JP4688673B2 - Insulating substrate for mounting electronic parts and electronic device - Google Patents

Insulating substrate for mounting electronic parts and electronic device Download PDF

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JP4688673B2
JP4688673B2 JP2005371522A JP2005371522A JP4688673B2 JP 4688673 B2 JP4688673 B2 JP 4688673B2 JP 2005371522 A JP2005371522 A JP 2005371522A JP 2005371522 A JP2005371522 A JP 2005371522A JP 4688673 B2 JP4688673 B2 JP 4688673B2
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mounting
electronic component
mounting surface
insulating substrate
electronic
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JP2007173668A (en
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浩一 平山
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Kyocera Corp
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Kyocera Corp
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Description

本発明は、加速度などの物理量を検知し、検知された物理量を電気信号に変換する機能を有する電子部品を搭載するための電子部品搭載用絶縁基体および電子装置に関する。   The present invention relates to an electronic component mounting insulating substrate and an electronic device for mounting an electronic component having a function of detecting a physical quantity such as acceleration and converting the detected physical quantity into an electrical signal.

検知された加速度を電気信号に変換する機能を有する加速度センサ素子は、半導体基板と、加速度を検知する機能を担う検知部と、検知部により検知される加速度を電気信号に変換する機能を担う電気回路とを備えており、検知部により検知される加速度に応じて電気回路により電気信号を発生させるものである。   An acceleration sensor element having a function of converting detected acceleration into an electric signal includes a semiconductor substrate, a detection unit responsible for detecting acceleration, and an electric component responsible for converting acceleration detected by the detection unit into an electrical signal. And an electric signal is generated by the electric circuit in accordance with the acceleration detected by the detection unit.

従来、上記構成の加速度センサ素子は、検知部の保護や、検知精度の向上、信頼性の確保などの観点から、加速度センサ素子を収納するためのパッケージ内に収納して加速度センサ装置（電子装置）としたうえで、測定機器や検出器、電子機器などに組み込まれて使用される。このような構成の加速度センサ装置は、例えば特許文献１に開示されている。
特開２００５−６９９４６号公報 Conventionally, the acceleration sensor element having the above-described configuration is housed in a package for housing the acceleration sensor element from the viewpoint of protecting the detection unit, improving detection accuracy, and ensuring reliability, and the like. ) And then incorporated into measurement equipment, detectors, and electronic equipment. An acceleration sensor device having such a configuration is disclosed in Patent Document 1, for example.
JP 2005-69946 A

しかしながら、従来型の加速度センサ装置において、加速度センサ素子の検知部により有効に物理量を検知できる範囲は、検知部が配置されている方向（検知部における検知面の向いている方向）に沿った方向に限られるため、例えば互いに直交する２方向で加速度の検知を行うには加速度センサ装置自体を２個、個別に設置する必要がある。また、加速度センサ装置自体を２個組み込む必要があるため、機器の小型化が困難となる場合がある。さらに、これら２個の加速度センサ装置は、それぞれを連動させるべく、各加速度センサ装置を電気的に接続する必要があるため、その結線が煩雑となるのに加え、接続部分の劣化により断線などが発生し易くなる。
However, in the conventional acceleration sensor device, the range in which the physical quantity can be effectively detected by the detection unit of the acceleration sensor element is the direction along the direction in which the detection unit is disposed (the direction in which the detection surface of the detection unit faces). since limited to, for example, two acceleration sensor device itself to do detection of acceleration in a straight intersects two directions each other, it is necessary to provide separately. In addition, since it is necessary to incorporate two acceleration sensor devices themselves, it may be difficult to reduce the size of the device. Furthermore, since these two acceleration sensor devices need to be electrically connected to each other in order to link each other, the connection becomes complicated, and also the disconnection or the like is caused by the deterioration of the connection portion. It tends to occur.

本発明は、このような事情のもとで考え出されたものであって、広範囲での物理量の検知が可能であり、長期信頼性に優れた電子部品搭載用絶縁基体および電子装置を提供することを、目的とする。   The present invention has been conceived under such circumstances, and provides an insulating substrate for mounting an electronic component and an electronic device that can detect a physical quantity in a wide range and have excellent long-term reliability. That is the purpose.

本発明の第１の側面に係る電子部品搭載用絶縁基体は、少なくとも一つの電子部品を搭載するための第１搭載面と、前記第１搭載面に直交し、且つ、少なくとも一つの電子部品を搭載するための第２搭載面と、前記第１搭載面および前記第２搭載面に交差するとともに平面視の形状がＬ字型であり、且つ、一端部において前記第１搭載面または前記第２搭載面に搭載される電子部品と電気的に接続する配線導体が電子部品搭載用絶縁基体の表面または内部を通り、該配線導体の他端部が前記電子部品搭載用絶縁基体の表面に露出している露出面と、を有することを特徴としている。ここで、「直交」とは、実質的に直交とみなせる交差状態であることを意味し、設計誤差や加工精度などに起因して生じる直交からのずれの範囲も含むことを意味する。なお、以下において「直交」と記載している場合は、特に断りがない限り、上記したものと同様の意味である。
Electronic component mounting insulating substrate according to the first aspect of the present invention includes a first mounting surface for mounting at least one electronic component, interlinked directly to the first mounting surface, and at least one electronic component A second mounting surface for mounting the first mounting surface, and the first mounting surface and the second mounting surface, and the shape in plan view is L-shaped , and at one end, the first mounting surface or the first mounting surface (2) A wiring conductor electrically connected to an electronic component mounted on the mounting surface passes through or on the surface of the electronic component mounting insulating substrate, and the other end of the wiring conductor is exposed on the surface of the electronic component mounting insulating substrate. And an exposed surface. Here, the "Cartesian" means that means that in a cross state which can be regarded as substantially perpendicular, a range from the deviation from the orthogonal resulting from such a design error or machining accuracy including. In the case that has been described as "Cartesian" in the following, a Unless otherwise noted, the same meaning as above.

本発明の第１の側面に係る電子部品搭載用絶縁基体において、前記露出面は前記第１搭載面および前記第２搭載面に直交しているのが好ましい。
In the electronic component mounting insulating substrate according to the first aspect of the present invention, preferably the exposed face is interlinked directly to the first mounting surface and the second mounting surface.

本発明の第１の側面に係る電子部品搭載用絶縁基体は、前記第１搭載面とは反対に位置し、且つ、一端部において前記第１搭載面または前記第２搭載面に搭載される電子部品と電気的に接続する配線導体が電子部品搭載用絶縁基体の表面または内部を通り、該配線導体の他端部が前記電子部品搭載用絶縁基体の表面に露出している、少なくとも一つの電子部品を搭載するための第３搭載面を更に有するのが好ましい。
The insulating base for mounting electronic components according to the first aspect of the present invention is located on the opposite side of the first mounting surface and is mounted on the first mounting surface or the second mounting surface at one end. A wiring conductor electrically connected to the component passes through or on the surface of the electronic component mounting insulating substrate, and the other end of the wiring conductor is exposed on the surface of the electronic component mounting insulating substrate. It is preferable to further have a third mounting surface for mounting the component.

本発明の第１の側面に係る電子部品搭載用絶縁基体は、前記第２搭載面とは反対に位置し、且つ、一端部において前記第１搭載面または前記第２搭載面に搭載される電子部品と電気的に接続する配線導体が電子部品搭載用絶縁基体の表面または内部を通り、該配線導体の他端部が前記電子部品搭載用絶縁基体の表面に露出している、少なくとも一つの電子部品を搭載するための第４搭載面を更に有するのが好ましい。
The electronic component mounting insulating base according to the first aspect of the present invention is located on the opposite side of the second mounting surface and is mounted on the first mounting surface or the second mounting surface at one end. A wiring conductor electrically connected to the component passes through or on the surface of the electronic component mounting insulating substrate, and the other end of the wiring conductor is exposed on the surface of the electronic component mounting insulating substrate. It is preferable to further have a fourth mounting surface for mounting components.

