JP4634175B2 - Logic plate for high pressure fluid - Google Patents

Logic plate for high pressure fluid Download PDF

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JP4634175B2
JP4634175B2 JP2005035308A JP2005035308A JP4634175B2 JP 4634175 B2 JP4634175 B2 JP 4634175B2 JP 2005035308 A JP2005035308 A JP 2005035308A JP 2005035308 A JP2005035308 A JP 2005035308A JP 4634175 B2 JP4634175 B2 JP 4634175B2
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plate member
groove
logic
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fluid
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道夫 塚本
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Mitsubishi Heavy Industries Ltd
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Description

本発明は高圧流体用のロジックプレート、特に溝を有する溝板部材と該溝を覆って閉塞流体通路を形成する蓋板部材とを備えたロジックプレートを複数重合させて、前記閉塞流体通路が１平面ではなく２平面に形成された所謂３次元回路をなすロジックプレートユニットに関する。 According to the present invention, a plurality of logic plates each having a logic plate for high-pressure fluid, particularly a groove plate member having a groove and a cover plate member covering the groove to form a closing fluid passage, are formed. The present invention relates to a logic plate unit forming a so-called three-dimensional circuit formed in two planes instead of a plane .

流体の流れを制御する装置においては、一般に電気や流体圧力等の信号を受けて作動する弁類と管路を組み合わせて複雑な制御回路が構成されていた。その場合、管路の接合や弁類の取付けを間違いなく行い、接合部における流体の漏洩を防止するには慎重な作業が要求されていた。そして従来では、それらの作業の容易化を図り、合わせて管路構成の小型化や保守の容易化を図るために、流体通路を内蔵した回路部材に弁類を取り付けて流体制御装置を一体化する傾向にあった。しかしながら、複雑な流体通路を内蔵した回路部材を高度の鋳造技術で注意深く鋳造しても、鋳巣、亀裂、気泡等ができて通路間が連通したり、また通路内の砂落しを完全に行なうことが困難なために弁や流体機器に故障を齎す虞があった。 In an apparatus for controlling the flow of fluid, a complicated control circuit is generally configured by combining valves and pipes that operate in response to signals such as electricity and fluid pressure. In that case, careful work has been required in order to surely join pipes and attach valves and prevent fluid leakage at the joints. Conventionally, in order to facilitate these operations and to reduce the size of the pipeline and facilitate maintenance, the fluid control device is integrated by attaching valves to the circuit member incorporating the fluid passage. Tended to be. However, even if a circuit member containing a complicated fluid passage is carefully cast with advanced casting technology, a cast hole, a crack, a bubble, etc. are formed, the passages communicate with each other, and sand removal in the passage is completely performed. This makes it difficult to cause trouble in valves and fluid equipment.

これらを解決する手段として、板部材に流体通路となる溝を設け、該板部材に蓋板部材をネジ締めして溝を覆うことによって流体通路を形成し、板部材及び蓋板部材に前記流体通路に所要の箇所で連通する穴を設け、これらの穴に通じる各種弁類及び流体の流出用の管継ぎ手を設けた構成が開示されている（例えば、特許文献１参照。）。また、複雑な形状の溝を設けた溝板部材と該溝板部材に蓋板部材を接着剤で接着して溝を覆うことによって流体通路を形成したものを積層して３次元の流体回路を形成する等の技術も開示されている（例えば、特許文献２参照。）。 As means for solving these problems, a groove serving as a fluid passage is provided in the plate member, a fluid passage is formed by screwing the lid plate member to the plate member to cover the groove, and the fluid is formed in the plate member and the lid plate member. There has been disclosed a configuration in which holes communicating with the passages at required locations are provided, and various valves and pipe joints for fluid outflow are provided (see, for example, Patent Document 1). Further, the three-dimensional stacked one which formed fluid passageway by covering the groove by bonding a cover plate member with an adhesive complex groove plate member having a groove shape and groove plate member Techniques such as forming a fluid circuit are also disclosed (for example, see Patent Document 2).

