JP4665946B2 - Method for evaluating resin chipping and method for producing composite material - Google Patents

Method for evaluating resin chipping and method for producing composite material Download PDF

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JP4665946B2
JP4665946B2 JP2007174216A JP2007174216A JP4665946B2 JP 4665946 B2 JP4665946 B2 JP 4665946B2 JP 2007174216 A JP2007174216 A JP 2007174216A JP 2007174216 A JP2007174216 A JP 2007174216A JP 4665946 B2 JP4665946 B2 JP 4665946B2
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composite material
resin
sample
warpage
amount
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JP2007246925A (en
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達也 渡辺
誠 小山
和栄 遠藤
昌二 橋本
清孝 古森
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Panasonic Corp
Panasonic Electric Works Co Ltd
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Matsushita Electric Works Ltd
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Description

本発明は、レジンクロスやプリプレグなどの複合材料に含有された樹脂の片付き(偏り)を評価する方法及びこの評価結果を用いた複合材料の製造方法に関するものである。   The present invention relates to a method for evaluating the fragmentation (bias) of a resin contained in a composite material such as a resin cloth or a prepreg, and a method for manufacturing a composite material using the evaluation result.

レジンクロスやプリプレグなどの複合材料に含有された樹脂が複合材料の厚み方向の一方向に偏っていると、プリント配線板などの電気用積層板に使用した場合に反りが発生しやすい。そこで、従来では、積層プレス条件を評価するための複合材料を用いて複合材料中の樹脂の流れ等を評価することが行なわれている(例えば、特許文献1参照)。また、
複合材料を加熱加圧硬化させた後、その断面を拡大して樹脂の片付きを計測することにより、樹脂の片付きを確認するようにしていた。
If the resin contained in the composite material such as resin cloth or prepreg is biased in one direction in the thickness direction of the composite material, warping tends to occur when it is used for an electrical laminate such as a printed wiring board. Therefore, conventionally, the flow of resin in the composite material and the like have been evaluated using a composite material for evaluating the lamination press condition (see, for example, Patent Document 1). Also,
After the composite material was heated and pressurized and cured, the cross section was enlarged and the resin fragmentation was measured to confirm the resin fragmentation.

しかしながら、このような方法で樹脂の片付きを確認すると、測定に時間がかかり、複合材料の製造工程にフィードバックをかけるのが遅れたり、測定者による測定値のバラツキが多いという問題があった。
特開平5−39372号公報
However, if the resin is separated by such a method, there are problems that it takes a long time to measure, delays in applying feedback to the manufacturing process of the composite material, and there are many variations in measured values by the measurer.
JP-A-5-39372

本発明は上記の点に鑑みてなされたものであり、測定に時間がかからず、また、測定者による評価のバラツキを少なくすることができる樹脂の片付き評価方法を提供することを目的とするものである。また、本発明は、この樹脂の片付き評価方法を用いた複合材料の製造方法を提供することを目的とするものである。   The present invention has been made in view of the above points, and it is an object of the present invention to provide a resin-sided evaluation method that does not take a long time for measurement and can reduce variations in evaluation by a measurer. Is. Moreover, this invention aims at providing the manufacturing method of the composite material using this evaluation method with a piece of resin.

本発明は、織布又は不織布の基材1に樹脂ワニス2を含浸乾燥して得られたBステージ状態の複合材料Aを吊り下げた状態にして加熱によるエネルギーを加えた後、該複合材料Aの反りを測定するにあたって、加熱温度が100℃よりも高い温度で且つ300℃以下であり、加熱された熱風Wの噴出し口30と前記複合材料Aの間に330メッシュ以上の網目構造の遮蔽板6を配置することを特徴とするものである。   In the present invention, a composite material A in a B-stage state obtained by impregnating and drying a resin varnish 2 on a woven or non-woven base material 1 is suspended and energy is applied by heating. In the measurement of the warpage, the heating temperature is higher than 100 ° C. and not higher than 300 ° C., and the mesh structure of 330 mesh or more is shielded between the outlet 30 of the heated hot air W and the composite material A. A plate 6 is arranged.

また、本発明は、織布または不織布の基材1に樹脂ワニス2を含浸乾燥する工程を含む複合材料Aの製造方法において、上記請求項1に記載の樹脂の片付き評価方法で得られた評価結果に基づき、含浸条件を変更することを特徴とするものである。 Further, the present invention is obtained in the substrate 1 of a woven or non-woven in the manufacturing method of a composite material A comprising a step of impregnating dry the resin varnish 2, in the first aspect-out with single evaluation method of the resin according to The impregnation conditions are changed based on the obtained evaluation results.

本発明によれば、複合材料の反りを評価する際に、その極小の断面を拡大したり極小の断面において樹脂量を測定したりする必要がないようにすることができ、測定に時間がかからず、また、測定者による評価のバラツキを少なくすることができるものである。   According to the present invention, when evaluating the warpage of a composite material, it is not necessary to enlarge the minimum cross section or to measure the amount of resin in the minimum cross section. In addition, variation in evaluation by the measurer can be reduced.

