JP4752986B1 - Adhesive film for circuit connection and circuit connection structure - Google Patents

Adhesive film for circuit connection and circuit connection structure Download PDF

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Publication number
JP4752986B1
JP4752986B1 JP2011501449A JP2011501449A JP4752986B1 JP 4752986 B1 JP4752986 B1 JP 4752986B1 JP 2011501449 A JP2011501449 A JP 2011501449A JP 2011501449 A JP2011501449 A JP 2011501449A JP 4752986 B1 JP4752986 B1 JP 4752986B1
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Prior art keywords
circuit
adhesive
film
circuit connection
adhesive film
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JPWO2011083824A1 (en
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貴 立澤
宏治 小林
耕太郎 関
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Showa Denko Materials Co Ltd
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Hitachi Chemical Co Ltd
Showa Denko Materials Co Ltd
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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/321—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives
    • H05K3/323—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives by applying an anisotropic conductive adhesive layer over an array of pads
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R11/00—Individual connecting elements providing two or more spaced connecting locations for conductive members which are, or may be, thereby interconnected, e.g. end pieces for wires or cables supported by the wire or cable and having means for facilitating electrical connection to some other wire, terminal, or conductive member, blocks of binding posts
    • H01R11/01—Individual connecting elements providing two or more spaced connecting locations for conductive members which are, or may be, thereby interconnected, e.g. end pieces for wires or cables supported by the wire or cable and having means for facilitating electrical connection to some other wire, terminal, or conductive member, blocks of binding posts characterised by the form or arrangement of the conductive interconnection between the connecting locations
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/10—Adhesives in the form of films or foils without carriers
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
    • C09J9/02—Electrically-conducting adhesives
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/20—Conductive material dispersed in non-conductive organic material
    • H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/02—Elements
    • C08K3/08—Metals
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
    • C09J2203/326—Applications of adhesives in processes or use of adhesives in the form of films or foils for bonding electronic components such as wafers, chips or semiconductors
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/10—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet
    • C09J2301/12—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet by the arrangement of layers
    • C09J2301/124—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet by the arrangement of layers the adhesive layer being present on both sides of the carrier, e.g. double-sided adhesive tape
    • C09J2301/1242—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet by the arrangement of layers the adhesive layer being present on both sides of the carrier, e.g. double-sided adhesive tape the opposite adhesive layers being different
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/20—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive itself
    • C09J2301/208—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive itself the adhesive layer being constituted by at least two or more adjacent or superposed adhesive layers, e.g. multilayer adhesive
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/40—Additional features of adhesives in the form of films or foils characterized by the presence of essential components
    • C09J2301/408—Additional features of adhesives in the form of films or foils characterized by the presence of essential components additives as essential feature of the adhesive layer
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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Organic Chemistry (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Dispersion Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Conductive Materials (AREA)
  • Adhesive Tapes (AREA)
  • Wire Bonding (AREA)
  • Non-Insulated Conductors (AREA)

Abstract

少なくとも接着剤層Ａ及び接着剤層Ｂを有し、接着剤層Ａは、所定の接着剤成分（３ａ）及び導電粒子（５）を含有する異方導電層（１１）であり、接着剤層Ｂは、所定の接着剤成分（３ａ）を含有する絶縁層（１２）であり、接着剤層Ａの厚みは、該接着剤層Ａに含有される導電粒子の平均粒径の０．３〜１．５倍であり、前記回路基板のうち、少なくとも一方の回路ピッチが４０μｍ以下であることを特徴とする回路接続用接着フィルム。
【選択図】図１It has at least an adhesive layer A and an adhesive layer B, and the adhesive layer A is an anisotropic conductive layer (11) containing a predetermined adhesive component (3a) and conductive particles (5). B is an insulating layer (12) containing a predetermined adhesive component (3a), and the thickness of the adhesive layer A is 0.3 to 0.3 of the average particle diameter of the conductive particles contained in the adhesive layer A. An adhesive film for circuit connection, which is 1.5 times and at least one of the circuit boards has a circuit pitch of 40 μm or less.
[Selection] Figure 1

Description

本発明は、回路接続用接着フィルム及び回路接続構造体に関するものである。   The present invention relates to an adhesive film for circuit connection and a circuit connection structure.

従来、相対向する回路を加熱、加圧し加圧方向の電極間を電気的に接続する回路接続材料として、異方導電性接着フィルムが知られており、例えば、エポキシ系接着剤やアクリル系接着剤に導電粒子を分散させた異方導電性接着フィルムが知られている。かかる異方導電性接着フィルムは、主に液晶ディスプレイ（以下、「ＬＣＤ」とする。）を駆動させる半導体が搭載されたＴＣＰ（Ｔａｐｅ Ｃａｒｒｉｅｒ Ｐａｃｋａｇｅ）又はＣＯＦ（Ｃｈｉｐ Ｏｎ Ｆｌｅｘ）とＬＣＤパネルとの電気的接続、あるいは、ＴＣＰ又はＣＯＦとプリント配線板との電気的接続に広く使用されている。   Conventionally, anisotropic conductive adhesive films are known as circuit connection materials for heating and pressurizing opposing circuits to electrically connect electrodes in the pressurizing direction, for example, epoxy adhesives and acrylic adhesives. An anisotropic conductive adhesive film in which conductive particles are dispersed in an agent is known. Such an anisotropic conductive adhesive film is mainly composed of a TCP (Tape Carrier Package) or COF (Chip On Flex) on which a semiconductor for driving a liquid crystal display (hereinafter referred to as “LCD”) is mounted and the LCD panel. Widely used for electrical connection or electrical connection between a TCP or COF and a printed wiring board.

また、最近では、半導体をフェイスダウンで直接ＬＣＤパネルやプリント配線板に実装する場合でも、従来のワイヤーボンディング法ではなく、薄型化や狭ピッチ接続に有利なフリップチップ実装が採用されている。このフリップチップ実装においても、異方導電性接着フィルムが回路接続材料として用いられている（例えば、特許文献１〜４参照）。   Recently, even when a semiconductor is directly mounted on an LCD panel or a printed wiring board face down, flip chip mounting, which is advantageous for thinning and narrow pitch connection, has been adopted instead of the conventional wire bonding method. Also in this flip chip mounting, an anisotropic conductive adhesive film is used as a circuit connecting material (for example, see Patent Documents 1 to 4).

ところで、近年、ＬＣＤモジュールのＣＯＦ化やファインピッチ化に伴い、回路接続材料を用いた接続の際に、隣り合う回路電極間に短絡が発生するという問題が生じている。この対応策として、接着剤成分中に絶縁粒子を分散させて短絡を防止する技術が知られている（例えば、特許文献５〜９参照）。   By the way, in recent years, with the increase in COF and fine pitch of LCD modules, there is a problem that a short circuit occurs between adjacent circuit electrodes when connecting using a circuit connecting material. As a countermeasure, a technique is known in which insulating particles are dispersed in an adhesive component to prevent a short circuit (see, for example, Patent Documents 5 to 9).

絶縁粒子を接着剤成分中に分散させる場合、回路接続材料の接着力の低下や、基板と回路接続部との界面での剥離が問題となる傾向がある。このため、基板が絶縁性有機物又はガラスからなる配線部材や、表面の少なくとも一部が窒化シリコン、シリコーン樹脂、ポリイミド樹脂の少なくとも一つからなる配線部材等に接着するために、回路接続材料にシリコーン粒子を含有させて接着力を向上させる方法（例えば、特許文献１０参照）や、接着後の熱膨張率差に基づく内部応力を低減させるため、回路接続材料にゴム粒子を分散させる方法が知られている（例えば、特許文献１１参照）。   When the insulating particles are dispersed in the adhesive component, there is a tendency that a decrease in the adhesive strength of the circuit connection material or peeling at the interface between the substrate and the circuit connection portion becomes a problem. For this reason, in order for the substrate to adhere to a wiring member made of an insulating organic substance or glass, or a wiring member made of at least one part of at least one of silicon nitride, silicone resin, polyimide resin, etc., the circuit connecting material is made of silicone. A method for improving adhesion by incorporating particles (for example, see Patent Document 10) and a method for dispersing rubber particles in a circuit connecting material in order to reduce internal stress based on a difference in coefficient of thermal expansion after adhesion are known. (For example, refer to Patent Document 11).

更に、回路電極間の短絡を防止する手段として、絶縁性を有する被膜で表面を被覆した導電粒子を回路接続材料に分散させる方法が知られている（例えば、特許文献１２，１３参照）。   Furthermore, as a means for preventing a short circuit between circuit electrodes, a method is known in which conductive particles whose surfaces are coated with an insulating film are dispersed in a circuit connecting material (see, for example, Patent Documents 12 and 13).

特開昭５９−１２０４３６号公報JP 59-120436 A 特開昭６０−１９１２２８号公報JP-A-60-191228 特開平１−２５１７８７号公報JP-A-1-251787 特開平７−９０２３７号公報JP-A-7-90237 特開昭５１−２０９４１号公報JP 51-20941 A 特開平３−２９２０７号公報JP-A-3-29207 特開平４−１７４９８０号公報JP-A-4-174980 特許第３０４８１９７号公報Japanese Patent No. 3048197 特許第３４７７３６７号公報Japanese Patent No. 3477367 国際公開第０１／０１４４８４号パンフレットInternational Publication No. 01/014484 Pamphlet 特開２００１−３２３２４９号公報JP 2001-323249 A 特許第２７９４００９号公報Japanese Patent No. 2779409 特開２００１−１９５９２１号公報Japanese Patent Laid-Open No. 2001-195921

近年、コストを低下させる観点から、ガラス基板の回路電極としてインジウム−錫酸化物（ＩＴＯ：Ｔｉｎ ｄｏｐｅｄ Ｉｎｄｉｕｍ Ｏｘｉｄｅ）電極に替えてインジウム−亜鉛酸化物（ＩＺＯ：Ｚｉｎｃ ｄｏｐｅｄ Ｉｎｄｉｕｍ Ｏｘｉｄｅ）電極が使用されはじめている。インジウム−亜鉛酸化物電極に対しては、接続抵抗を低減する観点から、ＮｉあるいはＮｉ合金やＮｉ酸化物等を含む最外層で覆われた導電粒子を回路接続材料に分散させることが検討されている。   In recent years, an indium-zinc oxide (IZO) electrode has been used instead of an indium-tin oxide (ITO) electrode as a circuit electrode of a glass substrate from the viewpoint of reducing costs. Yes. For indium-zinc oxide electrodes, from the viewpoint of reducing connection resistance, it has been studied to disperse conductive particles covered with an outermost layer containing Ni, Ni alloy, Ni oxide, or the like in a circuit connection material. Yes.

しかしながら、これら従来の回路接続材料構成では、基板となるガラスのガラスエッジ部に形成された有機膜の突起により、流動した導電粒子がせき止められて凝集することによりショートが発生するという問題もある。この対応策として電極上での導電粒子の捕捉効率を向上させ、余分な導電粒子を削減することで導電粒子の凝集によるショートを防止することも求められている。   However, these conventional circuit connection material configurations also have a problem that a short circuit occurs when the flowing conductive particles are dammed and aggregated by the protrusions of the organic film formed on the glass edge portion of the glass serving as the substrate. As a countermeasure, it is also required to improve the efficiency of capturing the conductive particles on the electrode and to prevent short-circuiting due to the aggregation of the conductive particles by reducing unnecessary conductive particles.

ところで、ＴＦＴ−ＬＣＤにおいては、前述の薄膜電極の下に下地としてＭｏやＡｌ等の金属回路が形成されていることが一般的であるが、コスト削減を目的としてドライバーＩＣ等の部品点数の低減のため、薄膜回路の引き回し方も非常に複雑になっており、特にインジウム−亜鉛酸化物（ＩＺＯ）膜を用いたパネルでは回路抵抗が高くなるためバーント現象と呼ばれる電極焼けを起こすことが問題となっている。   By the way, in a TFT-LCD, a metal circuit such as Mo or Al is generally formed as a base under the thin film electrode described above, but the number of parts such as a driver IC is reduced for the purpose of cost reduction. Therefore, the way of drawing a thin film circuit is also very complicated, and in particular, in a panel using an indium-zinc oxide (IZO) film, the circuit resistance becomes high, so that there is a problem that electrode burning called a burnt phenomenon occurs. It has become.

そこで、従来の回路接続材料に比べ、インジウム−錫酸化物（ＩＴＯ）電極やインジウム−亜鉛酸化物（ＩＺＯ）電極等の回路電極の種類に依存することなく回路電極間の接続抵抗を低減することが可能であると共に、回路ピッチが４０μｍよりも微小な回路においてもバーント現象が起こり難い回路接続材料（回路接続用接着フィルム）、及びそれを用いた回路接続構造体を提供することを目的とする。   Therefore, compared to conventional circuit connection materials, the connection resistance between circuit electrodes is reduced without depending on the type of circuit electrodes such as indium-tin oxide (ITO) electrodes and indium-zinc oxide (IZO) electrodes. An object of the present invention is to provide a circuit connection material (adhesive film for circuit connection) in which a burnt phenomenon hardly occurs even in a circuit having a circuit pitch smaller than 40 μm, and a circuit connection structure using the circuit connection material. .

本発明は、対向する回路基板間に介在して回路を電気的に接続するための回路接続用接着フィルムであって、回路接続用接着フィルムは少なくとも接着剤層Ａ及び接着剤層Ｂを有し、接着剤層Ａは、加熱又は光により遊離ラジカルを発生する硬化剤、ラジカル重合性物質、フィルム形成性高分子、並びに、ビッカース硬度が３００Ｈｖ以上の金属で最外層が覆われた導電粒子を含有する異方導電層であり、接着剤層Ｂは、加熱又は光により遊離ラジカルを発生する硬化剤、ラジカル重合性物質、及びフィルム形成性高分子を含有する絶縁層であり、接着剤層Ａの厚みは、該接着剤層Ａに含有される導電粒子の平均粒径の０．３〜１．５倍であり、かつ回路基板のうち、少なくとも一方の回路ピッチが４０μｍ以下であることを特徴とする回路接続用接着フィルムを提供する。   The present invention is an adhesive film for circuit connection for electrically connecting a circuit interposed between opposing circuit boards, and the adhesive film for circuit connection has at least an adhesive layer A and an adhesive layer B. The adhesive layer A contains a curing agent that generates free radicals by heating or light, a radical polymerizable substance, a film-forming polymer, and conductive particles whose outermost layer is covered with a metal having a Vickers hardness of 300 Hv or more. The adhesive layer B is an insulating layer containing a curing agent that generates free radicals by heating or light, a radical polymerizable substance, and a film-forming polymer. The thickness is 0.3 to 1.5 times the average particle diameter of the conductive particles contained in the adhesive layer A, and at least one of the circuit boards has a circuit pitch of 40 μm or less. Circuit To provide a connection for the adhesive film.

