JP4738828B2 - Diamond film coated member - Google Patents

Diamond film coated member Download PDF

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JP4738828B2
JP4738828B2 JP2005032738A JP2005032738A JP4738828B2 JP 4738828 B2 JP4738828 B2 JP 4738828B2 JP 2005032738 A JP2005032738 A JP 2005032738A JP 2005032738 A JP2005032738 A JP 2005032738A JP 4738828 B2 JP4738828 B2 JP 4738828B2
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diamond film
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undulation
tap
coated member
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JP2006218557A (en
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克夫 風早
貫治 水沼
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ALMT Corp
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Description

本発明は、Ａｌ−ＳｉＣ合金などの金属基複合材、Ａｌ−Ｓｉ合金、カーボン、ＦＲＰなどの難切削材を加工するための切削工具や、使用時に高い負荷のかかる耐磨耗部材などに関するものであり、加工時に作用する部位にダイヤモンド膜が被覆された部材に関する。   The present invention relates to a metal matrix composite material such as an Al-SiC alloy, a cutting tool for processing difficult-to-cut materials such as an Al-Si alloy, carbon, FRP, and a wear-resistant member that is heavily loaded during use. The present invention relates to a member in which a diamond film is coated on a site that acts during processing.

近年、難切削材の加工を行うために、超硬合金などの基材上にダイヤモンド膜を被覆したダイヤモンド膜被覆工具が用いられる。このようなダイヤモンド膜被覆工具で難切削材を加工すると、加工時の負荷や衝撃でダイヤモンド膜と基材との界面にそって亀裂が発生する。この亀裂の発生時期は加工条件や被削材の種類、ダイヤモンド膜の品質、基材の種類などにより差があり、発生した亀裂は加工を継続するに従い進展していく。特に、ダイヤモンド膜と基材との界面に生じた亀裂は、加工を継続すると引き裂かれるようにさらに拡がり、最終的にはダイヤモンド膜を剥離させてしまう。そしてこのようにダイヤモンド膜が剥離すると、工具の摩耗や損傷速度が極端に早まり、加工精度の悪化や工具の折損などを招くことになる。   In recent years, in order to process difficult-to-cut materials, diamond film-coated tools in which a diamond film is coated on a base material such as cemented carbide are used. When a difficult-to-cut material is processed with such a diamond film-coated tool, cracks occur along the interface between the diamond film and the substrate due to the load and impact during processing. The generation time of the crack varies depending on the processing conditions, the type of work material, the quality of the diamond film, the type of the base material, etc., and the generated crack progresses as processing continues. In particular, cracks generated at the interface between the diamond film and the base material further spread so as to be torn when the processing is continued, and eventually the diamond film is peeled off. When the diamond film is peeled in this way, the wear and damage speed of the tool are extremely accelerated, and the processing accuracy is deteriorated and the tool is broken.

ダイヤモンド膜の剥離の防止策として、ダイヤモンド膜を被覆する前に基材表面を粗くして表面積を大きくすることにより、接着面積を増加させ、基材への膜密着力を向上させるということが一般的に行われており、このようにすることで膜の剥離はある程度防止される。   As a measure to prevent peeling of the diamond film, it is common to increase the adhesion area and improve the film adhesion to the substrate by roughening the surface of the substrate and increasing the surface area before coating the diamond film. In this way, peeling of the film is prevented to some extent.

基材に対するダイヤモンド膜の接着性を改良し、剥離を防止するものとして特許文献１に記載のものがある。特許文献１では、セラミック基基材の表面に表面粗さＲｚ２〜２０μｍの基凹凸面を有し、角部の表面粗さを角部以外の表面粗さの４０％以上とした基材や、さらに基凹凸面は、最表面を構成する結晶粒子の大きさ程度（０．５〜１０μｍ）の微小凹凸を基凹凸面に対し有して成る二重凹凸面構造を有する基材が記載され、この基材はダイヤモンド膜被覆用として適することが記載されている。そして、このような基材は表面にダイヤモンド膜などを形成した場合に、その膜が基材表面に強力に付着し剥離しにくいものとされている。
特開平７−９７６０３号公報 There exists a thing of patent document 1 as what improves the adhesiveness of the diamond film | membrane with respect to a base material, and prevents peeling. In Patent Document 1, a substrate having a surface roughness Rz2 to 20 μm on the surface of a ceramic base substrate, the surface roughness of the corners being 40% or more of the surface roughness other than the corners, Furthermore, the base uneven surface is described as a base material having a double uneven surface structure in which micro unevenness of the size of crystal grains constituting the outermost surface (0.5 to 10 μm) is provided on the base uneven surface, It is described that this substrate is suitable for coating a diamond film. And when such a base material forms a diamond film etc. on the surface, it is supposed that the film adheres strongly to the base material surface and is difficult to peel off.
JP-A-7-97603

