JP4563491B1 - レーザ加工機 - Google Patents
レーザ加工機 Download PDFInfo
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- JP4563491B1 JP4563491B1 JP2009160442A JP2009160442A JP4563491B1 JP 4563491 B1 JP4563491 B1 JP 4563491B1 JP 2009160442 A JP2009160442 A JP 2009160442A JP 2009160442 A JP2009160442 A JP 2009160442A JP 4563491 B1 JP4563491 B1 JP 4563491B1
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- 238000012545 processing Methods 0.000 title claims abstract description 121
- 239000000428 dust Substances 0.000 claims abstract description 120
- 239000000758 substrate Substances 0.000 claims abstract description 95
- 230000007246 mechanism Effects 0.000 claims abstract description 47
- 230000003287 optical effect Effects 0.000 abstract description 5
- 239000010408 film Substances 0.000 description 26
- 239000010409 thin film Substances 0.000 description 19
- 238000003754 machining Methods 0.000 description 12
- 238000012986 modification Methods 0.000 description 12
- 230000004048 modification Effects 0.000 description 12
- 238000000926 separation method Methods 0.000 description 12
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- 239000004065 semiconductor Substances 0.000 description 9
- 238000003825 pressing Methods 0.000 description 8
- 238000000034 method Methods 0.000 description 6
- 238000004519 manufacturing process Methods 0.000 description 5
- 238000000059 patterning Methods 0.000 description 5
- 230000008569 process Effects 0.000 description 5
- 239000002184 metal Substances 0.000 description 4
- 239000013307 optical fiber Substances 0.000 description 4
- 239000010410 layer Substances 0.000 description 3
- 238000002679 ablation Methods 0.000 description 2
- 238000006243 chemical reaction Methods 0.000 description 2
- 238000005229 chemical vapour deposition Methods 0.000 description 2
- 230000001678 irradiating effect Effects 0.000 description 2
- 238000005339 levitation Methods 0.000 description 2
- 238000012546 transfer Methods 0.000 description 2
- 229910000831 Steel Inorganic materials 0.000 description 1
- 230000002411 adverse Effects 0.000 description 1
- 238000013459 approach Methods 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000002360 explosive Substances 0.000 description 1
- 238000012840 feeding operation Methods 0.000 description 1
- 239000010419 fine particle Substances 0.000 description 1
- 238000007667 floating Methods 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 230000000149 penetrating effect Effects 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 230000000717 retained effect Effects 0.000 description 1
- 239000002356 single layer Substances 0.000 description 1
- 238000004544 sputter deposition Methods 0.000 description 1
- 239000010959 steel Substances 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/08—Devices involving relative movement between laser beam and workpiece
- B23K26/0869—Devices involving movement of the laser head in at least one axial direction
- B23K26/0876—Devices involving movement of the laser head in at least one axial direction in at least two axial directions
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/08—Devices involving relative movement between laser beam and workpiece
- B23K26/082—Scanning systems, i.e. devices involving movement of the laser beam relative to the laser head
