JP4741616B2 - フォトレジスト積層基板の形成方法 - Google Patents
フォトレジスト積層基板の形成方法 Download PDFInfo
- Publication number
- JP4741616B2 JP4741616B2 JP2008055050A JP2008055050A JP4741616B2 JP 4741616 B2 JP4741616 B2 JP 4741616B2 JP 2008055050 A JP2008055050 A JP 2008055050A JP 2008055050 A JP2008055050 A JP 2008055050A JP 4741616 B2 JP4741616 B2 JP 4741616B2
- Authority
- JP
- Japan
- Prior art keywords
- metal
- aerosol
- metal nanoparticles
- layer
- forming
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 238000000034 method Methods 0.000 title claims description 69
- 239000000758 substrate Substances 0.000 title claims description 48
- 229920002120 photoresistant polymer Polymers 0.000 title claims description 26
- 239000002082 metal nanoparticle Substances 0.000 claims description 60
- 229910052751 metal Inorganic materials 0.000 claims description 58
- 239000002184 metal Substances 0.000 claims description 58
- 239000000443 aerosol Substances 0.000 claims description 36
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 15
- 229910052802 copper Inorganic materials 0.000 claims description 15
- 239000010949 copper Substances 0.000 claims description 15
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims description 12
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 claims description 10
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 claims description 10
- 238000010030 laminating Methods 0.000 claims description 7
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims description 6
- 229910052737 gold Inorganic materials 0.000 claims description 6
- 239000010931 gold Substances 0.000 claims description 6
- 229910052759 nickel Inorganic materials 0.000 claims description 6
- 239000007921 spray Substances 0.000 claims description 6
- 229910052715 tantalum Inorganic materials 0.000 claims description 6
- GUVRBAGPIYLISA-UHFFFAOYSA-N tantalum atom Chemical compound [Ta] GUVRBAGPIYLISA-UHFFFAOYSA-N 0.000 claims description 6
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims description 5
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims description 5
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 claims description 5
- 229910045601 alloy Inorganic materials 0.000 claims description 5
- 239000000956 alloy Substances 0.000 claims description 5
- 229910052782 aluminium Inorganic materials 0.000 claims description 5
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 5
- 239000002923 metal particle Substances 0.000 claims description 5
- 229910052763 palladium Inorganic materials 0.000 claims description 5
- 229910052697 platinum Inorganic materials 0.000 claims description 5
- 229910052709 silver Inorganic materials 0.000 claims description 5
- 239000004332 silver Substances 0.000 claims description 5
- 229910052718 tin Inorganic materials 0.000 claims description 5
- 239000011135 tin Substances 0.000 claims description 5
- 239000010936 titanium Substances 0.000 claims description 5
- 229910052719 titanium Inorganic materials 0.000 claims description 5
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 claims description 5
- 229910052721 tungsten Inorganic materials 0.000 claims description 5
- 239000010937 tungsten Substances 0.000 claims description 5
- 230000005684 electric field Effects 0.000 claims description 3
- 238000003475 lamination Methods 0.000 claims description 2
- 238000004519 manufacturing process Methods 0.000 description 14
- 238000007747 plating Methods 0.000 description 14
