JP4592076B2 - Backlight device - Google Patents

Backlight device Download PDF

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JP4592076B2
JP4592076B2 JP2004349219A JP2004349219A JP4592076B2 JP 4592076 B2 JP4592076 B2 JP 4592076B2 JP 2004349219 A JP2004349219 A JP 2004349219A JP 2004349219 A JP2004349219 A JP 2004349219A JP 4592076 B2 JP4592076 B2 JP 4592076B2
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guide plate
flexible circuit
light guide
circuit board
led
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JP2006164521A (en
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達郎 山田
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Citizen Electronics Co Ltd
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Description

本発明はバックライト装置に係わり特にLEDを光源に用い導光板の側面に光源を配置したサイドライト型のバックライト装置に関する。   The present invention relates to a backlight device, and more particularly to a sidelight type backlight device in which an LED is used as a light source and a light source is disposed on a side surface of a light guide plate.

近年、液晶セルを用いた表示装置は、時計、電話機、パソコン等のあらゆる電子機器に搭載されている。このような電子機器にあって、特に時計や携帯電話等は夜間や暗所においても使用されるため、液晶セルを照明するバックライトを備えたものが多い。このバックライトには、大別して光拡散板などの下に光源を配置した直下型と、導光板の側面に光源を配置したサイドライト型とがある。サイドライト型バックライトは、液晶表示パネルとほぼ同じ大きさに形成された合成樹脂からなる平板状の導光板を備え、その一つの側面が受光面とされ、その受光面に対向して光源が配置される。このように、サイドライト型バックライトは、導光板の側方に光源を配置する構成であるため、直下型バックライトに比べて薄型化が可能であり、また、液晶表示パネルに対する光源の発熱の影響を少なくし得る点で有利であるとされているが、光源で発した光を導光板内に有効に取り込むためには、導光板に対して光源の位置を適正に保持することが重要であり、これに対応したバックライト付き液晶表示装置が開示されている(例えば、特許文献1参照。)。   In recent years, display devices using liquid crystal cells are mounted on various electronic devices such as watches, telephones, and personal computers. In such an electronic device, in particular, a watch, a mobile phone, and the like are often used at night or in a dark place, and therefore, are often provided with a backlight for illuminating a liquid crystal cell. The backlight is roughly classified into a direct type in which a light source is arranged under a light diffusion plate or the like, and a side light type in which a light source is arranged on a side surface of a light guide plate. A sidelight-type backlight includes a flat light guide plate made of synthetic resin and having a size approximately the same as that of a liquid crystal display panel, one side of which is a light receiving surface, and a light source facing the light receiving surface. Be placed. As described above, the sidelight type backlight has a configuration in which the light source is disposed on the side of the light guide plate. Therefore, the sidelight type backlight can be made thinner than the direct type backlight, and the light source generates heat to the liquid crystal display panel. Although it is considered advantageous in that it can reduce the influence, it is important to keep the position of the light source properly with respect to the light guide plate in order to effectively incorporate the light emitted from the light source into the light guide plate. There is a backlight-equipped liquid crystal display device corresponding to this (see, for example, Patent Document 1).

以下、図14、図15を用いて第1の従来技術におけるバックライト付き液晶表示装置の具体的例について説明する。図14はバックライト付き液晶表示装置の平面図、図15は図14におけるX−X断面図である。図14、図15に示すように、従来のバックライト付き液晶表示装置100は、液晶セル110と、その下面側に備えたバックライト部120と、液晶セル110及びバックライト部120を保持する枠体130などから構成される。液晶セル110は、透明電極膜が形成された2枚の上下のガラス基板111、112の間に液晶物質を封入し、上下のガラス基板111、112の外側にそれぞれ偏光板115、116を貼り付けた構成を取っていて、枠体130によって保持されている。また、この液晶セル110の上ガラス基板111にはフレキシブル基板140が実装されている。そして、フレキシブル基板140には液晶セル110を制御駆動するところのIC140aや抵抗,コンデンサー類の電子部品140bなどが実装されている。このフレキシブル基板140は図中右側で枝分かれした分岐のフレキシブル基板141が形成されていて、その端部側は枠体130の内部の方に組み込まれている。   A specific example of a liquid crystal display device with a backlight according to the first prior art will be described below with reference to FIGS. 14 is a plan view of a liquid crystal display device with a backlight, and FIG. 15 is a sectional view taken along line XX in FIG. As shown in FIGS. 14 and 15, a conventional liquid crystal display device 100 with a backlight includes a liquid crystal cell 110, a backlight unit 120 provided on the lower surface thereof, and a frame for holding the liquid crystal cell 110 and the backlight unit 120. It consists of a body 130 and the like. In the liquid crystal cell 110, a liquid crystal material is sealed between two upper and lower glass substrates 111 and 112 on which a transparent electrode film is formed, and polarizing plates 115 and 116 are attached to the outer sides of the upper and lower glass substrates 111 and 112, respectively. And is held by the frame 130. A flexible substrate 140 is mounted on the upper glass substrate 111 of the liquid crystal cell 110. The flexible substrate 140 is mounted with an IC 140a for controlling and driving the liquid crystal cell 110, an electronic component 140b such as a resistor and a capacitor, and the like. The flexible substrate 140 is formed with a branched flexible substrate 141 branched on the right side in the drawing, and an end portion thereof is incorporated toward the inside of the frame body 130.

また、上記バックライト部120は、光源であるLED121と、このLED121の発光した光を液晶セル110の下面側に導く導光板122と、導光板122の下面などから漏れた光を再び導光板122側に反射させる反射板123などから構成されていて、いずれも枠体130の内部に収納されて配設されている。導光板122は、透明なアクリル材などで形成され、その一側面122aからLED121の光を採り入れて内部に導くと共に、反射板123の作用などを利用して上面122b側から光を放射する働きをなす。この時、放射した光の明るさを均一にするために導光板122と液晶セル110の間に光拡散板124を配設することも行っている。このように、この液晶表示装置100は液晶セル110の下面側にバックライト部120を備えて、枠体130でしっかりと保持した構造を取っている。   The backlight unit 120 includes an LED 121 as a light source, a light guide plate 122 that guides light emitted from the LED 121 to the lower surface side of the liquid crystal cell 110, and light that has leaked from the lower surface of the light guide plate 122. The reflecting plate 123 and the like are reflected to the side, and are all housed and disposed inside the frame body 130. The light guide plate 122 is formed of a transparent acrylic material or the like. The light guide plate 122 takes in the light of the LED 121 from one side surface 122a thereof and guides it to the inside, and emits light from the upper surface 122b side using the action of the reflection plate 123 or the like. Eggplant. At this time, a light diffusing plate 124 is also disposed between the light guide plate 122 and the liquid crystal cell 110 in order to make the brightness of the emitted light uniform. As described above, the liquid crystal display device 100 has a structure in which the backlight unit 120 is provided on the lower surface side of the liquid crystal cell 110 and is firmly held by the frame body 130.

LED121は、フレキシブル基板140から枝分かれした分岐のフレキシブル基板141の先端部の方に導電性接着剤や半田付けなどの公知の方法で装着されていて、枠体130の内部にあって、導光板122の受光壁面122aにLED121の発光面121aが対面するような形で配設される。LED121を装着した分岐のフレキシブル基板141は、枠体130内において、枠体130に形成された2箇所のピン(図示せず)と分岐のフレキシブル基板141に形成した2箇所の穴(図示せず)とが嵌合して位置決め固定されている。このような構造を取る液晶表示装置100にあっては、LED121を装着した分岐のフレキシブル基板141は、枠体の底面側に配置されており、分岐のフレキシブル基板141の上面側にLED121が配置されている。   The LED 121 is mounted by a known method such as conductive adhesive or soldering on the front end portion of the branched flexible substrate 141 branched from the flexible substrate 140, and is located inside the frame body 130, and the light guide plate 122. The light receiving surface 122a of the LED 121 is disposed so as to face the light receiving wall surface 122a. The branch flexible board 141 to which the LED 121 is mounted has two pins (not shown) formed in the frame body 130 and two holes (not shown) formed in the branch flexible board 141 in the frame body 130. ) And are positioned and fixed. In the liquid crystal display device 100 having such a structure, the branched flexible substrate 141 on which the LEDs 121 are mounted is disposed on the bottom surface side of the frame body, and the LEDs 121 are disposed on the upper surface side of the branched flexible substrate 141. ing.

