JP4525492B2 - Lighting device and liquid crystal display module - Google Patents

Lighting device and liquid crystal display module Download PDF

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JP4525492B2
JP4525492B2 JP2005191360A JP2005191360A JP4525492B2 JP 4525492 B2 JP4525492 B2 JP 4525492B2 JP 2005191360 A JP2005191360 A JP 2005191360A JP 2005191360 A JP2005191360 A JP 2005191360A JP 4525492 B2 JP4525492 B2 JP 4525492B2
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heat transfer
wiring pattern
lighting device
circuit board
drive circuit
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JP2007012416A (en
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明彦 井出
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Casio Computer Co Ltd
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Description

本発明は、照明装置及び液晶表示モジュールに関するものである。 The present invention relates to a lighting device and a liquid crystal display module .

従来、液晶表示装置等のフラットパネルディスプレイのバックライトとして、導光板の端面に光源を対向配置し、光源から射出され、対向端面から入射した光を導光板の一方の主面から面状に出射させるサイドライト型面状照明装置が用いられている。   Conventionally, as a backlight of a flat panel display such as a liquid crystal display device, a light source is opposed to the end face of the light guide plate, and light emitted from the light source and incident from the opposite end face is emitted in a planar shape from one main surface of the light guide plate. A sidelight type planar illumination device is used.

上述のような面状照明装置の光源として、発光ダイオード等の点光源が、低消費電力である等の利点から好適に用いられている。
特開平８−３１３９０２号公報 A point light source such as a light-emitting diode is preferably used as a light source for the above-described planar illumination device because of its low power consumption.
JP-A-8-313902

しかし、大型表示装置のバックライトとして上述した点光源によるサイドライト型面状照明装置を用いる場合、１個の点光源の射出光量は冷陰極管等の他の光源に比べて少ないため、相当の数の点光源を用いる必要がある。また一方、近年の表示装置に対する小型薄型化の要求に応ずるため、そのバックライトとして用いられる照明装置に対しても一段の小型薄型化が求められている。従って、発光ダイオード等の点光源を光源として複数個設置する場合、それらを高密度に実装する必要がある。   However, when the above-described side light type planar illumination device using a point light source is used as a backlight of a large display device, the amount of light emitted from one point light source is smaller than that of other light sources such as cold cathode tubes. It is necessary to use several point light sources. On the other hand, in order to meet the recent demand for smaller and thinner display devices, lighting devices used as backlights are required to be further reduced in size and thickness. Accordingly, when a plurality of point light sources such as light emitting diodes are installed as light sources, it is necessary to mount them at high density.

ところが、複数の点光源が高密度に実装された照明装置においては、個々の点光源の温度上昇が大きな問題となる。すなわち、点光源の温度が上昇すると、その寿命が低下するだけでなく、発光効率も低下する。特に、発光ダイオードにおいては、その傾向がより顕著に発現する。   However, in an illuminating device in which a plurality of point light sources are mounted at a high density, the temperature rise of each point light source becomes a big problem. That is, when the temperature of the point light source rises, not only its lifetime is reduced, but also the luminous efficiency is lowered. In particular, in the light emitting diode, the tendency appears more remarkably.

本発明の目的は、複数の点光源が高密度に実装されて小型薄型化が促進されると共に個々の点光源の温度上昇が有効に抑制されてその寿命及び発光効率の低下が防止された照明装置及び液晶表示モジュールを提供することである。 An object of the present invention is to provide lighting in which a plurality of point light sources are mounted at a high density to facilitate downsizing and thinning, and temperature rise of each point light source is effectively suppressed to prevent a decrease in lifetime and luminous efficiency. An apparatus and a liquid crystal display module are provided.

本発明の照明装置は、複数の点光源と、通電用配線パターンと第１の伝熱用配線パターンとが同一材料により表面に一括形成され、前記複数の点光源が前記通電用配線パターンに導通設置された駆動回路基板と、前記第１の伝熱用配線パターンに接触するように配置され、前記複数の点光源が発生させた熱を第１の所定部位に伝導する第１の伝熱部材と、を有することを特徴とするものである。
また、本発明の液晶表示モジュールは、液晶表示パネルに向けて光を照射する照明装置を備えた液晶表示モジュールであって、前記照明装置は、複数の点光源と、通電用配線パターンと第１の伝熱用配線パターンとが同一材料により表面に一括形成され、前記複数の点光源が前記通電用配線パターンに導通設置された駆動回路基板と、前記第１の伝熱用配線パターンに接触するように配置され、前記複数の点光源が発生させた熱を第１の所定部位に伝導する第１の伝熱部材と、を有することを特徴とするものである。 In the lighting device of the present invention, a plurality of point light sources, a current-carrying wiring pattern and a first heat-transfer wiring pattern are collectively formed on the surface with the same material, and the plurality of point light sources are electrically connected to the current-carrying wiring pattern. A first heat transfer member that is disposed in contact with the installed drive circuit board and the first heat transfer wiring pattern and conducts heat generated by the plurality of point light sources to a first predetermined portion. It is characterized by having.
The liquid crystal display module of the present invention is a liquid crystal display module including an illuminating device that emits light toward the liquid crystal display panel, and the illuminating device includes a plurality of point light sources, an energization wiring pattern, and a first wiring pattern. The heat transfer wiring pattern is collectively formed on the surface of the same material, and the plurality of point light sources are in contact with the first heat transfer wiring pattern and the drive circuit board electrically connected to the energization wiring pattern. And a first heat transfer member that conducts heat generated by the plurality of point light sources to a first predetermined portion.

