JP4707522B2 - Manufacturing method of hermetic terminal for crystal resonator - Google Patents

Manufacturing method of hermetic terminal for crystal resonator Download PDF

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JP4707522B2
JP4707522B2 JP2005288351A JP2005288351A JP4707522B2 JP 4707522 B2 JP4707522 B2 JP 4707522B2 JP 2005288351 A JP2005288351 A JP 2005288351A JP 2005288351 A JP2005288351 A JP 2005288351A JP 4707522 B2 JP4707522 B2 JP 4707522B2
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crystal
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hermetic terminal
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JP2007104080A (en
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剛志 中村
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Citizen Finetech Miyota Co Ltd
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Description

本発明は水晶振動子用気密端子の製造方法に関するものである。The present invention relates to a method for manufacturing an airtight terminal for a crystal resonator.

水晶振動子は多くの技術分野でクロック源として多用されている。小型の水晶振動子としてはシリンダー型の圧入方式水晶振動子がある。   Quartz resonators are widely used as clock sources in many technical fields. As a small crystal unit, there is a cylinder type press-fitting type crystal unit.

図５は圧入型シリンダータイプ水晶振動子の分解斜視図である。１は封止管、２は水晶振動子用気密端子、３はリード端子、４は水晶片、５は水晶片に形成された電極膜である。図４に示す圧入型シリンダータイプ水晶振動子は、水晶片４が水晶振動子用気密端子２に埋設されたリード端子３のインナーリード３ａに半田若しくは導電性接着剤により固定される。その後、周波数調整工程、洗浄工程を経、封止管１を前記水晶片４が固定された水晶振動子用気密端子２に圧入封止してシリンダータイプの水晶振動子が完成する。   FIG. 5 is an exploded perspective view of a press-fit cylinder type crystal resonator. Reference numeral 1 is a sealing tube, 2 is an airtight terminal for a crystal resonator, 3 is a lead terminal, 4 is a crystal piece, and 5 is an electrode film formed on the crystal piece. In the press-fit cylinder type crystal resonator shown in FIG. 4, the crystal piece 4 is fixed to the inner lead 3a of the lead terminal 3 embedded in the airtight terminal 2 for the crystal resonator with solder or a conductive adhesive. Thereafter, a frequency adjustment process and a cleaning process are performed, and the sealing tube 1 is press-fitted and sealed into the hermetic terminal 2 for the crystal oscillator to which the crystal piece 4 is fixed, thereby completing a cylinder type crystal oscillator.

図６は水晶振動子用気密端子２の断面図であり、６は金属環（ヘッダー部）、７は絶縁部材、３はリード端子、６ａは金属メッキ部である。水晶振動子用気密端子２の金属環６には封止管１の圧入時に軟質金属を介在させて気密性を保つために前記金属メッキ部６ａが施されている。従来はＳＭＤ用途のために耐熱性が十分に得られる高温半田メッキ（Ｐｂメッキ Ｐｂ対残部が９対１）が用いられてきたが、高温半田メッキ（Ｐｂメッキ）には地球環境保護問題があり、現在、電子部品や電子部品の取り付けに使用する半田の鉛フリー化が進められている。水晶振動子用気密端子２に施すメッキとして錫−銅の合金メッキを施し鉛フリー化を実現したものがある。（特許文献１参照。）   FIG. 6 is a cross-sectional view of the hermetic terminal 2 for a crystal resonator, 6 is a metal ring (header portion), 7 is an insulating member, 3 is a lead terminal, and 6a is a metal plating portion. The metal ring 6 of the hermetic terminal 2 for the crystal oscillator is provided with the metal plating portion 6a in order to maintain the airtightness by interposing a soft metal when the sealing tube 1 is press-fitted. Conventionally, high-temperature solder plating (Pb plating Pb vs. remaining 9: 1) has been used to obtain sufficient heat resistance for SMD applications, but high-temperature solder plating (Pb plating) has a problem of protecting the global environment. Currently, lead-free solder for electronic components and solder used for mounting electronic components is being promoted. As a plating to be applied to the hermetic terminal 2 for the crystal resonator, there is a material which has been made lead-free by applying a tin-copper alloy plating. (See Patent Document 1.)

