JP4657176B2 - Suction table and sheet peeling method using suction table - Google Patents

Suction table and sheet peeling method using suction table Download PDF

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JP4657176B2
JP4657176B2 JP2006232065A JP2006232065A JP4657176B2 JP 4657176 B2 JP4657176 B2 JP 4657176B2 JP 2006232065 A JP2006232065 A JP 2006232065A JP 2006232065 A JP2006232065 A JP 2006232065A JP 4657176 B2 JP4657176 B2 JP 4657176B2
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suction
peeling
sheet
wafer
suction table
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JP2008060136A (en
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孝久 吉岡
健 高野
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Lintec Corp
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Description

本発明は、シートが貼付された板状部材、例えば、保護シートが貼り付けられた半導体ウエハ（以下「ウエハ」という）から当該保護シートを剥離するために前記ウエハを保持する吸着テーブル、および吸着テーブルを用いたシート剥離方法に関する。   The present invention relates to a plate-like member to which a sheet is affixed, for example, a suction table for holding the wafer to peel the protective sheet from a semiconductor wafer to which a protective sheet is affixed (hereinafter referred to as “wafer”), and a suction The present invention relates to a sheet peeling method using a table.

従来より、この種のウエハを吸着保持するテーブルとしては、例えば特許文献１に記載された吸着テーブルが知られている。同文献１の吸着テーブルは、テーブル表面に多孔質セラミックス等からなる通気性部材を有し、この通気性部材の隙間を吸引口としてウエハを吸引し吸着保持する構造になっている。   Conventionally, for example, a suction table described in Patent Document 1 is known as a table for sucking and holding this type of wafer. The suction table of the document 1 has a breathable member made of porous ceramics or the like on the table surface, and has a structure for sucking and holding the wafer by using a gap between the breathable member as a suction port.

図３は、従来の吸着テーブルを使用してウエハの表面から保護シートを剥離する際の剥離初期段階を示したものであり、図４はその剥離後期段階を示したものである。これらの図を用いて保護シートＴの剥離動作を説明すると、図３（ａ）のように吸着テーブル１でウエハＷを吸着保持した後、保護シートＴの剥離終了点Ｐ２から剥離開始点Ｐ１に向かって図３（ｂ）のように剥離ローラ１０が保護シートＴ上を前進することにより、剥離ローラ１０に巻回されている剥離用シートＵが、その前進移動に同期して繰り出されながら貼り付けられていく。次に、剥離開始点Ｐ１まで剥離用シートＵが貼り付けられた時点で、図３（ｃ）のように剥離ローラ１０が後退し、これに同期して剥離シートＵが巻き取られ、この巻取り力によって保護シートＴが剥離シートＵによって引き上げられるようにしてウエハＷから剥離し始める。そして、図４（ａ）のように剥離ローラ１０が剥離終了点Ｐ２まで後退した時点で、保護シートＴの剥離が終了する。   FIG. 3 shows an initial peeling stage when the protective sheet is peeled from the surface of the wafer using a conventional suction table, and FIG. 4 shows a late peeling stage. The peeling operation of the protective sheet T will be described with reference to these drawings. After the wafer W is sucked and held by the suction table 1 as shown in FIG. 3A, the protective sheet T is peeled from the peeling end point P2 to the peeling start point P1. As shown in FIG. 3B, when the peeling roller 10 advances on the protective sheet T, the peeling sheet U wound around the peeling roller 10 is stuck while being fed out in synchronization with the forward movement. It will be attached. Next, when the peeling sheet U is pasted to the peeling start point P1, the peeling roller 10 moves backward as shown in FIG. 3C, and the peeling sheet U is wound up in synchronization with this, and this winding is performed. The protective sheet T starts to be peeled off from the wafer W so that the protective sheet T is pulled up by the peeling sheet U by the take-off force. Then, as shown in FIG. 4A, the peeling of the protective sheet T is completed when the peeling roller 10 is retracted to the peeling end point P2.

