JP4626185B2 - Common mode noise filter - Google Patents

Common mode noise filter Download PDF

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JP4626185B2
JP4626185B2 JP2004159142A JP2004159142A JP4626185B2 JP 4626185 B2 JP4626185 B2 JP 4626185B2 JP 2004159142 A JP2004159142 A JP 2004159142A JP 2004159142 A JP2004159142 A JP 2004159142A JP 4626185 B2 JP4626185 B2 JP 4626185B2
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insulating layer
conductor
coil
common mode
noise filter
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JP2005340611A (en
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博伸 千葉
淳 新海
祥吾 中山
秀樹 田中
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Panasonic Corp
Panasonic Holdings Corp
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Panasonic Corp
Matsushita Electric Industrial Co Ltd
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Application filed by Panasonic Corp, Matsushita Electric Industrial Co Ltd filed Critical Panasonic Corp
Priority to CNB2005800006882A priority patent/CN100559521C/en
Priority to KR1020067001847A priority patent/KR100789040B1/en
Priority to PCT/JP2005/009421 priority patent/WO2005117037A1/en
Priority to EP05743318A priority patent/EP1635363A1/en
Priority to US10/562,557 priority patent/US7119649B2/en
Priority to TW094116860A priority patent/TW200609956A/en
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Description

本発明は、各種電子機器に使用される小型で積層型のコモンモードノイズフィルタに関するものである。   The present invention relates to a small and stacked common mode noise filter used in various electronic devices.

図７は、従来のコモンモードノイズフィルタの分解斜視図である。   FIG. 7 is an exploded perspective view of a conventional common mode noise filter.

従来のコモンモードノイズフィルタは、図７に示すように、第１〜第４の絶縁層１ａ〜１ｄの各々の上面にそれぞれ渦巻き状の第１〜第４の導体２ａ、２ｂ、３ａ、３ｂを設け、そして第１の導体２ａと第２の導体２ｂとをバイア電極４ａを介して接続することにより第１のコイル２を形成するとともに、第３の導体３ａと第４の導体３ｂとをバイア電極４ｂを介して接続することにより第２のコイル３を形成していた。   As shown in FIG. 7, the conventional common mode noise filter has spiral first to fourth conductors 2a, 2b, 3a, and 3b on the upper surfaces of the first to fourth insulating layers 1a to 1d, respectively. The first coil 2 is formed by connecting the first conductor 2a and the second conductor 2b via the via electrode 4a, and the third conductor 3a and the fourth conductor 3b are connected to the via. The second coil 3 was formed by connecting through the electrode 4b.

また、前記第１の絶縁層１ａの下面と第４の導体３ｂの上面に磁性体からなる第５の絶縁層５をそれぞれ設け、さらに、前記第２の絶縁層１ｂ〜第４の絶縁層１ｄを非磁性体で構成するとともに、前記第１の絶縁層１ａと第５の絶縁層５を磁性体で構成していた。   Further, a fifth insulating layer 5 made of a magnetic material is provided on the lower surface of the first insulating layer 1a and the upper surface of the fourth conductor 3b, respectively, and further, the second insulating layer 1b to the fourth insulating layer 1d are provided. Is made of a non-magnetic material, and the first insulating layer 1a and the fifth insulating layer 5 are made of a magnetic material.

上記のような構成とすることにより、第３の絶縁層１ｃを介して対向する第２の導体２ｂと第３の導体３ａとを磁気結合させ、これにより、第１のコイル２と第２のコイル３のコモンモード成分のインピーダンスを大きくして、コモンモードノイズを除去するようにしていた。   With the configuration as described above, the second conductor 2b and the third conductor 3a facing each other with the third insulating layer 1c interposed therebetween are magnetically coupled, whereby the first coil 2 and the second conductor 2a are magnetically coupled. The impedance of the common mode component of the coil 3 is increased to remove common mode noise.

なお、この出願の発明に関する先行技術文献情報としては、例えば、特許文献１が知られている。
特開２０００−１９０４１０号公報 As prior art document information relating to the invention of this application, for example, Patent Document 1 is known.
JP 2000-190410 A

上記した従来のコモンモードノイズフィルタにおいては、第３の絶縁層１ｃの厚みが薄い場合、この第３の絶縁層１ｃを介して設けられた第２の導体２ｂと第３の導体３ａとの間すなわち第１のコイル２と第２のコイル３との間で絶縁不良やマイグレーション等が発生する可能性があった。さらに、第２の絶縁層１ｂ、第４の絶縁層１ｄの厚みが厚い場合、第１の絶縁層１ａと第２の導体２ｂとの距離、第４の導体１ｄの上面に設けられた第５の絶縁層５と第３の導体３ａとの距離が長くなるため、第１の絶縁層１ａ、第５の絶縁層５で発生する磁界を有効に活用できず、第１のコイル２、第２のコイル３のコモンモード成分のインピーダンスを大きくすることができない可能性があるという課題を有していた。   In the above-described conventional common mode noise filter, when the thickness of the third insulating layer 1c is thin, it is between the second conductor 2b and the third conductor 3a provided via the third insulating layer 1c. That is, there is a possibility that insulation failure, migration, or the like occurs between the first coil 2 and the second coil 3. Further, when the thickness of the second insulating layer 1b and the fourth insulating layer 1d is thick, the distance between the first insulating layer 1a and the second conductor 2b, the fifth provided on the upper surface of the fourth conductor 1d. Since the distance between the first insulating layer 5 and the third conductor 3a becomes longer, the magnetic fields generated in the first insulating layer 1a and the fifth insulating layer 5 cannot be used effectively, and the first coil 2 and second There is a problem that the impedance of the common mode component of the coil 3 may not be increased.

本発明は上記従来の課題を解決するもので、第１のコイルと第２のコイルとの間で絶縁不良やマイグレーション等が発生するのを防止することができ、さらには第１のコイル、第２のコイルのコモンモード成分のインピーダンスを大きくすることができるコモンモードノイズフィルタを提供することを目的とするものである。   The present invention solves the above-described conventional problems, and can prevent the occurrence of poor insulation, migration, or the like between the first coil and the second coil. It is an object of the present invention to provide a common mode noise filter capable of increasing the impedance of the common mode component of the second coil.

上記目的を達成するために本発明は、第１の絶縁層および第５の絶縁層を磁性体で構成し、かつ第２〜第４の絶縁層を非磁性体で構成するとともに、第３の絶縁層の厚みを第２の絶縁層および第４の絶縁層の厚みより厚くしたもので、第３の絶縁層の厚みを厚くすることができるため、この第３の絶縁層を介して設けられた第２の導体と第３の導体との間、すなわち第１のコイルと第２のコイルとの間で絶縁不良やマイグレーション等が発生するのを防止することができ、さらには、第２の絶縁層および第４の絶縁層の厚みを薄くできるため、第１の絶縁層と第２の導体との距離および第５の絶縁層と第３の導体との距離をそれぞれ短くでき、これにより、磁生体で構成された第１の絶縁層および第５の絶縁層で発生する磁界を有効に活用できるため、第１のコイル、第２のコイルのコモンモード成分のインピーダンスを大きくすることができるという作用効果が得られるものである。   To achieve the above object, according to the present invention, the first insulating layer and the fifth insulating layer are made of a magnetic material, and the second to fourth insulating layers are made of a non-magnetic material. Since the thickness of the insulating layer is greater than the thickness of the second insulating layer and the fourth insulating layer, and the thickness of the third insulating layer can be increased, the insulating layer is provided via the third insulating layer. Insulation failure, migration, etc. can be prevented between the second conductor and the third conductor, that is, between the first coil and the second coil. Since the thickness of the insulating layer and the fourth insulating layer can be reduced, the distance between the first insulating layer and the second conductor and the distance between the fifth insulating layer and the third conductor can be shortened, respectively. Effective use of the magnetic field generated in the first and fifth insulating layers composed of magnetic bodies Because, the first coil, in which the action and effect that it is possible to increase the impedance of the common mode component of the second coil can be obtained.