図６に示す水晶振動子用気密端子２は、金属環６及びリード端子３の表面に錫−銅等の金属メッキ部６ａが施されている。金属メッキ部６ａの構成は、水晶片４のインナーリード３ａへの固定に半田を用いるか、導電性接着剤を用いるかにより異なる。その構成は、導電性接着剤を用いる場合、第一層目に銅（Ｃｕ）メッキ−第二層目に錫（Ｓｎ）メッキ−第三層目に金（Ａｕ）メッキを施す構成である。最上面層（表面）に金メッキを施すのは導電性接着剤との接続性を確保するためであり、接触抵抗劣化防止のためである。
また、半田を用いて固定する場合は、第一層目に銅（Ｃｕ）メッキ−第二層目に錫銅合金（ＳｎＣｕ）メッキを施す構成である。下地層としての銅（Ｃｕ）メッキは、１〜５μｍの厚みをもって施され、第二層目は、錫（９０〜９７％）−銅（１０〜３％）合金を５〜２０μｍの厚みでメッキする。圧入する封止管（不図示）は、封止管の材料そのものか、ニッケルメッキを施した構成である。前記構成により高温半田付けに耐えられなおかつ気密性を確保できる圧入型シリンダータイプ水晶振動子を得ている。 The hermetic terminal 2 for crystal resonator shown in FIG. 6 has a metal ring 6 a made of tin-copper or the like on the surface of the metal ring 6 and the lead terminal 3. The configuration of the metal plating portion 6a differs depending on whether solder is used for fixing the crystal piece 4 to the inner lead 3a or a conductive adhesive is used. In the configuration, when a conductive adhesive is used, the first layer is copper (Cu) plating, the second layer is tin (Sn) plating, and the third layer is gold (Au) plating. The reason why the uppermost layer (surface) is gold-plated is to ensure connectivity with the conductive adhesive and to prevent contact resistance deterioration.
Moreover, when fixing using solder, it is the structure which tin-copper alloy (SnCu) plating is applied to copper (Cu) plating-2nd layer in the 1st layer. Copper (Cu) plating as an underlayer is applied with a thickness of 1 to 5 μm, and the second layer is plated with a tin (90 to 97%)-copper (10 to 3%) alloy with a thickness of 5 to 20 μm. To do. A sealing tube (not shown) to be press-fitted is a material of the sealing tube itself or a structure plated with nickel. With the above configuration, a press-fit cylinder type crystal resonator that can withstand high-temperature soldering and can ensure airtightness is obtained.

特開２００１−２８５００７号公報JP 2001-285007 A

前記構成による圧入型シリンダータイプ水晶振動子は、回路基板上に半田固定され使用されるが、この際、約２６０℃のリフロー炉に投入されることになる。前記水晶振動子用気密端子２に施される金属メッキ部６ａは、メッキ処理工程において用いる有機系添加剤を含んでおり、リフロー炉内で高温加熱されることにより前記有機系添加剤がガス化し、封止管内に放出してしまう。この時、金属メッキ部の一部を同時に飛散させてしまうことがあり、飛散した金属メッキ部の一部が水晶片に付着し、これにより周波数を低下させてしまうという問題があった。   The press-fit cylinder type crystal resonator having the above-described configuration is used by being solder-fixed on a circuit board, and at this time, it is put into a reflow furnace at about 260 ° C. The metal plating portion 6a applied to the quartz resonator hermetic terminal 2 contains an organic additive used in the plating process, and the organic additive is gasified by being heated at a high temperature in a reflow furnace. , Will be discharged into the sealed tube. At this time, a part of the metal plating part may be scattered at the same time, and there is a problem that a part of the scattered metal plating part adheres to the crystal piece, thereby lowering the frequency.