特許文献１に記載の基材のように表面を二重凹凸面構造にすることで、ダイヤモンド膜を基材表面へ強固に付着させることができる。これにより、加工時の負荷や衝撃によるダイヤモンド膜と基材との界面に沿って生じる亀裂の発生は、ある程度抑制できる。しかしながら、特許文献１に記載された発明では、一度亀裂が発生すると亀裂が進展してしまい、ダイヤモンド膜を剥離させることになる。これは、特許文献１に記載された構造は、ダイヤモンド膜が基材に強力に付着することを目的としており、亀裂が発生した場合の対策はなされていないためであると思われる。特に、難切削材を加工する場合には、ダイヤモンド膜と基材との界面において亀裂は必ずと言って良いほど発生するため、特許文献１に記載の発明を適用した部材を用いても、ダイヤモンド膜の剥離は避けられないという問題が起こりうる。   The diamond film can be firmly attached to the surface of the base material by forming the surface with a double uneven surface structure like the base material described in Patent Document 1. Thereby, generation | occurrence | production of the crack which arises along the interface of the diamond film and a base material by the load at the time of a process or an impact can be suppressed to some extent. However, in the invention described in Patent Document 1, once a crack occurs, the crack progresses and the diamond film is peeled off. This is probably because the structure described in Patent Document 1 aims to strongly adhere the diamond film to the base material, and no countermeasure is taken when a crack occurs. In particular, when processing difficult-to-cut materials, cracks are inevitably generated at the interface between the diamond film and the base material. Therefore, even if a member to which the invention described in Patent Document 1 is applied is used, The problem that peeling of the film is inevitable can occur.

以上のことから、本発明はダイヤモンド膜と基材との界面に沿って生じる亀裂の進展を効果的に防止し、ダイヤモンド膜の剥離が発生した場合でもその領域を最小限に抑えることにより、難切削材に対しても長寿命を有する切削工具や高い負荷がかかっても長寿命を呈する部材などのダイヤモンド膜被覆部材を提供するものである。   From the above, the present invention effectively prevents the development of cracks that occur along the interface between the diamond film and the substrate, and minimizes the area even when the diamond film peels off. The present invention also provides a diamond film-coated member such as a cutting tool having a long life or a member having a long life even when a high load is applied to the cutting material.

本発明のダイヤモンド膜被覆部材の第１の特徴は、基材の表面の少なくとも被加工物に対して作用する部位にダイヤモンド膜を被覆したダイヤモンド膜被覆部材であって、前記ダイヤモンド膜が被覆された部位の基材表面の断面曲線は、微小凹凸と、前記微小凹凸が連続して形成する第１のうねりと、前記第１のうねりが連続して形成する第２のうねりと、から構成されることである。   A first feature of the diamond film-coated member of the present invention is a diamond film-coated member in which a diamond film is coated on at least a portion of the surface of a base material that acts on a workpiece, and the diamond film is coated thereon. The cross-sectional curve of the surface of the substrate at the site is composed of minute irregularities, a first undulation formed by the minute irregularities, and a second undulation formed by the first undulation continuously. That is.