また、溝を設けた溝板部材と蓋板部材との接合を強固なものとするとともに、溝板部材の溝と蓋板部材で形成された流体通路のシール性を確実にするために、前記溝に沿って蓋板部材を接合する方法が開示され、接合方法として摩擦攪拌接合方法を効果的に用いる方法が開示されている（例えば、特許文献３。）。
さらに、ロジックプレートを非金属材料で構成することによって、腐食性流体による流路の腐食や電食を防止することが提案されており、その場合、非金属材料の強度不足を補うために、金属材料或は剛性を保持できる非金属材料製の支持板を蓋板部材或は溝を設けた溝板部材の背面にネジ締めする技術も開示されている（例えば、特許文献４）。 Further, while the junction between the groove plate member and the cover plate member having a groove and made firm, to ensure sealing of the fluid passage formed by grooves of the grooved plate member and the cover plate member Therefore, the above discloses a method of bonding the cover plate member along the groove, the method of using a friction stir welding method effectively is disclosed as a bonding method (e.g., Patent Document 3).
Furthermore, it has been proposed that the logic plate is made of a non-metallic material to prevent the corrosion of the flow path and the electric corrosion due to the corrosive fluid. In this case, in order to compensate for the lack of strength of the non-metallic material, screwing technology on the back of the groove plate member of non-metallic material made of a support plate to hold the material or stiffness provided the cover plate member, or a groove is also disclosed (e.g., Patent Document 4).

特公昭４９−１３６５１号公報Japanese Patent Publication No.49-13651 特開２００２−３０５０１０号公報JP 2002-305010 A 特許第３５６４４３０号公報Japanese Patent No. 3564430 特開２００４−３１６６６３号公報JP 2004-316663 A

このようなロジックプレートは、例えば鉄道車両用エアブレーキ装置、多くの配管を有する装置、電磁弁ユニット、クーリング或はホットプレート、空圧・油圧・蒸気配管、薄型圧力容器、車載用・定置型燃料電池等々、広い範囲の装置に用いられ、或は用いられようとしている。   Such logic plates include, for example, air brake devices for railway vehicles, devices having many pipes, solenoid valve units, cooling or hot plates, pneumatic / hydraulic / steam piping, thin pressure vessels, automotive / stationary fuels Used or about to be used in a wide range of devices such as batteries.

しかしながら、圧力２０〜３０ＭＰａにも達する高圧流体の制御用に用いようとする場合、特許文献１に開示されたものは、そのような高圧に耐えるように構成することは可能ではあるが、溝板部材と蓋板部材をネジ締めするので、複雑で長い流路となる流体通路の全長に亘って高圧流体の漏出を完全に防止するように構成することは容易ではない。また、特許文献２に開示されたものは、溝板部材と蓋板部材とが接着剤で接合されており、高圧や高温に耐えることはできない。 However, if is to be used for control of the high pressure fluid can reach a pressure 20 to 30 MPa, one disclosed in Patent Document 1, While it is possible to configure to withstand such high pressure, the groove plate since the parts material and the cover plate member screwing, it is not easy to be configured to completely prevent the leakage of high pressure fluid over the entire length of the fluid passage to be complex, long flow paths. Further, the one disclosed in Patent Document 2, a groove plate member and the cover plate member is joined with an adhesive can not withstand the high pressure and high temperature.

特許文献３に記述されているように、蓋板部材を溝板部材の溝に沿って摩擦攪拌接合すれば、かなりの高圧や高温の流体に対して流体通路を通る流体の漏出を防止することは可能であるが、摩擦攪拌接合が可能な蓋板部材の厚さは４ｍｍ前後以下に限られるので、溝幅が大きい場合は蓋板部材に掛かる流体圧による力が大きくなって蓋板部材の接合部や蓋板部材そのものの強度が不足することになる。溝幅を小さくすれば前記流体圧による力を低減することができるが、その場合流体通路の必要な通路面積を確保するためには溝の深さを増大する必要が生じ、そうすると溝板部材の厚さが増大することとなり、ロジックプレートが分厚いものとなり重量も増大する。特許文献４に開示されたものは、耐食性向上のために溝板部材と蓋板部材を非金属材で構成したもので、前記のような高圧に耐え得るように構成されるものではない。 As described in Patent Document 3, when the friction stir welding along the cover plate member into the groove of the grooved plate member, preventing leakage of fluid through the fluid passage against considerable pressure and hot fluid it is possible to, the thickness of the cover plate member that can friction stir welding is limited to the front and rear 4 mm, when the groove width is large becomes large force due to fluid pressure applied to the cover plate member lid strength of the joint and the cover plate member itself of the plate member is to be insufficient. Although it is possible to reduce the force due to the fluid pressure by reducing the groove width, it is necessary to increase the depth of the groove in order to ensure the necessary passage area in such a case the fluid passage, Then groove plate member As a result, the logic plate becomes thicker and the weight increases. Those disclosed in Patent Document 4, the groove plate member and the cover plate member to improve the corrosion resistance which was composed of a non-metallic material, but the present invention is configured to be capable of withstanding high pressure, such as the .

