JP4479380B2 - CONNECTION BODY, ELECTRONIC COMPONENT CONNECTION STRUCTURE, AND ELECTRONIC COMPONENT DEVICE - Google Patents
CONNECTION BODY, ELECTRONIC COMPONENT CONNECTION STRUCTURE, AND ELECTRONIC COMPONENT DEVICE Download PDFInfo
- Publication number
- JP4479380B2 JP4479380B2 JP2004193433A JP2004193433A JP4479380B2 JP 4479380 B2 JP4479380 B2 JP 4479380B2 JP 2004193433 A JP2004193433 A JP 2004193433A JP 2004193433 A JP2004193433 A JP 2004193433A JP 4479380 B2 JP4479380 B2 JP 4479380B2
- Authority
- JP
- Japan
- Prior art keywords
- bus bar
- electronic component
- connection
- group
- terminal side
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 230000000149 penetrating effect Effects 0.000 claims 2
- 239000003990 capacitor Substances 0.000 description 99
- 239000004020 conductor Substances 0.000 description 16
- 125000006850 spacer group Chemical group 0.000 description 8
- 230000000694 effects Effects 0.000 description 5
- 230000004048 modification Effects 0.000 description 3
- 238000012986 modification Methods 0.000 description 3
- 239000000758 substrate Substances 0.000 description 3
- 239000000853 adhesive Substances 0.000 description 2
- 230000001070 adhesive effect Effects 0.000 description 2
- 238000009499 grossing Methods 0.000 description 2
- 238000009413 insulation Methods 0.000 description 2
- 238000005452 bending Methods 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 239000012212 insulator Substances 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 230000035515 penetration Effects 0.000 description 1
- 230000001681 protective effect Effects 0.000 description 1
Classifications
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E60/00—Enabling technologies; Technologies with a potential or indirect contribution to GHG emissions mitigation
- Y02E60/10—Energy storage using batteries
Landscapes
- Connection Of Batteries Or Terminals (AREA)
- Inverter Devices (AREA)
- Details Of Resistors (AREA)
- Multi-Conductor Connections (AREA)
- Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
- Connection Or Junction Boxes (AREA)
Description
本発明は、複数の電解コンデンサ等の電子部品の接続に関し、特に、インダクタンスを低減した接続体、電子部品の接続構造、及び電子部品装置に関する。
The present invention relates to connection of electronic components such as a plurality of electrolytic capacitors, and more particularly to a connection body with reduced inductance, an electronic component connection structure, and an electronic component device.
直流電力の交流電力への電力変換等に用いられるコンデンサ装置では、複数のコンデンサの並列回路や直並列回路が用いられるが、その際、コンデンサ側の接続部に発生するインダクタンスが問題となる。このインダクタンスは、接続部に流れる大電流とその電流によって発生する磁界とから形成され、従来、斯かるインダクタンスの低減のため、各種の対策が講じられている。 In a capacitor device used for power conversion of DC power to AC power, etc., a parallel circuit or a series-parallel circuit of a plurality of capacitors is used. At that time, an inductance generated at a connection portion on the capacitor side becomes a problem. This inductance is formed from a large current flowing through the connection portion and a magnetic field generated by the current, and various countermeasures have been conventionally taken to reduce such inductance.
斯かるコンデンサの接続に関する先行技術には、次のような特許文献が存在している。
特許文献２には、板状の３枚の導体を積層させて近接させることにより並行配置し、この複数の導体を用いて２つのコンデンサを直列接続する構成が開示され、各コンデンサの端子に流れる電流の向きを反対方向にすることにより、各電流によって生じる磁界を相殺し、インダクタンスを低減させている。 Patent Document 2 discloses a configuration in which three plate-like conductors are stacked and placed in close proximity to each other, and a configuration in which two capacitors are connected in series using the plurality of conductors flows to the terminals of each capacitor. By reversing the direction of the current, the magnetic field generated by each current is canceled and the inductance is reduced.
特許文献３には、２枚の導体板を積層配置し、これら２枚の導体板を用いて複数のコンデンサを並列接続する構成が開示されている。 Patent Document 3 discloses a configuration in which two conductor plates are stacked and a plurality of capacitors are connected in parallel using these two conductor plates.
特許文献４には、２枚の導体板を積層配置し、これら２枚の導体板を用いて複数のコンデンサを並列接続する構成が開示されている。 Patent Document 4 discloses a configuration in which two conductor plates are stacked and a plurality of capacitors are connected in parallel using these two conductor plates.
特許文献５には、２枚のバスバーを積層し、各バスバーから突出させた接続部を用いてコンデンサの端子側に接続することにより、バスバー間でコンデンサを並列接続する構成が開示されている。 Patent Document 5 discloses a configuration in which capacitors are connected in parallel between bus bars by stacking two bus bars and connecting them to the terminal side of the capacitor using a connecting portion protruding from each bus bar.
また、特許文献６には、複数の平滑コンデンサの端子側に基板を接続して各平滑コンデンサを並列化する構成が開示されている。
Patent Document 6 discloses a configuration in which a plurality of smoothing capacitors are connected in parallel by connecting a substrate to the terminals of a plurality of smoothing capacitors.
ところで、複数の電解コンデンサを並列化して大容量化することや、バスバーによる低インダクタンス化を実現することは公知であり、また、各端子に流れる電流を逆方向にし、各電流によって生じる磁界を相殺することにより低インダクタンス化することも公知である。 By the way, it is publicly known to increase the capacity by parallelizing a plurality of electrolytic capacitors, and to realize low inductance by a bus bar. Also, the current flowing through each terminal is reversed to cancel the magnetic field generated by each current. It is also known to reduce inductance by doing so.