また、第2の従来技術として、図16、図17に示すようなバックライト装置の例もある。このバックライト装置は、分岐のフレキシブル基板241を導光板122の端部上面122bと枠体230の上面230bとを跨ぐように配置され、分岐のフレキシブル基板241の下面側に配置されるLED121が導光板122の端部側面122aと枠体230の内壁230aとの間に配置されている。分岐のフレキシブル基板241は枠体230の上面に両面接着テープ150で接着固定されている。   As a second prior art, there is an example of a backlight device as shown in FIGS. In this backlight device, the branched flexible substrate 241 is arranged so as to straddle the end upper surface 122b of the light guide plate 122 and the upper surface 230b of the frame 230, and the LED 121 disposed on the lower surface side of the branched flexible substrate 241 is guided. It is disposed between the end side surface 122 a of the optical plate 122 and the inner wall 230 a of the frame body 230. The branch flexible substrate 241 is bonded and fixed to the upper surface of the frame 230 with a double-sided adhesive tape 150.

特開2003−156739号公報(第2−3頁、図9−12)Japanese Patent Laying-Open No. 2003-156739 (page 2-3, FIG. 9-12)

しかしながら、前述の第1の従来例のバックライト装置においては、分岐のフレキシブル基板141の固定方法がピンと穴との少しガタ量を設けた嵌合固定方法を取っているために位置ズレなどが発生し、分岐のフレキシブル基板141に実装したLED121と導光板122との間隔bの値にバラツキが生じ、バックライトの輝度のバラツキが大きくなるという問題があった。また、LED121と導光板122との間隔bの値が大きくなりバックライトの輝度が低下してしまうという問題があった。
また、第2の従来例のバックライト装置においては導光板122の端部側面122aと枠体230の内壁230aとの間にLED121がガタ量を設けて配置されるため位置ズレなどが発生し、LED121と導光板122との間隔bの値の管理が難しい。このため輝度のバラツキ、輝度の低下が発生するという問題があった。また、導光板122とLED121との間隔bの値を調整して適正な間隔に管理しようとすると手間がかかり製造工数が大きくなり、コストアップになるという問題があった。
However, in the backlight device of the first conventional example described above, since the fixing method of the branch flexible substrate 141 is a fitting and fixing method in which a slight backlash between the pin and the hole is provided, misalignment or the like occurs. However, there is a problem in that the value of the distance b between the LED 121 mounted on the branch flexible substrate 141 and the light guide plate 122 varies, and the luminance of the backlight increases. In addition, there is a problem in that the value of the distance b between the LED 121 and the light guide plate 122 increases and the luminance of the backlight decreases.
Further, in the backlight device of the second conventional example, since the LED 121 is provided with a backlash between the end side surface 122a of the light guide plate 122 and the inner wall 230a of the frame body 230, misalignment occurs. It is difficult to manage the value of the distance b between the LED 121 and the light guide plate 122. For this reason, there has been a problem that luminance variation and luminance decrease occur. In addition, adjusting the distance b between the light guide plate 122 and the LED 121 to manage it at an appropriate distance is time consuming, increases the number of manufacturing steps, and increases the cost.

(発明の目的)
本発明の目的は、上記従来技術における課題を解決して、導光板とLEDとの間隔を極力小さくし安定した輝度を得ると共に輝度を上昇させ、LEDの光を効率よく導光板内に導き輝度特性に優れたバックライト装置を提供することにある。
(Object of invention)
The object of the present invention is to solve the above-mentioned problems in the prior art, to obtain a stable brightness by reducing the distance between the light guide plate and the LED as much as possible, and to increase the brightness, thereby efficiently guiding the LED light into the light guide plate. An object of the present invention is to provide a backlight device having excellent characteristics.

上記目的を達成するための本発明のバックライト装置は、箱形の形状をなし上方が開口されている枠体と、該枠体に保持される導光板と、該導光板の受光部となる側面に近接または密接して対向する如く配置される光源と、該光源を実装したフレキシブル回路基板とを備えたバックライト装置において、前記フレキシブル回路基板が光源に対して前記導光板と反対側の端部近傍に弾性を有する突当部を有し、前記枠体が前記突当部に対応する位置に凹部を有し、該枠体の凹部の内壁に前記フレキシブル回路基板の突当部を当接し、前記突当部の弾性を利用して前記フレキシブル回路基板を前記枠体に保持してなり、前記突当部がフレキシブル回路基板の前記導光板と反対側の方向に突出する突出部からなり、該突出部は、該突出部先端に沿って設ける長孔状の窓部と、該窓部と前記突出部先端との間に形成される帯状部とを有し、該帯状部における前記突出部先端側の端面または前記枠体における凹部の内壁のうち、いずれか一方に突起部を有することを特徴とする。 In order to achieve the above object, a backlight device according to the present invention is a frame having a box shape and an upper opening, a light guide plate held by the frame, and a light receiving portion of the light guide plate. In a backlight device including a light source disposed so as to face a side surface in close proximity or closely and a flexible circuit board on which the light source is mounted, an end of the flexible circuit board opposite to the light guide plate with respect to the light source There is a resilient abutting portion in the vicinity of the portion, the frame body has a recess at a position corresponding to the abutting portion, and the abutting portion of the flexible circuit board is brought into contact with the inner wall of the recess of the frame body , Ri Na by utilizing the elasticity of the abutment portion holding the flexible circuit board to the frame member, the abutting portion consists protrusion protruding in a direction opposite to the light guide plate of the flexible circuit board , The protrusion is along the tip of the protrusion A long hole-like window portion to be provided, and a belt-like portion formed between the window portion and the tip of the protrusion, and an end surface of the belt-like portion on the tip side of the protrusion or an inner wall of a recess in the frame body Of these, one has a protrusion .

また、導光板と光源との厚さが略等しいことを特徴とする。   In addition, the light guide plate and the light source are approximately equal in thickness.

以上のように本発明のバックライト装置は、枠体の内壁に設ける凹部にフレキシブル回路基板の突当部を組み込むことによって、その弾性を利用して導光板とLEDとの間隔を極力小さくした状態でフレキシブル回路基板を枠体に保持することができ、輝度を安定化させると共に輝度を上昇させることができる。この結果、LEDの光を効率よく導光板内に導き輝度特性に優れたバックライト装置を提供することができる。
また、枠体の凹部へのフレキシブル回路基板の組み込みは、作業が簡単で導光板に対してLEDを確実に位置決め出来る上、その固定のために両面接着テープ等を使用する必要もないためコストダウンが可能である。
また、LEDの厚さと導光板の厚さとを略等しく設定することにより、LEDの光を導光板内に効率よく受光しバックライト装置全体を薄型化することができる。
As described above, the backlight device of the present invention is a state in which the gap between the light guide plate and the LED is made as small as possible by incorporating the abutment portion of the flexible circuit board into the recess provided in the inner wall of the frame body. Thus, the flexible circuit board can be held on the frame, and the luminance can be stabilized and the luminance can be increased. As a result, it is possible to provide a backlight device that efficiently guides LED light into the light guide plate and has excellent luminance characteristics.
Incorporating a flexible circuit board into the recess of the frame is easy to work and can position the LED reliably with respect to the light guide plate, and it is not necessary to use double-sided adhesive tape to fix it. Is possible.
Further, by setting the thickness of the LED and the thickness of the light guide plate substantially equal, the light of the LED can be efficiently received in the light guide plate, and the entire backlight device can be made thin.

