JP4609286B2 - Method and apparatus for chamfering circular holes - Google Patents

Method and apparatus for chamfering circular holes Download PDF

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JP4609286B2
JP4609286B2 JP2005335568A JP2005335568A JP4609286B2 JP 4609286 B2 JP4609286 B2 JP 4609286B2 JP 2005335568 A JP2005335568 A JP 2005335568A JP 2005335568 A JP2005335568 A JP 2005335568A JP 4609286 B2 JP4609286 B2 JP 4609286B2
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circular hole
grindstone
workpiece
grinding wheel
chamfering
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JP2007136630A (en
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健司 上川
良博 大西
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Hitachi Zosen Corp
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Description

この発明は、ワークに形成された円形の孔の周縁部を面取りするための方法および装置に関する。   The present invention relates to a method and an apparatus for chamfering a peripheral portion of a circular hole formed in a workpiece.

ワークの周縁部や孔の周縁部を面取りする方法および装置として、面取り用傾斜形状を有する総形砥石により研磨を行うものが知られている(特許文献1参照)。
特開平6−55426号公報
As a method and apparatus for chamfering the peripheral part of a workpiece or the peripheral part of a hole, one that performs polishing with a general-purpose grindstone having a chamfered inclined shape is known (see Patent Document 1).
JP-A-6-55426

上記特許文献1の面取り方法および装置によると、ワークに当たる研磨面の範囲が狭く、ワークに当たっている部分だけが早期に摩耗して、研磨面側に研磨痕として溝が形成され、頻繁にドレッシングが必要となるという問題や寿命が短いという問題があった。特に、ガラス、石英、水晶等の脆性材料に形成された円形孔の周縁部の面取りを行うために、砥石として弾性砥石のように軟らかいものを使用する場合に、この問題は大きいものとなる。   According to the chamfering method and apparatus of Patent Document 1, the range of the polishing surface that hits the workpiece is narrow, only the portion that hits the workpiece wears early, grooves are formed as polishing marks on the polishing surface side, and frequent dressing is required There was a problem of becoming and a problem of short life. In particular, this problem becomes significant when a soft stone such as an elastic grindstone is used as a grindstone to chamfer the peripheral edge of a circular hole formed in a brittle material such as glass, quartz, or quartz.

この発明は、頻繁にドレッシングが必要となるという問題や寿命が短いという問題が解消された円形孔の面取り方法および装置を提供することを目的とする。   An object of the present invention is to provide a method and an apparatus for chamfering a circular hole in which the problem that frequent dressing is required and the problem that the life is short are solved.

の発明による円形孔の面取り方法は、ワークに形成されている円形孔の直径より大きい直径の球面からなる研磨面を有する真球形状の砥石を使用し、円形孔の中心軸とは一致していない砥石軸回りに砥石を回転させながら、研磨面が円形孔の周縁部全周に接触している状態で、ワークと砥石軸とを相対的に回転させることにより、前記接触部が研磨面上を常に移動するようにし、球面の研磨面の円形孔直径相当部分の中心帯全周を使用して、円形孔の周縁部の面取りを行うことを特徴とするものである。 Chamfering method of circular holes according to this invention uses a true spherical grindstone having a spherical surface or Ranaru polished surface of the larger diameter than the diameter of the circular hole formed in the workpiece, the central axis of the circular hole While rotating the grindstone around the wheel shafts that do not match, with the polishing surface in contact with the entire circumference of the peripheral edge of the circular hole, the workpiece and the grindstone shaft are relatively rotated, so that the contact portion becomes The peripheral surface of the circular hole is chamfered by using the entire circumference of the central band of the portion corresponding to the diameter of the circular hole of the spherical polished surface so as to always move on the polished surface .

の発明による円形孔の面取り装置は、上記(請求項1)の円形孔の面取り方法を行う装置であって、ワークに形成されている円形孔の直径より大きい直径の球面からなる研磨面を有する真球形状の砥石と、砥石を円形孔の中心軸とは一致していない砥石軸回りに回転させる砥石回転手段と、研磨面が円形孔の周縁部全周に接触している状態で接触部が研磨面上を常に移動するようにワークと砥石軸とを相対的に回転させる相対回転手段とを備えていることを特徴とするものである。 Chamfering device of the circular hole by the inventors of this, said a device for performing the chamfering method of circular holes, spherical surface or Ranaru polishing of larger diameter than the diameter of the circular hole formed in the workpiece (claim 1) A state of a spherical wheel having a surface, a grindstone rotating means for rotating the grindstone about a grindstone axis that does not coincide with the center axis of the circular hole, and a state where the polishing surface is in contact with the entire circumference of the peripheral edge of the circular hole And a relative rotation means for relatively rotating the workpiece and the grindstone shaft so that the contact portion always moves on the polishing surface.