また本発明は、対向する回路基板間に介在して回路を電気的に接続するための回路接続用接着フィルムであって、回路接続用接着フィルムは少なくとも接着剤層Ａ及び接着剤層Ｂを有し、接着剤層Ａは、加熱又は光により遊離ラジカルを発生する硬化剤、ラジカル重合性物質、フィルム形成性高分子、並びに、Ｎｉ、Ｎｉ合金及びＮｉ酸化物からなる群より選ばれる少なくとも１種を含む金属で最外層が覆われた導電粒子を含有する異方導電層であり、接着剤層Ｂは、加熱又は光により遊離ラジカルを発生する硬化剤、ラジカル重合性物質、及びフィルム形成性高分子を含有する絶縁層であり、接着剤層Ａの厚みは、該接着剤層Ａに含有される導電粒子の平均粒径の０．３〜１．５倍であり、かつ回路基板のうち、少なくとも一方の回路ピッチが４０μｍ以下であることを特徴とする回路接続用接着フィルムを提供する。   The present invention also provides a circuit connecting adhesive film for electrically connecting a circuit interposed between opposing circuit boards, and the circuit connecting adhesive film has at least an adhesive layer A and an adhesive layer B. The adhesive layer A is at least one selected from the group consisting of a curing agent that generates free radicals by heating or light, a radical polymerizable substance, a film-forming polymer, and Ni, a Ni alloy, and a Ni oxide. An anisotropic conductive layer containing conductive particles whose outermost layer is covered with a metal containing, adhesive layer B includes a curing agent that generates free radicals by heating or light, a radical polymerizable substance, and a high film-forming property. It is an insulating layer containing molecules, the thickness of the adhesive layer A is 0.3 to 1.5 times the average particle diameter of the conductive particles contained in the adhesive layer A, and among the circuit board, At least one circuit pin There is provided an adhesive film for circuit connection, characterized in that at 40μm or less.

上記回路接続用接着フィルムによれば、回路の種類に依存することなく回路間の接続抵抗を低減することが可能であり、回路間における短絡及びバーント現象を抑制することが可能である。なお、回路ピッチとは回路の太さと回路間隔との和である。   According to the adhesive film for circuit connection, it is possible to reduce the connection resistance between circuits without depending on the type of the circuit, and it is possible to suppress a short circuit and a burnt phenomenon between the circuits. The circuit pitch is the sum of the circuit thickness and the circuit interval.

ここで、バーント現象と回路接続用接着フィルムとの相関関係は回路接続用接着フィルムの４端子法による抵抗値及びＩ−Ｖ特性を測定することで得られることが分かってきている。特にインジウム−亜鉛酸化物（ＩＺＯ）回路においては、４０μｍピッチのＦＰＣを用いた４端子法による抵抗値が２Ω以下、かつ、１００μｍピッチのＦＰＣを用いたＩ−Ｖ特性評価にて３００ｍＡ付近よりも大きい電流領域においてもオーミック特性が保持できる回路接続用接着フィルムであればバーント現象を抑制することが可能である。   Here, it has been found that the correlation between the burnt phenomenon and the adhesive film for circuit connection can be obtained by measuring the resistance value and IV characteristic of the adhesive film for circuit connection by the four-terminal method. In particular, in an indium-zinc oxide (IZO) circuit, the resistance value by a four-terminal method using an FPC with a 40 μm pitch is 2Ω or less, and the IV characteristic evaluation using an FPC with a 100 μm pitch is more than around 300 mA. The burnt phenomenon can be suppressed if the adhesive film for circuit connection can maintain ohmic characteristics even in a large current region.

上記回路ピッチが４０μｍ以下である回路基板はフレキシブル基板であると好ましい。   The circuit board having a circuit pitch of 40 μm or less is preferably a flexible board.

上記回路ピッチが４０μｍ以下である回路基板とは別の回路基板は、回路表面にインジウム−亜鉛酸化物（ＩＺＯ）又はインジウム−錫酸化物（ＩＴＯ）からなる薄膜が形成されているものであると好ましい。この場合、回路同士の電気的接続を顕著に良好にすることができる。   A circuit board different from the circuit board having the circuit pitch of 40 μm or less has a thin film made of indium-zinc oxide (IZO) or indium-tin oxide (ITO) formed on the circuit surface. preferable. In this case, the electrical connection between the circuits can be remarkably improved.

上記導電粒子の平均粒径は１．５〜５．０μｍであると好ましい。この場合、隣接する回路間の短絡を更に抑制し易くなる。   The average particle diameter of the conductive particles is preferably 1.5 to 5.0 μm. In this case, it becomes easier to further suppress a short circuit between adjacent circuits.

また本発明は、回路ピッチが４０μｍ以下である第一の回路を有する第一の回路基板と、第二の回路を有する第二の回路基板とを、前記第一の回路と前記第二の回路とが対向するように配置し、対向配置した前記第一の回路と前記第二の回路とが対向するように配置し、対向配置した前記第一の回路と前記第二の回路との間に、上記本発明の回路接続用接着フィルムを介在させ、加熱加圧することにより、対向配置した前記第一の回路と前記第二の回路とを電気的に接続させてなる、回路接続構造体を提供する。   The present invention also provides a first circuit board having a first circuit having a circuit pitch of 40 μm or less, and a second circuit board having a second circuit, the first circuit and the second circuit. Between the first circuit and the second circuit arranged opposite to each other, the first circuit arranged opposite to the second circuit and the second circuit arranged opposite to each other. Provided is a circuit connection structure in which the first circuit and the second circuit arranged to face each other are electrically connected by heating and pressurizing the adhesive film for circuit connection of the present invention. To do.

本発明によれば、従来の回路接続材料に比べ、インジウム−錫酸化物（ＩＴＯ）電極やインジウム−亜鉛酸化物（ＩＺＯ）電極等の回路電極の種類に依存することなく回路電極間の接続抵抗を低減することが可能であると共に、回路ピッチが４０μｍ以下である高精細回路間の接続が可能であり、かつバーント現象を抑制することができる。   According to the present invention, compared to conventional circuit connection materials, the connection resistance between circuit electrodes is independent of the type of circuit electrode such as an indium-tin oxide (ITO) electrode or an indium-zinc oxide (IZO) electrode. Can be reduced, high-definition circuits having a circuit pitch of 40 μm or less can be connected, and the burnt phenomenon can be suppressed.

本発明の一実施形態に係る回路接続用接着フィルムを示す模式断面図である。It is a schematic cross section which shows the adhesive film for circuit connection which concerns on one Embodiment of this invention. 本発明の一実施形態に係る回路接続用接着フィルムに含まれる導電粒子を示す模式断面図である。It is a schematic cross section which shows the electrically-conductive particle contained in the adhesive film for circuit connection which concerns on one Embodiment of this invention. 本発明の一実施形態に係る回路接続構造体を示す模式断面図である。It is a schematic cross section which shows the circuit connection structure which concerns on one Embodiment of this invention. 本発明の一実施形態に係る回路接続構造体の製造方法を模式的に示す工程断面図である。It is process sectional drawing which shows typically the manufacturing method of the circuit connection structure which concerns on one Embodiment of this invention.

以下、必要に応じて図面を参照しつつ、本発明の好適な実施形態について詳細に説明する。   Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the drawings as necessary.

＜回路接続用接着フィルム＞
まず、図１を参照して、本実施形態の回路接続用接着フィルム１について説明する。図１は、本発明の一実施形態に係る回路接続用接着フィルムを示す模式断面図である。回路接続用接着フィルム１は、接着剤成分（絶縁性物質）３ａ及び導電粒子５を含有する異方導電層１１と、異方導電層１１上に形成された、接着剤成分３ｂを含有する絶縁層１２とを有する。<Adhesive film for circuit connection>
First, with reference to FIG. 1, the adhesive film 1 for circuit connection of this embodiment is demonstrated. FIG. 1 is a schematic cross-sectional view showing an adhesive film for circuit connection according to an embodiment of the present invention. An adhesive film 1 for circuit connection includes an anisotropic conductive layer 11 containing an adhesive component (insulating substance) 3a and conductive particles 5, and an insulation containing an adhesive component 3b formed on the anisotropic conductive layer 11. Layer 12.

（接着剤成分）
接着剤成分３ａ，３ｂは、（ａ）加熱又は光によって遊離ラジカルを発生する硬化剤（以下、場合により「（ａ）遊離ラジカル発生剤」という。）、（ｂ）ラジカル重合性物質、及び（ｃ）フィルム形成性高分子を含有する。(Adhesive component)
The adhesive components 3a and 3b are composed of (a) a curing agent that generates free radicals by heating or light (hereinafter sometimes referred to as “(a) free radical generator”), (b) a radical polymerizable substance, and ( c) Contains a film-forming polymer.

（ａ）遊離ラジカル発生剤は、目的とする接続温度、接続時間、ポットライフ等により適宜選定され、過酸化化合物（有機過酸化物）、アゾ化合物又は光開始剤のような、加熱及び光照射の少なくとも一方の処理により活性ラジカルを発生する化合物が用いられる。   (A) The free radical generator is appropriately selected depending on the intended connection temperature, connection time, pot life, etc., and heating and light irradiation such as a peroxide compound (organic peroxide), an azo compound or a photoinitiator A compound that generates an active radical by at least one of these treatments is used.

有機過酸化物は、高い反応性と優れたポットライフとを両立する観点から、半減期１０時間の温度が４０℃以上であり、かつ、半減期１分の温度が１８０℃以下であることが好ましく、半減期１０時間の温度が６０℃以上である、かつ、半減期１分の温度が１７０℃以下であることがより好ましい。また、有機過酸化物は、回路部材の回路電極の腐食を防止するために、塩素イオンや有機酸の含有量が５０００ｐｐｍ以下であることが好ましく、更に、加熱分解後に発生する有機酸が少ないものがより好ましい。   From the viewpoint of achieving both high reactivity and excellent pot life, the organic peroxide has a half-life temperature of 40 ° C or higher and a half-life temperature of 1 minute is 180 ° C or lower. More preferably, the temperature of the half-life of 10 hours is 60 ° C. or higher, and the temperature of the half-life of 1 minute is 170 ° C. or lower. The organic peroxide preferably has a chlorine ion or organic acid content of 5000 ppm or less in order to prevent corrosion of the circuit electrode of the circuit member, and further generates less organic acid after thermal decomposition. Is more preferable.

有機過酸化物としては、例えば、ジアシルパーオキサイド、パーオキシジカーボネート、パーオキシエステル、パーオキシケタール、ジアルキルパーオキサイド、ハイドロパーオキサイド等から選定できる。これらの中でも、回路部材の接続端子の腐食を抑える観点から、パーオキシエステル、ジアルキルパーオキサイド、ハイドロパーオキサイドから選定されることが好ましく、高い反応性が得られる観点から、パーオキシエステルから選定されることがより好ましい。   The organic peroxide can be selected from, for example, diacyl peroxide, peroxydicarbonate, peroxyester, peroxyketal, dialkyl peroxide, hydroperoxide and the like. Among these, it is preferable to select from peroxyesters, dialkyl peroxides, and hydroperoxides from the viewpoint of suppressing corrosion of connection terminals of circuit members, and from the viewpoint of obtaining high reactivity, it is selected from peroxyesters. More preferably.

ジアシルパーオキサイドとしては、例えば、イソブチルパーオキサイド、２，４−ジクロロベンゾイルパーオキサイド、３，５，５−トリメチルヘキサノイルパーオキサイド、オクタノイルパーオキサイド、ラウロイルパーオキサイド、ステアロイルパーオキサイド、スクシニックパーオキサイド、ベンゾイルパーオキシトルエン、ベンゾイルパーオキサイドが挙げられる。   Examples of the diacyl peroxide include isobutyl peroxide, 2,4-dichlorobenzoyl peroxide, 3,5,5-trimethylhexanoyl peroxide, octanoyl peroxide, lauroyl peroxide, stearoyl peroxide, and succinic peroxide. , Benzoylperoxytoluene, and benzoyl peroxide.

パーオキシジカーボネートとしては、例えば、ジ−ｎ−プロピルパーオキシジカーボネート、ジイソプロピルパーオキシジカーボネート、ビス（４−ｔ−ブチルシクロヘキシル）パーオキシジカーボネート、ジ−２−エトキシメトキシパーオキシジカーボネート、ジ（２−エチルヘキシルパーオキシ）ジカーボネート、ジメトキシブチルパーオキシジカーボネート、ジ（３−メチル−３−メトキシブチルパーオキシ）ジカーボネートが挙げられる。   Examples of peroxydicarbonate include di-n-propyl peroxydicarbonate, diisopropyl peroxydicarbonate, bis (4-t-butylcyclohexyl) peroxydicarbonate, di-2-ethoxymethoxyperoxydicarbonate, Examples include di (2-ethylhexylperoxy) dicarbonate, dimethoxybutylperoxydicarbonate, and di (3-methyl-3-methoxybutylperoxy) dicarbonate.

パーオキシエステルとしては、例えば、クミルパーオキシネオデカノエート、１，１，３，３−テトラメチルブチルパーオキシネオデカノエート、１−シクロヘキシル−１−メチルエチルパーオキシノエデカノエート、ｔ−ヘキシルパーオキシネオデカノエート、ｔ−ブチルパーオキシピバレート、１，１，３，３−テトラメチルブチルパーオキシ−２−エチルヘキサノネート、２，５−ジメチル−２，５−ビス（２−エチルヘキサノイルパーオキシ）ヘキサン、１−シクロヘキシル−１−メチルエチルパーオキシ−２−エチルヘキサノネート、ｔ−ヘキシルパーオキシ−２−エチルヘキサノネート、ｔ−ブチルパーオキシ−２−エチルヘキサノネート、ｔ−ブチルパーオキシイソブチレート、１，１−ビス（ｔ−ブチルパーオキシ）シクロヘキサン、ｔ−ヘキシルパーオキシイソプロピルモノカーボネート、ｔ−ブチルパーオキシ−３，５，５−トリメチルヘキサノネート、ｔ−ブチルパーオキシラウレート、２，５−ジメチル−２，５−ビス（ｍ−トルオイルパーオキシ）ヘキサン、ｔ−ブチルパーオキシイソプロピルモノカーボネート、ｔ−ブチルパーオキシ−２−エチルヘキシルモノカーボネート、ｔ−ヘキシルパーオキシベンゾエート、ｔ−ブチルパーオキシアセテートが挙げられる。   Examples of peroxyesters include cumyl peroxyneodecanoate, 1,1,3,3-tetramethylbutylperoxyneodecanoate, 1-cyclohexyl-1-methylethylperoxynoedecanoate, t -Hexylperoxyneodecanoate, t-butylperoxypivalate, 1,1,3,3-tetramethylbutylperoxy-2-ethylhexanoate, 2,5-dimethyl-2,5-bis ( 2-ethylhexanoylperoxy) hexane, 1-cyclohexyl-1-methylethylperoxy-2-ethylhexanoate, t-hexylperoxy-2-ethylhexanoate, t-butylperoxy-2-ethyl Hexanonate, t-butylperoxyisobutyrate, 1,1-bis (t-butylperoxy) cyclo Xane, t-hexylperoxyisopropyl monocarbonate, t-butylperoxy-3,5,5-trimethylhexanonate, t-butylperoxylaurate, 2,5-dimethyl-2,5-bis (m- Toluoyl peroxy) hexane, t-butyl peroxyisopropyl monocarbonate, t-butyl peroxy-2-ethylhexyl monocarbonate, t-hexyl peroxybenzoate, t-butyl peroxyacetate.