また、エネルギーが加熱によるので、複雑な装置を必要とせず、簡便に樹脂の片付きを評価することができるものである。   Moreover, since energy is based on heating, a complicated apparatus is not required, and it is possible to easily evaluate resin fragmentation.

また、100℃よりも高い温度で且つ300℃以下で加熱することにより、加熱時間をさらに短時間にしても複合材料中の揮発成分の揮発を充分に行うことができ、さらに短時間で正確な反りを測定することができるものである。   In addition, by heating at a temperature higher than 100 ° C. and not higher than 300 ° C., the volatile components in the composite material can be sufficiently volatilized even if the heating time is further shortened, and accurate in a shorter time. The warp can be measured.

また、加熱された熱風の噴出し口と複合材料の間に遮蔽板を置くことにより、熱風が複合材料に直接当たりにくくすることができ、複合材料に加えられるエネルギーが偏るのを防止して正確な反りを測定することができるものである。   Also, by placing a shielding plate between the heated hot air outlet and the composite material, the hot air can be prevented from directly hitting the composite material, and the energy applied to the composite material is prevented from being biased and accurate. Can be measured.

また、遮蔽板が330メッシュ以上の網目構造であると、複合材料に加えられるエネルギーが不要に遮られることがなく、短時間で反りを測定することができるものである。   Further, when the shielding plate has a mesh structure of 330 mesh or more, energy applied to the composite material is not unnecessarily blocked, and warpage can be measured in a short time.

また、複合材料を吊り下げた状態にしてエネルギーを加えると、複合材料に均一にエネルギーを加えることができ、複合材料からの揮発成分の揮発や樹脂の硬化が不均一になることが少なくなって正確な反りを測定することができるものである。   In addition, when energy is applied in a state where the composite material is suspended, energy can be applied uniformly to the composite material, and volatilization of volatile components from the composite material and curing of the resin are less likely to be uneven. Accurate warpage can be measured.

また、上記請求項1に記載の樹脂の片付き評価方法で得られた評価結果に基づき、含浸条件を変更することにより、織布または不織布の基材へ樹脂を含浸するにあたってその偏りを少なくすることができ、電気用積層板等に使用しても反りの発生が少ない複合材料を製造することができるものである。 Further, based on the first aspect evaluation results obtained by the evaluation method-out with pieces of resin according to, by changing the impregnation conditions, the bias order to impregnate the resin into the woven or nonwoven substrate It is possible to manufacture a composite material that can be reduced and that is less likely to warp even when used in an electrical laminate.

以下、本発明を実施するための最良の形態を説明する。   Hereinafter, the best mode for carrying out the present invention will be described.

本発明で評価する複合材料は従来から電気用積層板に使用されているものであって、織布または不織布の基材に樹脂ワニスを含浸乾燥して得られたBステージ状態のものである。織布または不織布の繊維としては、ガラス繊維あるいはポリエステル繊維やアラミド繊維などの合成樹脂繊維などが用いられている。また、樹脂ワニスとしては、ポリフェニレンオキサイド(PPO)、エポキシ樹脂、フェノール樹脂、ポリイミド、メラミン樹脂などの熱硬化性樹脂を、トルエン、メチルエチルケトン、ジメチルホルムアミドなどの溶剤に溶解させたものなどが用いられている。この他に、樹脂ワニスには各種の硬化剤、硬化促進剤、重合開始剤、無機充填材などが配合されている。   The composite material evaluated in the present invention is conventionally used for electrical laminates, and is in a B-stage state obtained by impregnating and drying a resin varnish on a woven or non-woven base material. As the woven or non-woven fiber, glass fiber, synthetic resin fiber such as polyester fiber or aramid fiber, or the like is used. As the resin varnish, a resin obtained by dissolving a thermosetting resin such as polyphenylene oxide (PPO), epoxy resin, phenol resin, polyimide, melamine resin in a solvent such as toluene, methyl ethyl ketone, dimethylformamide, or the like is used. Yes. In addition, various curing agents, curing accelerators, polymerization initiators, inorganic fillers, and the like are blended in the resin varnish.

そして、複合材料は図2(a)に示すような工程で製造される。すなわち、長尺の基材1を連続的に送りながら樹脂ワニス2に浸漬することにより基材1に樹脂ワニス2を含浸し、次に、樹脂ワニス2から基材1を引き上げてスクイズロール3、3の間を通過させ、この後、乾燥室に送られて加熱乾燥することにより、Bステージ状態の複合材料を得ることができるものである。基材1を樹脂ワニス2に浸漬するにあたっては、樹脂ワニス2中に配置したディップロール4の下面に基材1を接触させるようにして行なう。また、スクイズロール3、3の一方は他方に対して近接離間自在に形成されており、スクイズロール3、3の間隔を変えることにより、図2(b)に示すように基材1との間隔を変えて、基材1への樹脂ワニス2の付着量(含浸量)を調節することができるようになっている。   The composite material is manufactured by a process as shown in FIG. That is, the base material 1 is impregnated with the resin varnish 2 by immersing it in the resin varnish 2 while continuously feeding the long base material 1, and then the base material 1 is pulled up from the resin varnish 2 to squeeze roll 3, The composite material in a B-stage state can be obtained by passing between 3 and then being sent to a drying chamber and dried by heating. In immersing the substrate 1 in the resin varnish 2, the substrate 1 is brought into contact with the lower surface of the dip roll 4 disposed in the resin varnish 2. Further, one of the squeeze rolls 3 and 3 is formed so as to be close to and away from the other, and by changing the distance between the squeeze rolls 3 and 3, as shown in FIG. The amount of the resin varnish 2 attached to the substrate 1 (the amount of impregnation) can be adjusted.