この発明の円形孔の面取り方法および装置において、ワークとしては、ガラス、石英、水晶等の脆性材料が特に適しているが、あらゆる素材のワークに適用することができる。また、砥石としては、種々の砥石が使用可能であるが、軟らかい弾性砥石を使用する場合、得られる効果が大きいものとなる。 In the method and apparatus for chamfering a circular hole of the present invention, brittle materials such as glass, quartz, and quartz are particularly suitable as the workpiece, but the workpiece can be applied to workpieces of any material. Various grindstones can be used as the grindstone, but when a soft elastic grindstone is used, the effect obtained is great.

この発明の円形孔の面取り方法および装置において、ワークと砥石軸とを相対的に回転させるに際しては、ワークを円形孔の中心軸回りに回転させてもよく、砥石を支持する台をワークの円形孔の中心軸回りに回転させてもよい。第1の発明の円形孔の面取り方法および装置においては、孔の中心軸回りの回転に加えてまたはこれに代えて、砥石軸または円形孔の中心軸を所定の点を中心として回転(揺動)させるようにしてもよい。 In the method and apparatus for chamfering a circular hole of the present invention, when the workpiece and the grindstone shaft are relatively rotated, the workpiece may be rotated about the central axis of the circular hole, and the platform that supports the grindstone is a circular shape of the workpiece. You may rotate around the central axis of the hole. In the method and apparatus for chamfering a circular hole of the first invention, in addition to or instead of rotation around the central axis of the hole, the grindstone shaft or the central axis of the circular hole is rotated (oscillated) about a predetermined point. ).

の発明の円形孔の面取り方法および装置において、砥石の回転軸は、例えば、孔の中心軸に対して直交するものとされるが、これに限定されるものではなく、孔の中心軸と交差はするが一致していなければよく、孔の中心軸に対して所定角度(0°より大きく90°以下)傾斜していればよい。この角度は、90°に近い方が研磨面を広く使えるので、長寿命化の点で望ましい。 In chamfering method and apparatus of the circular hole of this invention, the rotation axis of the grinding wheel, for example, but is intended to perpendicular to the central axis of the hole, it is not limited thereto, and the central axis of the hole It is sufficient that the intersections do not coincide with each other, and they should be inclined at a predetermined angle (greater than 0 ° and not more than 90 °) with respect to the central axis of the hole. The angle close to 90 ° is desirable in terms of extending the life because the polished surface can be used widely.

の発明の円形孔の面取り方法および装置によると、研磨面を広く使って面取りを行うことができるので、砥石寿命を長くすることができる。また、周縁部に均等の負荷で接触し、その接触部分は砥石軸での回転により次々と変わることから、砥石が摩耗しても砥石の接触面全体の形状を崩すことなく使用することができ、弾性砥石のような比較的軟らかい砥石を使用することができる。さらにまた、砥石を円形孔内に入れて面取りを行う必要はないので、砥石の大きさ(直径)を孔径より大きくでき、砥石寿命をより一層長くすることができる。しかも、砥石が摩耗する場合でも、加工部(孔周縁部)に倣った形状で摩耗していくので、砥石形状を修正(ドレッシング)することなく連続して使用することができる。特に、面取り角度に許容範囲がある場合には、その範囲内で砥石の径が変わっても使用可能であり、極めて長期間の連続使用が可能となる。 According to chamfering method and apparatus of the circular hole of this invention, it is possible to perform chamfering with wide polished surface, it is possible to lengthen the grinding wheel life. In addition, it contacts the peripheral edge with an equal load, and the contact part changes one after another by the rotation of the grindstone shaft, so even if the grindstone is worn, it can be used without breaking the shape of the entire contact surface of the grindstone. A relatively soft grindstone such as an elastic grindstone can be used. Furthermore, since it is not necessary to chamfer the grindstone by putting it in the circular hole, the size (diameter) of the grindstone can be made larger than the hole diameter, and the life of the grindstone can be further extended. In addition, even when the grindstone is worn, it wears in a shape that follows the processed portion (hole peripheral portion), so that it can be used continuously without correcting (dressing) the grindstone shape. In particular, when there is an allowable range for the chamfer angle, the chamfer angle can be used even if the diameter of the grindstone changes within the range, and it can be used continuously for a very long time.