パーオキシケタールとしては、例えば、１，１−ビス（ｔ−ヘキシルパーオキシ）−３，５，５−トリメチルシクロヘキサン、１，１−ビス（ｔ−ヘキシルパーオキシ）シクロヘキサン、１，１−ビス（ｔ−ブチルパーオキシ）−３，５，５−トリメチルシクロヘキサン、１，１−（ｔ−ブチルパーオキシ）シクロドデカン、２，２−ビス（ｔ−ブチルパーオキシ）デカンが挙げられる。   Examples of the peroxyketal include 1,1-bis (t-hexylperoxy) -3,5,5-trimethylcyclohexane, 1,1-bis (t-hexylperoxy) cyclohexane, 1,1-bis ( t-butylperoxy) -3,5,5-trimethylcyclohexane, 1,1- (t-butylperoxy) cyclododecane, 2,2-bis (t-butylperoxy) decane.

ジアルキルパーオキサイドとしては、例えば、α，α’−ビス（ｔ−ブチルパーオキシ）ジイソプロピルベンゼン、ジクミルパーオキサイド、２，５−ジメチル−２，５−ジ（ｔ−ブチルパーオキシ）ヘキサン、ｔ−ブチルクミルパーオキサイドが挙げられる。   Examples of the dialkyl peroxide include α, α′-bis (t-butylperoxy) diisopropylbenzene, dicumyl peroxide, 2,5-dimethyl-2,5-di (t-butylperoxy) hexane, t -Butyl cumyl peroxide is mentioned.

ハイドロパーオキサイドとしては、例えば、ジイソプロピルベンゼンハイドロパーオキサイド、クメンハイドロパーオキサイドが挙げられる。   Examples of the hydroperoxide include diisopropylbenzene hydroperoxide and cumene hydroperoxide.

アゾ化合物としては、例えば、２，２’−アゾビス−２，４−ジメチルバレロニトリル、１，１’−アゾビス（１−アセトキシ−１−フェニルエタン）、２，２’−アゾビスイソブチロニトリル、２，２’−アゾビス（２−メチルブチロニトリル）、ジメチル−２，２’−アゾビスイソブチロニトリル、４，４’−アゾビス（４−シアノバレリン酸）及び１，１’−アゾビス（１−シクロヘキサンカルボニトリル）が挙げられる。   Examples of the azo compound include 2,2′-azobis-2,4-dimethylvaleronitrile, 1,1′-azobis (1-acetoxy-1-phenylethane), and 2,2′-azobisisobutyronitrile. 2,2′-azobis (2-methylbutyronitrile), dimethyl-2,2′-azobisisobutyronitrile, 4,4′-azobis (4-cyanovaleric acid) and 1,1′-azobis ( 1-cyclohexanecarbonitrile).

光開始剤としては、例えば、ベンゾインエチルエーテル、イソプロピルベンゾインエーテル等のベンゾインエーテル、ベンジル、ヒドロキシシクロヘキシルフェニルケトン等のベンジルケタール、ベンゾフェノン、アセトフェノン等のケトン類及びその誘導体、チオキサントン類、並びに、ビスイミダゾール類が好適に用いられる。   Photoinitiators include, for example, benzoin ethers such as benzoin ethyl ether and isopropyl benzoin ether, benzyl ketals such as benzyl and hydroxycyclohexyl phenyl ketone, ketones and derivatives thereof such as benzophenone and acetophenone, thioxanthones, and bisimidazoles Are preferably used.

光開始剤を用いる場合、用いる光源の波長や所望の硬化特性等に応じて、最適な光開始剤が選択される。また、必要に応じて、アミン類、イオウ化合物、リン化合物等の増感剤を任意の比率で光開始剤と併用してもよい。   When a photoinitiator is used, an optimal photoinitiator is selected according to the wavelength of the light source used, desired curing characteristics, and the like. Moreover, you may use together sensitizers, such as amines, a sulfur compound, and a phosphorus compound, with a photoinitiator in arbitrary ratios as needed.

増感剤としては、脂肪族アミン、芳香族アミン、含窒素環状構造を有するピペリジン等の環状アミン、ｏ−トリルチオ尿素、ナトリウムジエチルジチオホスフェート、芳香族スルフィン酸の可溶性塩、Ｎ，Ｎ’−ジメチル−ｐ−アミノベンゾニトリル、Ｎ，Ｎ’−ジエチル−ｐ−アミノベンゾニトリル、Ｎ，Ｎ’−ジ（β−シアノエチル）−ｐ−アミノベンゾニトリル、Ｎ，Ｎ’−ジ（β−クロロエチル）−ｐ−アミノベンゾニトリル、トリ−ｎ−ブチルホスフィン等が好ましい。また、増感剤としては、プロピオフェノン、アセトフェノン、キサントン、４−メチルアセトフェノン、ベンゾフェノン、フルオレン、トリフェニレン、ビフェニル、チオキサントン、アントラキノン、４，４’−ビス（ジメチルアミノ）ベンゾフェノン、４，４’−ビス（ジエチルアミノ）ベンゾフェノン、フェナントレン、ナフタレン、４−フェニルアセトフェノン、４−フェニルベンゾフェノン、１−ヨードナフタレン、２−ヨードナフタレン、アセナフテン、２−ナフトニトリル、１−ナフトニトリル、クリセン、ベンジル、フルオランテン、ピレン、１，２−ベンゾアントラセン、アクリジン、アントラセン、ペリレン、テトラセン、２−メトキシナフタレン等の非色素系増感剤、チオニン、メチレンブルー、ルミフラビン、リボフラビン、ルミクロム、クマリン、ソラレン、８−メトキシソラレン、６−メチルクマリン、５−メトキシソラレン、５−ヒドロキシソラレン、クマリルピロン、アクリジンオレンジ、アクリフラビン、プロフラビン、フルオレセイン、エオシンＹ、エオシンＢ、エリトロシン、ローズベンガル等の色素系増感剤が挙げられる。   Sensitizers include aliphatic amines, aromatic amines, cyclic amines such as piperidine having a nitrogen-containing cyclic structure, o-tolylthiourea, sodium diethyldithiophosphate, soluble sulfinic acid salts, N, N′-dimethyl -P-aminobenzonitrile, N, N'-diethyl-p-aminobenzonitrile, N, N'-di (β-cyanoethyl) -p-aminobenzonitrile, N, N'-di (β-chloroethyl)- P-aminobenzonitrile, tri-n-butylphosphine and the like are preferable. As sensitizers, propiophenone, acetophenone, xanthone, 4-methylacetophenone, benzophenone, fluorene, triphenylene, biphenyl, thioxanthone, anthraquinone, 4,4'-bis (dimethylamino) benzophenone, 4,4'- Bis (diethylamino) benzophenone, phenanthrene, naphthalene, 4-phenylacetophenone, 4-phenylbenzophenone, 1-iodonaphthalene, 2-iodonaphthalene, acenaphthene, 2-naphthonitrile, 1-naphthonitrile, chrysene, benzyl, fluoranthene, pyrene, Non-pigment sensitizers such as 1,2-benzoanthracene, acridine, anthracene, perylene, tetracene, 2-methoxynaphthalene, thionine, methylene blue, lumiflavin, ribo Rabin, lumichrome, coumarin, psoralen, 8-methoxypsoralen, 6-methylcoumarin, 5-methoxypsoralen, 5-hydroxypsoralen, coumarylpyrone, acridine orange, acriflavine, proflavine, fluorescein, eosin Y, eosin B, erythrosine, rose Examples include dye-based sensitizers such as Bengal.

これらの（ａ）遊離ラジカル発生剤は、１種を単独で又は２種以上を混合して使用することができ、分解促進剤、抑制剤等を混合して用いてもよい。   These (a) free radical generators can be used singly or in combination of two or more, and may be used by mixing a decomposition accelerator, an inhibitor and the like.

（ａ）遊離ラジカル発生剤の含有量は、接着剤成分全体に対して０．０５〜１０質量％が好ましく、０．１〜５質量％がより好ましい。   (A) 0.05-10 mass% is preferable with respect to the whole adhesive agent component, and, as for content of a free radical generator, 0.1-5 mass% is more preferable.

（ｂ）ラジカル重合性物質は、ラジカルにより重合する官能基を有する物質であり、例えば、アクリレート（対応するメタクリレートを含む。以下同じ。）、マレイミド化合物が挙げられる。   The (b) radical polymerizable substance is a substance having a functional group that is polymerized by radicals, and examples thereof include acrylates (including corresponding methacrylates; the same shall apply hereinafter) and maleimide compounds.

アクリレートとしては、例えば、ウレタンアクリレート、メチルアクリレート、エチルアクリレート、イソプロピルアクリレート、イソブチルアクリレート、エチレングリコールジアクリレート、ジエチレングリコールジアクリレート、トリエチレングリコールジアクリレート、トリメチロールプロパントリアクリレート、テトラメチロールメタンテトラアクリレート、２−ヒドロキシ−１，３−ジアクリロキシプロパン、２，２−ビス〔４−（アクリロキシメトキシ）フェニル〕プロパン、２，２−ビス〔４−（アクリロキシポリエトキシ）フェニル〕プロパン、ジシクロペンテニルアクリレート、トリシクロデカニルアクリレート、ビス（アクリロキシエチル）イソシアヌレート、ε−カプロラクトン変性トリス（アクリロキシエチル）イソシアヌレート、トリス（アクリロキシエチル）イソシアヌレートが挙げられる。   Examples of the acrylate include urethane acrylate, methyl acrylate, ethyl acrylate, isopropyl acrylate, isobutyl acrylate, ethylene glycol diacrylate, diethylene glycol diacrylate, triethylene glycol diacrylate, trimethylolpropane triacrylate, tetramethylol methane tetraacrylate, 2- Hydroxy-1,3-diaacryloxypropane, 2,2-bis [4- (acryloxymethoxy) phenyl] propane, 2,2-bis [4- (acryloxypolyethoxy) phenyl] propane, dicyclopentenyl acrylate , Tricyclodecanyl acrylate, bis (acryloxyethyl) isocyanurate, ε-caprolactone-modified tris (acryloxyethyl) Isocyanurate, tris (acryloyloxyethyl) isocyanurate.

マレイミド化合物としては、分子中にマレイミド基を少なくとも２個以上含有するものが好ましく、例えば、１−メチル−２，４−ビスマレイミドベンゼン、Ｎ，Ｎ’−ｍ−フェニレンビスマレイミド、Ｎ，Ｎ’−Ｐ−フェニレンビスマレイミド、Ｎ，Ｎ’−ｍ−トルイレンビスマレイミド、Ｎ，Ｎ’−４，４−ビフェニレンビスマレイミド、Ｎ，Ｎ’−４，４−（３，３’−ジメチル−ビフェニレン）ビスマレイミド、Ｎ，Ｎ’−４，４−（３，３’−ジメチルジフェニルメタン）ビスマレイミド、Ｎ，Ｎ’−４，４−（３，３’−ジエチルジフェニルメタン）ビスマレイミド、Ｎ，Ｎ’−４，４−ジフェニルメタンビスマレイミド、Ｎ，Ｎ’−４，４−ジフェニルプロパンビスマレイミド、Ｎ，Ｎ’−４，４−ジフェニルエーテルビスマレイミド、Ｎ，Ｎ’−３，３’−ジフェニルスルホンビスマレイミド、２，２−ビス［４−（４−マレイミドフェノキシ）フェニル］プロパン、２，２−ビス［３−ｓ−ブチル−４，８−（４−マレイミドフェノキシ）フェニル］プロパン、１，１−ビス［４−（４−マレイミドフェノキシ）フェニル］デカン、４，４’−シクロヘキシリデン−ビス［１−（４−マレイミドフェノキシ）−２−シクロヘキシル］ベンゼン、２，２−ビス［４−（４−マレイミドフェノキシ）フェニル］ヘキサフルオロプロパンが挙げられる。これらは、１種を単独で又は２種以上を併用して用いてもよく、アリルフェノール、アリルフェニルエーテル、安息香酸アリル等のアリル化合物と併用して用いてもよい。   As the maleimide compound, those containing at least two maleimide groups in the molecule are preferable. For example, 1-methyl-2,4-bismaleimidebenzene, N, N′-m-phenylenebismaleimide, N, N ′ -P-phenylene bismaleimide, N, N'-m-toluylene bismaleimide, N, N'-4,4-biphenylene bismaleimide, N, N'-4,4- (3,3'-dimethyl-biphenylene ) Bismaleimide, N, N′-4,4- (3,3′-dimethyldiphenylmethane) bismaleimide, N, N′-4,4- (3,3′-diethyldiphenylmethane) bismaleimide, N, N ′ -4,4-diphenylmethane bismaleimide, N, N'-4,4-diphenylpropane bismaleimide, N, N'-4,4-diphenyl ether bisma Imido, N, N′-3,3′-diphenylsulfone bismaleimide, 2,2-bis [4- (4-maleimidophenoxy) phenyl] propane, 2,2-bis [3-s-butyl-4,8 -(4-maleimidophenoxy) phenyl] propane, 1,1-bis [4- (4-maleimidophenoxy) phenyl] decane, 4,4'-cyclohexylidene-bis [1- (4-maleimidophenoxy) -2 -Cyclohexyl] benzene, 2,2-bis [4- (4-maleimidophenoxy) phenyl] hexafluoropropane. These may be used alone or in combination of two or more, and may be used in combination with allyl compounds such as allylphenol, allylphenyl ether, and allyl benzoate.

（ｂ）ラジカル重合性物質としては、接着性が向上する観点から、アクリレートが好ましく、ウレタンアクリレート又はウレタンメタアクリレートがより好ましい。（ｂ）ラジカル重合性物質は、１種を単独で又は２種以上を併用して用いることができる。   (B) As a radically polymerizable substance, an acrylate is preferable from the viewpoint of improving adhesiveness, and urethane acrylate or urethane methacrylate is more preferable. (B) A radically polymerizable substance can be used individually by 1 type or in combination of 2 or more types.

接着剤成分３ａ，３ｂは、２５℃での粘度が１０００００〜１００００００ｍＰａ・ｓであるラジカル重合性物質を少なくとも含有することが好ましく、１０００００〜５０００００ｍＰａ・ｓであるラジカル重合性物質を含有することがより好ましい。ラジカル重合性物質の粘度の測定は、市販のＥ型粘度計を用いて測定できる。   The adhesive components 3a and 3b preferably contain at least a radical polymerizable substance having a viscosity at 25 ° C. of 100,000 to 1,000,000 mPa · s, and more preferably contain a radical polymerizable substance of 100,000 to 500,000 mPa · s. preferable. The viscosity of the radical polymerizable substance can be measured using a commercially available E-type viscometer.

（ｂ）ラジカル重合性物質の含有量は、接着剤成分１００質量部に対して２０〜７０質量部が好ましく、３０〜６５質量部がより好ましい。   (B) 20-70 mass parts is preferable with respect to 100 mass parts of adhesive components, and, as for content of a radically polymerizable substance, 30-65 mass parts is more preferable.