- 238000005530 etching Methods 0.000 description 10
- 239000003985 ceramic capacitor Substances 0.000 description 9
- 238000009713 electroplating Methods 0.000 description 8
- 238000000576 coating method Methods 0.000 description 6
- 238000007772 electroless plating Methods 0.000 description 6
- 239000000853 adhesive Substances 0.000 description 5
- 230000001070 adhesive effect Effects 0.000 description 5
- 239000011248 coating agent Substances 0.000 description 5
- 238000004381 surface treatment Methods 0.000 description 5
- 230000015572 biosynthetic process Effects 0.000 description 4
- 238000007796 conventional method Methods 0.000 description 4
- 239000002105 nanoparticle Substances 0.000 description 4
- 238000010586 diagram Methods 0.000 description 3
- 239000000126 substance Substances 0.000 description 3
- 230000003746 surface roughness Effects 0.000 description 3
- 230000007797 corrosion Effects 0.000 description 2
- 238000005260 corrosion Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 239000002245 particle Substances 0.000 description 2
- 239000011347 resin Substances 0.000 description 2
- 229920005989 resin Polymers 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 238000005507 spraying Methods 0.000 description 2
- 229910000881 Cu alloy Inorganic materials 0.000 description 1
- 230000000274 adsorptive effect Effects 0.000 description 1
- 229910010293 ceramic material Inorganic materials 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000009792 diffusion process Methods 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 239000010419 fine particle Substances 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 230000007774 longterm Effects 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000000615 nonconductor Substances 0.000 description 1
- 239000005416 organic matter Substances 0.000 description 1
- 239000002861 polymer material Substances 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
- H05K3/382—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/102—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by bonding of conductive powder, i.e. metallic powder
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/108—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by semi-additive methods; masks therefor
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0306—Inorganic insulating substrates, e.g. ceramic, glass
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
- H05K2201/0203—Fillers and particles
- H05K2201/0242—Shape of an individual particle
- H05K2201/0257—Nanoparticles
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/10—Using electric, magnetic and electromagnetic fields; Using laser light
- H05K2203/105—Using an electrical field; Special methods of applying an electric potential
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/13—Moulding and encapsulation; Deposition techniques; Protective layers
- H05K2203/1333—Deposition techniques, e.g. coating
- H05K2203/1344—Spraying small metal particles or droplets of molten metal
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/14—Related to the order of processing steps
- H05K2203/1476—Same or similar kind of process performed in phases, e.g. coarse patterning followed by fine patterning
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
- H05K3/061—Etching masks
- H05K3/064—Photoresists
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