しかしながら、特許文献１では、電流の向きが一方のコンデンサの並列接続体は共に同一方向であり、対向するコンデンサの並列接続体と逆方向となり、インダクタンスが低減されるが、コンデンサの並列接続体は共に同一方向であるため、インダクタンスの低減効果は低い。また、特許文献２では、２つのコンデンサの並列化を開示しているにすぎない。また、特許文献３、５では、各コンデンサを並列化する導体が隣接しているものの、各導体に孤立した部分が存在しているため、この部分ではインダクタンスの低減を図ることができない。また、特許文献４では、並列化されるコンデンサに対して配線構造体が立体的であるため、装置全体に対する占める割合が大きくなる。また、特許文献６では、各コンデンサを並列化する基板における接続導体の構成が不明である。 However, in Patent Document 1, the parallel connection body of one capacitor is in the same direction in the direction of current, and is opposite to the parallel connection body of the opposing capacitor, and the inductance is reduced. Since both are in the same direction, the effect of reducing inductance is low. Further, Patent Document 2 merely discloses parallelization of two capacitors. In Patent Documents 3 and 5, although conductors for paralleling capacitors are adjacent to each other, there is an isolated portion in each conductor. Therefore, inductance cannot be reduced in this portion. Moreover, in patent document 4, since a wiring structure is three-dimensional with respect to the capacitor | condenser paralleled, the ratio for the whole apparatus becomes large. Moreover, in patent document 6, the structure of the connection conductor in the board | substrate which parallelizes each capacitor | condenser is unknown.
そこで、本発明は、複数のコンデンサ等の電子部品を直並列化するとともに、接続構造部分のコンパクト化とともに、低インダクタンス化を実現した接続体、電子部品の接続構造、及び電子部品装置を提供することを目的とする。
Accordingly, the present invention provides a connection body, a connection structure for an electronic component, and an electronic component device that realizes a reduction in inductance while reducing the inductance of the connection structure portion while making electronic components such as a plurality of capacitors in series and parallel. For the purpose.
上記目的を達成するため、本発明の接続体は、複数の電子部品の各端子側を対向させてなる第１及び第２の電子部品群と、これら第１及び第２の電子部品群の対向間隔内に配設されて前記第１の電子部品群と前記第２の電子部品群の端子間接続に用いられる接続体であって、前記第１の電子部品群の各電子部品の正極端子側を共通に接続する第１のバスバーと、前記第１の電子部品群の各電子部品の負極端子側を共通に接続する第２のバスバーと、前記第２の電子部品群の各電子部品の正極端子側を共通に接続する第３のバスバーと、前記第２の電子部品群の各電子部品の負極端子側を共通に接続する第４のバスバーと、前記第１のバスバーと前記第２のバスバー、前記第３のバスバーと前記第４のバスバー間に介在される絶縁部材と、前記第１のバスバーと前記第４のバスバー、又は前記第２のバスバーと前記第３のバスバーを接続する共通接続部と、前記共通接続部が形成されていない前記第２のバスバーと前記第３のバスバー、又は前記第１のバスバーと前記第４のバスバーに形成される接続端子部とからなり、前記第１のバスバーと前記第２のバスバー、前記第３のバスバーと前記第４のバスバーが前記絶縁部材を介して積層され、前記共通接続部と、前記接続端子部とが近接するように前記第１ないし前記第４のバスバーに配置されるとともに、前記第１のバスバーに流れる電流と前記第２のバスバーに流れる電流の向きが逆方向に設定され、前記第２のバスバーに流れる電流と前記第３のバスバーに流れる電流の向きが逆方向に設定され、前記第３のバスバーに流れる電流と前記第４のバスバーに流れる電流の向きが逆方向に設定された構成である。 In order to achieve the above object, the connection body of the present invention includes a first and second electronic component group in which the terminal sides of a plurality of electronic components are opposed to each other, and the opposed first and second electronic component groups. a connecting member disposed within the interval used for connection between the first electronic component and the second electronic component group and group terminal, the positive terminal of the electronic components of the first group of electronic components a first bus bar to be connected to a common, the second bus bar that connects the first negative terminal side of the electronic components of the electronic component group in common, the second electronic components of the positive electrode of the electronic component group third bus bar and the fourth bus bar and the second bus bar and the first bus bar connecting the second negative terminal side of the electronic components of the electronic component group on a common connecting the terminal side in common , An insulating member interposed between the third bus bar and the fourth bus bar, 1 bus bar and the fourth bus bar, or a common connection part for connecting the second bus bar and the third bus bar, and the second bus bar and the third bus bar in which the common connection part is not formed Or a connection terminal portion formed on the first bus bar and the fourth bus bar, wherein the first bus bar and the second bus bar, the third bus bar and the fourth bus bar are insulated. The first and fourth bus bars are stacked such that the common connection portion and the connection terminal portion are close to each other, and the current flowing through the first bus bar and the second The direction of the current flowing in the bus bar is set in the opposite direction, the direction of the current flowing in the second bus bar and the direction of the current flowing in the third bus bar are set in the reverse direction, and flows in the third bus bar. Direction of the current flowing through the flow on the fourth bus bar is set configured in the opposite direction.
斯かる構成とすれば、第１〜第４のバスバーと第１又は第２の電子部品群を構成する電子部品との電気的な接続により、複数の電子部品の直並列化が可能であり、接続構造部分のコンパクト化とともに、積層された各バスバーに流れる電流を、第１のバスバーと第２のバスバー間、第２のバスバーと第３のバスバー間、第３のバスバーと第４のバスバー間で互いに逆方向に設定できるので、磁界の相殺により、低インダクタンス化が図られる。 With such a configuration, a plurality of electronic components can be serially paralleled by electrical connection between the first to fourth bus bars and the electronic components constituting the first or second electronic component group, Along with downsizing of the connecting structure part, the current flowing through the stacked bus bars is changed between the first bus bar and the second bus bar, between the second bus bar and the third bus bar, and between the third bus bar and the fourth bus bar. Therefore, the inductance can be reduced by canceling out the magnetic field.
上記目的を達成するためには、前記第１のバスバー、前記絶縁部材及び前記第２のバスバーからなる第１の積層体と、前記第３のバスバー、前記絶縁部材及び前記第４のバスバーからなる第２の積層体と、前記第１の積層体の第１のバスバー及び／又は第２のバスバーに形成され、前記第１の電子部品群の電子部品の一方の端子側を接続する接続部と、他方の端子側を非接触で通過させる貫通部と、前記第２の積層体の第３のバスバー及び／又は第４のバスバーに形成され、前記第２の電子部品群の電子部品の一方の端子側を接続する接続部と、他方の端子側を非接触で通過させる貫通部とを備えた構成としてもよい。 In order to achieve the above object, the first laminated body composed of the first bus bar, the insulating member and the second bus bar, and the third bus bar, the insulating member and the fourth bus bar. A second laminated body, and a connection portion formed on the first bus bar and / or the second bus bar of the first laminated body, and connecting one terminal side of the electronic components of the first electronic component group; A through portion that allows the other terminal side to pass through in a non-contact manner, and a third bus bar and / or a fourth bus bar of the second laminate, and one of the electronic components of the second electronic component group. It is good also as a structure provided with the connection part which connects a terminal side, and the penetration part which lets the other terminal side pass in non-contact.