本発明によれば、複数の点光源を高密度に実装したにも拘わらず個々の点光源の温度上昇が有効に抑制され、複数の点光源の寿命及び発光効率が高度に維持された照明装置及び液晶表示モジュールを提供することができる。 According to the present invention, despite the fact that a plurality of point light sources are mounted at a high density, the temperature rise of each point light source is effectively suppressed, and the life and luminous efficiency of the plurality of point light sources are highly maintained. In addition, a liquid crystal display module can be provided.

図１は本発明の一実施形態としての面状照明装置が搭載された液晶表示モジュールを示す模式的断面図、図２はその面状照明装置を示す平面図、図３（ａ）、（ｂ）はその面状照明装置の要部Ｑを示す部分断面図と部分斜視図で、（ｂ）は（ａ）におけるＱ1 部を示している。   FIG. 1 is a schematic cross-sectional view showing a liquid crystal display module equipped with a planar illumination device as an embodiment of the present invention, FIG. 2 is a plan view showing the planar illumination device, and FIGS. ) Is a partial cross-sectional view and a partial perspective view showing a main part Q of the surface illumination device, and (b) shows a Q1 portion in (a).

図１に示されるように、本液晶表示モジュールの筐体は、扁平な直方体をなす箱の天板を除去した形状の収納ケース１に、底板を除去した同形状のカバーケース２が、嵌装されてなる。これら両ケース１、２は、共に金属板を加工して形成されている。カバーケース２の天板２ａには、表示を観察するための表示窓２ｂが穿設されている。   As shown in FIG. 1, the housing of the present liquid crystal display module includes a storage case 1 having a shape obtained by removing a top plate of a flat rectangular parallelepiped box, and a cover case 2 having the same shape from which a bottom plate has been removed. Being done. Both of these cases 1 and 2 are formed by processing a metal plate. A display window 2b for observing the display is formed in the top plate 2a of the cover case 2.

上記筐体内には、メインフレーム３が配置されている。本実施形態のメインフレーム３は、共に扁平な略直方体をなす前室３ａと後室３ｂの２室の空間が２段に形成されてなる。すなわち、四角筒状の枠体をなす側板３ｃの所定高さ位置に、その内面全周にわたって仕切り棚３ｄが突設され、この仕切り棚３ｄを境界として、前室３ａと後室３ｂとが２段に重ねて形成され、これら前室３ａと後室３ｂは、仕切り棚３ｄで囲まれた空間により連通されている。   A main frame 3 is disposed in the casing. The main frame 3 of the present embodiment is formed by two spaces of a front chamber 3a and a rear chamber 3b that are both flat and substantially rectangular parallelepiped. That is, a partition shelf 3d protrudes from the side plate 3c forming a rectangular cylindrical frame at a predetermined height position over the entire inner surface of the side plate 3c, and the front chamber 3a and the rear chamber 3b are separated from each other by the partition shelf 3d as a boundary. The front chamber 3a and the rear chamber 3b are formed so as to overlap each other, and are communicated with each other by a space surrounded by a partition shelf 3d.

メインフレーム３の前室３ａには、液晶表示パネル４が収納されている。液晶表示パネル４は、電極（不図示）が形成された一対のガラス基板５、６を、それぞれの電極形成面を対向させて枠状シール材（不図示）により所定の間隙を保って接合し、枠状シール材で囲まれたガラス基板５、６間に液晶（不図示）を封入して、構成されている。ガラス基板５、６の液晶封入側とは反対側の各外面には、一対の前、後偏光板７、８がそれぞれ貼着されている。   A liquid crystal display panel 4 is accommodated in the front chamber 3 a of the main frame 3. The liquid crystal display panel 4 is formed by bonding a pair of glass substrates 5 and 6 on which electrodes (not shown) are formed with a predetermined gap therebetween by a frame-shaped sealing material (not shown) with the respective electrode formation surfaces facing each other. The liquid crystal (not shown) is sealed between the glass substrates 5 and 6 surrounded by the frame-shaped sealing material. A pair of front and rear polarizing plates 7 and 8 are attached to the outer surfaces of the glass substrates 5 and 6 opposite to the liquid crystal sealing side, respectively.

本例の液晶表示パネル４における一対のガラス基板５、６の大きさは、表示面側となる前側ガラス基板５よりも後側ガラス基板６の方が大きく、これら大きさの異なるガラス基板５、６は後側ガラス基板６の一縁辺が前側ガラス基板５の対応する縁辺から突出する配置で接合されている。後側ガラス基板６の突出縁辺６ａには、各電極から引き出された配線とその各端部の接続端子（不図示）が配設されて駆動回路部が形成されており、これら駆動回路部には駆動回路素子としてのドライバＬＳＩ９がＣＯＧ（Chip On Glass）搭載されている。そして、この駆動回路部の入力端子エリアには、フレキシブル配線基板（ＦＰＣ：Flexible Printed Circuit）１０が導通接合されている。   The size of the pair of glass substrates 5 and 6 in the liquid crystal display panel 4 of this example is larger in the rear glass substrate 6 than in the front glass substrate 5 on the display surface side. 6 is joined in such an arrangement that one edge of the rear glass substrate 6 protrudes from a corresponding edge of the front glass substrate 5. On the protruding edge 6a of the rear glass substrate 6, wirings drawn from the respective electrodes and connection terminals (not shown) at respective ends thereof are arranged to form driving circuit portions. A driver LSI 9 as a drive circuit element is mounted on COG (Chip On Glass). A flexible printed circuit (FPC) 10 is conductively joined to the input terminal area of the drive circuit section.

