JP4509152B2 - 薄膜圧電トランスおよびその製造方法 - Google Patents
薄膜圧電トランスおよびその製造方法 Download PDFInfo
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- JP4509152B2 JP4509152B2 JP2007221487A JP2007221487A JP4509152B2 JP 4509152 B2 JP4509152 B2 JP 4509152B2 JP 2007221487 A JP2007221487 A JP 2007221487A JP 2007221487 A JP2007221487 A JP 2007221487A JP 4509152 B2 JP4509152 B2 JP 4509152B2
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- Prior art keywords
- piezoelectric
- piezoelectric transformer
- silicon
- piezoelectric vibrator
- thin film
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- Expired - Fee Related
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- 239000010409 thin film Substances 0.000 title claims description 22
- 238000004519 manufacturing process Methods 0.000 title claims description 16
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims description 55
- 229910052710 silicon Inorganic materials 0.000 claims description 54
- 239000010703 silicon Substances 0.000 claims description 54
- 230000002093 peripheral effect Effects 0.000 claims description 31
- 239000000758 substrate Substances 0.000 claims description 27
- 238000007789 sealing Methods 0.000 claims description 21
- 238000000151 deposition Methods 0.000 claims description 2
- 229910052451 lead zirconate titanate Inorganic materials 0.000 claims 3
- HFGPZNIAWCZYJU-UHFFFAOYSA-N lead zirconate titanate Chemical compound [O-2].[O-2].[O-2].[O-2].[O-2].[Ti+4].[Zr+4].[Pb+2] HFGPZNIAWCZYJU-UHFFFAOYSA-N 0.000 claims 1
- 238000000034 method Methods 0.000 description 20
- 238000000605 extraction Methods 0.000 description 15
- 229920005989 resin Polymers 0.000 description 14
- 239000011347 resin Substances 0.000 description 14
- 239000010408 film Substances 0.000 description 11
- 238000005530 etching Methods 0.000 description 10
- 239000011521 glass Substances 0.000 description 10
- 229910004298 SiO 2 Inorganic materials 0.000 description 9
- 238000000206 photolithography Methods 0.000 description 9
- KRHYYFGTRYWZRS-UHFFFAOYSA-N Fluorane Chemical compound F KRHYYFGTRYWZRS-UHFFFAOYSA-N 0.000 description 8
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Substances [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 description 7
- 230000010287 polarization Effects 0.000 description 7
- 239000010936 titanium Substances 0.000 description 7
- 238000009616 inductively coupled plasma Methods 0.000 description 5
- 239000003566 sealing material Substances 0.000 description 5
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 4
- 229910052782 aluminium Inorganic materials 0.000 description 4
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 4
- 238000001312 dry etching Methods 0.000 description 4
- 229910052751 metal Inorganic materials 0.000 description 4
- 239000002184 metal Substances 0.000 description 4
- 229920002120 photoresistant polymer Polymers 0.000 description 4
- 229910052697 platinum Inorganic materials 0.000 description 4
- 229910052719 titanium Inorganic materials 0.000 description 4
- 230000008901 benefit Effects 0.000 description 3
- 239000000945 filler Substances 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- 238000000059 patterning Methods 0.000 description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 2
- 239000000919 ceramic Substances 0.000 description 2
- 238000006243 chemical reaction Methods 0.000 description 2