しかしながら、従来の吸着テーブル１によると、図３（ｃ）のように剥離初期段階でウエハＷが保護シートＴから剥がれることなく持ち上がってしまい、ウエハＷの損傷や剥離不良が多発する。また、剥離後期段階では剥離用シートＵと保護シートＴの引き上げ力により図４（ａ）のようにウエハＷにずれが生じたり、同図（ｂ）のような持ち上がりを生じてしまい、ウエハＷの破損や剥離不良を多発する。ウエハＷのずれは、剥離ローラ１０の後退速度よりも剥離用シートＵの巻取り速度の方が速くなってしまった場合に生じやすい。   However, according to the conventional suction table 1, the wafer W is lifted without being peeled from the protective sheet T at the initial stage of peeling as shown in FIG. 3C, and the wafer W is frequently damaged or peeled off. Further, in the latter stage of peeling, the wafer W is displaced as shown in FIG. 4A due to the pulling force of the peeling sheet U and the protective sheet T, or lifted as shown in FIG. Frequent breakage and peeling failure. The deviation of the wafer W is likely to occur when the winding speed of the peeling sheet U is faster than the retraction speed of the peeling roller 10.

前記不具合を防止するために吸着テーブル１の吸着力を強くすると、ウエハＷの持ち上がりや、ずれ現象は解消されるが、ウエハＷを取り除く前に吸着テーブル１の真空破壊を行ったとしても、ウエハＷが吸着テーブルにぴたりと貼り付いてしまっている領域が残存してしまう。このような状態で、例えば厚さ５０μｍにまで研削されたウエハＷのような極薄の板状部材を吸着テーブルから取り除こうとすると、ウエハＷを破損させてしまうという別の不都合を生じる。   If the suction force of the suction table 1 is increased in order to prevent the above problem, the lifting or shifting phenomenon of the wafer W is eliminated, but even if the suction table 1 is broken before the wafer W is removed, the wafer is not damaged. An area where W is stuck to the suction table remains. In this state, for example, if an extremely thin plate-like member such as the wafer W ground to a thickness of 50 μm is removed from the suction table, another disadvantage that the wafer W is damaged is caused.

特開２００２−３２４８３１号公報JP 2002-324831 A

本発明は前記問題点を解決するためになされたもので、その目的とするところは、ウエハ等の板状部材から保護シート等のシートを剥離する場合に、ウエハの破損を防止するのに好適な吸着テーブルを提供することにある。   The present invention has been made to solve the above-described problems, and the object of the present invention is to prevent breakage of a wafer when a sheet such as a protective sheet is peeled from a plate-like member such as a wafer. Is to provide a simple adsorption table.

前記目的を達成するために、本発明に係る吸着テーブルは、シートが貼付された板状部材から該シートを剥離するために前記板状部材を吸着保持する吸着テーブルであって、前記吸着テーブルは、前記シートの剥離段階に対応してその対応する領域の吸着力が増減するように構成したことを特徴とする。 In order to achieve the above object, the suction table according to the present invention is a suction table that holds the plate-like member by suction so as to peel the sheet from the plate-like member to which the sheet is attached. According to the sheet peeling step, the adsorption force in the corresponding region is increased or decreased.

また、前記吸着テーブルは、前記板状部材を吸着保持する複数の吸引口を有し、前記シートの剥離段階に対応してその対応する領域の吸着力が増減するように前記吸引口の密度を増減させてもよい。 The suction table has a plurality of suction ports for sucking and holding the plate-like member, and the density of the suction ports is adjusted so that the suction force in the corresponding region increases or decreases in accordance with the peeling stage of the sheet. It may be increased or decreased.

前記本発明の吸着テーブルにおいては、前記シートの剥離初期段階及び剥離後期段階又はそのいずれか一方の段階に対応する領域の前記吸引口の密度が他の領域に比べて過密に設定されているものとしてよい。 In the suction table of the present invention, the density of the suction ports in the area corresponding to the initial stage and / or the late stage of peeling of the sheet is set more densely than that of the other areas. As good as

前記吸着テーブルは、複数の吸着領域に仕切られ、前記板状部材の外形形状によってその吸着領域を変更可能に設けられている構成としてよい。   The suction table may be divided into a plurality of suction areas, and the suction area may be changed according to the outer shape of the plate-like member.