そして、本発明の樹脂の片付き評価方法は以下のようにして行なう。まず、上記のようにして製造された複合材料Aの一部を適当な長さで切り取る。次に、この切り出した複合材料Aから評価用の複数枚の試料Sを切り取る。図1(a)では、複合材料Aの製造時における基材1の送り方向と直交する方向(基材1の幅方向)の三箇所(左、中、右)から試料Sを切り取っているが、試料Sの切り取り位置や枚数はこれに限定されるものではない。また、試料Sの大きさは80×50mmとすることができるが、これに限らず、80±10×50±10mmの範囲で設定可能である。   And the evaluation method with a piece of resin of this invention is performed as follows. First, a part of the composite material A manufactured as described above is cut out at an appropriate length. Next, a plurality of samples S for evaluation are cut out from the cut out composite material A. In FIG. 1A, the sample S is cut out from three locations (left, middle, and right) in the direction (width direction of the base material 1) orthogonal to the feeding direction of the base material 1 at the time of manufacturing the composite material A. The cutting position and the number of samples S are not limited to this. Further, the size of the sample S can be set to 80 × 50 mm, but is not limited thereto, and can be set in a range of 80 ± 10 × 50 ± 10 mm.

次に、上記の試料Sを加熱用治具10にセットする。加熱用治具10は、図3(a)(b)に示すように、上下面が開口する角筒状の筒体11と、筒体11の外面に設けた四本の脚部12と、筒体11を挟んで対向する一対の脚部12の上端間に掛架される掛架具13と、掛架具13に設けたクリップ具14とを備えて形成されている。筒体11の周壁は遮蔽板6として形成されるものであって、遮蔽板6は金網や孔あき板などを用いて網目構造に形成されていることが好ましい。そして、図1(b)(c)に示すように、クリップ具14にそのバネ14aの弾性力により試料Sの上端を挟むことにより試料Sを筒体11の内側に吊り下げ状態にセットする。このように試料Sを吊り下げた状態にして加熱すると、試料Sに均一に熱を加えることができ、試料Sからの揮発成分の揮発や試料Sの樹脂の硬化が不均一になることが少なくなって正確な反りを測定することができる。尚、符号13aは掛架具13がその長手方向に移動して脚部12から外れるのを防止するための留具である。   Next, the sample S is set on the heating jig 10. As shown in FIGS. 3 (a) and 3 (b), the heating jig 10 includes a rectangular tube-like cylinder 11 having an open top and bottom surface, four leg portions 12 provided on the outer surface of the cylinder 11, and A hanging tool 13 that is hung between the upper ends of a pair of leg portions 12 facing each other with the cylindrical body 11 interposed therebetween, and a clip tool 14 provided on the hanging tool 13 are formed. The peripheral wall of the cylindrical body 11 is formed as a shielding plate 6, and the shielding plate 6 is preferably formed in a mesh structure using a wire mesh or a perforated plate. Then, as shown in FIGS. 1B and 1C, the sample S is set in a suspended state inside the cylindrical body 11 by sandwiching the upper end of the sample S by the elastic force of the spring 14 a between the clip tool 14. When the sample S is heated in a suspended state in this way, the sample S can be uniformly heated, and the volatilization of the volatile components from the sample S and the curing of the resin of the sample S are less likely to be uneven. Thus, accurate warpage can be measured. Reference numeral 13a denotes a fastener for preventing the hanging tool 13 from moving in the longitudinal direction and coming off the leg portion 12.