上記目的を達成するためには、前記第１の電子部品群の前記第１のバスバー又は前記第２のバスバーと一体に形成されて外部回路と接続される第１の接続端子部と、この第１の接続端子部との間に前記絶縁部材を介在させて設置され、且つ、前記第２の電子部品群の前記第３のバスバー又は前記第４のバスバーと一体に形成されて外部回路と接続される第２の接続端子部とを備えた構成としてもよい。 In order to achieve the above object, a first connection terminal portion formed integrally with the first bus bar or the second bus bar of the first electronic component group and connected to an external circuit, The insulating member is interposed between the first connecting terminal portion and the third bus bar or the fourth bus bar of the second electronic component group so as to be connected to an external circuit. It is good also as a structure provided with the 2nd connecting terminal part.
上記目的を達成するため、本発明の電子部品の接続構造は、複数の電子部品の各端子側を対向させてなる第１及び第２の電子部品群と、第１、第２、第３及び第４のバスバーとを備える電子部品の接続構造であって、前記第１のバスバーに前記第１の電子部品群の各電子部品の正極端子側を共通に接続し、前記第２のバスバーに前記第１の電子部品群の各電子部品の負極端子側を共通に接続し、前記第３のバスバーに前記第２の電子部品群の各電子部品の正極端子側を共通に接続し、前記第４のバスバーに前記第２の電子部品群の各電子部品の負極端子側を共通に接続してなる既述の接続体を備えた構成である。 In order to achieve the above object, the electronic component connection structure of the present invention includes a first and second electronic component group in which the terminal sides of a plurality of electronic components are opposed to each other, and first, second, third, and A connection structure for an electronic component comprising a fourth bus bar, wherein a positive terminal side of each electronic component of the first electronic component group is commonly connected to the first bus bar, and the second bus bar is connected to the second bus bar. The negative terminal side of each electronic component of the first electronic component group is commonly connected, the positive terminal side of each electronic component of the second electronic component group is commonly connected to the third bus bar, and the fourth The bus bar is provided with the above-described connection body in which the negative electrode terminal side of each electronic component of the second electronic component group is connected in common.
斯かる構成とすれば、第１〜第４のバスバーと第１又は第２の電子部品群を構成する電子部品との電気的な接続により、複数の電子部品の直並列化が可能であり、接続構造部分のコンパクト化とともに、低インダクタンス化が図られた電子部品の接続構造が得られる。 With such a configuration, a plurality of electronic components can be serially paralleled by electrical connection between the first to fourth bus bars and the electronic components constituting the first or second electronic component group, A connection structure for an electronic component with a reduced inductance and a reduced inductance can be obtained.
上記目的を達成するため、本発明の電子部品装置は、既述の電子部品の接続構造を筐体内に備えた構成である。
In order to achieve the above object, an electronic component device according to the present invention has a structure in which a connection structure for an electronic component described above is provided in a housing.
以上説明したように、本発明によれば、次のような効果が得られる。 As described above, according to the present invention, the following effects can be obtained.
(1) 本発明の接続体によれば、複数の電子部品をグループ化して第１及び第２の電子部品群とし、各電子部品群毎に電子部品の並列化と、第１及び第２の電子部品群の直列化とを実現し、各電子部品を並列化する接続導体を隣接させるとともに、積層された各バスバーの隣接するバスバーの各電流が互いに逆方向になるように設定されているので、各電流での発生磁界が相殺されて低インダクタンス化を図ることができるとともに、接続構造のコンパクト化を図ることができる。 (1) According to the connection body of the present invention, a plurality of electronic components are grouped into the first and second electronic component groups, and the electronic components are arranged in parallel for each electronic component group. Since serialization of electronic parts group is realized, connecting conductors for paralleling electronic parts are adjacent to each other, and currents of adjacent bus bars of stacked bus bars are set in opposite directions. In addition, the magnetic fields generated by the respective currents are offset, so that the inductance can be reduced and the connection structure can be made compact.
(2) 本発明の電子部品の接続構造によれば、複数の電子部品からなる第１及び第２の電子部品群を備え、各電子部品の並列化と、第１及び第２の電子部品群の直列化を図るとともに、電子部品の並列化における低インダクタンス化を実現することができる。 (2) According to the electronic component connection structure of the present invention, the electronic device includes the first and second electronic component groups each including a plurality of electronic components, and the parallelization of the electronic components and the first and second electronic component groups. As a result, it is possible to achieve low inductance in paralleling electronic components.
(3) 本発明の電子部品装置によれば、複数の電子部品の並列化及び直列化を実現するとともに、接続構造の簡略化及びコンパクト化を実現し、低インダクタンス化を図ることができる。
(3) According to the electronic component device of the present invention, parallelization and serialization of a plurality of electronic components can be realized, the connection structure can be simplified and made compact, and low inductance can be achieved.
第１の実施形態
この第１の実施形態は、本発明の接続体、電子部品の接続構造及び電子部品装置に関し、コンデンサに関する接続体及びその接続構造を示すものである。この第１の実施形態について、図１ないし図３を参照して説明する。図１は、接続体及びコンデンサの接続構造を示す分解斜視図、図２は、接続体を示す斜視図、図３は、コンデンサの接続構造を示す斜視図である。
1st Embodiment This 1st Embodiment is related with the connection body of this invention, the connection structure of an electronic component, and an electronic component apparatus, and shows the connection body regarding a capacitor | condenser, and its connection structure. The first embodiment will be described with reference to FIGS. 1 to 3. FIG. 1 is an exploded perspective view showing a connection structure of a connection body and a capacitor, FIG. 2 is a perspective view showing the connection body, and FIG. 3 is a perspective view showing a connection structure of the capacitor.