また、前記目的を達成するために、本発明に係る吸着テーブルを用いたシート剥離方法は、板状部材を吸着保持するための複数の吸引口を有する吸着テーブルを用い、該吸引口により前記板状部材を吸着保持し、吸着保持した板状部材からシートを剥離する方法であって、前記シートの剥離時は、前記シートの剥離段階に対応してその対応する領域の前記吸着テーブルの吸着力に強弱を設けて、前記シートを剥離することを特徴とする。
In order to achieve the above object, a sheet peeling method using a suction table according to the present invention uses a suction table having a plurality of suction ports for sucking and holding a plate-like member, and the suction port is used for the plate. A method for adsorbing and holding a sheet-like member and peeling the sheet from the adsorbed and held plate-like member, and at the time of peeling the sheet, the suction force of the suction table in the corresponding area corresponding to the peeling stage of the sheet The sheet is peeled off by providing strength and weakness.

本発明にあっては、前記の如く、シートの剥離段階に対応して吸着力が増減するように吸引口の密度を増減させる構成、または、前記シートの剥離段階に対応して前記吸引口の密度を増減させることにより前記吸着テーブルの吸着力に強弱を設けて、前記シートを剥離する構成を採用した。このため、例えば、剥離初期、後期段階に対応する領域の吸引口の密度を他の領域に比べて過密に設定することにより、剥離初期、後期段階の吸着力のみが強められ、ウエハＷの持ち上がりや、ずれ現象を解消することができ、ウエハＷの破損を防止することができる。また、剥離初期、後期段階以外の段階（剥離中期段階）では吸着力を必要最低限の強さに設定できることから、真空破壊後に板状部材が吸着テーブルに貼り付く現象は効果的に抑制され、吸着テーブルから板状部材を無理なく容易に取り除くことができるようになり、板状部材の破損防止に好適である。   In the present invention, as described above, the structure of increasing or decreasing the density of the suction port so as to increase or decrease the suction force corresponding to the sheet peeling stage, or the suction port corresponding to the sheet peeling stage. The structure which peeled the said sheet | seat was provided by increasing / decreasing density and providing the strength of the adsorption | suction force of the said adsorption | suction table. For this reason, for example, by setting the density of the suction ports in the areas corresponding to the initial stage and the late stage of the peeling more densely than other areas, only the adsorption force in the initial stage and the late stage is strengthened, and the wafer W is lifted. In addition, the shift phenomenon can be eliminated, and damage to the wafer W can be prevented. In addition, since the adsorption force can be set to a necessary minimum strength at the stage other than the early stage and the late stage (the middle stage of peeling), the phenomenon that the plate member sticks to the suction table after the vacuum break is effectively suppressed, The plate-like member can be easily removed from the suction table without difficulty, which is suitable for preventing damage to the plate-like member.

以下、本発明を実施するための最良の形態について、添付した図面を参照しながら詳細に説明する。   Hereinafter, the best mode for carrying out the present invention will be described in detail with reference to the accompanying drawings.

図１は本発明の一実施形態である吸着テーブルの説明図である。吸着テーブル１は、ウエハＷの形状に対応した円形の凹部２を有するベース３と、凹部２を覆う円形の吸引板４により構成されている。前記凹部２と吸引板４とでチャンバ５が形成され、吸引板４の表面には、チャンバ５に連通する複数の吸引口６が設けられウエハＷを吸着保持する吸着領域Ｓが形成されている。前記ベース３にはチャンバ５に連通する吸引通路９Ａ、９Ｂが設けられ、真空ポンプなどの吸引手段７にホース等を介して接続されている。   FIG. 1 is an explanatory diagram of a suction table according to an embodiment of the present invention. The suction table 1 includes a base 3 having a circular recess 2 corresponding to the shape of the wafer W and a circular suction plate 4 that covers the recess 2. A chamber 5 is formed by the recess 2 and the suction plate 4. A plurality of suction ports 6 communicating with the chamber 5 are provided on the surface of the suction plate 4, and a suction region S for sucking and holding the wafer W is formed. . The base 3 is provided with suction passages 9A and 9B communicating with the chamber 5, and is connected to suction means 7 such as a vacuum pump via a hose or the like.