ダイヤモンド膜被覆部材において、膜が剥離する領域の大きさは、加工の際にダイヤモンド膜と基材との界面に亀裂が生じ、その亀裂がどこまで進展するかによって決まる。そこで本発明では、基材の表面に微小凹凸と、微小凹凸が連続して形成する第１のうねりと、第１のうねりが連続して形成する第２のうねりとを形成し、亀裂の進展が最小限になるような構造とした。このような構造によれば、次のようなメカニズムで亀裂の進展が防止される。金属基複合材などの難切削材を加工すると、加工時にダイヤモンド膜と基材との界面に亀裂が発生し、さらに加工を継続すると、界面に引き裂き応力が加わり、亀裂は界面に沿ってさらに進展していく。従って、亀裂は消滅せずに引き裂き応力により継続的に進展していき、広範囲にわたりダイヤモンド膜の剥離が短時間に発生してしまう。しかし、本発明のような構造であれば、山と谷からなるうねりが存在し、そのうねりを構成する山はマクロ的に見て放物線に類似した形状であるので、亀裂の進展方向はうねりの山の途中で界面に沿った方向からダイヤモンド膜の表面に向かう方向へと変化する。これによって、最終的に亀裂はダイヤモンド膜表面に達して消滅する。しかも、本発明では、第１のうねりと第２のうねりが形成されているので、引き裂き応力が大きい場合には第２のうねりが作用して亀裂の進展方向をダイヤモンド膜表面の方向に変化させ、引き裂き応力が小さい場合には、第１のうねりが作用して亀裂の進展方向をダイヤモンド膜表面の方向に変化させる。さらに、微小凹凸が形成されているので、ダイヤモンド膜の付着力を向上させることができ、うねりにより亀裂の進展を防止する効果と相まって、ダイヤモンド膜の剥離を防止し、寿命の長いダイヤモンド膜被覆部材とすることができる。   In the diamond film-coated member, the size of the area where the film peels is determined by the extent to which a crack occurs at the interface between the diamond film and the base material during the processing, and the crack progresses. Therefore, in the present invention, the microscopic unevenness, the first undulation formed by the continuous microscopic unevenness, and the second undulation formed by the continuous first undulation are formed on the surface of the base material, and the crack progresses. It was set as the structure which minimizes. According to such a structure, the progress of cracks is prevented by the following mechanism. When processing difficult-to-cut materials such as metal matrix composites, cracks occur at the interface between the diamond film and the base material during processing, and when the processing continues, tearing stress is applied to the interface, and the cracks further propagate along the interface. I will do it. Therefore, the crack does not disappear but continuously develops due to the tearing stress, and the diamond film peels over a wide range in a short time. However, in the structure of the present invention, there are undulations composed of peaks and valleys, and the peaks constituting the undulations have a shape similar to a parabola when viewed macroscopically. It changes from the direction along the interface toward the surface of the diamond film in the middle of the mountain. As a result, the crack finally reaches the diamond film surface and disappears. Moreover, in the present invention, since the first undulation and the second undulation are formed, when the tear stress is large, the second undulation acts to change the crack propagation direction to the direction of the diamond film surface. When the tear stress is small, the first swell acts to change the direction of crack growth to the direction of the diamond film surface. Furthermore, since the micro unevenness is formed, it is possible to improve the adhesion of the diamond film, coupled with the effect of preventing the development of cracks due to waviness, preventing the peeling of the diamond film, and a long-life diamond film coated member It can be.

第２の特徴は、前記第２のうねりは３５０μｍ以下のピッチで形成され、前記第１のうねりは高低差が０．３μｍ以上でピッチが５０μｍ以下で形成されていることである。このように特定された形状にすると、加工時に発生する大小の引き裂き応力による亀裂の進展方向を変化させることができ、ダイヤモンド膜の剥離を最小限にすることができる。   The second feature is that the second waviness is formed with a pitch of 350 μm or less, and the first waviness is formed with a height difference of 0.3 μm or more and a pitch of 50 μm or less. When the shape is specified as described above, the direction of crack propagation due to the large or small tear stress generated during processing can be changed, and the peeling of the diamond film can be minimized.

第３の特徴は、前記微小凹凸は、高低差が０．０５μｍ以上の凹凸により形成されていることである。このような大きさの凹凸にすることにより、ダイヤモンド膜の付着力を高く維持させることができ、前述の２つのうねりの作用効果と相まってダイヤモンド膜の剥離を防止することができる。   A third feature is that the minute unevenness is formed by unevenness having a height difference of 0.05 μm or more. By making the projections and depressions in such a size, the adhesion of the diamond film can be maintained high, and the diamond film can be prevented from peeling off in combination with the above-described two waviness effects.