本発明の目的は、基板実装時のリフロー工程において、前記水晶振動子用気密端子に施された金属メッキ部に含まれる有機系添加剤のガス化による金属メッキ部の飛散を防止し、これに伴う周波数低下等の製品特性に対する悪影響のない水晶振動子用気密端子の製造方法を提供しようとするものである。 An object of the present invention is to prevent scattering of the metal plating part due to gasification of the organic additive contained in the metal plating part applied to the airtight terminal for the crystal resonator in the reflow process at the time of mounting the substrate. It is an object of the present invention to provide a method for manufacturing a hermetic terminal for a crystal resonator that does not adversely affect product characteristics such as frequency reduction .

接続電極を有する水晶片を内部に収容する封止管の解放端に圧入固定され、前記水晶片の接続電極と固定されるインナーリードを有した一対のリード端子を支持する水晶振動子用気密端子の製造方法であって、前記水晶振動子用気密端子は、前記一対のリード端子と、前記一対のリード端子をお互いに絶縁してほぼ平行に支持するための絶縁部材と、この絶縁部材の周囲を包囲しており、前記封止管の解放端に圧入されて封止管内面と接触する金属環とで構成され、前記水晶振動子用気密端子の前記一対のリード端子及び前記金属環の表面には、金属メッキ部を備え、前記水晶振動子用気密端子の前記インナーリードが位置する上部表面部のみが露出するように前記水晶振動子用気密端子をキャリアに搭載する工程と、前記水晶振動子用気密端子を搭載した前記キャリアを加熱処理炉に投入し、前記水晶振動子用気密端子の上部表面部に向けて熱風を噴射し、前記水晶振動子用気密端子の前記水晶片が固定される前記インナーリードの金属メッキ部と前記金属環の上部表面部の金属メッキ部とに含まれる有機系添加剤を除去する工程と、を有する水晶振動子用気密端子の製造方法とする。An airtight terminal for a crystal resonator, which is press-fitted and fixed to an open end of a sealing tube that accommodates a crystal piece having a connection electrode therein, and supports a pair of lead terminals having an inner lead fixed to the connection electrode of the crystal piece. The airtight terminal for a crystal resonator includes the pair of lead terminals, an insulating member for insulating the pair of lead terminals from each other and supporting them substantially in parallel, and a periphery of the insulating member. A pair of lead terminals of the hermetic terminal for the quartz crystal unit and the surface of the metal ring, the metal ring being pressed into the open end of the seal tube and contacting the inner surface of the seal tube Mounting the crystal resonator hermetic terminal on the carrier so that only the upper surface portion where the inner lead of the crystal resonator hermetic terminal is located is exposed, and the crystal vibration Airtight for child The carrier carrying the child is put into a heat treatment furnace, hot air is sprayed toward the upper surface portion of the airtight terminal for the crystal resonator, and the crystal piece of the airtight terminal for the crystal resonator is fixed And a step of removing an organic additive contained in the metal plating portion of the lead and the metal plating portion of the upper surface portion of the metal ring.

前記水晶振動子用気密端子をキャリアに搭載する工程において、前記水晶振動子用気密端子の上部表面部のみをキャリア表面に露出させ、前記水晶振動子用気密端子の他の部位は、前記キャリア内に埋め込むようにして搭載される水晶振動子用気密端子の製造方法とする。In the step of mounting the crystal resonator hermetic terminal on the carrier, only the upper surface portion of the crystal resonator hermetic terminal is exposed on the carrier surface, and the other part of the crystal resonator hermetic terminal is located inside the carrier. A method for manufacturing a hermetic terminal for a crystal resonator mounted so as to be embedded in the substrate.