前記吸着領域Ｓは独立した２つの吸着領域Ｓ１、Ｓ２に仕切られている。そのための構成として、本実施形態の吸着テーブル１では、チャンバ５を環状の仕切り壁８で２つの独立したチャンバ５Ａ、５Ｂとし、各チャンバ５Ａ、５Ｂに個別に前記吸引通路９Ａ、９Ｂが連通している。従って、仕切り壁８内側のチャンバ５Ａが真空引きされると、同チャンバ５Ａに対応する円形の第１の吸着領域Ｓ１に吸着力が発生し、仕切り壁８外側のチャンバ５Ｂにも真空引きが行われると、同チャンバ５Ｂに対応するリング形状の第２の吸着領域Ｓ２に吸着力が発生するようになる。   The adsorption area S is divided into two independent adsorption areas S1 and S2. As a configuration for this purpose, in the suction table 1 of the present embodiment, the chamber 5 is divided into two independent chambers 5A and 5B by an annular partition wall 8, and the suction passages 9A and 9B communicate with the chambers 5A and 5B individually. ing. Therefore, when the chamber 5A inside the partition wall 8 is evacuated, an adsorption force is generated in the circular first adsorption region S1 corresponding to the chamber 5A, and the chamber 5B outside the partition wall 8 is also evacuated. As a result, a suction force is generated in the ring-shaped second suction region S2 corresponding to the chamber 5B.

前記吸引板４は、図１（ｂ）に示すように、保護シートＴが貼付されたウエハＷが載置されたときに、該保護シートＴの剥離段階に対応して、剥離開始点Ｐ１近傍領域を剥離初期領域Ａ１、剥離終了点Ｐ２近傍領域を剥離後期領域Ｃ１、その他の領域を剥離中期領域Ｂ１に分けられている。   As shown in FIG. 1B, the suction plate 4 corresponds to the peeling start point P1 corresponding to the peeling stage of the protective sheet T when the wafer W to which the protective sheet T is stuck is placed. The region is divided into a separation initial region A1, a region in the vicinity of the separation end point P2 is divided into a separation late region C1, and the other regions are divided into a separation intermediate region B1.

第１の吸着領域Ｓ１においては、剥離初期領域Ａ１および剥離後期領域Ｃ１に対応する吸引口６の密度が、剥離中期領域Ｂ１に比べて過密に設定されており、これにより、剥離初期領域Ａ１および剥離後期領域Ｃ１では、剥離中期領域Ｂ１よりも強い吸着力が生じるようになっている。これにより、剥離用シートＵと保護シートＴの引き上げ力によるウエハＷのずれや、割れが生じることを防止でき、また、剥離中期領域Ｂ１は、チャンバ５Ａの真空破壊を行った後のウエハＷの貼り付き現象を防止することが可能となっている。   In the first adsorption region S1, the density of the suction ports 6 corresponding to the separation initial region A1 and the separation late region C1 is set more densely than that of the separation intermediate region B1, so that the separation initial region A1 and In the late peeling region C1, a stronger adsorption force is generated than in the peeling intermediate region B1. Accordingly, it is possible to prevent the wafer W from being displaced or cracked due to the pulling-up force of the peeling sheet U and the protective sheet T, and the peeling middle region B1 is formed on the wafer W after the vacuum break of the chamber 5A. It is possible to prevent the sticking phenomenon.