第４の特徴は、前記微小凹凸、第１のうねりおよび第２のうねりは研削痕により形成されたものであり、前記研削痕の方向は、使用時にダイヤモンド膜と基材との界面に生じる亀裂の進展方向に対し直角方向、あるいは前記直角方向から±３０°の範囲であることである。このように３種類の凹凸を研削により形成し、その方向を亀裂の進展方向に対して交差するように形成することで、亀裂の進展を抑制する効果は大きくなる。もし、亀裂の進展方向と研削痕の方向が平行であれば、研削痕に沿って亀裂が進展するため、亀裂の進展を抑制する効果があまり得られない。   The fourth feature is that the fine irregularities, the first waviness and the second waviness are formed by grinding marks, and the direction of the grinding marks is a crack generated at the interface between the diamond film and the substrate during use. That is, it is in the direction perpendicular to the direction of the growth of the above, or in the range of ± 30 ° from the perpendicular direction. Thus, the effect which suppresses the progress of a crack becomes large by forming 3 types of unevenness | corrugations by grinding, and forming the direction so that it may cross | intersect with the propagation direction of a crack. If the growth direction of the crack and the direction of the grinding mark are parallel, the crack is developed along the grinding mark, so that the effect of suppressing the growth of the crack is not obtained so much.

第５の特徴は、前記ダイヤモンド膜被覆部材はタップであり、前記タップは、ネガ角のチャンファホーニングを施した不完全ねじ形状の食いつき部を設けたことである。   A fifth feature is that the diamond film covering member is a tap, and the tap is provided with an incomplete screw-shaped biting portion subjected to negative chamfer honing.

前述のような基材の表面に微小凹凸、第１のうねりおよび第２のうねりを有するダイヤモンド膜被覆部材として、タップに適用すると優れた効果を発揮できる。特に、金属基複合材のような軟質金属に硬質粒子を分散させた合金にネジ加工を行う切削工具に適している。このような用途では、ダイヤモンド膜が非常に剥離しやすく工具の寿命が短くなるが、本発明を適用した工具を用いることでダイヤモンド膜の剥離を効果的に防止できる。しかも、ネガ角のチャンファホーニングを形成することで、このホーニング面がチップブレーカーの役割を果たし、切り粉を分断するため、切れ刃部への溶着を低減することができる。これにより、切り粉が溶着したり脱離することが減少し、溶着や脱離する際に発生する引き裂き応力の発生も減少させることができるので、ダイヤモンド膜の剥離を大幅に減少させることが可能になる。また、切り粉の噛み込みによるダイヤモンド膜の剥離や工具の折損も防止される。なお、切り粉が噛み込みにくく、切削抵抗が高くなって基材が折損するのを防止するために、完全ねじ部は４ピッチ以上６ピッチ以下とし、食いつき部と完全ねじ部を円周方向において分割する複数の溝を設けることが望ましく、タップの強度を高くするために、完全ねじ部の後端側には、直径が（タップ径×０．７２）〜（タップ径×０．８３）の細径部を設けることが望ましい。このようにすれば、工具の寿命をより向上させることが可能になる。   When applied to a tap as a diamond film-coated member having minute irregularities, first waviness and second waviness on the surface of the substrate as described above, excellent effects can be exhibited. In particular, it is suitable for a cutting tool that performs screw machining on an alloy in which hard particles are dispersed in a soft metal such as a metal matrix composite. In such an application, the diamond film is very easily peeled off and the tool life is shortened. However, the use of the tool to which the present invention is applied can effectively prevent the diamond film from peeling. In addition, by forming negative corner chamfer honing, the honing surface serves as a chip breaker and cuts the chips, so that welding to the cutting edge can be reduced. This reduces chip welding and detachment, and also reduces the generation of tearing stress that occurs during welding and detachment, thus greatly reducing diamond film peeling. become. Further, peeling of the diamond film and breakage of the tool due to the biting of the chips are prevented. In addition, in order to prevent the chips from being bitten and to prevent the base material from being broken due to high cutting resistance, the complete threaded portion should be 4 pitches or more and 6 pitches or less, and the biting portion and the complete threaded portion in the circumferential direction. It is desirable to provide a plurality of grooves to be divided, and in order to increase the strength of the tap, a diameter of (tap diameter × 0.72) to (tap diameter × 0.83) is provided on the rear end side of the complete thread portion. It is desirable to provide a small diameter portion. In this way, the tool life can be further improved.