本発明の第２の側面に係る電子装置は、本発明の第１の側面に係る電子部品搭載用絶縁基体と、前記電子部品搭載用絶縁基体の前記第１搭載面および前記第２搭載面のそれぞれに少なくとも１つずつ搭載され、前記配線導体の前記一端部に対して電気的に接続される複数の電子部品と、を備えることを特徴としている。   An electronic device according to a second aspect of the present invention includes an electronic component mounting insulating substrate according to the first aspect of the present invention, and the first mounting surface and the second mounting surface of the electronic component mounting insulating substrate. And a plurality of electronic components that are mounted at least one each and are electrically connected to the one end of the wiring conductor.

本発明の第３の側面に係る電子装置は、本発明の第１の側面に係る電子部品搭載用絶縁基体であって第３搭載面あるいは第４搭載面を有する電子部品搭載用絶縁基体と、前記電子部品搭載用絶縁基体の前記第３搭載面のみ、前記第４搭載面のみ、あるいは、前記第３搭載面および前記第４搭載面の両方に搭載され、前記配線導体の前記他端部に対して電気的に接続される一または複数の電子部品を更に備えることを特徴としている。   An electronic device according to a third aspect of the present invention is an electronic component mounting insulating substrate according to the first aspect of the present invention, the electronic component mounting insulating substrate having a third mounting surface or a fourth mounting surface, Mounted on only the third mounting surface, only the fourth mounting surface, or both of the third mounting surface and the fourth mounting surface of the insulating base for mounting electronic components, and on the other end of the wiring conductor It is further characterized by further comprising one or a plurality of electronic components that are electrically connected to each other.

本発明の第３の側面に係る電子装置は、前記第１搭載面または前記第２搭載面に搭載される電子部品はセンサ素子を含み、前記第３搭載面または前記第４搭載面に搭載される電子部品は前記センサ素子と電気的に接続される受動素子を含むのが好ましい。   In the electronic device according to the third aspect of the present invention, the electronic component mounted on the first mounting surface or the second mounting surface includes a sensor element, and is mounted on the third mounting surface or the fourth mounting surface. Preferably, the electronic component includes a passive element electrically connected to the sensor element.

本発明の第２および第３の側面に係る電子装置は、電子部品搭載用絶縁基体と協働して電子部品を収納するための収納空間を規定する蓋体を更に備えるのが好ましい。   The electronic device according to the second and third aspects of the present invention preferably further includes a lid that defines a storage space for storing the electronic component in cooperation with the insulating base for mounting the electronic component.

本発明の第１の側面に係る電子部品搭載用絶縁基体は、少なくとも一つの電子部品を搭載するための第１搭載面と、第１搭載面に直交し、且つ、少なくとも一つの電子部品を搭載するための第２搭載面と、第１搭載面および第２搭載面に交差するとともに平面視の形状がＬ字型であり、且つ、一端部において第１搭載面または第２搭載面に搭載される電子部品と電気的に接続する配線導体が電子部品搭載用絶縁基体の表面または内部を通り、配線導体の他端部が電子部品搭載用絶縁基体の表面に露出している露出面と、を有している。そのため、本電子部品搭載用絶縁基体では、第１搭載面および第２搭載面の各々に、物理量を検知するための検知部を有する電子部品を搭載することにより、電子部品が搭載されている二つの電子部品搭載用絶縁基体（平板状）を個別に直交配置することなく、直交する２方向の物理量を適切に検知することができる。したがって、本電子部品搭載用絶縁基体は、より広範囲（例えば第１搭載面および第２搭載面の両方に直交する方向から見て約３６０°の範囲）にわたり物理量を検知することができる。
Electronic component mounting insulating substrate according to the first aspect of the present invention includes at least one first mounting surface for mounting the electronic components, interlinked directly to the first mounting surface, and at least one electronic component A second mounting surface for mounting, intersects the first mounting surface and the second mounting surface, has a L-shaped shape in plan view , and is mounted on the first mounting surface or the second mounting surface at one end. An exposed surface in which a wiring conductor electrically connected to the electronic component is passed through the surface or inside of the electronic component mounting insulating base, and the other end of the wiring conductor is exposed on the surface of the electronic component mounting insulating base ; have. Therefore, in this electronic component mounting insulating substrate, the electronic component is mounted by mounting an electronic component having a detection unit for detecting a physical quantity on each of the first mounting surface and the second mounting surface. One of the electronic component mounting insulating substrate (flat plate) to without orthogonal arrangement separately, can be appropriately detecting a physical quantity of straight interlinks two directions. Accordingly, the electronic component mounting insulating substrate, it is possible to detect the physical quantity more extensively (e.g., the first mounting surface and both in the range of look about 360 ° from the straight direction orthogonal to the second mounting surface).

また、本電子部品搭載用絶縁基体は、一端部において第１搭載面または第２搭載面に搭載される電子部品と電気的に接続する配線導体を有している。そのため、本電子部品搭載用絶縁基体では、例えば電子部品が搭載されている二つの電子部品搭載用絶縁基体（平板状）を個別に直交配置して各々を電気的に接続する場合のように、電子部品搭載用絶縁基体間の電気的接続部（例えば結線部）を設ける必要がない。このような電気的接続部は、電子部品搭載用絶縁基体外に位置しているため、相対的に劣化（ひいては断線）し易い。したがって、本電子部品搭載用絶縁基体は、相対的に劣化（ひいては断線）し易い上記電気的接続部を設けずにすむため、長期信頼性を確保するうえで好適である。加えて、本電子部品搭載用絶縁基体では、上記電気的接続部を設けるスペースを確保する必要がないため、その分の小型化を図ることができる。   The electronic component mounting insulating substrate has a wiring conductor electrically connected to the electronic component mounted on the first mounting surface or the second mounting surface at one end. Therefore, in this electronic component mounting insulating base, for example, when two electronic component mounting insulating bases (flat plate-like) on which electronic components are mounted are individually arranged orthogonally and electrically connected to each other, There is no need to provide an electrical connection (for example, a connection) between the insulating bases for mounting electronic components. Since such an electrical connection portion is located outside the electronic component mounting insulating substrate, it is relatively easily deteriorated (and thus broken). Therefore, the insulating base for mounting the electronic component is suitable for ensuring long-term reliability since it is not necessary to provide the electrical connection portion that is relatively easily deteriorated (and thus broken). In addition, in the insulating base for mounting the electronic component, since it is not necessary to secure a space for providing the electrical connection portion, the size can be reduced accordingly.

本発明の第１の側面に係る電子部品搭載用絶縁基体において露出面は第１搭載面および
第２搭載面に直交している。本構成の電子部品搭載用絶縁基体は、例えば外部回路基板に露出面が対向するように配置すると、第１搭載面に搭載される電子部品の検知部と第２搭載面に搭載される電子部品の検知部とが外部回路基板の主面に対して直交するように配置されることになる。つまり、本構成の電子部品搭載用絶縁基体は、例えば外部回路基板に露出面が対向するように配置すると、各電子部品の検知部の検知方向が外部回路基板の主面に対して平行で且つ各々が直交する方向（Ｘ−Ｙ方向）に向くことになる。したがって、本構成の電子部品搭載用絶縁基体は、搭載される外部回路基板の主面に対して平行な領域において広範囲の物理量を検知するうえで好適である。
Exposed surface in the electronic component mounting insulating substrate according to the first aspect of the present invention are interlinked directly to the first mounting surface and second mounting surface. When the insulating base for mounting electronic components of this configuration is disposed, for example, so that the exposed surface faces the external circuit board, the electronic component detecting unit mounted on the first mounting surface and the electronic component mounted on the second mounting surface of the detection unit is to be arranged in a straight intersect each with respect to the main surface of the external circuit board. In other words, when the electronic component mounting insulating base of this configuration is arranged, for example, so that the exposed surface faces the external circuit board, the detection direction of the detection part of each electronic component is parallel to the main surface of the external circuit board and each will be directed immediately interlinking direction (X-Y direction). Therefore, the electronic component mounting insulating substrate of this configuration is suitable for detecting a wide range of physical quantities in a region parallel to the main surface of the mounted external circuit board.

