JP4671309B1 - Addition type silicone resin composition - Google Patents

Addition type silicone resin composition Download PDF

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JP4671309B1
JP4671309B1 JP2010146333A JP2010146333A JP4671309B1 JP 4671309 B1 JP4671309 B1 JP 4671309B1 JP 2010146333 A JP2010146333 A JP 2010146333A JP 2010146333 A JP2010146333 A JP 2010146333A JP 4671309 B1 JP4671309 B1 JP 4671309B1
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coupling agent
silane coupling
silicone resin
containing silane
addition
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JP2012007126A (en
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フイ サム
彰吾 井崎
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Aica Kogyo Co Ltd
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Priority to KR1020110062804A priority patent/KR101269278B1/en
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    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08KUse of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00Use of organic ingredients
    • C08K5/54Silicon-containing compounds
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04Polysiloxanes
    • C08G77/12Polysiloxanes containing silicon bound to hydrogen
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08LCOMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L83/00Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
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    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
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    • C09J183/00Adhesives based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon, with or without sulfur, nitrogen, oxygen, or carbon only; Adhesives based on derivatives of such polymers

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Abstract

【課題】ポリフタルアミド樹脂などの難接着性基材に対して優れた密着性を有するとともに、硫黄ガスバリアー性にも優れ、接着剤、シーリング剤、封止剤などとして有用な硬化性シリコーン樹脂組成物を提供する。
【解決手段】SiH基と反応性を有する炭素−炭素二重結合を1分子中に少なくとも2個含有するオルガノポリシロキサン(a)、1分子中に少なくとも2個のSiH基を含有するオルガノ水素ポリシロキサン(b)、付加反応触媒(c)、(メタ)アクリロイル基含有シランカップリング剤およびエポキシ基含有シランカップリング剤の反応物(d)を含有することを特徴とする付加型シリコーン樹脂組成物。
【選択図】なし
The present invention relates to a curable silicone resin that has excellent adhesion to difficult-to-adhere substrates such as polyphthalamide resins and also has excellent sulfur gas barrier properties, and is useful as an adhesive, sealing agent, sealant, and the like. A composition is provided.
An organopolysiloxane containing at least two carbon-carbon double bonds reactive with SiH groups in one molecule (a), and an organohydrogenpolysiloxane containing at least two SiH groups in one molecule. An addition-type silicone resin composition comprising a reaction product (d) of siloxane (b), an addition reaction catalyst (c), a (meth) acryloyl group-containing silane coupling agent and an epoxy group-containing silane coupling agent .
[Selection figure] None

Description

本発明はポリフタルアミド樹脂などの難接着性基材に対して優れた密着性を有するとともに、硫黄ガスバリアー性にも優れ、接着剤、シーリング剤、封止剤などとして有用な付加型シリコーン樹脂組成物に関する。   The present invention is an addition-type silicone resin that has excellent adhesion to difficult-to-adhere substrates such as polyphthalamide resins, and also has excellent sulfur gas barrier properties, and is useful as an adhesive, sealing agent, sealant, etc. Relates to the composition.

シリコーン樹脂は耐熱性に優れ、弾性を有することから接着剤、シーリング剤、封止剤などの各種用途に使用されており、最近ではLEDの接着剤や封止剤としての需要が増加しつつある。LED部材には各種エンジニアリングプラスチックが使用されているため、シリコーン樹脂にはこれらのエンジニアリングプラスチックへの密着性が求められている。しかしながら、ポリフタルアミド樹脂などのエンジニアリングプラスチックへの密着性が十分ではなく、改良が求められている。また、LEDの導通や反射用金属として用いられる銀の腐蝕を抑制するため、硫黄ガスバリア性が求められている。   Silicone resins are excellent in heat resistance and have elasticity, so they are used in various applications such as adhesives, sealing agents, and sealants. Recently, demand for LED adhesives and sealants is increasing. . Since various engineering plastics are used for the LED member, the silicone resin is required to have adhesion to these engineering plastics. However, adhesion to engineering plastics such as polyphthalamide resin is not sufficient, and improvement is required. Moreover, in order to suppress the corrosion of silver used as a conductive metal or a reflective metal, a sulfur gas barrier property is required.

特許文献1〜4には、種々の付加硬化型シリコーン樹脂組成物が開示されているが、いずれもポリフタルアミド樹脂などのエンジニアリングプラスチックへの密着性が十分ではなく、更なる改良が必要であった。また、硫黄ガスバリア性についても十分ではなかった。
特開2004-2783号公報 特開2004-266134号公報 特表2007-502346号公報 特開2007-63538号公報
Patent Documents 1 to 4 disclose various addition-curable silicone resin compositions, but none of them has sufficient adhesion to engineering plastics such as polyphthalamide resins, and further improvements are necessary. It was. Further, the sulfur gas barrier property was not sufficient.
JP 2004-2783 A JP 2004-266134 A Special table 2007-502346 gazette JP 2007-63538 A

本発明はポリフタルアミド樹脂などの難接着性基材に対して優れた密着性を有するとともに、硫黄ガスバリアー性にも優れ、接着剤、シーリング剤、封止剤などとして有用な付加型シリコーン樹脂組成物を提供することである。   The present invention is an addition-type silicone resin that has excellent adhesion to difficult-to-adhere substrates such as polyphthalamide resins, and also has excellent sulfur gas barrier properties, and is useful as an adhesive, sealing agent, sealant, etc. It is to provide a composition.

本発明は、SiH基と反応性を有する炭素−炭素二重結合を1分子中に少なくとも2個含有するオルガノポリシロキサン(a)、1分子中に少なくとも2個のSiH基を含有するオルガノ水素ポリシロキサン(b)、付加反応触媒(c)、(メタ)アクリロイル基含有シランカップリング剤およびエポキシ基含有シランカップリング剤の反応物(d)を含有することを特徴とする付加型シリコーン樹脂組成物である。   The present invention relates to an organopolysiloxane (a) containing at least two carbon-carbon double bonds reactive with SiH groups in one molecule, and an organohydrogenpolysiloxane containing at least two SiH groups in one molecule. An addition-type silicone resin composition comprising a reaction product (d) of siloxane (b), an addition reaction catalyst (c), a (meth) acryloyl group-containing silane coupling agent and an epoxy group-containing silane coupling agent It is.

本発明の付加型シリコーン樹脂組成物はポリフタルアミド樹脂などのエンジニアリングプラスチックへの密着性に優れる。また、硫黄ガスバリアー性にも優れるため、LEDなどの各種電子部材の接着剤、シーリング剤、封止剤などとして特に適する。   The addition-type silicone resin composition of the present invention is excellent in adhesion to engineering plastics such as polyphthalamide resin. Moreover, since it is excellent also in sulfur gas barrier property, it is especially suitable as an adhesive agent, sealing agent, sealing agent, etc. of various electronic members, such as LED.

本発明の付加型シリコーン樹脂組成物の各成分について説明する。SiH基と反応性を有する炭素−炭素二重結合を1分子中に少なくとも2個含有するオルガノポリシロキサン(a)は、ビニル基、アリル基、プロペニル基、イソプロペニル基、ブテニル基、イソブテニル基、ヘキセニル基などの炭素−炭素二重結合を1分子中に少なくとも2個含有するオルガノポリシロキサンである。オルガノポリシロキサンは例えば主鎖がジオルガノシロキサンの繰返し単位であり、末端がトリオルガノシロキサン構造であるものが例示され、分岐や環状構造を有するものであってもよい。末端や繰返し単位中のケイ素に結合したオルガノ構造としてはメチル基、エチル基、フェニル基などが例示される。具体例としては、両末端にビニル基を有するジメチルポリシロキサンが挙げられる。   Each component of the addition-type silicone resin composition of this invention is demonstrated. Organopolysiloxane (a) containing at least two carbon-carbon double bonds having reactivity with SiH group in one molecule is vinyl group, allyl group, propenyl group, isopropenyl group, butenyl group, isobutenyl group, An organopolysiloxane containing at least two carbon-carbon double bonds such as a hexenyl group in one molecule. Examples of the organopolysiloxane include those in which the main chain is a repeating unit of diorganosiloxane and the terminal has a triorganosiloxane structure, and may have a branched or cyclic structure. Examples of the organo structure bonded to silicon in the terminal or repeating unit include a methyl group, an ethyl group, and a phenyl group. Specific examples include dimethylpolysiloxane having vinyl groups at both ends.

1分子中に少なくとも2個のSiH基を含有するオルガノ水素ポリシロキサン(b)は、末端および/または繰返し構造中において、2個以上のSiH基を含有するオルガノポリシロキサンである。オルガノポリシロキサンは例えば主鎖がジオルガノシロキサンの繰返し単位であり、末端がトリオルガノシロキサン構造であるものが例示され、分岐や環状構造を有するものであってもよい。末端や繰返し単位中のケイ素に結合したオルガノ構造としてはメチル基、エチル基、フェニル、オクチル基などが例示され、これらの2個以上が水素基に置換されたものである。   The organohydrogenpolysiloxane (b) containing at least two SiH groups in one molecule is an organopolysiloxane containing two or more SiH groups in the terminal and / or repeating structure. Examples of the organopolysiloxane include those in which the main chain is a repeating unit of diorganosiloxane and the terminal has a triorganosiloxane structure, and may have a branched or cyclic structure. Examples of the organo structure bonded to the terminal or silicon in the repeating unit include a methyl group, an ethyl group, a phenyl, and an octyl group, and two or more of these are substituted with a hydrogen group.

付加反応触媒(c)は、前記(a)成分と前記(b)成分のヒドロシリル化反応を促進させるために添加され、ヒドロシリル化反応の触媒活性を有する公知の金属、金属化合物、金属錯体などを用いることができる。特に白金、白金化合物、それらの錯体を用いることが好ましい。これらの触媒は単独で使用してもよく、2種以上を併用してもよい。また、助触媒を併用してもよい。付加反応触媒(c)の配合量は組成物全体に対して1ppm〜50ppmとすることが好ましく、より好ましくは5〜20ppmである。   The addition reaction catalyst (c) is added to promote the hydrosilylation reaction of the component (a) and the component (b), and a known metal, metal compound, metal complex or the like having catalytic activity for the hydrosilylation reaction is added. Can be used. In particular, it is preferable to use platinum, a platinum compound, or a complex thereof. These catalysts may be used alone or in combination of two or more. A cocatalyst may be used in combination. The addition amount of the addition reaction catalyst (c) is preferably 1 ppm to 50 ppm, more preferably 5 to 20 ppm, based on the entire composition.

本発明の付加型シリコーン樹脂組成物は前記(a)〜(c)の各成分に加えて、(メタ)アクリロイル基含有シランカップリング剤およびエポキシ基含有シランカップリング剤の反応物(d)を含有することを特徴とする。ここで、(d)に代えて、単に(メタ)アクリロイル基含有シランカップリング剤およびエポキシ基含有シランカップリング剤を前記(a)〜(c)の各成分と混合しても本願発明の効果は得られない。すなわち、(メタ)アクリロイル基含有シランカップリング剤およびエポキシ基含有シランカップリング剤を予め反応させ、前記(a)〜(c)の各成分と混合することが必要である。   In addition to the components (a) to (c), the addition type silicone resin composition of the present invention comprises a reaction product (d) of a (meth) acryloyl group-containing silane coupling agent and an epoxy group-containing silane coupling agent. It is characterized by containing. Here, instead of (d), the effect of the present invention can be obtained by simply mixing a (meth) acryloyl group-containing silane coupling agent and an epoxy group-containing silane coupling agent with the components (a) to (c). Cannot be obtained. That is, it is necessary that the (meth) acryloyl group-containing silane coupling agent and the epoxy group-containing silane coupling agent are reacted in advance and mixed with the components (a) to (c).

(メタ)アクリロイル基含有シランカップリング剤は、分子内に(メタ)アクリロイル基およびアルコキシシリル基などの反応性シリル基を有する化合物である。具体的には、γ−メタクリロキシプロピルメチルジメトキシシラン、γ−メタクリロキシプロピルトリメトキシシラン、γ−メタクリロキシプロピルメチルジエトキシシラン、γ−メタクリロキシプロピルトリエトキシシラン、γ−アクリロキシプロピルトリメトキシシランなどが挙げられる。   A (meth) acryloyl group-containing silane coupling agent is a compound having a reactive silyl group such as a (meth) acryloyl group and an alkoxysilyl group in the molecule. Specifically, γ-methacryloxypropylmethyldimethoxysilane, γ-methacryloxypropyltrimethoxysilane, γ-methacryloxypropylmethyldiethoxysilane, γ-methacryloxypropyltriethoxysilane, γ-acryloxypropyltrimethoxysilane Etc.

エポキシ基含有シランカップリング剤は、分子内にエポキシ基およびアルコキシシリル基などの反応性シリル基を有する化合物である。エポキシ基含有シランカップリング剤の具体例として、β−(3,4−エポキシシクロヘキシル)エチルトリメトキシシラン、γ−グリシドキシプロピルトリメトキシシラン、γ−グリシドキシプロピルメチルジエトキシシラン、γ−グリシドキシプロピルトリエトキシシランなどが挙げられる。   The epoxy group-containing silane coupling agent is a compound having a reactive silyl group such as an epoxy group and an alkoxysilyl group in the molecule. Specific examples of the epoxy group-containing silane coupling agent include β- (3,4-epoxycyclohexyl) ethyltrimethoxysilane, γ-glycidoxypropyltrimethoxysilane, γ-glycidoxypropylmethyldiethoxysilane, γ- Examples thereof include glycidoxypropyltriethoxysilane.

(メタ)アクリロイル基含有シランカップリング剤とエポキシ基含有シランカップリング剤を反応させる条件として、23℃で雰囲気下であれば24時間程度攪拌混合することにより十分に反応が進行する。同様に、60℃で雰囲気下であれば8時間程度、80℃雰囲気下であれば4時間、100℃雰囲気下であれば2時間程度攪拌混合することにより十分に反応が進行する。   As a condition for reacting the (meth) acryloyl group-containing silane coupling agent and the epoxy group-containing silane coupling agent, the reaction proceeds sufficiently by stirring and mixing for about 24 hours under an atmosphere at 23 ° C. Similarly, the reaction proceeds sufficiently by stirring and mixing for about 8 hours in an atmosphere at 60 ° C., for 4 hours in an atmosphere at 80 ° C., and for about 2 hours in an atmosphere at 100 ° C.

(メタ)アクリロイル基含有シランカップリング剤とエポキシ基含有シランカップリング剤を反応させる際に、さらにビニルトリメトキシシランやビニルトリエトキシシランなどのビニル基含有シランカップリング剤を反応させることもでき、この反応物を(d)成分として用いることによって、密着性や硫黄ガスバリアー性をさらに向上させることができる。ただし、(メタ)アクリロイル基含有シランカップリング剤に代えてビニル基含有シランカップリング剤を用いた場合、すなわちビニル基含有シランカップリング剤およびエポキシ基含有シランカップリング剤のみを反応させた生成物を(d)成分として用いた場合、本願発明の効果は発現しない。また、前記オルガノポリシロキサン(a)100重量部に対して、(d)成分を0.1〜20重量部配合することが好ましく、0.5〜10重量部配合することがより好ましい。   When the (meth) acryloyl group-containing silane coupling agent and the epoxy group-containing silane coupling agent are reacted, a vinyl group-containing silane coupling agent such as vinyltrimethoxysilane or vinyltriethoxysilane can be further reacted. By using this reactant as the component (d), adhesion and sulfur gas barrier properties can be further improved. However, when a vinyl group-containing silane coupling agent is used instead of the (meth) acryloyl group-containing silane coupling agent, that is, a product obtained by reacting only the vinyl group-containing silane coupling agent and the epoxy group-containing silane coupling agent. When is used as the component (d), the effect of the present invention is not exhibited. Moreover, it is preferable to mix | blend 0.1-20 weight part of (d) component with respect to 100 weight part of said organopolysiloxane (a), and it is more preferable to mix | blend 0.5-10 weight part.

本発明の硬化性シリコーン樹脂組成物には前記必須成分の他、各種樹脂、添加剤を配合できる。希釈剤の配合により、粘度、柔軟性等を調整できる。その具体例として、フタル酸ジメチル、フタル酸ジエチル、フタル酸ジブチル、フタル酸ジ2−エチルヘキシルなどフタル酸エステル系の希釈剤、ジメチルシリコーンオイル、アルキル変性シリコーンオイル、ポリエーテル変性シリコーンオイル等のシリコーンオイル、アジピン酸ジオクチル、アジピン酸ジイソノニル、アゼライン酸ジアルキル、セバシン酸ジブチル、エポキシ化大豆油、ポリプロピレングリコール、アクリルポリマー、α−オレフィンやその誘導体、植物油由来脂肪酸の2−エチルヘキシルエステル化合物等が挙げられる。   In addition to the essential components, various resins and additives can be blended in the curable silicone resin composition of the present invention. Viscosity, flexibility, etc. can be adjusted by blending the diluent. Specific examples include phthalate-based diluents such as dimethyl phthalate, diethyl phthalate, dibutyl phthalate, di-2-ethylhexyl phthalate, silicone oils such as dimethyl silicone oil, alkyl-modified silicone oil, and polyether-modified silicone oil. , Dioctyl adipate, diisononyl adipate, dialkyl azelate, dibutyl sebacate, epoxidized soybean oil, polypropylene glycol, acrylic polymer, α-olefin and derivatives thereof, vegetable oil-derived fatty acid 2-ethylhexyl ester compounds, and the like.

粘度調整、粘性調整、増量などを目的として、炭酸カルシウム、硅砂、タルク、カーボンブラック、酸化チタン、カオリン、二酸化ケイ素、メラミン等の充填材、硬化樹脂の補強のためにガラス繊維等の補強材、軽量化及び粘度調整などのためにシラスバルーン、ガラスバルーン等の中空体を添加できる。その他、酸化防止剤、顔料、防腐剤などを適宜使用することができる。   For the purpose of adjusting viscosity, adjusting viscosity, increasing weight, etc., fillers such as calcium carbonate, cinnabar, talc, carbon black, titanium oxide, kaolin, silicon dioxide, melamine, reinforcing materials such as glass fiber for reinforcing cured resin, Hollow bodies such as shirasu balloons and glass balloons can be added for weight reduction and viscosity adjustment. In addition, antioxidants, pigments, preservatives, and the like can be used as appropriate.

以下、本発明について実施例、比較例を挙げてより詳細に説明するが、具体例を示すものであって、特にこれらに限定するものではない。   EXAMPLES Hereinafter, although an Example and a comparative example are given and demonstrated in detail about this invention, a specific example is shown and it does not specifically limit to these.

反応物の調製
γ−メタクリロキシプロピルトリメトキシシラン(信越化学工業社製、商品名KBM−503)1重量部、γ−グリシドキシプロピルトリメトキシシラン(信越化学工業社製、商品名KBM−403)1重量部を23℃雰囲気下で24時間攪拌混合し、反応物1を得た。また、前記化合物の他にビニルトリメトキシシラン(信越化学工業社製、商品名KBM−1003)を用い、表1の配合、反応条件にて同様に反応物2〜12を得た。
Preparation of reaction product 1 part by weight of γ-methacryloxypropyltrimethoxysilane (manufactured by Shin-Etsu Chemical Co., Ltd., trade name KBM-503), γ-glycidoxypropyltrimethoxysilane (manufactured by Shin-Etsu Chemical Co., Ltd., trade name KBM-403) ) 1 part by weight was stirred and mixed in an atmosphere of 23 ° C. for 24 hours to obtain a reaction product 1. In addition to the above compounds, vinyltrimethoxysilane (manufactured by Shin-Etsu Chemical Co., Ltd., trade name KBM-1003) was used, and reactants 2 to 12 were obtained in the same manner under the composition and reaction conditions shown in Table 1.

Figure 0004671309
Figure 0004671309

付加型シリコーン樹脂組成物の調製
ポリメチルビニルシロキサン(粘度8.1Pa・s)100重量部に前記反応物1を1重量部添加した。次いで付加反応触媒として白金−ビニルシロキサン錯体を組成物全体に対して10ppmとなるよう添加し、さらにメチル水素ポリシロキサン(粘度4.9Pa・s)10重量部を添加混合することにより、実施例1の付加型シリコーン樹脂組成物を調製した。
Preparation of Addition Type Silicone Resin Composition 1 part by weight of the reaction product 1 was added to 100 parts by weight of polymethylvinylsiloxane (viscosity 8.1 Pa · s). Next, a platinum-vinylsiloxane complex was added as an addition reaction catalyst so as to be 10 ppm relative to the entire composition, and 10 parts by weight of methylhydrogenpolysiloxane (viscosity 4.9 Pa · s) was added and mixed. The addition type silicone resin composition was prepared.

実施例1において、反応物1に代えて表2、3記載の配合にて各反応物、各シランカップリング剤を添加した他は実施例1と同様に行い、実施例2〜14、比較例1〜7の各付加型シリコーン樹脂組成物を得た。   In Example 1, it replaced with the reactant 1 and carried out similarly to Example 1 except having added each reactant and each silane coupling agent by the mixing | blending of Table 2, 3, Example 2-14, a comparative example Each addition type silicone resin composition of 1-7 was obtained.

硬度
各付加型シリコーン樹脂組成物を150℃で1時間加熱することにより硬化させ、厚み2mmの試験体を作成した。JIS K6301に準拠し、硬度計Aを用いて硬度を測定した。
Hardness Each addition type silicone resin composition was cured by heating at 150 ° C. for 1 hour to prepare a specimen having a thickness of 2 mm. The hardness was measured using a hardness meter A in accordance with JIS K6301.

密着性
各付加型シリコーン樹脂組成物をポリフタルアミド樹脂板(幅25mm、2mm厚)に塗布量50g/mm2で塗布し、別のポリフタルアミド樹脂板(幅25mm、2mm厚)を長さ方向に25mm重なり合うように貼り合わせてクリップで固定し、150℃雰囲気下で1時間硬化させた。23℃雰囲気下で24時間養生後、引張り速度50mm/分でせん断試験を行い、強度の測定および破壊状態の確認を行った。また、被着材として半光沢銀メッキSUS板(幅25mm、100μm厚、メッキ厚3〜7μm)を用いて、同様にせん断強度の測定および破壊状態の確認を行った。
Adhesiveness Each addition type silicone resin composition was applied to a polyphthalamide resin plate (width 25 mm, 2 mm thickness) at an application amount of 50 g / mm 2 , and another polyphthalamide resin plate (width 25 mm, 2 mm thickness) was lengthened. They were pasted so as to overlap each other by 25 mm, fixed with clips, and cured at 150 ° C. for 1 hour. After curing for 24 hours in an atmosphere of 23 ° C., a shear test was performed at a pulling rate of 50 mm / min, and the strength was measured and the fracture state was confirmed. Further, using a semi-glossy silver plated SUS plate (width 25 mm, 100 μm thickness, plating thickness 3 to 7 μm) as an adherend, the shear strength was measured and the fracture state was confirmed in the same manner.

腐食性
銀メッキを施した銅板上に各付加型シリコーン樹脂組成物を塗布し、150℃で1時間加熱することにより硬化して厚み2mmの皮膜を形成した。該銅板を硫黄粉0.2gと共に100ccガラスビンに封入し、60℃または80℃雰囲気下で24時間放置した。放置後に銅板を取り出してシリコーン皮膜を剥がし、銀メッキの腐食の程度を確認して以下のように評価した。
○ :腐食なし
△ :部分的に腐食(薄い黒色)
× :全面腐食(黒色化)
Each addition type silicone resin composition was apply | coated on the copper plate which gave corrosive silver plating, and it hardened | cured by heating at 150 degreeC for 1 hour, and formed the film | membrane with a thickness of 2 mm. The copper plate was sealed in a 100 cc glass bottle with 0.2 g of sulfur powder, and left in a 60 ° C. or 80 ° C. atmosphere for 24 hours. After leaving, the copper plate was taken out, the silicone film was peeled off, and the degree of corrosion of the silver plating was confirmed and evaluated as follows.
○: No corrosion △: Partially corroded (light black)
×: Overall corrosion (blackening)

Figure 0004671309
Figure 0004671309

Figure 0004671309
Figure 0004671309

実施例の各付加型シリコーン樹脂組成物はポリフタルアミド樹脂に対して優れた密着性を有しおり、60℃における硫黄ガスバリアー性にも優れていた。さらに、実施例3〜14においては、半光沢銀メッキSUSに対しても優れた密着性を有しており、80℃における硫黄ガスバリアー性にも優れていた。一方、比較例の各付加型シリコーン樹脂組成物はポリフタルアミド樹脂や半光沢銀メッキSUSに対する密着が低く、硫黄ガスバリアー性が低いため銀が腐食されていた。   Each addition-type silicone resin composition of the example had excellent adhesion to the polyphthalamide resin, and was excellent in sulfur gas barrier properties at 60 ° C. Furthermore, in Examples 3 to 14, it had excellent adhesion to semi-glossy silver plating SUS and was excellent in sulfur gas barrier properties at 80 ° C. On the other hand, each addition type silicone resin composition of the comparative example had low adhesion to the polyphthalamide resin and semi-glossy silver plating SUS, and silver was corroded because of low sulfur gas barrier property.

Claims (3)

SiH基と反応性を有する炭素−炭素二重結合を1分子中に少なくとも2個含有するオルガノポリシロキサン(a)、1分子中に少なくとも2個のSiH基を含有するオルガノ水素ポリシロキサン(b)、付加反応触媒(c)、(メタ)アクリロイル基含有シランカップリング剤およびエポキシ基含有シランカップリング剤の反応物(d)を含有することを特徴とする付加型シリコーン樹脂組成物。   Organopolysiloxane containing at least two carbon-carbon double bonds reactive with SiH groups in one molecule (a) Organohydrogenpolysiloxane containing at least two SiH groups in one molecule (b) An addition-type silicone resin composition comprising a reaction product (d) of an addition reaction catalyst (c), a (meth) acryloyl group-containing silane coupling agent and an epoxy group-containing silane coupling agent. 前記(メタ)アクリロイル基含有シランカップリング剤とエポキシ基含有シランカップリング剤の反応物(d)が、(メタ)アクリロイル基含有シランカップリング剤、エポキシ基含有シランカップリング剤およびビニル基含有シランカップリング剤の反応物であることを特徴とする請求項1記載の付加型シリコーン樹脂組成物。   The reaction product (d) of the (meth) acryloyl group-containing silane coupling agent and the epoxy group-containing silane coupling agent is a (meth) acryloyl group-containing silane coupling agent, an epoxy group-containing silane coupling agent, and a vinyl group-containing silane. The addition-type silicone resin composition according to claim 1, wherein the addition-type silicone resin composition is a reaction product of a coupling agent. 前記オルガノポリシロキサン(a)100重量部に対して、(d)成分が、0.1〜20重量部配合されていることを特徴とする請求項1または2記載の付加型シリコーン樹脂組成物。   The addition type silicone resin composition according to claim 1 or 2, wherein 0.1 to 20 parts by weight of the component (d) is blended with respect to 100 parts by weight of the organopolysiloxane (a).
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Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6211251B2 (en) * 2012-06-21 2017-10-11 アイカ工業株式会社 Addition type silicone resin composition and sealant for optical semiconductor device
JP6084377B2 (en) * 2012-06-21 2017-02-22 アイカ工業株式会社 Addition type silicone resin composition and sealant for optical semiconductor device
JP6168754B2 (en) * 2012-11-16 2017-07-26 アイカ工業株式会社 Addition type silicone resin composition and sealant for optical semiconductor device
TWI523914B (en) * 2013-01-09 2016-03-01 Daicel Corp Hardened resin composition and hardened product thereof
CN103113846B (en) * 2013-03-12 2014-12-31 深圳市博恩实业有限公司 Heat-conducting silica gel sheet and manufacturing method thereof
CN106810698A (en) * 2016-12-30 2017-06-09 佛山市功能高分子材料与精细化学品专业中心 A kind of epoxy silicones tackifier and its organosilicon thermal conductive insulation glue of preparation
CN109796928B (en) * 2019-01-11 2020-10-16 北京天山新材料技术有限公司 Organosilicon sealant, device sealed by using organosilicon sealant and application of organosilicon sealant