第２の吸着領域Ｓ２も同様に、剥離初期領域Ａ２および剥離後期領域Ｃ２に対応する吸引口６の密度が、剥離中期領域Ｂ２に比べて過密に設定されており、これにより、剥離初期領域Ａ２および剥離後期領域Ｃ２は、剥離中期領域Ｂ２より強い吸着力が生じるようになっている。   Similarly, in the second adsorption region S2, the density of the suction ports 6 corresponding to the separation initial region A2 and the separation late region C2 is set more densely than that of the separation intermediate region B2, and thereby the separation initial region A2 Further, the peeling late region C2 has a stronger adsorption force than the peeling intermediate region B2.

前記第１、第２の吸着領域Ｓ１、Ｓ２の外径は、吸着保持されるウエハＷの外径に応じて異なり、例えば、ウエハＷの外形が８インチと１２インチであるならば、第１の吸着領域Ｓ１は８インチ径の円形、第２の吸着領域Ｓ２は１２インチ径の円形となる。また、ウエハＷ以外の板状部材を吸着保持するものならば、その板状部材の外形形状に合わせて第１、第２の吸着領域Ｓ１、Ｓ２の輪郭形状は適宜変更可能で、更に多くの吸着領域を設けることも可能である。   The outer diameters of the first and second suction regions S1 and S2 differ depending on the outer diameter of the wafer W to be sucked and held. For example, if the outer shape of the wafer W is 8 inches and 12 inches, the first diameter is the first. The suction region S1 is an 8-inch circular shape, and the second suction region S2 is a 12-inch circular shape. Further, if the plate-like member other than the wafer W is sucked and held, the contour shapes of the first and second suction regions S1 and S2 can be appropriately changed according to the outer shape of the plate-like member, and more It is also possible to provide a suction area.

次に、前記の如く構成された本実施形態の吸着テーブルの使用例、動作などについて図１、図３を基に説明する。   Next, usage examples and operations of the suction table of the present embodiment configured as described above will be described with reference to FIGS.

本実施形態の吸着テーブル１によると、例えば外径が８インチのウエハＷに貼付されている保護シートＴを剥離する場合は、図示しないロボットアーム等が図１（ｂ）のように当該ウエハＷを第１の吸着領域Ｓ１上に搬送し（図３（ａ）参照）、吸引手段７Ａがチャンバ５Ａの真空引きを開始する。これにより、第１の吸着領域Ｓ１の複数の吸引口６によってウエハＷを吸着保持する。   According to the suction table 1 of the present embodiment, for example, when the protective sheet T attached to the wafer W having an outer diameter of 8 inches is peeled off, a robot arm or the like (not shown) as shown in FIG. Is conveyed onto the first adsorption region S1 (see FIG. 3A), and the suction means 7A starts evacuation of the chamber 5A. Accordingly, the wafer W is sucked and held by the plurality of suction ports 6 in the first suction region S1.

その後、保護シートＴの剥離終了点Ｐ２から剥離開始点Ｐ１に向かって図３（ａ）に示す剥離ローラ１０が保護シートＴ上を前進することにより、剥離ローラ１０に巻回されている剥離用シートＵが、その前進移動に同期して繰り出されながら保護シートＴの表面に貼り付けられて行く（図３（ｂ）参照）。そして、剥離開始点Ｐ１まで剥離用シートＵが貼り付けられた時点で、剥離ローラ１０が後退し（図３（ｃ）参照）、これに同期して剥離シートＵが巻き取られ、この巻取り力によって保護シートＴが剥離シートＵに引き上げられるようにウエハＷから剥離し始める。   Thereafter, the peeling roller 10 shown in FIG. 3A advances on the protective sheet T from the peeling end point P2 of the protective sheet T toward the peeling start point P1, so that the peeling roller 10 is wound around the peeling roller 10. The sheet U is stuck on the surface of the protective sheet T while being fed out in synchronization with the forward movement (see FIG. 3B). Then, when the peeling sheet U is pasted to the peeling start point P1, the peeling roller 10 moves backward (see FIG. 3C), and the peeling sheet U is wound up in synchronization with this, and this winding is performed. The protective sheet T starts to be peeled from the wafer W so that the protective sheet T is pulled up to the peeling sheet U by force.