したがって本発明の目的は、圧力が２０〜３０ＭＰａにも達する高圧流体の制御に用いる場合に、流体通路の通路断面積を十分に確保しながら、流体の漏洩を完全に防止することができるロジックプレート、特に溝を有する溝板部材と該溝を覆って閉塞流体通路を形成する蓋板部材とを備えたロジックプレートを複数重合させて、前記閉塞流体通路が１平面ではなく２平面に形成された所謂３次元回路をなす高圧流体用ロジックプレートユニットを提供することである。 Accordingly, an object of the present invention is to provide a logic plate capable of completely preventing fluid leakage while sufficiently securing the cross-sectional area of the fluid passage when used for controlling a high-pressure fluid whose pressure reaches 20 to 30 MPa. In particular , a plurality of logic plates each having a groove plate member having a groove and a cover plate member covering the groove to form a closing fluid passage are superposed to form the closing fluid passage in two planes instead of one plane. The object is to provide a logic plate unit for high-pressure fluid that forms a so-called three-dimensional circuit .

上記目的を達成するため、本発明は、溝を有する溝板部材と該溝を覆って閉塞流体通路を形成する蓋板部材とを備えたロジックプレートを複数重合させて、前記閉塞流体通路が１平面ではなく２平面に形成された所謂３次元回路をなすロジックプレートユニットにおいて、第１の溝板部材の溝に沿って第１の蓋板部材を摩擦攪拌接合して構成された第１のロジックプレートと、第２の溝板部材の溝に沿って第２の蓋板部材を摩擦攪拌接合して構成された第２のロジックプレートをと含み、前記第１及び第２の蓋板部材同士を合わせ面となる様に重ねた状態で、両ロジックプレート同士を通しボルト、ナットからなる連結手段で連結したことを特徴とする。
前記蓋板部材の前記溝板部材の溝に沿う接合は摩擦攪拌接合により接合するのがよい。
摩擦攪拌接合はアルミ系材料の接合に用いられるが、このように構成すれば、比較的薄厚の蓋板部材を摩擦攪拌接合により安価、容易に接合して溝板部材の溝とそれを覆う蓋板部材で形成される流体通路を通る流体の漏洩を完全に防止することができ、比較的薄厚で強度を十分に確保できないアルミ材の蓋板部材の強度不足は前記補強部材で補うことができるので、前記溝板部材の溝幅を十分に大きくし溝深さは程ほどに抑えることができ、流路断面積を確保するための溝深さ増大に伴う溝板部材の厚さの増大を抑えることができる。また、一般に深い溝よりも浅い溝の方が加工は容易であり、加工費の低減も図れる。 To achieve the above object, according to the present invention, a plurality of logic plates each including a groove plate member having a groove and a cover plate member covering the groove to form a closing fluid passage are superposed so that the closing fluid passage is 1 In a logic plate unit that forms a so-called three-dimensional circuit formed in two planes instead of a plane, the first logic is configured by friction stir welding the first lid plate member along the groove of the first groove plate member. A plate and a second logic plate configured by friction stir welding the second lid plate member along the groove of the second groove plate member, and the first and second lid plate members The two logic plates are connected to each other by connecting means including bolts and nuts in a state where they are overlapped to form a mating surface.
The joining of the lid plate member along the groove of the groove plate member is preferably performed by friction stir welding.
Friction stir welding is used for joining aluminum-based materials. With this configuration, a relatively thin lid plate member can be easily and inexpensively joined by friction stir welding to cover the groove of the groove plate member and cover it. The leakage of the fluid passing through the fluid passage formed by the plate member can be completely prevented, and the insufficient strength of the lid member of the aluminum material that is relatively thin and cannot sufficiently secure the strength can be compensated by the reinforcing member. Therefore, the groove width of the groove plate member can be made sufficiently large and the groove depth can be suppressed moderately, and the increase in the thickness of the groove plate member accompanying the increase of the groove depth to ensure the flow path cross-sectional area Can be suppressed. In general, a shallow groove is easier to process than a deep groove, and the processing cost can be reduced.

また、前記補強部材は前記蓋板部材の全面を覆うようにするのもよい。これにより、ロジックプレートを単純な合成板状に形成することができ、外観がシンプルで、輸送、保管、取り扱い上も好都合となる。   The reinforcing member may cover the entire surface of the lid plate member. As a result, the logic plate can be formed into a simple synthetic plate, has a simple appearance, and is convenient for transportation, storage, and handling.

