JP4650791B2 - Processing method of glass substrate for display - Google Patents
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- JP4650791B2 JP4650791B2 JP2005236311A JP2005236311A JP4650791B2 JP 4650791 B2 JP4650791 B2 JP 4650791B2 JP 2005236311 A JP2005236311 A JP 2005236311A JP 2005236311 A JP2005236311 A JP 2005236311A JP 4650791 B2 JP4650791 B2 JP 4650791B2
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Description
本発明は、ディスプレイ用ガラス基板の製造方法に関するものである。 The present invention relates to a glass substrate manufacturing how for display.
液晶ディスプレイ、プラズマディスプレイ、エレクトロルミネッセンス、フィールドエミッションディスプレイ等の各種画像表示機器用のガラスパネルの製作に際しては、複数枚のガラスパネルが一枚のガラス基板から作り出される手法が採用されている。そのため、ガラスメーカーで製造されるガラス基板は、大型化が進んでいる。 When manufacturing glass panels for various image display devices such as liquid crystal displays, plasma displays, electroluminescence, and field emission displays, a technique in which a plurality of glass panels are produced from a single glass substrate is employed. For this reason, glass substrates manufactured by glass manufacturers are becoming larger.
これらのディスプレイ用ガラス基板は、矩形状で且つ所定の大きさに切断されたガラス基板端面部に対して研磨加工を施した後、そのガラス基板の表裏面を清浄な面にするための洗浄処理を行うことにより得られる。 These display glass substrates have a rectangular shape and are subjected to a polishing process to make the front and back surfaces of the glass substrate a clean surface after polishing the end surfaces of the glass substrate cut into a predetermined size. Is obtained.
すなわち、ガラス基板の切断部分は鋭利であることから、そのままでは、搬送時において、僅かな衝撃を受けただけでも欠けが生じ、隣接する他のガラス基板に傷を付けるといった問題が生じる。この問題を回避するため、特許文献1に開示されているように、ガラス基板の切断端面部に対しては、研磨加工が施される。 That is, since the cut portion of the glass substrate is sharp, if it is left as it is, even if it receives a slight impact, chipping occurs, and there is a problem that other adjacent glass substrates are damaged. In order to avoid this problem, as disclosed in Patent Document 1, the cut end surface portion of the glass substrate is polished.
また、各種画像表示装置機器用のガラス基板には、その表面に電子機能素子等が形成されることから、高い清浄度が要求される。このような要求に応じるため、特許文献2に開示されているように、ガラス基板を洗浄液に浸漬して、洗浄液を振動させガラス基板から汚れ等を除去する洗浄処理が行われる。
しかしながら、上記の処理を終えたガラス基板の表裏面には、多数の異物(パーティクル)が付着して容易に除去できない状態となっている。このような現象は、ガラス基板の四辺における切断端面部に面取加工が施された際には、その端面部が研磨によって鏡面にはならず必然的に微小な凹凸を有する面となることから、その端面部の微小凹部内にガラス粉や研磨粉が詰まり、洗浄処理時にそれらが滲み出て、ガラス基板表裏面に再付着し、乾燥時にガラス基板の表裏面のパーティクルとして残存することに由来して生じる。 However, many foreign substances (particles) are attached to the front and back surfaces of the glass substrate after the above processing, and cannot be easily removed. Such a phenomenon is because when the chamfering process is performed on the cut end surface portions on the four sides of the glass substrate, the end surface portion is not mirror-finished by polishing and inevitably becomes a surface having minute unevenness. This is because glass powder and polishing powder are clogged in the minute recesses on the end face, they ooze out during the cleaning process, reattach to the front and back surfaces of the glass substrate, and remain as particles on the front and back surfaces of the glass substrate during drying It happens.
ガラス基板端面部を研磨によって面取加工する際に、ガラス基板端面部の微小凹部内に侵入したガラス粉や研磨剤等の異物を除去し、ガラス基板へのパーティクルの付着を低減する方法として、ガラス基板を洗浄処理する際に超音波洗浄を行なうことが考えられるが、ガラス基板へのパーティクルの付着を十分に排除できないばかりでなく、ガラス基板の端面部から一定量のガラス粉や研磨粉を除去するには、不当に長い時間を要し、生産性が極めて悪化するという根本的な問題が生じる。 When chamfering the glass substrate end surface part by polishing, as a method of removing foreign substances such as glass powder and abrasives that have entered into the minute recesses of the glass substrate end surface part, and reducing the adhesion of particles to the glass substrate, Although it is conceivable to perform ultrasonic cleaning when cleaning the glass substrate, not only does it not sufficiently eliminate the adhesion of particles to the glass substrate, but also a certain amount of glass powder or polishing powder from the end surface of the glass substrate. The removal takes an unreasonably long time, resulting in a fundamental problem that productivity is extremely deteriorated.