本発明の第１の側面に係る電子部品搭載用絶縁基体は、第１搭載面とは反対に位置し、且つ、一端部において第１搭載面または第２搭載面に搭載される電子部品と電気的に接続する配線導体が電子部品搭載用絶縁基体の表面または内部を通り、配線導体の他端部が電子部品搭載用絶縁基体の表面に露出している、少なくとも一つの電子部品を搭載するための第３搭載面を更に有している。このような構成によると、例えば第１搭載面や第２搭載面に搭載される電子部品に対して、コンデンサなどの電子部品（受動素子）を電気的に接続する必要がある場合でも、受動素子を第３搭載面に搭載することができるので、従来のように受動素子が搭載される電子部品搭載用絶縁基体を別途配置する必要がない。したがって、本構成の電子部品搭載用絶縁基体は、他の電子部品搭載用絶縁基体との間に、相対的に劣化（ひいては断線）し易い電気的接続部（例えば結線部）を設けずにすむため、長期信頼性を確保するうえで好適であるのに加え、電気的接続部を設けるスペースを確保する必要がないため、小型化を図るうえで好適である。
The electronic component mounting insulating substrate according to the first aspect of the present invention is positioned opposite to the first mounting surface and has an electrical component and an electric component mounted on the first mounting surface or the second mounting surface at one end. For mounting at least one electronic component in which the wiring conductor to be connected passes through the surface or inside of the electronic component mounting insulating base and the other end of the wiring conductor is exposed on the surface of the electronic component mounting insulating base The third mounting surface is further provided. According to such a configuration, for example, even when an electronic component (passive device) such as a capacitor needs to be electrically connected to an electronic component mounted on the first mounting surface or the second mounting surface, the passive device it is possible to mount the third mounting surface, it is not necessary to separately place the conventional electronic component mounting insulating substrate passive elements Ru mounted as. Therefore, the electronic component mounting insulating base of this configuration does not need to provide an electrical connection portion (for example, a connection portion) that is relatively deteriorated (and thus broken) between other electronic component mounting insulating bases. Therefore, in addition to being suitable for securing long-term reliability, it is not necessary to secure a space for providing an electrical connection portion, which is suitable for achieving miniaturization.

本発明の第１の側面に係る電子部品搭載用絶縁基体は、第２搭載面とは反対に位置し、且つ、一端部において第１搭載面または第２搭載面に搭載される電子部品と電気的に接続する配線導体が電子部品搭載用絶縁基体の表面または内部を通り、配線導体の他端部が電子部品搭載用絶縁基体の表面に露出している、少なくとも一つの電子部品を搭載するための第４搭載面を更に有している。このような構成によると、例えば第１搭載面や第２搭載面に搭載される電子部品に対して、コンデンサなどの電子部品（受動素子）を電気的に接続する必要がある場合で且つ第３搭載面だけでは搭載面積を充分に確保できない場合でも、受動素子を第４搭載面に搭載することができるので、従来のように受動素子が搭載される電子部品搭載用絶縁基体を別途配置する必要がない。したがって、本構成の電子部品搭載用絶縁基体は、受動素子などを比較的多数搭載する場合でも、他の電子部品搭載用絶縁基体との間に、相対的に劣化（ひいては断線）し易い電気的接続部（例えば結線部）を設けずにすむため、長期信頼性を確保するうえで好適であるのに加え、電気的接続部を設けるスペースを確保する必要がないため、小型化を図るうえで好適である。
The electronic component mounting insulating substrate according to the first aspect of the present invention is positioned opposite to the second mounting surface, and the electronic component mounted on the first mounting surface or the second mounting surface at one end and the electrical component. For mounting at least one electronic component in which the wiring conductor to be connected passes through the surface or inside of the electronic component mounting insulating base and the other end of the wiring conductor is exposed on the surface of the electronic component mounting insulating base The fourth mounting surface is further provided. According to such a configuration, for example, it is necessary to electrically connect an electronic component (passive element) such as a capacitor to the electronic component mounted on the first mounting surface or the second mounting surface, and the third. even if only mounting surface can not be sufficiently secured mounting area, it is possible to mount the passive element to the fourth mounting surface necessary to separately arranged as in the conventional electronic component mounting insulating substrate passive elements Ru mounted There is no. Therefore, the electronic component mounting insulating base of this configuration is an electrical component that is relatively easily deteriorated (and thus disconnected) with other electronic component mounting insulating bases even when a relatively large number of passive elements are mounted. Since it is not necessary to provide a connection part (for example, a connection part), in addition to being suitable for ensuring long-term reliability, it is not necessary to secure a space for providing an electrical connection part. Is preferred.

本発明の第２の側面に係る電子装置は、本発明の第１の側面に係る電子部品搭載用絶縁基体と、電子部品搭載用絶縁基体の第１搭載面および第２搭載面のそれぞれに少なくとも１つずつ搭載され、配線導体の一端部に対して電気的に接続される複数の電子部品と、を備えている。このような構成によると、第１搭載面および第２搭載面の各々に、検知部を有する電子部品を搭載することにより、電子部品が搭載されている二つの電子部品搭載用絶縁基体（平板状）を個別に直交配置することなく、直交する２方向の物理量を適切に検知することができる。したがって、本電子装置は、より広範囲（例えば第１搭載面および第２搭載面の両方に直交する方向から見て約３６０°の範囲）にわたり物理量を検知することができる。
The electronic device according to the second aspect of the present invention includes at least each of the electronic component mounting insulating base according to the first aspect of the present invention and each of the first mounting surface and the second mounting surface of the electronic component mounting insulating base. A plurality of electronic components mounted one by one and electrically connected to one end of the wiring conductor. According to such a configuration, by mounting the electronic component having the detection unit on each of the first mounting surface and the second mounting surface, two electronic component mounting insulating bases (flat plate-shaped) on which the electronic component is mounted. ) a without orthogonal arrangement separately, it can be appropriately detecting a physical quantity of straight interlinks two directions. Accordingly, the electronic device can detect the physical quantity more extensively (e.g., the first mounting surface and both in the range of look about 360 ° from the straight direction orthogonal to the second mounting surface).

また、本電子装置は、一端部において第１搭載面または第２搭載面に搭載される電子部品と電気的に接続し、電子部品搭載用絶縁基体の表面または内部を通り、他端部が露出面において電子部品搭載用絶縁基体の表面に露出する配線導体を有している。そのため、本電子装置では、例えば電子部品が搭載されている二つの電子部品搭載用絶縁基体（平板状）を個別に直交配置して各々を電気的に接続する場合のように、相対的に劣化（ひいては断線）し易い電気的接続部（例えば結線部）を設けずにすむ。したがって、本電子装置は、長期信頼性を確保するうえで好適であるのに加え、上記電気的接続部を設けるスペースを確保する必要がないため、小型化を図るうえで好適である。
In addition, the electronic device is electrically connected to an electronic component mounted on the first mounting surface or the second mounting surface at one end , passes through the surface or the inside of the electronic component mounting insulating base , and the other end is exposed. The wiring conductor exposed on the surface of the insulating base for electronic component mounting is provided on the surface . For this reason, in this electronic apparatus, for example, two electronic component mounting insulating bases (flat plates) on which electronic components are mounted are individually orthogonally arranged and electrically connected to each other. It is not necessary to provide an electrical connection part (for example, a connection part) that is easily broken (and thus disconnected). Therefore, in addition to being suitable for ensuring long-term reliability, this electronic device is suitable for achieving miniaturization because it is not necessary to secure a space for providing the electrical connection portion.