以下、本発明の実施形態について図1から図13を参照して説明する。図1、図2は本発明の実施例1におけるバックライト装置を示す図である。図3、図7は本発明の実施例2におけるバックライト装置を示す図であり、図4、図5は本発明の実施例2におけるバックライト装置の他の例を示す図である。図6は本発明の実施例3におけるバックライト装置を示す図である。また、図8から図11は本発明の実施例4におけるバックライト装置を示す図であり、図12、図13は、本発明の実施例4におけるバックライト装置の他の例を示す図である。本実施形態におけるバックライト装置は光源を搭載した分岐のフレキシブル回路基板の固定方法に特徴があり、その他の基本的な構成は前述の従来技術と類似している。したがって、従来例と同様な構成要素については同一番号を付与し説明を省略する。   Hereinafter, embodiments of the present invention will be described with reference to FIGS. 1 and 2 are diagrams showing a backlight device according to Embodiment 1 of the present invention. 3 and 7 are diagrams showing a backlight device according to Embodiment 2 of the present invention, and FIGS. 4 and 5 are diagrams showing another example of the backlight device according to Embodiment 2 of the present invention. FIG. 6 is a diagram showing a backlight device according to Embodiment 3 of the present invention. 8 to 11 are diagrams showing a backlight device according to Embodiment 4 of the present invention, and FIGS. 12 and 13 are diagrams illustrating other examples of the backlight device according to Embodiment 4 of the present invention. . The backlight device according to the present embodiment is characterized by a method of fixing a branched flexible circuit board on which a light source is mounted, and the other basic configuration is similar to the above-described conventional technology. Therefore, the same components as those in the conventional example are given the same reference numerals and description thereof is omitted.

図1は、実施例1におけるバックライト装置の主要部を示し、図1(a)は枠体にフレキシブル回路基板を組み込んだ状態を示す平面図、図1(b)は、図1(a)におけるX−X断面図、図2(a)は、図1(a)におけるY−Y断面図、図2(b)は図2(a)におけるフレキシブル回路基板を示す斜視図である。以下、図を用いて実施例1におけるバックライト装置について説明する。   FIG. 1 shows the main part of the backlight device in Example 1, FIG. 1 (a) is a plan view showing a state in which a flexible circuit board is incorporated in a frame, and FIG. 1 (b) shows FIG. FIG. 2A is a sectional view taken along the line Y-Y in FIG. 1A, and FIG. 2B is a perspective view showing the flexible circuit board in FIG. 2A. Hereinafter, the backlight device according to the first embodiment will be described with reference to the drawings.

図1、図2に示すように実施例1におけるバックライト装置は、箱形の形状をなし上方が開口されている枠体10と、該枠体10に保持される導光板122と、該導光板122の受光部となる側面122aに近接または密接して対向する如く配置される光源としてのLED121と、該LED121を実装したフレキシブル回路基板11とを備えている。このLED121の厚さcの値は導光板122の厚さaの値と略等しく設定することが好ましい。これによってLED121の光を導光板122内に効率よく受光しバックライト装置全体の薄型化が可能となる。枠体10は導光板122の側面122aに対向する側壁14を有し、この側壁14の内側に沿って段部16が形成されている。この段部16の上面16bは、枠体10に組込まれている導光板122の上面122bと同じ高さに形成されている。さらに段部16の上面16bから上方に延びる枠体の側壁14の内壁には凹部15が形成されており、この凹部15は内壁15a、15b、15cを有し、内壁15cが段部16の上面16bとほぼ同一平面となるように形成されている。   As shown in FIGS. 1 and 2, the backlight device according to the first embodiment includes a frame 10 having a box shape and an upper opening, a light guide plate 122 held by the frame 10, and the light guide plate. It includes an LED 121 as a light source disposed so as to be close to or in close proximity to a side surface 122a that serves as a light receiving portion of the optical plate 122, and a flexible circuit board 11 on which the LED 121 is mounted. The value of the thickness c of the LED 121 is preferably set substantially equal to the value of the thickness a of the light guide plate 122. As a result, the light of the LED 121 can be efficiently received in the light guide plate 122 and the entire backlight device can be made thinner. The frame 10 has a side wall 14 that faces the side surface 122 a of the light guide plate 122, and a step portion 16 is formed along the inside of the side wall 14. The upper surface 16 b of the step portion 16 is formed at the same height as the upper surface 122 b of the light guide plate 122 incorporated in the frame body 10. Further, a recess 15 is formed in the inner wall of the side wall 14 of the frame body that extends upward from the upper surface 16 b of the step portion 16, and this recess 15 has inner walls 15 a, 15 b, 15 c, and the inner wall 15 c is the upper surface of the step portion 16. It is formed so as to be substantially flush with 16b.

一方、フレキシブル回路基板1は図2(b)に示すように、組み込まれた状態においてLED121に対して導光板122と反対側となる端部から突出する幅Kの突出部1aが形成されている。このフレキシブル回路基板1を枠体10に組み込む時は、図1(b)、図2(b)に示すように、突当部である突出部1aの先端部2を凹部15の隅部15dに当接させ、矢印Aの方向に押圧することにより、突出部1aを湾曲させる。以下、フレキシブル回路基板1の組み込み方法について説明する。   On the other hand, as shown in FIG. 2B, the flexible circuit board 1 is formed with a protruding portion 1a having a width K that protrudes from an end portion opposite to the light guide plate 122 with respect to the LED 121 in the assembled state. . When the flexible circuit board 1 is incorporated into the frame body 10, as shown in FIGS. 1 (b) and 2 (b), the tip 2 of the projecting portion 1 a that is the abutting portion is connected to the corner 15 d of the recess 15. By contacting and pressing in the direction of arrow A, the protrusion 1a is curved. Hereinafter, a method for incorporating the flexible circuit board 1 will be described.

フレキシブル回路基板1は前述の枠体10に導光板122を配置し、その後に組み込まれる。フレキシブル回路基板1は実装されているLED121を下面側にして導光板122と枠体の段部16とを跨ぐようにして導光板の上面122bと枠体の段部の上面16bとに配置される。この時、LED121が導光板122の側壁122aと枠体の段部16の側面16aとの間に配置される。また、フレキシブル回路基板1の導光板122と反対側の突出部1aが枠体10における側壁14の凹部15に組み込まれ、突当部である突出部1aの先端部2を凹部15の隅部15dに当接させ、矢印Aの方向に押圧することにより、突出部1aを湾曲させる。この湾曲した突出部1aの弾性を利用してフレキシブル回路基板1が枠体10に保持される。この側壁14における凹部15の長さLの値は、図2(a)に示すように、フレキシブル回路基板1の突出部1aの幅Kの値より僅かに大きく設定されており、凹部15の両端の位置は、導光板に122に対してLED121が所定の位置に位置決めされるように設定されている。   The flexible circuit board 1 is assembled after the light guide plate 122 is disposed on the frame 10 described above. The flexible circuit board 1 is disposed on the upper surface 122b of the light guide plate and the upper surface 16b of the step portion of the frame body so that the LED 121 mounted on the lower surface side is straddling the light guide plate 122 and the step portion 16 of the frame body. . At this time, the LED 121 is disposed between the side wall 122a of the light guide plate 122 and the side surface 16a of the step 16 of the frame. Further, the protruding portion 1a on the opposite side of the light guide plate 122 of the flexible circuit board 1 is incorporated in the concave portion 15 of the side wall 14 of the frame body 10, and the tip portion 2 of the protruding portion 1a that is the abutting portion is connected to the corner portion 15d of the concave portion 15. The protrusion 1a is curved by being brought into contact with and pressed in the direction of the arrow A. The flexible circuit board 1 is held by the frame body 10 by using the elasticity of the curved protruding portion 1a. The length L of the recess 15 in the side wall 14 is set slightly larger than the value of the width K of the protrusion 1a of the flexible circuit board 1 as shown in FIG. Is set so that the LED 121 is positioned at a predetermined position with respect to the light guide plate 122.