第６の特徴は、前記タップはスパイラルタップであることである。スパイラル形状のタップとすることで、加工時に工具に作用するトルクを小さくでき、かつ溶着も減少させることができるので、ダイヤモンド膜と基材との界面に発生する亀裂の進展をより防止させることができる。これにより長時間安定して加工を行うことのできるタップとすることができる。このようなスパイラルタップの場合、チャンファホーニングの角度はネガ角である−１°〜−３５°とするのが好ましい。   A sixth feature is that the tap is a spiral tap. By using a spiral tap, the torque acting on the tool during processing can be reduced and welding can be reduced, which can further prevent the development of cracks occurring at the interface between the diamond film and the substrate. it can. Thereby, it can be set as the tap which can be processed stably for a long time. In the case of such a spiral tap, it is preferable that the angle of the chamfer honing is a negative angle of −1 ° to −35 °.

第７の特徴は、前記基材は、炭化タングステンとコバルトを主成分とする超硬合金であって、被覆されたダイヤモンド膜の膜厚が１０μｍ以上であることである。超硬合金は経済的な面や加工性の面で基材として利用しやすい材料であるが、超硬合金はコバルトを含有することから、ダイヤモンド膜と超硬合金の界面で遊離炭素を生成しやすく、加工時に生じた亀裂が進展しやすくなる。ダイヤモンド膜の膜厚が１０μｍ以上の時には、ダイヤモンド膜と超硬合金の熱膨張係数の差により生じる残留応力によって膜密着力が不安定になり、この傾向が大きくなるが、本発明のような表面形状の基材を用いたものであれば、このような状況であっても亀裂の進展が抑えられ、安定した性能で長時間加工することができる。   A seventh feature is that the base material is a cemented carbide mainly composed of tungsten carbide and cobalt, and the film thickness of the coated diamond film is 10 μm or more. Cemented carbide is a material that is easy to use as a base material in terms of economy and workability, but since cemented carbide contains cobalt, it generates free carbon at the interface between the diamond film and the cemented carbide. It is easy, and the crack generated at the time of processing tends to progress. When the film thickness of the diamond film is 10 μm or more, the film adhesion becomes unstable due to the residual stress caused by the difference in thermal expansion coefficient between the diamond film and the cemented carbide, and this tendency increases. If a substrate having a shape is used, even in such a situation, the progress of cracks can be suppressed, and processing can be performed for a long time with stable performance.

第８の特徴は、前記被加工物は、金属基複合材であることである。金属基複合材は前述のように軟質金属に硬質粒子を分散させた合金であり、ダイヤモンド膜と基材との界面に亀裂が発生した場合、加工による大きな引き裂き応力と軟質金属が切れ刃部に溶着したり脱離することによる小さい引き裂き応力により亀裂が進展していく。しかし、本発明のダイヤモンド膜被覆部材の構造によれば、亀裂の発生を防止するとともに、亀裂が発生した場合でも、これら大小の引き裂き応力を、それぞれ第１のうねりと第２のうねりとが亀裂の進展を防止し、亀裂によるダイヤモンド膜の剥離を最小限に抑えることが可能になる。従って、金属基複合材のように、難切削材で溶着しやすい材料の加工には、本発明のダイヤモンド膜被覆部材を適用すると、本発明の作用効果が最大限に生かせる。   The eighth feature is that the workpiece is a metal matrix composite. A metal matrix composite is an alloy in which hard particles are dispersed in a soft metal as described above, and when a crack occurs at the interface between the diamond film and the base material, a large tear stress due to processing and the soft metal are applied to the cutting edge. Cracks develop due to small tearing stress caused by welding or desorption. However, according to the structure of the diamond film-coated member of the present invention, the occurrence of cracks is prevented, and even when cracks occur, these large and small tear stresses are caused by cracks in the first and second wavinesses, respectively. It is possible to prevent the diamond film from peeling due to cracks. Therefore, when the diamond film-coated member of the present invention is applied to processing of a material that is difficult to cut and easily welded, such as a metal matrix composite, the effects of the present invention can be maximized.

本発明のダイヤモンド膜被覆部材によれば、加工中に発生するダイヤモンド膜と基材表面との界面に沿って生じる亀裂の進展を効果的に止め、膜の剥離領域を最小限にすることができるので、難切削材に対しても長寿命を有する切削工具や高い負荷がかかっても長寿命を呈する部材などのダイヤモンド膜被覆部材として利用することができる。   According to the diamond film-coated member of the present invention, it is possible to effectively stop the progress of cracks that occur along the interface between the diamond film and the substrate surface generated during processing, and to minimize the film peeling area. Therefore, it can be used as a diamond film covering member such as a cutting tool having a long life even for difficult-to-cut materials or a member having a long life even when a high load is applied.