本発明は、また、溝を有する溝板部材に該溝を覆って閉塞流体通路を形成するように蓋板部材を前記溝に沿って摩擦攪拌接合して構成されたロジックプレート２個を前記蓋板部材の表面を互いに合わせて連結手段で連結して構成した２層ロジックプレートユニットを提案する。
このように構成すると、蓋板部材が２枚重なるので流路における蓋板部材部分の強度は２倍と成り、前記補強部材を要することなく流体の高圧に耐えるように構成されたロジックプレートユニットを得ることができる。この場合、流路はいわゆる３次元構成となる。 The present invention also includes two logic plates, each of which is formed by friction stir welding a lid plate member along the groove so as to form a closed fluid passage over the groove plate member having the groove. A two-layer logic plate unit is proposed in which the surfaces of the plate members are aligned with each other and connected by connecting means.
With this configuration, since the two cover plate members overlap each other, the strength of the cover plate member portion in the flow path is doubled, and the logic plate unit configured to withstand the high pressure of the fluid without requiring the reinforcing member. Obtainable. In this case, the flow path has a so-called three-dimensional configuration.

前記のように２枚のロジックプレートの蓋板部材同士を合わせてなる２層ロジックプレートユニットの溝板部材に、さらに溝を有する溝板部材に該溝を覆って閉塞流体通路を形成するように蓋板部材を前記溝に沿って摩擦攪拌接合して構成されたロジックプレートの蓋板部材を合わせ、それらを連結手段で連結して構成することにより、３個或は４個のロジックプレートからなるロジックプレートユニットを、補強部材を設けることなく流体の高圧に耐えるように構成することができる。さらに溝を有する溝板部材に該溝を覆って閉塞流体通路を形成するように蓋板部材を前記溝に沿って摩擦攪拌接合して構成されたロジックプレートの蓋板部材を前段の溝板部材に合わせて積層すれば、補強部材を設けることなく積層されたロジックプレートユニットを構成することができる。 As described above, a closed fluid passage is formed by covering the groove plate member of the two-layer logic plate unit formed by combining the lid plate members of the two logic plates with the groove plate member further having the groove. The cover plate member of the logic plate formed by friction stir welding of the cover plate member along the groove is combined and connected by connecting means to form three or four logic plates. The logic plate unit can be configured to withstand the high pressure of the fluid without providing a reinforcing member. Further, the lid plate member of the logic plate formed by friction stir welding the lid plate member along the groove so as to form a closed fluid passage over the groove plate member having the groove, By stacking according to the above, it is possible to configure a stacked logic plate unit without providing a reinforcing member.

溝板部材と内部通路のシールを確実に行なう蓋板部材と該蓋板部材を支える補強部材を具備することによって、流体通路の幅を十分確保しながら圧力２０〜３０ＭＰａにも達する高圧流体の制御用に用いることができるロジックプレートを提供できる。さらにロジックプレートを積層する場合には、補強部材を設けることなく流体の高圧に耐えることができるロジックプレートユニットを構成することができる。   Control of high-pressure fluid reaching a pressure of 20 to 30 MPa while ensuring a sufficient width of the fluid passage by providing a lid plate member that reliably seals the groove plate member and the internal passage and a reinforcing member that supports the lid plate member A logic plate that can be used for the purpose can be provided. Further, when logic plates are stacked, a logic plate unit that can withstand the high pressure of fluid can be configured without providing a reinforcing member.

以下、図面を参照して本発明の好適な実施例を例示的に説明する。但しこの実施例に記載されている構成部品の寸法、材質、形状、その相対的配置等は、特に特定的な記載がない限りはこの発明の範囲をそれに限定する趣旨ではなく、単なる説明例に過ぎない。   DESCRIPTION OF EXEMPLARY EMBODIMENTS Hereinafter, exemplary embodiments of the invention will be described with reference to the drawings. However, the dimensions, materials, shapes, relative arrangements, and the like of the components described in this embodiment are not intended to limit the scope of the present invention unless otherwise specified, but are merely illustrative examples. Not too much.