次に、試料Sをセットした加熱用治具10を電気オーブンなどの加熱装置にセットし、試料Sにエネルギーとして加熱による熱を与える。ここで、加熱温度は、試料S中の揮発成分(乾燥で除去されなかった残存する溶剤など)の蒸気圧が400Pa以上になる温度で且つ300℃以下である。試料S中の揮発成分の蒸気圧が400Pa以上になる温度未満で加熱すると、揮発成分が試料Sから除去されるのに時間がかかり、また試料S中の樹脂の硬化にも時間がかかり、さらに反りの発生量も少なくなり、短時間で正確な反り量(試料Sの表裏の差)を測定することができない。また、加熱温度が300℃より高くなると、試料S中の樹脂が分解し始めて樹脂含有量が変化するために、正確な反り量を測定することができない。さらに、上記の加熱温度は100℃よりも高い温度に設定する。この場合は、上記の揮発成分の蒸気圧が400Pa以上になる温度よりも高い温度で試料Sを加熱するために、さらに短時間で試料Sに反りを発生させることができ、短時間で反り量を測定することができる。また、さらに好ましくは、上記の加熱温度は試料S中の樹脂のTg以上でTg+50℃以下に設定する。この場合は、上記の100℃よりも高い温度Tgで試料Sを加熱するために、さらに短時間で試料Sに反りを発生させることができると共にTg+50℃以下で加熱することにより、試料S中から低分子量樹脂の揮発を抑えて樹脂組成の変化を防止することができ、正確な反り量を測定することができる。   Next, the heating jig 10 on which the sample S is set is set in a heating device such as an electric oven, and heat is applied to the sample S as energy. Here, the heating temperature is a temperature at which the vapor pressure of a volatile component in the sample S (such as a remaining solvent that has not been removed by drying) becomes 400 Pa or higher and is 300 ° C. or lower. When heated below the temperature at which the vapor pressure of the volatile component in the sample S is 400 Pa or more, it takes time for the volatile component to be removed from the sample S, and it takes time for the resin in the sample S to harden. The amount of warpage is reduced, and an accurate amount of warpage (difference between the front and back of the sample S) cannot be measured in a short time. Further, when the heating temperature is higher than 300 ° C., the resin in the sample S starts to decompose and the resin content changes, so that an accurate warpage amount cannot be measured. Further, the heating temperature is set to a temperature higher than 100 ° C. In this case, since the sample S is heated at a temperature higher than the temperature at which the vapor pressure of the volatile component is 400 Pa or more, the sample S can be warped in a shorter time, and the amount of warpage can be reduced in a short time. Can be measured. More preferably, the heating temperature is set to not less than Tg of the resin in the sample S and not more than Tg + 50 ° C. In this case, since the sample S is heated at a temperature Tg higher than the above 100 ° C., the sample S can be warped in a shorter time and heated at Tg + 50 ° C. The volatilization of the low molecular weight resin can be suppressed to prevent a change in the resin composition, and an accurate amount of warpage can be measured.

上記のようにして試料Sを加熱すると、試料S中の揮発成分が揮発して体積が減少すると共に試料S中の樹脂が硬化して収縮するが、試料Sの厚み方向における樹脂の付着量が異なると、上記の体積減少と硬化収縮の度合いが試料Sの表裏で差が生じるために、加熱処理後の試料Sに反りが発生する。   When the sample S is heated as described above, the volatile components in the sample S are volatilized and the volume is reduced, and the resin in the sample S is cured and contracted. However, the amount of the resin in the thickness direction of the sample S is reduced. If they are different, the degree of volume reduction and cure shrinkage differs between the front and back of the sample S, so that the sample S after the heat treatment is warped.

図4には、試料Sの加熱時間と揮発率との関係を加熱温度別に示す。揮発率は、揮発率(%)=(加熱後に残量した揮発分の重量)/(揮発成分の総重量)×100で示す。このグラフから明らかなように、加熱温度が高いほど揮発率が短時間で急激に低下するものであり、この結果から上記のような加熱温度に設定するのが好ましい。   FIG. 4 shows the relationship between the heating time of the sample S and the volatilization rate for each heating temperature. The volatilization rate is represented by volatility (%) = (weight of volatile matter remaining after heating) / (total weight of volatile components) × 100. As is apparent from this graph, the higher the heating temperature, the more rapidly the volatility decreases in a short time. From this result, it is preferable to set the heating temperature as described above.

また、図5(a)(b)には試料Sの揮発率と反り量との関係を加熱温度150℃の場合(図5(a))と加熱温度200℃の場合(図5(b))とを示す。尚、ここでは、複合材料Aの基材として2116タイプのガラスクロスを用い、複合材料Aの樹脂としてはPPO樹脂を用いた。また、複合材料Aの樹脂量は50%であり、片面側(表面側)の樹脂量と他の片面側(裏面側)の樹脂量の差が質量比で6:4のものを用いた。このグラフから明らかなように、加熱温度が高い方が揮発率の上昇に伴って反り量の増加が大きくなるものであり、この結果から上記のような加熱温度に設定するのが好ましい。   5A and 5B show the relationship between the volatilization rate and the amount of warping of the sample S when the heating temperature is 150 ° C. (FIG. 5A) and when the heating temperature is 200 ° C. (FIG. 5B). ). Here, 2116 type glass cloth was used as the base material of the composite material A, and PPO resin was used as the resin of the composite material A. The resin amount of the composite material A was 50%, and the difference between the resin amount on one side (front side) and the resin amount on the other side (back side) was 6: 4 by mass ratio. As is clear from this graph, the higher the heating temperature, the larger the amount of warpage increases as the volatilization rate increases. From this result, it is preferable to set the heating temperature as described above.

次に、加熱用治具10を加熱装置から取り出すと共に加熱用治具10から試料Sを取り出す。次に、図1(d)(e)に示すように、平坦な測定台25の上に試料Sを平置きして反り量を測定する。この反り量とは、測定台25の上面から試料Sの最も高い部分までを金尺等の定規7で測定した値である。   Next, the heating jig 10 is taken out from the heating device and the sample S is taken out from the heating jig 10. Next, as shown in FIGS. 1D and 1E, the amount of warpage is measured by placing the sample S flat on a flat measurement table 25. The amount of warpage is a value obtained by measuring from the upper surface of the measuring table 25 to the highest portion of the sample S with a ruler 7 such as a metal ruler.