以上のように本発明は、第１の絶縁層の上面に設けられた第１の導体と、前記第１の導体の上面に設けられた第２の絶縁層と、前記第２の絶縁層に設けられた第１のバイア電極と、前記第２の絶縁層の上面に設けられかつ前記第１の導体に前記第１のバイア電極を介して接続されてこの第１の導体とにより第１のコイルを構成する渦巻き状の第２の導体と、前記第２の導体の上面に設けられた第３の絶縁層と、前記第３の絶縁層の上面に設けられた渦巻き状の第３の導体と、前記第３の導体の上面に設けられた第４の絶縁層と、前記第４の絶縁層に設けられた第２のバイア電極と、前記第４の絶縁層の上面に設けられかつ前記第３の導体に前記第２のバイア電極を介して接続されてこの第３の導体とにより第２のコイルを構成する第４の導体と、前記第４の導体の上面に設けられた第５の絶縁層と、前記第１〜第４の導体の各々の一端部にそれぞれ接続された第１〜第４の引出電極とを備え、前記第１の絶縁層および第５の絶縁層を磁性体で構成し、かつ前記第２〜第４の絶縁層を非磁性体で構成するとともに、前記第３の絶縁層の厚みを前記第２の絶縁層および第４の絶縁層の厚みより厚くしているため、第３の絶縁層の厚みを厚くすることができ、これにより、この第３の絶縁層を介して設けられた第２の導体と第３の導体との間、すなわち第１のコイルと第２のコイルとの間で絶縁不良やマイグレーション等が発生するのを防止することができ、さらには、第２の絶縁層および第４の絶縁層の厚みを薄くできるため、第１の絶縁層と第２の導体との距離および第５の絶縁層と第３の導体との距離をそれぞれ短くでき、これにより、磁生体で構成された第１の絶縁層、第５の絶縁層で発生する磁界を有効に活用できるため、第１のコイル、第２のコイルのコモンモード成分のインピーダンスを大きくすることができるという効果を奏するものである。 As described above, the present invention provides a first conductor provided on the upper surface of the first insulating layer, a second insulating layer provided on the upper surface of the first conductor, and the second insulating layer. a first via electrode provided, wherein the second provided on the upper surface of the insulating layer and are connected through the first via electrode to said first conductor the first conductor first A spiral second conductor constituting the coil, a third insulating layer provided on the top surface of the second conductor, and a spiral third conductor provided on the top surface of the third insulating layer A fourth insulating layer provided on the top surface of the third conductor; a second via electrode provided on the fourth insulating layer; provided on the top surface of the fourth insulating layer; and the third is a connection conductor via the second via electrodes fourth conductors constituting the second coil by a third conductor A fifth insulating layer provided on the upper surface of the fourth conductor, and first to fourth extraction electrodes respectively connected to one end portions of the first to fourth conductors, The first insulating layer and the fifth insulating layer are made of a magnetic material, the second to fourth insulating layers are made of a non-magnetic material, and the thickness of the third insulating layer is set to the second value. Since it is thicker than the thickness of the insulating layer and the fourth insulating layer, the thickness of the third insulating layer can be increased, whereby the second conductor provided via the third insulating layer. Between the first and third conductors, that is, between the first coil and the second coil, it is possible to prevent poor insulation, migration, and the like. Furthermore, the second insulating layer and the fourth conductor can be prevented. The thickness of the insulating layer can be reduced, so that the distance between the first insulating layer and the second conductor and the fifth insulating layer The distance between the first and second conductors can be shortened, and the magnetic field generated in the first insulating layer and the fifth insulating layer made of a magnetic body can be effectively utilized. The effect is that the impedance of the common mode component of the coil can be increased.

図１は本発明の一実施の形態におけるコモンモードノイズフィルタの分解斜視図、図２は同コモンモードノイズフィルタの斜視図である。   FIG. 1 is an exploded perspective view of a common mode noise filter according to an embodiment of the present invention, and FIG. 2 is a perspective view of the common mode noise filter.

本発明の一実施の形態におけるコモンモードノイズフィルタは、図１に示すように、第１の絶縁層１１の上面に設けられた第１の導体１２と、前記第１の導体１２の上面に設けられた第２の絶縁層１３と、前記第２の絶縁層１３の上面に設けられかつ前記第１の導体１２に接続された渦巻き状の第２の導体１４と、前記第２の導体１４の上面に設けられた第３の絶縁層１５と、前記第３の絶縁層１５の上面に設けられた渦巻き状の第３の導体１６と、前記第３の導体１６の上面に設けられた第４の絶縁層１７と、前記第４の絶縁層１７の上面に設けられかつ前記第３の導体１６に接続された第４の導体１８と、前記第４の導体１８の上面に設けられた第５の絶縁層１９とを備えている。   As shown in FIG. 1, the common mode noise filter according to one embodiment of the present invention is provided with a first conductor 12 provided on the upper surface of the first insulating layer 11 and an upper surface of the first conductor 12. Of the formed second insulating layer 13, a spiral second conductor 14 provided on the upper surface of the second insulating layer 13 and connected to the first conductor 12, and the second conductor 14 A third insulating layer 15 provided on the upper surface, a spiral third conductor 16 provided on the upper surface of the third insulating layer 15, and a fourth provided on the upper surface of the third conductor 16. An insulating layer 17, a fourth conductor 18 provided on the upper surface of the fourth insulating layer 17 and connected to the third conductor 16, and a fifth conductor 18 provided on the upper surface of the fourth conductor 18. The insulating layer 19 is provided.

そして、前記第１の導体１２とこの第１の導体１２に接続された第２の導体１４とにより第１のコイル２０が構成され、かつ第３の導体１６とこの第３の導体１６に接続された第４の導体１８とにより第２のコイル２１が構成されている。   A first coil 20 is constituted by the first conductor 12 and the second conductor 14 connected to the first conductor 12, and is connected to the third conductor 16 and the third conductor 16. The second coil 21 is configured by the fourth conductor 18 thus formed.

また、前記第１の絶縁層１１、第５の絶縁層１９は磁性体で構成し、かつ第２の絶縁層１３、第３の絶縁層１５、第４の絶縁層１７は非磁性体で構成している。   The first insulating layer 11 and the fifth insulating layer 19 are made of a magnetic material, and the second insulating layer 13, the third insulating layer 15 and the fourth insulating layer 17 are made of a non-magnetic material. is doing.