そして、剥離ローラ１０が剥離終了点Ｐ２まで後退した時点で、保護シートＴの剥離が終了する。剥離完了後は、チャンバ５Ａとこれに連通する吸引口６の真空破壊を行い、吸着テーブル１の吸着力を解除してから、ロボットアーム等が保護シートＴ剥離済みウエハＷを吸着テーブル１から次工程へ搬送する。   And peeling of the protection sheet T is complete | finished when the peeling roller 10 reverse | retreats to the peeling completion point P2. After the peeling is completed, the chamber 5A and the suction port 6 communicating with the chamber 5A are vacuum-breaked to release the suction force of the suction table 1, and then the robot arm or the like moves the protective sheet T peeled wafer W from the suction table 1 next. Transport to process.

ところで、剥離初期領域Ａ１ではウエハＷは強い吸着力により確実に吸着保持されているから、図３（ｃ）に示すように剥離用シートＵや保護シートＴと一緒にウエハＷが引き上げられて剥離不良を発生することはない。また、剥離後期領域Ｃ１でも当該ウエハＷは強い吸着力により確実に吸着保持されているから、図４（ａ）、（ｂ）に示すような剥離用シートＵと保護シートＴの引き上げ力によるウエハＷのずれや、割れが生じることもない。さらに、剥離中期領域Ｂ１では、剥離初期、後期領域Ａ１、Ｃ１よりも吸着力が弱められているから、真空破壊後にウエハＷが吸着テーブルに貼り付くような現象は効果的に抑制され、吸着テーブル１からウエハＷを無理なく容易に剥がすことができる。   By the way, in the peeling initial region A1, since the wafer W is securely held by suction with a strong suction force, the wafer W is pulled up together with the peeling sheet U and the protective sheet T as shown in FIG. There will be no defects. In addition, since the wafer W is surely attracted and held by the strong attracting force even in the late peeling region C1, the wafer by the pulling force of the stripping sheet U and the protective sheet T as shown in FIGS. There is no W shift or cracking. Further, since the adsorption force is weaker in the middle peeling area B1 than in the early and late peeling areas A1 and C1, the phenomenon that the wafer W sticks to the suction table after the vacuum break is effectively suppressed. The wafer W can be easily peeled from 1 without difficulty.

前記のように、８インチのウエハＷの場合は第１の吸着領域Ｓ１を使用したが、外径が１２インチのウエハＷの場合は第１及び第２の吸着領域Ｓ１、Ｓ２を使用し、同様に保護シートＴを剥離する。   As described above, the first suction region S1 is used in the case of the 8-inch wafer W, but the first and second suction regions S1 and S2 are used in the case of the wafer W having an outer diameter of 12 inches. Similarly, the protective sheet T is peeled off.

以上のように、本発明の実施形態を開示したが、本発明はこれに限定されるものではない。例えば、前記実施形態では、シートの一例として保護シートＴを例示したが、これ以外のシートを板状部材から剥離する場合にも本発明は適用される。   As mentioned above, although embodiment of this invention was disclosed, this invention is not limited to this. For example, in the embodiment, the protective sheet T is illustrated as an example of the sheet, but the present invention is also applied to the case where other sheets are peeled from the plate-like member.

また、本実施形態では、吸引口６の密度を増減させることによって、ウエハＷを保持する吸着力を増減させたが、剥離初期領域Ａ１（Ａ２）および剥離後期領域Ｃ１（Ｃ２）と、剥離中期領域Ｂ１（Ｂ２）とを別の吸引手段を用いて、それら領域の吸着力を増減させるように構成してもよい。   In this embodiment, the suction force for holding the wafer W is increased / decreased by increasing / decreasing the density of the suction ports 6, but the initial peeling region A <b> 1 (A <b> 2), the late peeling region C <b> 1 (C <b> 2), and the intermediate peeling phase. You may comprise the area | region B1 (B2) so that the suction | attraction force of these area | regions may be increased / decreased using another suction means.