図１は、本発明に使用される高圧流体用ロジックプレート１０に機器類５１および５３が取り付けられた状態の部分断面を示す。同図において１は溝板部材、２は蓋板部材、３は補強板部材である。前記溝板部材１には流体通路となる溝１ａ、１ｂが設けられている。これらの溝は蓋板部材２によって覆われ、該蓋板部材２は接合、特に摩擦攪拌接合により符号４で示すように前記溝板部材１に接合されている。１ｃは溝１ａに連通する溝板部材１に設けられた連通孔であり、２ａ、３ａは溝１ｂに連通するそれぞれ蓋板部材２及び補強板部材３に設けられた連通孔である。前記補強板部材３は前記蓋板部材２の上にボルト５、５で前記溝板部材に締め付けられている。機器５１が前記溝板部材１に、機器５３が前記補強板部材に、それぞれ連通孔１ｃ及び連通孔２ａ、３ａに対してそれぞれＯリング１２、１４でシールされて取り付けられている。これらはＯリングに代えてパッキングとしてもよいことは勿論である。機器５３を補強板部材３に取り付ける場合は、連通孔２ａ、３ａにおける蓋板部材２と補強板部材３の接合部で流体の漏洩が生じないように、蓋板部材２と補強板部材３の間には接着剤或はパッキング剤を塗布或はパッキングを敷くことが望ましい。 FIG. 1 shows a partial cross-section in a state in which devices 51 and 53 are attached to a high-pressure fluid logic plate 10 used in the present invention. In the figure, 1 is a groove plate member, 2 is a lid plate member, and 3 is a reinforcing plate member. The groove plate member 1 is provided with grooves 1a and 1b serving as fluid passages. These grooves are covered with a cover plate member 2, and the cover plate member 2 is joined to the groove plate member 1 as shown by reference numeral 4 by joining, particularly friction stir welding. 1c is a communication hole provided in the groove plate member 1 communicating with the groove 1a, and 2a and 3a are communication holes provided in the lid plate member 2 and the reinforcing plate member 3 respectively communicating with the groove 1b. The reinforcing plate member 3 is fastened to the groove plate member by bolts 5 and 5 on the lid plate member 2. The device 51 is attached to the groove plate member 1 and the device 53 is attached to the reinforcing plate member by being sealed with O-rings 12 and 14 with respect to the communication hole 1c and the communication holes 2a and 3a, respectively. Of course, these may be packed instead of the O-ring. When the device 53 is attached to the reinforcing plate member 3, the lid plate member 2 and the reinforcing plate member 3 are arranged so that no fluid leaks at the joint between the lid plate member 2 and the reinforcing plate member 3 in the communication holes 2 a and 3 a. It is desirable to apply an adhesive or a packing agent or lay a packing between them.

図１においては、補強板部材３は蓋板部材の上面に押しボルトで溝板部材１に締め付けているが、通しボルトとナットで結合してもよい。溝１ａを通る高圧流体の圧力により蓋板部材２前記溝１ａに面する部分には上向きの力が作用して、その部分は上方に変形しようとするが、補強板部材３で押えられているので、力は蓋板部材２とともに補強板部材３を変形させようとする。溝１ｂについても同様であり、溝から蓋板部材２に作用する力の大きさは、溝幅と溝長さの積の総和と流体圧力との積である。この力のうち、一部は溝に沿って摩擦攪拌接合された蓋板部材で担われ残りが補強板部材に作用することになる。補強部材はボルトでこの力に対抗できるように蓋板部材を挟んで溝板部材に結合される。   In FIG. 1, the reinforcing plate member 3 is fastened to the groove plate member 1 with a push bolt on the upper surface of the lid plate member, but may be coupled with a through bolt and a nut. An upward force acts on the portion facing the groove 1a by the pressure of the high-pressure fluid passing through the groove 1a, and the portion tries to deform upward, but is pressed by the reinforcing plate member 3. Therefore, the force tries to deform the reinforcing plate member 3 together with the cover plate member 2. The same applies to the groove 1b, and the magnitude of the force acting on the cover plate member 2 from the groove is the product of the sum of the products of the groove width and the groove length and the fluid pressure. A part of this force is carried by the cover plate member that is friction stir welded along the groove, and the rest acts on the reinforcing plate member. The reinforcing member is coupled to the groove plate member with the lid plate member sandwiched so as to be able to counter this force with a bolt.