本発明のダイヤモンド膜被覆部材の基材表面およびダイヤモンド膜の部分の模式図を図１に示す。ダイヤモンド膜被覆部材１は、炭化タングステンとコバルトを主成分とする超硬合金からなる基材３の表面にダイヤモンド膜２が化学的気相合成法により形成されている。ダイヤモンド膜２は少なくとも加工に作用する部位には形成されて、すくい面８と逃げ面９を有し、その交差部には切れ刃４が形成されている。基材３の表面は、相対的にピッチの大きい第２のうねり５が形成され、この第２のうねり５のピッチＡは３５０μｍ以下で形成されている。第２のうねり５上には相対的にピッチの小さい第１のうねり６が形成され、この第１のうねり６はピッチＢが５０μｍ以下で、かつうねりの高低差ｂが０．３μｍ以上で形成されている。さらに、第１のうねり６上には微小凹凸７が形成され、この微小凹凸７は高低差ｃが０．０５μｍ以上の凹凸で形成されている。これらの第２のうねり５、第１のうねり６および微小凹凸７は研削により生じる研削痕で形成されており、この研削痕の方向は、ダイヤモンド被覆部材を使用する時にダイヤモンド膜と基材との界面に生じる亀裂の進展する方向に対して交差する方向に形成される。この交差する角度は直角かあるいは直角方向から±３０°の範囲の角度になっている。   A schematic diagram of the base material surface and the diamond film portion of the diamond film-coated member of the present invention is shown in FIG. In the diamond film covering member 1, a diamond film 2 is formed on the surface of a base material 3 made of a cemented carbide mainly composed of tungsten carbide and cobalt by a chemical vapor synthesis method. The diamond film 2 is formed at least at a site that acts on processing, has a rake face 8 and a flank face 9, and a cutting edge 4 is formed at the intersection. The surface of the substrate 3 is formed with second waviness 5 having a relatively large pitch, and the pitch A of the second waviness 5 is formed to be 350 μm or less. A first undulation 6 having a relatively small pitch is formed on the second undulation 5, and the first undulation 6 is formed with a pitch B of 50 μm or less and a undulation height difference b of 0.3 μm or more. Has been. Furthermore, a minute unevenness 7 is formed on the first undulation 6, and the minute unevenness 7 is formed as an unevenness having an elevation difference c of 0.05 μm or more. These second undulations 5, first undulations 6 and minute irregularities 7 are formed by grinding marks generated by grinding, and the direction of the grinding marks is determined between the diamond film and the substrate when the diamond covering member is used. It is formed in a direction intersecting with the direction in which the crack generated at the interface propagates. The intersecting angle is a right angle or an angle in a range of ± 30 ° from the right angle direction.