更に、図１の例では、剥離初期領域Ａ１、Ａ２や、剥離後期領域Ｃ１、Ｃ２の形状を扇のような形状に設けたが、この形に限定されることはなく、例えば、図２のように保護シートＴの剥離ラインに合わせた形状でもよい。また、それら領域に境界を設けることなく、無段階に吸引口の密度を増減させるように構成してもよい。   Furthermore, in the example of FIG. 1, the shape of the separation initial regions A <b> 1 and A <b> 2 and the separation late regions C <b> 1 and C <b> 2 are provided in a fan-like shape, but the shape is not limited to this, for example, FIG. Thus, the shape matched with the peeling line of the protection sheet T may be sufficient. Moreover, you may comprise so that the density of a suction opening may be increased / decreased without a step, without providing a boundary in those area | regions.

また、板状部材としてウエハＷを例示したが、これに代えて、ガラス、鋼板、樹脂板その他の板状部材に貼り付けられているシートを剥離する場合にも本発明は適用される。半導体ウエハは、シリコンウエハや化合物ウエハであってもよい。また板状部材は、円形のものに限らず、多角形状であってもよい。   Moreover, although the wafer W was illustrated as a plate-shaped member, it replaces with this and this invention is applied also when peeling the sheet | seat affixed on glass, a steel plate, a resin plate, and other plate-shaped members. The semiconductor wafer may be a silicon wafer or a compound wafer. Further, the plate-like member is not limited to a circular shape, and may be a polygonal shape.

図１は本発明の一実施形態である吸着テーブルの説明図であり、（ａ）は吸着テーブルの平面図、（ｂ）はそのｂ−ｂ線断面図である。1A and 1B are explanatory views of a suction table according to an embodiment of the present invention, in which FIG. 1A is a plan view of the suction table, and FIG. 本発明の他の実施形態である吸着テーブルの平面図。The top view of the adsorption | suction table which is other embodiment of this invention. 図３は従来の吸着テーブルに吸着保持されたウエハからシートを剥離する際の剥離動作説明図であり、（ａ）は剥離開始前の状態説明図、（ｂ）は剥離対象シートに剥離用シートを貼り付けた状態の説明図、（ｃ）は従来の吸着テーブルを用いた場合に剥離初期段階で生じる不具合の説明図である。FIGS. 3A and 3B are diagrams for explaining a peeling operation when a sheet is peeled off from a wafer held by suction on a conventional suction table. FIG. 3A is a diagram for explaining a state before starting peeling, and FIG. FIG. 4C is an explanatory diagram of a problem that occurs at the initial stage of peeling when a conventional suction table is used. 図４は従来の吸着テーブルを用いた場合に剥離後期段階で生じる不具合の説明図であり、（ａ）はウエハに生じるずれの説明図、（ｂ）はウエハに生じる持ち上がりの説明図である。4A and 4B are explanatory diagrams of defects occurring in the latter stage of peeling when a conventional suction table is used. FIG. 4A is an explanatory diagram of displacement generated on the wafer, and FIG. 4B is an explanatory diagram of lifting generated on the wafer.

符号の説明Explanation of symbols

１ 吸着テーブル
６ 吸引口
Ａ１、Ａ２ 剥離初期領域
Ｂ１、Ｂ２ 剥離中期領域
Ｃ１、Ｃ２ 剥離後期領域
Ｓ 吸着領域
Ｓ１ 第１の吸着領域
Ｓ２ 第２の吸着領域
Ｔ 保護シート（シート）
Ｗ ウエハ（板状部材） DESCRIPTION OF SYMBOLS 1 Suction table 6 Suction port A1, A2 Initial peeling area | region B1, B2 Middle peeling area | region C1, C2 Late peeling area | region S Adsorption area S1 1st adsorption area S2 2nd adsorption area T Protective sheet (sheet)
W Wafer (plate member)

Claims (5)