（ｂ）ラジカル重合性物質は、上記ラジカル重合性物質に加えて、耐熱性を向上させるために上記有機過酸化物と架橋して、単独で１００℃以上のＴｇを示すラジカル重合性物質を更に含有することが特に好ましい。このようなラジカル重合性物質としては、ジシクロペンテニル基、トリシクロデカニル基及び／又はトリアジン環を有するものを用いることができる。これらの中でも、トリシクロデカニル基やトリアジン環を有するラジカル重合性物質が好適に用いられる。   (B) In addition to the radical polymerizable substance, the radical polymerizable substance is further crosslinked with the organic peroxide in order to improve heat resistance, and further includes a radical polymerizable substance having a Tg of 100 ° C. or more alone. It is particularly preferable to contain it. As such a radically polymerizable substance, a substance having a dicyclopentenyl group, a tricyclodecanyl group and / or a triazine ring can be used. Among these, radically polymerizable substances having a tricyclodecanyl group or a triazine ring are preferably used.

また、必要に応じて、ハイドロキノン、メチルエーテルハイドロキノン類等の重合禁止剤を適宜用いてもよい。   Moreover, you may use suitably polymerization inhibitors, such as hydroquinone and methyl ether hydroquinones, as needed.

更に、（ｂ）ラジカル重合性物質は、上記ラジカル重合性物質に加えて、リン酸エステル構造を有するラジカル重合性物質を更に含有することが好ましい。リン酸エステル構造を有するラジカル重合性物質は、無水リン酸と２−ヒドロキシル（メタ）アクリレートとの反応物として得られる。具体的には、２−メタクリロイロキシエチルアッシドホスフェート、２−アクリロイロキシエチルアッシドホスフェート等が挙げられる。これらは、１種を単独で又は２種以上を組み合わせて使用できる。   Furthermore, it is preferable that the (b) radical polymerizable substance further contains a radical polymerizable substance having a phosphate ester structure in addition to the radical polymerizable substance. The radically polymerizable substance having a phosphoric ester structure is obtained as a reaction product of phosphoric anhydride and 2-hydroxyl (meth) acrylate. Specific examples include 2-methacryloyloxyethyl acid phosphate and 2-acryloyloxyethyl acid phosphate. These can be used individually by 1 type or in combination of 2 or more types.

リン酸エステル構造を有するラジカル重合性物質の含有量は、金属等の無機物表面との接着強度が向上する観点から、接着剤成分１００質量部に対して０．１〜１０質量部が好ましく、０．５〜５質量部がより好ましい。   The content of the radical polymerizable substance having a phosphate ester structure is preferably 0.1 to 10 parts by mass with respect to 100 parts by mass of the adhesive component from the viewpoint of improving the adhesive strength with the surface of an inorganic substance such as metal. More preferable is 5 to 5 parts by mass.

（ｃ）フィルム形成性高分子としては、ポリスチレン、ポリエチレン、ポリビニルブチラール、ポリビニルホルマール、ポリイミド、ポリアミド、ポリエステル、ポリ塩化ビニル、ポリフェニレンオキサイド、尿素樹脂、メラミン樹脂、フェノール樹脂、キシレン樹脂、エポキシ樹脂、ポリイソシアネート樹脂、フェノキシ樹脂、ポリイミド樹脂、ポリエステルウレタン樹脂等が用いられる。   (C) As the film-forming polymer, polystyrene, polyethylene, polyvinyl butyral, polyvinyl formal, polyimide, polyamide, polyester, polyvinyl chloride, polyphenylene oxide, urea resin, melamine resin, phenol resin, xylene resin, epoxy resin, poly Isocyanate resins, phenoxy resins, polyimide resins, polyester urethane resins and the like are used.

これらの中でも、接着性が向上する観点から、水酸基等の官能基を有する樹脂がより好ましい。また、上記フィルム形成性高分子をラジカル重合性の官能基で変性したものも用いることができる。フィルム形成性高分子の重量平均分子量は１００００以上が好ましい。また、重量平均分子量は、１００００００以上になると混合性が低下する傾向にあることから、１００００００未満が好ましい。   Among these, a resin having a functional group such as a hydroxyl group is more preferable from the viewpoint of improving adhesiveness. Moreover, what modified | denatured the said film forming polymer with the radically polymerizable functional group can also be used. The weight average molecular weight of the film-forming polymer is preferably 10,000 or more. Further, the weight average molecular weight is preferably less than 1,000,000 because the mixing property tends to decrease when it becomes 1,000,000 or more.

（ｃ）フィルム形成性高分子の含有量は、接着剤成分１００質量部に対して３０〜８０質量部が好ましく、３５〜７０質量部がより好ましい。   (C) 30-80 mass parts is preferable with respect to 100 mass parts of adhesive components, and, as for content of a film-forming polymer, 35-70 mass parts is more preferable.

接着剤成分３ａ，３ｂは、例えば（ｄ）熱硬化性樹脂と（ｅ）その硬化剤とを含有してもよい。   The adhesive components 3a and 3b may contain, for example, (d) a thermosetting resin and (e) the curing agent.

（ｄ）熱硬化性樹脂としては、エポキシ樹脂が好ましい。エポキシ樹脂は、１分子内に２個以上のグリシジル基を有する各種のエポキシ化合物等を単独に、あるいは、その２種以上を混合して用いられる。エポキシ樹脂としては、エピクロルヒドリンとビスフェノールＡ、ビスフェノールＦ及び／又はビスフェノールＡＤ等とから誘導されるビスフェノール型エポキシ樹脂、エピクロルヒドリンとフェノールノボラックやクレゾールノボラックとから誘導されるエポキシノボラック樹脂やナフタレン環を含んだ骨格を有するナフタレン系エポキシ樹脂、グリシジルアミン型エポキシ樹脂、グリシジルエーテル型エポキシ樹脂、ビフェニル型エポキシ樹脂、脂環式エポキシ樹脂等が挙げられる。エポキシ樹脂は、１種を単独で又は２種以上を混合して用いることが可能である。エポキシ樹脂は、不純物イオン（Ｎａ＋、Ｃｌ−等）や、加水分解性塩素等を３００ｐｐｍ以下に低減した高純度品を用いることがエレクトロンマイグレーション防止のために好ましい。(D) As the thermosetting resin, an epoxy resin is preferable. The epoxy resin is used alone or in combination of two or more of various epoxy compounds having two or more glycidyl groups in one molecule. Epoxy resins include bisphenol-type epoxy resins derived from epichlorohydrin and bisphenol A, bisphenol F and / or bisphenol AD, skeletons containing epoxy novolac resins derived from epichlorohydrin and phenol novolac or cresol novolac, and naphthalene rings. Naphthalene type epoxy resin having glycidyl amine type epoxy resin, glycidyl ether type epoxy resin, biphenyl type epoxy resin, alicyclic epoxy resin and the like. Epoxy resins can be used alone or in combination of two or more. For the epoxy resin, it is preferable to use a high-purity product in which impurity ions (Na + , Cl −, etc.), hydrolyzable chlorine, etc. are reduced to 300 ppm or less.

（ｅ）硬化剤は、より長いポットライフを得る観点から、潜在性硬化剤が好ましい。熱硬化性樹脂がエポキシ樹脂である場合、潜在性硬化剤としては、イミダゾール系、ヒドラジド系、三フッ化ホウ素−アミン錯体、スルホニウム塩、アミンイミド、ポリアミンの塩、ジシアンジアミド等が挙げられる。これらは１種を単独で又は２種以上を混合して使用することができる。潜在性硬化剤には、分解促進剤、抑制剤等を混合してもよい。上記潜在性硬化剤は、可使時間が延長されるため、ポリウレタン系、ポリエステル系の高分子物質等で被覆してマイクロカプセル化することが好ましい。   (E) The curing agent is preferably a latent curing agent from the viewpoint of obtaining a longer pot life. When the thermosetting resin is an epoxy resin, examples of the latent curing agent include imidazole series, hydrazide series, boron trifluoride-amine complex, sulfonium salt, amine imide, polyamine salt, dicyandiamide, and the like. These can be used individually by 1 type or in mixture of 2 or more types. The latent curing agent may be mixed with a decomposition accelerator, an inhibitor and the like. The latent curing agent is preferably microencapsulated by coating with a polyurethane-based or polyester-based polymeric substance or the like because the pot life is extended.

なお、本明細書における重量平均分子量は、ゲルパーミエイションクロマトグラフィー（ＧＰＣ）分析により下記条件で測定し、標準ポリスチレンの検量線を使用して換算することにより求められるものである。
（ＧＰＣ条件）
使用機器：日立Ｌ−６０００型（（株）日立製作所製、商品名）
検出器：Ｌ−３３００ＲＩ（（株）日立製作所製、商品名）
カラム：ゲルパックＧＬ−Ｒ４２０＋ゲルパックＧＬ−Ｒ４３０＋ゲルパックＧＬ−Ｒ４４０（計３本）（日立化成工業（株）製、商品名）
溶離液：テトラヒドロフラン
測定温度：４０℃
流量：１．７５ｍｌ／ｍｉｎIn addition, the weight average molecular weight in this specification is calculated | required by measuring on the following conditions by gel permeation chromatography (GPC) analysis, and converting using the analytical curve of a standard polystyrene.
(GPC conditions)
Equipment used: Hitachi L-6000 type (manufactured by Hitachi, Ltd., trade name)
Detector: L-3300RI (trade name, manufactured by Hitachi, Ltd.)
Column: Gel pack GL-R420 + Gel pack GL-R430 + Gel pack GL-R440 (3 in total) (trade name, manufactured by Hitachi Chemical Co., Ltd.)
Eluent: Tetrahydrofuran Measurement temperature: 40 ° C
Flow rate: 1.75 ml / min

また、接着剤成分３ａ及び３ｂにおける上述の成分の種類及び配合量等は、それぞれ同じでも異なっていてもよい。また、上述の成分の種類及び配合量は、接着剤成分３ｂの流動性が、接着剤成分３ａの流動性よりも大きくなるように調整されることが好ましい。   Further, the types and blending amounts of the above-mentioned components in the adhesive components 3a and 3b may be the same or different. Moreover, it is preferable that the kind and compounding quantity of the above-mentioned component are adjusted so that the fluidity | liquidity of the adhesive agent component 3b may become larger than the fluidity | liquidity of the adhesive agent component 3a.

（導電粒子）
本実施形態の回路接続用接着フィルム１は、導電粒子５として、ビッカース硬度が３００Ｈｖ以上の金属、好ましくはＮｉ、Ｎｉ合金及びＮｉ酸化物からなる群より選ばれる少なくとも１種を含む金属で最外層が覆われたものを用いる。(Conductive particles)
The adhesive film 1 for circuit connection of this embodiment is an outermost layer made of a metal having a Vickers hardness of 300 Hv or more, preferably a metal containing at least one selected from the group consisting of Ni, Ni alloy and Ni oxide as the conductive particles 5. Use the one covered with.

このような導電粒子５としては、例えば図２（ａ）〜（ｃ）に示す導電粒子５ａ〜５ｃを用いることができる。   As such conductive particles 5, for example, conductive particles 5a to 5c shown in FIGS. 2A to 2C can be used.

まず、導電粒子５ａの構成について図２（ａ）を用いて詳細に説明する。図２は、本発明の一実施形態に係る回路接続用接着フィルムに含まれる導電粒子を示す模式断面図である。   First, the configuration of the conductive particles 5a will be described in detail with reference to FIG. FIG. 2 is a schematic cross-sectional view showing conductive particles contained in an adhesive film for circuit connection according to one embodiment of the present invention.

図２（ａ）に示すように、導電粒子５ａは、核体２１と、核体２１の表面上に形成される金属層（最外層）２２とを有する。核体２１は、中核部２１ａと、中核部２１ａの表面上に形成される突起部２１ｂとを有している。金属層２２は、表面に複数の突起部１４を有している。金属層２２は、核体２１を覆っており、突起部２１ｂに対応する位置で突出し、その突出している部分が突起部１４となっている。   As shown in FIG. 2A, the conductive particle 5 a includes a nucleus body 21 and a metal layer (outermost layer) 22 formed on the surface of the nucleus body 21. The core body 21 has a core portion 21a and a protrusion 21b formed on the surface of the core portion 21a. The metal layer 22 has a plurality of protrusions 14 on the surface. The metal layer 22 covers the core body 21 and protrudes at a position corresponding to the protruding portion 21 b, and the protruding portion is the protruding portion 14.

核体２１は、有機高分子化合物からなることが好ましい。この場合、核体２１は、金属からなる核体に比べてコストが低い上、熱膨張率や圧着接合時の寸法変化に対して弾性変形範囲が広いため、回路接続用途に好適に用いられる。   The nucleus 21 is preferably made of an organic polymer compound. In this case, since the core 21 is lower in cost than the core made of metal and has a wide elastic deformation range with respect to the coefficient of thermal expansion and dimensional change at the time of pressure bonding, it is preferably used for circuit connection.

核体２１の中核部２１ａを構成する有機高分子化合物としては、例えばアクリル樹脂、スチレン樹脂、ベンゾグアナミン樹脂、シリコーン樹脂、ポリブタジエン樹脂又はこれらの共重合体が挙げられ、これらを架橋したものを使用してもよい。核体２１の突起部２１ｂを構成する有機高分子化合物としては、中核部２１ａを構成する有機高分子化合物と同一であっても異なっていてもよい。   Examples of the organic polymer compound constituting the core portion 21a of the core body 21 include acrylic resin, styrene resin, benzoguanamine resin, silicone resin, polybutadiene resin, or a copolymer thereof. May be. The organic polymer compound constituting the protruding portion 21b of the core body 21 may be the same as or different from the organic polymer compound constituting the core portion 21a.

核体２１の中核部２１ａの平均粒径は、１．５〜５．０μｍであることが好ましく、２．０〜４．５μｍであることがより好ましく、２．５〜４．０μｍであることが更に好ましい。平均粒径が１μｍ未満であると粒子の二次凝集が生じ、隣接する回路との絶縁性が不十分となる傾向がある。他方、平均粒径が５μｍを越えると、その大きさに起因して隣接する回路との絶縁性が不十分となる傾向がある。   The average particle size of the core 21a of the core 21 is preferably 1.5 to 5.0 μm, more preferably 2.0 to 4.5 μm, and 2.5 to 4.0 μm. Is more preferable. When the average particle size is less than 1 μm, secondary aggregation of the particles occurs, and the insulation with an adjacent circuit tends to be insufficient. On the other hand, if the average particle size exceeds 5 μm, the insulation from adjacent circuits tends to be insufficient due to the size.

核体２１は、中核部２１ａの表面に中核部２１ａよりも小さな径を有する突起部２１ｂを複数個吸着させることにより形成することができる。突起部２１ｂを中核部２１ａの表面に吸着させる方法としては、例えば、中核部２１ａ及び突起部２１ｂの双方もしくは一方の粒子をシラン、アルミニウム、チタン等の各種カップリング剤及び接着剤の希釈溶液で表面処理した後、両者を混合し付着させる方法が挙げられる。なお、突起部２１ｂの平均粒径は５０〜５００ｎｍであることが好ましい。   The core 21 can be formed by adsorbing a plurality of protrusions 21b having a smaller diameter than the core 21a on the surface of the core 21a. As a method for adsorbing the protrusion 21b on the surface of the core 21a, for example, the core 21a and the protrusion 21b or both particles may be diluted with various coupling agents such as silane, aluminum, titanium, and an adhesive. After surface treatment, the method of mixing and adhering both is mentioned. In addition, it is preferable that the average particle diameter of the protrusion part 21b is 50-500 nm.