- Y10T156/10—Methods of surface bonding and/or assembly therefor
Description
Claims (4)
- 絶縁基板と金属層とを備えた積層基板を用意する段階と、
前記金属層上に、ホットサーマルスプレーまたはコールドサーマルスプレー方式を用いて金属ナノ粒子間のピッチが0.001〜20μmである金属ナノ粒子のエアロゾルを塗布する段階と、
前記エアロゾルが塗布された前記金属層上にフォトレジストフィルムを積層する段階と、
を含むことを特徴とするフォトレジスト積層基板の形成方法。 - 前記金属ナノ粒子の直径が0.001〜10μmであることを特徴とする、請求項1に記載のフォトレジスト積層基板の形成方法。
- 前記金属ナノ粒子が、銅、アルミニウム、ニッケル、錫、白金、パラジウム、銀、金、チタン、タンタル、タングステン及びこれらの合金からなる群より選ばれる少なくとも一つの金属粒子であることを特徴とする、請求項1または2に記載のフォトレジスト積層基板の形成方法。
- 前記エアロゾルを塗布する段階において、金属ナノ粒子を均一に塗布するために電場を印加することを特徴とする、請求項1、請求項2、請求項3のいずれか1項に記載のフォトレジスト積層基板の形成方法。
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020070022563A KR100834515B1 (ko) | 2007-03-07 | 2007-03-07 | 금속 나노입자 에어로졸을 이용한 포토레지스트 적층기판의형성방법, 절연기판의 도금방법, 회로기판의 금속층의표면처리방법 및 적층 세라믹 콘덴서의 제조방법 |
KR10-2007-0022563 | 2007-03-07 |
Related Child Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2010182261A Division JP2011014916A (ja) | 2007-03-07 | 2010-08-17 | 金属ナノ粒子のエアロゾルを用いたフォトレジスト積層基板の形成方法、絶縁基板のメッキ方法、回路基板の金属層の表面処理方法、及び積層セラミックコンデンサの製造方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2008219018A JP2008219018A (ja) | 2008-09-18 |
JP4741616B2 true JP4741616B2 (ja) | 2011-08-03 |
Family
ID=39742006
Family Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2008055050A Active JP4741616B2 (ja) | 2007-03-07 | 2008-03-05 | フォトレジスト積層基板の形成方法 |
JP2010182261A Pending JP2011014916A (ja) | 2007-03-07 | 2010-08-17 | 金属ナノ粒子のエアロゾルを用いたフォトレジスト積層基板の形成方法、絶縁基板のメッキ方法、回路基板の金属層の表面処理方法、及び積層セラミックコンデンサの製造方法 |
Family Applications After (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2010182261A Pending JP2011014916A (ja) | 2007-03-07 | 2010-08-17 | 金属ナノ粒子のエアロゾルを用いたフォトレジスト積層基板の形成方法、絶縁基板のメッキ方法、回路基板の金属層の表面処理方法、及び積層セラミックコンデンサの製造方法 |
Country Status (5)
Country | Link |
---|---|
US (1) | US8003173B2 (ja) |
JP (2) | JP4741616B2 (ja) |
KR (1) | KR100834515B1 (ja) |
CN (1) | CN101262743B (ja) |
TW (1) | TWI362234B (ja) |
Families Citing this family (15)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2010129934A (ja) * | 2008-11-30 | 2010-06-10 | Sintokogio Ltd | ガラス回路基板及びガラス回路基板の製造方法 |
KR101045307B1 (ko) * | 2009-08-07 | 2011-06-29 | 주식회사 유앤비오피씨 | 메탈코어 인쇄회로기판의 제조방법 |
JP2011097038A (ja) * | 2009-10-02 | 2011-05-12 | Ibiden Co Ltd | セラミック配線基板およびその製造方法 |
WO2012075006A2 (en) * | 2010-11-29 | 2012-06-07 | Northeastern University | High rate electric field driven nanoelement assembly on an insulated surface |
KR101259352B1 (ko) | 2011-06-24 | 2013-04-30 | 한국과학기술원 | 레이저를 이용한 선택적 금속패턴 형성방법 |
KR101378168B1 (ko) * | 2012-07-13 | 2014-03-24 | 재단법인 멀티스케일 에너지시스템 연구단 | 나노입자를 포함하는 전자소자의 제조방법 |
DE102012023212B3 (de) * | 2012-11-28 | 2014-01-30 | Wieland-Werke Ag | Elektrisch leitendes Bauteil mit verbesserter Haftung und Verfahren zu seiner Herstellung, sowie zur Herstellung eines Werkstoffverbunds |
DE102012023210A1 (de) * | 2012-11-28 | 2014-05-28 | Wieland-Werke Ag | Kupferband zur Herstellung von Leiterplatten |
WO2015014379A1 (en) * | 2013-08-02 | 2015-02-05 | Universität Duisburg-Essen | Electrical capacitor comprising nanoparticles of a semiconductive material |
US9633971B2 (en) | 2015-07-10 | 2017-04-25 | Invensas Corporation | Structures and methods for low temperature bonding using nanoparticles |
US10886250B2 (en) | 2015-07-10 | 2021-01-05 | Invensas Corporation | Structures and methods for low temperature bonding using nanoparticles |
DE102016001810A1 (de) * | 2016-02-17 | 2017-08-17 | Häusermann GmbH | Verfahren zur Herstellung einer Leiterplatte mit verstärkter Kupferstruktur |