シートが貼付された板状部材から該シートを剥離するために前記板状部材を吸着保持する吸着テーブルであって、
前記吸着テーブルは、前記シートの剥離段階に対応してその対応する領域の吸着力が増減するように構成したこと
を特徴とする吸着テーブル。 An adsorption table for adsorbing and holding the plate member in order to peel the sheet from the plate member to which the sheet is attached,
The suction table is configured so that the suction force in the corresponding area increases or decreases in correspondence with the peeling stage of the sheet. 前記吸着テーブルは、前記板状部材を吸着保持する複数の吸引口を有し、前記シートの剥離段階に対応してその対応する領域の吸着力が増減するように前記吸引口の密度を増減させたこと
を特徴とする請求項１に記載の吸着テーブル。 The suction table has a plurality of suction ports for sucking and holding the plate-like member, and the density of the suction ports is increased or decreased so that the suction force of the corresponding region increases or decreases in accordance with the peeling stage of the sheet. The suction table according to claim 1, wherein: 前記シートの剥離初期段階及び剥離後期段階又はそのいずれか一方の段階に対応する領域の前記吸引口の密度が他の領域に比べて過密に設定されていること
を特徴とする請求項１又は２のいずれかに記載の吸着テーブル。 The density of the suction port in an area corresponding to one or both of the initial peeling stage and the late peeling stage of the sheet is set to be denser than other areas. The suction table according to any one of the above. 前記吸着テーブルは、複数の吸着領域に仕切られ、前記板状部材の外形形状によってその吸着領域を変更可能に設けられていること
を特徴とする請求項１ないし３のいずれかに記載の吸着テーブル。 The suction table according to any one of claims 1 to 3, wherein the suction table is partitioned into a plurality of suction areas, and the suction area can be changed according to an outer shape of the plate-like member. . 板状部材を吸着保持するための複数の吸引口を有する吸着テーブルを用い、該吸引口により前記板状部材を吸着保持し、吸着保持した板状部材からシートを剥離する方法であって、
前記シートの剥離時は、前記シートの剥離段階に対応してその対応する領域の前記吸着テーブルの吸着力に強弱を設けて、前記シートを剥離すること
を特徴とする吸着テーブルを用いたシート剥離方法。 Using a suction table having a plurality of suction ports for sucking and holding a plate member, the plate member is sucked and held by the suction port, and the sheet is peeled from the sucked and held plate member,
At the time of peeling the sheet, the sheet is peeled by providing the strength of the suction force of the suction table in the corresponding area corresponding to the peeling stage of the sheet and peeling the sheet. Method.
JP2006232065A 2006-08-29 2006-08-29 Suction table and sheet peeling method using suction table Active JP4657176B2 (en)

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JP5635363B2 (en) * 2010-10-19 2014-12-03 日東電工株式会社 Protective tape peeling method and protective tape peeling apparatus
JP5856450B2 (en) * 2011-11-30 2016-02-09 株式会社Ｓｃｒｅｅｎホールディングス Pattern transfer apparatus and pattern transfer method
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Citations (4)

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Publication number Priority date Publication date Assignee Title
JPH1043458A (en) * 1996-08-05 1998-02-17 Fujishiyou:Kk Sewing needle thread passing device
JP2002324831A (en) * 2001-04-26 2002-11-08 Takatori Corp Vacuum suction table
JP2003174077A (en) * 2001-12-04 2003-06-20 Lintec Corp Suction holder
JP2003179126A (en) * 2001-09-27 2003-06-27 Toshiba Corp Mechanism, apparatus, and method for peeling adhesive tape, device and method for picking up semiconductor chip, and method and apparatus for manufacturing semiconductor device

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH1043458A (en) * 1996-08-05 1998-02-17 Fujishiyou:Kk Sewing needle thread passing device
JP2002324831A (en) * 2001-04-26 2002-11-08 Takatori Corp Vacuum suction table
JP2003179126A (en) * 2001-09-27 2003-06-27 Toshiba Corp Mechanism, apparatus, and method for peeling adhesive tape, device and method for picking up semiconductor chip, and method and apparatus for manufacturing semiconductor device
JP2003174077A (en) * 2001-12-04 2003-06-20 Lintec Corp Suction holder

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