そしてまた、第３の絶縁層１５の厚みは第２の絶縁層１３および第４の絶縁層１７の厚みより厚くしている。   In addition, the thickness of the third insulating layer 15 is larger than the thickness of the second insulating layer 13 and the fourth insulating layer 17.

上記構成において、前記第１の絶縁層１１は、Ｆｅ2Ｏ3をベースとしたフェライト等の磁性材料によりシート状に構成されているもので、絶縁性を有している。 In the above configuration, the first insulating layer 11 is formed in a sheet shape from a magnetic material such as ferrite based on Fe 2 O 3 and has an insulating property.

前記第１の導体１２は、銀等の導電材料をめっきすることにより形成されるもので、第１の絶縁層１１の上面に設けられている。また、この第１の導体１２の一端部には、第１の絶縁層１１の側部に露出する第１の引出電極２２が接続されている。   The first conductor 12 is formed by plating a conductive material such as silver, and is provided on the upper surface of the first insulating layer 11. A first lead electrode 22 exposed at the side of the first insulating layer 11 is connected to one end of the first conductor 12.

前記第２の絶縁層１３は、Ｃｕ−Ｚｎフェライト、ガラスセラミック等の非磁性材料によりシート状に構成されているもので、絶縁性を有し、かつ第１の導体１２の上面に設けられている。また、この第２の絶縁層１３の中央部には第１のバイア電極２３が形成されている。なお、この第１のバイア電極２３は、第１の導体１２の他端部１２ａと接続されている。   The second insulating layer 13 is formed in a sheet shape from a non-magnetic material such as Cu—Zn ferrite or glass ceramic, has an insulating property, and is provided on the upper surface of the first conductor 12. Yes. A first via electrode 23 is formed at the center of the second insulating layer 13. The first via electrode 23 is connected to the other end portion 12 a of the first conductor 12.

前記第２の導体１４は、渦巻き状に銀等の導電材料をめっきすることにより形成されるもので、第２の絶縁層１３の上面に設けられている。また、この第２の導体１４の一端部には、第２の絶縁層１３の側部に露出する第２の引出電極２４が接続されている。そしてまた、この第２の導体１４の他端部１４ａ、すなわち渦巻きの中心部は第１のバイア電極２３と接続されているもので、これにより、第１のバイア電極２３を介して第１の導体１２の他端部１２ａと第２の導体１４の他端部１４ａとが電気的に接続されるため、第１の導体１２と第２の導体１４は接続されることになり、これにより、第１の導体１２と第２の導体１４とからなる第１のコイル２０が形成される。   The second conductor 14 is formed by plating a conductive material such as silver in a spiral shape, and is provided on the upper surface of the second insulating layer 13. Further, a second extraction electrode 24 exposed at the side of the second insulating layer 13 is connected to one end of the second conductor 14. Further, the other end portion 14 a of the second conductor 14, that is, the central portion of the spiral is connected to the first via electrode 23, whereby the first conductor electrode 23 is connected to the first via electrode 23. Since the other end portion 12a of the conductor 12 and the other end portion 14a of the second conductor 14 are electrically connected, the first conductor 12 and the second conductor 14 are connected. A first coil 20 composed of the first conductor 12 and the second conductor 14 is formed.

前記第３の絶縁層１５は、Ｃｕ−Ｚｎフェライト、ガラスセラミック等の非磁性材料によりシート状に構成されているもので、絶縁性を有し、かつ第２の導体１４の上面に設けられている。   The third insulating layer 15 is formed in a sheet shape from a nonmagnetic material such as Cu—Zn ferrite or glass ceramic, has an insulating property, and is provided on the upper surface of the second conductor 14. Yes.

また、前記第３の絶縁層１５の厚みは、第２の絶縁層１３および第４の絶縁層１７の厚みより厚くなっている。   The third insulating layer 15 is thicker than the second insulating layer 13 and the fourth insulating layer 17.

さらに、前記第３の絶縁層１５を介して上下方向に隣り合う第２の導体１４と第３の導体１６は、互いに磁気的な影響を及ぼし合うため、第１のコイル２０と第２のコイル２１との間で磁気結合することになり、これにより、第１のコイル２０、第２のコイル２１のコモンモード成分のインピーダンスを大きくすることができる。   Furthermore, since the second conductor 14 and the third conductor 16 that are adjacent in the vertical direction through the third insulating layer 15 exert a magnetic influence on each other, the first coil 20 and the second coil Thus, the impedance of the common mode component of the first coil 20 and the second coil 21 can be increased.

前記第３の導体１６は、渦巻き状に銀等の導電材料をめっきすることにより形成されるもので、第３の絶縁層１５の上面に設けられている。また、この第３の導体１６の一端部には、第３の絶縁層１５の側部に露出する第３の引出電極２５が接続されている。そしてまた、この第３の導体１６は、その大部分が第２の導体１４と第３の絶縁層１５を介して上面視にて重なるように対向している。   The third conductor 16 is formed by plating a conductive material such as silver in a spiral shape, and is provided on the upper surface of the third insulating layer 15. In addition, a third extraction electrode 25 exposed at the side of the third insulating layer 15 is connected to one end of the third conductor 16. Further, the third conductor 16 is opposed so that most of the third conductor 16 overlaps with the second conductor 14 through the third insulating layer 15 in a top view.

前記第４の絶縁層１７は、Ｃｕ−Ｚｎフェライト、ガラスセラミック等の非磁性材料によりシート状に構成されているもので、絶縁性を有し、かつ第３の導体１６の上面に設けられている。また、この第４の絶縁層１７の中央部には第２のバイア電極２６が形成されている。なお、この第２のバイア電極２６は、第３の導体１６の他端部１６ａ、すなわち渦巻きの中心部と接続されている。   The fourth insulating layer 17 is formed in a sheet shape from a nonmagnetic material such as Cu—Zn ferrite or glass ceramic, has an insulating property, and is provided on the upper surface of the third conductor 16. Yes. A second via electrode 26 is formed at the center of the fourth insulating layer 17. The second via electrode 26 is connected to the other end 16a of the third conductor 16, that is, the center of the spiral.