本発明のダイヤモンド膜被覆部材の例として、ダイヤモンド膜被覆タップを使用して穴にタップ加工を行った時のダイヤモンド膜の剥離状況の試験を行った。図２はこのタップの側面図であり、図３は切れ刃１１の部分断面図である。なお、図３のｏはタップの回転中心を示している。炭化タングステンと５％のコバルトを含む超硬合金からなる材料を図２に示すような形状に加工した基材３を準備した。切れ刃１１は、不完全ねじ形状の食付き部１１ａと完全ねじ形状の完全ねじ部１１ｂからなり、食付き部１１ａは２山、完全ねじ部１１ｂは５山になっている。食付き部１１ａの部分の切れ刃には、図３に示すようにすくい面８と逃げ面９との交差部にチャンファホーニングを行い、すくい角αが負の１５°からなるチャンファ面１０を形成した。チャンファ面１０はダイヤモンド砥石を用いて研削加工を行い、図１に示すような第２のうねり５、第１のうねり６および微小凹凸７を形成した。タップの径はＭ４とし、うねりや凹凸のピッチおよび高低差は、ダイヤモンド砥石のドレッシング状態並びに研削加工時の送り速度を変えることにより制御した。なお、研削痕の方向については、切れ刃稜線に対して平行なものおよび垂直なものを製作した。これらのうねりや凹凸のピッチ、高低差および研削痕の方向を表１に示す。このような基材３の表面に熱フィラメントを使った気相合成法により厚さ約１０μｍのダイヤモンド膜を被覆した。比較のために、従来のダイヤモンド膜被覆部材として、チャンファ面１０が本発明の第２のうねり５に該当する山と谷のみのもの（比較例１）および本発明の第２のうねり５と第１のうねり６に該当する山と谷のみのもの（比較例２）を製作し、本発明のものと同様のダイヤモンド膜を被覆したタップを製作した。これらのタップを用い、比較試験を行った。被加工物はＡｌ−３０％ＳｉＣ合金を用い、予め形成しておいた穴に以下に示す加工条件でタップ加工を行い、チャンファ面のダイヤモンド膜の剥離状況の観察を行った。この試験の結果を表１の右端に示す。   As an example of the diamond film-coated member of the present invention, the diamond film was peeled when a hole was tapped using a diamond film-coated tap. FIG. 2 is a side view of the tap, and FIG. 3 is a partial sectional view of the cutting edge 11. In addition, o of FIG. 3 has shown the rotation center of the tap. A base material 3 was prepared by processing a material made of a cemented carbide containing tungsten carbide and 5% cobalt into a shape as shown in FIG. The cutting edge 11 includes a chamfered portion 11a having an incomplete screw shape and a complete screw portion 11b having a complete screw shape. The chamfered portion 11a has two threads and the complete screw portion 11b has five threads. As shown in FIG. 3, chamfer honing is performed on the cutting edge of the chamfered portion 11a at the intersection of the rake face 8 and the flank 9 to form a chamfer face 10 having a rake angle α of negative 15 °. did. The chamfer surface 10 was ground using a diamond grindstone to form second waviness 5, first waviness 6 and minute irregularities 7 as shown in FIG. The tap diameter was M4, and the pitch and height difference of the waviness and unevenness were controlled by changing the dressing state of the diamond grindstone and the feed rate during grinding. In addition, about the direction of the grinding mark, the thing parallel and perpendicular | vertical with respect to a cutting-edge ridgeline was manufactured. Table 1 shows the waviness, the pitch of the unevenness, the height difference, and the direction of the grinding mark. A diamond film having a thickness of about 10 μm was coated on the surface of the substrate 3 by a vapor phase synthesis method using a hot filament. For comparison, as a conventional diamond film-coated member, the chamfer surface 10 has only peaks and valleys corresponding to the second undulation 5 of the present invention (Comparative Example 1) and the second undulation 5 and the second of the present invention. Only the peaks and valleys corresponding to the undulation 6 of 1 (Comparative Example 2) were manufactured, and a tap coated with the same diamond film as that of the present invention was manufactured. A comparative test was performed using these taps. An Al-30% SiC alloy was used as the workpiece, and tapping was performed on a previously formed hole under the following processing conditions, and the state of peeling of the diamond film on the chamfer surface was observed. The results of this test are shown at the right end of Table 1.

Figure 0004738828
Figure 0004738828

加工条件
タップの回転数：Ｎ＝３１８ｍ−１
切削速度：Ｖ＝４ｍ／ｍｉｎ
送り速度：Ｆ＝２２６ｍｍ／ｍｉｎ
加工深さ：Ｄ＝８ｍｍ Processing conditions Tap rotation speed: N = 318 m −1
Cutting speed: V = 4 m / min
Feeding speed: F = 226mm / min
Processing depth: D = 8mm

以上の試験を行った結果、本発明のタップはいずれもチャンファ面の剥離が発生するまでに５００穴以上加工することができたが、比較例１のものでは１００穴、比較例２のものでは２００穴しか加工することができず、本発明のタップはダイヤモンド膜が剥離しにくいことがわかった。   As a result of the above test, all of the taps of the present invention were able to process 500 holes or more before the chamfer surface was peeled off. Only 200 holes could be processed, and it was found that the tap of the present invention hardly peeled the diamond film.

本発明は、Ａｌ−ＳｉＣ合金などの金属基複合材、Ａｌ−Ｓｉ合金、カーボン、ＦＲＰなどの難切削材を加工するための切削工具や、使用時に高い負荷のかかる耐磨耗部材などに好適であるが、これ以外の材料であっても使用することができ、ダイヤモンド膜が被覆された切削工具や耐磨耗部材などの各種部材に使用することができる。   The present invention is suitable for metal matrix composites such as Al-SiC alloys, cutting tools for processing difficult-to-cut materials such as Al-Si alloys, carbon, FRP, and wear-resistant members that are heavily loaded during use. However, other materials can also be used, and can be used for various members such as a cutting tool coated with a diamond film and a wear-resistant member.