メインフレーム３の後室３ｂ内には、サイドライト型の面状照明装置１１が収容されている。このサイドライト型面状照明装置１１は、外形が照射対象の液晶表示パネル４に大略対応した矩形をなす導光板１２を備えている。導光板１２は、端面を光入射面とし主面の一方を光出射面として、端面から入射させた光をその一方の主面から面状に出射させる透明な板である。本実施形態の導光板１２は、アクリル樹脂等の透明な樹脂材料を用いて型成形により形成され、長手方向の両端面１２ａ、１２ａ（図２参照）をそれぞれ光入射面とし、光出射面とする前面１２ｂの反対側の後面１２ｃは、入射した導光板１２内の伝播光を光出射面（前面）１２ｂに向けて反射させるために微細な凹凸面に形成されている。   In the rear chamber 3b of the main frame 3, a sidelight type planar illumination device 11 is accommodated. The sidelight type planar illumination device 11 includes a light guide plate 12 whose outer shape forms a rectangle substantially corresponding to the liquid crystal display panel 4 to be irradiated. The light guide plate 12 is a transparent plate that emits light incident from the end surface in a planar shape from the one main surface with the end surface as a light incident surface and one of the main surfaces as a light output surface. The light guide plate 12 of the present embodiment is formed by molding using a transparent resin material such as acrylic resin, and both end surfaces 12a and 12a (see FIG. 2) in the longitudinal direction are respectively light incident surfaces, The rear surface 12c opposite to the front surface 12b is formed with a fine uneven surface so as to reflect the incident propagation light in the light guide plate 12 toward the light emitting surface (front surface) 12b.

図２に示されるように、導光板１２の長手方向両端面（光入射面）１２ａ、１２ａに沿って、それぞれ、点光源としての発光ダイオード（以下、ＬＥＤ（Light-Emitting Diode）という）１３が、本例では１２個づつ対向配置されている。これら１２個づつのＬＥＤ１３は、それぞれ、ＰＣＢ（Printed-Circuit Board）１４、１４上に等間隔で直接搭載されている。なお、本実施形態の液晶表示モジュールでは、液晶表示パネル４の大きさが６．４インチ（対角距離：約１６３ｍｍ）の表示画面に向けて、２４個のＬＥＤ１３を約０．９Ｗの出力で点灯させて得られる面状光を照射する。   As shown in FIG. 2, light emitting diodes (hereinafter referred to as LED (Light-Emitting Diode)) 13 as point light sources are respectively provided along both longitudinal end surfaces (light incident surfaces) 12 a and 12 a of the light guide plate 12. In this example, twelve of them are arranged facing each other. These 12 LEDs 13 are directly mounted on PCBs (Printed-Circuit Boards) 14 and 14 at equal intervals, respectively. In the liquid crystal display module of the present embodiment, 24 LEDs 13 are output at about 0.9 W toward a display screen having a liquid crystal display panel 4 size of 6.4 inches (diagonal distance: about 163 mm). Irradiate with planar light obtained by lighting.

ＰＣＢ１４には、図３（ａ）、（ｂ）に示されるように、銅パターン１４ａが形成されている。この銅パターン１４ａは、搭載されている各ＬＥＤ１３に対する通電用の配線（不図示）とは別に設けられた伝熱用の伝熱専用銅パターンであり、ＰＣＢ１４の表裏両面に通電用の銅パターン（不図示）と同一工程で一括形成されている。ＰＣＢ表裏両面に形成された伝熱用銅パターン１４ａは、スルーホール１４ｂの内面に被着形成された銅層により連通接続されている。そして、表側銅パターン１４ａには、他の部分よりも幅広の接触部１４ｃが、各ＬＥＤ１３間にそれぞれ形成されている。また、各駆動回路基板１４には、それぞれ、給電用のリード線１４ｄ、１４ｄ（図２参照）が導通接続されている。   As shown in FIGS. 3A and 3B, a copper pattern 14 a is formed on the PCB 14. This copper pattern 14a is a heat transfer dedicated copper pattern provided separately from the power supply wiring (not shown) for each LED 13 mounted, and the power supply copper pattern (on both sides of the PCB 14) (Not shown) are formed in the same process. The heat transfer copper patterns 14a formed on both the front and back sides of the PCB are connected in communication by a copper layer deposited on the inner surface of the through hole 14b. And in the front side copper pattern 14a, the contact part 14c wider than another part is formed between each LED13, respectively. In addition, power supply lead wires 14d and 14d (see FIG. 2) are conductively connected to each drive circuit board 14, respectively.

図１に戻って、導光板１２の後面１２ｂには光反射シート１５が装着されている。この光反射シート１５は、微小な凹凸面に形成された後面１２ｂで反射されずに外部に出射した光を反射して導光板１２内に再入射させるために設けられており、これにより、ＬＥＤ１３からの射出光の利用効率が格段に高められる。   Returning to FIG. 1, a light reflecting sheet 15 is mounted on the rear surface 12 b of the light guide plate 12. The light reflecting sheet 15 is provided to reflect the light emitted to the outside without being reflected by the rear surface 12b formed on the minute uneven surface, and to re-enter the light guide plate 12, whereby the LED 13 The usage efficiency of the light emitted from is greatly improved.