前記第４の導体１８は、銀等の導電材料をめっきすることにより形成されるもので、第４の絶縁層１７の上面に設けられている。また、この第４の導体１８の一端部には、第４の絶縁層１７の側部に露出する第４の引出電極２７が接続されている。そしてまた、この第４の導体１８の他端部１８ａ、すなわち渦巻きの中心部は第２のバイア電極２６と接続されているもので、これにより、第２のバイア電極２６を介して第３の導体１６の他端部１６ａと第４の導体１８の他端部１８ａとが電気的に接続されるため、第３の導体１６と第４の導体１８は接続されることになり、これにより、第３の導体１６と第４の導体１８とからなる第２のコイル２１が形成される。なお、前記第２の導体１４、第３の導体１６を渦巻き状にすることによって、第１のコイル２０、第２のコイル２１のインピーダンスを大きくすることができる。また、第１のバイア電極２３および第２のバイア電極２６は、それぞれ第２の絶縁層１３を貫通する孔および第４の絶縁層１７を貫通する孔に銀等の導電体を充填することにより構成している。   The fourth conductor 18 is formed by plating a conductive material such as silver, and is provided on the upper surface of the fourth insulating layer 17. In addition, a fourth lead electrode 27 exposed at the side of the fourth insulating layer 17 is connected to one end of the fourth conductor 18. The other end 18a of the fourth conductor 18, that is, the center of the spiral is connected to the second via electrode 26, whereby the third conductor 18 is connected to the third via the second via electrode 26. Since the other end 16a of the conductor 16 and the other end 18a of the fourth conductor 18 are electrically connected, the third conductor 16 and the fourth conductor 18 are connected. A second coil 21 composed of the third conductor 16 and the fourth conductor 18 is formed. The impedance of the first coil 20 and the second coil 21 can be increased by making the second conductor 14 and the third conductor 16 spiral. The first via electrode 23 and the second via electrode 26 are formed by filling a hole penetrating the second insulating layer 13 and a hole penetrating the fourth insulating layer 17 with a conductor such as silver, respectively. It is composed.

前記第５の絶縁層１９は、Ｆｅ2Ｏ3をベースとしたフェライト等の磁性材料によりシート状に構成されているもので、絶縁性を有し、かつ第４の導体１８の上面に設けられている。 The fifth insulating layer 19 is formed in a sheet shape from a magnetic material such as ferrite based on Fe 2 O 3 , has an insulating property, and is provided on the upper surface of the fourth conductor 18. ing.

ここで、前記第２の絶縁層１３、第３の絶縁層１５、第４の絶縁層１７において、非磁性材料としてフェライト系のものを使用すると、第１の絶縁層１１、第５の絶縁層１９とともにフェライト同士となるため、各絶縁層を同時に焼成しても、各絶縁層の接合性が良くなり、安定した製品ができる。   Here, when the second insulating layer 13, the third insulating layer 15, and the fourth insulating layer 17 are made of a ferrite-based material as the nonmagnetic material, the first insulating layer 11 and the fifth insulating layer are used. Since it becomes ferrite together with 19, even if each insulating layer is fired simultaneously, the bondability of each insulating layer is improved and a stable product can be obtained.

なお、前記第１の絶縁層１１の下面と第５の絶縁層１９の上面にはダミー絶縁層２８が設けられているもので、このダミー絶縁層２８は、シート状に構成され、絶縁性を有しているが、その材料は磁性材料、非磁性材料のどちらで構成しても構わない。また、第１〜第５の絶縁層１１、１３、１５、１７、１９、ダミー絶縁層２８の枚数は、図１に示された枚数に限られるものではない。   A dummy insulating layer 28 is provided on the lower surface of the first insulating layer 11 and the upper surface of the fifth insulating layer 19, and this dummy insulating layer 28 is formed in a sheet shape and has an insulating property. However, the material may be either a magnetic material or a non-magnetic material. Further, the number of the first to fifth insulating layers 11, 13, 15, 17, 19, and the dummy insulating layer 28 is not limited to the number shown in FIG.

そして、上記した構成により、ノイズフィルタ本体部２９が形成される。また、このノイズフィルタ本体部２９の両側面には、第１〜第４の外部電極３０、３１、３２、３３が設けられ、そしてこの第１〜第４の外部電極３０、３１、３２、３３はそれぞれ前記第１〜第４の引出電極２２、２４、２５、２７と接続されている。   And the noise filter main-body part 29 is formed by the above-mentioned structure. The first to fourth external electrodes 30, 31, 32, 33 are provided on both side surfaces of the noise filter main body 29, and the first to fourth external electrodes 30, 31, 32, 33 are provided. Are connected to the first to fourth extraction electrodes 22, 24, 25, 27, respectively.

上記したように、上下方向に隣り合い互いに磁気的な影響を及ぼし合う第２の導体１４と第３の導体１６は渦巻き状にしているため、互いに磁気的に影響を及ぼす導体の長さは長くなり、また、第１のコイル２０、第２のコイル２１を構成しかつ磁界が発生する第１〜第４の導体１２、１４、１６、１８は非磁性体に設けているため、磁束の漏れを少なくすることができ、これにより、第１のコイル２０と第２のコイル２１との間の磁気結合は強まり、さらに、磁性を有する第１の絶縁層１１、第５の絶縁層１９の磁界を効果的に活用でき、この結果、第１のコイル２０と第２のコイル２１のコモンモード成分のインピーダンスが大きくなるものである。   As described above, since the second conductor 14 and the third conductor 16 that are adjacent to each other in the vertical direction and have a magnetic influence on each other are spiral, the length of the conductor that has a magnetic influence on each other is long. In addition, since the first to fourth conductors 12, 14, 16, and 18 that constitute the first coil 20 and the second coil 21 and generate a magnetic field are provided in a non-magnetic material, magnetic flux leakage Thus, the magnetic coupling between the first coil 20 and the second coil 21 is strengthened, and the magnetic fields of the first insulating layer 11 and the fifth insulating layer 19 having magnetism are increased. As a result, the impedance of the common mode component of the first coil 20 and the second coil 21 is increased.

なお、前記第１の導体１２、第４の導体１８の形状は、コモンモードノイズ成分のインピーダンスが小さくならなければ、特に限定されるものではないが、図１に示すような形状にすれば、第１の導体１２、第４の導体１８のディファレンシャル成分のインピーダンスが低くなり、その分だけコモンモード成分のインピーダンスを大きくすることができる。   The shapes of the first conductor 12 and the fourth conductor 18 are not particularly limited as long as the impedance of the common mode noise component is not reduced. However, if the shape is as shown in FIG. The impedance of the differential component of the first conductor 12 and the fourth conductor 18 is lowered, and the impedance of the common mode component can be increased accordingly.

また、第１〜第４の引出電極２２、２４、２５、２７も銀等の導電材料をめっきすることにより形成するが、この場合、第１〜第４の引出電極２２、２４、２５、２７は、第１〜第４の導体１２、１４、１６、１８と同時に同じ材料で形成するのが好ましい。なお、第１〜第４の導体１２、１４、１６、１８および第１〜第４の引出電極２２、２４、２５、２７は、めっきで形成するのではなく、その他の印刷や蒸着等の方法で形成してもよい。   The first to fourth extraction electrodes 22, 24, 25, and 27 are also formed by plating a conductive material such as silver. In this case, the first to fourth extraction electrodes 22, 24, 25, and 27 are formed. Is preferably made of the same material at the same time as the first to fourth conductors 12, 14, 16, 18. Note that the first to fourth conductors 12, 14, 16, 18 and the first to fourth extraction electrodes 22, 24, 25, 27 are not formed by plating, but other methods such as printing and vapor deposition. May be formed.