本発明の基材表面およびダイヤモンド膜の部分の状態を表す模式図。The schematic diagram showing the state of the base-material surface of this invention, and the part of a diamond film. 実施例１のタップを表す側面図。The side view showing the tap of Example 1. FIG. 図２のタップの切れ刃部分の断面図。Sectional drawing of the cutting blade part of the tap of FIG.

符号の説明Explanation of symbols

１ ダイヤモンド膜被覆部材
２ ダイヤモンド膜
３ 基材
４ 切れ刃稜線
５ 第２のうねり
６ 第１のうねり
７ 微小凹凸
８ すくい面
９ 逃げ面
１０ チャンファ面
１１ 切れ刃
１１ａ 食付き部
１１ｂ 完全ねじ部
Ａ 第２のうねりのピッチ
Ｂ 第１のうねりのピッチ
Ｃ 微小凹凸のピッチ
ａ 第２のうねりの高低差
ｂ 第１のうねりの高低差
ｃ 微小凹凸の高低差 DESCRIPTION OF SYMBOLS 1 Diamond film coating | coated member 2 Diamond film 3 Base material 4 Cutting edge ridgeline 5 2nd waviness 6 1st waviness 7 Minute unevenness 8 Rake face 9 Relief face 10 Chamfer face 11 Cutting edge 11a Biting part 11b Complete thread part A 1st 2 Waviness pitch B First waviness pitch C Minute uneven pitch a Second waviness difference b First waviness height difference c Small unevenness height difference

Claims (6)

基材の表面の少なくとも被加工物に対して作用する部位にダイヤモンド膜を被覆したダイヤモンド膜被覆部材であって、
前記ダイヤモンド膜が被覆された部位の基材表面の断面曲線は、
微小凹凸と、
前記微小凹凸が連続して形成する第１のうねりと、
前記第１のうねりが連続して形成する第２のうねりと、から構成され、
前記第２のうねりは３５０μｍ以下のピッチで形成され、前記第１のうねりは高低差が０．３μｍ以上でピッチが５０μｍ以下で形成されていることを特徴とするダイヤモンド膜被覆部材。 A diamond film-coated member in which a diamond film is coated on at least a part of the surface of the substrate that acts on a workpiece,
The cross-sectional curve of the substrate surface at the site coated with the diamond film is:
Minute irregularities,
A first undulation in which the minute irregularities are continuously formed;
A second undulation formed continuously by the first undulation ,
The diamond film covering member, wherein the second undulation is formed with a pitch of 350 μm or less, and the first undulation is formed with a height difference of 0.3 μm or more and a pitch of 50 μm or less . 前記微小凹凸は、高低差が０．０５μｍ以上の凹凸により形成されていることを特徴とする請求項１に記載のダイヤモンド膜被覆部材。 2. The diamond film-coated member according to claim 1 , wherein the minute unevenness is formed by unevenness having a height difference of 0.05 μm or more. 前記ダイヤモンド膜被覆部材はタップであり、前記タップは、ネガ角のチャンファホーニングを施した不完全ねじ形状の食いつき部を設けたことを特徴とする請求項１または２に記載のダイヤモンド膜被覆部材。 The diamond film covering member according to claim 1 or 2 , wherein the diamond film covering member is a tap, and the tap is provided with an incomplete screw-shaped biting portion subjected to negative chamfer honing. 前記タップはスパイラルタップである請求項３に記載のダイヤモンド膜被覆部材。 The diamond film-coated member according to claim 3 , wherein the tap is a spiral tap. 前記基材は、炭化タングステンとコバルトを主成分とする超硬合金であって、被覆されたダイヤモンド膜の膜厚が１０μｍ以上であることを特徴とする請求項１〜４のいずれかに記載のダイヤモンド膜被覆部材。 The said base material is a cemented carbide which has a tungsten carbide and cobalt as a main component, Comprising: The film thickness of the coated diamond film is 10 micrometers or more, The any one of Claims 1-4 characterized by the above-mentioned. Diamond film coated member. 前記被加工物は、金属基複合材であることを特徴とする請求項１〜５のいずれかに記載のダイヤモンド膜被覆部材。 The workpiece, the diamond film coated member according to any one of claims 1 to 5, characterized in that a metal matrix composite material.
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