特に、近年、表示機器の高精細化が進み、これに伴ってガラス基板への清浄度がより厳しく要求されるに至っている。それにも拘らず、既述のように、ガラス基板表面へパーティクルが付着していたのでは、清浄度の厳しい要求に応じることができず、製品価値が低下するのみならず、使用に耐え得なくなり、不良品として扱われるという不具合をも招く。 In particular, in recent years, high definition of display devices has progressed, and along with this, the degree of cleanliness of glass substrates has been demanded more severely. Nevertheless, as described above, if particles adhere to the surface of the glass substrate, it is not possible to meet strict requirements for cleanliness, not only to reduce product value, but also to withstand use. This also causes a problem of being treated as a defective product.
本発明の目的は、ガラス基板端面部を研磨によって面取加工する際に、ガラス基板端面部の微小凹部内に侵入したガラス粉や研磨剤等の異物を除去し、ガラス基板表裏面へのパーティクルの付着を低減できるディスプレイ用ガラス基板の処理方法を提供することである。 The object of the present invention is to remove foreign substances such as glass powder and abrasives that have entered the minute recesses of the glass substrate end surface when chamfering the end surface of the glass substrate by polishing, and particles on the front and back surfaces of the glass substrate. to provide a process how a glass substrate for a display which can reduce the adhesion of.
本発明のディスプレイ用ガラス基板の処理方法は、切断されたガラス基板端面部を研磨により面取り加工した後に、ガラス基板端面部のみを薬液処理することにより、該端面部の微小凹部内の異物を除去することを特徴とする。 The method for processing a glass substrate for display according to the present invention removes foreign matters in minute concave portions of the end surface portion by treating the end surface portion of the cut glass substrate with a chamfering process and then chemically treating only the end surface portion of the glass substrate. It is characterized by doing.
本発明のディスプレイ用ガラス基板の処理方法によれば、ガラス基板端面部の面取加工によって形成されたガラス基板端面部の微小凹部内に侵入したガラス粉や研磨剤等の異物を除去でき、ガラス基板の表裏面へのパーティクルの付着を低減できる。それ故、ディスプレイ用ガラス基板の処理方法として好適である。 According to the processing method for a glass substrate for a display of the present invention, foreign substances such as glass powder and abrasives that have entered into the minute recesses of the glass substrate end surface portion formed by chamfering of the glass substrate end surface portion can be removed. Particle adhesion to the front and back surfaces of the substrate can be reduced. Therefore, it is suitable as a processing method for a glass substrate for display.
一般に、ディスプレイ用ガラス基板は、所定の大きさに切断された後、その切断端面部は、面取加工が施される。この際、面取加工が施されたガラス基板端面部には、微小な凹凸が形成され、その微小凹部内にガラス粉や研磨粉等の異物が詰る。そして、ガラス基板を洗浄すると、微小凹部内からガラス粉や研磨粉等の異物が滲み出て、乾燥時にガラス基板の表裏面にパーティクルとして析出する。 In general, after a display glass substrate is cut into a predetermined size, the cut end surface portion is chamfered. At this time, minute irregularities are formed on the end surface portion of the glass substrate that has been chamfered, and foreign matters such as glass powder and polishing powder are clogged in the minute recesses. When the glass substrate is cleaned, foreign matters such as glass powder and polishing powder ooze out from the minute recesses, and precipitate as particles on the front and back surfaces of the glass substrate during drying.