本発明によれば、水晶振動子用気密端子は、水晶片が固定される前記インナーリード表面と、前記金属環の上部表面部があらかじめ加熱処理され、金属メッキ部に含まれる有機系添加剤はガス化され除去された構成であるため、圧入型シリンダータイプ水晶振動子として回路基板に実装される際加熱されても、封止管内での金属メッキ部の飛散がなく、周波数特性等の悪化の問題がなくなる。   According to the present invention, the hermetic terminal for the crystal resonator is pretreated by heating the inner lead surface to which the crystal piece is fixed and the upper surface portion of the metal ring, and the organic additive contained in the metal plating portion is Because it is gasified and removed, even if it is heated when mounted on a circuit board as a press-fit cylinder type crystal resonator, there is no scattering of the metal plating part in the sealing tube, and the frequency characteristics etc. deteriorate. The problem disappears.

以下、図に基づいて本発明の具体的な実施形態について説明する。
図１は本発明に係る水晶振動子用気密端子を示す斜視図であり、水晶片が固定された状態を示しており、（ａ）は斜視図、（ｂ）は上面図である。図４に示した圧入型シリンダータイプ水晶振動子と同一部材については同一の符号を用いて説明する。尚、図１において封止管は省略してある。 Hereinafter, specific embodiments of the present invention will be described with reference to the drawings.
FIG. 1 is a perspective view showing an airtight terminal for a crystal resonator according to the present invention , showing a state where a crystal piece is fixed, (a) is a perspective view, and (b) is a top view. The same members as those in the press-fit cylinder type crystal resonator shown in FIG. 4 will be described using the same reference numerals. In FIG. 1, the sealing tube is omitted.

水晶振動子用気密端子２は金属環６、絶縁部材７、リード端子３で構成されており、金属環６とリード端子３の表面には背景技術において説明した第一層目に銅（Ｃｕ）−第二層目に錫（Ｓｎ）−第三層目に金（Ａｕ）の構成の金属メッキ部（不図示）や、第一層目に銅（Ｃｕ）−第二層目に錫銅合金（ＳｎＣｕ）の構成の金属メッキ部が施されている。   The hermetic terminal 2 for the crystal resonator includes a metal ring 6, an insulating member 7, and a lead terminal 3. The surface of the metal ring 6 and the lead terminal 3 has copper (Cu) as the first layer described in the background art. -The second layer is tin (Sn)-the third layer is gold (Au), and the first layer is copper (Cu)-the second layer is tin-copper alloy The metal plating part of the structure of (SnCu) is given.

前記水晶振動子用気密端子２の金属環６の上面部６ｂ、及びインナーリード３ａ表面はメッキ処理後、熱処理が施された構成である。前記熱処理は、図示しない封止管を水晶振動子用気密端子２に圧入封止した時に封止管内で前記金属メッキ部が露出する部分（金属環上面部６ｂ、インナーリード３ａ）に対して部分的に行われる。（図１中の斜線部分が熱処理部である。）前記熱処理後、電極膜５の形成された水晶片４を水晶振動子用気密端子２のインナーリード３ａと水晶片４の接続電極５ａを対応させて配置し、固定部材８により固定している。固定部材８としては、導電性接着剤や半田が用いられる。水晶片４の水晶振動子用気密端子２へのマウント後は、封止管（不図示）が圧入封止されて圧入型シリンダータイプ水晶振動子が構成される。   The upper surface portion 6b of the metal ring 6 and the surface of the inner lead 3a of the hermetic terminal 2 for the quartz crystal resonator are subjected to heat treatment after plating. The heat treatment is performed with respect to a portion (metal ring upper surface portion 6b, inner lead 3a) where the metal plating portion is exposed in the sealing tube when a sealing tube (not shown) is press-fitted and sealed into the hermetic terminal 2 for the crystal resonator. Done. (The shaded area in FIG. 1 is a heat treatment part.) After the heat treatment, the crystal piece 4 on which the electrode film 5 is formed corresponds to the inner lead 3a of the hermetic terminal 2 for the crystal resonator and the connection electrode 5a of the crystal piece 4. And fixed by the fixing member 8. As the fixing member 8, a conductive adhesive or solder is used. After the crystal piece 4 is mounted on the airtight terminal 2 for the crystal resonator, a sealing tube (not shown) is press-fitted and sealed to form a press-fit cylinder type crystal resonator.