そして、図２に示されるように、上述した複数のＬＥＤ１３が搭載された一対のＰＣＢ１４、１４と後面１２ｃに光反射シート１５（図１参照）が装着された導光板１２は、ライトフレーム１６内の所定位置に設置されている。ライトフレーム１６は本発明の第２の伝熱部材となるもので、熱伝導性に富む板金材を加工して形成されており、収容する導光板１２の長手方向両端面（光入射面）１２ａ、１２ａに対応する各側部には、一対の側板１６ａ、１６ａが底板１６ｂ（図１参照）に対し垂直に立設されている。   As shown in FIG. 2, the light guide plate 12 having the light reflecting sheet 15 (see FIG. 1) attached to the pair of PCBs 14, 14 on which the plurality of LEDs 13 described above are mounted and the rear surface 12 c is provided inside the light frame 16. It is installed at a predetermined position. The light frame 16 serves as a second heat transfer member of the present invention, is formed by processing a sheet metal material rich in thermal conductivity, and both longitudinal end surfaces (light incident surfaces) 12a of the light guide plate 12 to be accommodated. , 12a, a pair of side plates 16a, 16a are erected vertically to the bottom plate 16b (see FIG. 1).

ＬＥＤ１３が搭載された一対のＰＣＢ１４、１４は、それぞれ、上記側板１６ａと押え板１７により挟持された状態でライトフレーム１６内に設置されている。この押え板１７は、本発明の第１の伝熱部材となるもので、ライトフレーム１６と同様に熱伝導性に富む板金材を加工してなり、図３（ａ）に示されるように、その一方の端部には、断面がＬ字形をなす複数の押圧片１７ａがＬＥＤ１３間隙に対応させて櫛歯状に延出形成されている。この各Ｌ字押圧片１７ａをＬＥＤ１３間のＰＣＢ１４表面に接触させ、ＰＣＢ１４裏面を側板１５ａに接触させている。この場合、各Ｌ字押圧片１７ａは、ＰＣＢ１４表面に配設されている銅パターン１４ａのうち、ＬＥＤ１３間の幅広に形成された接触部１４ｃと広い面積にわたり密接している。従って、ＬＥＤ１３が発生させた熱は、熱伝導率の高い銅パターン１４ａとＬ字押圧片１７ａとを広い面積で密接させて構成された伝熱経路を通じて速やかに押え板１７の他端側に伝播される。   The pair of PCBs 14 and 14 on which the LEDs 13 are mounted are installed in the light frame 16 while being sandwiched between the side plate 16 a and the presser plate 17. This presser plate 17 serves as a first heat transfer member of the present invention, and is formed by processing a sheet metal material rich in thermal conductivity like the light frame 16, and as shown in FIG. At one end thereof, a plurality of pressing pieces 17a having an L-shaped cross section are formed to extend in a comb shape corresponding to the gaps of the LEDs 13. Each L-shaped pressing piece 17a is in contact with the surface of the PCB 14 between the LEDs 13, and the back surface of the PCB 14 is in contact with the side plate 15a. In this case, each L-shaped pressing piece 17a is in close contact with a wide area of the contact portion 14c formed wide between the LEDs 13 in the copper pattern 14a disposed on the surface of the PCB 14. Therefore, the heat generated by the LED 13 quickly propagates to the other end of the presser plate 17 through a heat transfer path formed by bringing the copper pattern 14a having high thermal conductivity and the L-shaped pressing piece 17a into close contact with each other over a wide area. Is done.

各押え板１７の他端側は、それぞれ、図１に示されるように、メインフレーム３の貫通穴を通してメインフレーム３その外側に延出され、フレーム側板３ｃの外面に沿って折曲されている。これら折曲端部１７ｂは、シールドケース２を収納ケース１に嵌装した状態において、シールドケース側板２ｃの内面にそれぞれ密接している。これにより、各押え板１７の折曲端部１７ｂまで伝播した熱が、熱伝導性に富むシールドケース２を通じて液晶表示モジュール外部へ速やかに放散される。   As shown in FIG. 1, the other end side of each presser plate 17 extends through the through hole of the main frame 3 to the outside of the main frame 3 and is bent along the outer surface of the frame side plate 3c. . These bent end portions 17b are in close contact with the inner surface of the shield case side plate 2c in a state where the shield case 2 is fitted in the storage case 1. Thereby, the heat propagated to the bent end portion 17b of each presser plate 17 is quickly dissipated to the outside of the liquid crystal display module through the shield case 2 rich in thermal conductivity.

導光板１２の前面１２ｂには、光拡散シート１８とプリズムシート１９の２枚の光学シートが、この順序で重畳設置されている。光拡散シート１８は導光板１２から面状に出射される照射光の輝度分布を均一化するために、プリズムシート１９は照射光の出射方向を正面方向に揃えるために、それぞれ設置されている。   On the front surface 12b of the light guide plate 12, two optical sheets, a light diffusion sheet 18 and a prism sheet 19, are superposed in this order. The light diffusion sheet 18 is installed in order to make the luminance distribution of the irradiation light emitted from the light guide plate 12 planar, and the prism sheet 19 is installed to align the emission direction of the irradiation light in the front direction.

上述のように構成されたサイドライト型面状照明装置１１は、そのライトフレーム１６が後室３ｂの底を閉じる配置でメインフレーム３に嵌合装着され、後室３ｂ内の所定位置に収納保持されている。   The side light type planar lighting device 11 configured as described above is fitted and mounted to the main frame 3 so that the light frame 16 closes the bottom of the rear chamber 3b, and is stored and held at a predetermined position in the rear chamber 3b. Has been.