この発明の実施の形態を、以下図面を参照して説明する。   Embodiments of the present invention will be described below with reference to the drawings.

図1および図2は、の発明による円形孔の面取り方法および装置を模式的に示している。 1 and 2 show schematically a chamfering method and apparatus of the circular hole by the inventors of this.

の発明による円形孔の面取り装置は、ワーク(2)に形成された円形孔(3)の周縁部(3a)を面取りするためのものであり、球面の研磨面(1a)を有する真球形状(真球体)の砥石(1)と、砥石(1)を円形孔(3)の中心軸(ここではワーク(2)面の鉛直方向とする)と直交する砥石軸(5)回りに回転させる砥石回転手段(回転方向矢印で示す)(4)と、ワーク(2)と砥石(1)とを相対的に回転させる相対回転手段(図示略)とを備えている。 Chamfering device of the circular hole by the inventors of this is for chamfering the workpiece periphery of formed (2) the circular hole (3) (3a), a sphere having a polished surface of the spherical surface (1a) The shape (true sphere) of the grindstone (1) and the grindstone (1) rotate around the grindstone axis (5) perpendicular to the central axis of the circular hole (3) (here, the vertical direction of the workpiece (2) surface) Grindstone rotating means (indicated by an arrow in the direction of rotation) (4) for rotating, and relative rotating means (not shown) for relatively rotating the workpiece (2) and the grindstone (1).

砥石(1)の研磨面(1a)の直径は、面取りの対象となる円形孔(3)の直径より大きいものとされており、砥石(1)は、円形孔(3)の周縁部全周と接触している状態を維持したまま、砥石軸(5)回りに回転させられる。相対回転手段は、例えば、円形孔(3)の中心軸を中心にワーク(2)または砥石の支持台(図示略)を回転させるものとされる。これにより、球面の研磨面(1a)の円形孔直径相当部分(研磨使用領域)の中心帯全周を使用して面取りが行われる。   The diameter of the grinding surface (1a) of the grindstone (1) is larger than the diameter of the circular hole (3) to be chamfered, and the grindstone (1) is all around the peripheral edge of the circular hole (3). The wheel is rotated around the grindstone axis (5) while maintaining a state in contact with the wheel. The relative rotation means rotates the work (2) or a grindstone support (not shown) around the central axis of the circular hole (3), for example. As a result, chamfering is performed using the entire circumference of the central zone of the portion corresponding to the diameter of the circular hole (polishing use region) of the spherical polished surface (1a).

の発明の円形孔の面取り方法および装置によると、砥石(1)の回転により研磨面上の前記接触部が常に移動するので、研磨面(1a)を広く面取りに使えることから、砥石(1)の寿命を長くすることができる。また、砥石(1)の研磨面(1a)の円形孔直径相当部分(研磨使用領域)の中心帯全周が面取り対象である孔(3)の周縁部(3a)に当たることから、砥石(1)が摩耗しても砥石(1)の研磨使用領域全体の形状を崩すことなく使用することができ、弾性砥石のような比較的軟らかい砥石(1)を使用することができる。さらにまた、砥石(1)の直径が孔径より大きいので、砥石寿命をより一層長くすることができる。しかも、砥石(1)が摩耗する場合でも、孔(3)の周縁部(3a)に倣った形を維持して摩耗していくので、砥石形状を修正することなく連続して使用することができる。特に、面取り角度に許容範囲がある場合には、砥石の径が変化しても許容範囲内に収めることが容易であり、極めて長期間の連続使用が可能となる。 According to chamfering method and apparatus of the circular hole of inventions of this, since the contact portion of the polishing surface by the rotation of the grinding wheel (1) is always moved, since that can be used for wide chamfer polishing surface (1a), the grindstone ( 1) Life can be extended. Further, since the entire circumference of the central zone of the circular hole diameter equivalent portion (polishing use region) of the grinding surface (1a) of the grinding stone (1) hits the peripheral portion (3a) of the hole (3) to be chamfered, the grinding stone (1 ) Can be used without breaking the shape of the entire grinding area of the grindstone (1), and a relatively soft grindstone (1) such as an elastic grindstone can be used. Furthermore, since the diameter of the grindstone (1) is larger than the hole diameter, the life of the grindstone can be further increased. Moreover, even when the grindstone (1) is worn, it keeps wearing the shape following the peripheral edge (3a) of the hole (3), so it can be used continuously without correcting the grindstone shape. it can. In particular, when there is an allowable range for the chamfer angle, it is easy to keep within the allowable range even if the diameter of the grindstone changes, and continuous use for an extremely long time is possible.