電子部品の接続構造として例えば、コンデンサの接続構造２は、接続体４を備えることにより、第１及び第２の電子部品群として第１及び第２のコンデンサ群６、８の直列化とともに、コンデンサ群６を構成するコンデンサ６１、６２、６３、６４の並列化、コンデンサ群８を構成するコンデンサ８１、８２、８３、８４の並列化をしたものである。 As an electronic component connection structure, for example, the capacitor connection structure 2 includes the connection body 4 so that the first and second capacitor groups 6 and 8 are serialized as the first and second electronic component groups. The capacitors 61, 62, 63, and 64 that constitute the group 6 are paralleled, and the capacitors 81, 82, 83, and 84 that constitute the capacitor group 8 are parallelized.
接続体４には、第１のバスバー４１、第２のバスバー４２、第３のバスバー４３、第４のバスバー４４とともに、絶縁部材として絶縁紙４５、４６が備えられている。各バスバー４１〜４４は、コンデンサ６１〜６４、８１〜８４の正極端子１２及び負極端子１４を覆う程度の幅を持つ板状部材であって、バスバー４１の一方の端部には正極側の接続端子部として外部接続部１６、バスバー４４の一方の端部には負極側の接続端子部として外部接続部１８、バスバー４２、４３の一方の端部には両者を結合する共通接続部２０が形成されている。バスバー４１は、複数のコンデンサ６１〜６４の正極側を並列に接続する接続導体であって、コンデンサ６１〜６４の正極端子１２を並列に接続する接続部として複数の接続孔２２、負極端子１４を非接触で通過させるための径大な貫通部として複数の貫通孔２４が交互に形成されている。同様に、バスバー４２は、複数のコンデンサ６１〜６４の負極側を並列に接続する接続導体であって、コンデンサ６１〜６４の負極端子１４を並列に接続する接続部として複数の接続孔２６、正極端子１２を非接触で通過させるための径大な貫通部として複数の貫通孔２８が交互に形成されている。 In addition to the first bus bar 41, the second bus bar 42, the third bus bar 43, and the fourth bus bar 44, the connection body 4 includes insulating paper 45 and 46 as insulating members. Each bus bar 41 to 44 is a plate-like member having a width that covers the positive electrode terminal 12 and the negative electrode terminal 14 of the capacitors 61 to 64 and 81 to 84, and is connected to one end of the bus bar 41 on the positive electrode side. The external connection portion 16 as a terminal portion, the external connection portion 18 as a negative connection terminal portion at one end portion of the bus bar 44, and the common connection portion 20 that couples them to one end portions of the bus bars 42 and 43 are formed. Has been. The bus bar 41 is a connection conductor that connects the positive electrodes of the capacitors 61 to 64 in parallel. The bus bar 41 includes a plurality of connection holes 22 and a negative electrode terminal 14 as connection portions that connect the positive terminals 12 of the capacitors 61 to 64 in parallel. A plurality of through-holes 24 are alternately formed as large-diameter through portions for passing through in a non-contact manner. Similarly, the bus bar 42 is a connection conductor that connects the negative electrode sides of the capacitors 61 to 64 in parallel. The bus bar 42 includes a plurality of connection holes 26 and positive electrodes as connection portions that connect the negative electrode terminals 14 of the capacitors 61 to 64 in parallel. A plurality of through holes 28 are alternately formed as large-diameter through portions for allowing the terminals 12 to pass through in a non-contact manner.
バスバー４３は、複数のコンデンサ８１〜８４の正極側を並列に接続する接続導体であって、コンデンサ８１〜８４の正極端子１２を並列に接続する接続部として複数の接続孔２２、負極端子１４を非接触で通過させるための径大な貫通部として複数の貫通孔２４が交互に形成されている。同様に、バスバー４４は、複数のコンデンサ８１〜８４の負極側を並列に接続する接続導体であって、コンデンサ８１〜８４の負極端子１４を並列に接続する接続部として複数の接続孔２６、正極端子１２を非接触で通過させるための径大な貫通部として複数の貫通孔２８が交互に形成されている。 The bus bar 43 is a connection conductor that connects the positive electrode sides of the capacitors 81 to 84 in parallel. The bus bar 43 includes the connection holes 22 and the negative electrode terminals 14 as connection portions that connect the positive electrode terminals 12 of the capacitors 81 to 84 in parallel. A plurality of through-holes 24 are alternately formed as large-diameter through portions for passing through in a non-contact manner. Similarly, the bus bar 44 is a connection conductor that connects the negative electrode sides of the capacitors 81 to 84 in parallel, and includes a plurality of connection holes 26 and positive electrodes as connection portions that connect the negative electrode terminals 14 of the capacitors 81 to 84 in parallel. A plurality of through holes 28 are alternately formed as large-diameter through portions for allowing the terminals 12 to pass through in a non-contact manner.
また、絶縁紙４５は、コンデンサ群６側のバスバー４１、４２の間に設置されて両者間を絶縁する部材であって、バスバー４１、４２より幅広且つ長大に形成されているとともに、接続孔２２、２６及び貫通孔２４、２８の中心に対応する透孔３０を備えており、各透孔３０は絶縁を図るため、貫通孔２４、２８より径小である。同様に、絶縁紙４６は、コンデンサ群８側のバスバー４３、４４の間に設置されて両者間を絶縁する部材であって、バスバー４３、４４より幅広且つ長大に形成されているとともに、接続孔２２、２６及び貫通孔２４、２８の中心に対応する透孔３０を備えており、各透孔３０は絶縁を図るため、貫通孔２４、２８より径小である。 The insulating paper 45 is a member that is installed between the bus bars 41 and 42 on the capacitor group 6 side and insulates between the two. The insulating paper 45 is formed wider and longer than the bus bars 41 and 42, and the connection hole 22. , 26 and through holes 30 corresponding to the centers of the through holes 24, 28. Each through hole 30 is smaller in diameter than the through holes 24, 28 for insulation. Similarly, the insulating paper 46 is a member that is installed between the bus bars 43 and 44 on the capacitor group 8 side and insulates the two, and is formed wider and longer than the bus bars 43 and 44, and has a connection hole. 22 and 26 and through holes 30 corresponding to the centers of the through holes 24 and 28 are provided, and each through hole 30 is smaller in diameter than the through holes 24 and 28 for insulation.