このサイドライト型面状照明装置１１においては、２４個のＬＥＤ１３から射出された光が、導光板１２内にその対向する端面（光入射面）１２ａから入射し、この入射光が微小な凹凸が形成された後面１２ｂに入射すると、ここで前面（光出射面）１２ａに向けて全反射され、前面１２ａから面状に出射される。前面１２ａから出射された面状照射光は、光拡散シート１８とプリズムシート１９を透過することにより、輝度分布が略均一で正面方向の輝度が高い面状光となって液晶表示パネル４に照射される。   In the sidelight type planar illumination device 11, light emitted from the 24 LEDs 13 enters the light guide plate 12 from its opposite end surface (light incident surface) 12a, and the incident light has minute unevenness. When incident on the formed rear surface 12b, the light is totally reflected toward the front surface (light emitting surface) 12a and emitted from the front surface 12a in a planar shape. The planar irradiation light emitted from the front surface 12a is transmitted through the light diffusion sheet 18 and the prism sheet 19, and is irradiated to the liquid crystal display panel 4 as planar light having a substantially uniform luminance distribution and high luminance in the front direction. Is done.

ライトフレーム１６の後面側で収納ケース１における底板１ａの内面に、駆動制御回路基板２０が設置されている。この駆動制御回路基板２０は、本液晶表示モジュール全体の駆動を制御するものであり、従って、前述した液晶表示パネル４のガラス基板６端部に導通接合されたフレキシブル配線基板１０やＬＥＤ１３が搭載されたＰＣＢ１４から引き出されたリード線１４ｄが、導通接続されている。   On the rear side of the light frame 16, the drive control circuit board 20 is installed on the inner surface of the bottom plate 1 a in the storage case 1. The drive control circuit board 20 controls the driving of the entire liquid crystal display module. Accordingly, the flexible wiring board 10 and the LEDs 13 that are conductively bonded to the end of the glass substrate 6 of the liquid crystal display panel 4 are mounted. The lead wire 14d drawn out from the PCB 14 is conductively connected.

ここで、上記液晶表示モジュールにおいてＬＥＤ１３から発生する熱の放散作用について、詳細に説明する。   Here, the heat dissipation action generated from the LED 13 in the liquid crystal display module will be described in detail.

各ＰＣＢ１４に搭載されている１２個のＬＥＤ１３を点灯させることにより発せられた熱は、主に表面の銅パターン１４ａからこれに接触させた第１の伝熱部材である押え板１７のＬ字押圧片１７ａを経て押え板１７のメインフレーム３外に延出させた他端側の折曲端部１７ｂに伝わり、この折曲端部１７ｂに密接するシールドケース側板２ｃに伝わってモジュール外に放散される。この第１の伝熱部材を介する放熱経路は、熱伝導性に優れた銅や板金材を互いに密接させて形成され、且つ銅パターン１４ａとＬ字押圧片１７ａの接触面積が幅広の接触部１４ｃを形成することにより大きく確保されているから、速やかな放熱効果を奏することができる。   The heat generated by turning on the twelve LEDs 13 mounted on each PCB 14 is mainly L-shaped pressing of the presser plate 17 which is the first heat transfer member brought into contact with the copper pattern 14a on the surface. It is transmitted to the bent end portion 17b on the other end side that extends outside the main frame 3 of the presser plate 17 through the piece 17a, is transmitted to the shield case side plate 2c that is in close contact with the bent end portion 17b, and is dissipated out of the module. The The heat dissipation path through the first heat transfer member is formed by bringing copper or sheet metal material having excellent thermal conductivity into close contact with each other, and the contact area 14c having a wide contact area between the copper pattern 14a and the L-shaped pressing piece 17a. Since it is ensured largely by forming, a rapid heat dissipation effect can be produced.

また、ＬＥＤ１３から発せられた熱は、ＰＣＢ表面の銅パターン１４ａからスルーホール１４ｂの銅層を経て裏面の銅パターン１４ａに伝わり、この裏面側に伝わった熱は、ＰＣＢ１４裏面の銅パターン１４ａに密接する第２伝熱部材としてのライトフレーム側板１６ａを経て底板１６ｂに伝わり、ここから収納ケース１内の空間中に放散される。この第２の伝熱部材を介する放熱経路も、熱伝導性に優れた銅や板金材を互いに密接させて形成されているので、速やかな放熱効果が奏される。   The heat generated from the LED 13 is transferred from the copper pattern 14a on the PCB to the copper pattern 14a on the back surface through the copper layer of the through hole 14b, and the heat transferred to the back surface is in close contact with the copper pattern 14a on the back surface of the PCB 14. The light is transmitted to the bottom plate 16b through the light frame side plate 16a as the second heat transfer member, and is diffused into the space in the storage case 1 from here. Since the heat dissipation path via the second heat transfer member is also formed by bringing copper or sheet metal material excellent in thermal conductivity into close contact with each other, a rapid heat dissipation effect is achieved.

以上のように、本実施形態の液晶表示モジュールに用いられている照明装置１１は、複数のＬＥＤ１３が高密度に搭載された駆動回路基板１４を第１伝熱部材である押え板１７と第２の伝熱部材であるライトフレーム１６で挟持し、これら伝熱部材１６、１７を介してＬＥＤ１３が発生させた熱を照明装置１１外に速やかに放散させる構成としたから、複数のＬＥＤ１３が高密度に実装されて小型薄型化が促進されると共に個々のＬＥＤ１３の温度上昇が顕著に抑制されてその寿命及び発光効率が高度に維持される。   As described above, the illuminating device 11 used in the liquid crystal display module of the present embodiment has the drive circuit board 14 on which the plurality of LEDs 13 are mounted at a high density, the presser plate 17 that is the first heat transfer member, and the second heat transfer member. The heat transfer member 16 is sandwiched between the light frames 16 and the heat generated by the LEDs 13 via the heat transfer members 16 and 17 is quickly dissipated to the outside of the lighting device 11. As a result, it is possible to reduce the size and thickness of the LED 13 and to suppress the temperature rise of the individual LEDs 13 and maintain the lifetime and the luminous efficiency at a high level.