TWI822659B (zh) | 2016-10-27 | 2023-11-21 | 美商艾德亞半導體科技有限責任公司 | 用於低溫接合的結構和方法 |
US11856877B2 (en) | 2019-12-23 | 2023-12-26 | The University Of Canterbury | Electrical contacts for nanoparticle networks |
KR20240055081A (ko) * | 2021-10-06 | 2024-04-26 | 소에이 가가쿠 고교 가부시키가이샤 | 잉크, 잉크의 제조 방법 및 적층 세라믹 콘덴서의 제조 방법 |
Citations (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH06252289A (ja) * | 1992-12-28 | 1994-09-09 | Toshiba Corp | 半導体装置の製造方法及び薄膜形成装置 |
JPH08111474A (ja) * | 1994-10-07 | 1996-04-30 | Toshiba Corp | 配線層の形成方法 |
JPH09148714A (ja) * | 1995-11-24 | 1997-06-06 | Matsushita Electric Works Ltd | 立体成形回路基板の製造方法 |
JP2000261144A (ja) * | 1999-03-05 | 2000-09-22 | Dainippon Printing Co Ltd | 多層プリント配線板およびその製造方法 |
JP2004200557A (ja) * | 2002-12-20 | 2004-07-15 | Nippon Foil Mfg Co Ltd | 積層配線用金属板材 |
JP2004342831A (ja) * | 2003-05-15 | 2004-12-02 | Fujitsu Ltd | 回路基板、電子装置、及び回路基板の製造方法 |
JP2006049923A (ja) * | 2001-04-03 | 2006-02-16 | National Institute Of Advanced Industrial & Technology | 回路基板とその作製方法 |
JP2006210896A (ja) * | 2004-12-27 | 2006-08-10 | Fuji Photo Film Co Ltd | 成膜方法、それを用いて製造された構造物及び圧電素子、並びに、液体吐出ヘッドの製造方法 |
Family Cites Families (17)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4424408A (en) * | 1979-11-21 | 1984-01-03 | Elarde Vito D | High temperature circuit board |
DE69016433T2 (de) * | 1990-05-19 | 1995-07-20 | Papyrin Anatolij Nikiforovic | Beschichtungsverfahren und -vorrichtung. |
JP3352140B2 (ja) * | 1993-03-31 | 2002-12-03 | オリンパス光学工業株式会社 | 誘電体積層部品とその製造方法 |
JP2885113B2 (ja) * | 1995-01-30 | 1999-04-19 | 日本電気株式会社 | 印刷配線板およびその製造方法 |
CA2237588A1 (en) * | 1995-11-13 | 1997-05-22 | The University Of Connecticut | Nanostructured feeds for thermal spray |
US5964395A (en) * | 1997-06-09 | 1999-10-12 | Ford Motor Company | Predeposited transient phase electronic interconnect media |
US6640434B1 (en) * | 2000-04-11 | 2003-11-04 | Lear Corporation | Method of forming an electrical circuit on a substrate |
TW558823B (en) * | 2002-04-10 | 2003-10-21 | Via Tech Inc | Through-hole process of integrated circuit substrate |
JP4045542B2 (ja) * | 2002-11-13 | 2008-02-13 | セイコーエプソン株式会社 | パターン形成方法および装置並びにその方法により製造した電子デバイスおよび実装基板 |
KR101018944B1 (ko) * | 2003-03-04 | 2011-03-02 | 니폰 제온 가부시키가이샤 | 다층 프린트 배선판의 제조방법 및 다층 프린트 배선판 |
US7390561B2 (en) * | 2003-10-02 | 2008-06-24 | Praxair S. T. Technology, Inc. | Method for making a metal surface infused composite and the composite thereof |
JP2005183904A (ja) * | 2003-12-22 | 2005-07-07 | Rohm & Haas Electronic Materials Llc | 電子部品にはんだ領域を形成する方法及びはんだ領域を有する電子部品 |
US20050227049A1 (en) | 2004-03-22 | 2005-10-13 | Boyack James R | Process for fabrication of printed circuit boards |
JP4849432B2 (ja) * | 2004-03-30 | 2012-01-11 | ブラザー工業株式会社 | 圧電膜の製造方法、基板と圧電膜との積層構造、圧電アクチュエータおよびその製造方法 |
KR100682942B1 (ko) * | 2005-03-22 | 2007-02-15 | 삼성전자주식회사 | 금속 전구체 화합물을 포함하는 촉매 레지스트 및 이를이용한 촉매 입자들의 패터닝 방법 |
JP5203575B2 (ja) * | 2005-05-04 | 2013-06-05 | ローム・アンド・ハース・エレクトロニック・マテリアルズ,エル.エル.シー. | コーティング組成物 |
JP4595665B2 (ja) * | 2005-05-13 | 2010-12-08 | 富士電機システムズ株式会社 | 配線基板の製造方法 |
-
2007
- 2007-03-07 KR KR1020070022563A patent/KR100834515B1/ko active IP Right Grant
-
2008
- 2008-01-04 US US12/003,991 patent/US8003173B2/en active Active
- 2008-01-11 TW TW097101254A patent/TWI362234B/zh active
- 2008-03-05 JP JP2008055050A patent/JP4741616B2/ja active Active
- 2008-03-06 CN CN2008100065443A patent/CN101262743B/zh not_active Expired - Fee Related
-
2010