なお、図において符号５１、５３は図示しないボルトで取り付けてある機器、或は弁類であり、或は圧力流体の入口、出口コネクターである。５２、５４はそれぞれ連通炉１ｃ、３ａと機器５１、５３との間をシールするＯリングであるが、これらはパッキングであってもよい。復雑な回路構成においては、前記の機器、弁類、出入り口コネクターは多数配設されることになる。なお、蓋板部材２と補強板部材３との接合面は接合、特に摩擦攪拌接合であり、溝１ａ、１ｂを通る流体は完全にシールされる。このように、流路のシール機能は蓋板部材の接合部で果たし、補強部材で蓋板部材を補強することで、流路を形成する溝板部材の溝深さを深くしなくても蓋板部材側の強度を確保することができるので、溝深さを深くして蓋板部材に掛かる負荷を減じる場合に較べればロジックプレートユニットの厚さを薄型に構成することができ、重量も軽減することができる。   In the figure, reference numerals 51 and 53 are devices or valves attached with bolts (not shown), or pressure fluid inlet / outlet connectors. 52 and 54 are O-rings for sealing between the communication furnaces 1c and 3a and the devices 51 and 53, respectively, but these may be packing. In a complicated circuit configuration, a large number of the devices, valves, and entrance / exit connectors are provided. In addition, the joining surface of the cover plate member 2 and the reinforcing plate member 3 is joined, particularly friction stir welding, and the fluid passing through the grooves 1a and 1b is completely sealed. Thus, the sealing function of the flow path is achieved at the joint portion of the lid plate member, and the lid plate member is reinforced by the reinforcing member, so that the lid is not required to increase the groove depth of the groove plate member forming the flow path. Since the strength on the plate member side can be ensured, the thickness of the logic plate unit can be reduced and the weight can be reduced compared to the case where the groove depth is increased to reduce the load on the cover plate member. can do.

図２は、溝板部材２１の溝２１ａ、２１ｂに沿って摩擦攪拌接合されて構成されたロジックプレート２０と溝板部材３１の溝３１ａ、３１ｂに沿って摩擦攪拌接合されて構成されたロジックプレート３０を互いに蓋板部材２１、３１を合わせて通しボルト、ナット２５ａ、２５ｂで連結した本発明の実施例にかかるロジックプレートユニット１００の部分断面を示す。このような構成は、流体回路が１平面ではなく２平面に形成された所謂３次元回路をなすものである。この構成は、流路が複雑に交錯して１平面で構成することができない場合に有効である。この構成ではロジックプレート２０の蓋板部材２２はその上に積層されるロジックプレート３０で補強されることになるので、図１のように補強部材を特に設けないでも各ロジックプレート２０、３０は流路（溝２１ａ、３１ａ、２１ｂ、３１ｂ）を通る流体の高圧力に耐えることができる。図では蓋板部材２２及び３２の溝２１ａと３１ａが連通孔２２ａ、３２ａで連結されており、流路断面積が溝２１ａ或は３１ａのみでは不足の場合に流体を溝２１ａと３１ａに分けて流すことにより大きな流路断面積を確保することができる。特にこのような場合には、溝２１ａと３１ａを流れる流体の圧力は互いに均衡するので、蓋板部材２２、３２のこの部分は高圧流体により変形を受けることがなくなる。溝２１ｂ、３１ｂは連通されることなく別々の流路に構成されている。溝２１ｂ、３１ｂが蓋板部材を隔てて重なっている場合は流体圧力による蓋板部材２２、３２のその部分に掛かる力は減殺され、重なっていない場合はそれぞれ対面するロジカルプレートの蓋板部材及び溝板部材により支えられることのなり、高圧に耐えることができる。図２においても、ロジックプレートユニット１００の溝板部材２１及び／或は溝板部材３１には図示しない機器或は弁類或は流路入口や出口のコネクターが配設される。 FIG. 2 shows a logic plate 20 constructed by friction stir welding along the grooves 21a and 21b of the groove plate member 21 and a logic plate constructed by friction stirring and joining along the grooves 31a and 31b of the groove plate member 31. 30 shows a partial cross-section of a logic plate unit 100 according to an embodiment of the present invention in which 30 are connected to each other with cover plate members 21 and 31 and are connected by through bolts and nuts 25a and 25b. Such a configuration forms a so-called three-dimensional circuit in which the fluid circuit is formed in two planes instead of one plane. This configuration is effective when the flow paths are intricately crossed and cannot be configured in one plane. In this configuration, the cover plate member 22 of the logic plate 20 is reinforced by the logic plate 30 laminated thereon, so that each logic plate 20, 30 can be flowed without any reinforcement member as shown in FIG. It can withstand the high pressure of fluid passing through the channels (grooves 21a, 31a, 21b, 31b). In the figure, the grooves 21a and 31a of the cover plate members 22 and 32 are connected by the communication holes 22a and 32a, and the fluid is divided into the grooves 21a and 31a when the channel cross-sectional area is insufficient only by the grooves 21a or 31a. A large flow path cross-sectional area can be secured by flowing. Particularly in such a case, the pressure of the fluid flowing through the grooves 21a and 31a is balanced with each other, so that this portion of the cover plate members 22 and 32 is not deformed by the high-pressure fluid. The grooves 21b and 31b are configured as separate flow paths without being communicated with each other. When the grooves 21b and 31b overlap with each other across the lid plate member, the force applied to that portion of the lid plate members 22 and 32 by the fluid pressure is reduced, and when they do not overlap, the lid plate member of the logical plate facing each other and It is supported by the groove plate member and can withstand high pressure. In FIG. 2 as well, the groove plate member 21 and / or the groove plate member 31 of the logic plate unit 100 are provided with devices (not shown) or valves, or flow path inlet and outlet connectors.