また、第２の伝熱部材が導光板１２を収容保持するライトフレーム１６を兼ねることにより構造が簡素化されると共に部品点数が低減され、且つ、熱伝導性に優れた高価な材質の駆動回路基板を使用しなくても上述した所望の放熱効果が得られるから、照明装置のコストが大幅に低減される。   The second heat transfer member also serves as the light frame 16 that houses and holds the light guide plate 12, thereby simplifying the structure, reducing the number of components, and driving circuit made of an expensive material having excellent thermal conductivity. Since the desired heat dissipation effect described above can be obtained without using a substrate, the cost of the lighting device is greatly reduced.

その結果、本実施形態の照明装置が適用された液晶表示モジュールによれば、小型薄型化と低コスト化が促進されるだけでなく、バックライトとしての照明装置の寿命及び発光効率が高度に維持されるために充分に明るい表示を長期にわたって得ることができる。   As a result, according to the liquid crystal display module to which the illumination device of the present embodiment is applied, not only the reduction in size and thickness and the cost reduction are promoted, but also the lifetime and luminous efficiency of the illumination device as a backlight are maintained at a high level. Therefore, a sufficiently bright display can be obtained for a long time.

次に、上記実施形態の変形例について、図４（ａ）、（ｂ）に基づき説明する。なお、上記実施形態と同一の構成要素については同一の符号を付して、その説明を省略する。   Next, a modification of the above embodiment will be described with reference to FIGS. 4 (a) and 4 (b). In addition, the same code | symbol is attached | subjected about the component same as the said embodiment, and the description is abbreviate | omitted.

本変形例は、ＬＥＤ１３の温度上昇を、ＬＥＤ１３に通電することにより発生する熱を速やかに放散させるだけでなく、ＬＥＤ１３の雰囲気温度の上昇を抑制することによっても、防止することを企図したものである。   This modification is intended to prevent the temperature increase of the LED 13 not only by quickly dissipating the heat generated by energizing the LED 13 but also by suppressing the increase in the ambient temperature of the LED 13. is there.

すなわち、図４（ａ）に示されるように、本変形例における第１の伝熱部材としての押え板４１は、ＬＥＤ１３が搭載された駆動回路基板１４をライトフレーム側板１６ａとで挟持するための押圧片４１ａと、導光板１２の前面１２ｂの端部を係止するための係合片４１ｂを備えている。   That is, as shown in FIG. 4A, the presser plate 41 as the first heat transfer member in the present modification is for holding the drive circuit board 14 on which the LED 13 is mounted between the light frame side plate 16a. The pressing piece 41a and the engaging piece 41b for latching the edge part of the front surface 12b of the light-guide plate 12 are provided.

押え板４１は熱伝導性に優れた板金材を加工して形成されており、図３（ｂ）に示されるように、その隣設ＬＥＤ１３間の間隙に対応する部分が櫛歯状に直角に折曲されて押圧片４１ａが形成され、これら押圧片４１ａの間の部分が折曲されずに延出されて、係合片４１ｂが形成されている。すなわち、押圧片４１ａと係合片４１ｂが交互に形成されている。そして、係合片４１ｂのＬＥＤ１３側に向ける内面４１ｃは、鏡面に仕上げ処理されている。   The holding plate 41 is formed by processing a sheet metal material having excellent thermal conductivity, and as shown in FIG. 3B, the portion corresponding to the gap between the adjacent LEDs 13 is perpendicular to the comb teeth. The pressing piece 41a is formed by being bent, and the portion between the pressing pieces 41a is extended without being bent to form the engaging piece 41b. That is, the pressing pieces 41a and the engaging pieces 41b are alternately formed. The inner surface 41c of the engagement piece 41b facing the LED 13 is finished to a mirror surface.

上述のように形成された押え板４１は、押圧片４１ａをＬＥＤ１３間のＰＣＢ１４表面に接触させてＰＣＢ１４裏面を側板１５ａに密接させ、係合片４１ｂを導光板１２における前面１２ｂの光入射側端部に圧接係合させた状態で、メインフレーム３に装着されている。この場合上記実施形態と同様に、押え板４１のメインフレーム３外に延出された端部がフレーム側板３ｃの外面に沿って折曲され、シールドケース側板２ｃの内面に密接させる折曲端部４１ｃが形成されている。   The presser plate 41 formed as described above has the pressing piece 41a in contact with the surface of the PCB 14 between the LEDs 13 to bring the back surface of the PCB 14 into close contact with the side plate 15a, and the engaging piece 41b on the light incident side end of the front surface 12b of the light guide plate 12. It is mounted on the main frame 3 in a state where it is press-fitted to the part. In this case, similarly to the above-described embodiment, the end portion of the presser plate 41 extending outside the main frame 3 is bent along the outer surface of the frame side plate 3c and is in close contact with the inner surface of the shield case side plate 2c. 41c is formed.