各コンデンサ６１〜６４とバスバー４１、４２の接続には例えば、接続用ビス３２が用いられており、バスバー４２の貫通孔２８及び絶縁紙４５の透孔３０を貫通させた接続用ビス３２をバスバー４１の接続孔２２を通してワッシャを兼ねる取付高さ設定ないし調整手段としてのスペーサ３４とともに正極端子１２に締め付けることにより、接続用ビス３２及びスペーサ３４を介して正極端子１２とバスバー４１とが接続され、また、バスバー４１の貫通孔２４及び絶縁紙４５の透孔３０を貫通させた接続用ビス３２をバスバー４２の接続孔２６を通してスペーサ３４とともに負極端子１４に締め付けることにより、接続用ビス３２及びスペーサ３４を介して負極端子１４とバスバー４２とが接続されている。 For example, connection screws 32 are used to connect the capacitors 61 to 64 and the bus bars 41 and 42. The connection screws 32 that pass through the through holes 28 of the bus bar 42 and the through holes 30 of the insulating paper 45 are connected to the bus bars. The positive terminal 12 and the bus bar 41 are connected to each other through the connection screw 32 and the spacer 34 by tightening the positive terminal 12 together with the spacer 34 as a mounting height setting or adjusting means that also serves as a washer through the connection hole 22 of 41, Further, the connection screw 32 that penetrates the through hole 24 of the bus bar 41 and the through hole 30 of the insulating paper 45 is fastened to the negative electrode terminal 14 together with the spacer 34 through the connection hole 26 of the bus bar 42, thereby connecting the connection screw 32 and the spacer 34. The negative electrode terminal 14 and the bus bar 42 are connected via each other.
また、各コンデンサ８１〜８４とバスバー４３、４４の接続には例えば、接続用ビス３２が用いられており、同様に、バスバー４３の貫通孔２８及び絶縁紙４５の透孔３０を貫通させた接続用ビス３２をバスバー４４の接続孔２２を通してワッシャを兼ねる取付高さ設定ないし調整手段としてのスペーサ３４とともに負極端子１４に締め付けることにより、接続用ビス３２及びスペーサ３４を介して負極端子１２とバスバー４４とが接続され、また、バスバー４４の貫通孔２４及び絶縁紙４５の透孔３０を貫通させた接続用ビス３２をバスバー４３の接続孔２６を通してスペーサ３４とともに正極端子１２に締め付けることにより、接続用ビス３２及びスペーサ３４を介して正極端子１２とバスバー４３とが接続されている。 Further, for example, connection screws 32 are used to connect each of the capacitors 81 to 84 and the bus bars 43 and 44. Similarly, the connection through the through hole 28 of the bus bar 43 and the through hole 30 of the insulating paper 45 is used. By tightening the connecting screw 32 to the negative terminal 14 together with the spacer 34 as a mounting height setting or adjusting means that also serves as a washer through the connection hole 22 of the bus bar 44, the negative terminal 12 and the bus bar 44 are connected via the connecting screw 32 and the spacer 34. Are connected to the positive terminal 12 together with the spacer 34 through the connection hole 26 of the bus bar 43 and the connection screw 32 passing through the through hole 24 of the bus bar 44 and the through hole 30 of the insulating paper 45. The positive terminal 12 and the bus bar 43 are connected via the screw 32 and the spacer 34.
そして、バスバー４１の外部接続部１６は、この実施形態では、バスバー４１の端部からコンデンサ６４の側面側に屈曲させて露出しており、その屈曲部分の上部に固定ねじ部３６を備えている。また、バスバー４４の外部接続部１８は、この実施形態では、バスバー４４の端部から外部接続部１６に重なるように屈曲させて露出しており、その屈曲部分の上部に固定ねじ部３６と重ならないように隣接して固定ねじ部３８が形成されている。この実施形態では、固定ねじ部３６が共通正極端子、固定ねじ部３８が共通負極端子を構成している。また、重ねられた外部接続部１６、１８の間には各外部接続部１６、１８より面積の広い絶縁紙４５、４６が重ねられて介挿され、両者間の絶縁が図られている。 In this embodiment, the external connection portion 16 of the bus bar 41 is exposed by being bent from the end portion of the bus bar 41 toward the side surface of the capacitor 64, and includes a fixing screw portion 36 at the upper portion of the bent portion. . Further, in this embodiment, the external connection portion 18 of the bus bar 44 is exposed by being bent so as to overlap the external connection portion 16 from the end portion of the bus bar 44, and the fixing screw portion 36 is overlapped with the upper portion of the bent portion. A fixing screw portion 38 is formed adjacently so as not to become. In this embodiment, the fixing screw portion 36 constitutes a common positive terminal and the fixing screw portion 38 constitutes a common negative terminal. Further, insulating papers 45 and 46 having a larger area than the external connection portions 16 and 18 are inserted between the overlapped external connection portions 16 and 18 so as to insulate them.
また、バスバー４２、４３の端部に形成された共通接続部２０は、各バスバー４２、４３の端部をＬ字形に屈曲させて接続片５０、５２を形成し、これら接続片５０、５２に形成した固定孔５４に接続手段としてビス５６又はリベットにより接続したものである。 In addition, the common connection portion 20 formed at the end portions of the bus bars 42 and 43 forms connection pieces 50 and 52 by bending the end portions of the bus bars 42 and 43 into L-shapes. The formed fixing hole 54 is connected by screws 56 or rivets as connecting means.