このように本発明では、複合材料A(試料S)の反りを評価する際に、その極小の断面を拡大したり極小の断面において樹脂量を測定したりする必要がない。従って、測定に時間がかからず、また、測定者による評価のバラツキを少なくすることができる。   As described above, in the present invention, when evaluating the warpage of the composite material A (sample S), it is not necessary to enlarge the minimum cross section or measure the resin amount in the minimum cross section. Therefore, measurement does not take time, and variation in evaluation by the measurer can be reduced.

上記の例では、試料Sの揮発成分を揮発させると共に試料Sの樹脂の硬化を行なうために、加熱によりエネルギーとして熱を与えたが、これに限らず、本発明ではエネルギーを与える手段として光(赤外線,遠赤外線など)などを用いることができる。しかし、既存の設備を利用することができて複雑な装置も必要としない加熱による方法が好ましく、これにより、簡便に樹脂の片付きを評価することができる。また、上記の例では、熱風Wの噴出し口30と試料Sの間に遮蔽板6を置くことにより、熱風Wが試料Sに直接当たりにくくすることができ、試料Sに加えられる熱が偏って試料Sの一部のみが局所的に硬化するのを防止することができ、正確な反りを測定することができるものである。   In the above example, in order to volatilize the volatile components of the sample S and cure the resin of the sample S, heat is applied as energy by heating. However, the present invention is not limited to this, and light ( Infrared rays, far infrared rays, etc.) can be used. However, a heating method that can use existing equipment and does not require a complicated apparatus is preferable, and thus, the resin can be easily evaluated. Further, in the above example, by placing the shielding plate 6 between the hot air W outlet 30 and the sample S, the hot air W can be made difficult to directly hit the sample S, and the heat applied to the sample S is biased. Thus, only a part of the sample S can be prevented from being locally cured, and an accurate warp can be measured.

また、上記の例において、遮蔽板6の目の大きさは330メッシュ(JIS Z 8801-1:2000)以上であることが好ましい。遮蔽板6の目の大きさが330メッシュ未満であると、熱風Wの遮蔽を充分に行うことができず、試料Sに加えられる熱が偏って試料Sの一部のみが局所的に硬化し、正確な反り量を測定することができない恐れがある。遮蔽板6の目の大きさの上限は特に設定されないが、入手のし易さなどから550メッシュ以下にするのが好ましい。また、上記の例では、金網の遮蔽板6を用いて筒体11を形成したが、これに限らず、図6のように、孔のあいていない平板の金属板で形成される遮蔽板6を多数枚用いて外枠6a、中枠6b、内枠6cを形成し、外枠6aの内側に中枠6bを、中枠6bの内側に内枠6cを配置し、内枠6cの略中央部分に試料Sを配置して加熱するようにしても良い。この場合、外枠6a、中枠6b、内枠6cを形成するにあたって、隣り合う遮蔽板6、6の間には間隙20を設けるようにし、また、外枠6aの間隙20と中枠6bの間隙20は対向しないようにし、中枠6bの間隙20と内枠6cの間隙20は対向しないようにする。このように熱風Wが試料Sに直接当たりにくくすることができる形状のものが使用可能である。   In the above example, the size of the screen of the shielding plate 6 is preferably 330 mesh (JIS Z 8801-1: 2000) or more. If the size of the screen of the shielding plate 6 is less than 330 mesh, the hot air W cannot be sufficiently shielded, and the heat applied to the sample S is biased so that only a part of the sample S is locally cured. There is a possibility that an accurate amount of warpage cannot be measured. The upper limit of the size of the eye of the shielding plate 6 is not particularly set, but is preferably 550 mesh or less from the viewpoint of availability. Further, in the above example, the cylindrical body 11 is formed using the shielding plate 6 made of wire mesh. However, the present invention is not limited to this, and the shielding plate 6 is formed of a flat metal plate having no holes as shown in FIG. Are used to form an outer frame 6a, an inner frame 6b, and an inner frame 6c. The inner frame 6b is arranged inside the outer frame 6a, the inner frame 6c is arranged inside the inner frame 6b, and the substantially center of the inner frame 6c. You may make it arrange | position and heat the sample S to a part. In this case, when forming the outer frame 6a, the middle frame 6b, and the inner frame 6c, a gap 20 is provided between the adjacent shielding plates 6 and 6, and the gap 20 between the outer frame 6a and the middle frame 6b. The gap 20 is not opposed, and the gap 20 of the inner frame 6b is not opposed to the gap 20 of the inner frame 6c. Thus, the thing of the shape which can make hot air W hard to hit sample S directly can be used.

