JP4692839B2 - 軟質材封止型パワー半導体装置 - Google Patents
軟質材封止型パワー半導体装置 Download PDFInfo
- Publication number
- JP4692839B2 JP4692839B2 JP2006207926A JP2006207926A JP4692839B2 JP 4692839 B2 JP4692839 B2 JP 4692839B2 JP 2006207926 A JP2006207926 A JP 2006207926A JP 2006207926 A JP2006207926 A JP 2006207926A JP 4692839 B2 JP4692839 B2 JP 4692839B2
- Authority
- JP
- Japan
- Prior art keywords
- power semiconductor
- lead
- semiconductor element
- element chip
- semiconductor device
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L24/31—Structure, shape, material or disposition of the layer connectors after the connecting process
- H01L24/33—Structure, shape, material or disposition of the layer connectors after the connecting process of a plurality of layer connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
- Lead Frames For Integrated Circuits (AREA)
Description
第1実施形態の軟質材封止型パワー半導体装置を図1に示す。図1は、この軟質材封止型パワー半導体装置の軸方向断面図である。
第2実施形態の軟質材封止型パワー半導体装置を図3に示す。図3は、この軟質材封止型パワー半導体装置の軸方向断面図である。
第3実施形態の軟質材封止型パワー半導体装置を図4に示す。図4は、この軟質材封止型パワー半導体装置の軸方向断面図である。
第4実施形態の軟質材封止型パワー半導体装置を図5に示す。図5は、この軟質材封止型パワー半導体装置の平面図である。
2 リードヘッダ
3 パワー半導体素子チップ
4 ディスク
5 緩衝材
6〜8 はんだ層
9 軟質の封止材
21 周縁部
22 円形溝
23 中央部
24 螺旋溝
25 螺旋状の厚肉部
Claims (1)
- 両端面がそれぞれ主電極面をなすパワー半導体素子チップと、外部の冷却用金属体に固定されるとともに前記パワー半導体素子チップの一方の前記主電極面がはんだ付けされる金属製のディスクと、前記パワー半導体素子チップの一方の主電極面にはんだ付けされるリードヘッダを先端に有するリードと、少なくとも前記パワー半導体素子チップの側面及び前記2つのはんだ付け部分を封止する軟質の封止材とを備える軟質材封止型パワー半導体装置において、
前記リードヘッダは、円盤形状を成し、この円盤形状の中央部から周縁部へ向けて連続的に薄くなり、前記周縁部の径方向内側に隣接する部分に螺旋溝が多数形成され、前記中央部は互いに周方向に隣接する螺旋溝の間の螺旋状の肉部を通じて前記周縁部に連なることを特徴とする軟質材封止型パワー半導体装置。
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2006207926A JP4692839B2 (ja) | 2006-07-31 | 2006-07-31 | 軟質材封止型パワー半導体装置 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2006207926A JP4692839B2 (ja) | 2006-07-31 | 2006-07-31 | 軟質材封止型パワー半導体装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2008034698A JP2008034698A (ja) | 2008-02-14 |
JP4692839B2 true JP4692839B2 (ja) | 2011-06-01 |
Family
ID=39123800
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2006207926A Expired - Fee Related JP4692839B2 (ja) | 2006-07-31 | 2006-07-31 | 軟質材封止型パワー半導体装置 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JP4692839B2 (ja) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP6827353B2 (ja) * | 2017-03-29 | 2021-02-10 | エイブリック株式会社 | 半導体装置および電子装置 |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH04229639A (ja) * | 1990-04-30 | 1992-08-19 | Motorola Inc | 整流器およびその製造方法 |
JPH11330332A (ja) * | 1998-05-14 | 1999-11-30 | Sanken Electric Co Ltd | 半導体装置 |
JP2004214517A (ja) * | 2003-01-08 | 2004-07-29 | Hitachi Ltd | 半導体装置 |
JP2004289028A (ja) * | 2003-03-25 | 2004-10-14 | Hitachi Ltd | 半導体装置 |
Family Cites Families (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TW200527618A (en) * | 2003-11-10 | 2005-08-16 | Bosch Gmbh Robert | Diode |
-
2006
- 2006-07-31 JP JP2006207926A patent/JP4692839B2/ja not_active Expired - Fee Related
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH04229639A (ja) * | 1990-04-30 | 1992-08-19 | Motorola Inc | 整流器およびその製造方法 |
JPH11330332A (ja) * | 1998-05-14 | 1999-11-30 | Sanken Electric Co Ltd | 半導体装置 |
JP2004214517A (ja) * | 2003-01-08 | 2004-07-29 | Hitachi Ltd | 半導体装置 |
JP2004289028A (ja) * | 2003-03-25 | 2004-10-14 | Hitachi Ltd | 半導体装置 |
Also Published As
Publication number | Publication date |
---|---|
JP2008034698A (ja) | 2008-02-14 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JP4569473B2 (ja) | 樹脂封止型パワー半導体モジュール | |
KR101905995B1 (ko) | 양면냉각형 파워모듈 | |
CN109585385B (zh) | 半导体装置 | |
JPH0677353A (ja) | 応力を軽減したプラスチック・パッケージ | |
JP2005117009A (ja) | 半導体装置およびその製造方法 | |
JP2010171181A (ja) | 半導体装置 | |
WO2020241238A1 (ja) | 半導体装置 | |
JP7062082B2 (ja) | 半導体装置 | |
JP2008263210A (ja) | 電力用半導体装置 | |
US20140367842A1 (en) | Power semiconductor device and method of manufacturing the same | |
JP4994123B2 (ja) | パワー半導体モジュール | |
WO2013141154A1 (ja) | 放熱フィン付き半導体モジュール | |
JP4367376B2 (ja) | 電力半導体装置 | |
TW201349368A (zh) | 半導體裝置及其製造方法 | |
JP2002359328A (ja) | 半導体装置 | |
JP4692839B2 (ja) | 軟質材封止型パワー半導体装置 | |
JP2007227762A (ja) | 半導体装置及びこれを備えた半導体モジュール | |
JP5840102B2 (ja) | 電力用半導体装置 | |
WO2015097748A1 (ja) | 電力変換装置、及びパワーモジュール | |
JP2008211168A (ja) | 半導体装置および半導体モジュール | |
JP2008042084A (ja) | 半導体装置 | |
JP2015037151A (ja) | 半導体装置 | |
JP4961398B2 (ja) | 半導体装置 | |
JP2009010208A (ja) | 複合リードフレーム及びこの複合リードフレームを用いた半導体装置 | |
TWI395307B (zh) | Semiconductor element module and manufacturing method thereof |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20080821 |
|
A977 | Report on retrieval |
Free format text: JAPANESE INTERMEDIATE CODE: A971007 Effective date: 20100412 |
|
A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20100817 |
|
A521 | Written amendment |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20101008 |
|
TRDD | Decision of grant or rejection written | ||
A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 Effective date: 20110127 |
|
A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 |
|
A61 | First payment of annual fees (during grant procedure) |
Free format text: JAPANESE INTERMEDIATE CODE: A61 Effective date: 20110209 |
|
FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20140304 Year of fee payment: 3 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
LAPS | Cancellation because of no payment of annual fees |