斯かる構成とすれば、接続体４において、バスバー４１、４２側は絶縁紙４５を挟み込んで接着材で第１の積層体として構成されるとともに、バスバー４３、４４側は絶縁紙４６を挟み込んで接着材で第２の積層体として構成される。そして、複数のコンデンサについて、例えば、コンデンサ６１〜６４と、コンデンサ８１〜８４とにグループ化してコンデンサ群６、８とし、コンデンサ群６側に第１の積層体であるバスバー４１、４２を接続し、コンデンサ群８側に第２の積層体であるバスバー４３、４４を接続することにより、各コンデンサ群６、８をそれぞれ並列化した後、バスバー４２、４３を連結して共通化することにより、図４に示すように、コンデンサ６１〜６４、８１〜８４を並列化及び直列化することができる。 With such a configuration, in the connection body 4, the bus bars 41 and 42 are sandwiched with the insulating paper 45 and are configured as a first laminated body with an adhesive, and the bus bars 43 and 44 are sandwiched with the insulating paper 46. It is comprised as a 2nd laminated body with an adhesive material. For example, the capacitors 61 to 64 and the capacitors 81 to 84 are grouped into the capacitor groups 6 and 8, and the bus bars 41 and 42 that are the first laminated bodies are connected to the capacitor group 6 side. By connecting the bus bars 43 and 44, which are the second laminated body, to the capacitor group 8 side, the capacitor groups 6 and 8 are paralleled, and then the bus bars 42 and 43 are connected and shared. As shown in FIG. 4, capacitors 61 to 64 and 81 to 84 can be parallelized and serialized.
このように接続体４を用いて構成されたコンデンサの接続構造２によれば、各コンデンサ６１〜６４、８１〜８４に流れる電流が接続体４を構成するバスバー４１、４２又はバスバー４３、４４において、外部接続部１６、１８に接続される図示しないドライバと各コンデンサ群６、８に流れる電流をＩとすると、この電流Ｉの向きは隣接するバスバー４１、４２間又はバスバー４３、４４間で互いに逆方向となるとともに、バスバー４２、４３間においても互いに逆方向となり、各電流Ｉによって発生する磁界の相殺効果が高まり、大幅な低インダクタンス化が図られる。 According to the capacitor connection structure 2 configured using the connection body 4 in this way, the current flowing through each of the capacitors 61 to 64 and 81 to 84 in the bus bars 41 and 42 or the bus bars 43 and 44 configuring the connection body 4. When the current flowing through the driver (not shown) connected to the external connection portions 16 and 18 and the capacitor groups 6 and 8 is I, the direction of the current I is between the adjacent bus bars 41 and 42 or between the bus bars 43 and 44. In addition to the reverse direction, the bus bars 42 and 43 are also opposite to each other, and the effect of canceling out the magnetic field generated by each current I is enhanced, thereby greatly reducing the inductance.
第２の実施形態
この第２の実施形態は、本発明の電子部品装置に関し、コンデンサ装置を示すものである。この第２の実施形態について、図５及び図６を参照して説明する。図５は、第２の実施形態に係るコンデンサ装置を示す分解斜視図、図６は、コンデンサ装置を示す斜視図である。
Second Embodiment The second embodiment relates to an electronic component device of the present invention and shows a capacitor device. The second embodiment will be described with reference to FIGS. FIG. 5 is an exploded perspective view showing the capacitor device according to the second embodiment, and FIG. 6 is a perspective view showing the capacitor device.
コンデンサ装置７０には、防護体としてのケース７１が備えられ、このケース７１の収納空間部７２には、既述のコンデンサの接続構造２に係る接続体４、第１及び第２のコンデンサ群６、８が収納されている。また、ケース７１の収納空間部７２には、支持壁部７４、７６及び支柱部７８、９０、９２、９３が形成されている。支持壁部７４、７６及び支柱部７８、９０、９２、９３には、ビス９４を固定するためのねじ孔９６が形成されている。そして、第１及び第２のカバー９８、１００が備えられ、カバー９８にはねじ孔９６に対応する位置に透孔１０２が形成され、同様に、カバー１００にもねじ孔９６に対応する位置に透孔１０４が形成されている。 The capacitor device 70 is provided with a case 71 as a protective body. In the storage space 72 of the case 71, the connection body 4 according to the capacitor connection structure 2 described above, the first and second capacitor groups 6 are provided. , 8 are stored. In addition, support wall portions 74 and 76 and support column portions 78, 90, 92, and 93 are formed in the storage space portion 72 of the case 71. Screw holes 96 for fixing the screws 94 are formed in the support wall portions 74 and 76 and the column portions 78, 90, 92, and 93. First and second covers 98 and 100 are provided, and a through hole 102 is formed in the cover 98 at a position corresponding to the screw hole 96. Similarly, the cover 100 is also in a position corresponding to the screw hole 96. A through hole 104 is formed.
このようにケース７１には接続体４を備えたコンデンサ群６、８が収納され、各コンデンサ群６、８は、カバー９８、１００で覆われ、ビス９４によってケース７１内に固定され、コンデンサ装置７０を構成することができる。 In this way, the capacitor group 6 and 8 including the connection body 4 is accommodated in the case 71. The capacitor groups 6 and 8 are covered with the covers 98 and 100, and are fixed in the case 71 by the screws 94. 70 can be configured.
そして、このようなコンデンサ装置７０によれば、既述のコンデンサの接続構造２及び接続体４を備えているので、複数のコンデンサ６１〜６４、８１〜８４の並列化及び直列化が実現されているとともに、コンデンサ接続の簡略化及びコンパクト化が実現され、接続体４による低インダクタンス化が図られている。 And according to such a capacitor | condenser apparatus 70, since the capacitor | condenser connection structure 2 and the connection body 4 which were already described are provided, the parallelization and serialization of the several capacitors 61-64 and 81-84 are implement | achieved. In addition, simplification and compactness of the capacitor connection are realized, and the inductance is reduced by the connection body 4.
次に、本発明に係る接続体、電子部品の接続構造、及び電子部品装置の上記実施形態について、変形例を列挙して説明する。 Next, the above-described embodiments of the connection body, the electronic component connection structure, and the electronic component device according to the present invention will be described by listing modifications.
(1) 接続体４は、バスバー４１〜４４を導体パターンとし、絶縁紙４５、４６を絶縁体とした基板で構成してもよい。 (1) The connection body 4 may be formed of a substrate having the bus bars 41 to 44 as conductor patterns and the insulating paper 45 and 46 as insulators.
(2) コンデンサ群６、８をそれぞれ４個のコンデンサで構成したが、３以下又は５以上のコンデンサを用いて構成してもよい。 (2) The capacitor groups 6 and 8 are each composed of four capacitors, but may be composed of three or less capacitors or five or more capacitors.