金属層２２は、Ｎｉ、Ｐｄ、Ｒｈ等のビッカース硬度が３００Ｈｖ以上の金属、好ましくはＮｉ、Ｎｉ合金及びＮｉ酸化物からなる群より選ばれる少なくとも１種を含む金属を含む。Ｎｉとしては、純Ｎｉ、Ｎｉ合金及びＮｉ酸化物からなる群より選ばれる少なくとも１種が挙げられ、これらの中でも純Ｎｉ、純Ｐｄが好ましい。Ｎｉ合金としては、例えば、Ｎｉ−Ｂ、Ｎｉ−Ｗ、Ｎｉ−Ｂ、Ｎｉ−Ｗ−Ｃｏ、Ｎｉ−Ｆｅ及びＮｉ−Ｃｒが挙げられる。Ｎｉ酸化物としては、例えば、ＮｉＯ等が挙げられる。金属層２２は、単一の金属の層からなるものであってもよく、複数の金属の層からなるものであってもよい。なお、ビッカース硬度は、例えば、ジャパンハイテック社製の「Ｍａｉｃｒｏｈａｒａｄｎｅｓｓ Ｔｅｓｔｅｒ ＭＨＴ−４（商品名）」を用いて、負荷荷重２０ｋｇｆ、負荷速度２０ｋｇｆ／秒、保持時間５秒の条件で測定することができる。   The metal layer 22 includes a metal having a Vickers hardness of 300 Hv or higher, such as Ni, Pd, and Rh, preferably a metal including at least one selected from the group consisting of Ni, Ni alloy, and Ni oxide. Examples of Ni include at least one selected from the group consisting of pure Ni, Ni alloy, and Ni oxide. Among these, pure Ni and pure Pd are preferable. Examples of the Ni alloy include Ni-B, Ni-W, Ni-B, Ni-W-Co, Ni-Fe, and Ni-Cr. Examples of the Ni oxide include NiO. The metal layer 22 may be composed of a single metal layer or may be composed of a plurality of metal layers. The Vickers hardness can be measured, for example, under the conditions of a load load of 20 kgf, a load speed of 20 kgf / second, and a holding time of 5 seconds using “Macroharadness Tester MHT-4 (trade name)” manufactured by Japan Hightech. .

金属層２２は、これらの金属を核体２１に対して無電解めっき法を用いてめっきすることにより形成することができる。無電解めっき法は、大きくバッチ方式と連続滴下方式とに分けられるが、いずれの方式を用いても金属層２２を形成することができる。   The metal layer 22 can be formed by plating these metals on the core 21 using an electroless plating method. The electroless plating method is roughly divided into a batch method and a continuous dropping method, and the metal layer 22 can be formed by using any method.

金属層２２の厚さ（めっきの厚さ）は、５０〜１７０ｎｍが好ましく、５０〜１５０ｎｍがより好ましい。金属層２２の厚さをこのような範囲とすることで、回路電極３２，４２間の接続抵抗をより一層低減させることができる。金属層２２の厚さが５０ｎｍ未満ではめっきの欠損等が発生する傾向があり、１７０ｎｍを超えると導電粒子間で凝結が発生して隣接する回路電極間で短絡が生じる傾向がある。   50-170 nm is preferable and, as for the thickness (thickness of plating) of the metal layer 22, 50-150 nm is more preferable. By setting the thickness of the metal layer 22 in such a range, the connection resistance between the circuit electrodes 32 and 42 can be further reduced. If the thickness of the metal layer 22 is less than 50 nm, plating defects tend to occur, and if it exceeds 170 nm, condensation occurs between the conductive particles and a short circuit tends to occur between adjacent circuit electrodes.

なお、導電粒子５ａは、部分的に核体２１が露出している場合がある。この場合、接続信頼性の観点から、核体２１の表面積に対する金属層２２の被覆率は７０％以上であることが好ましく、８０％以上であることがより好ましく、９０％以上であることが更に好ましい。   Note that the core 21 may be partially exposed in the conductive particles 5a. In this case, from the viewpoint of connection reliability, the coverage of the metal layer 22 with respect to the surface area of the core 21 is preferably 70% or more, more preferably 80% or more, and further preferably 90% or more. preferable.

導電粒子５ａの突起部１４の高さ（Ｈ）は５０〜５００ｎｍであることが好ましく、７５〜３００ｎｍであることがより好ましい。突起部１４の高さ（Ｈ）が５０ｎｍ未満であると、高温高湿処理後に接続抵抗が高くなる傾向があり、５００ｎｍを超えると、導電粒子と回路電極との接触面積が小さくなるため接続抵抗が高くなる傾向がある。   The height (H) of the protrusions 14 of the conductive particles 5a is preferably 50 to 500 nm, and more preferably 75 to 300 nm. If the height (H) of the protrusion 14 is less than 50 nm, the connection resistance tends to increase after the high-temperature and high-humidity treatment. If the height (H) exceeds 500 nm, the contact area between the conductive particles and the circuit electrode becomes small, so the connection resistance Tend to be higher.

隣接する突起部１４間の距離（Ｓ）は１０００ｎｍ以下であることが好ましく、５００ｎｍ以下であることがより好ましい。また、隣接する突起部１４間の距離（Ｓ）は、後述する導電粒子５ａと回路電極３２，４２との間に接着剤成分３ａ，３ｂの硬化体４ａ，４ｂが入り込まず、十分に導電粒子５ａと回路電極３２，４２とを接触させるためには、少なくとも５０ｎｍ以上であることが好ましい。なお、突起部１４の高さ（Ｈ）及び隣接する突起部１４間の距離（Ｓ）は、電子顕微鏡により測定することができる。   The distance (S) between the adjacent protrusions 14 is preferably 1000 nm or less, and more preferably 500 nm or less. Moreover, the distance (S) between the adjacent protrusions 14 is sufficient for the conductive particles 5a and the circuit electrodes 32 and 42, which will be described later, not to enter the cured bodies 4a and 4b of the adhesive components 3a and 3b. In order to make 5a and circuit electrodes 32 and 42 contact, it is preferred that it is at least 50 nm or more. In addition, the height (H) of the protrusion part 14 and the distance (S) between the adjacent protrusion parts 14 can be measured with an electron microscope.

なお、導電粒子５は、図２（ｂ）に示すように、核体２１が中核部２１ａのみで構成された導電粒子５ｂであってもよい。言い換えると、図２（ａ）に示す核体２１において突起部２１ｂが設けられていなくてもよい。図２（ｂ）に示す導電粒子５ｂは、中核部２１ａの表面を金属めっきし、中核部２１ａの表面上に突起部１４を有する金属層２２を形成することにより得ることができる。   In addition, as shown in FIG. 2B, the conductive particles 5 may be conductive particles 5b in which the core 21 is composed only of the core 21a. In other words, the protrusion 21b may not be provided in the core body 21 shown in FIG. The conductive particles 5b shown in FIG. 2B can be obtained by metal plating the surface of the core portion 21a and forming the metal layer 22 having the protrusions 14 on the surface of the core portion 21a.

突起部１４を形成させるためのめっき方法について説明する。突起部１４は、金属めっきの際、めっき条件を途中で変更して、金属層２２の厚さを部分的に変化させることで形成することができる。例えば、突起部１４は、最初に使用しためっき液よりも濃度の高いめっき液をめっき反応の途中で追加し、めっき液の濃度を不均一にすることにより形成することができる。   A plating method for forming the protrusion 14 will be described. The protrusion 14 can be formed by changing the plating conditions in the middle of metal plating and partially changing the thickness of the metal layer 22. For example, the protrusion 14 can be formed by adding a plating solution having a higher concentration than the plating solution used first in the course of the plating reaction and making the concentration of the plating solution non-uniform.

また、導電粒子５は、図２（ｃ）に示すように、核体２１と、中核部２１ａの表面上に形成される金属層（最外層）２２とを有する導電粒子５ｃであってもよい。導電粒子５ｃは、突起部１４を有していない点で導電粒子５ａと相違する。   Further, as shown in FIG. 2C, the conductive particle 5 may be a conductive particle 5c having a core body 21 and a metal layer (outermost layer) 22 formed on the surface of the core portion 21a. . The conductive particle 5 c is different from the conductive particle 5 a in that it does not have the protrusion 14.

また、導電粒子５は、非導電性のガラス、セラミック、プラスチック等の絶縁粒子を、Ｎｉ等を含む金属層２２で被覆したものであってもよい。金属層２２がＮｉを含み核体２１がプラスチックである場合や、又は導電粒子５が熱溶融金属粒子の場合には、加熱加圧により変形性を有し、接続時に導電粒子５と電極との接触面積が増加し接続信頼性が向上するので好ましい。   In addition, the conductive particles 5 may be those in which insulating particles such as non-conductive glass, ceramic, and plastic are coated with a metal layer 22 containing Ni or the like. When the metal layer 22 contains Ni and the core 21 is plastic, or when the conductive particles 5 are hot-melt metal particles, the metal layer 22 is deformable by heating and pressurization, and the conductive particles 5 and the electrodes are connected when connected. This is preferable because the contact area is increased and the connection reliability is improved.

導電粒子５の含有量は、異方導電層における接着剤成分１００体積部に対して０．１〜３０体積部が好ましく、用途に応じて適宜調整される。また、導電粒子５の含有量は、導電粒子５による隣接する回路同士の短絡等を一層十分に抑制する観点から、異方導電層における接着剤成分１００体積部に対して０．１〜１０体積部がより好ましい。   The content of the conductive particles 5 is preferably 0.1 to 30 parts by volume with respect to 100 parts by volume of the adhesive component in the anisotropic conductive layer, and is appropriately adjusted depending on the application. Further, the content of the conductive particles 5 is 0.1 to 10 volumes with respect to 100 parts by volume of the adhesive component in the anisotropic conductive layer from the viewpoint of more sufficiently suppressing short circuits between adjacent circuits due to the conductive particles 5. Part is more preferred.

回路電極３２，４２間の導通を一層確実にする観点から、導電粒子５の１０％圧縮弾性率（Ｋ値）は、１００〜１０００ｋｇｆ／ｍｍ２であることが好ましい。ここで、１０％圧縮弾性率（Ｋ値）とは、導電粒子５を１０％圧縮変形させた際の弾性率をいい、例えば株式会社フィッシャーインストルメンツ製Ｈ−１００微小硬度計により測定することができる。From the viewpoint of further ensuring the conduction between the circuit electrodes 32 and 42, the 10% compression elastic modulus (K value) of the conductive particles 5 is preferably 100 to 1000 kgf / mm 2 . Here, the 10% compression modulus (K value) refers to the modulus of elasticity when the conductive particles 5 are 10% compressed and deformed, and can be measured by, for example, an H-100 microhardness meter manufactured by Fisher Instruments Co., Ltd. it can.

導電粒子５の平均粒径は、接続する回路電極の高さより低くすることにより隣接電極間の短絡を更に抑制し易くなる観点から、１．５〜５．０μｍが好ましく、２．０〜４．５μｍがより好ましく、２．５〜４．０μｍが更に好ましい。なお、導電粒子５ａ，５ｂの「平均粒径」とは、突起部１４の高さ（Ｈ）は考慮せず、核体２１と金属層２２の突起部１４が形成されていない部分とを考慮して算出される粒径を意味するものとする。   The average particle size of the conductive particles 5 is preferably 1.5 to 5.0 μm from the viewpoint of further easily suppressing a short circuit between adjacent electrodes by making the average particle size lower than the height of the circuit electrode to be connected. 5 micrometers is more preferable and 2.5-4.0 micrometers is still more preferable. Note that the “average particle diameter” of the conductive particles 5a and 5b does not consider the height (H) of the protrusions 14, but considers the portion of the core 21 and the metal layer 22 where the protrusions 14 are not formed. Mean the particle size calculated as above.

導電粒子５の平均粒径は、以下のようにして測定できる。示差走査型電子顕微鏡（ＳＥＭ：例えば、ＨＩＴＡＣＨＩ製、Ｓ８００）で３０００倍に拡大された導電粒子の粒子像から５０個の粒子を任意に選択する。拡大された粒子像を用いて、選択した複数の粒子それぞれについて最大径と最小径とを測定する。そして、それぞれの粒子の最大径及び最小径の積の平方根をその粒子の粒径とする。任意に選択した導電粒子５０個について上記のようにして各々粒径を測定し、測定した粒子個数で粒径の和を除した値を平均粒径とする。   The average particle diameter of the conductive particles 5 can be measured as follows. 50 particles are arbitrarily selected from the particle image of the conductive particles magnified 3000 times with a differential scanning electron microscope (SEM: for example, S800, manufactured by HITACHI). Using the enlarged particle image, the maximum diameter and the minimum diameter are measured for each of the selected plurality of particles. The square root of the product of the maximum diameter and the minimum diameter of each particle is defined as the particle diameter of the particle. The particle diameter of each of 50 arbitrarily selected conductive particles is measured as described above, and the value obtained by dividing the sum of the particle diameters by the measured number of particles is taken as the average particle diameter.

更に、本実施形態の回路接続用接着フィルム１（異方導電層１１及び絶縁層１２）は、ゴム微粒子、充填材、軟化剤、促進剤、老化防止剤、着色剤、難燃化剤、チキソトロピック剤、カップリング剤、フェノール樹脂、メラミン樹脂、イソシアネート類等を含有してもよい。   Furthermore, the adhesive film for circuit connection 1 (anisotropic conductive layer 11 and insulating layer 12) of this embodiment is composed of rubber fine particles, fillers, softeners, accelerators, anti-aging agents, colorants, flame retardants, thixotropes. You may contain a tropic agent, a coupling agent, a phenol resin, a melamine resin, isocyanates, etc.

ゴム微粒子としては、粒子の平均粒径が、配合する導電粒子５の平均粒径の２倍以下であり、かつ室温（２５℃）での貯蔵弾性率が導電粒子５及び接着剤成分３ａ，３ｂの室温での貯蔵弾性率の１／２以下であるものが好ましい。特に、ゴム微粒子の材質がシリコーン、アクリルエマルジョン、ＳＢＲ、ＮＢＲ、ポリブタジエンゴムである場合、１種を単独で又は２種以上を混合して用いることが好適である。３次元架橋したこれらゴム微粒子は、耐溶剤性が優れており、接着剤成分３ａ，３ｂ中に容易に分散される。   As the rubber fine particles, the average particle diameter of the particles is not more than twice the average particle diameter of the conductive particles 5 to be blended, and the storage elastic modulus at room temperature (25 ° C.) is the conductive particles 5 and the adhesive components 3a and 3b. Those having a storage elastic modulus of 1/2 or less at room temperature are preferred. In particular, when the material of the rubber fine particles is silicone, acrylic emulsion, SBR, NBR, or polybutadiene rubber, it is preferable to use one kind alone or a mixture of two or more kinds. These three-dimensionally crosslinked rubber fine particles have excellent solvent resistance and are easily dispersed in the adhesive components 3a and 3b.