なお、図３に示すように、第３の絶縁層１５において第２の導体１４および第３の導体１６の渦巻きの内側に磁性材料からなる磁性部３４を設けてもよい。このとき、この磁性部３４は渦巻き状の第２の導体１４および第３の導体１６における最も内側にある導体よりも内側に形成され、かつ第２の導体１４および第３の導体１６とは接触しないように設けられている。   As shown in FIG. 3, a magnetic portion 34 made of a magnetic material may be provided inside the spirals of the second conductor 14 and the third conductor 16 in the third insulating layer 15. At this time, the magnetic portion 34 is formed inside the innermost conductor of the spiral second conductor 14 and the third conductor 16 and is in contact with the second conductor 14 and the third conductor 16. It is provided not to.

このようにした場合は、第１のコイル２０と第２のコイル２１との間、すなわち磁気結合する第２の導体１４と第３の導体１６との間に位置する第３の絶縁層１５に磁性材料を設けることができ、これにより、第１のコイル２０と第２のコイル２１の間を交差する磁界を強めることができるため、第１のコイル２０、第２のコイル２１のコモンモード成分のインピーダンスを大きくすることができる。特に、本発明のように、第３の絶縁層１５の厚みを厚くしている場合は、第１のコイル２０と第２のコイル２１の間の距離が長くなっているため、第１のコイル２０と第２のコイル２１の間を交差する磁界が弱く、非常に有効な構成といえる。さらに、同一の絶縁層には、異なる材料からなる磁性部３４とバイア電極２３、２６の両方を設けないようにすれば、容易に磁性部３４あるいはバイア電極２３、２６を形成することができる。   In this case, the third insulating layer 15 located between the first coil 20 and the second coil 21, that is, between the second conductor 14 and the third conductor 16 that are magnetically coupled to each other, Since a magnetic material can be provided and thereby a magnetic field intersecting between the first coil 20 and the second coil 21 can be strengthened, the common mode component of the first coil 20 and the second coil 21 can be increased. The impedance can be increased. In particular, when the thickness of the third insulating layer 15 is increased as in the present invention, the distance between the first coil 20 and the second coil 21 is long. It can be said that the magnetic field which crosses between 20 and the 2nd coil 21 is weak, and can be said to be a very effective structure. Further, if the magnetic part 34 and the via electrodes 23 and 26 made of different materials are not provided in the same insulating layer, the magnetic part 34 or the via electrodes 23 and 26 can be easily formed.

また、図４に示すように、第４の引出電極２７は、第１の引出電極２２が設けられた第１の絶縁層１１の同一面に設けるようにしてもよく、この場合は、第２のバイア電極２６を、第２の絶縁層１３および第３の絶縁層１５に設け、かつ第４の導体１８および第４の引出電極２７を第１の絶縁層１１の上面に設けて、第３の導体１６の他端部１６ａと第４の導体１８とを接続する必要がある。なお、図４においては、第４の引出電極２７は第２の絶縁層１３に隠れているため、図示されていない。また、第１の引出電極２２を、第４の引出電極２７が設けられた第４の絶縁層１７の同一面に設けるようにしてもよい。このようにした場合も、第１の引出電極２２、第４の引出電極２７が同一面内に設けられることになるため、第１の引出電極２２、第４の引出電極２７同士でも磁気結合させることができ、これにより、第１のコイル２０と第２のコイル２１との間の磁気結合が強まるため、コモンモード成分のインピーダンスをさらに大きくすることができる。   Further, as shown in FIG. 4, the fourth extraction electrode 27 may be provided on the same surface of the first insulating layer 11 provided with the first extraction electrode 22, and in this case, the second extraction electrode 22 The via electrode 26 is provided on the second insulating layer 13 and the third insulating layer 15, and the fourth conductor 18 and the fourth lead electrode 27 are provided on the upper surface of the first insulating layer 11. It is necessary to connect the other end portion 16a of the conductor 16 and the fourth conductor 18 to each other. In FIG. 4, the fourth extraction electrode 27 is not shown because it is hidden behind the second insulating layer 13. Further, the first extraction electrode 22 may be provided on the same surface of the fourth insulating layer 17 provided with the fourth extraction electrode 27. Also in this case, since the first extraction electrode 22 and the fourth extraction electrode 27 are provided in the same plane, the first extraction electrode 22 and the fourth extraction electrode 27 are also magnetically coupled to each other. As a result, the magnetic coupling between the first coil 20 and the second coil 21 is strengthened, so that the impedance of the common mode component can be further increased.

さらに、第１〜第４の引出電極２２、２４、２５、２７のそれぞれの幅は、第１〜第４の導体１２、１４、１６、１８のそれぞれの幅より広くしてもよく、このようにした場合は、第１のコイル２０と第２のコイル２１との磁気結合に関係しない第１〜第４の導体１２、１４、１６、１８の磁気的な影響を低減することができるため、磁気結合する部分のほとんどを互いに磁気的な影響を及ぼし合う第２の導体１４と第３の導体１６とにすることができ、これにより、コモンモード成分のインピーダンスをさらに大きくすることができる。   Furthermore, the width of each of the first to fourth lead electrodes 22, 24, 25, 27 may be wider than the width of each of the first to fourth conductors 12, 14, 16, 18 as described above. In this case, since it is possible to reduce the magnetic influence of the first to fourth conductors 12, 14, 16, 18 that are not related to the magnetic coupling between the first coil 20 and the second coil 21, Most of the portions to be magnetically coupled can be the second conductor 14 and the third conductor 16 that have a magnetic influence on each other, whereby the impedance of the common mode component can be further increased.

そしてまた、第１の導体１２および第４の導体１８のそれぞれの幅は、第２の導体１４および第３の導体１６の幅より広くしてもよく、このようにした場合は、第１の導体１２および第４の導体１８で発生するディファレンシャルモード成分のインピーダンスを小さくできるため、その分だけ第１のコイル２０、第２のコイル２１のコモンモード成分のインピーダンスをさらに大きくすることができる。   In addition, the width of each of the first conductor 12 and the fourth conductor 18 may be wider than the width of the second conductor 14 and the third conductor 16, and in this case, Since the impedance of the differential mode component generated in the conductor 12 and the fourth conductor 18 can be reduced, the impedance of the common mode component of the first coil 20 and the second coil 21 can be further increased accordingly.

次に、本発明の一実施の形態におけるコモンモードノイズフィルタの製造方法について説明する。   Next, the manufacturing method of the common mode noise filter in one embodiment of the present invention will be described.

図１、図２において、まず、それぞれの原材料である磁性材料や非磁性材料の粉体および樹脂からなる混合物により、方形の第１〜第５の絶縁層１１、１３、１５、１７、１９、ダミー絶縁層２８をそれぞれ所定枚数作製する。このとき、第２の絶縁層１３、第４の絶縁層１７の所定箇所に、レーザ、パンチング等で孔あけ加工をし、この孔に銀を充填して、第１、第２のバイア電極２３、２６を形成する。また、第３の絶縁層１５の厚みを第２の絶縁層１３、第４の絶縁層１７の厚みより厚くする。   In FIG. 1 and FIG. 2, first, rectangular first to fifth insulating layers 11, 13, 15, 17, 19, A predetermined number of dummy insulating layers 28 are formed. At this time, holes are drilled at predetermined locations of the second insulating layer 13 and the fourth insulating layer 17 by laser, punching or the like, and the holes are filled with silver, so that the first and second via electrodes 23 are filled. , 26 are formed. Further, the thickness of the third insulating layer 15 is made larger than the thickness of the second insulating layer 13 and the fourth insulating layer 17.

次に、所定枚数のダミー絶縁層２８の上面に、第１の絶縁層１１を配置する。   Next, the first insulating layer 11 is disposed on the upper surface of the predetermined number of dummy insulating layers 28.

次に、第１の絶縁層１１の上面に、第１の導体１２および第１の引出電極２２を、めっきによって形成する。   Next, the first conductor 12 and the first extraction electrode 22 are formed on the upper surface of the first insulating layer 11 by plating.

次に、第１の導体１２の上面に、第１のバイア電極２３が設けられた第２の絶縁層１３を配置する。このとき、第１の導体１２の他端部１２ａと第１のバイア電極２３とを接続する。   Next, the second insulating layer 13 provided with the first via electrode 23 is disposed on the upper surface of the first conductor 12. At this time, the other end portion 12a of the first conductor 12 and the first via electrode 23 are connected.

次に、第２の絶縁層１３の上面に、渦巻き状の第２の導体１４および第２の引出電極２４をめっきによって形成する。このとき、第２の導体１４の他端部１４ａと第１のバイア電極２３とを接続する。   Next, the spiral second conductor 14 and the second extraction electrode 24 are formed on the upper surface of the second insulating layer 13 by plating. At this time, the other end portion 14 a of the second conductor 14 and the first via electrode 23 are connected.

次に、第２の導体１４の上面に、第３の絶縁層１５を配置する。   Next, the third insulating layer 15 is disposed on the upper surface of the second conductor 14.

次に、第３の絶縁層１５の上面に、渦巻き状の第３の導体１６および第３の引出電極２５をめっきによって形成する。   Next, the spiral third conductor 16 and the third extraction electrode 25 are formed on the upper surface of the third insulating layer 15 by plating.

次に、第３の導体１６の上面に、第２のバイア電極２６が設けられた第４の絶縁層１７を配置する。このとき、第３の導体１６の他端部１６ａと第２のバイア電極２６とを接続する。   Next, the fourth insulating layer 17 provided with the second via electrode 26 is disposed on the upper surface of the third conductor 16. At this time, the other end 16a of the third conductor 16 and the second via electrode 26 are connected.

次に、第４の絶縁層１７の上面に、第４の導体１８および第４の引出電極２７をめっきによって形成する。このとき、第４の導体１８の他端部１８ａと第２のバイア電極２６とを接続する。   Next, the fourth conductor 18 and the fourth extraction electrode 27 are formed on the upper surface of the fourth insulating layer 17 by plating. At this time, the other end 18a of the fourth conductor 18 and the second via electrode 26 are connected.

なお、第１の導体１２、第２の導体１４、第３の導体１６、第４の導体１８の形成方法は、別途用意したベース板（図示せず）に所定パターン形状の導体をめっきによって形成し、その後、この導体を各絶縁層に転写することにより形成する。   In addition, the formation method of the 1st conductor 12, the 2nd conductor 14, the 3rd conductor 16, and the 4th conductor 18 forms the conductor of a predetermined pattern shape by plating on the base plate (not shown) prepared separately. Then, the conductor is formed by transferring it to each insulating layer.

次に、第４の導体１８の上面に、第５の絶縁層１９を配置し、その後、第５の絶縁層１９の上面に所定枚数のダミー絶縁層２８を配置してノイズフィルタ本体部２９を形成する。   Next, the fifth insulating layer 19 is disposed on the upper surface of the fourth conductor 18, and then a predetermined number of dummy insulating layers 28 are disposed on the upper surface of the fifth insulating layer 19, so that the noise filter main body 29 is disposed. Form.

なお、上記製造工程において、製造上の効率を向上させるために、各絶縁層に第１の導体１２、第２の導体１４、第３の導体１６、第４の導体１８をそれぞれ複数設けた後、各個片に切断するようにして、同時に複数のノイズフィルタ本体部２９を得るようにしてもよい。   In the above manufacturing process, after providing a plurality of first conductors 12, second conductors 14, third conductors 16, and fourth conductors 18 in each insulating layer in order to improve manufacturing efficiency. Alternatively, a plurality of noise filter main bodies 29 may be obtained at the same time by cutting into individual pieces.

次に、ノイズフィルタ本体部２９を所定の温度、時間で焼成する。   Next, the noise filter main body 29 is fired at a predetermined temperature and time.

次に、ノイズフィルタ本体部２９の両側面に、第１〜第４の引出電極２２、２４、２５、２７とそれぞれ接続されるように銀を印刷することにより、第１〜第４の外部電極３０、３１、３２、３３を形成する。   Next, the first to fourth external electrodes are printed on both side surfaces of the noise filter main body 29 by printing silver so as to be connected to the first to fourth extraction electrodes 22, 24, 25, 27, respectively. 30, 31, 32, and 33 are formed.

最後に、第１〜第４の外部電極３０、３１、３２、３３の表面にめっきによってニッケルめっき層を形成するとともに、さらにこのニッケルめっき層の表面にめっきによってすずやはんだ等の低融点金属めっき層を形成する。   Finally, a nickel plating layer is formed on the surfaces of the first to fourth external electrodes 30, 31, 32, and 33 by plating, and a low melting point metal plating layer such as tin or solder is further formed on the surface of the nickel plating layer by plating. Form.

上記した本発明の一実施の形態においては、第１の絶縁層１１の上面に設けられた第１の導体１２と、前記第１の導体１２の上面に設けられた第２の絶縁層１３と、前記第２の絶縁層１３の上面に設けられかつ前記第１の導体１２に接続されてこの第１の導体１２とにより第１のコイル２０を構成する渦巻き状の第２の導体１４と、前記第２の導体１４の上面に設けられた第３の絶縁層１５と、前記第３の絶縁層１５の上面に設けられた渦巻き状の第３の導体１６と、前記第３の導体１６の上面に設けられた第４の絶縁層１７と、前記第４の絶縁層１７の上面に設けられかつ前記第３の導体１６に接続されてこの第３の導体１６とにより第２のコイル２１を構成する第４の導体１８と、前記第４の導体１８の上面に設けられた第５の絶縁層１９と、前記第１〜第４の導体１２、１４、１６、１８の各々の一端部にそれぞれ接続された第１〜第４の引出電極２２、２４、２５、２７とを備え、前記第１の絶縁層１１および第５の絶縁層１９を磁性体で構成し、かつ前記第２〜第４の絶縁層１３、１５、１７を非磁性体で構成するとともに、前記第３の絶縁層１５の厚みを前記第２の絶縁層１３および第４の絶縁層１７の厚みより厚くしているため、第３の絶縁層１５の厚みを厚くすることができ、これにより、この第３の絶縁層１５を介して設けられた第２の導体１４と第３の導体１６との間、すなわち第１のコイル２０と第２のコイル２１との間で絶縁不良やマイグレーション等が発生するのを防止することができ、さらには、第２の絶縁層１３および第４の絶縁層１７の厚みを薄くでき、これにより、第１の絶縁層１１と第２の導体１４との距離および第５の絶縁層１９と第３の導体１６との距離をそれぞれ短くできるため、磁性体で構成された第１の絶縁層１１および第５の絶縁層１９で発生する磁界を有効に活用でき、この結果、第１のコイル２０、第２のコイル２１のコモンモード成分のインピーダンスを大きくすることができるものである。   In the above-described embodiment of the present invention, the first conductor 12 provided on the upper surface of the first insulating layer 11, the second insulating layer 13 provided on the upper surface of the first conductor 12, A spiral second conductor 14 provided on the upper surface of the second insulating layer 13 and connected to the first conductor 12 to form the first coil 20 with the first conductor 12; A third insulating layer 15 provided on the upper surface of the second conductor 14, a spiral third conductor 16 provided on the upper surface of the third insulating layer 15, and the third conductor 16 The second coil 21 is formed by the fourth insulating layer 17 provided on the upper surface and the third conductor 16 provided on the upper surface of the fourth insulating layer 17 and connected to the third conductor 16. A fourth conductor 18 to be configured, and a fifth insulating layer 1 provided on the upper surface of the fourth conductor 18 And first to fourth extraction electrodes 22, 24, 25, 27 respectively connected to one end portions of the first to fourth conductors 12, 14, 16, 18, The insulating layer 11 and the fifth insulating layer 19 are made of a magnetic material, and the second to fourth insulating layers 13, 15, and 17 are made of a non-magnetic material, and the thickness of the third insulating layer 15 is made. Is made thicker than the thickness of the second insulating layer 13 and the fourth insulating layer 17, the thickness of the third insulating layer 15 can be increased. It is possible to prevent insulation failure, migration, and the like from occurring between the second conductor 14 and the third conductor 16 provided via the first conductor 20, that is, between the first coil 20 and the second coil 21. Furthermore, the thickness of the second insulating layer 13 and the fourth insulating layer 17 can be reduced. Thus, the distance between the first insulating layer 11 and the second conductor 14 and the distance between the fifth insulating layer 19 and the third conductor 16 can be shortened, respectively. The magnetic fields generated in the insulating layer 11 and the fifth insulating layer 19 can be effectively used, and as a result, the impedance of the common mode component of the first coil 20 and the second coil 21 can be increased. .

ここで、図５は、本発明の一実施の形態におけるコモンモードノイズフィルタにおいて、第２の絶縁層１３および第４の絶縁層１７の厚みと、第１のコイル２０、第２のコイル２１の結合係数との関係を示す図である。   Here, FIG. 5 shows the thicknesses of the second insulating layer 13 and the fourth insulating layer 17 and the first coil 20 and the second coil 21 in the common mode noise filter according to the embodiment of the present invention. It is a figure which shows the relationship with a coupling coefficient.

このとき、試料として、第３の絶縁層１５の厚みを２４μｍとした図１に示す構造を備えたコモンモードノイズフィルタを作製した。そして、その結合係数が０．９４以下のものを不良とした。なお、この結合係数が大きいほど、第１のコイル２０、第２のコイル２１のコモンモード成分のインピーダンスを大きくすることができる。   At this time, a common mode noise filter having the structure shown in FIG. 1 in which the thickness of the third insulating layer 15 was 24 μm was produced as a sample. Those having a coupling coefficient of 0.94 or less were regarded as defective. In addition, the impedance of the common mode component of the 1st coil 20 and the 2nd coil 21 can be enlarged, so that this coupling coefficient is large.

図５から明らかなように、第２の絶縁層１３および第４の絶縁層１７の厚みは２０μｍ以下にする必要があることがわかる。２０μｍより厚いと磁性を有する第１の絶縁層１１、第５の絶縁層１９の磁界を効果的に活用できないからである。   As can be seen from FIG. 5, the thicknesses of the second insulating layer 13 and the fourth insulating layer 17 need to be 20 μm or less. This is because if the thickness is greater than 20 μm, the magnetic fields of the first insulating layer 11 and the fifth insulating layer 19 having magnetism cannot be effectively used.

また、第２の絶縁層１３および第４の絶縁層１７の厚みの下限値は、要求される特性に応じて適宜決めればよいが、取り扱い易さを考慮して例えば５μｍ以上とするのが好ましい。このとき、第２の絶縁層１３は、２０μｍより薄くても、第２の絶縁層１３の上下に設けられた第１の導体１２と第２の導体１４が同電位であるため、絶縁不良等の問題はあまり発生しない。第４の絶縁層１７についても同様である。   Further, the lower limit value of the thickness of the second insulating layer 13 and the fourth insulating layer 17 may be appropriately determined according to the required characteristics, but is preferably set to 5 μm or more in consideration of ease of handling. . At this time, even if the second insulating layer 13 is thinner than 20 μm, the first conductor 12 and the second conductor 14 provided above and below the second insulating layer 13 have the same potential, so that the insulation failure, etc. The problem does not occur much. The same applies to the fourth insulating layer 17.

図６は、本発明の一実施の形態において、第３の絶縁層１５の厚みと絶縁不良発生率との関係を示す図である。   FIG. 6 is a diagram showing the relationship between the thickness of the third insulating layer 15 and the insulation failure occurrence rate in the embodiment of the present invention.

このとき、試料として、第２の絶縁層１３および第４の絶縁層１７の厚みを１７μｍとした図１に示す構造を備えたコモンモードノイズフィルタを作製した。そして、周囲の温度１２５℃、湿度８５％、圧力２ａｔｍの条件下で連続して５Ｖ印加し、絶縁抵抗が１０7Ω以下のものを不良とした。 At this time, a common mode noise filter having the structure shown in FIG. 1 in which the thickness of the second insulating layer 13 and the fourth insulating layer 17 was 17 μm was prepared as a sample. Then, 5 V was continuously applied under conditions of an ambient temperature of 125 ° C., a humidity of 85%, and a pressure of 2 atm, and those having an insulation resistance of 10 7 Ω or less were regarded as defective.

なお、図６で、Ａは第３の絶縁層１５の厚みが１７μｍ、Ｂは２０μｍ、Ｃは２４μｍのものを示している。   In FIG. 6, A indicates that the thickness of the third insulating layer 15 is 17 μm, B indicates 20 μm, and C indicates 24 μm.

図６から明らかなように、Ａは３６時間経過後に絶縁不良が発生したが、Ｂ、Ｃは６０時間経過しても絶縁不良は発生しなかった。すなわち、第３の絶縁層１５の厚みは２０μｍ以上にする必要があることがわかる。また、２０μｍより薄いと第２の導体１４と第３の導体１６との間で絶縁不良が発生するだけでなく、マイグレーション等が発生する可能性も大きくなる。   As apparent from FIG. 6, insulation failure occurred in A after 36 hours, but insulation failure did not occur in B and C even after 60 hours. That is, it can be seen that the thickness of the third insulating layer 15 needs to be 20 μm or more. On the other hand, if the thickness is less than 20 μm, not only insulation failure occurs between the second conductor 14 and the third conductor 16, but also the possibility of occurrence of migration or the like increases.