(3) 接続体４をコンデンサ群６に接続するバスバー４１、４２と、コンデンサ群８に接続するバスバー４３、４４とからなる４層構造としたが、これに限らず、第１のコンデンサ群６に接続するバスバー４１、４２に更に、正極側接続用のバスバー、負極側接続用のバスバーを絶縁部材を介在させて積層し、第２のコンデンサ群８にも同様に積層してもよく、接続体のバスバーを６層又は８層又はそれ以上の多層としてもよい。 (3) Although the four-layer structure including the bus bars 41 and 42 for connecting the connection body 4 to the capacitor group 6 and the bus bars 43 and 44 for connecting to the capacitor group 8 is used, the present invention is not limited to this, and the first capacitor group 6 The bus bars 41 and 42 connected to the positive electrode side connection bus bar and the negative electrode side connection bus bar may be laminated with an insulating member interposed therebetween, and the second capacitor group 8 may be laminated similarly. The body busbar may be 6 layers, 8 layers or more.
(4) 上記実施形態では、極性を持つ電子部品として電解コンデンサを例示したが、フィルムコンデンサ等の電解コンデンサ以外のコンデンサ、抵抗、電池等の電子部品を用いてもよい。極性を有しない抵抗やフィルムコンデンサを用いても、本発明によれば、インダクタンス低減効果が得られる。 (4) In the above embodiment, an electrolytic capacitor is exemplified as an electronic component having polarity. However, a capacitor other than an electrolytic capacitor such as a film capacitor, or an electronic component such as a resistor or a battery may be used. Even if a resistor or a film capacitor having no polarity is used, the inductance reduction effect can be obtained according to the present invention.
(5) 上記実施形態では、バスバー４１でコンデンサ群６の正極端子１２、バスバー４２でコンデンサ群６の負極端子１４、バスバー４３でコンデンサ群８の正極端子１２、バスバー４４でコンデンサ群８の負極端子１４を接続する構成としたが、バスバー４１でコンデンサ群６の負極端子１４、バスバー４２でコンデンサ群６の正極端子１２、バスバー４３でコンデンサ群８の負極端子１４、バスバー４４でコンデンサ群８の正極端子１２を接続する構成としてもよく、隣接して流れる電流の方向を互いに逆方向とすることができ、同様に、インダクタンス低減効果が得られる。 (5) In the above embodiment, the bus bar 41 has the positive terminal 12 of the capacitor group 6, the bus bar 42 has the negative terminal 14 of the capacitor group 6, the bus bar 43 has the positive terminal 12 of the capacitor group 8, and the bus bar 44 has the negative terminal of the capacitor group 8. 14, the bus bar 41 is connected to the negative electrode terminal 14 of the capacitor group 6, the bus bar 42 is connected to the positive electrode terminal 12 of the capacitor group 6, the bus bar 43 is connected to the negative electrode terminal 14 of the capacitor group 8, and the bus bar 44 is connected to the positive electrode of the capacitor group 8. The terminal 12 may be connected, and the directions of currents flowing adjacent to each other can be opposite to each other. Similarly, an inductance reduction effect can be obtained.
(6) 上記実施形態では、隣接する第２のバスバー４２と第３のバスバー４３を共通化し、第１のバスバー４１に正極側の外部接続部１６を接続し、第４のバスバー４４に負極側の外部接続部１８を接続し、バスバー４１〜４４において、隣接して流れる電流の向きを互いに逆方向にしたものを示したが、これに限らず、第１のバスバー４１と第４のバスバー４４を共通化し、第２のバスバー４２に正極側の外部接続部１６を接続し、第３のバスバー４３に負極側の外部接続部１８を接続してもよく、バスバー４１〜４４において、隣接して流れる電流の向きを互いに逆方向に設定することもできる。 (6) In the above embodiment, the adjacent second bus bar 42 and the third bus bar 43 are made common, the first bus bar 41 is connected to the positive external connection portion 16, and the fourth bus bar 44 is connected to the negative electrode side. In the bus bars 41 to 44, the directions of the currents that flow adjacent to each other are shown to be opposite to each other. However, the present invention is not limited to this, and the first bus bar 41 and the fourth bus bar 44 are not limited thereto. And connecting the positive external connection portion 16 to the second bus bar 42 and connecting the negative external connection portion 18 to the third bus bar 43. The directions of the flowing currents can be set in opposite directions.
以上述べたように、本発明の最も好ましい実施形態等について説明したが、本発明は上記記載に限定されるものではなく、特許請求の範囲に記載され、又は、発明を実施するための最良の形態に開示された発明の要旨に基づき、当業者において様々な変形や変更が可能であり、斯かる変形や変更が本発明の範囲に含まれることはいうまでもない。
As described above, the most preferred embodiment of the present invention has been described. However, the present invention is not limited to the above description, and is described in the claims or the best for carrying out the invention. Various modifications and changes can be made by those skilled in the art based on the gist of the invention disclosed in the embodiments, and it goes without saying that such modifications and changes are included in the scope of the present invention.
本発明によれば、複数のコンデンサ等の電子部品の直並列接続に関し、電子部品の配置と接続構造の簡略化とともに、接続部の低インダクタンス化を図ることができ、有用である。
ADVANTAGE OF THE INVENTION According to this invention, regarding the serial-parallel connection of several electronic components, such as a capacitor | condenser, the arrangement | positioning of an electronic component and the connection structure can be simplified, and the low inductance of a connection part can be aimed at, and it is useful.