- 239000004020 conductor Substances 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 239000011162 core material Substances 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 238000001035 drying Methods 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 239000003822 epoxy resin Substances 0.000 description 2
- 229910052759 nickel Inorganic materials 0.000 description 2
- 230000000149 penetrating effect Effects 0.000 description 2
- 239000004033 plastic Substances 0.000 description 2
- 229920000647 polyepoxide Polymers 0.000 description 2
- 238000004151 rapid thermal annealing Methods 0.000 description 2
- 238000003980 solgel method Methods 0.000 description 2
- 238000004528 spin coating Methods 0.000 description 2
- 238000003786 synthesis reaction Methods 0.000 description 2
- 229910052718 tin Inorganic materials 0.000 description 2
- 239000011135 tin Substances 0.000 description 2
- RZVAJINKPMORJF-UHFFFAOYSA-N Acetaminophen Chemical compound CC(=O)NC1=CC=C(O)C=C1 RZVAJINKPMORJF-UHFFFAOYSA-N 0.000 description 1
- 238000009623 Bosch process Methods 0.000 description 1
- 239000004593 Epoxy Substances 0.000 description 1
- GRYLNZFGIOXLOG-UHFFFAOYSA-N Nitric acid Chemical compound O[N+]([O-])=O GRYLNZFGIOXLOG-UHFFFAOYSA-N 0.000 description 1
- KWYUFKZDYYNOTN-UHFFFAOYSA-M Potassium hydroxide Chemical compound [OH-].[K+] KWYUFKZDYYNOTN-UHFFFAOYSA-M 0.000 description 1
- 229910018503 SF6 Inorganic materials 0.000 description 1
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 1
- 150000004703 alkoxides Chemical class 0.000 description 1
- 239000011324 bead Substances 0.000 description 1
- 238000004140 cleaning Methods 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 239000000428 dust Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000009713 electroplating Methods 0.000 description 1
- 230000009477 glass transition Effects 0.000 description 1
- 238000005470 impregnation Methods 0.000 description 1
- 238000007373 indentation Methods 0.000 description 1
- 239000004973 liquid crystal related substance Substances 0.000 description 1
- 239000007791 liquid phase Substances 0.000 description 1
- 238000001459 lithography Methods 0.000 description 1
- 238000001755 magnetron sputter deposition Methods 0.000 description 1
- 230000007246 mechanism Effects 0.000 description 1
- 238000002156 mixing Methods 0.000 description 1
- 229910017604 nitric acid Inorganic materials 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 230000003071 parasitic effect Effects 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 230000001681 protective effect Effects 0.000 description 1
- 239000005297 pyrex Substances 0.000 description 1
- 238000001552 radio frequency sputter deposition Methods 0.000 description 1
- 230000004044 response Effects 0.000 description 1
- 229910052814 silicon oxide Inorganic materials 0.000 description 1
- 239000011863 silicon-based powder Substances 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 230000007480 spreading Effects 0.000 description 1
- 238000003892 spreading Methods 0.000 description 1
- SFZCNBIFKDRMGX-UHFFFAOYSA-N sulfur hexafluoride Chemical compound FS(F)(F)(F)(F)F SFZCNBIFKDRMGX-UHFFFAOYSA-N 0.000 description 1
- 229960000909 sulfur hexafluoride Drugs 0.000 description 1
- 238000001771 vacuum deposition Methods 0.000 description 1