本発明の第３の側面に係る電子装置は、本発明の第１の側面に係る電子部品搭載用絶縁基体であって第３搭載面あるいは第４搭載面を有する電子部品搭載用絶縁基体と、この電子部品搭載用絶縁基体の第３搭載面のみ、第４搭載面のみ、あるいは、第３搭載面および第４搭載面の両方に搭載され、配線導体の他端部に対して電気的に接続される一または複数の電子部品を更に備えている。このような構成によると、例えば第１搭載面や第２搭載面に搭載される電子部品に対して、コンデンサなどの電子部品（受動素子）を電気的に接続する必要がある場合でも、受動素子を第３搭載面および第４搭載面のいずれか一方に搭載することができるので、従来のように受動素子が搭載される電子部品搭載用絶縁基体を別途配置する必要がない。したがって、本構成の電子装置は、他の電子部品搭載用絶縁基体との間に、相対的に劣化（ひいては断線）し易い電気的接続部（例えば結線部）を設けずにすむため、長期信頼性を確保するうえで好適であるのに加え、電気的接続部を設けるスペースを確保する必要がないため、小型化を図るうえで好適である。
An electronic device according to a third aspect of the present invention is an electronic component mounting insulating substrate according to the first aspect of the present invention, the electronic component mounting insulating substrate having a third mounting surface or a fourth mounting surface, This electronic component mounting insulating substrate is mounted only on the third mounting surface, only the fourth mounting surface, or both the third mounting surface and the fourth mounting surface, and is electrically connected to the other end of the wiring conductor. One or more electronic components. According to such a configuration, for example, even when an electronic component (passive device) such as a capacitor needs to be electrically connected to an electronic component mounted on the first mounting surface or the second mounting surface, the passive device it is possible to mount to one of the third mounting surface and a fourth mounting surface, it is not necessary to separately place the conventional electronic component mounting insulating substrate passive elements Ru mounted as. Therefore, the electronic device of this configuration does not need to provide an electrical connection portion (for example, a connection portion) that is relatively easily deteriorated (and thus disconnected) between other electronic component mounting insulating bases. In addition to being suitable for securing the property, it is not necessary to secure a space for providing the electrical connection portion, which is suitable for miniaturization.

本発明の第３の側面に係る電子装置は、第１搭載面または第２搭載面に搭載される電子部品はセンサ素子を含み、第３搭載面または第４搭載面に搭載される電子部品はセンサ素子と電気的に接続される受動素子を含んでいる。このような構成によると、センサ素子によって、より広範囲（例えば第１搭載面および第２搭載面の両方に直交する方向から見て約３６０°の範囲）にわたり物理量を検知することができるのに加え、抵抗やコンデンサなどの受動素子を本発明の電子装置内に実装できるので、例えば外部電気回路基板へ受動素子を実装するための配線導体を配設する必要がなく、配線導体による断線や短絡によるセンサ素子の誤動作の影響を抑えることができる。
In the electronic device according to the third aspect of the present invention, the electronic component mounted on the first mounting surface or the second mounting surface includes a sensor element, and the electronic component mounted on the third mounting surface or the fourth mounting surface is It includes a passive element that is electrically connected to the sensor element. According to this structure, the sensor element, to be able to detect the physical quantity more extensively (e.g., the first mounting surface and both in the range of look about 360 ° from the straight direction orthogonal to the second mounting surface) In addition, since passive elements such as resistors and capacitors can be mounted in the electronic device of the present invention, for example, there is no need to provide a wiring conductor for mounting the passive elements on an external electric circuit board, and disconnection or short circuit due to the wiring conductor. The influence of the malfunction of the sensor element due to can be suppressed.

本発明の第２および第３の側面に係る電子装置は、前記電子部品搭載用絶縁基体と協働して前記電子部品を収納するための収納空間を規定する蓋体を更に備える。本構成の電子装置は、電子部品の気密封止をより適切に行うことができるため、信頼性を高めるうえで好適である。   The electronic device according to the second and third aspects of the present invention further includes a lid that defines a storage space for storing the electronic component in cooperation with the electronic component mounting insulating base. The electronic device having this configuration is suitable for improving the reliability because the electronic component can be hermetically sealed.

図１は本発明の実施形態に係る電子部品搭載用絶縁基体を備える電子装置Ｘを表し、（ａ）は下方から見た斜視図であり、（ｂ）は（ａ）と反対側の下方から見た斜視図である。電子装置Ｘは、電子部品搭載用絶縁基体１０、電子部品２０、電子部品３０、および配線導体４０を備える。
FIG. 1 shows an electronic device X including an electronic component mounting insulating base according to an embodiment of the present invention, in which (a) is a perspective view seen from below, and (b) is from the lower side opposite to (a). FIG. The electronic device X includes an electronic component mounting insulating substrate 10, an electronic component 20, an electronic component 30, and a wiring conductor 40 .

電子部品搭載用絶縁基体１０は、搭載面１１、搭載面１２、搭載面１３、および搭載面１４、および露出面１５を有しており、平面視Ｌ字状に構成されている。搭載面１１は、電子部品２０を搭載するための部位であり、ｘ軸の正方向を向くように構成されている。搭載面１２は、電子部品２０を搭載するための部位であり、ｘ軸に略直交するｙ軸の正方向を向くように構成されている。搭載面１３は、電子部品３０を搭載するための部位であり、ｙ軸の負方向（搭載面１１とは反対方向）を向くように構成されている。搭載面１４は、電子部品３０を搭載するための部位であり、ｘ軸の負方向（搭載面１２とは反対方向）を向くように構成されている。露出面１５は、後述する配線導体４０の他端部を露出させるための部位であり、ｚ軸の正方向（各搭載面１１〜１４と直交する方向）を向くように構成されている。
Electronic component mounting insulating base 10, mounting surface 11, mounting surface 12 has a mounting surface 13 and mounting surface 14 and the exposed surface 15, it is constructed on a flat surface an L-shape. The mounting surface 11 is a part for mounting the electronic component 20 and is configured to face the positive direction of the x axis. The mounting surface 12 is a part for mounting the electronic component 20 and is configured to face the positive direction of the y-axis substantially orthogonal to the x-axis. The mounting surface 13 is a part for mounting the electronic component 30 and is configured to face the negative direction of the y axis (the direction opposite to the mounting surface 11). The mounting surface 14 is a part for mounting the electronic component 30 and is configured to face the negative direction of the x axis (the direction opposite to the mounting surface 12). Exposed surface 15 is a part for exposing the other end of the wiring conductor 40 to be described later, is configured to face forward (the mounting surface 11 to 14 straight direction orthogonal) of the z-axis.

電子部品搭載用絶縁基体１０を構成する材料としては、酸化アルミニウム質焼結体（アルミナセラミックス）、窒化アルミニウム質焼結体（窒化アルミニウムセラミックス）、炭化珪素質焼結体（炭化珪素セラミックス）、窒化珪素質焼結体（窒化珪素セラミックス）、ガラス質焼結体（ガラスセラミックス）、ムライト質焼結体などのセラミックスや、エポキシ樹脂、ポリイミド樹脂、アクリル樹脂、フェノール樹脂、ポリエステル樹脂などの熱硬化型または紫外線硬化型の樹脂、セラミックスなどの無機材料と樹脂との複合材料などが挙げられる。   The materials constituting the electronic component mounting insulating substrate 10 include aluminum oxide sintered bodies (alumina ceramics), aluminum nitride sintered bodies (aluminum nitride ceramics), silicon carbide sintered bodies (silicon carbide ceramics), and nitriding. Thermosetting type such as ceramics such as silicon sintered body (silicon nitride ceramics), glassy sintered body (glass ceramics), mullite sintered body, epoxy resin, polyimide resin, acrylic resin, phenol resin, polyester resin Alternatively, an ultraviolet curable resin, a composite material of an inorganic material such as ceramics, and a resin can be given.

ここで、電子部品搭載用絶縁基体１０を構成する材料としてガラスセラミックスを採用した場合における電子部品搭載用絶縁基体１０の作製方法の一例について説明する。まず、
セラミックスやガラスなどの原料粉末を有機溶剤やバインダなどとともにシート状に成形して複数のセラミックグリーンシートを作製する。次に、作製されたセラミックグリーンシートを搭載面１３および搭載面１４を構成可能な所定寸法の四角形状に金型で打ち抜き、打抜きシートを作製する。次に、打ち抜きシートを所定寸法まで積層したうえで所定の焼成温度（例えば約１０００℃）で焼成し焼成体を形成する。次に、形成された焼成体を所望の形状（平面視Ｌ字型）となるように所定の切断手段（例えば、ダイシングカット法やレーザーカット法）により切断する。焼成体を平面視Ｌ字型に切断する方法としては、ダイシングカット法で切断する場合、搭載面１３および搭載面１４を構成可能な所定寸法を金型にて四角形状に打ち抜かれた一辺を基準として切断する方法が挙げられる。以上のようにして、電子部品搭載用絶縁基体１０は作製される。なお、電子部品搭載用絶縁基体１０を構成する材料として樹脂を採用した場合、この樹脂を所定の成形方法（例えば、射出成形やトランスファ成形）で成形することにより作製することができる。 Here, an example of a manufacturing method of the electronic component mounting insulating substrate 10 in the case where glass ceramics is adopted as a material constituting the electronic component mounting insulating substrate 10 will be described. First,
A plurality of ceramic green sheets are produced by forming raw material powders such as ceramics and glass into a sheet with an organic solvent and a binder. Next, the produced ceramic green sheet is punched with a die into a rectangular shape having a predetermined dimension capable of constituting the mounting surface 13 and the mounting surface 14 to produce a punched sheet. Next, the punched sheet is laminated to a predetermined size and then fired at a predetermined firing temperature (for example, about 1000 ° C.) to form a fired body. Next, the formed fired body is cut by a predetermined cutting means (for example, a dicing cut method or a laser cut method) so as to have a desired shape (L shape in plan view). As a method of cutting the fired body into an L shape in plan view, when cutting by a dicing cut method, a predetermined dimension capable of configuring the mounting surface 13 and the mounting surface 14 is based on one side punched out into a square shape by a mold. And a method of cutting. In this way, the electronic component mounting insulating substrate 10 is manufactured. In addition, when resin is employ | adopted as a material which comprises the insulation base | substrate 10 for electronic component mounting, it can produce by shape | molding this resin with a predetermined molding method (for example, injection molding or transfer molding).