図1および図2においては、砥石軸(5)と円形孔(3)の中心軸とが直交するようになされているが、砥石軸(5)は、円形孔(3)の中心軸と一致していない方向であれば、円形孔(3)の中心軸と交差する任意の方向(0°より大きく90°以下)に設けることができる。   1 and 2, the grindstone axis (5) and the central axis of the circular hole (3) are orthogonal to each other, but the grindstone axis (5) is aligned with the central axis of the circular hole (3). As long as it is not in the direction, it can be provided in any direction (greater than 0 ° and 90 ° or less) intersecting the central axis of the circular hole (3).

図3から図5までは、砥石軸(5)と砥石(1)の当たり面(研磨使用領域)との関係を示すもので、図3に示すように、砥石軸(5)が孔(3)の中心軸と直交している場合には、研磨使用領域は、球体を砥石軸(5)に直交しかつ大円(球の中心を通りかつ砥石軸と直交する平面と球面との交線である円)からそれぞれ孔(3)の半径分の位置(現実的には少し長めの位置)にある2つの平行面(11)(12)によって切り落とした形状(樽型部分真球体)(1b)となる。また、図4に示すように、砥石軸(5)が孔(3)の中心軸と直交していない場合には、研磨使用領域は、球体を砥石軸(5)に直交しかつ大円に対して非対称の位置である、それぞれ円形孔(3)周縁と異なる1点で接触する位置(現実的には砥石の球体中心より遠ざかる方向に離れた位置)にある2つの平行面(13)(14)によって切り落とした形状(傘型部分真球体)(1c)となる。図4の傘型部分真球体は、球の大円部分を含んでいるが、砥石軸(5)と孔(3)の中心軸とがなす角が小さくなると、図5に示すように、研磨使用領域は、球体を砥石軸(5)に直交しかつ大円に対して前述と同様の非対称の位置にある2つの平行面(15)(16)によって切り落とした形状(傘型部分真球体)(1d)でかつ球の大円部分を含まないものとなる。なお、図4および図5の傘型部分真球体(1c)(1d)の研磨使用領域において、研磨使用領域の幅w(平行面(13)(14)間距離、平行面(15)(16)間距離)は、砥石軸が孔の中心軸となす角をα、円形孔の直径をdとして、w≧dsinαとなる。図3から図5までのいずれの場合でも、砥石(1)は、円形孔(3)に嵌まっている状態を維持したまま、すなわち、孔(3)の周縁部(3a)の全周にわたって研磨面(1a)を接触させた状態で、砥石軸(5)回りに回転させられる。   FIGS. 3 to 5 show the relationship between the grindstone shaft (5) and the contact surface (polishing use area) of the grindstone (1). As shown in FIG. 3, the grindstone shaft (5) has a hole (3 ) Is perpendicular to the center axis of the grinding wheel, the sphere is the intersection of the spherical surface and the spherical surface perpendicular to the grinding wheel axis (5) and a great circle (through the center of the sphere and perpendicular to the grinding wheel axis). (Circle-shaped partial sphere) cut by two parallel surfaces (11) and (12) at the position corresponding to the radius of the hole (3) (actually a slightly longer position) from each circle) ). In addition, as shown in FIG. 4, when the grindstone axis (5) is not perpendicular to the central axis of the hole (3), the polishing use area is perpendicular to the grindstone axis (5) and into a great circle. Two parallel surfaces (13) (13) (a) which are asymmetrical positions and are in contact with each other at one point different from the periphery of the circular hole (3) (practically away from the center of the grindstone sphere). The shape cut out by 14) (umbrella type partial sphere) (1c) is obtained. The umbrella-shaped partial spherical body of FIG. 4 includes a great circle portion of a sphere. However, when the angle formed by the grindstone shaft (5) and the central axis of the hole (3) becomes small, as shown in FIG. The area of use is a shape in which the sphere is cut off by two parallel surfaces (15) and (16) that are orthogonal to the grindstone axis (5) and at the same asymmetrical position as described above (umbrella type partial sphere) (1d) and does not include the great circle part of the sphere. 4 and 5, the width w (the distance between the parallel surfaces (13) and (14), the parallel surfaces (15) and (16), and the parallel surfaces (15) and (16) ))) Is w ≧ dsin α, where α is the angle between the grindstone axis and the center axis of the hole, and d is the diameter of the circular hole. In any of the cases from FIG. 3 to FIG. 5, the grindstone (1) remains in the state of being fitted in the circular hole (3), that is, over the entire circumference of the peripheral edge (3a) of the hole (3). The grindstone shaft (5) is rotated around the grinding surface (1a) in contact.