図３には本発明の実施例にかかるロジックプレートを３個積層したロジックプレートユニット２００の部分断面が示されている。この場合、溝板部材４１と蓋板部材４２からなる最上部のロジックプレート４０はその蓋板部材４２が下段のロジックプレート３０の溝板部材３１に合わせて通しボルト、ナット３５ａ、３５ｂで連結されている。図示しないが、ロジックプレート２０の下側に他のロジックプレートの蓋板部材を合わせて連結すれば４層の積層ロジックプレートユニットが構成できる。このように次々と積層して多層のロジックプレートを構成することができる。そしてこのように２層以上の積層ロジックプレートユニットを構成する際には、図１で設けたような補強部材は設けなくても流体の高圧に耐えることができるロジックプレートを構成することができる。 FIG. 3 shows a partial cross section of a logic plate unit 200 in which three logic plates according to an embodiment of the present invention are stacked. In this case, the uppermost logic plate 40 composed of the groove plate member 41 and the cover plate member 42 is connected to the groove plate member 31 of the lower logic plate 30 by the cover plate member 42 by through bolts and nuts 35a and 35b. ing. Although not shown, a four-layer stacked logic plate unit can be configured by connecting and connecting the lid plate members of other logic plates to the lower side of the logic plate 20. In this way, a multilayer logic plate can be formed by stacking one after another. When a stacked logic plate unit having two or more layers is configured as described above, it is possible to configure a logic plate that can withstand the high pressure of fluid without providing a reinforcing member as shown in FIG.

圧力２０〜３０ＭＰａにも達する高圧流体の制御用に用いることができるロジックプレートを構成することができ、高圧流体の制御装置を小型、安価で、組付け容易に構成することができる。また、高圧流体のシールは接合部で行なわれるので、高温に対しても確実なシール機能が発揮される。   A logic plate that can be used for controlling a high-pressure fluid reaching a pressure of 20 to 30 MPa can be configured, and a high-pressure fluid control device can be configured in a small size, at low cost, and easily assembled. In addition, since the high-pressure fluid is sealed at the joint, a reliable sealing function is exhibited even at high temperatures.

本発明に使用される高圧流体用ロジックプレートの構成と該ロジックプレートに機器類が装着着された状態を示す部分断面図である。 It is a fragmentary sectional view which shows the state by which the structure of the logic plate for high pressure fluids used for this invention and equipment was mounted | worn with this logic plate. 本発明の実施例に係わる２層積層のロジックプレートユニットの構成を示す部分断面図である。It is a partial sectional view showing a configuration of a logic plate unit of the two-layer laminate according to actual施例of the present invention. 本発明の他の実施例に係わる３層積層のロジックプレートユニットの構成を示す部分断面図である。It is a fragmentary sectional view which shows the structure of the logic plate unit of the 3 layer lamination concerning the other Example of this invention.

１、２１、３１、４１ 溝板部材
溝板部材
１ａ、１ｂ 溝
１ｃ 連通孔
２ 蓋板部材
２ａ 連通孔
３ 補強板部材
３ａ 連通孔
４ 摩擦攪拌接合部
５ ボルト
１０ ロジックプレート
２０、３０、４０ ロジックプレート
２２、３２、４２ 蓋板部材
２１ａ、２１ｂ、３１ａ、３１ｂ 溝
２２ａ、３２ａ 連通孔
２５ａ、３５ａ 通しボルト
２５ｂ、３５ｂ ナット
５１、５３ 機器
５２、５４ Ｏリング
１００、２００ ロジックプレートユニット
1, 21, 31, 41 Groove plate member Groove plate member 1a, 1b Groove 1c Communication hole 2 Lid plate member 2a Communication hole 3 Reinforcement plate member 3a Communication hole 4 Friction stir joint 5 Bolt 10 Logic plate 20, 30, 40 Logic Plate 22, 32, 42 Lid plate member 21a, 21b, 31a, 31b Groove 22a, 32a Communication hole 25a, 35a Through bolt 25b, 35b Nut 51, 53 Equipment 52, 54 O-ring 100, 200 Logic plate unit