そこで、本発明では、ガラス基板表裏面へのパーティクルの付着を低減するために、切断されたガラス基板端面部を研磨加工した後に、ガラス基板端面部のみを薬液処理している。このようにすることで、ガラス基板端面部の研磨加工によって形成された微小凹部内に詰ったガラス粉や研磨粉等の異物が薬液に溶け出す。そのため、その後、ガラス基板を洗浄処理しても、ガラス基板表裏面へのパーティクルの付着を低減することができる。 Therefore, in the present invention, in order to reduce the adhesion of particles to the front and rear surfaces of the glass substrate, only the glass substrate end surface portion is subjected to chemical treatment after the cut glass substrate end surface portion is polished. By doing in this way, foreign substances, such as glass powder and polishing powder, which are packed in the minute recesses formed by the polishing process of the glass substrate end face portion are dissolved into the chemical solution. Therefore, even if it wash-processes a glass substrate after that, adhesion of the particle to the glass substrate front and back can be reduced.
尚、本発明でいう「端面部」とは、ガラス基板の辺の先端から5mmまでの部分をいう。 In the present invention, the “end face portion” refers to a portion from the tip of the side of the glass substrate to 5 mm.
尚、搬送時の衝撃等による欠けや割れを防ぐために、ガラス基板の端面部形状は、断面形状がR形状となるように研磨加工することが好ましい。 In order to prevent chipping or cracking due to impact or the like during conveyance, the end surface portion of the glass substrate is preferably polished so that the cross-sectional shape is an R shape.
また、端面部の研磨加工によって形成される微小凹部内にガラス粉や研磨粉等の異物を詰り難くするには、ガラス基板の端面部の表面粗さを細かくすればよく、具体的には、平均粗さ(Ra)で表したときに、1.0μm以下となるように研磨加工することが好ましい。 Moreover, in order to make it difficult to clog foreign matters such as glass powder and polishing powder in the minute recesses formed by the polishing of the end face part, the surface roughness of the end face part of the glass substrate may be made fine. Polishing is preferably performed so that the average roughness (Ra) is 1.0 μm or less.
尚、ガラス基板端面部のみを薬液処理する方法としては、ガラス基板の端面部のみを薬液に浸漬したり、端面部のみにシャワーを掛けたり、或いは、端面部に薬液を染み込ませたローラーブラシを押し当てればよい。或いは、ガラス基板表面に、基板端面処理に用いる薬液に対して耐性を持つ保護層を成膜する、若しくは、フィルム等を貼る等の処理を行った後、ガラス基板ごと浸漬処理やシャワーによる処理を行ってもよい。 In addition, as a method for chemical treatment of only the glass substrate end surface portion, a roller brush in which only the end surface portion of the glass substrate is immersed in the chemical solution, only the end surface portion is showered, or the end surface portion is impregnated with the chemical solution is used. Press it. Alternatively, on the glass substrate surface, after forming a protective layer resistant to the chemical solution used for the substrate end surface treatment, or applying a treatment such as attaching a film or the like, the entire glass substrate is subjected to immersion treatment or treatment by shower. You may go.
ガラス基板端面部のみを薬液処理する理由は、ガラス基板端面部を面取加工した直後にガラス基板全体を薬液処理した場合、ガラス基板端面部の微小凹部内から溶け出たガラス粉や研磨粉等の異物が、ガラス基板の表裏面に再付着し、乾燥時にガラス基板の表裏面にパーティクルとして残存する恐れがあるためである。 The reason for chemical treatment of only the glass substrate end face is that glass powder or polishing powder that has melted from the minute recesses of the glass substrate end face when the entire glass substrate is treated immediately after chamfering the glass substrate end face. This is because the foreign matter may adhere again to the front and back surfaces of the glass substrate and remain as particles on the front and back surfaces of the glass substrate during drying.
また、本発明に使用する薬液としては、ガラス基板端面部の微小凹部に詰ったガラス粉や研磨粉等の異物を短時間で除去するには、酸性溶液またはアルカリ性溶液を用いることが好ましい。その理由は、酸性溶液またはアルカリ性溶液であれば、異物を容易に溶かすことができるためである。 Moreover, as a chemical | medical solution used for this invention, in order to remove foreign materials, such as glass powder and polishing powder clogged in the micro recessed part of the glass substrate end surface part, it is preferable to use an acidic solution or an alkaline solution. The reason is that foreign substances can be easily dissolved in an acidic solution or an alkaline solution.