また、第３の絶縁層１５の厚みの上限値は、要求される特性に応じて適宜求めればよいが、第１のコイル２０と第２のコイル２１の磁気結合や、製品全体の厚み等を考慮して例えば５０μｍ以下とするのが好ましい。   Further, the upper limit value of the thickness of the third insulating layer 15 may be determined as appropriate according to the required characteristics. However, the magnetic coupling between the first coil 20 and the second coil 21, the thickness of the entire product, etc. Considering, for example, 50 μm or less is preferable.

なお、上記本発明の一実施の形態におけるコモンモードノイズフィルタにおいては、第１のコイル２０、第２のコイル２１をそれぞれ１つ設けたが、第１のコイル２０、第２のコイル２１をそれぞれ複数設けたアレイタイプとしてもよい。   In the common mode noise filter according to the embodiment of the present invention, one first coil 20 and one second coil 21 are provided. However, each of the first coil 20 and the second coil 21 is provided. A plurality of array types may be used.

本発明に係るコモンモードノイズフィルタは、第１のコイルと第２のコイルとの間で絶縁不良やマイグレーション等が発生するのを防止することができ、さらには第１のコイル、第２のコイルのコモンモード成分のインピーダンスも大きくすることができ、携帯電話、情報機器等のノイズ対策として使用されるノイズフィルタ等として有用である。   The common mode noise filter according to the present invention can prevent the occurrence of insulation failure, migration, or the like between the first coil and the second coil, and further includes the first coil and the second coil. The impedance of the common mode component can be increased, and it is useful as a noise filter used as a noise countermeasure for mobile phones, information devices and the like.

本発明の一実施の形態におけるコモンモードノイズフィルタの分解斜視図The disassembled perspective view of the common mode noise filter in one embodiment of this invention 同コモンモードノイズフィルタの斜視図Perspective view of the common mode noise filter 同コモンモードノイズフィルタの他の例を示す分解斜視図An exploded perspective view showing another example of the common mode noise filter 同コモンモードノイズフィルタのさらに他の例を示す分解斜視図An exploded perspective view showing still another example of the common mode noise filter 同コモンモードノイズフィルタにおいて、第２の絶縁層および第４の絶縁層の厚みと、第１のコイル、第２のコイルの結合係数との関係を示す図The figure which shows the relationship between the thickness of a 2nd insulating layer and a 4th insulating layer, and the coupling coefficient of a 1st coil and a 2nd coil in the common mode noise filter 同コモンモードノイズフィルタにおいて、第３の絶縁層の厚みと絶縁不良発生率との関係を示す図The figure which shows the relationship between the thickness of a 3rd insulating layer, and the insulation failure incidence in the common mode noise filter 従来のコモンモードノイズフィルタの分解斜視図Exploded perspective view of a conventional common mode noise filter

符号の説明Explanation of symbols

１１ 第１の絶縁層
１２ 第１の導体
１３ 第２の絶縁層
１４ 第２の導体
１５ 第３の絶縁層
１６ 第３の導体
１７ 第４の絶縁層
１８ 第４の導体
１９ 第５の絶縁層
２０ 第１のコイル
２１ 第２のコイル
２２ 第１の引出電極
２４ 第２の引出電極
２５ 第３の引出電極
２７ 第４の引出電極
３４ 磁性部 DESCRIPTION OF SYMBOLS 11 1st insulating layer 12 1st conductor 13 2nd insulating layer 14 2nd conductor 15 3rd insulating layer 16 3rd conductor 17 4th insulating layer 18 4th conductor 19 5th insulating layer 20 1st coil 21 2nd coil 22 1st extraction electrode 24 2nd extraction electrode 25 3rd extraction electrode 27 4th extraction electrode 34 Magnetic part

Claims (5)

第１の絶縁層の上面に設けられた第１の導体と、前記第１の導体の上面に設けられた第２の絶縁層と、前記第２の絶縁層に設けられた第１のバイア電極と、前記第２の絶縁層の上面に設けられかつ前記第１の導体に前記第１のバイア電極を介して接続されてこの第１の導体とにより第１のコイルを構成する渦巻き状の第２の導体と、前記第２の導体の上面に設けられた第３の絶縁層と、前記第３の絶縁層の上面に設けられた渦巻き状の第３の導体と、前記第３の導体の上面に設けられた第４の絶縁層と、前記第４の絶縁層に設けられた第２のバイア電極と、前記第４の絶縁層の上面に設けられかつ前記第３の導体に前記第２のバイア電極を介して接続されてこの第３の導体とにより第２のコイルを構成する第４の導体と、前記第４の導体の上面に設けられた第５の絶縁層と、前記第１〜第４の導体の各々の一端部にそれぞれ接続された第１〜第４の引出電極とを備え、前記第１の絶縁層および第５の絶縁層を磁性体で構成し、かつ前記第２〜第４の絶縁層を非磁性体で構成するとともに、前記第３の絶縁層の厚みを前記第２の絶縁層および第４の絶縁層の厚みより厚くしたコモンモードノイズフィルタ。 A first conductor provided on the upper surface of the first insulating layer, a second insulating layer provided on the upper surface of the first conductor, and a first via electrode provided on the second insulating layer A spiral-shaped second coil provided on the upper surface of the second insulating layer and connected to the first conductor via the first via electrode and forming a first coil with the first conductor. Two conductors, a third insulating layer provided on the upper surface of the second conductor, a spiral third conductor provided on the upper surface of the third insulating layer, and the third conductor A fourth insulating layer provided on an upper surface; a second via electrode provided on the fourth insulating layer; and a second conductor electrode provided on an upper surface of the fourth insulating layer and on the third conductor. It is connected through the vias electrode and the fourth conductor constituting the second coil by the third conductor, on the fourth conductor A first insulating layer and a fifth insulating layer, and first to fourth lead electrodes connected to one end of each of the first to fourth conductors, respectively. And the second to fourth insulating layers are made of a nonmagnetic material, and the thickness of the third insulating layer is set to the second insulating layer and the fourth insulating layer. Common mode noise filter thicker than 第３の絶縁層において第２の導体および第３の導体の渦巻きの内側に磁性材料からなる磁性部を設けた請求項１記載のコモンモードノイズフィルタ。 The common mode noise filter according to claim 1, wherein a magnetic part made of a magnetic material is provided inside the spiral of the second conductor and the third conductor in the third insulating layer. 第１の引出電極および第４の引出電極を、第１の絶縁層または第４の絶縁層の同一面に設けるようにした請求項１記載のコモンモードノイズフィルタ。 The common mode noise filter according to claim 1, wherein the first extraction electrode and the fourth extraction electrode are provided on the same surface of the first insulating layer or the fourth insulating layer. 第１〜第４の引出電極のそれぞれの幅を、第１〜第４の導体のそれぞれの幅より広くした請求項１記載のコモンモードノイズフィルタ。 The common mode noise filter according to claim 1, wherein each of the first to fourth extraction electrodes has a width wider than each of the first to fourth conductors. 第１の導体および第４の導体のそれぞれの幅を、第２の導体および第３の導体のそれぞれの幅より広くした請求項１記載のコモンモードノイズフィルタ。 The common mode noise filter according to claim 1, wherein the width of each of the first conductor and the fourth conductor is wider than the width of each of the second conductor and the third conductor.
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