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/14—Working by laser beam, e.g. welding, cutting or boring using a fluid stream, e.g. a jet of gas, in conjunction with the laser beam; Nozzles therefor
- B23K26/142—Working by laser beam, e.g. welding, cutting or boring using a fluid stream, e.g. a jet of gas, in conjunction with the laser beam; Nozzles therefor for the removal of by-products
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/16—Removal of by-products, e.g. particles or vapours produced during treatment of a workpiece
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/362—Laser etching
- B23K26/364—Laser etching for making a groove or trench, e.g. for scribing a break initiation groove
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/40—Removing material taking account of the properties of the material involved
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/70—Auxiliary operations or equipment
- B23K26/702—Auxiliary equipment
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K37/00—Auxiliary devices or processes, not specially adapted to a procedure covered by only one of the preceding main groups
- B23K37/02—Carriages for supporting the welding or cutting element
- B23K37/0211—Carriages for supporting the welding or cutting element travelling on a guide member, e.g. rail, track
- B23K37/0235—Carriages for supporting the welding or cutting element travelling on a guide member, e.g. rail, track the guide member forming part of a portal
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K37/00—Auxiliary devices or processes, not specially adapted to a procedure covered by only one of the preceding main groups
- B23K37/04—Auxiliary devices or processes, not specially adapted to a procedure covered by only one of the preceding main groups for holding or positioning work
- B23K37/0408—Auxiliary devices or processes, not specially adapted to a procedure covered by only one of the preceding main groups for holding or positioning work for planar work
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/04—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices
- H01L31/042—PV modules or arrays of single PV cells
- H01L31/0445—PV modules or arrays of single PV cells including thin film solar cells, e.g. single thin film a-Si, CIS or CdTe solar cells
- H01L31/046—PV modules composed of a plurality of thin film solar cells deposited on the same substrate
- H01L31/0463—PV modules composed of a plurality of thin film solar cells deposited on the same substrate characterised by special patterning methods to connect the PV cells in a module, e.g. laser cutting of the conductive or active layers
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2101/00—Articles made by soldering, welding or cutting
- B23K2101/36—Electric or electronic devices
- B23K2101/40—Semiconductor devices
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2103/00—Materials to be soldered, welded or cut
- B23K2103/16—Composite materials, e.g. fibre reinforced
- B23K2103/166—Multilayered materials
- B23K2103/172—Multilayered materials wherein at least one of the layers is non-metallic
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2103/00—Materials to be soldered, welded or cut
- B23K2103/50—Inorganic material, e.g. metals, not provided for in B23K2103/02 – B23K2103/26
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/50—Photovoltaic [PV] energy