以上のように構成された本変形例においては、各ＬＥＤ１３本体の熱は、上記実施形態と同様に、第１の伝熱部材である押え板４１を介する第１の放熱経路と第２の伝熱部材であるライトフレーム１６を介する第２の放熱経路を通じて速やかに放散され、且つ、導光板１２に蓄積するＬＥＤ１３からの輻射熱等は、前記押え板４１の係合片４１ｂを介する第１の放熱経路を通じて放散される。これにより、各ＬＥＤ１３の温度上昇が、各ＬＥＤ１３の雰囲気温度の上昇が有効に防止されことも相俟って、より顕著に抑制される。   In the present modified example configured as described above, the heat of each LED 13 main body is the same as that of the above-described embodiment in that the first heat dissipation path and the second heat transfer path through the presser plate 41 that is the first heat transfer member. The radiant heat from the LED 13 that is quickly dissipated through the second heat dissipation path via the light frame 16 that is a heat member and accumulates in the light guide plate 12 is the first heat dissipation via the engagement piece 41b of the presser plate 41. Dissipated through the route. Thereby, the temperature rise of each LED13 is suppressed more notably, coupled with the fact that the increase in the ambient temperature of each LED13 is effectively prevented.

また、押え板４１の係合片４１ｂを導光板１２における前面（光出射面）１２ｂの光入射側端部に圧接係合させたから、この部分から光が出射して漏れ光や迷光が発生する不具合が防止され、且つ、その係合片４１ｂの内面４１ｃを鏡面に形成したから、この内面４１ｃで各ＬＥＤ１３からの射出光を鏡面反射させて光の利用効率を上げることができる。   Further, since the engaging piece 41b of the presser plate 41 is press-engaged with the light incident side end portion of the front surface (light emitting surface) 12b of the light guide plate 12, light is emitted from this portion, and leakage light or stray light is generated. Problems are prevented, and the inner surface 41c of the engaging piece 41b is formed as a mirror surface. Therefore, the light emission efficiency from each LED 13 can be mirror-reflected by the inner surface 41c and the light utilization efficiency can be increased.

その結果、本変形例の照明装置が適用された液晶表示モジュールは、小型薄型化と低コスト化が促進されるだけでなく、バックライトとしての照明装置の寿命及び発光効率がより高度に維持され、且つ、漏れ光や迷光の発生が防止されると共に光の利用効率が高められるために高品位で明るい表示を長期にわたり実現することができる。   As a result, the liquid crystal display module to which the illumination device of the present modification is applied not only promotes downsizing and thinning and cost reduction, but also maintains the lifetime and luminous efficiency of the illumination device as a backlight to a higher level. In addition, the occurrence of leakage light and stray light is prevented and the light use efficiency is enhanced, so that high-quality and bright display can be realized over a long period of time.

なお、本発明は、上記実施形態に限定されるものではない。
例えば、本発明は上記実施形態の照明装置のように導光板を用いたサイドライト形面状照明装置に限らず、導光板を用いないで多数のＬＥＤをＰＣＢに高密度実装しただけの構成で、ＬＥＤからの射出光をそのまま照射光とするカード型照明装置等、複数の点光源を基板に高密度実装してなる他の種々の照明装置に広く適用可能である。 The present invention is not limited to the above embodiment.
For example, the present invention is not limited to the sidelight type planar illumination device using the light guide plate as in the illumination device of the above embodiment, but has a configuration in which a large number of LEDs are simply mounted on the PCB without using the light guide plate. The present invention can be widely applied to various other illumination devices in which a plurality of point light sources are mounted with high density on a substrate, such as a card-type illumination device that directly uses light emitted from an LED as irradiation light.

また、点光源としてＬＥＤを用いる照明装置に限らず、電球等の他の点光源を用いる照明装置にも、本発明を適用できることは、勿論である。   Of course, the present invention can be applied not only to lighting devices that use LEDs as point light sources, but also to lighting devices that use other point light sources such as light bulbs.

本発明の一実施形態としての面状照明装置が適用された液晶表示モジュールを示す模式的断面図である。It is typical sectional drawing which shows the liquid crystal display module to which the planar illuminating device as one Embodiment of this invention was applied. 上記液晶表示モジュールにおける面状照明装置を示す平面図である。It is a top view which shows the planar illuminating device in the said liquid crystal display module. （ａ）は上記面状照明装置の要部Ｑを示す斜視図で、（ｂ）はそのＱ1 部を示す模式的断面図である。(A) is a perspective view which shows the principal part Q of the said planar illuminating device, (b) is typical sectional drawing which shows the Q1 part. （ａ）は上記実施形態の変形例における要部を示す斜視図で、（ｂ）はその内の押え板を示す模式的断面図である。(A) is a perspective view which shows the principal part in the modification of the said embodiment, (b) is typical sectional drawing which shows the press plate in it.

符号の説明Explanation of symbols

１ 収納ケース
２ カバーケース
３ フレーム
４ 液晶表示パネル
５、６ ガラス基板
７、８ 前、後偏光板
９ 駆動回路素子
１０ フレキシブル配線基板
１１ 面状照明装置
１２ 導光板
１３ ＬＥＤ（Light-Emitted Diode）
１４ ＰＣＢ（Printed-Circuit Board）
１５ 光反射シート
１６ ライトフレーム
１７、４１ 押え板
２０ 電子回路基板 DESCRIPTION OF SYMBOLS 1 Storage case 2 Cover case 3 Frame 4 Liquid crystal display panel 5 and 6 Glass substrate 7 and 8 Front and back polarizing plate 9 Drive circuit element 10 Flexible wiring board 11 Planar illumination device 12 Light guide plate 13 LED (Light-Emitted Diode)
14 PCB (Printed-Circuit Board)
15 Light reflection sheet 16 Light frame 17, 41 Press plate 20 Electronic circuit board

Claims (11)