また、この時、フレキシブル回路基板1は、湾曲した突出部1aの反発力(弾性)によって導光板122の方向に押圧される力を受けLED121が導光板の側面122aに接近し導光板の側面122aとLED121との間隔bの値を小さくすることができる。尚、LED121は導光板の側面122aに接触しても良い。また、フレキシブル回路基板1は、湾曲した突出部1aの反発力(弾性)によって導光板の上面122b、側壁の段部上面16bの方向にも押圧される。この結果、フレキシブル回路基板1が枠体10に確実に保持される。   At this time, the flexible circuit board 1 receives a force pressed in the direction of the light guide plate 122 by the repulsive force (elasticity) of the curved protruding portion 1a, so that the LED 121 approaches the side surface 122a of the light guide plate and the side surface 122a of the light guide plate. And the distance b between the LED 121 and the LED 121 can be reduced. The LED 121 may contact the side surface 122a of the light guide plate. The flexible circuit board 1 is also pressed in the direction of the upper surface 122b of the light guide plate and the stepped upper surface 16b of the side wall by the repulsive force (elasticity) of the curved protruding portion 1a. As a result, the flexible circuit board 1 is securely held by the frame body 10.

以上のように本実施におけるバックライト装置は、枠体10の側壁14の内壁に設ける凹部15にフレキシブル回路基板1の突出部1aを湾曲させて組み込むことによって、その弾性を利用して導光板122とLED121との間隔bの値を小さくすることができる。この結果、導光板122に対してLED121を簡単で確実に位置決め出来る上、その固定のために両面接着テープ等を必要とせず、枠体10にフレキシブル回路基板1を保持することが出来、コストダウンが可能である。また、輝度を安定化させると共に輝度を上昇させることができる。また、LED121の厚さcの値を導光板122の厚さaの値と略等しく設定することにより、LED121の光を導光板122内に効率よく受光しバックライト装置全体の薄型化することができる。   As described above, the backlight device according to the present embodiment incorporates the protruding portion 1a of the flexible circuit board 1 by bending it into the concave portion 15 provided on the inner wall of the side wall 14 of the frame body 10, thereby utilizing the elasticity of the light guide plate 122. And the distance b between the LED 121 and the LED 121 can be reduced. As a result, the LED 121 can be easily and reliably positioned with respect to the light guide plate 122, and the flexible circuit board 1 can be held on the frame body 10 without requiring a double-sided adhesive tape for fixing the LED 121, thereby reducing the cost. Is possible. In addition, the luminance can be stabilized and the luminance can be increased. Further, by setting the value of the thickness c of the LED 121 to be substantially equal to the value of the thickness a of the light guide plate 122, the light of the LED 121 can be efficiently received in the light guide plate 122 and the entire backlight device can be thinned. it can.

図3は実施例2におけるバックライト装置の主要部を示し枠体にフレキシブル回路基板を組み込んだ状態を示す断面図である。図4、図5はフレキシブル回路基板の折曲部の形状が異なる他の例を示す断面図、図6は、本実施例におけるバックライト装置の他の例を示す断面図である。また、図7は本実施例におけるフレキシブル回路基板を示す斜視図である。本実施例におけるバックライト装置は光源を搭載した分岐のフレキシブル回路基板の突当部の形状が異なる例であり、その他の基本的な構成は前述の実施例1と類似している。したがって実施例1と同様な構成要素については同一番号を付与し説明を省略する。以下、図を用いて実施例2のバックライト装置について説明する。   FIG. 3 is a cross-sectional view illustrating a main part of the backlight device according to the second embodiment and a state in which the flexible circuit board is incorporated in the frame. 4 and 5 are cross-sectional views showing other examples in which the shape of the bent portion of the flexible circuit board is different, and FIG. 6 is a cross-sectional view showing another example of the backlight device in this embodiment. FIG. 7 is a perspective view showing the flexible circuit board in this embodiment. The backlight device in the present embodiment is an example in which the shape of the abutting portion of the branched flexible circuit board on which the light source is mounted is different, and the other basic configuration is similar to that of the first embodiment. Therefore, the same components as those in the first embodiment are given the same numbers, and the description thereof is omitted. Hereinafter, the backlight device of Example 2 will be described with reference to the drawings.

前述したように実施例2におけるバックライト装置の基本構造は実施例1と同様であるため説明を省略する。フレキシブル回路基板11は図7(a)に示すように、組み込まれた状態においてLED121に対して導光板122と反対側となる端部から突出する幅Kの突出部11aが形成されている。このフレキシブル回路基板11を枠体10に組み込む時は、図7(b)に示すように、突出部11aを上方に向かって円弧状に折り曲げ突当部である折曲部12を形成する。以下、フレキシブル回路基板11の組み込み方法について説明する。   As described above, the basic structure of the backlight device according to the second embodiment is the same as that of the first embodiment, and thus the description thereof is omitted. As shown in FIG. 7A, the flexible circuit board 11 is formed with a protruding portion 11 a having a width K that protrudes from the end opposite to the light guide plate 122 with respect to the LED 121 in the assembled state. When the flexible circuit board 11 is incorporated into the frame body 10, as shown in FIG. 7B, the protruding portion 11a is bent upward in an arc shape to form a bent portion 12 that is an abutting portion. Hereinafter, a method for incorporating the flexible circuit board 11 will be described.

図3に示すように、フレキシブル回路基板11は前述の枠体10に導光板122を配置し、その後に組み込まれる。フレキシブル回路基板11は実装されているLED121を下面側にして導光板122と枠体の段部16とを跨ぐようにして導光板の上面122bと枠体の段部の上面16bとに配置される。この時、LED121が導光板122の側壁122aと枠体の段部16の側面16aとの間に配置される。また、フレキシブル回路基板11の導光板122と反対側の端部を折り曲げて形成する突当部である折曲部12が枠体10における側壁14の凹部15に組み込まれ、凹部内壁15a、15b、15cに当接され、折曲部12の弾性を利用してフレキシブル回路基板11が枠体10に保持される。図3に示すように、側壁14における凹部15の長さの値は、実施例1と同様にフレキシブル回路基板の折曲部12の幅Kの値より僅かに大きく設定されており、凹部15の両端の位置は、導光板に122に対してLED121が所定の位置に位置決めされるように設定されている。   As shown in FIG. 3, the flexible circuit board 11 arrange | positions the light-guide plate 122 in the above-mentioned frame 10, and is integrated after that. The flexible circuit board 11 is disposed on the upper surface 122b of the light guide plate and the upper surface 16b of the step portion of the frame body so that the LED 121 mounted on the lower surface side is straddling the light guide plate 122 and the step portion 16 of the frame body. . At this time, the LED 121 is disposed between the side wall 122a of the light guide plate 122 and the side surface 16a of the step 16 of the frame. Further, a bent portion 12 which is a contact portion formed by bending an end portion of the flexible circuit board 11 opposite to the light guide plate 122 is incorporated in the concave portion 15 of the side wall 14 in the frame body 10, and the concave inner walls 15a, 15b, The flexible circuit board 11 is held by the frame body 10 by using the elasticity of the bent portion 12. As shown in FIG. 3, the length value of the concave portion 15 in the side wall 14 is set to be slightly larger than the value of the width K of the bent portion 12 of the flexible circuit board as in the first embodiment. The positions of both ends are set so that the LED 121 is positioned at a predetermined position with respect to the light guide plate 122.

また、この時、フレキシブル回路基板11は、折曲部12の反発力(弾性)によって導光板122の方向に押圧される力を受けLED121が導光板の側面122aに接近し導光板の側面122aとLED121との間隔bの値を小さくすることができる。尚、LED121は導光板の側面122aに接触しても良い。また、フレキシブル回路基板11は、折曲部12の反発力(弾性)によって導光板の上面122b、側壁の段部上面16bの方向にも押圧される。この結果、フレキシブル回路基板11が枠体10に確実に保持される。   At this time, the flexible circuit board 11 receives a force pressed in the direction of the light guide plate 122 by the repulsive force (elasticity) of the bent portion 12, and the LED 121 approaches the side surface 122a of the light guide plate and the side surface 122a of the light guide plate. The value of the distance b from the LED 121 can be reduced. The LED 121 may contact the side surface 122a of the light guide plate. The flexible circuit board 11 is also pressed in the direction of the upper surface 122 b of the light guide plate and the stepped upper surface 16 b of the side wall by the repulsive force (elasticity) of the bent portion 12. As a result, the flexible circuit board 11 is securely held by the frame body 10.