電子部品２０は、検知部２１および導電部（図示せず）を有し、検知部２１により検知される物理量を電気信号に変換するためのものである。ここで、物理量とは、長さ［ｍ：メートル］、質量［ｋｇ：キログラム］、時間［ｓ：秒］、電流［Ａ：アンペア］、温度［Ｋ：ケルビン］、物質量［ｍｏｌ：モル］、および光度［ｃｄ：カンデラ］といった基本単位や、平面角［ｒａｄ：ラジアン］および立体角［ｓｒ：ステラジアン］といった補助単位を組み立ててなる組立単位（例えば、加速度や磁束密度）により表すことができる量を意味する。なお、電子部品２０は、例えば半導体基板の主面に機械素子（ＭＥＭＳ：Micro Electro Mechanical Systems）などを設けることにより作製される。半導体基板を構成する材料としては、シリコン、ゲルマニウム、ダイヤモンド、ガリウム砒素、窒化ガリウム、インジウム、インジウム−アンチモンなどが挙げられる。   The electronic component 20 includes a detection unit 21 and a conductive unit (not shown), and converts a physical quantity detected by the detection unit 21 into an electrical signal. Here, the physical quantity means length [m: meter], mass [kg: kilogram], time [s: second], current [A: ampere], temperature [K: Kelvin], substance amount [mol: mol]. And a basic unit such as luminous intensity [cd: candela] and an assembly unit (for example, acceleration or magnetic flux density) formed by assembling auxiliary units such as plane angle [rad: radian] and solid angle [sr: steradian]. Means quantity. Note that the electronic component 20 is manufactured, for example, by providing a mechanical element (MEMS: Micro Electro Mechanical Systems) on the main surface of a semiconductor substrate. Examples of the material constituting the semiconductor substrate include silicon, germanium, diamond, gallium arsenide, gallium nitride, indium, and indium-antimony.

検知部２１は、測定対象から入力される物理量を検知するためのものであり、電子部品２０を構成する基板（例えば、半導体基板）の主面に設けられている。測定対象としては、例えば加速度成分、角速度あるいは角加速度成分を含有するものが挙げられる。   The detection unit 21 is for detecting a physical quantity input from a measurement target, and is provided on the main surface of a substrate (for example, a semiconductor substrate) constituting the electronic component 20. Examples of the measurement object include those containing an acceleration component, an angular velocity, or an angular acceleration component.

ここで、検知部２１として、半導体基板の微小加工技術により形成された梁状振動体（図示せず）を含んでなる機械素子と、機械素子における梁状振動体と半導体基板との間の離間距離の変動を、静電容量の変動として捉える容量電極とを有し、加速度成分や角速度成分を検知するため機能を担うものを採用してなる電子部品２０による物理量の検知の流れの一例について説明する。まず、検知部２１に作用する垂直方向の加速度に応じて、機械素子における梁状振動体が動く。次に、梁状振動体の動きに応じて生じる容量の変化を検知する。次に、検知した容量変化を電気信号として電子部品２０の外部に伝播する。以上により、検知部２１に作用した加速度の大きさを検知することができる。なお、発生する電気信号が非常に小さい場合は、増幅器や増幅回路などにより増幅するようにしてもよい。   Here, as the detection unit 21, a mechanical element including a beam-like vibrating body (not shown) formed by a microfabrication technique for a semiconductor substrate, and a separation between the beam-like vibrating body and the semiconductor substrate in the mechanical element. A description will be given of an example of a physical quantity detection flow by the electronic component 20 that has a capacitive electrode that captures a change in distance as a change in capacitance and that has a function to detect an acceleration component or an angular velocity component. To do. First, the beam-like vibrating body in the mechanical element moves according to the vertical acceleration acting on the detection unit 21. Next, a change in capacitance that occurs according to the movement of the beam-like vibrating body is detected. Next, the detected capacitance change is propagated to the outside of the electronic component 20 as an electrical signal. As described above, the magnitude of acceleration acting on the detection unit 21 can be detected. If the generated electric signal is very small, it may be amplified by an amplifier or an amplifier circuit.

電子部品３０は、供給される電力を消費、蓄積、放出する機能を担う受動素子を含んでなる部材であり、図面上、搭載面１３上に六つ、搭載面１４上に四つ配設されている。受動素子としては、抵抗器、コンデンサ、インダクタ、変圧器、圧電素子、水晶発振子などが挙げられる。なお、電子部品搭載用絶縁基体１０における各搭載面１１〜１４に対する電子部品２０，３０の接合は、Ａｕ−Ｓｉ、Ａｕ−Ｇｅ、Ｓｎ−Ｐｂ共晶はんだなどのロウ材や、Ａｇ粒子とエポキシ系樹脂やポリイミド系樹脂とを混合してなる接着剤、エポキシ系樹脂、銀粒子とガラスとを混合してなる銀ガラスなどの接合材（図示せず）を用いて行われる。   The electronic component 30 is a member including passive elements that have functions of consuming, storing, and releasing the supplied power. Six electronic components 30 are arranged on the mounting surface 13 and four on the mounting surface 14 in the drawing. ing. Examples of the passive element include a resistor, a capacitor, an inductor, a transformer, a piezoelectric element, and a crystal oscillator. The electronic components 20 and 30 are bonded to the mounting surfaces 11 to 14 of the electronic component mounting insulating substrate 10 by brazing materials such as Au-Si, Au-Ge, Sn-Pb eutectic solder, Ag particles and epoxy. It is performed using a bonding material (not shown) such as an adhesive formed by mixing a resin based on polyimide or a polyimide resin, an epoxy resin, or silver glass formed by mixing silver particles and glass.

配線導体４０は、接続端子部４１を有しており、各電子部品２０，３０と外部（例えば外部電気回路基板）との間の電気的導通を得るための部材である。また、配線導体４０の形態としては、メタライズ層状、めっき層状、蒸着層状、金属箔層状などが挙げられる。接続端子部４１は、導電性接続材（例えば、はんだ）を介して外部電気回路基板（図示せず）に電気的接続される部位であり、露出面１５において露出するように形成されている。配線導体４０を構成する材料としては、タングステン、モリブデン、マンガン、銅、銀、パラジウム、白金、金などの金属材料が挙げられる。   The wiring conductor 40 has a connection terminal portion 41, and is a member for obtaining electrical continuity between the electronic components 20 and 30 and the outside (for example, an external electric circuit board). Moreover, as a form of the wiring conductor 40, metallized layer shape, plating layer shape, vapor deposition layer shape, metal foil layer shape, etc. are mentioned. The connection terminal portion 41 is a portion that is electrically connected to an external electric circuit board (not shown) via a conductive connection material (for example, solder), and is formed so as to be exposed at the exposed surface 15. Examples of the material constituting the wiring conductor 40 include metal materials such as tungsten, molybdenum, manganese, copper, silver, palladium, platinum, and gold.