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- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Mechanical Engineering (AREA)
- Plasma & Fusion (AREA)
- Sustainable Development (AREA)
- Life Sciences & Earth Sciences (AREA)
- Electromagnetism (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- General Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Sustainable Energy (AREA)
- Laser Beam Processing (AREA)
Abstract
【解決手段】被加工面を上にした基板9を動かないよう保定する保定機構2と、Y軸方向に走行して基板9の被加工面にレーザ光を照射しかつX軸方向にも移動可能な加工ノズル3と、加工ノズル3の走行に追随してY軸方向に走行する集塵ノズル5と、基板9を下方から支持しながらこの基板9に対してX軸方向に相対移動可能な支持機構4とを具備するレーザ加工機1を構成した。本レーザ加工機1では、レーザ加工時に基板9は動かさず、加工ノズル3及び集塵ノズル5を走行させつつレーザ加工を実施し、レーザ光を照射した加工部位から発生する粉塵を吸引する。また、加工ノズル3をX軸方向にピッチ送り移動させる際には、支持機構4をもX軸方向に移動させ、支持機構4とレーザ光軸との干渉を回避する。
【選択図】図1
Description
2…保定機構
3…加工ノズル
4…支持機構
5…集塵ノズル
6…集塵接続機構
9…基板
L…レーザ光の照射部位
X…加工ノズル及び集塵ノズルのピッチ送り方向
Y…加工ノズル及び集塵ノズルの走行方向
Claims (5)
- レーザ加工が施される被加工面を上にした基板を支持する本体と、
所定の走行方向に走行可能であるように前記基板の下方に設けられ、レーザ光を上向きに発射して基板を透過させて前記被加工面に照射する加工ノズルと、
前記加工ノズルに追随して前記走行方向に走行可能であるように前記基板の上方に設けられ、恒常的に前記被加工面における前記レーザ光の照射部位の直上またはその近傍にあって、この照射部位から発生し上方に飛散する粉塵を吸引する集塵ノズルと
を具備し、
前記集塵ノズルは、前記基板の被加工面に近接する吸引口を有した複数個のノズル部材を前記走行方向とは交差する方向に連接し、かつそれらノズル部材の上部を単一の集合管に連結したものであって、各ノズル部材にそれぞれ各ノズル部材の内部を流通する風量を手動で調節できるエアダンパまたは流量制御弁を設けている
ことを特徴とするレーザ加工機。 - 前記集塵ノズルは、前記基板の被加工面に近接し前記照射部位の直上に開口する下向きの吸引口を有しており、
前記吸引口は、前記走行方向とは交差する方向に拡張した細長穴である請求項1記載のレーザ加工機。 - 前記集塵ノズルは、前記基板の被加工面に近接し前記照射部位の近傍に開口する前記走行方向を向いた吸引口を有しており、
前記吸引口は、前記走行方向とは交差する方向に拡張した細長穴である請求項1記載のレーザ加工機。 - 前記加工ノズルは、前記走行方向とは交差したピッチ送り方向にも移動可能である請求項1、2または3記載のレーザ加工機。
- 前記本体は、
前記基板を動かないよう保定する保定機構と、
前記基板を下方から支持しながらこの基板に対して前記ピッチ送り方向に相対移動可能な支持機構と
を備えている請求項4記載のレーザ加工機。
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2009160442A JP4563491B1 (ja) | 2009-07-07 | 2009-07-07 | レーザ加工機 |
PCT/JP2009/067453 WO2011004509A1 (ja) | 2009-07-07 | 2009-10-07 | レーザ加工機 |
EP09847108A EP2452774A4 (en) | 2009-07-07 | 2009-10-07 | LASER CUTTING MACHINE |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2009160442A JP4563491B1 (ja) | 2009-07-07 | 2009-07-07 | レーザ加工機 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP4563491B1 true JP4563491B1 (ja) | 2010-10-13 |
JP2011016135A JP2011016135A (ja) | 2011-01-27 |
Family
ID=43048777
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2009160442A Active JP4563491B1 (ja) | 2009-07-07 | 2009-07-07 | レーザ加工機 |
Country Status (3)
Country | Link |
---|---|
EP (1) | EP2452774A4 (ja) |
JP (1) | JP4563491B1 (ja) |
WO (1) | WO2011004509A1 (ja) |
Cited By (2)
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JP2012227188A (ja) * | 2011-04-15 | 2012-11-15 | Kataoka Seisakusho:Kk | 薄膜太陽電池の製造方法、レーザ加工機 |
CN111571007A (zh) * | 2020-05-23 | 2020-08-25 | 松山湖材料实验室 | 优化激光加工质量的方法及其装置 |
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WO2012076064A1 (en) * | 2010-12-10 | 2012-06-14 | Solneva Sa | Device for structuring large format modules |
GB2492971B (en) * | 2011-07-15 | 2013-09-18 | M Solv Ltd | Method and apparatus for dividing thin film device into separate cells |
ITUD20120020A1 (it) * | 2012-02-08 | 2013-08-09 | Seit Elettronica Srl | Apparato di aspirazione per una macchina di lavoro, quale un ponte laser per una macchina ricamatrice/cucitrice |
JP5926592B2 (ja) * | 2012-03-27 | 2016-05-25 | 川崎重工業株式会社 | パターニング用レーザ加工装置 |
WO2013186057A1 (en) * | 2012-06-13 | 2013-12-19 | Solneva Sa | Multifunctional device for structuring large format modules |