以上のように本実施におけるバックライト装置は、枠体10の側壁14の内壁に設ける凹部15にフレキシブル回路基板11の折曲部12を組み込むことによって、その弾性を利用して導光板122とLED121との間隔bの値を小さくすることができる。したがって、導光板122に対してLED121を簡単で確実に位置決め出来る上、枠体10にフレキシブル回路基板11を保持することができる。この結果、実施例1と同様の効果を得ることができる。   As described above, the backlight device according to the present embodiment incorporates the bent portion 12 of the flexible circuit board 11 into the concave portion 15 provided on the inner wall of the side wall 14 of the frame body 10, thereby utilizing the elasticity of the light guide plate 122 and the LED 121. The distance b can be reduced. Therefore, the LED 121 can be easily and reliably positioned with respect to the light guide plate 122 and the flexible circuit board 11 can be held on the frame body 10. As a result, the same effect as in the first embodiment can be obtained.

尚、フレキシブル回路基板の折曲部の形状については、円弧状に折り曲げた例で説明したが、その他の例として図4に示すように、フレキシブル回路基板21の端部をS字状に折り曲げた折曲部22としても良い。この場合、枠体の側壁14に設ける凹部25の開口部には、側壁14の上面14a側から内側に突出する上面突起部17を形成する。これよって凹部25はアンダーカツト状になり、この凹部25にS字状に折り曲げた折曲部22を組み込むことにより、枠体10にフレキシブル回路基板21をより確実に保持することができる。その他の構成は同様であるため説明は省略する。
また、図5に示すように鋭角状に折り曲げた折曲部32としても良い。この場合、枠体の側壁14に設ける凹部35の幅dの値は折曲部32の反発力(弾性)を利用出来るように折曲部32の厚さに応じて調整する。
以上のように、図4、図5に示した例においても導光板122とLED121との間隔bの値を小さくすることができ、同様の効果を得ることができる。
In addition, about the shape of the bending part of the flexible circuit board, it demonstrated in the example bent in circular arc shape, However, as shown in FIG. 4, the edge part of the flexible circuit board 21 was bent in S shape as another example. The bent portion 22 may be used. In this case, an upper surface protrusion 17 that protrudes inward from the upper surface 14 a side of the side wall 14 is formed in the opening of the recess 25 provided on the side wall 14 of the frame. Accordingly, the concave portion 25 has an undercut shape, and the flexible circuit board 21 can be more reliably held on the frame body 10 by incorporating the bent portion 22 bent into an S shape into the concave portion 25. Since other configurations are the same, description thereof is omitted.
Moreover, it is good also as the bending part 32 bend | folded at acute angle shape as shown in FIG. In this case, the value of the width d of the concave portion 35 provided on the side wall 14 of the frame body is adjusted according to the thickness of the bent portion 32 so that the repulsive force (elasticity) of the bent portion 32 can be used.
As described above, also in the examples shown in FIGS. 4 and 5, the value of the distance b between the light guide plate 122 and the LED 121 can be reduced, and the same effect can be obtained.

図6は、実施例3におけるバックライト装置の主要部を示し枠体にフレキシブル回路基板を組み込んだ状態を示す断面図である。本実施例におけるバックライト装置は光源を搭載した分岐のフレキシブル回路基板を導光板の下面側、即ち枠体の底面に配置した例であり、その他の基本的な構成は前述の実施例2と類似している。したがって実施例2と同様な構成要素については同一番号を付与し説明を省略する。以下、図面を用いて実施例3のバックライト装置について説明する。   FIG. 6 is a cross-sectional view illustrating a main part of the backlight device according to the third embodiment and a state in which the flexible circuit board is incorporated in the frame. The backlight device in this embodiment is an example in which a branched flexible circuit board on which a light source is mounted is arranged on the lower surface side of the light guide plate, that is, the bottom surface of the frame, and the other basic configuration is similar to that of the second embodiment. is doing. Therefore, the same constituent elements as those in the second embodiment are designated by the same reference numerals and the description thereof is omitted. Hereinafter, the backlight device of Example 3 will be described with reference to the drawings.

図6に示すように枠体10と、該枠体10に保持される導光板122と、該導光板122の受光部となる側面122aに近接または密接して対向する如く配置される光源としてのLED121と、該LED121を実装したフレキシブル回路基板41とを備えている。枠体10は導光板122の側面122aに対向する側壁24を有し、この側壁24の内壁には凹部45が形成されており、この凹部45は内壁45a、45b、45cを有し、内壁45cが枠体の底面26とほぼ同一平面となるように形成されている。   As shown in FIG. 6, as a light source arranged so as to face the frame body 10, the light guide plate 122 held by the frame body 10, and the side surface 122 a serving as the light receiving portion of the light guide plate 122 in close proximity or close to each other. An LED 121 and a flexible circuit board 41 on which the LED 121 is mounted are provided. The frame 10 has a side wall 24 that faces the side surface 122a of the light guide plate 122. A concave portion 45 is formed on the inner wall of the side wall 24. The concave portion 45 has inner walls 45a, 45b, 45c, and an inner wall 45c. Is formed to be substantially flush with the bottom surface 26 of the frame.

フレキシブル回路基板41は前述の枠体10に導光板122を配置する前に組み込まれる。フレキシブル回路基板41は実装されているLED121を上面側にして枠体の底面26に配置され、フレキシブル回路基板41のLED121に対して導光板122と反対側の端部を折り曲げて形成する突当部である折曲部42が枠体10における側壁24の凹部45に組み込まれ、凹部内壁45a、45b、45cに当接され、折曲部42の弾性を利用してフレキシブル回路基板41が枠体10に保持される。次に導光板122を配置する。この時、導光板122の一部がフレキシブル回路基板41における折曲部42の反対側の端部と重なるように配置する。また、LED121が導光板122の側面122aと側壁24の内壁24aとの間に配置される。   The flexible circuit board 41 is incorporated before the light guide plate 122 is arranged in the frame 10 described above. The flexible circuit board 41 is disposed on the bottom surface 26 of the frame body with the mounted LED 121 as the upper surface side, and a bumping portion formed by bending the end of the flexible circuit board 41 opposite to the light guide plate 122 with respect to the LED 121. The bent portion 42 is incorporated in the concave portion 45 of the side wall 24 in the frame body 10 and is brought into contact with the inner walls 45a, 45b, 45c of the concave portion, and the flexible circuit board 41 is utilized by utilizing the elasticity of the bent portion 42. Retained. Next, the light guide plate 122 is disposed. At this time, it arrange | positions so that a part of light-guide plate 122 may overlap with the edge part on the opposite side of the bending part 42 in the flexible circuit board 41. FIG. The LED 121 is disposed between the side surface 122 a of the light guide plate 122 and the inner wall 24 a of the side wall 24.

また、フレキシブル回路基板41は、折曲部42の反発力(弾性)によって導光板122の方向に押圧される力を受けLED121が導光板の側面122aに接近し導光板の側面122aとLED121との間隔b値を実施例1と同様に小さくすることができる。また、フレキシブル回路基板41は、折曲部42の反発力(弾性)によって枠体の底面26の方向にも押圧されると共に、導光板122によっても上方への動きを規制される。この結果、フレキシブル回路基板41が枠体10に確実に保持される。尚、側壁の凹部45の長さ、フレキシブル回路基板41における折曲部42の幅の値については、実施例2と同様に設定すれば良い。   Further, the flexible circuit board 41 receives a force pressed in the direction of the light guide plate 122 by the repulsive force (elasticity) of the bent portion 42, the LED 121 approaches the side surface 122 a of the light guide plate, and the side surface 122 a of the light guide plate and the LED 121 The interval b value can be reduced as in the first embodiment. The flexible circuit board 41 is also pressed in the direction of the bottom surface 26 of the frame body by the repulsive force (elasticity) of the bent portion 42, and the upward movement is also restricted by the light guide plate 122. As a result, the flexible circuit board 41 is securely held by the frame body 10. The length of the concave portion 45 on the side wall and the width of the bent portion 42 in the flexible circuit board 41 may be set in the same manner as in the second embodiment.