充填材を含有した場合、接続信頼性等が向上するため好ましい。充填材の最大径は、導電粒子５ａの平均粒径未満であることが好ましい。充填材の含有量は、回路接続用接着フィルム全体に対して５〜６０体積％の範囲が好ましい。含有量が６０体積％を越えると、信頼性向上の効果が飽和する傾向がある。   The inclusion of a filler is preferable because connection reliability and the like are improved. The maximum diameter of the filler is preferably less than the average particle diameter of the conductive particles 5a. The content of the filler is preferably in the range of 5 to 60% by volume with respect to the entire adhesive film for circuit connection. When the content exceeds 60% by volume, the effect of improving reliability tends to be saturated.

カップリング剤としては、ビニル基、アクリル基、アミノ基、エポキシ基及びイソシアネート基からなる群より選ばれる１種以上の基を含有する化合物が、接着性の向上の点から好ましい。   As the coupling agent, a compound containing one or more groups selected from the group consisting of a vinyl group, an acrylic group, an amino group, an epoxy group, and an isocyanate group is preferable from the viewpoint of improving adhesiveness.

本実施形態の回路接続用接着フィルム１は、接続時に接着剤が溶融流動し相対向する回路電極を接続した後、硬化して接続を保持するものであり、接着剤の流動性は重要な因子である。厚さ０．７ｍｍ、１５ｍｍ×１５ｍｍのガラス板に、厚さ３５μｍ、５ｍｍ×５ｍｍの回路接続用接着フィルム１を挟み、１７０℃、２ＭＰａ、１０秒の条件で加熱加圧を行った場合、初期の面積（Ａ）と加熱加圧後の面積（Ｂ）とを用いて表される流動性（Ｂ）／（Ａ）の値は１．３〜３．０であることが好ましく、１．５〜２．５であることがより好ましい。（Ｂ）／（Ａ）が１．３未満では流動性が悪く、良好な接続が得られない傾向があり、３．０を超える場合は、気泡が発生しやすく信頼性に劣る傾向がある。   The adhesive film 1 for circuit connection according to the present embodiment is one in which the adhesive melts and flows at the time of connection and the circuit electrodes facing each other are connected and then cured to maintain the connection. The fluidity of the adhesive is an important factor. It is. When an adhesive film for circuit connection 1 having a thickness of 35 μm and a thickness of 5 mm × 5 mm is sandwiched between a glass plate having a thickness of 0.7 mm and 15 mm × 15 mm, and heating and pressurization are performed at 170 ° C., 2 MPa, and 10 seconds, The value of the fluidity (B) / (A) expressed by using the area (A) and the area (B) after heating and pressing is preferably 1.3 to 3.0, and 1.5 More preferably, it is -2.5. When (B) / (A) is less than 1.3, the fluidity is poor and there is a tendency that good connection cannot be obtained. When it exceeds 3.0, bubbles tend to be generated and the reliability tends to be poor.

本実施形態の回路接続用接着フィルム１の硬化後の４０℃での弾性率は１００〜３０００ＭＰａが好ましく、５００〜２０００ＭＰａがより好ましい。   100-3000 MPa is preferable and, as for the elasticity modulus in 40 degreeC after hardening of the adhesive film 1 for circuit connection of this embodiment, 500-2000 MPa is more preferable.

本実施形態の回路接続用フィルム１において、異方導電層１１の厚みは、導電粒子５の平均粒径の０．３〜１．５倍であり、好ましくは０．７〜１．３倍である。   In the circuit connection film 1 of the present embodiment, the anisotropic conductive layer 11 has a thickness of 0.3 to 1.5 times the average particle size of the conductive particles 5, preferably 0.7 to 1.3 times. is there.

また、回路接続用フィルム１の厚み（異方導電層１１及び絶縁層１２の総厚み）は、６〜２０μｍであることが好ましく、８〜１８μｍであることがより好ましく、８〜１４μｍであることがさらに好ましい。すなわち、絶縁層１２の厚みは、異方導電層１１の厚みをＴＡ（μｍ）として、（６−ＴＡ）〜（２０−ＴＡ）μｍであることが好ましく、（８−ＴＡ）〜（１８−ＴＡ）μｍであることがより好ましく、（８−ＴＡ）〜（１４−ＴＡ）μｍであることがさらに好ましい。絶縁層１２の厚みが上記範囲であると、高精細回路間の接続が一層信頼性良く行うことができ、かつバーント現象を一層抑制することができる。Further, the thickness of the circuit connecting film 1 (total thickness of the anisotropic conductive layer 11 and the insulating layer 12) is preferably 6 to 20 μm, more preferably 8 to 18 μm, and 8 to 14 μm. Is more preferable. That is, the thickness of the insulating layer 12 is preferably (6−T A ) to (20−T A ) μm, where T A (μm) is the thickness of the anisotropic conductive layer 11, and (8−T A ). ~ (18-T a) is more preferably [mu] m, still more preferably (8-T a) ~ ( 14-T a) μm. When the thickness of the insulating layer 12 is in the above range, the connection between the high-definition circuits can be performed more reliably and the burnt phenomenon can be further suppressed.

回路接続用フィルム１は、例えば、異方導電層１１と絶縁層１２とをラミネーターを用いてラミネートすることによって作製することができる。   The circuit connecting film 1 can be produced, for example, by laminating the anisotropic conductive layer 11 and the insulating layer 12 using a laminator.

また、異方導電層１１及び絶縁層１２は、例えば、それぞれの層を構成する各成分を溶解又は分散した混合液を準備し、該混合液を塗工装置を用いて塗工して乾燥させることで作製することができる。   Moreover, the anisotropic conductive layer 11 and the insulating layer 12 prepare the liquid mixture which melt | dissolved or disperse | distributed each component which comprises each layer, for example, apply | coat this liquid mixture using a coating device, and make it dry. Can be produced.

異方導電層１１及び絶縁層１２の厚みは、塗工装置のコーターギャップを制御することにより適宜変動させることができる。また、コーターギャップが広い場合でも、塗布する混合液の固形分濃度を低くすることにより、層の厚みを小さくすることができる。   The thicknesses of the anisotropic conductive layer 11 and the insulating layer 12 can be appropriately changed by controlling the coater gap of the coating apparatus. Even when the coater gap is wide, the thickness of the layer can be reduced by reducing the solid content concentration of the mixed liquid to be applied.

異方導電層１１は、接着剤成分３ａ及び導電粒子５を含む混合液を塗工することで作製してもよいが、接着剤成分３ａを含む混合液を塗工して接着剤成分３ａからなる層を形成した後、該層の表面に導電粒子を散布し埋め込むこと等によって作製することもできる。後者の方法としては、例えば、特開平１０−３０２９２６号公報に記載の方法を用いることができる。   The anisotropic conductive layer 11 may be prepared by applying a mixed solution containing the adhesive component 3a and the conductive particles 5, but the mixed solution containing the adhesive component 3a is applied to the adhesive component 3a. After forming a layer to be formed, it can be produced by spreading and embedding conductive particles on the surface of the layer. As the latter method, for example, the method described in JP-A-10-302926 can be used.

＜回路接続構造体＞
図３は、本発明の一実施形態に係る回路接続構造体を示す模式断面図である。本実施形態の回路接続構造体１００は、相互に対向する回路部材（第１の回路部材）３０及び回路部材（第２の回路部材）４０と、回路部材３０及び回路部材４０の間に介在し、これらを接続する回路接続部材１０とを備えている。<Circuit connection structure>
FIG. 3 is a schematic cross-sectional view showing a circuit connection structure according to an embodiment of the present invention. The circuit connection structure 100 of the present embodiment is interposed between the circuit member (first circuit member) 30 and the circuit member (second circuit member) 40 facing each other, and the circuit member 30 and the circuit member 40. And a circuit connecting member 10 for connecting them.

回路部材３０は、回路基板（第１の回路基板）３１と、回路基板３１の主面３１ａ上に形成される回路電極（第１の回路電極）３２とを備えている。回路部材４０は、回路基板（第２の回路基板）４１と、回路基板４１の主面４１ａ上に形成される回路電極（第２の回路電極）４２とを備えている。   The circuit member 30 includes a circuit board (first circuit board) 31 and a circuit electrode (first circuit electrode) 32 formed on the main surface 31 a of the circuit board 31. The circuit member 40 includes a circuit board (second circuit board) 41 and a circuit electrode (second circuit electrode) 42 formed on the main surface 41 a of the circuit board 41.

回路基板３１，４１の材質は特に制限されないが、通常は有機絶縁性物質、ガラス又はシリコンである。   The material of the circuit boards 31 and 41 is not particularly limited, but is usually an organic insulating material, glass or silicon.

回路電極３２，４２の材質としては、Ａｕ、Ａｇ、Ｓｎ、Ｐｔ族の金属、インジウム−錫酸化物（ＩＴＯ）、インジウム−亜鉛酸化物（ＩＺＯ）、Ａｌ、Ｃｒが挙げられる。回路電極３２，４２の少なくとも一方は、電気的接続が顕著に良好となる観点から、インジウム−錫酸化物（ＩＴＯ）及びインジウム−亜鉛酸化物（ＩＺＯ）の少なくとも一方を含むことが好ましい。また、回路電極３２，４２は、全体が上記材質で構成されていてもよいし、最外層のみが上記材質で構成されていてもよい。   Examples of the material of the circuit electrodes 32 and 42 include Au, Ag, Sn, and Pt group metals, indium-tin oxide (ITO), indium-zinc oxide (IZO), Al, and Cr. At least one of the circuit electrodes 32 and 42 preferably contains at least one of indium-tin oxide (ITO) and indium-zinc oxide (IZO) from the viewpoint of significantly improving electrical connection. Further, the circuit electrodes 32 and 42 may be entirely made of the above material, or only the outermost layer may be made of the above material.

上記回路部材３０，４０のうち少なくとも一方、好ましくはフレキシブル基板の回路ピッチは、４０μｍ以下である。また、回路ピッチの下限は、特に限定されないが、例えば凡そ２０μｍとすることができる。   At least one of the circuit members 30 and 40, preferably the circuit pitch of the flexible substrate is 40 μm or less. Further, the lower limit of the circuit pitch is not particularly limited, but can be about 20 μm, for example.

回路電極３２、４２の表面は平坦になっていることが好ましい。なお、本明細書において「回路電極の表面が平坦」とは、回路電極の表面の凹凸が２０ｎｍ以下であることをいう。   The surfaces of the circuit electrodes 32 and 42 are preferably flat. In the present specification, “the surface of the circuit electrode is flat” means that the unevenness of the surface of the circuit electrode is 20 nm or less.

導電粒子５が突起部を有するものである場合には、回路電極３２，４２の厚さを５０ｎｍ未満にすると、回路部材３０及び回路部材４０間で回路接続用接着フィルム１を加圧するに際し、導電粒子の表面側にある突起部が回路電極３２，４２を貫通し回路基板３１，４１と接触する場合がある。そのため、回路電極３２，４２の厚さを５０ｎｍ以上とすることにより、回路電極３２，４２と導電粒子５との接触面積が増加し、接続抵抗がより低下することとなる。また、回路電極３２，４２の厚さは、製造コスト等の点から、１０００ｎｍ以下が好ましく、５００ｎｍ以下がより好ましい。   When the conductive particles 5 have protrusions, if the thickness of the circuit electrodes 32 and 42 is less than 50 nm, the conductive particles 5 are electrically conductive when the circuit connecting adhesive film 1 is pressed between the circuit members 30 and 40. The protrusions on the surface side of the particles may pass through the circuit electrodes 32 and 42 and come into contact with the circuit boards 31 and 41. Therefore, by setting the thickness of the circuit electrodes 32 and 42 to 50 nm or more, the contact area between the circuit electrodes 32 and 42 and the conductive particles 5 is increased, and the connection resistance is further decreased. In addition, the thickness of the circuit electrodes 32 and 42 is preferably 1000 nm or less, and more preferably 500 nm or less from the viewpoint of manufacturing cost.

また、回路部材３０において、回路電極３２及び回路基板３１の間に絶縁層が更に設けられてもよいし、回路部材４０において、回路電極４２及び回路基板４１の間に絶縁層が更に設けられていてもよい。絶縁層の材質は、絶縁材料で構成されていれば特に制限されないが、通常は有機絶縁性物質、二酸化珪素又は窒化珪素である。   In the circuit member 30, an insulating layer may be further provided between the circuit electrode 32 and the circuit board 31. In the circuit member 40, an insulating layer is further provided between the circuit electrode 42 and the circuit board 41. May be. The material of the insulating layer is not particularly limited as long as it is made of an insulating material, but is usually an organic insulating material, silicon dioxide or silicon nitride.

第１の回路部材３０及び第２の回路部材４０の具体例としては、半導体チップ、抵抗体チップ、コンデンサチップ等のチップ部品、プリント基板等の基板が挙げられる。これらの回路部材３０，４０には通常、回路電極（接続端子）３２，４２が多数（場合によっては単数でもよい）設けられている。   Specific examples of the first circuit member 30 and the second circuit member 40 include chip components such as a semiconductor chip, a resistor chip, and a capacitor chip, and a substrate such as a printed circuit board. These circuit members 30 and 40 are usually provided with a large number of circuit electrodes (connection terminals) 32 and 42 (in some cases, the number may be one).

回路接続部材１０は、上記回路接続用接着フィルム１を硬化処理することによって得られるものであり、上記接着剤成分３ａ，３ｂを硬化してなる硬化体４ａ，４ｂと、上記導電粒子５とを含む。   The circuit connecting member 10 is obtained by curing the circuit connecting adhesive film 1, and includes the cured bodies 4a and 4b obtained by curing the adhesive components 3a and 3b, and the conductive particles 5. Including.

回路接続構造体１００において、対向する回路電極３２と回路電極４２とは、導電粒子５を介して電気的に接続されている。即ち、導電粒子５が、回路電極３２，４２の双方に直接接触することにより電気的に接続されている。   In the circuit connection structure 100, the facing circuit electrode 32 and the circuit electrode 42 are electrically connected through the conductive particles 5. That is, the conductive particles 5 are electrically connected by directly contacting both the circuit electrodes 32 and 42.

導電粒子５が複数の突起部を有する場合には、その一部が回路電極３２又は回路電極４２に食い込んでいることが好ましい。この場合、導電粒子の突起部と回路電極３２，４２との接触面積がより増加し、接続抵抗をより低減させることができる。   When the conductive particle 5 has a plurality of protrusions, it is preferable that a part of the conductive particle 5 bites into the circuit electrode 32 or the circuit electrode 42. In this case, the contact area between the protrusions of the conductive particles and the circuit electrodes 32 and 42 can be further increased, and the connection resistance can be further reduced.