尚、ガラス粉や研磨粉等の異物は、酸性溶液やアルカリ性溶液の両方に溶けるが、より短時間で異物を除去したい場合や、短時間で薬液を洗い流したい場合は、アルカリ性溶液よりもエッチング能力が高く、容易に溶液を洗い流すことができる酸性溶液を用いることが好ましく、具体的には、HF、HNO3、H2SO4、HCl、H2O2を単独または混合して使用することができる。特に、エッチング能力の高いHFを単独、または、HFに他の酸やNH4Fを混合して使用することが好ましい。 Foreign substances such as glass powder and polishing powder dissolve in both acidic and alkaline solutions. However, if you want to remove foreign substances in a shorter time or want to wash away chemicals in a shorter time, the etching ability is better than that of an alkaline solution. It is preferable to use an acidic solution that is high and can be easily washed away. Specifically, HF, HNO 3 , H 2 SO 4 , HCl, and H 2 O 2 may be used alone or in combination. it can. In particular, it is preferable to use HF having a high etching ability alone or by mixing HF with other acid or NH 4 F.
また、ガラス基板表面への薬液の付着による悪影響を回避したい場合は、HF等の酸性溶液よりもエッチング能力の緩やかなアルカリ性溶液を用いることが好ましく、具体的には、NaOH及び/またはKOHを含有する溶液を使用することが好ましい。 Further, when it is desired to avoid the adverse effect due to the adhesion of the chemical solution to the glass substrate surface, it is preferable to use an alkaline solution having a gradual etching ability rather than an acidic solution such as HF, and specifically contains NaOH and / or KOH. It is preferred to use a solution that
また、上記方法で処理されたガラス基板は、ガラス基板端面部に異物は少なくなる。そのため、ガラス基板を洗浄処理しても、ガラス基板の表裏面へのパーティクルの付着を防止することができる。 Moreover, the glass substrate processed by the said method has few foreign materials in a glass substrate end surface part. Therefore, even if the glass substrate is subjected to a cleaning treatment, adhesion of particles to the front and back surfaces of the glass substrate can be prevented.
以下、本発明を実施例に基づいて詳細に説明する。 Hereinafter, the present invention will be described in detail based on examples.
表1及び表2は本発明の実施例(試料No.1〜6)を、表3は比較例(試料No.7及びNo.8)をそれぞれ示している。 Tables 1 and 2 show examples (samples No. 1 to 6) of the present invention, and Table 3 shows comparative examples (samples No. 7 and No. 8), respectively.
表中の各試料は次のようにして準備した。 Each sample in the table was prepared as follows.
まず、730×920×0.7mmの大きさに切断した液晶ディスプレイ用ガラス基板(日本電気硝子製OA−10)を用意し、ガラス基板の端面部(切断面)をR形状に研磨加工し、端面粗さを測定した。次に、薬液を染み込ませたローラーブラシを押し当てて、表に示す条件で薬液処理を行った。続いて、ガラス基板全体を温純水に浸漬し5分間振動して洗浄を行い、その後、ガラス基板を取り出し、乾燥した。このようにして試料No.1〜6を得た。また、比較例としてガラス基板端面部の薬液処理を行っていない試料No.7及び8を用意した。 First, a glass substrate for liquid crystal display (OA-10 manufactured by Nippon Electric Glass) cut to a size of 730 × 920 × 0.7 mm is prepared, and the end surface portion (cut surface) of the glass substrate is polished into an R shape, End face roughness was measured. Next, a chemical brush treatment was performed under the conditions shown in the table by pressing a roller brush soaked with the chemical liquid. Subsequently, the entire glass substrate was immersed in warm pure water and washed by shaking for 5 minutes, and then the glass substrate was taken out and dried. In this way, sample no. 1-6 were obtained. In addition, as a comparative example, a sample No. in which the chemical treatment of the glass substrate end surface portion is not performed. 7 and 8 were prepared.
尚、端面粗さについては、ガラス基板端面の稜部について、任意の5箇所を表面粗さ計(東京精密製サーフコム756A)を用いて測定を行い平均して求めた。測長距離は3mm、測定速度は0.3mm/秒、カットオフは0.8mmの条件で測定した。 In addition, about end surface roughness, about the ridge part of the glass substrate end surface, arbitrary five places were measured using the surface roughness meter (Tokyo Seimitsu Surfcom 756A), and calculated | required and averaged. The measurement distance was 3 mm, the measurement speed was 0.3 mm / second, and the cutoff was 0.8 mm.
このようにして、得られた各試料について、ガラス基板端面部の異物の残存面積割合及びガラス基板の表裏面に付着するパーティクルの量を評価した。 Thus, about each obtained sample, the residual area ratio of the foreign material of a glass substrate end surface part and the quantity of the particle adhering to the front and back of a glass substrate were evaluated.