ここで、配線導体４０を構成する材料としてタングステンを採用するとともに、配線導体４０の形態をメタライズ層状にした場合における配線導体４０の形成方法の一例について説明する。まず、タングステン粉末を有機溶剤やバインダなどとともに混練して金属ペーストを作製する。次に、作製された金属ペーストを所定の印刷方法（例えば、スクリーン印刷法）により電子部品搭載用絶縁基体１０を構成するセラミックグリーンシートの表面あるいはビア用貫通孔に対して印刷する。以上のようにして、配線導体４０は形成される。なお、配線導体４０における露出表面に対しては、さらにめっき層（例えば、金めっきや錫めっき）を形成してもよい。   Here, an example of a method of forming the wiring conductor 40 when tungsten is adopted as a material constituting the wiring conductor 40 and the wiring conductor 40 is formed in a metallized layer shape will be described. First, a tungsten paste is kneaded with an organic solvent, a binder, etc., and a metal paste is produced. Next, the produced metal paste is printed on the surface of the ceramic green sheet constituting the electronic component mounting insulating substrate 10 or the via through-hole by a predetermined printing method (for example, screen printing method). The wiring conductor 40 is formed as described above. A plating layer (for example, gold plating or tin plating) may be further formed on the exposed surface of the wiring conductor 40.

本実施形態に係る電子部品搭載用絶縁基体１０は、一つの電子部品２０が搭載される搭載面１１と、搭載面１１に直交し、且つ、一つの電子部品２０が搭載される搭載面１２と、搭載面１１および搭載面１２に直交し、且つ、一端部において搭載面１１および搭載面
１２に搭載される電子部品２０と電気的に接続する配線導体４０の他端部が露出している露出面１５と、を有している。そのため、電子部品搭載用絶縁基体１０では、搭載面１１および搭載面１２の各々に、物理量を検知するための検知部２１を有する電子部品２０を搭載することにより、電子部品２０が各々搭載されている二つの電子部品搭載用絶縁基体（平板状）を個別に直交配置することなく、直交する２方向の物理量を適切に検知することができる。したがって、電子部品搭載用絶縁基体１０は、より広範囲（例えば搭載面１１および搭載面１２の両方に直交する方向から見て約３６０°の範囲）にわたり物理量を検知することができる。
Electronic component mounting insulating substrate 10 according to this embodiment includes a mounting surface 11 that one of the electronic component 20 is Ru are mounted, interlinked directly on the mounting surface 11, and, mounting surface 12 in which one of the electronic component 20 Ru mounted If, interlinked directly on the mounting surface 11 and mounting surface 12, and, to expose the other end of the mounting surface 11 and the mounting surface the electronic component 20 that will be mounted on the 12 and the wiring conductor 40 which electrically connects at one end And an exposed surface 15. Therefore, in the electronic component mounting insulating substrate 10, the electronic component 20 is mounted on each of the mounting surface 11 and the mounting surface 12 by mounting the electronic component 20 having the detection unit 21 for detecting a physical quantity. without orthogonal disposed separately two electronic component mounting insulating substrate (flat plate) which are, it is possible to appropriately detect the physical quantity of straight interlinks two directions. Therefore, the electronic component mounting insulating substrate 10 can detect the physical quantity more extensively (e.g. mounting surface 11 and both the range of about 360 ° as viewed from the straight direction orthogonal mounting surface 12).

また、電子部品搭載用絶縁基体１０は、一端部において搭載面１１および搭載面１２に搭載される電子部品２０と電気的に接続する配線導体４０を有している。そのため、電子部品搭載用絶縁基体１０では、例えば電子部品２０が搭載されている二つの電子部品搭載用絶縁基体（平板状）を個別に直交配置して各々を電気的に接続する場合のように、電子部品搭載用絶縁基体間の電気的接続部（例えば結線部）を設ける必要がない。このような電気的接続部は、電子部品搭載用絶縁基体外に位置しているため、相対的に劣化（ひいては断線）し易い。したがって、電子部品搭載用絶縁基体１０は、相対的に劣化（ひいては断線）し易い上記電気的接続部を設けずにすむため、長期信頼性を確保することができる。加えて、電子部品搭載用絶縁基体１０では、上記電気的接続部を設けるスペースを確保する必要がないため、その分の小型化を図ることができる。   In addition, the electronic component mounting insulating base 10 has a wiring conductor 40 that is electrically connected to the mounting surface 11 and the electronic component 20 mounted on the mounting surface 12 at one end. Therefore, in the electronic component mounting insulating base 10, for example, as in the case where two electronic component mounting insulating bases (flat plates) on which the electronic component 20 is mounted are individually arranged orthogonally and each is electrically connected. It is not necessary to provide an electrical connection part (for example, a connection part) between the insulating bases for mounting electronic parts. Since such an electrical connection portion is located outside the electronic component mounting insulating substrate, it is relatively easily deteriorated (and thus broken). Therefore, the electronic component mounting insulating substrate 10 does not need to be provided with the electrical connection portion that is relatively easily deteriorated (and thus disconnected), and thus long-term reliability can be ensured. In addition, in the electronic component mounting insulating base 10, it is not necessary to secure a space for providing the electrical connection portion, and therefore the size can be reduced accordingly.

電子部品搭載用絶縁基体１０において露出面１５は搭載面１１および搭載面１２に直交している。電子部品搭載用絶縁基体１０は、例えば外部の回路基板に露出面１５が対向するように配置すると、搭載面１１に搭載される電子部品２０の検知部２１と搭載面１２に搭載される電子部品２０の検知部２１とが該回路基板の主面に対して直交するように配置されることになる。つまり、電子部品搭載用絶縁基体１０は、上記回路基板に露出面１５が対向するように配置すると、各電子部品２０の検知部２１の検知方向が該回路基板の主面に対して平行で且つ各々が直交する方向（Ｘ−Ｙ方向）に向くことになる。したがって、電子部品搭載用絶縁基体１０は、搭載される外部の回路基板の主面に対して平行な領域において広範囲の物理量を検知することができる。
Exposed surface 15 in the electronic component mounting insulating base 10 it is interlinked directly on the mounting surface 11 and mounting surface 12. When the electronic component mounting insulating substrate 10 is disposed, for example, so that the exposed surface 15 faces an external circuit board, the electronic component 20 mounted on the mounting surface 12 and the detection unit 21 of the electronic component 20 mounted on the mounting surface 11. so that is a detection unit 21 of the 20 are arranged in a straight intersect each with respect to the main surface of the circuit board. In other words, when the electronic component mounting insulating base 10 is arranged so that the exposed surface 15 faces the circuit board, the detection direction of the detection unit 21 of each electronic component 20 is parallel to the main surface of the circuit board and each will be directed immediately interlinking direction (X-Y direction). Therefore, the electronic component mounting insulating substrate 10 can detect a wide range of physical quantities in a region parallel to the main surface of the external circuit board to be mounted.

電子部品搭載用絶縁基体１０は、搭載面１１とは反対に位置し、且つ、一端部において搭載面１１および搭載面１２に搭載される電子部品２０と電気的に接続する配線導体４０の他端部が露出している、六つの電子部品３０が搭載される搭載面１３を有している。このような構成によると、例えば搭載面１１や搭載面１２に搭載される電子部品２０に対して、電子部品３０を電気的に接続する必要がある場合でも、電子部品３０を搭載面１３に搭載することができるので、従来のように電子部品３０が搭載される電子部品搭載用絶縁基体を別途配置する必要がない。したがって、電子部品搭載用絶縁基体１０は、他の電子部品搭載用絶縁基体との間に、相対的に劣化（ひいては断線）し易い電気的接続部（例えば結線部）を設けずにすむため、長期信頼性を確保することができるのに加え、電気的接続部を設けるスペースを確保する必要がないため、小型化を図ることができる。
The electronic component mounting insulating substrate 10 is positioned opposite to the mounting surface 11 and has the other end of the wiring conductor 40 electrically connected to the electronic component 20 mounted on the mounting surface 11 and the mounting surface 12 at one end. parts are exposed, six of the electronic component 30 has a mounting surface 13 that will be mounted. According to such a configuration, for example, even when the electronic component 30 needs to be electrically connected to the electronic component 20 mounted on the mounting surface 11 or the mounting surface 12, the electronic component 30 is mounted on the mounting surface 13. it is possible to, it is not necessary to separately place the electronic component mounting insulating substrate prior electronic component 30 as is Ru are mounted. Therefore, the electronic component mounting insulating base 10 does not have to be provided with an electrical connection portion (for example, a connection portion) that is relatively easily deteriorated (and thus disconnected) between other electronic component mounting insulating bases. In addition to ensuring long-term reliability, it is not necessary to secure a space for providing an electrical connection portion, so that downsizing can be achieved.