図6は、の発明による円形孔の面取り方法および装置で使用される相対回転手段の実施形態の例を模式的に示している。 6, an example of an embodiment of a relative rotation means used in chamfering method and apparatus of the circular hole by the inventor of this is shown schematically.

図6(a)において、相対回転手段は、ワーク(2)をその孔(3)の中心軸(7)回りに回転させるワーク回転手段(回転方向矢印で示す)(6)からなるものとされている。この場合、砥石軸(5)は、軸を中心に回転自在に固定とされてもよい。   In FIG. 6A, the relative rotation means is composed of work rotation means (indicated by a rotation direction arrow) (6) for rotating the work (2) about the central axis (7) of the hole (3). ing. In this case, the grindstone shaft (5) may be fixed so as to be rotatable about the shaft.

図6(b)において、相対回転手段は、砥石(1)を支持する台(図示略)を二点鎖線で示す範囲内で孔(3)の中心軸(7)回りに回転させる砥石支持台回転手段(回転方向矢印で示す)(8)からなるものとされている。この場合、ワーク(2)は、固定とされてもよい。   In FIG. 6 (b), the relative rotating means rotates the table (not shown) for supporting the grindstone (1) around the central axis (7) of the hole (3) within the range indicated by the two-dot chain line. Rotating means (indicated by an arrow in the direction of rotation) (8) is included. In this case, the workpiece (2) may be fixed.

上記の発明による面取り方法および装置において、面取り角度θは、円形孔の直径dと砥石の直径Dとによって決定されるもので、D=d/sinθの関係を有している。例えば、面取り角度が45°の場合、D=1.41dとなり、面取り角度が60°の場合、D=1.15dとなり、面取り角度が30°の場合、D=2dとなる。面取り角度の許容範囲が45°±15°であるとすると、D=2dの砥石で研磨するに際して、D=1.15dとなるまで面取りを継続して行うことができることになIn chamfering the method and apparatus according to the invention described above this, the bevel angle theta, those determined by the diameter D of the diameter d and the grindstone circular holes have a relation of D = d / sin [theta. For example, when the chamfering angle is 45 °, D = 1.41d, when the chamfering angle is 60 °, D = 1.15d, and when the chamfering angle is 30 °, D = 2d. When the allowable range of the chamfer angle is assumed to be 45 ° ± 15 °, when polishing with the grinding wheel of D = 2d, ing that can be continued chamfered until D = 1.15d.