その結果、実施例である試料No.1〜6については、ガラス基板端面の凹部に残存する異物の残存面積割合は10%以下と少なく、また、ガラス基板の表裏面に付着したパーティクルの量も600個/m2以下と少なかった。 As a result, for sample Nos. 1 to 6 which are examples, the remaining area ratio of the foreign matter remaining in the recesses on the end surface of the glass substrate is as low as 10% or less, and the amount of particles attached to the front and back surfaces of the glass substrate is also low. Less than 600 pieces / m 2 .
これに対して、比較例である試料No.7及び8は、ガラス基板端面の凹部に残存する異物の残存面積割合は15%以上と多く、また、ガラス基板の表裏面に付着したパーティクルの量も1000個/m2以上と多かった。 On the other hand, in the sample Nos. 7 and 8 as comparative examples, the remaining area ratio of the foreign matters remaining in the recesses on the end surface of the glass substrate is as large as 15% or more, and the amount of particles adhering to the front and back surfaces of the glass substrate Also, it was more than 1000 pieces / m 2 .
尚、ガラス基板端面の凹部に残存する異物の残存面積割合については、各試料のガラス基板の四辺の端面のそれぞれの中央部にセロハンテープを貼り、セロハンテープを剥がし、剥がしたセロハンテープの表面をCCD撮像装置付きの光学顕微鏡を用いて観察した。次いで、観察した画像をコンピューターに取り込み、画像処理を行って、ガラス基板の端面の面積に占める異物の付着面積の割合を求め、平均して、異物の残存面積割合とした。 In addition, about the remaining area ratio of the foreign material remaining in the concave portion of the glass substrate end surface, a cellophane tape is applied to the center of each end surface of the glass substrate of each sample, the cellophane tape is peeled off, and the surface of the peeled cellophane tape is removed. It observed using the optical microscope with a CCD imaging device. Next, the observed image was taken into a computer and subjected to image processing, and the ratio of the adhesion area of the foreign matter in the area of the end surface of the glass substrate was determined and averaged to be the residual area ratio of the foreign substance.
また、ガラス表裏面に付着したパーティクルの量については、ガラス基板表面検査装置(日立ハイテク電子エンジニアリング社製GI4830)を用いて測定した。測定条件としてはポリスチレン標準粒子1μm以上を検知する条件で測定を行った。ガラス基板の表裏面のパーティクルの個数をそれぞれカウントして平均し、ガラス基板表裏面の総面積で除することにより、その個数を1m2に換算して求めた。 Moreover, about the quantity of the particle adhering to glass front and back, it measured using the glass substrate surface inspection apparatus (HI4830 by Hitachi High-Tech Electronics Engineering). As measurement conditions, measurement was performed under the condition of detecting polystyrene standard particles of 1 μm or more. The number of particles on the front and back surfaces of the glass substrate was counted and averaged and divided by the total area of the front and back surfaces of the glass substrate, and the number was calculated by converting to 1 m 2 .
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JP2004059419A (en) * | 2002-05-31 | 2004-02-26 | Nippon Sheet Glass Co Ltd | Method of manufacturing glass substrate and glass substrate obtained by the method |
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2005
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JPS5425A (en) * | 1977-06-03 | 1979-01-05 | Hitachi Ltd | Method of chamfering glass substrate |
JPH09227170A (en) * | 1996-02-19 | 1997-09-02 | Fujitsu Ltd | Cleaning of glass base board |
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JP2001212531A (en) * | 2000-02-04 | 2001-08-07 | Dainippon Screen Mfg Co Ltd | Cleaning device |
JP2002160147A (en) * | 2000-11-21 | 2002-06-04 | Asahi Glass Co Ltd | Edge polishing method for plate glass |
JP2003151943A (en) * | 2001-11-19 | 2003-05-23 | Speedfam Clean System Co Ltd | Scrub cleaning apparatus |
JP2003168668A (en) * | 2001-12-04 | 2003-06-13 | Tokyo Electron Ltd | Substrate-treating apparatus and substrate-treating method |
JP2004059419A (en) * | 2002-05-31 | 2004-02-26 | Nippon Sheet Glass Co Ltd | Method of manufacturing glass substrate and glass substrate obtained by the method |
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