図２は本発明に係る水晶振動子用気密端子を示す部分断面図で、封止管圧入部を拡大して示した図である。金属環６の上面部６ｂ（封止管１が水晶振動子用気密端子２に圧入封止された際に封止管内に露出する部分）は封止管１の圧入前に熱処理されているので、金属メッキ部６ａに含まれる有機系添加剤は既にガス化され除去された状態となっている。従って、回路基板への実装時の加熱により引き起こされる問題はない。また、図２において図示してないが、インナーリード３ａも封止管内部に配置される構成となるが、あらかじめ熱処理されているため同様である。
前記構成によれば、金属メッキ部６ａに含まれる有機系添加剤は、あらかじめガス化され除去されているので、封止管内でのガス放出による金属メッキ部６ａの飛散がなくなり、該金属メッキ部６ａの水晶片への付着が防止でき、周波数低下等の問題が解消される。 FIG. 2 is a partial sectional view showing an airtight terminal for a crystal resonator according to the present invention, and is an enlarged view of a sealing tube press-fitting portion. Since the upper surface portion 6b of the metal ring 6 (the portion exposed to the inside of the sealing tube when the sealing tube 1 is press-fitted and sealed into the quartz vibrator airtight terminal 2) is heat-treated before the sealing tube 1 is press-fitted. The organic additive contained in the metal plating part 6a has already been gasified and removed. Therefore, there is no problem caused by heating during mounting on the circuit board. Although not shown in FIG. 2, the inner lead 3a is also arranged inside the sealing tube, but the same is true because it has been preheated.
According to the said structure, since the organic type additive contained in the metal plating part 6a is gasified and removed beforehand, there is no scattering of the metal plating part 6a by the gas discharge | release in a sealing pipe, and this metal plating part 6a can be prevented from adhering to the crystal piece, and problems such as frequency reduction can be solved.

尚、熱処理する部位をインナーリード３ａと金属環の上面部６ｂとするのは、特に問題発生の原因となる部位が、封止管内に露出する部分であるためである。また、金属環６の外周面を熱処理しないのは、熱処理による金属メッキ部６ａ表面の凹凸化を避け、封止管との圧入封止の気密性を損なわないためである。   The reason why the heat treatment sites are the inner lead 3a and the upper surface portion 6b of the metal ring is that the site that causes the problem is the portion exposed in the sealing tube. Further, the reason why the outer peripheral surface of the metal ring 6 is not heat-treated is to avoid unevenness of the surface of the metal plating portion 6a by the heat treatment and not to impair the airtightness of the press-fitting sealing with the sealing tube.