本発明の複合材料Aの製造方法は、上記の複合材料A(試料S)の反り評価に基づいて樹脂ワニス2の含浸条件を変更するものである。樹脂ワニス2の含浸条件を変更するにあたっては、例えば、図7に示すように、複合材料Aの製造工程において、ディップロール4の下面に接触する方の基材1の片面を表面21とし、ディップロール4の下面に接触しない方の片面を裏面22とし、上記の反り評価で複合材料A(試料S)が図1(d)のように基材1の表面側が凹となり、裏面側が凸となるように反り(以下、「+方向の反り」という)が生じた場合は、ディップロール4を基材1の樹脂ワニス2への導入側(図2において左側)に移動させるようにする。これにより、基材1の表面21とこれに対向するスクイズロール3の間隔が狭くなって基材1の表面21側への樹脂ワニスの付着量を少なくすることができ、複合材料Aの厚み方向における樹脂の含有量を均一化することができて複合材料Aの硬化時の反りを少なくすることができる。また、上記の反り評価で複合材料A(試料S)が図1(e)のように基材1の表面側が凸となり、裏面側が凹となるように反り(以下、「−方向の反り」という)が生じた場合は、ディップロール4を基材1の樹脂ワニス2からの導出側(図2において右側)に移動させるようにする。これにより、基材1の裏面22とこれに対向するスクイズロール3の間隔が狭くなって基材1の裏面22側への樹脂ワニスの付着量を少なくすることができ、複合材料Aの厚み方向における樹脂の含有量を均一化することができて複合材料Aの硬化時の反りを少なくすることができる。ディップロール4の移動量はディップロール4の直径や基材1の送り速度などによって異なるが、例えば、試料Sの反り量が20mm以上で巻いた状態(カール状態)になる場合は、ディップロール4を基材1の導入側あるいは導出側に1.5mm移動させることができる。また、試料Sの反り量が15mm〜20mm未満の場合はディップロール4を基材1の導入側あるいは導出側に1.3mm移動させることができる。また、試料Sの反り量が10mm〜15mm未満の場合はディップロール4を基材1の導入側あるいは導出側に1.0mm移動させることができる。また、試料Sの反り量が7mm〜10mm未満の場合はディップロール4を基材1の導入側あるいは導出側に0.5mm移動させることができる。また、試料Sの反り量が3mm〜7mm未満の場合はディップロール4を基材1の導入側あるいは導出側に0.3mm移動させることができる。そして、試料Sの反り量が3mm未満の場合はディップロール4を移動させないようにする。   The manufacturing method of the composite material A of this invention changes the impregnation conditions of the resin varnish 2 based on curvature evaluation of said composite material A (sample S). In changing the impregnation conditions of the resin varnish 2, for example, as shown in FIG. 7, in the manufacturing process of the composite material A, one surface of the base material 1 that contacts the lower surface of the dip roll 4 is used as the surface 21. One side that does not contact the lower surface of the roll 4 is the rear surface 22, and in the above-described warpage evaluation, the composite material A (sample S) is concave on the front surface side of the substrate 1 as shown in FIG. When warping (hereinafter referred to as “+ direction warping”) occurs, the dip roll 4 is moved to the introduction side (left side in FIG. 2) of the base material 1 to the resin varnish 2. Thereby, the space | interval of the surface 21 of the base material 1 and the squeeze roll 3 which opposes this becomes narrow, the adhesion amount of the resin varnish to the surface 21 side of the base material 1 can be decreased, and the thickness direction of the composite material A The content of the resin in can be made uniform, and the warp when the composite material A is cured can be reduced. Further, in the above-described warpage evaluation, the composite material A (sample S) warps so that the front surface side of the base material 1 is convex and the back surface side is concave as shown in FIG. 1 (e) (hereinafter referred to as "-direction warpage"). ) Occurs, the dip roll 4 is moved to the lead-out side (right side in FIG. 2) of the base material 1 from the resin varnish 2. Thereby, the space | interval of the back surface 22 of the base material 1 and the squeeze roll 3 which opposes this becomes narrow, the adhesion amount of the resin varnish to the back surface 22 side of the base material 1 can be decreased, and the thickness direction of the composite material A The content of the resin in can be made uniform, and the warp when the composite material A is cured can be reduced. The amount of movement of the dip roll 4 varies depending on the diameter of the dip roll 4 and the feed speed of the substrate 1, but for example, when the amount of warping of the sample S is 20 mm or more (curled state), the dip roll 4 Can be moved 1.5 mm to the introduction side or the extraction side of the substrate 1. Further, when the amount of warpage of the sample S is 15 mm to less than 20 mm, the dip roll 4 can be moved 1.3 mm to the introduction side or the withdrawal side of the base material 1. Further, when the amount of warping of the sample S is less than 10 mm to less than 15 mm, the dip roll 4 can be moved 1.0 mm toward the introduction side or the withdrawal side of the base material 1. Further, when the amount of warpage of the sample S is less than 7 mm to 10 mm, the dip roll 4 can be moved by 0.5 mm toward the introduction side or the withdrawal side of the substrate 1. Moreover, when the curvature amount of the sample S is 3 mm to less than 7 mm, the dip roll 4 can be moved 0.3 mm toward the introduction side or the withdrawal side of the substrate 1. And when the curvature amount of the sample S is less than 3 mm, the dip roll 4 is not moved.