以上のように本実施例においても導光板122とLED121との間隔bの値を小さくすることができ、実施例2と同様の効果を得ることができる。
尚、突当部としての折曲部の形状については、実施例2において他の例として記載した形状についても適応が可能である。
また、本実施例においては、フレキシブル回路基板の突当部が折曲部である例で説明したが、実施例1のように、フレキシブル回路基板の突出部の先端部を突当部とした場合も同様に適応が可能である。
As described above, also in the present embodiment, the value of the distance b between the light guide plate 122 and the LED 121 can be reduced, and the same effect as in the second embodiment can be obtained.
In addition, about the shape of the bending part as an abutting part, the shape described as another example in Example 2 is applicable.
In the present embodiment, the example in which the abutting portion of the flexible circuit board is a bent portion has been described. However, as in the case of the first embodiment, the tip of the protruding portion of the flexible circuit board is an abutting portion. Can be similarly applied.

図8は、実施例4におけるバックライト装置の主要部を示し枠体にフレキシブル回路基板を組み込んだ状態を示す平面図、図9は図8におけるX−X断面図、図10はフレキシブル回路基板を枠体に組み込む前の状態を示す部分拡大平面図、図11はフレキシブル回路基板を示す斜視図である。本実施例におけるバックライト装置は、フレキシブル回路基板の突当部、枠体の構成が実施例1と異なり、その他の基本的な構成は前述の実施例1と類似している。したがって実施例1と同様な構成要素については同一番号を付与し説明を省略する。以下、図8〜11を用いて実施例3のバックライト装置について説明する。   8 is a plan view showing the main part of the backlight device in Example 4 and showing a state in which the flexible circuit board is incorporated in the frame, FIG. 9 is a sectional view taken along line XX in FIG. 8, and FIG. FIG. 11 is a perspective view showing a flexible circuit board, and FIG. 11 is a partially enlarged plan view showing a state before being incorporated into a frame. The backlight device according to the present embodiment is different from the first embodiment in the configuration of the abutment portion of the flexible circuit board and the frame body, and other basic configurations are similar to those in the first embodiment. Therefore, the same components as those in the first embodiment are given the same numbers, and the description thereof is omitted. Hereinafter, the backlight device of Example 3 will be described with reference to FIGS.

図8、図9、図10に示すように実施例3におけるバックライト装置は、枠体10と、枠体10に保持される導光板122と、導光板122の受光部となる側面122aに近接または密接して対向する如く配置される光源としてのLED121と、該LED121を実装したフレキシブル回路基板51とを備えている。枠体10は導光板122の側面122aに対向する側壁14を有し、この側壁14の内側に沿って段部16が形成されている。この段部16の上面16bは、枠体10に組込まれている導光板122の上面122bと同じ高さに形成されている。さらに段部16の上面16bから上方に延びる枠体の側壁14の内壁には凹部55が形成されており、この凹部55は内壁55a、55b、55cを有し、内壁55cが段部16の上面16bとほぼ同一平面となるように形成されている。また、内壁55aには突起部52が形成されている。   As shown in FIGS. 8, 9, and 10, the backlight device according to the third embodiment is close to the frame body 10, the light guide plate 122 held by the frame body 10, and the side surface 122 a serving as the light receiving unit of the light guide plate 122. Or LED121 as a light source arrange | positioned so that it closely opposes, and the flexible circuit board 51 which mounted this LED121 are provided. The frame 10 has a side wall 14 that faces the side surface 122 a of the light guide plate 122, and a step portion 16 is formed along the inside of the side wall 14. The upper surface 16 b of the step portion 16 is formed at the same height as the upper surface 122 b of the light guide plate 122 incorporated in the frame body 10. Further, a concave portion 55 is formed on the inner wall of the side wall 14 of the frame body extending upward from the upper surface 16 b of the step portion 16, and this concave portion 55 has inner walls 55 a, 55 b, 55 c, and the inner wall 55 c is the upper surface of the step portion 16. It is formed so as to be substantially flush with 16b. Further, a protrusion 52 is formed on the inner wall 55a.

図10、図11に示すように、フレキシブル回路基板51には、枠体10に組み込まれた状態においてLED121に対して導光板122と反対側となる端部から突出する幅Kの突出部56が形成されている。この突出部56は、その先端56aとLED121との間に窓部53を有する。この窓部53は突出部56の先端56aに近接して設けられ、先端56aに沿ってフレキシブル回路基板51の長さ方向に長孔状に形成されている。この窓部53と先端56aとの間には弾性を有する帯状部54が形成される。   As shown in FIGS. 10 and 11, the flexible circuit board 51 has a protrusion 56 having a width K that protrudes from an end opposite to the light guide plate 122 with respect to the LED 121 in a state of being incorporated in the frame body 10. Is formed. The projecting portion 56 has a window portion 53 between the tip 56 a and the LED 121. The window 53 is provided in the vicinity of the tip 56a of the protrusion 56, and is formed in a long hole shape in the length direction of the flexible circuit board 51 along the tip 56a. An elastic band 54 is formed between the window 53 and the tip 56a.

フレキシブル回路基板51は枠体10に導光板122を配置し、その後に組み込まれる。図8、9に示すようにフレキシブル回路基板51は実装されているLED121を下面側にして導光板122と枠体の段部16とを跨ぐようにして導光板の上面122bと枠体の段部の上面16bとに配置される。図10はフレキシブル回路基板51を枠体10に組み込む前の状態を示している。図10に示す状態からフレキシブル回路基板51を矢印の方向に移動し、図8、9に示すようにフレキシブル回路基板51の突当部である突出部56を枠体10における側壁14の凹部55に挿入する。側壁14の凹部55の長さLは、フレキシブル回路基板の突出部56の幅Kより僅かに大きく設定されており、凹部55の両端の位置は、導光板に122に対してLED121が所定の位置に位置決めされるように設定されている。また、フレキシブル回路基板51の突出部56の帯状部54が、凹部内壁55aに設ける内壁の突起部52に当接される。この内壁の突起部52はフレキシブル回路基板51の突出部56における窓部53の長手方向のほぼ中央に対応する位置に配置されている。   The flexible circuit board 51 has the light guide plate 122 disposed on the frame body 10 and is assembled thereafter. As shown in FIGS. 8 and 9, the flexible circuit board 51 has the LED 121 mounted on the lower surface side so as to straddle the light guide plate 122 and the step portion 16 of the frame body, and the upper surface 122b of the light guide plate and the step portion of the frame body. And the upper surface 16b. FIG. 10 shows a state before the flexible circuit board 51 is assembled into the frame body 10. The flexible circuit board 51 is moved in the direction of the arrow from the state shown in FIG. 10, and the protrusions 56, which are the abutting parts of the flexible circuit board 51, are formed in the recesses 55 of the side wall 14 in the frame body 10 as shown in FIGS. insert. The length L of the concave portion 55 of the side wall 14 is set to be slightly larger than the width K of the protruding portion 56 of the flexible circuit board. The positions of both ends of the concave portion 55 are predetermined positions with respect to the light guide plate 122 with respect to the LED 121. It is set to be positioned. Further, the belt-like portion 54 of the protruding portion 56 of the flexible circuit board 51 is brought into contact with the protruding portion 52 on the inner wall provided on the inner wall 55a of the concave portion. The protrusion 52 on the inner wall is disposed at a position corresponding to the approximate center in the longitudinal direction of the window 53 in the protrusion 56 of the flexible circuit board 51.