（回路接続構造体の製造方法）
本実施形態の回路接続用接着フィルム１は、ＩＣチップと基板との接着や、電気回路相互の接着用の接着剤としても有用である。第１の回路電極（接続端子）を有する第１の回路部材と、第２の回路電極（接続端子）を有する第２の回路部材とを、第１の回路電極及び第２の回路電極が対向した状態で配置して、第１の回路電極と第２の回路電極との間に本実施形態の回路接続用接着フィルム１を介在して加熱加圧することにより、第１の回路電極及び第２の回路電極が電気的に接続させて、回路接続構造体１００を構成することができる。(Method for manufacturing circuit connection structure)
The adhesive film 1 for circuit connection according to this embodiment is also useful as an adhesive for bonding an IC chip and a substrate or bonding electric circuits to each other. The first circuit electrode and the second circuit electrode are opposed to the first circuit member having the first circuit electrode (connection terminal) and the second circuit member having the second circuit electrode (connection terminal). In this state, the first circuit electrode and the second circuit electrode are heated and pressed by interposing the circuit connecting adhesive film 1 of the present embodiment between the first circuit electrode and the second circuit electrode. The circuit connection structure 100 can be configured by electrically connecting the circuit electrodes.

本実施形態で用いる回路電極の接続方法は、熱又は光による硬化性を有する回路接続用接着フィルム１を、表面が金、銀、錫及び白金属から選ばれる金属を含む一方の電極回路上に形成した後、もう一方の回路電極を位置合わせし加熱、加圧することで、回路電極同士を接続することができる。   In the circuit electrode connection method used in the present embodiment, the adhesive film for circuit connection 1 having heat or light curability is placed on one electrode circuit containing a metal whose surface is selected from gold, silver, tin and white metal. After the formation, the other circuit electrodes are aligned, heated, and pressed to connect the circuit electrodes.

本実施形態の回路接続構造体１００としては、例えば、半導体チップ、抵抗体チップ、コンデンサチップ等のチップ部品、プリント基板等の基板等が挙げられる。これらの回路接続構造体１００には回路電極（接続端子）が通常は多数（場合によっては単数でもよい）設けられており、回路接続構造体１００の少なくとも１組をそれらの回路接続構造体１００に設けられた接続端子の少なくとも一部を対向配置し、対向配置した回路電極間に接着剤を介在させ、加熱加圧して対向配置した回路電極同士を電気的に接続して回路板とする。回路接続構造体１００の少なくとも１組を加熱加圧することにより、対向配置した回路電極同士は、回路接続用接着フィルムの導電粒子を介して電気的に接続することができる。   Examples of the circuit connection structure 100 according to the present embodiment include chip components such as semiconductor chips, resistor chips, and capacitor chips, and substrates such as printed boards. These circuit connection structures 100 are usually provided with a large number of circuit electrodes (connection terminals) (may be a single terminal in some cases), and at least one set of the circuit connection structures 100 is attached to the circuit connection structures 100. At least a part of the provided connection terminals is arranged to face each other, an adhesive is interposed between the arranged circuit electrodes, and the circuit electrodes arranged to face each other by heating and pressing are electrically connected to form a circuit board. By heating and pressurizing at least one set of the circuit connection structure 100, the circuit electrodes arranged to face each other can be electrically connected via the conductive particles of the adhesive film for circuit connection.

次に、図４を用いて、本実施形態の回路接続構造体７０の製造方法について具体的に説明する。図４は、本発明の一実施形態に係る回路接続構造体の製造方法を模式的に示す工程断面図である。図４（ａ）は、回路部材同士を接続する前の状態を示しており、図４（ｂ）は回路部材同士を接続する際の状態を示しており、図４（ｃ）は回路部材同士を接続した後の回路接続構造体を示している。   Next, the manufacturing method of the circuit connection structure 70 of the present embodiment will be specifically described with reference to FIG. FIG. 4 is a process cross-sectional view schematically showing a method for manufacturing a circuit connection structure according to an embodiment of the present invention. FIG. 4A shows a state before the circuit members are connected to each other, FIG. 4B shows a state when the circuit members are connected to each other, and FIG. The circuit connection structure after connecting is shown.

まず、図４（ａ）に示すように、主面上に回路電極７２及び液晶表示部７４を有するＬＣＤパネル７３を用意する。次に、回路接続用接着フィルム６１を回路電極７２上に接着して載置する。そして、ＣＯＦ等の回路電極７６が設けられた回路基板７５を、回路電極７２と回路電極７６とが回路接続用接着フィルム６１を介して互いに対向するように位置合わせする。なお、回路電極７２及び回路電極７６は、例えば複数の電極が並んだ構造を有している。   First, as shown in FIG. 4A, an LCD panel 73 having a circuit electrode 72 and a liquid crystal display 74 on the main surface is prepared. Next, the adhesive film 61 for circuit connection is adhered and placed on the circuit electrode 72. Then, the circuit board 75 provided with the circuit electrode 76 such as COF is aligned so that the circuit electrode 72 and the circuit electrode 76 face each other through the circuit connecting adhesive film 61. The circuit electrode 72 and the circuit electrode 76 have, for example, a structure in which a plurality of electrodes are arranged.

次に、図４（ｂ）に示すように、ＬＣＤパネル７３と回路基板７５とを位置合わせをしながら、回路電極７２と回路電極７６とが回路接続用接着フィルム６１を介して互いに対向するように、回路接続用接着フィルム６１上に回路基板７５を載置する。これにより、回路電極７２と回路電極７６とが回路接続用接着フィルム６１中の導電粒子５により接続されることとなる。   Next, as shown in FIG. 4B, the circuit electrode 72 and the circuit electrode 76 are opposed to each other through the circuit connecting adhesive film 61 while aligning the LCD panel 73 and the circuit board 75. Next, the circuit board 75 is placed on the adhesive film 61 for circuit connection. Thereby, the circuit electrode 72 and the circuit electrode 76 are connected by the conductive particles 5 in the circuit connecting adhesive film 61.

次に、回路電極７６が配置された面とは反対側の面から（図４（ｂ）中の矢印Ａ方向）回路基板７５を加圧すると共に、回路接続用接着フィルム６１を加熱する。これにより、回路接続用接着フィルム６１が硬化し、回路接続部材６０が得られる。以上により、図４（ｃ）に示すように、ＬＣＤパネル７３と回路基板７５とが回路接続部材６０を介して強固に接続された回路接続構造体７０が得られる。なお、硬化処理の方法は、使用する接着剤成分に応じて、加熱及び光照射の一方又は双方を採用することができる。   Next, the circuit board 75 is pressed from the surface opposite to the surface on which the circuit electrode 76 is disposed (in the direction of arrow A in FIG. 4B), and the circuit connecting adhesive film 61 is heated. Thereby, the adhesive film 61 for circuit connection hardens | cures, and the circuit connection member 60 is obtained. 4C, the circuit connection structure 70 in which the LCD panel 73 and the circuit board 75 are firmly connected via the circuit connection member 60 is obtained. In addition, the method of a hardening process can employ | adopt one or both of a heating and light irradiation according to the adhesive agent component to be used.

以上、本発明の好適な実施形態について説明したが、本発明は上記実施形態に限定されるものではない。   The preferred embodiment of the present invention has been described above, but the present invention is not limited to the above embodiment.

以下、実施例によって本発明を更に詳細に説明するが、本発明はこれらの実施例に限定されるものではない。   EXAMPLES Hereinafter, although an Example demonstrates this invention further in detail, this invention is not limited to these Examples.

（実施例１）
［ウレタンアクリレートの合成］
重量平均分子量８００のポリカプロラクトンジオール４００質量部と、２−ヒドロキシプロピルアクリレート１３１質量部、触媒としてジブチル錫ジラウレート０．５質量部、重合禁止剤としてハイドロキノンモノメチルエーテル１．０質量部を攪拌しながら５０℃に加熱して混合した。次いで、イソホロンジイソシアネート２２２質量部を滴下し更に攪拌しながら８０℃に昇温してウレタン化反応を行った。イソシアネート基の反応率が９９％以上になったことを確認後、反応温度を下げてウレタンアクリレートを得た。Example 1
[Synthesis of urethane acrylate]
While stirring 400 parts by mass of polycaprolactone diol having a weight average molecular weight of 800, 131 parts by mass of 2-hydroxypropyl acrylate, 0.5 parts by mass of dibutyltin dilaurate as a catalyst, and 1.0 part by mass of hydroquinone monomethyl ether as a polymerization inhibitor, 50 Heat to ℃ and mix. Next, 222 parts by mass of isophorone diisocyanate was dropped, and the temperature was raised to 80 ° C. while stirring to carry out a urethanization reaction. After confirming that the reaction rate of the isocyanate group was 99% or more, the reaction temperature was lowered to obtain urethane acrylate.

［ポリエステルウレタン樹脂の調製］
ジカルボン酸としてテレフタル酸、ジオールとしてプロピレングリコール、イソシアネートとして４，４’−ジフェニルメタンジイソシアネートを用い、テレフタル酸／プロピレングリコール／４，４’−ジフェニルメタンジイソシアネートのモル比が１．０／１．３／０．２５及び１．０／２．０／０．２５となる２種類のポリエステルウレタン樹脂Ａ、Ｂを調製した。[Preparation of polyester urethane resin]
Using terephthalic acid as the dicarboxylic acid, propylene glycol as the diol, and 4,4′-diphenylmethane diisocyanate as the isocyanate, the molar ratio of terephthalic acid / propylene glycol / 4,4′-diphenylmethane diisocyanate is 1.0 / 1.3 / 0. Two types of polyester urethane resins A and B to be 25 and 1.0 / 2.0 / 0.25 were prepared.

上記ポリエステルウレタン樹脂をメチルエチルケトンに２０質量％となるように溶解した。上記ポリエステルウレタン樹脂のメチルエチルケトン溶液を用いて、片面を表面処理（シリコーン処理）した厚さ８０μｍのＰＥＴフィルムに塗工装置を用いて塗布した。更に、７０℃、１０分の熱風乾燥により、厚さが３５μｍのフィルムを作製した。広域動的粘弾性測定装置（Ｒｈｅｏｍｅｔｒｉｃ Ｓｃｉｅｎｔｉｆｉｃ社製、商品名：ＲＳＡＩＩ）を用いて引っ張り荷重５ｇ、周波数１０Ｈｚにて弾性率の温度依存性を測定した。測定結果から得られたポリエステルウレタン樹脂のガラス転移温度は１０５℃であった。   The said polyester urethane resin was melt | dissolved in methyl ethyl ketone so that it might become 20 mass%. Using a methyl ethyl ketone solution of the above-mentioned polyester urethane resin, it was applied to a PET film having a thickness of 80 [mu] m on one surface (silicone treatment) using a coating apparatus. Furthermore, a film having a thickness of 35 μm was produced by hot air drying at 70 ° C. for 10 minutes. The temperature dependence of the elastic modulus was measured at a tensile load of 5 g and a frequency of 10 Hz using a wide area dynamic viscoelasticity measuring device (trade name: RSAII, manufactured by Rheometric Scientific). The glass transition temperature of the polyester urethane resin obtained from the measurement results was 105 ° C.

ラジカル重合性物質としての上記ウレタンアクリレート２５質量部、イソシアヌレート型アクリレート（製品名：Ｍ−３２５、東亞合成社製）２０質量部、２−メタクリロイロキシエチルアッシドホスフェート（製品名：Ｐ−２Ｍ、共栄社化学社製）１質量部、及び遊離ラジカル発生剤としてのベンゾイルパーオキサイド（製品名：ナイパーＢＭＴ−Ｋ４０、日本油脂製）４質量部を、フィルム形成性高分子としての上記ポリエステルウレタン樹脂Ａの２０％メチルエチルケトン溶液５５質量部に混合し、攪拌しバインダ樹脂とした。   25 parts by mass of the urethane acrylate as a radical polymerizable substance, 20 parts by mass of isocyanurate type acrylate (product name: M-325, manufactured by Toagosei Co., Ltd.), 2-methacryloyloxyethyl acid phosphate (product name: P-2M) , Manufactured by Kyoeisha Chemical Co., Ltd.) 1 part by mass, and 4 parts by mass of benzoyl peroxide (product name: Nyper BMT-K40, manufactured by NOF Corporation) as a free radical generator, the polyester urethane resin A as a film-forming polymer Was mixed with 55 parts by mass of a 20% methyl ethyl ketone solution and stirred to obtain a binder resin.

更に、ポリスチレンを核体とするＮｉを含む最外層に覆われ、かつ最外層の表面に突起を有する導電粒子（平均粒径：４μｍ、以下、場合により「Ｎｉ被覆粒子」と表記する。）をバインダ樹脂に対して３体積％配合分散させた。そして、混合液を片面を表面処理（シリコーン処理）した厚さ５０μｍのＰＥＴフィルムの表面処理が施されていない側に塗工装置を用いて塗布し、７０℃、１０分の熱風乾燥により、厚さが４μｍの異方導電接着剤層Ａ（幅１５ｃｍ、長さ７０ｍ）を得た。   Furthermore, conductive particles (average particle diameter: 4 μm, hereinafter sometimes referred to as “Ni-coated particles”) covered with an outermost layer containing Ni whose core is polystyrene and having protrusions on the surface of the outermost layer. 3% by volume was mixed and dispersed in the binder resin. Then, the mixed solution was applied using a coating apparatus to the surface of the PET film having a thickness of 50 μm that had been subjected to surface treatment (silicone treatment) on one side, and dried by hot air at 70 ° C. for 10 minutes. An anisotropic conductive adhesive layer A (width 15 cm, length 70 m) having a thickness of 4 μm was obtained.

ラジカル重合性物質としての上記ウレタンアクリレート２５質量部、イソシアヌレート型アクリレート（製品名：Ｍ−３２５、東亞合成社製）２０質量部、２−メタクリロイロキシエチルアッシドホスフェート（製品名：Ｐ−２Ｍ、共栄社化学社製）１質量部、及び遊離ラジカル発生剤としてのベンゾイルパーオキサイド（製品名：ナイパーＢＭＴ−Ｋ４０、日本油脂製）４質量部を、フィルム形成性高分子としての上記ポリエステルウレタン樹脂Ｂの２０％メチルエチルケトン溶液５５質量部に混合し、攪拌しバインダ樹脂とした。次いで、前記バインダ樹脂を片面を表面処理（シリコーン処理）した厚さ５０μｍのＰＥＴフィルムの表面処理が施されていない側に塗工装置を用いて塗布し、７０℃、１０分の熱風乾燥により、厚さが１０μｍの接着剤層Ｂ（幅１５ｃｍ、長さ７０ｍ）を得た。   25 parts by mass of the urethane acrylate as a radical polymerizable substance, 20 parts by mass of isocyanurate type acrylate (product name: M-325, manufactured by Toagosei Co., Ltd.), 2-methacryloyloxyethyl acid phosphate (product name: P-2M) , Manufactured by Kyoeisha Chemical Co., Ltd.) 1 part by mass, and 4 parts by mass of benzoyl peroxide (product name: Nyper BMT-K40, manufactured by NOF Corporation) as a free radical generator, the polyester urethane resin B as a film-forming polymer Was mixed with 55 parts by mass of a 20% methyl ethyl ketone solution and stirred to obtain a binder resin. Next, the binder resin was applied using a coating apparatus to the surface of the PET film having a thickness of 50 μm that was surface-treated on one side (silicone treatment), and dried with hot air at 70 ° C. for 10 minutes. An adhesive layer B (width 15 cm, length 70 m) having a thickness of 10 μm was obtained.