図1は、の発明による円形孔の面取り方法および装置の実施形態を示す斜視図である。Figure 1 is a perspective view showing an embodiment of a chamfering method and apparatus of the circular hole by the inventors of this. 図2は、同3面図であり、(a)は側面図、(b)は平面図、(c)は正面図である。FIG. 2 is a three-side view, where (a) is a side view, (b) is a plan view, and (c) is a front view. 図3は、の発明による円形孔の面取り方法および装置における砥石の当たり面(研磨使用領域)を示す図であり、(a)は側面図、(b)は平面図である。Figure 3 is a diagram illustrating contact surfaces of the grinding wheel in the chamfering method and apparatus of the circular hole by the inventors of this the (polishing use area), (a) is a side view, (b) is a plan view. 図4は、の発明による円形孔の面取り方法および装置において、砥石軸が第1の実施形態と異なる場合の砥石の当たり面の1例を示す図であり、(a)は側面図、(b)は平面図である。Figure 4 is the chamfering method and apparatus of the circular hole by the inventors of this is illustrative of one example of surface per grinding wheel when the grinding wheel axis is different from the first embodiment, (a) is a side view, ( b) is a plan view. 図5は、の発明による円形孔の面取り方法および装置において、砥石軸が第1の実施形態と異なる場合の砥石の当たり面の他の例を示す図であり、(a)は側面図、(b)は平面図である。Figure 5 is the chamfering method and apparatus of the circular hole by the inventors of this is a view showing another example of the contact surface of the grinding wheel when the grinding wheel axis is different from the first embodiment, (a) is a side view, (B) is a plan view. 図6は、この発明による円形孔の面取り方法および装置における砥石とワークとの相対回転の異なる実施形態を示す斜視図である。FIG. 6 is a perspective view showing different embodiments of the relative rotation of the grindstone and the workpiece in the chamfering method and apparatus for circular holes according to the present invention.

(1) 砥石
(1a)(1b)(1c)(1d) 研磨面
(2) ワーク
(3) 円形孔
(3a) 周縁部
(4) 砥石回転手段
(5) 砥石軸
(6) ワーク回転手段
(7) 円形孔の中心軸
(8) 砥石支持台回転手
(1) Whetstone
(1a) (1b) (1c) (1 d) Polished surface
(2) Workpiece
(3) Circular hole
(3a) Perimeter
(4) Wheel rotation means
(5) Wheel axis
(6) Work rotation means
(7) Center axis of circular hole
(8) grinding supporting table rotating camera stage

Claims (2)

ワークに形成されている円形孔の直径より大きい直径の球面からなる研磨面を有する真球形状の砥石を使用し、円形孔の中心軸とは一致していない砥石軸回りに砥石を回転させながら、研磨面が円形孔の周縁部全周に接触している状態で、ワークと砥石軸とを相対的に回転させることにより、前記接触部が研磨面上を常に移動するようにし、球面の研磨面の円形孔直径相当部分の中心帯全周を使用して、円形孔の周縁部の面取りを行うことを特徴とする円形孔の面取り方法。 Using a true spherical grindstone having a spherical surface or Ranaru polished surface of the larger diameter than the diameter of the circular hole formed in the workpiece, rotating the grinding wheel to the grinding wheel axis which does not coincide with the center axis of the circular hole while, in a state in which the polishing surface is in contact with the peripheral edge entire periphery of the circular hole, by relatively rotating the workpiece and the grinding wheel axis, said contact portion so as to always move on the polishing surface, a spherical A chamfering method for a circular hole, wherein the peripheral edge of the circular hole is chamfered using the entire circumference of the central zone of the portion corresponding to the diameter of the circular hole on the polished surface . 請求項1の円形孔の面取り方法を行う装置であって、ワークに形成されている円形孔の直径より大きい直径の球面からなる研磨面を有する真球形状の砥石と、砥石を円形孔の中心軸とは一致していない砥石軸回りに回転させる砥石回転手段と、研磨面が円形孔の周縁部全周に接触している状態で接触部が研磨面上を常に移動するようにワークと砥石軸とを相対的に回転させる相対回転手段とを備えていることを特徴とする円形孔の面取り装置。 An apparatus for performing the chamfering method of the circular hole of claim 1, and the true spherical grindstone having a spherical surface or Ranaru polished surface of the larger diameter than the diameter of the circular hole formed in the workpiece, the grinding wheel circular hole Grinding wheel rotating means for rotating around the grinding wheel axis that does not coincide with the central axis of the workpiece, and the workpiece so that the contact portion always moves on the polishing surface while the polishing surface is in contact with the entire circumference of the peripheral edge of the circular hole. A chamfering device for a circular hole, comprising: a relative rotation means for relatively rotating the grindstone shaft.
JP2005335568A 2005-11-21 2005-11-21 Method and apparatus for chamfering circular holes Expired - Fee Related JP4609286B2 (en)

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