- 2010-08-17 JP JP2010182261A patent/JP2011014916A/ja active Pending
Patent Citations (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH06252289A (ja) * | 1992-12-28 | 1994-09-09 | Toshiba Corp | 半導体装置の製造方法及び薄膜形成装置 |
JPH08111474A (ja) * | 1994-10-07 | 1996-04-30 | Toshiba Corp | 配線層の形成方法 |
JPH09148714A (ja) * | 1995-11-24 | 1997-06-06 | Matsushita Electric Works Ltd | 立体成形回路基板の製造方法 |
JP2000261144A (ja) * | 1999-03-05 | 2000-09-22 | Dainippon Printing Co Ltd | 多層プリント配線板およびその製造方法 |
JP2006049923A (ja) * | 2001-04-03 | 2006-02-16 | National Institute Of Advanced Industrial & Technology | 回路基板とその作製方法 |
JP2004200557A (ja) * | 2002-12-20 | 2004-07-15 | Nippon Foil Mfg Co Ltd | 積層配線用金属板材 |
JP2004342831A (ja) * | 2003-05-15 | 2004-12-02 | Fujitsu Ltd | 回路基板、電子装置、及び回路基板の製造方法 |
JP2006210896A (ja) * | 2004-12-27 | 2006-08-10 | Fuji Photo Film Co Ltd | 成膜方法、それを用いて製造された構造物及び圧電素子、並びに、液体吐出ヘッドの製造方法 |
Also Published As
Publication number | Publication date |
---|---|
US8003173B2 (en) | 2011-08-23 |
CN101262743B (zh) | 2010-07-14 |
JP2011014916A (ja) | 2011-01-20 |
CN101262743A (zh) | 2008-09-10 |
US20080220373A1 (en) | 2008-09-11 |
KR100834515B1 (ko) | 2008-06-02 |
TW200843569A (en) | 2008-11-01 |
TWI362234B (en) | 2012-04-11 |
JP2008219018A (ja) | 2008-09-18 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JP4741616B2 (ja) | フォトレジスト積層基板の形成方法 | |
TWI331889B (ja) | ||
US20070101571A1 (en) | Printed wiring board, its manufacturing method and circuit device | |
KR100427794B1 (ko) | 다층 배선 기판의 제조 방법 | |
JP2006147970A (ja) | 多層配線基板およびその製造方法 | |
JP4708407B2 (ja) | キャパシタ内蔵型印刷回路基板及びその製造方法 | |
CN103404243B (zh) | 印刷电路板及其制造方法 | |
KR100874172B1 (ko) | 연성인쇄회로기판의 제조방법 및 이를 이용하여 형성된연성 인쇄회로기판의 금속 배선패턴 | |
TW200841786A (en) | Printed circuit board and method for manufacturing the same | |
JP6406598B2 (ja) | プリント配線板及びその製造方法 | |
WO2018211733A1 (ja) | プリント配線板及びその製造方法 | |
JP5133406B2 (ja) | 高密度相互接続(hdi)基材材料上の誘電コーティングを貫く固体ブラインドビアを形成する方法 | |
KR101095380B1 (ko) | 미세 피치의 인쇄회로기판 제조 방법 | |
WO1995031886A1 (fr) | Plaquette a circuit imprime multicouche et sa production, et plaque de transfert et sa production | |
JP6305472B2 (ja) | 金属連結構造及びその製造方法 | |
CN111837210B (zh) | 布线基板及其制造方法 | |
JP2007258714A (ja) | 高温工程に適した絶縁構造体及びその製造方法 | |
KR101272664B1 (ko) | 시드층 및 도금층을 포함하는 금속 패턴을 포함하는 다층 인쇄 회로 기판 및 이의 제조 방법 | |
JP2001196746A (ja) | プリント配線板およびプリント配線板の製造方法 | |
JP5493020B2 (ja) | 配線基板の製造方法及び半導体パッケージの製造方法 | |
JP4466169B2 (ja) | 半導体装置用基板の製造方法 | |
JP2005150349A (ja) | 積層型電子部品の製造方法 | |
KR100468195B1 (ko) | 다층 인쇄 회로 기판을 제조하는 방법 | |
JP2007235015A5 (ja) | ||
JP6231773B2 (ja) | 厚膜回路基板の製造方法 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20100608 |
|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20100817 |
|
A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20110104 |
|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20110310 |
|
TRDD | Decision of grant or rejection written | ||
A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 Effective date: 20110405 |
|
A61 | First payment of annual fees (during grant procedure) |
Free format text: JAPANESE INTERMEDIATE CODE: A61 Effective date: 20110506 |
|
R150 | Certificate of patent or registration of utility model |
Ref document number: 4741616 Country of ref document: JP Free format text: JAPANESE INTERMEDIATE CODE: R150 Free format text: JAPANESE INTERMEDIATE CODE: R150 |
|
FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20140513 Year of fee payment: 3 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |