JP4667086B2 - Electronic component mounting structure and electronic component mounting method - Google Patents

Electronic component mounting structure and electronic component mounting method Download PDF

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JP4667086B2
JP4667086B2 JP2005070799A JP2005070799A JP4667086B2 JP 4667086 B2 JP4667086 B2 JP 4667086B2 JP 2005070799 A JP2005070799 A JP 2005070799A JP 2005070799 A JP2005070799 A JP 2005070799A JP 4667086 B2 JP4667086 B2 JP 4667086B2
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electronic component
insulating layer
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circuit board
opening
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JP2006253558A (en
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恭也 大薮
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Nitto Denko Corp
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Description

本発明は、電子部品の実装構造および電子部品の実装方法に関する。 The present invention relates to a method of mounting the mounting structure and an electronic component of electronic components.

半導体素子等の電子部品は駆動されることにより発熱する。電子部品が過剰に発熱すると、その電子部品は誤動作を生じる場合がある。そこで、このような電子部品の誤動作を防止するために、電子部品を放熱する配線回路基板が開発されている（例えば、特許文献１参照）。   Electronic components such as semiconductor elements generate heat when driven. If the electronic component generates excessive heat, the electronic component may malfunction. Therefore, in order to prevent such malfunction of the electronic component, a printed circuit board that radiates heat from the electronic component has been developed (for example, see Patent Document 1).

図８は、特許文献１の実装配線基板の構造を示す図である。図８の実装配線基板９００においては、金属製ベース９２０上に複数の絶縁層９３１，９３２，９３３が互いに離間するように形成される。   FIG. 8 is a view showing the structure of the mounting wiring board of Patent Document 1. In FIG. In the mounting wiring board 900 of FIG. 8, a plurality of insulating layers 931, 932, 933 are formed on a metal base 920 so as to be separated from each other.

さらに、金属製ベース９２０および絶縁層９３１，９３２，９３３上には複数の導体９４１，９４２，９４３，９４４が互いに離間するように形成される。複数の導体のうち一部の導体９４２，９４３は、金属製ベース９２０上の絶縁層９３１，９３２の隙間および絶縁層９３２，９３３の隙間を埋めるようにそれぞれ配置され、金属製ベース９２０に接続されている。   Further, a plurality of conductors 941, 942, 943, 944 are formed on the metal base 920 and the insulating layers 931, 932, 933 so as to be separated from each other. Among the plurality of conductors, some of the conductors 942 and 943 are disposed so as to fill the gap between the insulating layers 931 and 932 and the gap between the insulating layers 932 and 933 on the metal base 920, and are connected to the metal base 920. ing.

一方、他の導体９４１，９４４は、絶縁層９３１上および絶縁層９３３上に配置されている。絶縁層９３１，９３３上に形成された導体９４１，９４４にそれぞれ電子部品９５０，９６０が設けられる。電子部品９５０，９６０の端子はそれぞれ導体９４１，９４４に接続される。   On the other hand, the other conductors 941 and 944 are disposed on the insulating layer 931 and the insulating layer 933. Electronic components 950 and 960 are provided on the conductors 941 and 944 formed on the insulating layers 931 and 933, respectively. Terminals of the electronic components 950 and 960 are connected to conductors 941 and 944, respectively.

ここで、電子部品９５０が実装される導体９４１と金属製ベース９２０に接続された導体９４２とが、絶縁性および熱伝導性を有する熱伝導性部品９０１により接続されている。また、電子部品９６０が実装される導体９４４と金属製ベース９２０に接続された導体９４３とが、絶縁性および熱伝導性を有する熱伝導性部品９０２により接続されている。   Here, the conductor 941 on which the electronic component 950 is mounted and the conductor 942 connected to the metal base 920 are connected by a thermally conductive component 901 having insulating properties and thermal conductivity. In addition, the conductor 944 on which the electronic component 960 is mounted and the conductor 943 connected to the metal base 920 are connected by a thermally conductive component 902 having insulating properties and thermal conductivity.

このような構造により、図８の実装配線基板９００においては、電子部品９５０において発生される熱が、導体９４１、熱伝導性部品９０１および導体９４２を通じて金属製ベース９２０に伝達される。また、電子部品９６０において発生される熱が、導体９４４、熱伝導性部品９０２および導体９４３を通じて金属製ベース９２０に伝達される。その結果、電子部品９５０，９６０において発生する熱が、金属製ベース９２０により速やかに放散される。
特開平１１−９７８１８号公報 With such a structure, in the mounting wiring board 900 of FIG. 8, heat generated in the electronic component 950 is transmitted to the metal base 920 through the conductor 941, the heat conductive component 901, and the conductor 942. In addition, heat generated in the electronic component 960 is transmitted to the metal base 920 through the conductor 944, the heat conductive component 902, and the conductor 943. As a result, heat generated in the electronic components 950 and 960 is quickly dissipated by the metal base 920.
JP-A-11-97818

ところで、電子部品を備える電子機器は、従来より小型化が求められている。それに伴い、電子部品の小型化および配線回路基板の小型化の要求も高まっている。   Incidentally, electronic devices including electronic components are required to be smaller than before. Along with this, there is an increasing demand for miniaturization of electronic parts and miniaturization of printed circuit boards.

配線回路基板の小型化を実現するためには、配線の高密度化を実現する必要がある。しかしながら、上記の実装配線基板９００では、電子部品９５０，９６０が、配線として形成される導体９４１，９４４上に配置されるので、導体９４１，９４４からなる電子部品９５０，９６０の実装スペースが必要となり配線の高密度化が困難となっていた。   In order to reduce the size of the printed circuit board, it is necessary to increase the wiring density. However, in the mounting wiring board 900 described above, the electronic components 950 and 960 are disposed on the conductors 941 and 944 formed as wiring, so that a mounting space for the electronic components 950 and 960 including the conductors 941 and 944 is required. It has been difficult to increase the wiring density.

本発明の目的は、配線の高密度化を実現しつつ、実装される電子部品の放熱性を十分に向上させることができる電子部品の実装構造および電子部品の実装方法を提供することである。 An object of the present invention, while achieving the high density of the wiring, to provide a mounting structure and mounting method of the electronic component mounted electronic components sufficiently improved can be Ru electronic components that causes the heat dissipation of the is there.

第１の発明に係る電子部品の実装構造は、端子部を備える電子部品と、電子部品が実装される配線回路基板とを備え、配線回路基板は、第１および第２の面を有するとともに、所定位置に第１の面から第２の面に連通する第１の開口部を有する第１の絶縁層と、第１の絶縁層の第１の面側の第１の開口部を含む領域上に設けられ、所定のパターンを有する導体層と、第１の絶縁層の第２の面側に設けられ、第１の絶縁層の第１の開口部に連通する第２の開口部を有する熱拡散部材と、第１および第２の開口部の少なくとも一方の内部で導体層に接するように設けられる導電性部材とを備え、第１の絶縁層の第２の面側に実装される電子部品の端子部が導電性部材に接続され、電子部品と熱拡散部材との間および第２の開口部内に、絶縁性を有しかつ熱伝導性を有する材料からなる封止樹脂が充填されたものである。 An electronic component mounting structure according to a first aspect of the present invention includes an electronic component including a terminal portion and a printed circuit board on which the electronic component is mounted. The wired circuit board includes first and second surfaces. a first insulating layer and the first insulating layer first surface on a first region including the opening of which has a first opening communicating from the first surface to the second surface in a predetermined position provided, a conductor layer having a predetermined pattern, et al formed on the second surface side of the first insulating layer is, having a second opening communicating with the first opening in the first insulating layer and the thermal diffusion member, and a conductive member provided in contact with the conductive layer at least one of the interior of the first and second openings, electrons to be mounted on a second surface of the first insulating layer terminal portion of the component is connected to the conductive member, between and within the second opening of the electronic component and the heat diffusion member, have a insulating And in which a sealing resin made of a material having a thermal conductivity has been filled.

その発明に係る電子部品の実装構造においては、端子部を備える電子部品が配線回路基板に実装される。配線回路基板において、第１の絶縁層の第１の面側に所定のパターンを有する導体層が設けられている。この導体層は配線として用いられる。また、第１の絶縁層の第２の面側において、第１および第２の開口部の少なくとも一方の内部で導体層に接するように設けられる導電性部材に電子部品の端子部が接続される。これにより、電子部品の大きさにかかわらず、第１の絶縁層の第１の面側で配線の幅およびピッチを微細化することができる。それにより、配線の十分な高密度化が実現される。 In the electronic component mounting structure according to the invention, the electronic component including the terminal portion is mounted on the printed circuit board. In the printed circuit board, a conductor layer having a predetermined pattern is provided on the first surface side of the first insulating layer. This conductor layer is used as a wiring. In addition, on the second surface side of the first insulating layer, the terminal portion of the electronic component is connected to a conductive member provided so as to be in contact with the conductor layer inside at least one of the first and second openings. . Thereby, the width and pitch of the wiring can be miniaturized on the first surface side of the first insulating layer regardless of the size of the electronic component. Thereby, a sufficiently high wiring density is realized.

また、電子部品が実装される第１の絶縁層の第２の面側に、熱拡散部材が設けられている。ここで、配線回路基板に電子部品が実装されると、電子部品と熱拡散部材とが近接する。さらに、電子部品と熱拡散部材との間および第２の開口部内に、絶縁性を有しかつ熱伝導性を有する材料からなる封止樹脂が充填される。これにより、電子部品から発生される熱が熱拡散部材に伝達されやすくなる。その結果、電子部品の熱が熱拡散部材により拡散されるので、電子部品の放熱性が十分に向上する。 In addition, a heat diffusion member is provided on the second surface side of the first insulating layer on which the electronic component is mounted. Here, when the electronic component is mounted on the printed circuit board, the electronic component and the heat diffusing member come close to each other. Further, a sealing resin made of a material having insulating properties and thermal conductivity is filled between the electronic component and the heat diffusion member and in the second opening. Thereby, the heat generated from the electronic component is easily transmitted to the heat diffusing member. As a result, the heat of the electronic component is diffused by the heat diffusing member, so that the heat dissipation of the electronic component is sufficiently improved.

電子部品と熱拡散部材との間および第２の開口部内に、絶縁性を有しかつ熱伝導性を有する材料からなる封止樹脂が充填される。この場合、配線回路基板の導電性部材および電子部品の端子部の劣化が防止され、配線回路基板および電子部品の長寿命化が実現される。
封止樹脂は、フィラーが添加された樹脂、または無機材料が添加された樹脂からなってもよい。
第１の絶縁層の第１の面側で、第１の絶縁層の第１の面および導体層を覆うように第２の絶縁層が設けられてもよい。この場合、第１の絶縁層の第１の面上に形成された配線が第２の絶縁層により外部の雰囲気から保護され、配線の劣化が防止される。また、配線回路基板の長寿命化が実現される。
第２の絶縁層上に補強板が設けられてもよい。これにより、配線回路基板の強度が向上する。 A sealing resin made of a material having insulating properties and thermal conductivity is filled between the electronic component and the heat diffusion member and in the second opening. In this case, deterioration of the conductive member of the printed circuit board and the terminal part of the electronic component is prevented, and the life of the wired circuit board and the electronic component is extended.
The sealing resin may be made of a resin to which a filler is added or a resin to which an inorganic material is added.
A second insulating layer may be provided on the first surface side of the first insulating layer so as to cover the first surface of the first insulating layer and the conductor layer. In this case, the wiring formed on the first surface of the first insulating layer is protected from the external atmosphere by the second insulating layer, and deterioration of the wiring is prevented. In addition, the service life of the printed circuit board is increased.
A reinforcing plate may be provided on the second insulating layer. Thereby, the strength of the printed circuit board is improved.

第２の発明に係る電子部品の実装方法は、端子部を備える電子部品を配線回路基板に実装する電子部品の実装方法であって、第１および第２の面を有するとともに、所定位置に第１の面から第２の面に連通する第１の開口部を有する第１の絶縁層を形成する工程と、第１の絶縁層の第１の面側の第１の開口部を含む領域上に所定のパターンを有する導体層を設ける工程と、第１の絶縁層の第２の面側に第１の絶縁層の第１の開口部に連通する第２の開口部を有する熱拡散部材を設ける工程と、第１および第２の開口部の少なくとも一方の内部で導体層に接するように導電性部材を設けることにより配線回路基板を作製する工程と、電子部品の端子部を導電性部材に接続し、配線回路基板の第１の絶縁層の第２の面側に電子部品を実装する工程と、電子部品と熱拡散部材との間および第２の開口部内に、絶縁性を有しかつ熱伝導性を有する材料からなる封止樹脂を充填する工程とを含むものである。 An electronic component mounting method according to a second aspect of the present invention is an electronic component mounting method for mounting an electronic component having a terminal portion on a printed circuit board. The electronic component mounting method has first and second surfaces, and is arranged at a predetermined position. Forming a first insulating layer having a first opening communicating from the first surface to the second surface, and a region including the first opening on the first surface side of the first insulating layer; a step of providing a conductive layer having a predetermined pattern, the heat diffusion member having a second opening communicating with the first opening in the first insulating layer to the second surface of the first insulating layer as provided Ru Engineering and a step of manufacturing a wiring circuit board by kicking setting the conductive member in contact with the conductive layer at least one of the interior of the first and second openings, the conductive terminals of the electronic component connect sexual member, a step of mounting an electronic component on a second side of the first insulating layer of the printed circuit board , During and second in the opening of the electronic component and the heat diffusion member, it is intended to include a step of filling the sealing resin made of a material having a having and thermally conductive insulating properties.

その発明に係る電子部品の実装方法によれば、端子部を備える電子部品が配線回路基板に実装される。配線回路基板において、第１の絶縁層の第１の面側に所定のパターンを有する導体層が設けられている。この導体層は配線として用いられる。また、第１の絶縁層の第２の面側において、第１および第２の開口部の少なくとも一方の内部で導体層に接するように設けられる導電性部材に電子部品の端子部が接続される。これにより、電子部品の大きさにかかわらず、第１の絶縁層の第１の面側で配線の幅およびピッチを微細化することができる。それにより、配線の十分な高密度化が実現される。 According to the electronic component mounting method of the invention, the electronic component including the terminal portion is mounted on the printed circuit board. In the printed circuit board, a conductor layer having a predetermined pattern is provided on the first surface side of the first insulating layer. This conductor layer is used as a wiring. In addition, on the second surface side of the first insulating layer, the terminal portion of the electronic component is connected to a conductive member provided so as to be in contact with the conductor layer inside at least one of the first and second openings. . Thereby, the width and pitch of the wiring can be miniaturized on the first surface side of the first insulating layer regardless of the size of the electronic component. Thereby, a sufficiently high wiring density is realized.

また、電子部品が実装される第１の絶縁層の第２の面側に、熱拡散部材が設けられている。ここで、配線回路基板に電子部品が実装されると、電子部品と熱拡散部材とが近接する。さらに、電子部品と熱拡散部材との間および第２の開口部内に、絶縁性を有しかつ熱伝導性を有する材料からなる封止樹脂が充填される。これにより、電子部品から発生される熱が熱拡散部材に伝達されやすくなる。その結果、電子部品の熱が熱拡散部材により拡散されるので、電子部品の放熱性が十分に向上する。 In addition, a heat diffusion member is provided on the second surface side of the first insulating layer on which the electronic component is mounted. Here, when the electronic component is mounted on the printed circuit board, the electronic component and the heat diffusing member come close to each other. Further, a sealing resin made of a material having insulating properties and thermal conductivity is filled between the electronic component and the heat diffusion member and in the second opening. Thereby, the heat generated from the electronic component is easily transmitted to the heat diffusing member. As a result, the heat of the electronic component is diffused by the heat diffusing member, so that the heat dissipation of the electronic component is sufficiently improved.

本発明に係る電子部品の実装構造および電子部品の実装方法によれば、端子部を備える電子部品が配線回路基板に実装される。配線回路基板において、第１の絶縁層の第１の面側に所定のパターンを有する導体層が設けられている。この導体層は配線として用いられる。また、第１の絶縁層の第２の面側において、開口部内に設けられる導電性部材に電子部品の端子部が接続される。これにより、電子部品の大きさにかかわらず、第１の絶縁層の第１の面側で配線の幅およびピッチを微細化することができる。それにより、配線の十分な高密度化が実現される。 According to the mounting structure and mounting method of the electronic component of the engagement Ru electronic components in the present invention, an electronic component comprising a terminal portion is mounted on the wiring circuit board. In the printed circuit board, a conductor layer having a predetermined pattern is provided on the first surface side of the first insulating layer. This conductor layer is used as a wiring. In addition, on the second surface side of the first insulating layer, a terminal portion of the electronic component is connected to a conductive member provided in the opening. Thereby, the width and pitch of the wiring can be miniaturized on the first surface side of the first insulating layer regardless of the size of the electronic component. Thereby, a sufficiently high wiring density is realized.

また、電子部品が実装される第１の絶縁層の第２の面側に、熱拡散部材が設けられている。ここで、配線回路基板に電子部品が実装されると、電子部品と熱拡散部材とが近接する。これにより、電子部品から発生される熱が熱拡散部材に伝達されやすくなる。その結果、電子部品の熱が熱拡散部材により拡散されるので、電子部品の放熱性が十分に向上する。   In addition, a heat diffusion member is provided on the second surface side of the first insulating layer on which the electronic component is mounted. Here, when the electronic component is mounted on the printed circuit board, the electronic component and the heat diffusing member come close to each other. Thereby, the heat generated from the electronic component is easily transmitted to the heat diffusing member. As a result, the heat of the electronic component is diffused by the heat diffusing member, so that the heat dissipation of the electronic component is sufficiently improved.

以下、本発明の一実施の形態に係る電子部品の実装構造および電子部品の実装方法について説明する。 The following describes how to implement the mounting structure and an electronic component engagement Ru electronic components to an embodiment of the present invention.

図１および図２は、本発明の一実施の形態に係る配線回路基板の製造方法の一例を説明するための製造工程図である。図３は、本発明の一実施の形態に係る電子部品の実装構造の一例を説明するための図である。   1 and 2 are manufacturing process diagrams for explaining an example of a method for manufacturing a printed circuit board according to an embodiment of the present invention. FIG. 3 is a diagram for explaining an example of a mounting structure for an electronic component according to an embodiment of the present invention.

本実施の形態に係る配線回路基板１００は、次のように作製される。   The printed circuit board 100 according to the present embodiment is manufactured as follows.

図１（ａ）に示すように、金属層１を用意し、その金属層１の上面にベース絶縁層２を形成する。   As shown in FIG. 1A, a metal layer 1 is prepared, and a base insulating layer 2 is formed on the upper surface of the metal layer 1.

金属層１としては、例えば、ステンレス箔、ニッケル箔または銅箔等の金属箔が用いられる。金属層１の厚みは約１０〜５０μｍであることが好ましい。また、ベース絶縁層２としては、例えばポリイミドフィルム等の絶縁性の樹脂が用いられる。ベース絶縁層２の厚みは約４〜２５μｍであることが好ましい。   As the metal layer 1, for example, a metal foil such as a stainless steel foil, a nickel foil, or a copper foil is used. The thickness of the metal layer 1 is preferably about 10 to 50 μm. As the base insulating layer 2, an insulating resin such as a polyimide film is used. The thickness of the base insulating layer 2 is preferably about 4 to 25 μm.

次に、図１（ｂ）に示すように、ベース絶縁層２の上面にスパッタリング等により金属薄膜３を形成する。金属薄膜３の厚みは、例えば約０．１５μｍである。金属薄膜３は複数の層により形成されてもよく、例えばクロム薄膜と銅薄膜との積層体であってもよい。   Next, as shown in FIG. 1B, a metal thin film 3 is formed on the upper surface of the base insulating layer 2 by sputtering or the like. The thickness of the metal thin film 3 is, for example, about 0.15 μm. The metal thin film 3 may be formed of a plurality of layers, for example, a laminate of a chromium thin film and a copper thin film.

続いて、図１（ｃ）に示すように、金属薄膜３の上面に所定のパターンのめっきレジスト４を形成し、めっきレジスト４の非形成領域にめっき法により配線となる導体層５を形成する。これによりめっきレジスト４と逆パターンの導体層５が金属薄膜３上に形成される。導体層５は、例えば電解銅めっき等により形成され、例えば約１０μｍの厚みを有する。   Subsequently, as shown in FIG. 1C, a plating resist 4 having a predetermined pattern is formed on the upper surface of the metal thin film 3, and a conductor layer 5 serving as a wiring is formed in a region where the plating resist 4 is not formed by plating. . As a result, a conductor layer 5 having a pattern opposite to that of the plating resist 4 is formed on the metal thin film 3. The conductor layer 5 is formed, for example, by electrolytic copper plating or the like, and has a thickness of about 10 μm, for example.

そこで、図１（ｄ）に示すように、めっきレジスト４をエッチングにより除去し、外部に露出する金属薄膜３をさらにエッチングにより除去する。   Therefore, as shown in FIG. 1D, the plating resist 4 is removed by etching, and the metal thin film 3 exposed to the outside is further removed by etching.

図１（ｅ）に示すように、外部に露出するベース絶縁層２の上面および導体層５および金属薄膜３を覆うように、カバー絶縁層６を形成する。カバー絶縁層６としては、例えばポリイミドフィルム等の絶縁性の樹脂が用いられる。カバー絶縁層６の厚みは約４〜２５μｍであることが好ましい。   As shown in FIG. 1E, an insulating cover layer 6 is formed so as to cover the upper surface of the insulating base layer 2 exposed to the outside, the conductor layer 5 and the metal thin film 3. As the insulating cover layer 6, for example, an insulating resin such as a polyimide film is used. The insulating cover layer 6 preferably has a thickness of about 4 to 25 μm.

その後、図２（ｆ）に示すように、金属層１の下面に所定のパターンのエッチングレジスト（図示せず）を形成し、金属層１のエッチングおよびエッチングレジストの除去を行う。これにより、エッチングレジストと逆パターンの金属層１が除去される。   Thereafter, as shown in FIG. 2F, an etching resist (not shown) having a predetermined pattern is formed on the lower surface of the metal layer 1, and the metal layer 1 is etched and the etching resist is removed. Thereby, the metal layer 1 having a pattern opposite to that of the etching resist is removed.

図２（ｆ）において、金属層１の非形成領域（以下、金属層開口部と呼ぶ。）Ｈには、後述する電子部品の端子が挿入される。したがって、金属層開口部Ｈはベース絶縁層２を介して金属薄膜３および導体層５と隣接する位置に形成されている。詳細は後述する。   In FIG. 2 (f), a terminal of an electronic component described later is inserted into a non-formation region (hereinafter referred to as a metal layer opening) H of the metal layer 1. Therefore, the metal layer opening H is formed at a position adjacent to the metal thin film 3 and the conductor layer 5 through the base insulating layer 2. Details will be described later.

さらに、図２（ｇ）に示すように、ベース絶縁層２の外部に露出した下面に所定のパターンのエッチングレジスト(図示せず）を形成し、ベース絶縁層２のエッチングおよびエッチングレジストの除去を行う。これにより、ベース絶縁層２に開口部ｈが形成され、金属薄膜３の下面の一部がベース絶縁層２に形成された開口部ｈおよび金属層開口部Ｈを通じて外部に露出する。なお、このエッチング工程において、ベース絶縁層２に形成される開口部ｈの大きさは、金属層開口部Ｈの大きさよりも小さくなるように設定する。   Further, as shown in FIG. 2G, an etching resist (not shown) having a predetermined pattern is formed on the lower surface exposed to the outside of the insulating base layer 2, and etching of the insulating base layer 2 and removal of the etching resist are performed. Do. As a result, an opening h is formed in the base insulating layer 2, and a part of the lower surface of the metal thin film 3 is exposed to the outside through the opening h formed in the base insulating layer 2 and the metal layer opening H. In this etching step, the size of the opening h formed in the base insulating layer 2 is set to be smaller than the size of the metal layer opening H.

図２（ｈ）に示すように、外部に露出した金属薄膜３の一部にめっき層７を形成する。めっき層７はニッケルめっき層および金めっき層等からなる。めっき層７は複数の層により形成されてもよく、例えばニッケルめっき層と金めっき層との積層体であってもよい。   As shown in FIG. 2H, a plating layer 7 is formed on a part of the metal thin film 3 exposed to the outside. The plating layer 7 includes a nickel plating layer, a gold plating layer, and the like. The plating layer 7 may be formed of a plurality of layers, for example, a laminate of a nickel plating layer and a gold plating layer.

最後に、図２（ｉ）に示すように、カバー絶縁層６の上面に接着剤層８を介して補強板９を貼り合わせる。接着剤層８としては、例えばエポキシ系接着剤またはポリイミド系接着剤等が用いられる。補強板９としては、例えば、ステンレス板またはアルミニウム板等の金属板が用いられる。補強板９の厚みは約５０〜５００μｍであることが好ましい。   Finally, as shown in FIG. 2 (i), the reinforcing plate 9 is bonded to the upper surface of the insulating cover layer 6 via the adhesive layer 8. For example, an epoxy adhesive or a polyimide adhesive is used as the adhesive layer 8. As the reinforcing plate 9, for example, a metal plate such as a stainless steel plate or an aluminum plate is used. The thickness of the reinforcing plate 9 is preferably about 50 to 500 μm.

上記の工程を経て、本実施の形態に係る配線回路基板１００が完成する。この配線回路基板１００においては、金属薄膜３、導体層５およびめっき層７により電子部品を接続するための端子部Ｔが構成されている。   Through the above steps, the printed circuit board 100 according to the present embodiment is completed. In the printed circuit board 100, the metal thin film 3, the conductor layer 5, and the plating layer 7 constitute a terminal portion T for connecting electronic components.

また、図２（ｉ）に示すように、本実施の形態に係る配線回路基板１００においては、補強板９がカバー絶縁層６上に設けられているが、補強板９は必ずしも必要ではない。   Further, as shown in FIG. 2I, in the printed circuit board 100 according to the present embodiment, the reinforcing plate 9 is provided on the insulating cover layer 6, but the reinforcing plate 9 is not necessarily required.

図３に示すように、配線回路基板１００に電子部品５００が実装される。本例において、電子部品５００は端子５１０および本体部５２０を備える。端子５１０は、例えばはんだバンプまたは金バンプである。   As shown in FIG. 3, an electronic component 500 is mounted on the printed circuit board 100. In this example, the electronic component 500 includes a terminal 510 and a main body 520. The terminal 510 is, for example, a solder bump or a gold bump.

図３において、電子部品５００の２つの端子５１０は、それぞれ配線回路基板１００の端子部Ｔに接続される。端子５１０がはんだバンプである場合、電子部品５００の端子５１０と配線回路基板１００の端子部Ｔとの接続は、はんだバンプを熱溶融することにより行われる。   In FIG. 3, two terminals 510 of the electronic component 500 are each connected to the terminal portion T of the printed circuit board 100. When the terminal 510 is a solder bump, the connection between the terminal 510 of the electronic component 500 and the terminal portion T of the printed circuit board 100 is performed by thermally melting the solder bump.

配線回路基板１００に電子部品５００が実装された状態で、配線回路基板１００と電子部品５００との間に封止樹脂５０を充填する。封止樹脂５０としては、例えば液状エポキシ樹脂が用いられる。   A sealing resin 50 is filled between the printed circuit board 100 and the electronic component 500 in a state where the electronic component 500 is mounted on the printed circuit board 100. For example, a liquid epoxy resin is used as the sealing resin 50.

封止樹脂５０が液状エポキシ樹脂である場合、配線回路基板１００および電子部品５００間に液状エポキシ樹脂を注入し、注入された液状エポキシ樹脂を熱硬化することにより配線回路基板１００および電子部品５００間を封止する。これにより、本実施の形態に係る電子部品の実装構造１００Ａが完成する。   In the case where the sealing resin 50 is a liquid epoxy resin, a liquid epoxy resin is injected between the printed circuit board 100 and the electronic component 500, and the injected liquid epoxy resin is thermally cured, thereby causing a gap between the printed circuit board 100 and the electronic component 500. Is sealed. Thereby, the electronic component mounting structure 100A according to the present embodiment is completed.

本実施の形態に係る配線回路基板１００においては、配線としての導体層５がベース絶縁層２の一面側に形成されている。また、ベース絶縁層２の他面側に電子部品５００を実装可能な端子部Ｔが露出している。これにより、電子部品５００の大きさにかかわらず、ベース絶縁層２の一面側で導体層５により形成される配線の幅およびピッチを微細化することができる。それにより、配線の十分な高密度化が実現される。   In the printed circuit board 100 according to the present embodiment, a conductor layer 5 as a wiring is formed on one surface side of the base insulating layer 2. Further, a terminal portion T on which the electronic component 500 can be mounted is exposed on the other surface side of the base insulating layer 2. Thereby, regardless of the size of the electronic component 500, the width and pitch of the wiring formed by the conductor layer 5 on one surface side of the base insulating layer 2 can be reduced. Thereby, a sufficiently high wiring density is realized.

また、配線回路基板１００においては、電子部品５００を実装するための端子部Ｔが金属層１に近接して形成されている。これにより、配線回路基板１００の端子部Ｔに実装された電子部品５００から発生される熱は、封止樹脂５０を通して近接する金属層１に伝達される。それにより、電子部品５００の熱が金属層１により拡散されるので、電子部品５００の放熱性が向上する。   Further, in the printed circuit board 100, a terminal portion T for mounting the electronic component 500 is formed close to the metal layer 1. Thereby, the heat generated from the electronic component 500 mounted on the terminal portion T of the printed circuit board 100 is transmitted to the adjacent metal layer 1 through the sealing resin 50. Thereby, since the heat of the electronic component 500 is diffused by the metal layer 1, the heat dissipation of the electronic component 500 is improved.

特に、配線回路基板１００および電子部品５００間に形成される封止樹脂５０が絶縁性を有し、熱伝導性を有する材料である場合、電子部品５００により発生される熱は効率よく金属層１に伝達され、放熱性がさらに向上する。   In particular, when the sealing resin 50 formed between the printed circuit board 100 and the electronic component 500 is a material having an insulating property and a thermal conductivity, the heat generated by the electronic component 500 is efficiently transferred to the metal layer 1. The heat dissipation is further improved.

樹脂の熱伝導性を向上させるために、樹脂にフィラーを添加したり、無機材料を添加してもよい。   In order to improve the thermal conductivity of the resin, a filler may be added to the resin or an inorganic material may be added.

本実施の形態において、配線回路基板１００の作製時にベース絶縁層２に形成される開口部ｈの大きさは、金属層１の金属層開口部Ｈの大きさよりも小さく設定される。これにより、配線回路基板１００の端子部Ｔと金属層１との短絡が防止される。   In the present embodiment, the size of the opening h formed in the base insulating layer 2 when the printed circuit board 100 is manufactured is set smaller than the size of the metal layer opening H of the metal layer 1. Thereby, the short circuit with the terminal part T of the printed circuit board 100 and the metal layer 1 is prevented.

上記のように、配線回路基板１００と電子部品５００との間には封止樹脂５０が充填される。それにより、配線回路基板１００の端子部Ｔおよび電子部品５００の端子５１０の劣化が防止され、配線回路基板１００および電子部品５００の長寿命化が実現される。   As described above, the sealing resin 50 is filled between the printed circuit board 100 and the electronic component 500. Accordingly, the terminal portion T of the printed circuit board 100 and the terminal 510 of the electronic component 500 are prevented from being deteriorated, and the life of the wired circuit board 100 and the electronic component 500 is extended.

図３の配線回路基板１００および電子部品の実装構造１００Ａにおいて、金属層１は熱拡散部材に相当し、ベース絶縁層２の上面は第１の面に相当し、ベース絶縁層２の下面は第２の面に相当する。   In the printed circuit board 100 and the electronic component mounting structure 100A in FIG. 3, the metal layer 1 corresponds to a heat diffusion member, the upper surface of the base insulating layer 2 corresponds to the first surface, and the lower surface of the base insulating layer 2 corresponds to the first surface. It corresponds to the surface of 2.

また、ベース絶縁層２は第１の絶縁層に相当し、カバー絶縁層６は第２の絶縁層に相当し、めっき層７は導電性部材に相当し、金属薄膜３および導体層５は導体層に相当する。さらに、図２（ｇ）の開口部ｈは開口部に相当する。   The base insulating layer 2 corresponds to a first insulating layer, the cover insulating layer 6 corresponds to a second insulating layer, the plating layer 7 corresponds to a conductive member, and the metal thin film 3 and the conductor layer 5 are conductors. Corresponds to the layer. Further, the opening h in FIG. 2G corresponds to the opening.

（配線回路基板の製造方法および電子部品の実装構造の他の例）
図４および図５は、本発明の一実施の形態に係る配線回路基板の製造方法の他の例を説明するための製造工程図である。図６は、本発明の一実施の形態に係る電子部品の実装構造の他の例を説明するための図である。 (Other example of printed circuit board manufacturing method and electronic component mounting structure)
4 and 5 are manufacturing process diagrams for explaining another example of the method for manufacturing the printed circuit board according to the embodiment of the present invention. FIG. 6 is a diagram for explaining another example of the electronic component mounting structure according to the embodiment of the present invention.

この配線回路基板２００は、次のように作製される。   The printed circuit board 200 is manufactured as follows.

図４（ａ）に示すように、金属層１を用意し、金属層１の上面にベース絶縁層２を所定のパターンで形成する。それにより、金属層１の上面においては、ベース絶縁層２の開口部ｈが形成される。   As shown in FIG. 4A, a metal layer 1 is prepared, and a base insulating layer 2 is formed on the upper surface of the metal layer 1 in a predetermined pattern. Thereby, an opening h of the base insulating layer 2 is formed on the upper surface of the metal layer 1.

その後、図４（ｂ）金属層１の露出した上面およびベース絶縁層２の上面および側面を覆うように金属薄膜３を形成する。   Thereafter, the metal thin film 3 is formed so as to cover the exposed upper surface of the metal layer 1 and the upper surface and side surfaces of the base insulating layer 2 in FIG.

続いて、図４（ｃ）に示すように、第１の実施の形態と同様の手順で金属薄膜３の上面にめっきレジスト４を形成し、めっき法により導体層５を形成する。   Subsequently, as shown in FIG. 4C, a plating resist 4 is formed on the upper surface of the metal thin film 3 in the same procedure as in the first embodiment, and a conductor layer 5 is formed by a plating method.

そして、図４（ｄ）に示すように、めっきレジスト４をエッチングにより除去し、外部に露出する金属薄膜３をさらにエッチングにより除去する。   Then, as shown in FIG. 4D, the plating resist 4 is removed by etching, and the metal thin film 3 exposed to the outside is further removed by etching.

そこで、図５（ｅ）に示すように、第１の実施の形態と同様の手順で外部に露出するベース絶縁層２の上面および導体層５および金属薄膜３を覆うように、カバー絶縁層６を形成する。また、図５（ｆ）に示すように、金属層１の下面に所定のパターンのエッチングレジスト（図示せず）を形成し、金属層１のエッチングおよびエッチングレジストの除去を行う。これにより、エッチングレジストと逆パターンの金属層１が除去される。   Therefore, as shown in FIG. 5E, the insulating cover layer 6 is formed so as to cover the upper surface of the insulating base layer 2 exposed to the outside, the conductor layer 5 and the metal thin film 3 in the same procedure as in the first embodiment. Form. Further, as shown in FIG. 5F, an etching resist (not shown) having a predetermined pattern is formed on the lower surface of the metal layer 1, and the metal layer 1 is etched and the etching resist is removed. Thereby, the metal layer 1 having a pattern opposite to that of the etching resist is removed.

それにより、第１の実施の形態と同様に、金属層開口部Ｈが形成される。ここで、上記の金属層１のエッチング工程において、金属層１の金属層開口部Ｈの大きさは、図５（ａ）の工程において形成されたベース絶縁層２の開口部ｈの大きさよりも大きくなるように設定する。   Thereby, the metal layer opening H is formed as in the first embodiment. Here, in the etching process of the metal layer 1, the size of the metal layer opening H of the metal layer 1 is larger than the size of the opening h of the base insulating layer 2 formed in the process of FIG. Set to be larger.

図５（ｆ）の金属層開口部Ｈにおいては、金属薄膜３の一部およびベース絶縁層２の一部が露出している。   In the metal layer opening H of FIG. 5F, a part of the metal thin film 3 and a part of the base insulating layer 2 are exposed.

最後に、図５（ｇ）に示すように、金属層開口部Ｈに露出した金属薄膜３の一部にめっき層７を形成する。これにより、金属薄膜３、導体層５およびめっき層７からなる配線回路基板２００の端子部Ｔが形成され、配線回路基板２００が完成する。   Finally, as shown in FIG. 5G, the plating layer 7 is formed on a part of the metal thin film 3 exposed in the metal layer opening H. Thereby, the terminal part T of the wiring circuit board 200 which consists of the metal thin film 3, the conductor layer 5, and the plating layer 7 is formed, and the wiring circuit board 200 is completed.

なお、本例においても、カバー絶縁層６の上面に接着剤層８を介して補強板９を張り合わせてもよい。   In this example as well, the reinforcing plate 9 may be bonded to the upper surface of the insulating cover layer 6 via the adhesive layer 8.

図６に示すように、作製された配線回路基板２００の端子部Ｔに電子部品５００を実装する。これにより、電子部品の実装構造２００Ａが完成する。   As shown in FIG. 6, the electronic component 500 is mounted on the terminal portion T of the manufactured printed circuit board 200. Thus, the electronic component mounting structure 200A is completed.

本例の配線回路基板２００の製造時においては、金属層１の上面へのベース絶縁層２の形成時に、ベース絶縁層２のパターニングを行っている。これにより、後工程でベース絶縁層２の開口部ｈを形成する工程を省略することができる。その結果、工程数および製造時間の軽減を実現することができる。   At the time of manufacturing the printed circuit board 200 of this example, the base insulating layer 2 is patterned when the base insulating layer 2 is formed on the upper surface of the metal layer 1. Thereby, the process of forming the opening h of the base insulating layer 2 in a subsequent process can be omitted. As a result, reduction in the number of processes and manufacturing time can be realized.

図６の配線回路基板２００および電子部品の実装構造２００Ａにおいて、金属層１は熱拡散部材に相当し、ベース絶縁層２の上面は第１の面に相当し、ベース絶縁層２の下面は第２の面に相当する。   In the printed circuit board 200 and the electronic component mounting structure 200A of FIG. 6, the metal layer 1 corresponds to a heat diffusion member, the upper surface of the base insulating layer 2 corresponds to the first surface, and the lower surface of the base insulating layer 2 corresponds to the first surface. It corresponds to the surface of 2.

また、ベース絶縁層２は第１の絶縁層に相当し、カバー絶縁層６は第２の絶縁層に相当し、めっき層７は導電性部材に相当し、金属薄膜３および導体層５は導体層に相当する。さらに、図４（ａ）の開口部ｈは開口部に相当する。   The base insulating layer 2 corresponds to a first insulating layer, the cover insulating layer 6 corresponds to a second insulating layer, the plating layer 7 corresponds to a conductive member, and the metal thin film 3 and the conductor layer 5 are conductors. Corresponds to the layer. Furthermore, the opening h in FIG. 4A corresponds to the opening.

（配線回路基板の製造方法および電子部品の実装構造のさらに他の例）
図７は、本発明の一実施の形態に係る電子部品の実装構造のさらに他の例を説明するための図である。本例に係る電子部品の実装構造を構成する配線回路基板３００の製造方法については、図示を省略する。 (Still another example of printed circuit board manufacturing method and electronic component mounting structure)
FIG. 7 is a view for explaining still another example of the electronic component mounting structure according to the embodiment of the present invention. An illustration of the manufacturing method of the printed circuit board 300 constituting the electronic component mounting structure according to this example is omitted.

この配線回路基板３００は、例えば次のように作製される。   For example, the printed circuit board 300 is manufactured as follows.

初めに、ベース絶縁層２を用意し、ベース絶縁層２の上面に導体層５を所定のパターンで形成する。   First, the base insulating layer 2 is prepared, and the conductor layer 5 is formed in a predetermined pattern on the upper surface of the base insulating layer 2.

続いて、ベース絶縁層２および導体層５の上面を覆うようにカバー絶縁層６を形成する。そこで、カバー絶縁層６の所定の箇所に開口部を設ける。この開口部は導体層５の一部が外部に露出するように形成される。そして、カバー絶縁層６の開口部を介して外部に露出する導体層５上にめっき層７を形成する。これにより、本例に係る配線回路基板３００においては、導体層５およびめっき層７からなる配線回路基板３００の端子部Ｔが形成される。   Subsequently, the insulating cover layer 6 is formed so as to cover the upper surfaces of the insulating base layer 2 and the conductor layer 5. Therefore, an opening is provided at a predetermined location of the insulating cover layer 6. The opening is formed so that a part of the conductor layer 5 is exposed to the outside. Then, the plating layer 7 is formed on the conductor layer 5 exposed to the outside through the opening of the insulating cover layer 6. Thereby, in the printed circuit board 300 according to the present example, the terminal portion T of the printed circuit board 300 including the conductor layer 5 and the plating layer 7 is formed.

次に、カバー絶縁層６の上面に所定のパターンで金属層１を形成する。この金属層１は、カバー絶縁層６の開口部およびその周辺を除く所定領域に形成される。そこで、外部に露出するめっき層７に電子部品５００の端子５１０を接続し、配線回路基板３００と電子部品５００との間に封止樹脂５０を充填することにより、電子部品５００を配線回路基板３００に実装する。このようにして、電子部品の実装構造３００Ａが完成する。   Next, the metal layer 1 is formed in a predetermined pattern on the upper surface of the cover insulating layer 6. The metal layer 1 is formed in a predetermined region excluding the opening of the insulating cover layer 6 and its periphery. Therefore, the terminal 510 of the electronic component 500 is connected to the plating layer 7 exposed to the outside, and the sealing resin 50 is filled between the printed circuit board 300 and the electronic component 500, whereby the electronic component 500 is connected to the printed circuit board 300. To implement. In this manner, the electronic component mounting structure 300A is completed.

本例においても、ベース絶縁層２の下面に接着剤層８を介して補強板９を張り合わせてもよい。   Also in this example, the reinforcing plate 9 may be bonded to the lower surface of the base insulating layer 2 via the adhesive layer 8.

図７の配線回路基板３００および電子部品の実装構造３００Ａにおいて、金属層１は熱拡散部材に相当し、カバー絶縁層６の下面は第１の面に相当し、カバー絶縁層６の上面は第２の面に相当する。   In the printed circuit board 300 and the electronic component mounting structure 300A of FIG. 7, the metal layer 1 corresponds to a heat diffusion member, the lower surface of the cover insulating layer 6 corresponds to the first surface, and the upper surface of the cover insulating layer 6 corresponds to the first surface. It corresponds to the surface of 2.

また、カバー絶縁層６は第１の絶縁層に相当し、ベース絶縁層２は第２の絶縁層に相当し、めっき層７は導電性部材に相当し、導体層５は導体層に相当する。   The insulating cover layer 6 corresponds to the first insulating layer, the insulating base layer 2 corresponds to the second insulating layer, the plated layer 7 corresponds to the conductive member, and the conductive layer 5 corresponds to the conductive layer. .

［実施例１］
図１および図２を用いて説明した配線回路基板１００の作製方法に基づいて実施例１の配線回路基板１００および電子部品の実装構造１００Ａを作製した。 [Example 1]
A printed circuit board 100 and an electronic component mounting structure 100A of Example 1 were produced based on the production method of the wired circuit board 100 described with reference to FIGS.

初めに、金属層１として厚み１８μｍのステンレス箔を用意し、その金属層１の上面に厚み４μｍの感光性ポリイミドからなるベース絶縁層２を形成した。   First, a stainless foil having a thickness of 18 μm was prepared as the metal layer 1, and a base insulating layer 2 made of photosensitive polyimide having a thickness of 4 μm was formed on the upper surface of the metal layer 1.

次に、ベース絶縁層２の上面にスパッタリングにより厚み０．１５μｍの金属薄膜３を形成した。金属薄膜３は厚み０．０３μｍのクロム薄膜と厚み０．１２μｍの銅薄膜とをベース絶縁層２の上面に順に積層することにより形成した。   Next, a metal thin film 3 having a thickness of 0.15 μm was formed on the upper surface of the insulating base layer 2 by sputtering. The metal thin film 3 was formed by sequentially laminating a chromium thin film having a thickness of 0.03 μm and a copper thin film having a thickness of 0.12 μm on the upper surface of the base insulating layer 2.

続いて、金属薄膜３の上面に所定のパターンのめっきレジスト４を形成し、めっきレジスト４の非形成領域に電解銅めっきにより導体層５を形成した。これによりめっきレジスト４と逆パターンの導体層５が金属薄膜３上に形成された。導体層５の厚みは１０μｍであった。そして、めっきレジスト４をエッチングにより除去し、それにより外部に露出する金属薄膜３をさらにエッチングにより除去した。   Subsequently, a plating resist 4 having a predetermined pattern was formed on the upper surface of the metal thin film 3, and a conductor layer 5 was formed in an area where the plating resist 4 was not formed by electrolytic copper plating. As a result, a conductor layer 5 having a pattern opposite to that of the plating resist 4 was formed on the metal thin film 3. The thickness of the conductor layer 5 was 10 μm. Then, the plating resist 4 was removed by etching, whereby the metal thin film 3 exposed to the outside was further removed by etching.

そこで、外部に露出するベース絶縁層２の上面および導体層５および金属薄膜３を覆うように、感光性ポリイミドからなるカバー絶縁層６を形成した。カバー絶縁層６の厚みは１０μｍであった。   Therefore, a cover insulating layer 6 made of photosensitive polyimide is formed so as to cover the upper surface of the base insulating layer 2 exposed to the outside, the conductor layer 5 and the metal thin film 3. The cover insulating layer 6 had a thickness of 10 μm.

その後、金属層１の下面に所定のパターンのエッチングレジストを形成し、金属層１のエッチングおよびエッチングレジストの除去を行った。これにより、エッチングレジストと逆パターンの金属層１がベース絶縁層２の下面に形成され、金属層開口部Ｈが形成された。   Thereafter, an etching resist having a predetermined pattern was formed on the lower surface of the metal layer 1, and the metal layer 1 was etched and the etching resist was removed. As a result, the metal layer 1 having a pattern opposite to that of the etching resist was formed on the lower surface of the base insulating layer 2, and the metal layer opening H was formed.

金属層開口部Ｈに露出したベース絶縁層２の下面に所定のパターンのエッチングレジストを形成し、ベース絶縁層２のエッチングおよびエッチングレジストの除去を行った。これにより、ベース絶縁層２に開口部ｈが形成された。   An etching resist having a predetermined pattern was formed on the lower surface of the base insulating layer 2 exposed in the metal layer opening H, and the base insulating layer 2 was etched and the etching resist was removed. As a result, an opening h was formed in the base insulating layer 2.

ベース絶縁層２に形成された開口部ｈに露出した金属薄膜３の一部にめっき層７を形成した。めっき層７は、厚み２μｍのニッケルめっき層および厚み０．１μｍの金めっき層を順に積層することにより形成した。   A plating layer 7 was formed on a part of the metal thin film 3 exposed in the opening h formed in the base insulating layer 2. The plating layer 7 was formed by sequentially laminating a nickel plating layer having a thickness of 2 μm and a gold plating layer having a thickness of 0.1 μm.

最後に、カバー絶縁層６の上面に接着剤層８を介して補強板９を貼り合わせた。接着剤層８としては、厚み２５μｍのエポキシ系接着剤を用いた。補強板９としては、厚み３００μｍのアルミニウム板を用いた。これにより、図２（ｉ）に示す構造を有する実施例１の配線回路基板１００を完成した。   Finally, the reinforcing plate 9 was bonded to the upper surface of the cover insulating layer 6 via the adhesive layer 8. As the adhesive layer 8, an epoxy adhesive having a thickness of 25 μm was used. As the reinforcing plate 9, an aluminum plate having a thickness of 300 μm was used. Thereby, the printed circuit board 100 of Example 1 having the structure shown in FIG.

完成された配線回路基板１００に端子５１０としてはんだパンプを備える電子部品５００を実装した。この実装は、配線回路基板１００の金属薄膜３、導体層５およびめっき層７からなる端子部Ｔに電子部品５００の端子５１０を熱溶融することにより行った。電子部品５００としては、半導体素子を用いた。   An electronic component 500 having a solder bump as a terminal 510 was mounted on the completed printed circuit board 100. This mounting was performed by thermally melting the terminal 510 of the electronic component 500 in the terminal portion T including the metal thin film 3, the conductor layer 5, and the plating layer 7 of the printed circuit board 100. As the electronic component 500, a semiconductor element was used.

そして、配線回路基板１００と電子部品５００との間に液状エポキシ樹脂からなる封止樹脂５０を注入し、熱硬化させた。それにより、図３に示す構造を有する実施例１の電子部品の実装構造１００Ａを完成した。   Then, a sealing resin 50 made of a liquid epoxy resin was injected between the printed circuit board 100 and the electronic component 500 and thermally cured. Thus, the electronic component mounting structure 100A of Example 1 having the structure shown in FIG. 3 was completed.

［実施例２］
図４および図５を用いて説明した配線回路基板２００の作製方法に基づいて実施例２の配線回路基板２００および電子部品の実装構造２００Ａを作製した。作製方法は、以下の点を除き実施例１の配線回路基板１００および電子部品の実装構造１００Ａと同じである。 [Example 2]
A printed circuit board 200 and an electronic component mounting structure 200A of Example 2 were produced based on the production method of the wired circuit board 200 described with reference to FIGS. The manufacturing method is the same as that of the printed circuit board 100 and the electronic component mounting structure 100A of Example 1 except for the following points.

実施例２の配線回路基板２００の作製時においては、初めに厚み１８μｍのステンレス箔を金属層１として用意し、予め所定のパターンで厚み４μｍの感光性ポリイミドからなるベース絶縁層２を形成した。   When the printed circuit board 200 of Example 2 was manufactured, first, a stainless steel foil having a thickness of 18 μm was prepared as the metal layer 1, and a base insulating layer 2 made of photosensitive polyimide having a thickness of 4 μm was previously formed in a predetermined pattern.

金属層１上においては所定のパターンでベース絶縁層２が形成されることにより、ベース絶縁層２の開口部ｈが予め形成される。   On the metal layer 1, the base insulating layer 2 is formed in a predetermined pattern, so that the opening h of the base insulating layer 2 is formed in advance.

その後、実施例１の配線回路基板１００の作製時と同じ手順で図５（ｇ）に示す構造を有する配線回路基板２００を完成し、半導体素子である電子部品５００を実装した。それにより、図６に示す構造を有する電子部品の実装構造２００Ａを完成した。   Thereafter, a printed circuit board 200 having the structure shown in FIG. 5G was completed by the same procedure as that for producing the printed circuit board 100 of Example 1, and an electronic component 500 as a semiconductor element was mounted. Thereby, an electronic component mounting structure 200A having the structure shown in FIG. 6 was completed.

なお、実施例２の配線回路基板２００および電子部品の実装構造２００Ａにおいて、カバー絶縁層６の一面には図５（ｇ）および図６で図示しない接着剤層８および補強板９が形成されている。   In the printed circuit board 200 and the electronic component mounting structure 200A according to the second embodiment, an adhesive layer 8 and a reinforcing plate 9 (not shown in FIGS. 5G and 6) are formed on one surface of the cover insulating layer 6. Yes.

［評価］
電子部品５００が実装された実施例１および実施例２の配線回路基板１００，２００について、電子部品５００に通電した。その結果、電子部品５００が効率的に放熱され、電子部品５００の誤動作は生じなかった。 [Evaluation]
The electronic component 500 was energized with respect to the printed circuit boards 100 and 200 of Example 1 and Example 2 on which the electronic component 500 was mounted. As a result, the electronic component 500 is efficiently radiated and no malfunction of the electronic component 500 occurs.

本発明は、電子部品を備える電子機器および電子部品を実装する基板等に有効に利用できる。   INDUSTRIAL APPLICABILITY The present invention can be effectively used for an electronic device including an electronic component, a substrate on which the electronic component is mounted, and the like.

本発明の一実施の形態に係る配線回路基板の製造方法の一例を説明するための製造工程図である。It is a manufacturing process figure for demonstrating an example of the manufacturing method of the printed circuit board which concerns on one embodiment of this invention. 本発明の一実施の形態に係る配線回路基板の製造方法の一例を説明するための製造工程図である。It is a manufacturing process figure for demonstrating an example of the manufacturing method of the printed circuit board which concerns on one embodiment of this invention. 本発明の一実施の形態に係る電子部品の実装構造の一例を説明するための図である。It is a figure for demonstrating an example of the mounting structure of the electronic component which concerns on one embodiment of this invention. 本発明の一実施の形態に係る配線回路基板の製造方法の他の例を説明するための製造工程図である。It is a manufacturing process figure for demonstrating the other example of the manufacturing method of the printed circuit board which concerns on one embodiment of this invention. 本発明の一実施の形態に係る配線回路基板の製造方法の他の例を説明するための製造工程図である。It is a manufacturing process figure for demonstrating the other example of the manufacturing method of the printed circuit board which concerns on one embodiment of this invention. 本発明の一実施の形態に係る電子部品の実装構造の他の例を説明するための図である。It is a figure for demonstrating the other example of the mounting structure of the electronic component which concerns on one embodiment of this invention. 本発明の一実施の形態に係る電子部品の実装構造のさらに他の例を説明するための図である。It is a figure for demonstrating the further another example of the mounting structure of the electronic component which concerns on one embodiment of this invention. 特許文献１の実装配線基板の構造を示す図である。It is a figure which shows the structure of the mounting wiring board of patent document 1. FIG.

符号の説明Explanation of symbols

１ 金属層
２ ベース絶縁層
３ 金属薄膜
５ 導体層
６ カバー絶縁層
７ めっき層
９ 補強板
５０ 封止樹脂
１００，２００，３００ 配線回路基板
５００ 電子部品
５１０ 端子
１００Ａ，２００Ａ，３００Ａ 電子部品の実装構造
DESCRIPTION OF SYMBOLS 1 Metal layer 2 Base insulating layer 3 Metal thin film 5 Conductor layer 6 Cover insulating layer 7 Plating layer 9 Reinforcing plate 50 Sealing resin 100, 200, 300 Wiring circuit board 500 Electronic component 510 Terminal 100A, 200A, 300A Mounting structure of electronic component

Claims (5)

端子部を備える電子部品と、
前記電子部品が実装される配線回路基板とを備え、
前記配線回路基板は、
第１および第２の面を有するとともに、所定位置に前記第１の面から前記第２の面に連通する第１の開口部を有する第１の絶縁層と、
前記第１の絶縁層の前記第１の面側の前記第１の開口部を含む領域上に設けられ、所定のパターンを有する導体層と、
前記第１の絶縁層の前記第２の面側に設けられ、前記第１の絶縁層の前記第１の開口部に連通する第２の開口部を有する熱拡散部材と、
前記第１および第２の開口部の少なくとも一方の内部で前記導体層に接するように設けられる導電性部材とを備え、
前記第１の絶縁層の前記第２の面側に実装される前記電子部品の前記端子部が前記導電性部材に接続され、
前記電子部品と前記熱拡散部材との間および前記第２の開口部内に、絶縁性を有しかつ熱伝導性を有する材料からなる封止樹脂が充填されたことを特徴とする電子部品の実装構造。 An electronic component comprising a terminal part;
A printed circuit board on which the electronic component is mounted,
The wired circuit board is:
A first insulating layer having first and second surfaces and having a first opening communicating with the second surface from the first surface at a predetermined position;
A conductor layer provided on a region including the first opening on the first surface side of the first insulating layer and having a predetermined pattern;
The first we provided on the second surface side of the insulating layer is a heat diffusion member having a second opening communicating with the first opening of the first insulating layer,
And a first and second at least one of the inside conductive members disposed in contact with the conductive layer of the opening,
The terminal part of the electronic component mounted on the second surface side of the first insulating layer is connected to the conductive member ;
Mounting of an electronic component characterized in that a sealing resin made of a material having an insulating property and a thermal conductivity is filled between the electronic component and the heat diffusion member and in the second opening. Construction. 前記封止樹脂は、フィラーが添加された樹脂、または無機材料が添加された樹脂からなることを特徴とする請求項１記載の電子部品の実装構造。2. The electronic component mounting structure according to claim 1, wherein the sealing resin is made of a resin to which a filler is added or a resin to which an inorganic material is added. 前記第１の絶縁層の前記第１の面側で、前記第１の絶縁層の前記第１の面および前記導体層を覆うように第２の絶縁層が設けられることを特徴とする請求項１または２記載の電子部品の実装構造。The second insulating layer is provided on the first surface side of the first insulating layer so as to cover the first surface of the first insulating layer and the conductor layer. The mounting structure of the electronic component of 1 or 2. 前記第２の絶縁層上に補強板が設けられることを特徴とする請求項３記載の電子部品の実装構造。4. The electronic component mounting structure according to claim 3, wherein a reinforcing plate is provided on the second insulating layer. 端子部を備える電子部品を配線回路基板に実装する電子部品の実装方法であって、
第１および第２の面を有するとともに、所定位置に前記第１の面から前記第２の面に連通する第１の開口部を有する第１の絶縁層を形成する工程と、
前記第１の絶縁層の前記第１の面側の前記第１の開口部を含む領域上に所定のパターンを有する導体層を設ける工程と、
前記第１の絶縁層の前記第２の面側に前記第１の絶縁層の前記第１の開口部に連通する第２の開口部を有する熱拡散部材を設ける工程と、
前記第１および第２の開口部の少なくとも一方の内部で前記導体層に接するように導電性部材を設けることにより前記配線回路基板を作製する工程と、
前記電子部品の前記端子部を前記導電性部材に接続し、前記配線回路基板の前記第１の絶縁層の前記第２の面側に前記電子部品を実装する工程と、
前記電子部品と前記熱拡散部材との間および前記第２の開口部内に、絶縁性を有しかつ熱伝導性を有する材料からなる封止樹脂を充填する工程とを含むことを特徴とする電子部品の実装方法。 An electronic component mounting method for mounting an electronic component including a terminal portion on a printed circuit board,
Forming a first insulating layer having first and second surfaces and having a first opening communicating with the second surface from the first surface at a predetermined position;
Providing a conductor layer having a predetermined pattern on a region including the first opening on the first surface side of the first insulating layer ;
And as the previous SL first insulating layer and the second second Engineering of Ru formed thermal diffusion member having an opening communicating with the first opening of the first insulating layer on the side of,
A step of manufacturing the printed circuit board by kicking setting the conductive member as in at least one of the interior of the first and second openings in contact with the conductive layer,
Connecting the terminal portion of the electronic component to the conductive member, and mounting the electronic component on the second surface side of the first insulating layer of the wired circuit board ;
Filling a sealing resin made of a material having an insulating property and a thermal conductivity between the electronic component and the heat diffusing member and in the second opening. Component mounting method.
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Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0832199A (en) * 1994-07-19 1996-02-02 Fujitsu Ltd Structure of mounting ic chip on circuit board, and mounting method
JP2003023250A (en) * 2001-07-06 2003-01-24 Denso Corp Multilayered substrate and its manufacturing method

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0832199A (en) * 1994-07-19 1996-02-02 Fujitsu Ltd Structure of mounting ic chip on circuit board, and mounting method
JP2003023250A (en) * 2001-07-06 2003-01-24 Denso Corp Multilayered substrate and its manufacturing method

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