電子部品搭載用絶縁基体１０は、搭載面１２とは反対に位置し、且つ、一端部において搭載面１１および搭載面１２に搭載される電子部品２０と電気的に接続する配線導体４０
の他端部が露出している、四つの電子部品３０が搭載される搭載面１４を有している。このような構成によると、例えば搭載面１１や搭載面１２に搭載される電子部品２０に対して、電子部品３０を電気的に接続する必要がある場合で且つ搭載面１３だけでは搭載面積を充分に確保できない場合でも、電子部品３０を搭載面１４に搭載することができるので、従来のように電子部品３０が搭載される電子部品搭載用絶縁基体を別途配置する必要がない。したがって、電子部品搭載用絶縁基体１０は、電子部品３０を比較的多数搭載する場合でも、他の電子部品搭載用絶縁基体との間に、相対的に劣化（ひいては断線）し易い電気的接続部（例えば結線部）を設けずにすむため、長期信頼性を確保することができるのに加え、電気的接続部を設けるスペースを確保する必要がないため、小型化を図ることができる。
The electronic component mounting insulating substrate 10 is positioned opposite to the mounting surface 12 and has a wiring conductor 40 electrically connected to the mounting surface 11 and the electronic component 20 mounted on the mounting surface 12 at one end.
The other end of the are exposed, four electronic components 30 has a mounting surface 14 that will be mounted. According to such a configuration, for example, when it is necessary to electrically connect the electronic component 30 to the electronic component 20 mounted on the mounting surface 11 or the mounting surface 12, the mounting surface 13 alone has a sufficient mounting area. even when not secured to, it is possible to mount the electronic component 30 on the mounting surface 14, it is not necessary to separately place the conventional electronic component mounting insulating substrate on which the electronic components 30 Ru mounted as. Therefore, even when a relatively large number of electronic components 30 are mounted, the electronic component mounting insulating base 10 is relatively easily deteriorated (and thus disconnected) between other electronic component mounting insulating bases. Since it is not necessary to provide a connection portion (for example, a connection portion), it is possible to ensure long-term reliability, and in addition, it is not necessary to secure a space for providing an electrical connection portion.

本実施形態に係る電子装置Ｘは、電子部品搭載用絶縁基体１０と、電子部品搭載用絶縁基体１０の搭載面１１および搭載面１２のそれぞれに一つずつ搭載され、配線導体４０の一端部に対して電気的に接続される二つの電子部品２０と、を備えている。このような構成によると、搭載面１１および搭載面１２の各々に、検知部２１を有する電子部品２０を搭載することにより、電子部品２０が搭載されている二つの電子部品搭載用絶縁基体（平板状）を個別に直交配置することなく、直交する２方向の物理量を適切に検知することができる。したがって、電子装置Ｘは、より広範囲（例えば第１搭載面および第２搭載面の両方に直交する方向から見て約３６０°の範囲）にわたり物理量を検知することができる。
The electronic device X according to the present embodiment is mounted on each of the electronic component mounting insulating base 10 and the mounting surface 11 and mounting surface 12 of the electronic component mounting insulating base 10, and is attached to one end of the wiring conductor 40. And two electronic components 20 that are electrically connected to each other. According to such a configuration, by mounting the electronic component 20 having the detection unit 21 on each of the mounting surface 11 and the mounting surface 12, two electronic component mounting insulating bases (flat plates) on which the electronic component 20 is mounted. without the Jo) perpendicular separately arranged, it is possible to appropriately detect the physical quantity of straight interlinks two directions. Therefore, the electronic device X is capable of detecting a physical quantity more extensively (e.g., the first mounting surface and both in the range of look about 360 ° from the straight direction orthogonal to the second mounting surface).

また、電子装置Ｘは、一端部において搭載面１１または搭載面１２に搭載される電子部品２０と電気的に接続し、且つ、他端部が露出面１５において露出する配線導体４０を有している。そのため、電子装置Ｘでは、例えば電子部品２０が搭載されている二つの電子部品搭載用絶縁基体（平板状）を個別に直交配置して各々を電気的に接続する場合のように、相対的に劣化（ひいては断線）し易い電気的接続部（例えば結線部）を設けずにすむ。したがって、電子装置Ｘは、長期信頼性を確保するうえで好適であるのに加え、上記電気的接続部を設けるスペースを確保する必要がないため、小型化を図ることができる。   In addition, the electronic device X includes a wiring conductor 40 that is electrically connected to the electronic component 20 mounted on the mounting surface 11 or the mounting surface 12 at one end and is exposed at the exposed surface 15 at the other end. Yes. Therefore, in the electronic apparatus X, for example, as in the case where two electronic component mounting insulating bases (flat plates) on which the electronic component 20 is mounted are individually orthogonally arranged and each is electrically connected, It is not necessary to provide an electrical connection portion (for example, a connection portion) that is likely to deteriorate (and eventually break). Accordingly, the electronic device X is suitable for ensuring long-term reliability, and in addition, it is not necessary to secure a space for providing the electrical connection portion, so that the electronic device X can be reduced in size.

電子装置Ｘは、電子部品搭載用絶縁基体１０と、搭載面１３および搭載面１４の両方に搭載され、配線導体４０の他端部に対して電気的に接続される合計１０個の電子部品３０を備えている。このような構成によると、例えば搭載面１１や搭載面１２に搭載される電子部品２０に対して、電子部品３０を電気的に接続する必要がある場合でも、電子部品３０を搭載面１３および搭載面１４に搭載することができるので、従来のように電子部品３０が搭載される電子部品搭載用絶縁基体を別途配置する必要がない。したがって、電子装置Ｘは、他の電子部品搭載用絶縁基体との間に、相対的に劣化（ひいては断線）し易い電気的接続部（例えば結線部）を設けずにすむため、長期信頼性を確保することができるのに加え、電気的接続部を設けるスペースを確保する必要がないため、小型化を図ることができる。
The electronic device X is mounted on both the electronic component mounting insulating substrate 10 and both the mounting surface 13 and the mounting surface 14 and is electrically connected to the other end of the wiring conductor 40 in total 10 electronic components 30. It has. According to such a configuration, for example, even when it is necessary to electrically connect the electronic component 30 to the electronic component 20 mounted on the mounting surface 11 or the mounting surface 12, the electronic component 30 is mounted on the mounting surface 13 and the mounting surface. it is possible to mount on the surface 14, it is not necessary to separately place the electronic component mounting insulating substrate prior electronic component 30 as is Ru are mounted. Therefore, since the electronic device X does not need to provide an electrical connection portion (for example, a connection portion) that is relatively easily deteriorated (and thus disconnected) between other electronic component mounting insulating bases, long-term reliability is ensured. In addition to being able to be secured, it is not necessary to secure a space for providing an electrical connection portion, so that the size can be reduced.

以上、本発明の具体的な実施形態を示したが、本発明はこれに限定されるものではなく、発明の思想から逸脱しない範囲内で種々の変更が可能である。   Although specific embodiments of the present invention have been described above, the present invention is not limited to these embodiments, and various modifications can be made without departing from the spirit of the invention.

電子装置Ｘは、電子部品搭載用絶縁基体１０と協働して電子部品２０，３０を収納するための収納空間を規定する蓋体を更に備えていてもよい。このような構成によると、電子部品２０，３０の気密封止をより適切に行うことができるため、信頼性を高めることができる。   The electronic device X may further include a lid that defines a storage space for storing the electronic components 20 and 30 in cooperation with the electronic component mounting insulating base 10. According to such a structure, since the airtight sealing of the electronic components 20 and 30 can be performed more appropriately, reliability can be improved.