以下本発明を実施例によって具体的に説明する。   Hereinafter, the present invention will be described specifically by way of examples.

(樹脂ワニスの調製)
攪拌装置と攪拌羽根を付けた2000mlのフラスコにトルエンを入れて、90℃に加熱したオイルバスに浸して80℃に加熱する。トルエンが80℃になったら、PPOを入れ完全に溶解するまで攪拌し、溶解後、TAIC、パーブチルPを入れ冷却する。できた樹脂組成物にシリカBをホモディスパーで攪拌しながら投入する。
(Preparation of resin varnish)
Toluene is placed in a 2000 ml flask equipped with a stirrer and a stirring blade, and immersed in an oil bath heated to 90 ° C. and heated to 80 ° C. When toluene reaches 80 ° C., PPO is added and stirred until it is completely dissolved. After dissolution, TAIC and perbutyl P are added and cooled. Silica B is added to the resulting resin composition while stirring with a homodisper.

尚、上記の各成分としては以下のものを用いた。
PPO:ノリル640−111(ポリフェニレンオキサイド)日本ジーイープラスチックス株式会社製
TAIC:日本化成株式会社製の硬化剤
パーブチルP:日本油脂株式会社製の硬化促進剤
トルエン:試薬 ナカライテスク株式会社製の溶剤
シリカB:FB−1SDX、電気化学工業株式会社製の無機充填材(シリカ)
また、上記各成分の配合量は、PPOが160質量部、TAICが240質量部、トルエンが525質量部、パーブチルPが20質量部、シリカBが105質量部とした。
The following components were used as the above components.
PPO: Noryl 640-111 (polyphenylene oxide) TAIC manufactured by Nippon GE Plastics Co., Ltd. Curing agent perbutyl P manufactured by Nippon Kasei Co., Ltd. B: FB-1SDX, inorganic filler (silica) manufactured by Denki Kagaku Kogyo Co., Ltd.
The blending amounts of the above components were 160 parts by mass of PPO, 240 parts by mass of TAIC, 525 parts by mass of toluene, 20 parts by mass of perbutyl P, and 105 parts by mass of silica B.

(複合材料の製造)
基材1としてはガラスクロス(日東紡績株式会社の「116E」)を用い、これに上記の樹脂ワニスを樹脂分50%となるように図2(a)に示すような装置で含浸させ、この後、乾燥工程で120℃10分間の加熱処理をして乾燥した。ここで製造した複合材料は反りが発生しやすいように、基材1の表面21側に付着した樹脂量と裏面22側に付着した樹脂量とを質量比で6:4となるようにした。また、複合材料中の樹脂のTgは190℃(DMA)であった。
(Manufacture of composite materials)
A glass cloth (“116E” manufactured by Nitto Boseki Co., Ltd.) is used as the substrate 1, and the above resin varnish is impregnated with an apparatus as shown in FIG. Then, it heat-processed at 120 degreeC for 10 minute (s) at the drying process, and dried. The composite material manufactured here was made to have a mass ratio of the amount of resin adhering to the front surface 21 side of the base material 1 and the amount of resin adhering to the back surface 22 side so that warpage would easily occur. The Tg of the resin in the composite material was 190 ° C. (DMA).

(参考例1、2、実施例〜7及び比較例1〜5)
上記の複合材料Aから三枚の試料S(大きさ80×50mm)を切り取り、これを加熱用治具10を用いて加熱処理を行なった。各実施例及び比較例、参考例の加熱温度、試料S中の揮発成分(トルエン)の蒸気圧、加熱時間、遮蔽板(金網)のメッシュ、加熱時の固定状態を表1に示す。そして、加熱処理後の試料Sの反り量を測定すると共に測定時の作業性と測定の正確さを評価した。「測定時の作業性」は、5分以内に反りが測定ができれば○と判定し、反りの測定時間に5分以上を要したものを×とした。また、「測定の正確さ」は,反りが小さい(3mm未満)と測定が難しくなり,反りが大きい(25mmより大きい)と組成変化と樹脂分解の可能性があり、測定値の正確さが低いことが考えられるので、反り量が3〜25mmの場合を○、この範囲以外を×とした。結果を表1に示す。尚、表1の「反り量」の欄の「+」は+方向に試料Sが反ったことを示す。
(Reference Examples 1 and 2, Examples 3 to 7 and Comparative Examples 1 to 5)
Three samples S (size 80 × 50 mm) were cut from the composite material A, and this was heat-treated using the heating jig 10. Table 1 shows the heating temperature of each example and comparative example and reference example, the vapor pressure of the volatile component (toluene) in the sample S, the heating time, the mesh of the shielding plate (metal mesh), and the fixed state during heating. And while measuring the curvature amount of the sample S after heat processing, the workability | operativity at the time of measurement and the accuracy of a measurement were evaluated. “Workability at the time of measurement” was determined as “good” when the warp could be measured within 5 minutes, and “×” was taken when the warping measurement time required 5 minutes or more. “Measurement accuracy” is difficult to measure if warpage is small (less than 3 mm), and if warpage is large (greater than 25 mm), there is a possibility of composition change and resin decomposition, and the accuracy of the measured value is low. Therefore, the case where the amount of warpage was 3 to 25 mm was marked as ◯, and the range other than this range was marked as x. The results are shown in Table 1. In Table 1, “+” in the “warp amount” column indicates that the sample S is warped in the + direction.