図３は本発明の水晶振動子用気密端子の製造方法を説明するための図で、（ａ）はキャリアの上面図、（ｂ）はキャリアの正面図である。
９は、水晶振動子用気密端子２を搭載するキャリアである。該キャリア９にはリード端子挿入用の穴（不図示）が設けられており、該穴にリード端子を挿入して搭載している。前記キャリア９に搭載後、熱処理炉に投入する。熱処理炉内では、前記キャリア９に搭載された水晶振動子用気密端子２のインナーリード３ａ及び金属環６の上面部６ｂに向け熱風を噴射し熱処理を行う。熱風の噴射方向は、水晶振動子用気密端子２の上方、側方のいずれからでも可能であるが、側方からの場合は、水晶振動子用気密端子２の金属環６外周部には直接熱風があたらないよう、カバー部材（不図示）等を用いて行うのが好ましい。熱処理は、約３５０℃の高温下で、約５秒間の短時間で行えば良い。該工程により、インナーリード３ａ及び金属環６の上面部６ｂの金属メッキ部６ａに含まれる有機系添加剤をガス化し放出できる。 FIGS. 3A and 3B are views for explaining a method for manufacturing an airtight terminal for a crystal resonator according to the present invention, in which FIG. 3A is a top view of the carrier and FIG. 3B is a front view of the carrier.
Reference numeral 9 denotes a carrier on which the airtight terminal 2 for a crystal resonator is mounted. The carrier 9 is provided with a lead terminal insertion hole (not shown), and the lead terminal is inserted into the hole for mounting. After mounting on the carrier 9, it is put into a heat treatment furnace. In the heat treatment furnace, heat treatment is performed by injecting hot air toward the inner lead 3a of the hermetic terminal 2 for crystal resonator mounted on the carrier 9 and the upper surface portion 6b of the metal ring 6. The hot air can be sprayed from either the upper side or the side of the hermetic terminal 2 for the crystal resonator. It is preferable to use a cover member (not shown) or the like so as not to be exposed to hot air. The heat treatment may be performed at a high temperature of about 350 ° C. for a short time of about 5 seconds. By this step, the organic additive contained in the inner lead 3a and the metal plating portion 6a of the upper surface portion 6b of the metal ring 6 can be gasified and released.

図４は本発明の水晶振動子用気密端子の製造工程において用いるキャリアの部分断面図である。１０はキャリアで、図３に示すキャリアとは別の形態である。水晶振動子用気密端子２はキャリア１０内に埋め込まれるようにして搭載される形態である。該構成によればキャリア１０表面にはインナーリード３ａと金属環６の上面部６ｂが露出するのみで、金属環６の外周面はキャリア１０内に埋め込まれる形態であるため、熱風はインナーリード３ａと金属環６の上面部６ｂのみをターゲットに噴射できる。   FIG. 4 is a partial cross-sectional view of the carrier used in the manufacturing process of the hermetic terminal for the crystal resonator of the present invention. Reference numeral 10 denotes a carrier, which has a different form from the carrier shown in FIG. The hermetic terminal 2 for the crystal resonator is mounted so as to be embedded in the carrier 10. According to this configuration, the inner lead 3a and the upper surface portion 6b of the metal ring 6 are only exposed on the surface of the carrier 10, and the outer peripheral surface of the metal ring 6 is embedded in the carrier 10, so that hot air is generated from the inner lead 3a. And only the upper surface portion 6b of the metal ring 6 can be injected onto the target.

本発明に係る水晶振動子用気密端子を示す斜視図で、（ａ）は斜視図、（ｂ）は上面図It is a perspective view which shows the airtight terminal for crystal oscillators concerning this invention, (a) is a perspective view, (b) is a top view. 本発明に係る水晶振動子用気密端子を示す部分断面図The fragmentary sectional view which shows the airtight terminal for crystal oscillators concerning this invention 本発明の水晶振動子用気密端子の製造方法を説明するための図で、（ａ）はキャリアの上面図、（ｂ）はキャリアの正面図It is a figure for demonstrating the manufacturing method of the airtight terminal for crystal oscillators of this invention, (a) is a top view of a carrier, (b) is a front view of a carrier. 本発明の水晶振動子用気密端子の製造工程において用いるキャリアの部分断面図The fragmentary sectional view of the carrier used in the manufacturing process of the airtight terminal for crystal oscillators of the present invention 圧入型シリンダータイプ水晶振動子の分解斜視図Exploded perspective view of press-fit cylinder type crystal unit 水晶振動子用気密端子の断面図Cross section of hermetic terminal for quartz crystal