複数の点光源と、
通電用配線パターンと第１の伝熱用配線パターンとが同一材料により表面に一括形成され、前記複数の点光源が前記通電用配線パターンに導通設置された駆動回路基板と、
前記第１の伝熱用配線パターンに接触するように配置され、前記複数の点光源が発生させた熱を第１の所定部位に伝導する第１の伝熱部材と、
を有することを特徴とする照明装置。 Multiple point sources,
A drive circuit board in which the energization wiring pattern and the first heat transfer wiring pattern are collectively formed on the surface of the same material, and the plurality of point light sources are conductively installed on the energization wiring pattern;
A first heat transfer member disposed to contact the first heat transfer wiring pattern and conducting heat generated by the plurality of point light sources to a first predetermined portion;
A lighting device comprising: 前記複数の点光源が発生させた熱を第２の所定部位に伝導する第２の伝熱部材を有し、
前記駆動回路基板は、裏面に第２の伝熱用配線パターンが形成され、
前記第２の伝熱部材は、前記第２の伝熱用配線パターンに接触するように配置されていることを特徴とする請求項１に記載の照明装置。 A second heat transfer member that conducts heat generated by the plurality of point light sources to a second predetermined portion;
The drive circuit board has a second heat transfer wiring pattern formed on the back surface,
The lighting device according to claim 1, wherein the second heat transfer member is disposed so as to be in contact with the second heat transfer wiring pattern. 前記駆動回路基板は、該駆動回路基板の表面と該駆動回路基板の裏面との間を連通させるスルーホールが形成され、
前記第１の伝熱用配線パターンと前記第２の伝熱用配線パターンは、スルーホールを介して接続されていることを特徴とする請求項２に記載の照明装置。 The drive circuit board is formed with a through hole that allows communication between the front surface of the drive circuit board and the back surface of the drive circuit board.
The lighting device according to claim 2, wherein the first heat transfer wiring pattern and the second heat transfer wiring pattern are connected through a through hole. 前記駆動回路基板は、前記第１の伝熱部材と前記第２の伝熱部材とにより挟持されるように配置されていることを特徴とする請求項２または３に記載の照明装置。   4. The lighting device according to claim 2, wherein the drive circuit board is disposed so as to be sandwiched between the first heat transfer member and the second heat transfer member. 5. 前記第１の伝熱用配線パターンは、隣接する２つの前記点光源間に配置された第１の領域と前記点光源に覆われた第２の領域とを有しているとともに、前記第１の領域の配線幅が前記第２の領域の配線幅よりも広く形成され、
前記第１の伝熱部材は、前記第１の領域で前記第１の伝熱用配線パターンに接触するように配置されていることを特徴とする請求項１から４の何れかに記載の照明装置。 The first heat transfer wiring pattern includes a first region disposed between two adjacent point light sources and a second region covered with the point light sources, and the first region. The wiring width of the region is formed wider than the wiring width of the second region,
5. The illumination according to claim 1, wherein the first heat transfer member is disposed in contact with the first heat transfer wiring pattern in the first region. 6. apparatus. 前記複数の点光源から射出された光を端面から入射させ一方の主面から面状に出射させる導光板を有し、
前記第２の伝熱部材は、前記導光板、前記複数の点光源及び前記駆動回路基板を収納するケース部材であることを特徴とする請求項２から４の何れかに記載の照明装置。 A light guide plate that allows light emitted from the plurality of point light sources to be incident from an end surface and to be emitted in a planar shape from one main surface;
5. The lighting device according to claim 2, wherein the second heat transfer member is a case member that houses the light guide plate, the plurality of point light sources, and the drive circuit board. 前記駆動回路基板は、該駆動回路基板の表面が前記導光板の前記端面に対して平行になるように配置されていることを特徴とする請求項６に記載の照明装置。   The lighting device according to claim 6, wherein the drive circuit board is disposed such that a surface of the drive circuit board is parallel to the end face of the light guide plate. 前記第１の伝熱部材または前記第２の伝熱部材が金属からなることを特徴とする請求項２から４の何れかに記載の照明装置。 The lighting device according to claim 2, wherein the first heat transfer member or the second heat transfer member is made of metal. 前記通電用配線パターンと前記第１の伝熱用配線パターンとが銅からなることを特徴とする請求項１から８の何れかに記載の照明装置。   The lighting device according to claim 1, wherein the energization wiring pattern and the first heat transfer wiring pattern are made of copper. 前記点光源は発光ダイオードであることを特徴とする請求項１から９の何れかに記載の照明装置。   The lighting device according to claim 1, wherein the point light source is a light emitting diode. 液晶表示パネルに向けて光を照射する照明装置を備えた液晶表示モジュールであって、
前記照明装置は、
複数の点光源と、
通電用配線パターンと第１の伝熱用配線パターンとが同一材料により表面に一括形成され、前記複数の点光源が前記通電用配線パターンに導通設置された駆動回路基板と、
前記第１の伝熱用配線パターンに接触するように配置され、前記複数の点光源が発生させた熱を第１の所定部位に伝導する第１の伝熱部材と、
を有することを特徴とする液晶表示モジュール。 A liquid crystal display module including an illumination device that emits light toward a liquid crystal display panel,
The lighting device includes:
Multiple point sources,
A drive circuit board in which the energization wiring pattern and the first heat transfer wiring pattern are collectively formed on the surface of the same material, and the plurality of point light sources are conductively installed on the energization wiring pattern;
A first heat transfer member disposed to contact the first heat transfer wiring pattern and conducting heat generated by the plurality of point light sources to a first predetermined portion;
A liquid crystal display module comprising:
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