- 239000012808 vapor phase Substances 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Chemical compound O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
- 239000013585 weight reducing agent Substances 0.000 description 1
- 238000001039 wet etching Methods 0.000 description 1
- 238000004804 winding Methods 0.000 description 1
- 229910000859 α-Fe Inorganic materials 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N30/00—Piezoelectric or electrostrictive devices
- H10N30/40—Piezoelectric or electrostrictive devices with electrical input and electrical output, e.g. functioning as transformers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F27/00—Details of transformers or inductances, in general
- H01F27/24—Magnetic cores
- H01F27/245—Magnetic cores made from sheets, e.g. grain-oriented
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N30/00—Piezoelectric or electrostrictive devices
- H10N30/01—Manufacture or treatment
- H10N30/07—Forming of piezoelectric or electrostrictive parts or bodies on an electrical element or another base
- H10N30/074—Forming of piezoelectric or electrostrictive parts or bodies on an electrical element or another base by depositing piezoelectric or electrostrictive layers, e.g. aerosol or screen printing
- H10N30/079—Forming of piezoelectric or electrostrictive parts or bodies on an electrical element or another base by depositing piezoelectric or electrostrictive layers, e.g. aerosol or screen printing using intermediate layers, e.g. for growth control
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N30/00—Piezoelectric or electrostrictive devices
- H10N30/01—Manufacture or treatment
- H10N30/08—Shaping or machining of piezoelectric or electrostrictive bodies
- H10N30/082—Shaping or machining of piezoelectric or electrostrictive bodies by etching, e.g. lithography
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N30/00—Piezoelectric or electrostrictive devices
- H10N30/80—Constructional details
- H10N30/85—Piezoelectric or electrostrictive active materials
- H10N30/853—Ceramic compositions
- H10N30/8548—Lead-based oxides
- H10N30/8554—Lead-zirconium titanate [PZT] based
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/42—Piezoelectric device making
Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Chemical & Material Sciences (AREA)
- Ceramic Engineering (AREA)
- Piezo-Electric Or Mechanical Vibrators, Or Delay Or Filter Circuits (AREA)
Description
を備えているのが好ましい。
尚、前記圧電振動子は、PZTの薄膜により構成され、前記支持構造体はシリコン基板を加工して得られたダイヤフラムにより構成されていることが好ましい。
以下に、本発明の実施例について図面を参照しながら説明を行う。
Claims (6)
- シリコン基板に形成され、圧電振動子と、該圧電振動子を支持する支持構造体と、を有する圧電トランスであって、前記支持構造体は、前記圧電振動子の周辺に配置され、内部に空間を有するシリコン外周部と、該外周部から前記空間の形成される領域に渡された梁部と、を有し、前記圧電振動子は前記内部の空間領域に配置され、前記梁部のみによって支持されている圧電トランスにおいて、
前記圧電振動子が、前記シリコン外周部から前記内部に向けて延びる梁部によって支持されることを特徴とする圧電トランス。 - 前記梁部が、その延在方向と交差する方向に離されて複数形成されていることを特徴とする請求項1に記載の圧電トランス。
- 前記梁の太さが50μm以上であり、かつ、300μm以下であることを特徴とする請求項1又は2に記載の圧電トランス。
- 請求項1から3までに記載の圧電トランスの外周部の表裏にそれぞれ板状の封止部材で封止したことを特徴とする圧電トランス装置。
- 前記圧電振動子は、ジルコン酸チタン酸鉛(Pb(Zr1−xTix)O3、以下「P
ZT」と称する。)の薄膜により構成され、前記支持構造体はシリコン基板を加工して構成されていることを特徴とする請求項4に記載の圧電トランス装置。 - 請求項1に記載の圧電トランスの製造方法であって、
シリコン基板において外周部と該外周部から内側に向けて延びた梁部とを除く部分を除去して凹部を形成する工程と、
該凹部内に、PZT薄膜を堆積する工程と、
該PZT薄膜の外周部を除去し、前記梁部のみによって支持されている圧電振動子を形成する工程と、
を有することを特徴とする圧電トランスの製造方法。
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2007221487A JP4509152B2 (ja) | 2007-08-28 | 2007-08-28 | 薄膜圧電トランスおよびその製造方法 |