Figure 0004665946
Figure 0004665946

本発明の実施の形態の一例を示し、(a)は複合材料の平面図、(b)は試料の吊下げ状態を示す正面図、(c)は試料の吊下げ状態を示す側面図、(d)(e)は反りの測定を示す概略図である。An example of embodiment of this invention is shown, (a) is a top view of a composite material, (b) is a front view which shows the suspended state of a sample, (c) is a side view which shows the suspended state of a sample, ( d) (e) is a schematic diagram showing the measurement of warpage. 同上の(a)は含浸装置を示す概略図、(b)は含浸装置のスクイズロールを示す概略図である。(A) is the schematic which shows an impregnation apparatus, (b) is the schematic which shows the squeeze roll of an impregnation apparatus. 同上の(a)は加熱用治具を示す平面図、(b)は斜視図である。(A) is a plan view showing a heating jig, and (b) is a perspective view. 同上の加熱時間と揮発率の関係を示すグラフである。It is a graph which shows the relationship between a heating time same as the above, and a volatilization rate. 同上の(a)(b)は揮発率と反り量の関係を示すグラフである。(A) and (b) are graphs showing the relationship between the volatilization rate and the amount of warpage. 同上の遮蔽板の一例を示す平面図である。It is a top view which shows an example of the shielding board same as the above. 同上の基材の表面と裏面を示す斜視図である。It is a perspective view which shows the surface and back surface of a base material same as the above.

符号の説明Explanation of symbols

1 基材
2 樹脂ワニス
6 遮蔽板
30 噴出し口
A 複合材料
DESCRIPTION OF SYMBOLS 1 Base material 2 Resin varnish 6 Shielding board 30 Ejection opening A Composite material

Claims (2)

織布または不織布の基材に樹脂ワニスを含浸乾燥して得られたBステージ状態の複合材料を吊り下げた状態にして加熱によるエネルギーを加えた後、該複合材料の反りを測定するにあたって、加熱温度が100℃よりも高い温度で且つ300℃以下であり、加熱された熱風の噴出し口と前記複合材料の間に330メッシュ以上の網目構造の遮蔽板を配置することを特徴とする樹脂の片付き評価方法。   After measuring the warpage of the composite material after applying energy by heating in a suspended state of the composite material in the B-stage state obtained by impregnating and drying the resin varnish on the base material of the woven or non-woven fabric A resin having a mesh structure of a mesh structure of 330 mesh or more between a heated hot air outlet and the composite material, the temperature of which is higher than 100 ° C. and lower than 300 ° C. Evaluation method with tidying up. 織布または不織布の基材に樹脂ワニスを含浸乾燥する工程を含む複合材料の製造方法において、上記請求項1に記載の樹脂の片付き評価方法で得られた評価結果に基づき、含浸条件を変更することを特徴とする複合材料の製造方法。 The method of manufacturing a composite material comprising a step of impregnating dry the resin varnish to the substrate woven or nonwoven fabric, on the basis of the claim 1 evaluation results obtained by evaluation methods-out with pieces of resin according to the impregnation conditions The manufacturing method of the composite material characterized by changing.
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Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS595023A (en) * 1982-06-30 1984-01-11 Matsushita Electric Works Ltd Preparation of resin impregnated base material for laminate
JPH07266435A (en) * 1994-03-29 1995-10-17 Matsushita Electric Works Ltd Manufacture of laminated sheet
JPH08318531A (en) * 1995-05-26 1996-12-03 Shin Kobe Electric Mach Co Ltd Manufacture of prepreg for laminate and apparatus for drying prepreg
JPH091764A (en) * 1995-06-23 1997-01-07 Matsushita Electric Works Ltd Manufacture of laminated plate
JP2000198113A (en) * 1999-01-07 2000-07-18 Asahi Chem Ind Co Ltd Prepreg
JP2004091672A (en) * 2002-08-30 2004-03-25 Asahi Kasei Electronics Co Ltd Macromolecular varnish

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS595023A (en) * 1982-06-30 1984-01-11 Matsushita Electric Works Ltd Preparation of resin impregnated base material for laminate
JPH07266435A (en) * 1994-03-29 1995-10-17 Matsushita Electric Works Ltd Manufacture of laminated sheet
JPH08318531A (en) * 1995-05-26 1996-12-03 Shin Kobe Electric Mach Co Ltd Manufacture of prepreg for laminate and apparatus for drying prepreg
JPH091764A (en) * 1995-06-23 1997-01-07 Matsushita Electric Works Ltd Manufacture of laminated plate
JP2000198113A (en) * 1999-01-07 2000-07-18 Asahi Chem Ind Co Ltd Prepreg
JP2004091672A (en) * 2002-08-30 2004-03-25 Asahi Kasei Electronics Co Ltd Macromolecular varnish

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