Claims (3)

溝を有する溝板部材と該溝を覆って閉塞流体通路を形成する蓋板部材とを備えたロジックプレートを複数重合させて、前記閉塞流体通路が１平面ではなく２平面に形成された所謂３次元回路をなすロジックプレートユニットにおいて、
第１の溝板部材の溝に沿って第１の蓋板部材を摩擦攪拌接合して構成された第１のロジックプレートと、第２の溝板部材の溝に沿って第２の蓋板部材を摩擦攪拌接合して構成された第２のロジックプレートをと含み、
前記第１及び第２の蓋板部材同士を合わせ面となる様に重ねた状態で、両ロジックプレート同士を通しボルト、ナットからなる連結手段で連結したことを特徴とする高圧流体用ロジックプレートユニット。 A plurality of logic plates each having a groove plate member having a groove and a lid plate member covering the groove to form a closing fluid passage are superposed so that the closing fluid passage is formed in two planes instead of one plane. In the logic plate unit that forms a dimensional circuit,
A first logic plate configured by friction stir welding of the first lid plate member along the groove of the first groove plate member, and a second lid plate member along the groove of the second groove plate member And a second logic plate configured by friction stir welding,
A logic plate unit for high-pressure fluid, wherein the first and second cover plate members are overlapped with each other so as to form a mating surface, and both logic plates are connected to each other by connecting means including bolts and nuts. . 少なくとも前記第１若しくは第２の溝板部材の表面に、溝を有する溝板部材に該溝を覆って閉塞流体通路を形成するように蓋板部材を前記溝に沿って摩擦攪拌接合してなる複数のロジックプレートの内、少なくとも第１のロジックプレートの第１の蓋板部材と第２のロジックプレートの第２の蓋板部材は合わせ面となる様に重ねた状態で、それらを前記連結手段で連結して構成したことを特徴とする請求項１記載の３層或は４層の高圧流体用ロジックプレートユニット。 At least on the surface of the first or second groove plate member, a cover plate member is friction stir welded along the groove so as to cover the groove and form a closed fluid passage on the groove plate member having the groove. the plurality of logic plate, at least a first in first cover plate member and the second state the cover plate member is overlaid so as to be a mating surface of the second logic plates logic plates, they said coupling means 2. The logic plate unit for three-layer or four-layer high-pressure fluid according to claim 1 , wherein the logic plate unit is configured to be connected with each other. 少なくとも前記第１若しくは第２の溝板部材の表面に、溝を有する溝板部材に該溝を覆って閉塞流体通路を形成するように蓋板部材を前記溝に沿って摩擦攪拌接合してなるロジックプレートの、５個以上の該ロジックプレートを、少なくとも第１のロジックプレートの第１の蓋板部材と第２のロジックプレートの第２の蓋板部材は合わせ面となる様に重ねた状態で積層し、それらを前記連結手段で連結して構成したことを特徴とする請求項１記載の多層の高圧流体用ロジックプレートユニット。 At least on the surface of the first or second groove plate member, a cover plate member is friction stir welded along the groove so as to cover the groove and form a closed fluid passage on the groove plate member having the groove. In a state where five or more logic plates of the logic plate are overlapped so that at least the first lid plate member of the first logic plate and the second lid plate member of the second logic plate become a mating surface. The multi-layer logic plate unit for high-pressure fluid according to claim 1 , characterized in that they are stacked and connected by said connecting means.
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Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6357859U (en) * 1986-10-02 1988-04-18
JP2002372198A (en) * 2001-06-12 2002-12-26 Mitsubishi Heavy Ind Ltd Working method, working device and working facility for logic plate
JP2004530190A (en) * 2001-02-28 2004-09-30 ポーター・インストゥルメント・カンパニー・インコーポレイテッド Flow controller
JP2004316663A (en) * 2003-04-10 2004-11-11 Mitsubishi Heavy Ind Ltd Logic plate

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6357859U (en) * 1986-10-02 1988-04-18
JP2004530190A (en) * 2001-02-28 2004-09-30 ポーター・インストゥルメント・カンパニー・インコーポレイテッド Flow controller
JP2002372198A (en) * 2001-06-12 2002-12-26 Mitsubishi Heavy Ind Ltd Working method, working device and working facility for logic plate
JP2004316663A (en) * 2003-04-10 2004-11-11 Mitsubishi Heavy Ind Ltd Logic plate

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