JP6120161B2 (ja) * | 2013-04-08 | 2017-04-26 | 住友化学株式会社 | レーザー加工装置及び光学表示デバイスの生産システム |
US10672603B2 (en) * | 2015-10-23 | 2020-06-02 | Infineon Technologies Ag | System and method for removing dielectric material |
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JP6928879B2 (ja) * | 2018-01-30 | 2021-09-01 | トヨタ自動車株式会社 | レーザー溶接装置 |
JP2019188454A (ja) * | 2018-04-27 | 2019-10-31 | 三星ダイヤモンド工業株式会社 | スクライブ装置の粉塵吸引機構 |
JP7417029B2 (ja) | 2018-12-14 | 2024-01-18 | 日亜化学工業株式会社 | 発光装置及びその製造方法 |
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Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0596329A (ja) * | 1991-10-02 | 1993-04-20 | Amada Co Ltd | レーザアシスト曲げ加工方法およびその装置 |
JPH0715170U (ja) * | 1993-08-13 | 1995-03-14 | 株式会社小松製作所 | 加工機の集塵装置 |
JPH1197824A (ja) * | 1997-09-22 | 1999-04-09 | Matsushita Electric Works Ltd | 回路板の製造方法 |
JP2002160079A (ja) * | 2000-11-30 | 2002-06-04 | Laser Gijutsu Sogo Kenkyusho | 薄膜アブレーション加工方法及び装置 |
JP2003313739A (ja) * | 2002-04-24 | 2003-11-06 | Oike Tec Co Ltd | スリット糸及びスリット糸の製造方法、並びに該スリット糸の製造に用いるレーザ裁断装置 |
Family Cites Families (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH083231B2 (ja) | 1990-12-28 | 1996-01-17 | タカムラ建設株式会社 | プレキャストカーテンウォール板 |
JPH0619990U (ja) * | 1992-08-07 | 1994-03-15 | 株式会社小松製作所 | ヒュームおよび排煙の集塵装置 |
JP4444384B2 (ja) * | 1999-02-22 | 2010-03-31 | 株式会社アマダエンジニアリングセンター | レーザ加工装置 |
JP2000343268A (ja) * | 1999-06-02 | 2000-12-12 | Amada Eng Center Co Ltd | レーザ加工機 |
JP2001085720A (ja) * | 1999-09-16 | 2001-03-30 | Kanegafuchi Chem Ind Co Ltd | 薄膜光電変換モジュール及びその製造方法 |
JP2002254183A (ja) * | 2001-02-28 | 2002-09-10 | Sunx Ltd | 空気流発生装置及びレーザマーキング装置 |
US7341886B2 (en) * | 2005-03-03 | 2008-03-11 | Eastman Kodak Company | Apparatus and method for forming vias |
JP4555743B2 (ja) * | 2005-07-21 | 2010-10-06 | 本田技研工業株式会社 | レーザ加工ヘッド |
JP5008849B2 (ja) * | 2005-09-08 | 2012-08-22 | ソニーモバイルディスプレイ株式会社 | レーザ加工方法及び透明樹脂層を有する表示装置の製造方法 |
JP4933348B2 (ja) * | 2007-05-25 | 2012-05-16 | 芝浦メカトロニクス株式会社 | レーザ加工装置 |
JP4085127B1 (ja) * | 2007-10-02 | 2008-05-14 | 株式会社エムアンドシー | 除滓吸引装置 |
JP4231538B1 (ja) * | 2007-12-12 | 2009-03-04 | 株式会社片岡製作所 | レーザ加工機 |
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2009
- 2009-07-07 JP JP2009160442A patent/JP4563491B1/ja active Active
- 2009-10-07 WO PCT/JP2009/067453 patent/WO2011004509A1/ja active Application Filing
- 2009-10-07 EP EP09847108A patent/EP2452774A4/en not_active Withdrawn
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0596329A (ja) * | 1991-10-02 | 1993-04-20 | Amada Co Ltd | レーザアシスト曲げ加工方法およびその装置 |
JPH0715170U (ja) * | 1993-08-13 | 1995-03-14 | 株式会社小松製作所 | 加工機の集塵装置 |
JPH1197824A (ja) * | 1997-09-22 | 1999-04-09 | Matsushita Electric Works Ltd | 回路板の製造方法 |
JP2002160079A (ja) * | 2000-11-30 | 2002-06-04 | Laser Gijutsu Sogo Kenkyusho | 薄膜アブレーション加工方法及び装置 |
JP2003313739A (ja) * | 2002-04-24 | 2003-11-06 | Oike Tec Co Ltd | スリット糸及びスリット糸の製造方法、並びに該スリット糸の製造に用いるレーザ裁断装置 |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
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JP2012227188A (ja) * | 2011-04-15 | 2012-11-15 | Kataoka Seisakusho:Kk | 薄膜太陽電池の製造方法、レーザ加工機 |
CN111571007A (zh) * | 2020-05-23 | 2020-08-25 | 松山湖材料实验室 | 优化激光加工质量的方法及其装置 |
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WO2011004509A1 (ja) | 2011-01-13 |
JP2011016135A (ja) | 2011-01-27 |
EP2452774A1 (en) | 2012-05-16 |
EP2452774A4 (en) | 2012-08-29 |
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