一方、LED121は導光板122の側壁122aと枠体の段部16の側面16aとの間に配置される。この時、フレキシブル回路基板51の帯状部54は凹部55の内壁55aに設ける突起部52に当接され、窓部53の方向に僅かに弾性変形する。このため、フレキシブル回路基板51は帯状部54の反発力(弾性)によって、LED121が導光板122の側壁122aの方向に押圧される力を受け、LED121が導光板の側面122aに接近し導光板の側面122aとLED121との間隔bの値を小さくすることができる。尚、LED121は導光板の側面122aに接触しても良い。また、凹部55の上下方向の隙間dの値はフレキシブル回路基板51の厚さtより僅かに大きく設定し、フレキシブル回路基板51の突出部56が凹部55に狭持されるようになっている。この結果、フレキシブル回路基板51が枠体10に確実に保持される。   On the other hand, the LED 121 is disposed between the side wall 122a of the light guide plate 122 and the side surface 16a of the step portion 16 of the frame body. At this time, the belt-like portion 54 of the flexible circuit board 51 is brought into contact with the protrusion 52 provided on the inner wall 55 a of the recess 55 and slightly elastically deforms in the direction of the window 53. For this reason, the flexible circuit board 51 receives a force by which the LED 121 is pressed in the direction of the side wall 122a of the light guide plate 122 by the repulsive force (elasticity) of the band-shaped portion 54, and the LED 121 approaches the side surface 122a of the light guide plate. The value of the distance b between the side surface 122a and the LED 121 can be reduced. The LED 121 may contact the side surface 122a of the light guide plate. In addition, the value of the gap d in the vertical direction of the recess 55 is set slightly larger than the thickness t of the flexible circuit board 51, and the protruding portion 56 of the flexible circuit board 51 is held between the recesses 55. As a result, the flexible circuit board 51 is securely held by the frame body 10.

以上のように本実施におけるバックライト装置は、枠体10の側壁14の内壁に設ける凹部55にフレキシブル回路基板51の突出部56を挿入して組み込むことによって、突出部51の窓53に隣接して設ける帯状部54に枠体の側壁における凹部55の内壁55aに設ける突起部52を当接させ、帯状部54の弾性を利用して導光板122とLED121との間隔bの値を小さくすることができる。この結果、実施例1と同様に、導光板122に対してLED121を簡単で確実に位置決め出来る上、その固定のために両面接着テープ等を必要とせず、枠体10にフレキシブル回路基板51を保持することが出来、コストダウンが可能である。また、導光板122とLED121との間隔bの値を小さくすることができるため、輝度を安定化させると共に輝度を上昇させることができる。   As described above, the backlight device according to the present embodiment is adjacent to the window 53 of the protrusion 51 by inserting the protrusion 56 of the flexible circuit board 51 into the recess 55 provided on the inner wall of the side wall 14 of the frame body 10. The protrusion 52 provided on the inner wall 55a of the recess 55 on the side wall of the frame body is brought into contact with the belt-like part 54 provided to reduce the value of the distance b between the light guide plate 122 and the LED 121 using the elasticity of the belt-like part 54. Can do. As a result, as in the first embodiment, the LED 121 can be easily and reliably positioned with respect to the light guide plate 122, and a double-sided adhesive tape or the like is not required for fixing the LED 121, and the flexible circuit board 51 is held on the frame 10. It is possible to reduce the cost. Moreover, since the value of the distance b between the light guide plate 122 and the LED 121 can be reduced, the luminance can be stabilized and the luminance can be increased.

尚、本実施例おいては、突起部を枠体10の側壁14における凹部55の内壁55置に設けた例で説明したが、フレキシブル回路基板61における突出部56の帯状部54に突起部を設けても良い。その例を図12、13に示す。図12はフレキシブル回路基板を枠体に組み込む前の状態を示す部分拡大平面図、図13はフレキシブル回路基板を枠体に組み込んだ状態を示す部分拡大平面図である。図12に示すようにフレキシブル回路基板51の突出部56における突出部先端56aの端面に突起部57を設ける。この突出部の突起部57は帯状部54の端面から突出し、窓部53の長手方向中央付近に対応する位置に設けられている。そして図12に示す状態からフレキシブル回路基板51を矢印の方向に移動し、図13に示すようにフレキシブル回路基板51の突出部56を枠体10における側壁14の凹部55に挿入する。この時、フレキシブル回路基板51の帯状部54に設ける突起部57は凹部55の内壁55aに当接され、帯状部54が窓部53の方向に僅かに弾性変形する。   In the present embodiment, the example in which the protrusion is provided on the inner wall 55 of the recess 55 in the side wall 14 of the frame body 10 has been described, but the protrusion is provided on the belt-like portion 54 of the protrusion 56 in the flexible circuit board 61. It may be provided. Examples thereof are shown in FIGS. FIG. 12 is a partially enlarged plan view showing a state before the flexible circuit board is incorporated into the frame, and FIG. 13 is a partially enlarged plan view showing a state where the flexible circuit board is incorporated into the frame. As shown in FIG. 12, a protrusion 57 is provided on the end surface of the protrusion 56 a of the protrusion 56 of the flexible circuit board 51. The protruding portion 57 of the protruding portion protrudes from the end surface of the belt-like portion 54 and is provided at a position corresponding to the vicinity of the center in the longitudinal direction of the window portion 53. Then, the flexible circuit board 51 is moved from the state shown in FIG. 12 in the direction of the arrow, and the protruding portion 56 of the flexible circuit board 51 is inserted into the recess 55 of the side wall 14 in the frame 10 as shown in FIG. At this time, the protrusion 57 provided on the belt-like portion 54 of the flexible circuit board 51 is brought into contact with the inner wall 55 a of the recess 55, and the belt-like portion 54 is slightly elastically deformed in the direction of the window portion 53.

このため、前述の実施例4と同様にフレキシブル回路基板51は帯状部54の反発力(弾性)によって、LED121が導光板122の側壁122aの方向に押圧される力を受け、LED121が導光板の側面122aに接近し導光板の側面122aとLED121との間隔の値を小さくすることができる。その他は実施例4と同様であるため説明は省略する。以上、図12、図13に示した例においても、実施例4と同様に枠体10にフレキシブル回路基板51を確実に保持することができる。また、導光板122とLED121との間隔を小さくすることができるため、輝度を安定化させると共に輝度を上昇させることができる。   For this reason, the flexible circuit board 51 receives the force by which the LED 121 is pressed in the direction of the side wall 122a of the light guide plate 122 by the repulsive force (elasticity) of the belt-like portion 54, and the LED 121 is the light guide plate as in the fourth embodiment. The value of the distance between the side surface 122a of the light guide plate and the LED 121 can be reduced by approaching the side surface 122a. The rest of the configuration is the same as that of the fourth embodiment, and a description thereof is omitted. As described above, also in the examples shown in FIGS. 12 and 13, the flexible circuit board 51 can be reliably held in the frame 10 similarly to the fourth embodiment. Moreover, since the space | interval of the light-guide plate 122 and LED121 can be made small, a brightness | luminance can be raised while stabilizing a brightness | luminance.

尚、本実施形態では液晶表示装置のバックライト装置に適用する場合について説明したが、これに限らず、種々の照明機器、表示装置等のバックライト装置に広く適用することができる。   In the present embodiment, the case where the present invention is applied to a backlight device of a liquid crystal display device has been described. However, the present invention is not limited to this, and can be widely applied to backlight devices such as various illumination devices and display devices.