１ 封止管
２ 水晶振動子用気密端子
３ リード端子
３ａ インナーリード
４ 水晶片
５ 電極膜
５ａ 接続電極
６ 金属環
６ａ 金属メッキ部
６ｂ 金属環の上面部
７ 絶縁部材
８ 固定部材
９ キャリア
１０ キャリア
DESCRIPTION OF SYMBOLS 1 Sealing tube 2 Airtight terminal for crystal oscillator 3 Lead terminal 3a Inner lead 4 Crystal piece 5 Electrode film 5a Connection electrode 6 Metal ring 6a Metal plating part 6b Upper surface part of metal ring 7 Insulating member 8 Fixing member 9 Carrier 10 Carrier

Claims (2)

接続電極を有する水晶片を内部に収容する封止管の解放端に圧入固定され、  It is press-fitted and fixed to the open end of the sealing tube that accommodates the crystal piece having the connection electrode inside,
前記水晶片の接続電極と固定されるインナーリードを有した一対のリード端子を支持する水晶振動子用気密端子の製造方法であって、  A method of manufacturing a hermetic terminal for a crystal resonator supporting a pair of lead terminals having an inner lead fixed to a connection electrode of the crystal piece,
前記水晶振動子用気密端子は、前記一対のリード端子と、前記一対のリード端子をお互いに絶縁してほぼ平行に支持するための絶縁部材と、この絶縁部材の周囲を包囲しており、前記封止管の解放端に圧入されて封止管内面と接触する金属環とで構成され、前記水晶振動子用気密端子の前記一対のリード端子及び前記金属環の表面には、金属メッキ部を備え、  The airtight terminal for the crystal resonator surrounds the pair of lead terminals, an insulating member for insulating the pair of lead terminals from each other and supporting them substantially in parallel, and the periphery of the insulating member, A metal ring that is press-fitted into the open end of the sealing tube and is in contact with the inner surface of the sealing tube; and a metal plating portion is provided on the surface of the pair of lead terminals and the metal ring of the hermetic terminal for the crystal resonator. Prepared,
前記水晶振動子用気密端子の前記インナーリードが位置する上部表面部のみが露出するように前記水晶振動子用気密端子をキャリアに搭載する工程と、  Mounting the quartz crystal hermetic terminal on a carrier so that only the upper surface portion where the inner lead of the quartz crystal hermetic terminal is located is exposed;
前記水晶振動子用気密端子を搭載した前記キャリアを加熱処理炉に投入し、  The carrier equipped with the airtight terminal for the crystal resonator is put into a heat treatment furnace,
前記水晶振動子用気密端子の上部表面に向けて熱風を噴射し、  Injecting hot air toward the upper surface of the airtight terminal for the crystal unit,
前記水晶振動子用気密端子の前記水晶片が固定される前記インナーリードの金属メッキ部と前記金属環の上部表面部の金属メッキ部とに含まれる有機系添加剤を除去する工程と、  Removing the organic additive contained in the metal plating portion of the inner lead to which the crystal piece of the hermetic terminal for the crystal resonator is fixed and the metal plating portion of the upper surface portion of the metal ring;
を有することを特徴とする水晶振動子用気密端子の製造方法。  A method for manufacturing a hermetic terminal for a crystal resonator, comprising: 前記水晶振動子用気密端子をキャリアに搭載する工程において、  In the step of mounting the hermetic terminal for crystal resonator on a carrier,
前記水晶振動子用気密端子の前記インナーリードが位置する上部表面部のみをキャリア表面に露出させ、  Only the upper surface portion where the inner lead of the airtight terminal for the crystal unit is located is exposed to the carrier surface,
前記水晶振動子用気密端子の他の部位は、  The other part of the airtight terminal for the crystal unit is
前記キャリア内に埋め込むようにして搭載されることを特徴とする請求項１に記載の水晶振動子用気密端子の製造方法。  2. The method for manufacturing an airtight terminal for a crystal resonator according to claim 1, wherein the method is mounted so as to be embedded in the carrier.
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