得られた接着剤層Ａ、Ｂを接着剤が向き合う方向に重ね合わせ、ラミネーター（Ｄｕｐｏｎｔ社製ＲＩＳＴＯＮ、モデル；ＨＲＬ、ロール圧力はバネ加重のみ、ロール温度４０℃、速度５０ｃｍ／分）を用いてラミネートした後に、異方導電接着剤層Ａ側のＰＥＴを剥離し、厚み１４μｍの異方導電接着剤（幅１５ｃｍ、長さ６０ｍ）を得た。得られた異方導電接着剤を１．５ｍｍ幅に裁断し、内径４０ｍｍ、外径４８ｍｍのプラスチック製リールの側面（厚み１．７ｍｍ）に接着フィルム面を内側にして５０ｍ巻きつけ、テープ状の回路接続用接着フィルムを得た。   The obtained adhesive layers A and B are overlapped in the direction in which the adhesive faces each other, and a laminator (Dupont RISTON, model: HRL, roll pressure is spring load only, roll temperature 40 ° C., speed 50 cm / min) is used. After laminating, the anisotropic conductive adhesive layer A side PET was peeled off to obtain an anisotropic conductive adhesive having a thickness of 14 μm (width 15 cm, length 60 m). The obtained anisotropic conductive adhesive was cut into a width of 1.5 mm, and wound on a side surface (thickness 1.7 mm) of a plastic reel having an inner diameter of 40 mm and an outer diameter of 48 mm with the adhesive film surface facing inward for 50 m. An adhesive film for circuit connection was obtained.

（実施例２〜４）
導電粒子のＫ値及び粒子径を表１〜２に示すように変化させた以外は、実施例１と同様にして、回路接続用接着フィルムを作製した。(Examples 2 to 4)
An adhesive film for circuit connection was produced in the same manner as in Example 1 except that the K value and the particle diameter of the conductive particles were changed as shown in Tables 1 and 2.

（実施例５〜６）
各接着剤層Ａ、Ｂの厚みを表２に示すように変化させた以外は、実施例４と同様にして、回路接続用接着フィルムを作製した。(Examples 5-6)
An adhesive film for circuit connection was produced in the same manner as in Example 4 except that the thicknesses of the adhesive layers A and B were changed as shown in Table 2.

（比較例１〜３）
導電粒子のＫ値、最外層の金属、及び粒子径を表３に示すように変化させた以外は、実施例１と同様にして、回路接続用接着フィルムを作製した。(Comparative Examples 1-3)
An adhesive film for circuit connection was produced in the same manner as in Example 1 except that the K value of the conductive particles, the outermost layer metal, and the particle diameter were changed as shown in Table 3.

（比較例４）
各接着剤層Ａの厚みを表４に示すように変化させ接着剤の構成を単層にした以外は、実施例１と同様にして、回路接続用接着フィルムを作製した。(Comparative Example 4)
An adhesive film for circuit connection was produced in the same manner as in Example 1 except that the thickness of each adhesive layer A was changed as shown in Table 4 to make the adhesive composition a single layer.

（比較例５）
各接着剤層Ａ、Ｂの厚みを表４に示すように変化させた以外は、実施例１と同様にして、回路接続用接着フィルムを作製した。(Comparative Example 5)
An adhesive film for circuit connection was produced in the same manner as in Example 1 except that the thicknesses of the adhesive layers A and B were changed as shown in Table 4.

Figure 0004752986
Figure 0004752986

Figure 0004752986
Figure 0004752986

Figure 0004752986
Figure 0004752986

Figure 0004752986
Figure 0004752986

（回路の接続）
実施例、比較例で得られた回路接続用接着フィルム（幅１．５ｍｍ、長さ３ｃｍ）の接着剤面を、７０℃、１ＭＰａで２秒間加熱加圧して厚さ０．７ｍｍのＣｒ／インジウム−亜鉛酸化物（ＩＺＯ）コートガラス基板上に転写し、ＰＥＴフィルムを剥離した。次いで、ピッチ４０μｍ、厚さ８μｍのすずめっき銅回路を５００本有するフレキシブル回路板（ＦＰＣ）を、転写した接着剤上に置き、２４℃、０．５ＭＰａで１秒間加圧して仮固定した。このＦＰＣが回路接続フィルムによって仮固定されたガラス基板を本圧着装置に設置し、１５０μｍ厚さのテフロン（登録商標）シートをクッション材とし、ＦＰＣ側から、ヒートツールによって１８０℃、３ＭＰａで６秒間加熱加圧して幅１．５ｍｍにわたり接続し、接続体を得た。(Circuit connection)
The adhesive surface of the adhesive film for circuit connection (width 1.5 mm, length 3 cm) obtained in the examples and comparative examples was heated and pressed at 70 ° C. and 1 MPa for 2 seconds to provide a 0.7 mm thick Cr / indium. -Transferred onto a zinc oxide (IZO) coated glass substrate and peeled off the PET film. Next, a flexible circuit board (FPC) having 500 tin-plated copper circuits with a pitch of 40 μm and a thickness of 8 μm was placed on the transferred adhesive and temporarily fixed by pressing at 24 ° C. and 0.5 MPa for 1 second. A glass substrate on which this FPC is temporarily fixed by a circuit connection film is placed in a main pressure bonding apparatus, and a Teflon (registered trademark) sheet having a thickness of 150 μm is used as a cushion material. From the FPC side, a heat tool is used at 180 ° C. and 3 MPa for 6 seconds. Heat and pressure were applied over a width of 1.5 mm to obtain a connection body.

（接続抵抗の測定）
上記接続体について、４端子法によりそれぞれの電極における抵抗値をデジタルマルチメータ（装置名：ＴＲ６８４５、アドバンテスト社製）で測定し、１０本の電極の平均値を求めた。得られた結果を表５、６に示す。(Measurement of connection resistance)
About the said connection body, the resistance value in each electrode was measured with the digital multimeter (device name: TR6845, product made from an Advantest company) by 4 terminal method, and the average value of 10 electrodes was calculated | required. The results obtained are shown in Tables 5 and 6.

（Ｉ−Ｖ特性の評価）
上記接続体について、４端子法により電流値を５０ｍＡ／１０秒の間隔で増加させながら電圧の変化を記録し、オーミック性から外れた時の電流値を測定した。その結果を表５、６に示す。(Evaluation of IV characteristics)
With respect to the connection body, a change in voltage was recorded while increasing the current value at an interval of 50 mA / 10 seconds by the four-terminal method, and the current value when deviating from ohmic properties was measured. The results are shown in Tables 5 and 6.

（導電粒子捕捉率の評価）
上記接続体について、オリンパス（株）製ＢＨ３−ＭＪＬ液晶パネル検査用顕微鏡を用い、ガラス基板側からノマルスキー微分干渉観察により１電極当たりの圧痕の数を２０電極分測定し平均値を算出した。一方、接着剤中の単位面積当たりの導電粒子個数は、オリンパス（株）製ＢＨ３−ＭＪＬ液晶パネル検査用顕微鏡にて計測した。得られた結果から、次式を用いて導電粒子捕捉率を算出した。得られた値を表５、６に示す。
導電粒子捕捉率＝（電極上導電粒子数［個］）×１００／｛（接着剤中単位面積当たり導電粒子数［個／ｍｍ２］）×（電極１本当たりの接続面積［ｍｍ２］）｝(Evaluation of conductive particle capture rate)
Using the Olympus BH3-MJL liquid crystal panel inspection microscope, the number of indentations per electrode was measured for 20 electrodes by Nomarski differential interference observation from the glass substrate side, and the average value was calculated. On the other hand, the number of conductive particles per unit area in the adhesive was measured with a BH3-MJL liquid crystal panel inspection microscope manufactured by Olympus Corporation. From the obtained results, the conductive particle capture rate was calculated using the following formula. The obtained values are shown in Tables 5 and 6.
Conductive particle capture rate = (number of conductive particles on electrode [number]) × 100 / {(number of conductive particles per unit area in adhesive [number / mm 2 ]) × (connection area [mm 2 ] per electrode) }

Figure 0004752986
Figure 0004752986

Figure 0004752986
Figure 0004752986

１，６１…回路接続用接着フィルム、１０，６０…回路接続部材、３ａ，３ｂ…接着剤成分、４ａ，４ｂ…硬化体、５，５ａ，５ｂ，５ｃ…導電粒子、１１…異方導電層、１２…絶縁層、１４…突起部、２１…核体、２１ａ…中核部、２１ｂ…突起部、２２…金属層（最外層）、３０，４０…回路部材、３１，４１，７５…回路基板、３２，４２，７２，７６…回路電極、７０，１００…回路接続構造体、７２…回路電極、７３…パネル、７４…液晶表示部。   DESCRIPTION OF SYMBOLS 1,61 ... Adhesive film for circuit connection 10, 60 ... Circuit connection member, 3a, 3b ... Adhesive component, 4a, 4b ... Hardened body, 5, 5a, 5b, 5c ... Conductive particle, 11 ... Anisotropic conductive layer , 12 ... Insulating layer, 14 ... Projection, 21 ... Core, 21a ... Core, 21b ... Projection, 22 ... Metal layer (outermost layer), 30, 40 ... Circuit member, 31, 41, 75 ... Circuit board 32, 42, 72, 76 ... circuit electrodes, 70, 100 ... circuit connection structures, 72 ... circuit electrodes, 73 ... panels, 74 ... liquid crystal display units.

Claims (6)

対向する回路基板間に介在して回路を電気的に接続するための回路接続用接着フィルムであって、
前記回路接続用接着フィルムは少なくとも接着剤層Ａ及び接着剤層Ｂを有し、
前記接着剤層Ａは、加熱又は光により遊離ラジカルを発生する硬化剤、ラジカル重合性物質、フィルム形成性高分子、及び、ビッカース硬度が３００Ｈｖ以上の金属で最外層が覆われた導電粒子を含有する異方導電層であり、
前記接着剤層Ｂは、加熱又は光により遊離ラジカルを発生する硬化剤、ラジカル重合性物質、及びフィルム形成性高分子を含有する絶縁層であり、
前記接着剤層Ａの厚みは、該接着剤層Ａに含有される導電粒子の平均粒径の０．３〜１．５倍であり、かつ
前記回路基板のうち、少なくとも一方の回路ピッチが４０μｍ以下であることを特徴とする回路接続用接着フィルム。An adhesive film for circuit connection for electrically connecting a circuit interposed between opposing circuit boards,
The adhesive film for circuit connection has at least an adhesive layer A and an adhesive layer B,
The adhesive layer A includes a curing agent that generates free radicals by heating or light, a radical polymerizable substance, a film-forming polymer, and conductive particles whose outermost layer is covered with a metal having a Vickers hardness of 300 Hv or more. An anisotropic conductive layer
The adhesive layer B is an insulating layer containing a curing agent that generates free radicals by heating or light, a radical polymerizable substance, and a film-forming polymer.
The thickness of the adhesive layer A is 0.3 to 1.5 times the average particle size of the conductive particles contained in the adhesive layer A, and at least one circuit pitch of the circuit boards is 40 μm. The adhesive film for circuit connection characterized by the following. 対向する回路基板間に介在して回路を電気的に接続するための回路接続用接着フィルムであって、
前記回路接続用接着フィルムは少なくとも接着剤層Ａ及び接着剤層Ｂを有し、
前記接着剤層Ａは、加熱又は光により遊離ラジカルを発生する硬化剤、ラジカル重合性物質、フィルム形成性高分子、並びに、Ｎｉ、Ｎｉ合金及びＮｉ酸化物からなる群より選ばれる少なくとも１種を含む金属で最外層が覆われた導電粒子を含有する異方導電層であり、
前記接着剤層Ｂは、加熱又は光により遊離ラジカルを発生する硬化剤、ラジカル重合性物質、及びフィルム形成性高分子を含有する絶縁層であり、
前記接着剤層Ａの厚みは、該接着剤層Ａに含有される導電粒子の平均粒径の０．３〜１．５倍であり、かつ
前記回路基板のうち、少なくとも一方の回路ピッチが４０μｍ以下であることを特徴とする回路接続用接着フィルム。An adhesive film for circuit connection for electrically connecting a circuit interposed between opposing circuit boards,
The adhesive film for circuit connection has at least an adhesive layer A and an adhesive layer B,
The adhesive layer A includes at least one selected from the group consisting of a curing agent that generates free radicals by heating or light, a radical polymerizable substance, a film-forming polymer, and Ni, a Ni alloy, and a Ni oxide. An anisotropic conductive layer containing conductive particles whose outermost layer is covered with a metal containing,
The adhesive layer B is an insulating layer containing a curing agent that generates free radicals by heating or light, a radical polymerizable substance, and a film-forming polymer.
The thickness of the adhesive layer A is 0.3 to 1.5 times the average particle size of the conductive particles contained in the adhesive layer A, and at least one circuit pitch of the circuit boards is 40 μm. The adhesive film for circuit connection characterized by the following. 前記回路ピッチが４０μｍ以下である回路基板がフレキシブル基板である、請求項１又は２記載の回路接続用接着フィルム。  The adhesive film for circuit connection according to claim 1 or 2, wherein the circuit substrate having a circuit pitch of 40 µm or less is a flexible substrate. 前記回路ピッチが４０μｍ以下である回路基板とは別の回路基板の回路表面にインジウム−亜鉛酸化物又はインジウム−錫酸化物からなる薄膜が形成されている、請求項１〜３のいずれか一項に記載の回路接続用接着フィルム。  The thin film which consists of indium-zinc oxide or indium-tin oxide is formed in the circuit surface of the circuit board different from the circuit board whose said circuit pitch is 40 micrometers or less. The adhesive film for circuit connection as described in 2. 導電粒子の平均粒径が１．５〜５．０μｍである、請求項１〜４のいずれか一項に記載の回路接続用接着フィルム。  The adhesive film for circuit connection as described in any one of Claims 1-4 whose average particle diameter of electroconductive particle is 1.5-5.0 micrometers. 回路ピッチが４０μｍ以下である第一の回路を有する第一の回路基板と、第二の回路を有する第二の回路基板とを、前記第一の回路と前記第二の回路とが対向するように配置し、対向配置した前記第一の回路と前記第二の回路とが対向するように配置し、対向配置した前記第一の回路と前記第二の回路との間に、請求項１〜５のいずれか一項に記載の回路接続用接着フィルムを介在させ、加熱加圧することにより、対向配置した前記第一の回路と前記第二の回路とを電気的に接続させてなる、回路接続構造体。  A first circuit board having a first circuit having a circuit pitch of 40 μm or less and a second circuit board having a second circuit are arranged such that the first circuit and the second circuit face each other. Between the first circuit and the second circuit arranged opposite to each other, the first circuit arranged opposite to the second circuit and the second circuit arranged opposite to each other. Circuit connection formed by interposing the adhesive film for circuit connection according to any one of 5 and electrically connecting the first circuit and the second circuit arranged to face each other by heating and pressing. Structure.
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