本発明の実施例1におけるバックライト装置の主要部を示し、図1(a)は平面図、図1(b)は、図1(a)におけるX−X断面図である。1 shows a main part of a backlight device according to a first embodiment of the present invention, in which FIG. 1A is a plan view, and FIG. 1B is a cross-sectional view taken along line XX in FIG. 本発明の実施例1におけるバックライト装置の主要部を示し、図2(a)は、図1(a)におけるY−Y断面図、図2(b)は、図2(a)におけるフレキシブル回路基板を示す斜視図である。FIG. 2A shows a main part of the backlight device according to the first embodiment of the present invention, FIG. 2A is a cross-sectional view taken along line YY in FIG. 1A, and FIG. 2B is a flexible circuit in FIG. It is a perspective view which shows a board | substrate. 本発明の実施例2におけるバックライト装置の主要部を示す断面図である。It is sectional drawing which shows the principal part of the backlight apparatus in Example 2 of this invention. 本発明の実施例2におけるフレキシブル回路基板の折曲部の形状が異なる他の例を示す断面図である。It is sectional drawing which shows the other example from which the shape of the bending part of the flexible circuit board in Example 2 of this invention differs. 本発明の実施例2におけるフレキシブル回路基板の折曲部の形状が異なる他の例を示す断面図であるIt is sectional drawing which shows the other example from which the shape of the bending part of the flexible circuit board in Example 2 of this invention differs. 本発明の実施例3におけるバックライト装置を示す断面図である。It is sectional drawing which shows the backlight apparatus in Example 3 of this invention. 本発明の実施例2のフレキシブル回路基板を示す斜視図である。It is a perspective view which shows the flexible circuit board of Example 2 of this invention. 本発明の実施例4におけるバックライト装置の主要部を示す平面図である。It is a top view which shows the principal part of the backlight apparatus in Example 4 of this invention. 図8におけるX−X断面図である。It is XX sectional drawing in FIG. 本発明の実施例4におけるフレキシブル回路基板を枠体に組み込む前の状態を示す部分拡大平面図である。It is a partial enlarged plan view which shows the state before incorporating the flexible circuit board in Example 4 of this invention in a frame. 本発明の実施例4におけるフレキシブル回路基板を示す斜視図である。It is a perspective view which shows the flexible circuit board in Example 4 of this invention. 本発明の実施例4における他の例を示し、フレキシブル回路基板を枠体に組み込む前の状態を示す部分拡大平面図である。It is a partial enlarged plan view which shows the other example in Example 4 of this invention, and shows the state before incorporating a flexible circuit board in a frame. 本発明の実施例4における他の例を示し、フレキシブル回路基板を枠体に組み込んだ状態を示す部分拡大平面図である。It is the elements on larger scale which show the other example in Example 4 of this invention, and show the state which integrated the flexible circuit board in the frame. 第1の従来例におけるバックライト装置の主要部を示す平面図である。It is a top view which shows the principal part of the backlight apparatus in a 1st prior art example. 図14におけるX−X断面図である。It is XX sectional drawing in FIG. 第2の従来例におけるバックライト装置の主要部を示す平面図である。It is a top view which shows the principal part of the backlight apparatus in a 2nd prior art example. 図16におけるX−X断面図である。It is XX sectional drawing in FIG.

符号の説明Explanation of symbols

1、11、21、31 フレキシブル回路基板
1a、11a フレキシブル回路基板の突出部
2 突出部の先端部
10 枠体
12、22、32 折曲部
14 枠体の側壁
14a 側壁の上面
15、25、35 側壁の凹部
15a 凹部の内壁
15b 凹部の内壁
15c 凹部の内壁
15d 凹部の隅部
16 段部
16a 段部の側面
16b 段部の上面
17 上面突起部
24 枠体の側壁
26 枠体の底面
41 フレキシブル回路基板
42 折曲部
45 側壁の凹部
45a 凹部の内壁
45b 凹部の内壁
45c 凹部の内壁
51 フレキシブル回路基板
52 内壁の突起部
53 フレキシブル回路基板の窓部
54 帯状部
55 側壁の凹部
55a 凹部の内壁
56 突出部
56a 突出部の端面
57 突出部の突起部
121 LED
122 導光板
122a 導光板の側面
122b 導光板の上面
DESCRIPTION OF SYMBOLS 1, 11, 21, 31 Flexible circuit board 1a, 11a The protrusion part 2 of a flexible circuit board The front-end | tip part 10 of a protrusion part Frame body 12, 22, 32 Bending part 14 Side wall 14a of a frame body Upper surface 15, 25, 35 of a side wall Side wall recessed portion 15a Recessed inner wall 15b Recessed inner wall 15c Recessed inner wall 15d Recessed corner 16 Stepped portion 16a Stepped side surface 16b Stepped portion upper surface 17 Upper surface protruding portion 24 Frame body side wall 26 Frame body bottom surface 41 Flexible circuit Substrate 42 Bent part 45 Side wall recess 45a Recess inner wall 45b Recess inner wall 45c Recess inner wall 51 Flexible circuit board 52 Inner wall projection 53 Flexible circuit board window 54 Band-like part 55 Side wall recess 55a Recess inner wall 56 Projection Part 56a End surface 57 of protrusion part Projection part 121 of protrusion part LED
122 Light guide plate 122a Light guide plate side surface 122b Light guide plate upper surface

Claims (2)

箱形の形状をなし上方が開口されている枠体と、該枠体に保持される導光板と、該導光板の受光部となる側面に近接または密接して対向する如く配置される光源と、該光源を実装したフレキシブル回路基板とを備えたバックライト装置において、
前記フレキシブル回路基板が光源に対して前記導光板と反対側の端部近傍に弾性を有する突当部を有し、前記枠体が前記突当部に対応する位置に凹部を有し、該枠体の凹部の内壁に前記フレキシブル回路基板の突当部を当接し、前記突当部の弾性を利用して前記フレキシブル回路基板を前記枠体に保持してなり、前記突当部がフレキシブル回路基板の前記導光板と反対側の方向に突出する突出部からなり、該突出部は、該突出部先端に沿って設ける長孔状の窓部と、該窓部と前記突出部先端との間に形成される帯状部とを有し、該帯状部における前記突出部先端側の端面または前記枠体における凹部の内壁のうち、いずれか一方に突起部を有することを特徴とするバックライト装置。
A frame having a box shape and having an upper opening; a light guide plate held by the frame; and a light source disposed so as to be close to or in close contact with a side surface serving as a light receiving portion of the light guide plate In a backlight device including a flexible circuit board on which the light source is mounted,
The flexible circuit board has an abutting portion having elasticity in the vicinity of the end opposite to the light guide plate with respect to the light source, and the frame body has a recess at a position corresponding to the abutting portion. the abutting portions of the flexible circuit board on the inner wall of the recess of the body contact, the abutting portions elastic utilizing the retaining said flexible circuit board to the frame body Ri Na, the abutment portion is flexible circuit It comprises a protrusion that protrudes in a direction opposite to the light guide plate of the substrate, the protrusion being a long hole-shaped window provided along the tip of the protrusion, and between the window and the tip of the protrusion And a protrusion formed on one of the end surface of the protrusion on the leading end side of the protrusion and the inner wall of the recess in the frame .
前記導光板と前記光源との厚さが略等しいことを特徴とする請求項1に記載のバックライト装置。 The backlight device according to claim 1, wherein the light guide plate and the light source have substantially the same thickness.
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JP5442328B2 (en) * 2009-06-24 2014-03-12 ミネベア株式会社 Surface lighting device
JP5387210B2 (en) * 2009-07-30 2014-01-15 カシオ計算機株式会社 Backlight device and liquid crystal display device
KR101677996B1 (en) * 2010-08-31 2016-11-21 엘지디스플레이 주식회사 Liquid crystal display device
JP5578559B2 (en) * 2010-09-03 2014-08-27 シチズン電子株式会社 Backlight unit and liquid crystal display device
WO2012067002A1 (en) * 2010-11-17 2012-05-24 シャープ株式会社 Backlight device and liquid crystal display device provided with backlight device
WO2013027169A2 (en) * 2011-08-19 2013-02-28 I2Ic Corporation Light source using a bent pcb
JP2019192574A (en) * 2018-04-27 2019-10-31 シャープ株式会社 Composite light guide member, lighting device, and display device

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