Citations (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH08143672A (en) * 1994-05-10 1996-06-04 Dow Corning Corp Additive for accelerating adhesion and curable organosiloxane composition contained therein
JP2001220394A (en) * 2000-02-07 2001-08-14 Toray Ind Inc Monomer, polymer and lens for eye
JP2002513427A (en) * 1998-04-17 2002-05-08 クロンプトン・コーポレーション Silicone oligomer and curable composition containing the same
JP2004002783A (en) * 2002-04-04 2004-01-08 Kanegafuchi Chem Ind Co Ltd Composition for optical material, optical material, method for producing the same and liquid crystal display device and led produced by using the same
JP2004202996A (en) * 2002-12-26 2004-07-22 Seiko Epson Corp Cover window and its manufacturing method
JP2004266134A (en) * 2003-03-03 2004-09-24 Kanegafuchi Chem Ind Co Ltd Resin paste for die bonding and light emitting diode using it
JP2006117845A (en) * 2004-10-22 2006-05-11 Ge Toshiba Silicones Co Ltd Flame-retardant adhesive polyorganosiloxane composition
JP2007002088A (en) * 2005-06-23 2007-01-11 Shin Etsu Chem Co Ltd Self-adhesive organopolysiloxane composition
JP2007502346A (en) * 2003-08-14 2007-02-08 ダウ・コーニング・コーポレイション Adhesive having improved chemical resistance and curable silicone composition for preparing adhesive
JP2007063538A (en) * 2005-08-03 2007-03-15 Shin Etsu Chem Co Ltd Addition curing-type silicone resin composition for light emitting diode
JP2007326848A (en) * 2006-05-09 2007-12-20 Hitachi Chem Co Ltd Method for producing silicone oligomer
WO2008020635A1 (en) * 2006-08-14 2008-02-21 Dow Corning Toray Co., Ltd. Silicone rubber composition for fabric coating and coated fabric
JP2008528788A (en) * 2005-02-01 2008-07-31 ダウ・コーニング・コーポレイション Curable coating composition
JP2010116490A (en) * 2008-11-13 2010-05-27 Toppan Printing Co Ltd Anchor coat agent for coating
JP2010248410A (en) * 2009-04-17 2010-11-04 Momentive Performance Materials Inc Adhesive polyorganosiloxane composition

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2994699B2 (en) * 1990-07-19 1999-12-27 東レ・ダウコーニング・シリコーン株式会社 Film-forming organopolysiloxane composition
US5270425A (en) * 1992-11-23 1993-12-14 Dow Corning Corporation One-part curable organosiloxane compositions
JPH08208993A (en) * 1995-11-27 1996-08-13 Toshiba Silicone Co Ltd Heat-conductive silicone composition
JP4209608B2 (en) 2001-11-14 2009-01-14 信越化学工業株式会社 Room temperature curable silicone rubber composition
WO2009008452A1 (en) * 2007-07-10 2009-01-15 Kaneka Corporation Silicone composition containing silicone polymer particle and method for producing the same

Patent Citations (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH08143672A (en) * 1994-05-10 1996-06-04 Dow Corning Corp Additive for accelerating adhesion and curable organosiloxane composition contained therein
JP2002513427A (en) * 1998-04-17 2002-05-08 クロンプトン・コーポレーション Silicone oligomer and curable composition containing the same
JP2001220394A (en) * 2000-02-07 2001-08-14 Toray Ind Inc Monomer, polymer and lens for eye
JP2004002783A (en) * 2002-04-04 2004-01-08 Kanegafuchi Chem Ind Co Ltd Composition for optical material, optical material, method for producing the same and liquid crystal display device and led produced by using the same
JP2004202996A (en) * 2002-12-26 2004-07-22 Seiko Epson Corp Cover window and its manufacturing method
JP2004266134A (en) * 2003-03-03 2004-09-24 Kanegafuchi Chem Ind Co Ltd Resin paste for die bonding and light emitting diode using it
JP2007502346A (en) * 2003-08-14 2007-02-08 ダウ・コーニング・コーポレイション Adhesive having improved chemical resistance and curable silicone composition for preparing adhesive
JP2006117845A (en) * 2004-10-22 2006-05-11 Ge Toshiba Silicones Co Ltd Flame-retardant adhesive polyorganosiloxane composition
JP2008528788A (en) * 2005-02-01 2008-07-31 ダウ・コーニング・コーポレイション Curable coating composition
JP2007002088A (en) * 2005-06-23 2007-01-11 Shin Etsu Chem Co Ltd Self-adhesive organopolysiloxane composition
JP2007063538A (en) * 2005-08-03 2007-03-15 Shin Etsu Chem Co Ltd Addition curing-type silicone resin composition for light emitting diode
JP2007326848A (en) * 2006-05-09 2007-12-20 Hitachi Chem Co Ltd Method for producing silicone oligomer
WO2008020635A1 (en) * 2006-08-14 2008-02-21 Dow Corning Toray Co., Ltd. Silicone rubber composition for fabric coating and coated fabric
JP2010116490A (en) * 2008-11-13 2010-05-27 Toppan Printing Co Ltd Anchor coat agent for coating
JP2010248410A (en) * 2009-04-17 2010-11-04 Momentive Performance Materials Inc Adhesive polyorganosiloxane composition

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