KR20080083858A KR101100448B1 (ko) | 2007-08-28 | 2008-08-27 | 박막 압전 트랜스포머 및 그 제조 방법 |
US12/199,061 US7834525B2 (en) | 2007-08-28 | 2008-08-27 | Thin film piezoelectric transformer and method of manufacturing the same |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2007221487A JP4509152B2 (ja) | 2007-08-28 | 2007-08-28 | 薄膜圧電トランスおよびその製造方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2009054865A JP2009054865A (ja) | 2009-03-12 |
JP4509152B2 true JP4509152B2 (ja) | 2010-07-21 |
Family
ID=40406335
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2007221487A Expired - Fee Related JP4509152B2 (ja) | 2007-08-28 | 2007-08-28 | 薄膜圧電トランスおよびその製造方法 |
Country Status (3)
Country | Link |
---|---|
US (1) | US7834525B2 (ja) |
JP (1) | JP4509152B2 (ja) |
KR (1) | KR101100448B1 (ja) |
Families Citing this family (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4851549B2 (ja) * | 2009-02-10 | 2012-01-11 | 日本電波工業株式会社 | 圧電デバイス |
WO2011086645A1 (ja) * | 2010-01-12 | 2011-07-21 | コニカミノルタホールディングス株式会社 | 圧電素子の製造方法及びその製造方法により製造された圧電素子 |
JP5614629B2 (ja) * | 2010-07-05 | 2014-10-29 | 横河電機株式会社 | 電源装置 |
JP5718954B2 (ja) * | 2013-01-09 | 2015-05-13 | 株式会社タムラ製作所 | 圧電トランス |
JP6442899B2 (ja) * | 2014-07-30 | 2018-12-26 | セイコーエプソン株式会社 | 振動デバイス、電子機器、および移動体 |
JP6552801B2 (ja) * | 2014-10-06 | 2019-07-31 | 株式会社タムラ製作所 | 圧電トランス及びこれを用いた電源用回路モジュール |
KR102283082B1 (ko) * | 2015-11-09 | 2021-07-30 | 삼성전기주식회사 | 전원 공급 장치 |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2002111092A (ja) * | 2000-09-28 | 2002-04-12 | Taiheiyo Cement Corp | 圧電トランスのケーシング構造 |
JP2004071699A (ja) * | 2002-08-02 | 2004-03-04 | Toto Ltd | 圧電トランス |
Family Cites Families (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CH582957A5 (ja) * | 1974-08-20 | 1976-12-15 | Suisse Horlogerie | |
US5315874A (en) * | 1989-02-28 | 1994-05-31 | The Charles Stark Draper Laboratories | Monolithic quartz resonator accelerometer |
JP2914284B2 (ja) * | 1996-03-26 | 1999-06-28 | 日本電気株式会社 | 圧電トランス |
US6250158B1 (en) * | 1997-05-09 | 2001-06-26 | Litton Systems, Inc. | Monolithic vibrating beam angular velocity sensor |
KR19990031153A (ko) | 1997-10-09 | 1999-05-06 | 이형도 | 압전 트랜스 실장장치 |
JP2002286452A (ja) * | 2001-03-26 | 2002-10-03 | Murata Mfg Co Ltd | 振動ジャイロおよびそれを用いた電子装置 |
KR100476556B1 (ko) | 2002-04-11 | 2005-03-18 | 삼성전기주식회사 | 압전트랜스 장치, 압전트랜스 하우징 및 그 제조방법 |
JP4281348B2 (ja) * | 2002-12-17 | 2009-06-17 | セイコーエプソン株式会社 | 圧電振動片と圧電振動片を利用した圧電デバイス、ならびに圧電デバイスを利用した携帯電話装置および圧電デバイスを利用した電子機器 |
JP2006238266A (ja) * | 2005-02-28 | 2006-09-07 | Seiko Epson Corp | 圧電振動片、及び圧電振動子 |
JP5016207B2 (ja) | 2005-07-05 | 2012-09-05 | シャープ株式会社 | 圧電薄膜トランス及びその製造方法 |
-
2007
- 2007-08-28 JP JP2007221487A patent/JP4509152B2/ja not_active Expired - Fee Related
-
2008
- 2008-08-27 US US12/199,061 patent/US7834525B2/en not_active Expired - Fee Related
- 2008-08-27 KR KR20080083858A patent/KR101100448B1/ko not_active IP Right Cessation
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2002111092A (ja) * | 2000-09-28 | 2002-04-12 | Taiheiyo Cement Corp | 圧電トランスのケーシング構造 |
JP2004071699A (ja) * | 2002-08-02 | 2004-03-04 | Toto Ltd | 圧電トランス |
Also Published As
Publication number | Publication date |
---|---|
KR101100448B1 (ko) | 2011-12-29 |
JP2009054865A (ja) | 2009-03-12 |
US7834525B2 (en) | 2010-11-16 |
KR20090023189A (ko) | 2009-03-04 |
US20090058229A1 (en) | 2009-03-05 |
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