電子装置Ｘにおいて電子部品２０は、電子部品搭載用絶縁基体１０の搭載面１１や搭載面１２に搭載してもよい。また、電子装置Ｘにおいて電子部品３０は、電子部品搭載用絶縁基体１０の搭載面１３や搭載面１４に搭載してもよい。   In the electronic device X, the electronic component 20 may be mounted on the mounting surface 11 or the mounting surface 12 of the electronic component mounting insulating substrate 10. In the electronic device X, the electronic component 30 may be mounted on the mounting surface 13 or the mounting surface 14 of the electronic component mounting insulating substrate 10.

電子装置Ｘにおいて電子部品搭載用絶縁基体１０の露出面１５は、ｚ軸の正方向（各搭載面１１〜１４と直交する方向）に対して傾斜する方向を向くように構成されていてもよい。 Exposed surface 15 of the electronic component mounting insulating substrate 10 in the electronic device X may be configured to face a direction that is inclined with respect to the positive direction (the mounting surface 11 to 14 straight direction orthogonal) of the z-axis Good.

電子装置Ｘにおいて電子部品搭載用絶縁基体１０の各搭載面１１〜１４は、電子部品２０，３０の少なくとも一部を収容するための凹部を有していてもよい。このような構成は、電子装置Ｘの小型化を図るうえで好適である。   In the electronic device X, each mounting surface 11 to 14 of the electronic component mounting insulating base 10 may have a recess for accommodating at least a part of the electronic components 20 and 30. Such a configuration is suitable for reducing the size of the electronic device X.

本発明の実施形態に係る電子部品搭載用絶縁基体を備える電子装置を表し、（ａ）は下方から見た斜視図であり、（ｂ）は（ａ）とは反対の下方から見た斜視図である。1 represents an electronic device including an electronic component mounting insulating base according to an embodiment of the present invention, (a) is a perspective view seen from below, and (b) is a perspective view seen from below opposite to (a). It is.

符号の説明Explanation of symbols

Ｘ 電子装置
１０ 電子部品搭載用絶縁基体
１１ 搭載面（第１搭載面）
１２ 搭載面（第２搭載面）
１３ 搭載面（第３搭載面）
１４ 搭載面（第４搭載面）
２０ 電子部品
２１ 検知部
３０ 電子部品
４０ 配線導体
４１ 接続端子部 X Electronic device 10 Insulating substrate 11 for mounting electronic components Mounting surface (first mounting surface)
12 Mounting surface (second mounting surface)
13 Mounting surface (third mounting surface)
14 Mounting surface (4th mounting surface)
20 Electronic component 21 Detection unit 30 Electronic component 40 Wiring conductor 41 Connection terminal portion

Claims (8)

少なくとも一つの電子部品を搭載するための第１搭載面と、
前記第１搭載面に直交し、且つ、少なくとも一つの電子部品を搭載するための第２搭載面と、
前記第１搭載面および前記第２搭載面に交差するとともに平面視の形状がＬ字型であり、且つ、一端部において前記第１搭載面または前記第２搭載面に搭載される電子部品と電気的に接続する配線導体が電子部品搭載用絶縁基体の表面または内部を通り、該配線導体の他端部が前記電子部品搭載用絶縁基体の表面に露出している露出面と、を有することを特徴とする、電子部品搭載用絶縁基体。 A first mounting surface for mounting at least one electronic component;
Interlinked directly to the first mounting surface, and a second mounting surface for mounting at least one electronic component,
The first mounting surface and the second mounting surface intersect with each other, and the shape in plan view is L-shaped, and an electronic component and an electric component mounted on the first mounting surface or the second mounting surface at one end portion A wiring conductor to be electrically connected passes through the surface or inside of the electronic component mounting insulating substrate, and the other end of the wiring conductor is exposed on the surface of the electronic component mounting insulating substrate. An insulating substrate for mounting electronic components. 前記露出面は前記第１搭載面および前記第２搭載面に直交している、請求項１に記載の電子部品搭載用絶縁基体。 The exposed surface is interlinked directly to the first mounting surface and the second mounting surface, an electronic component mounting insulating substrate according to claim 1. 前記第１搭載面とは反対に位置し、且つ、一端部において前記第１搭載面または前記第２搭載面に搭載される電子部品と電気的に接続する配線導体が電子部品搭載用絶縁基体の表面または内部を通り、該配線導体の他端部が前記電子部品搭載用絶縁基体の表面に露出している、少なくとも一つの電子部品を搭載するための第３搭載面を更に有する、請求項１または２に記載の電子部品搭載用絶縁基体。 A wiring conductor that is located opposite to the first mounting surface and is electrically connected to an electronic component mounted on the first mounting surface or the second mounting surface at one end of the insulating substrate for mounting the electronic component 2. A third mounting surface for mounting at least one electronic component, wherein the other end portion of the wiring conductor passes through the surface or the inside and is exposed on the surface of the electronic component mounting insulating base. Or an insulating substrate for mounting electronic components according to 2; 前記第２搭載面とは反対に位置し、且つ、一端部において前記第１搭載面または前記第２搭載面に搭載される電子部品と電気的に接続する配線導体が電子部品搭載用絶縁基体の表面または内部を通り、該配線導体の他端部が前記電子部品搭載用絶縁基体の表面に露出している、少なくとも一つの電子部品を搭載するための第４搭載面を更に有する、請求項３に記載の電子部品搭載用絶縁基体。 A wiring conductor that is located opposite to the second mounting surface and that is electrically connected to the electronic component mounted on the first mounting surface or the second mounting surface at one end portion of the insulating substrate for mounting the electronic component. 4. A fourth mounting surface for mounting at least one electronic component, wherein the other end portion of the wiring conductor is exposed on the surface of the electronic component mounting insulating base , passing through the surface or the inside. An insulating substrate for mounting electronic components as described in 1. 請求項１から４のいずれかに記載の電子部品搭載用絶縁基体と、
前記電子部品搭載用絶縁基体の前記第１搭載面および前記第２搭載面のそれぞれに少なくとも１つずつ搭載され、前記配線導体の前記一端部に対して電気的に接続される複数の電子部品と、を備えることを特徴とする、電子装置。 An insulating base for electronic component mounting according to any one of claims 1 to 4,
A plurality of electronic components mounted on at least one of the first mounting surface and the second mounting surface of the electronic component mounting insulating base and electrically connected to the one end of the wiring conductor; An electronic device comprising: 請求項３または４に記載の電子部品搭載用絶縁基体と、
前記電子部品搭載用絶縁基体の前記第３搭載面のみ、前記第４搭載面のみ、あるいは、前記第３搭載面および前記第４搭載面の両方に搭載され、前記配線導体の前記他端部に対して電気的に接続される一または複数の電子部品を更に備えることを特徴とする、電子装
置。 An insulating base for mounting an electronic component according to claim 3 or 4,
Mounted on only the third mounting surface, only the fourth mounting surface, or both of the third mounting surface and the fourth mounting surface of the insulating base for mounting electronic components, and on the other end of the wiring conductor An electronic device further comprising one or more electronic components electrically connected to the electronic device. 前記第１搭載面または前記第２搭載面に搭載される電子部品はセンサ素子を含み、前記第３搭載面または前記第４搭載面に搭載される電子部品は前記センサ素子と電気的に接続される受動素子を含む、請求項６に記載の電子装置。   The electronic component mounted on the first mounting surface or the second mounting surface includes a sensor element, and the electronic component mounted on the third mounting surface or the fourth mounting surface is electrically connected to the sensor element. The electronic device according to claim 6, comprising a passive element. 前記電子部品搭載用絶縁基体と協働して前記電子部品を収納するための収納空間を規定する蓋体を更に備える、請求項５から７のいずれかに記載の電子装置。   The electronic device according to claim 5, further comprising a lid body that defines a storage space for storing the electronic component in cooperation with the insulating base for mounting the electronic component.
JP2005371522A 2005-12-26 2005-12-26 Insulating substrate for mounting electronic parts and electronic device Expired - Fee Related JP4688673B2 (en)

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US8100010B2 (en) * 2008-04-14 2012-01-24 Honeywell International Inc. Method and system for forming an electronic assembly having inertial sensors mounted thereto
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JPH0786493A (en) * 1993-09-10 1995-03-31 Matsushita Electric Ind Co Ltd Multichip module
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