２ コンデンサの接続構造
４ 接続体
６ 第１のコンデンサ群（第１の電子部品群）
８ 第２のコンデンサ群（第２の電子部品群）
１２ 正極端子
１４ 負極端子
１６、１８ 外部接続部（第１及び第２の接続端子部）
２０ 共通接続部
２２、２６ 接続孔（接続部）
２４、２８ 貫通孔（貫通部）
４１ 第１のバスバー
４２ 第２のバスバー
４３ 第３のバスバー
４４ 第４のバスバー
４５、４６ 絶縁紙（絶縁部材）
６１〜６４、８１〜８４ コンデンサ（電子部品）
2 Capacitor connection structure 4 Connection body 6 First capacitor group (first electronic component group)
8 Second capacitor group (second electronic component group)
12 Positive terminal 14 Negative terminal 16, 18 External connection portion (first and second connection terminal portions)
20 Common connection part 22, 26 Connection hole (connection part)
24, 28 Through hole (through part)
41 1st bus bar 42 2nd bus bar 43 3rd bus bar 44 4th bus bar 45, 46 Insulating paper (insulating member)
61-64, 81-84 Capacitors (electronic parts)
Claims (5)
前記第１の電子部品群の各電子部品の正極端子側を共通に接続する第１のバスバーと、
前記第１の電子部品群の各電子部品の負極端子側を共通に接続する第２のバスバーと、
前記第２の電子部品群の各電子部品の正極端子側を共通に接続する第３のバスバーと、
前記第２の電子部品群の各電子部品の負極端子側を共通に接続する第４のバスバーと、
前記第１のバスバーと前記第２のバスバー、前記第３のバスバーと前記第４のバスバー間に介在される絶縁部材と、
前記第１のバスバーと前記第４のバスバー、又は前記第２のバスバーと前記第３のバスバーを接続する共通接続部と、
前記共通接続部が形成されていない前記第２のバスバーと前記第３のバスバー、又は前記第１のバスバーと前記第４のバスバーに形成される接続端子部と、
からなり、前記第１のバスバーと前記第２のバスバー、前記第３のバスバーと前記第４のバスバーが前記絶縁部材を介して積層され、前記共通接続部と、前記接続端子部とが近接するように前記第１ないし前記第４のバスバーに配置されるとともに、前記第１のバスバーに流れる電流と前記第２のバスバーに流れる電流の向きが逆方向に設定され、前記第２のバスバーに流れる電流と前記第３のバスバーに流れる電流の向きが逆方向に設定され、前記第３のバスバーに流れる電流と前記第４のバスバーに流れる電流の向きが逆方向に設定されたことを特徴とする接続体。 A first and second electronic component group in which the terminal sides of a plurality of electronic components are opposed to each other, and the first electronic component group disposed within a facing interval between the first and second electronic component groups. And a connection body used for connection between terminals of the second electronic component group,
A first bus bar that connects the positive terminal side of the electronic components of the first group of electronic components in common,
A second bus bar that connects the negative terminal side of the electronic components of the first group of electronic components in common,
A third bus bar which connects the positive electrode terminal side of the electronic components of the second group of electronic components in common,
A fourth bus bar for connecting the negative terminal side of the electronic components of the second group of electronic components in common,
An insulating member interposed between the first bus bar and the second bus bar, the third bus bar and the fourth bus bar;
A common connection for connecting the first bus bar and the fourth bus bar, or the second bus bar and the third bus bar;
A connection terminal portion formed on the second bus bar and the third bus bar, or the first bus bar and the fourth bus bar, in which the common connection portion is not formed;
The first bus bar, the second bus bar, the third bus bar, and the fourth bus bar are stacked via the insulating member, and the common connection portion and the connection terminal portion are close to each other. the first through the fourth is arranged to the busbar Rutotomoni, the direction of the current flowing in the said current flowing through the first bus bar second bus bar is set in the opposite direction so as to flow into the second bus bar The direction of the current and the current flowing through the third bus bar is set in the opposite direction, and the direction of the current flowing through the third bus bar and the current flowing through the fourth bus bar is set in the reverse direction. Connected body.
前記第３のバスバー、前記絶縁部材及び前記第４のバスバーからなる第２の積層体と、
前記第１の積層体の第１のバスバー及び／又は第２のバスバーに形成され、前記第１の電子部品群の電子部品の一方の端子側を接続する接続部と、他方の端子側を非接触で通過させる貫通部と、
前記第２の積層体の第３のバスバー及び／又は第４のバスバーに形成され、前記第２の電子部品群の電子部品の一方の端子側を接続する接続部と、他方の端子側を非接触で通過させる貫通部と、
を備えたことを特徴とする請求項１記載の接続体。 A first laminate comprising the first bus bar, the insulating member and the second bus bar;
A second laminate comprising the third bus bar, the insulating member and the fourth bus bar;
A connecting portion that is formed on the first bus bar and / or the second bus bar of the first stacked body and connects one terminal side of the electronic components of the first electronic component group, and the other terminal side is not connected A penetrating part to be passed by contact;
A connection portion that is formed on the third bus bar and / or the fourth bus bar of the second stacked body and connects one terminal side of the electronic components of the second electronic component group, and the other terminal side is not connected A penetrating part to be passed by contact;
The connection body according to claim 1, further comprising:
この第１の接続端子部との間に前記絶縁部材を介在させて設置され、且つ、前記第２の電子部品群の前記第３のバスバー又は前記第４のバスバーと一体に形成されて外部回路と接続される第２の接続端子部と、
を備えたことを特徴とする請求項１又は２記載の接続体。 A first connection terminal portion formed integrally with the first bus bar or the second bus bar of the first electronic component group and connected to an external circuit;
The insulating member is interposed between the first connection terminal portion and the third bus bar or the fourth bus bar of the second electronic component group, and is formed integrally with the external circuit. A second connection terminal connected to
The connection body according to claim 1, further comprising:
前記第１のバスバーに前記第１の電子部品群の各電子部品の正極端子側を共通に接続し、前記第２のバスバーに前記第１の電子部品群の各電子部品の負極端子側を共通に接続し、前記第３のバスバーに前記第２の電子部品群の各電子部品の正極端子側を共通に接続し、前記第４のバスバーに前記第２の電子部品群の各電子部品の負極端子側を共通に接続してなる請求項１ないし請求項３のいずれかに記載の接続体を備えたことを特徴とする電子部品の接続構造。 An electronic component connection structure comprising first and second electronic component groups, each terminal side of a plurality of electronic components facing each other, and first, second, third, and fourth bus bars,
The positive terminal side of each electronic component of the first electronic component group is commonly connected to the first bus bar, and the negative terminal side of each electronic component of the first electronic component group is commonly connected to the second bus bar. The positive terminal side of each electronic component of the second electronic component group is commonly connected to the third bus bar, and the negative electrode of each electronic component of the second electronic component group is connected to the fourth bus bar. 4. A connection structure for an electronic component comprising the connection body according to claim 1, wherein the terminal side is connected in common.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2004193433A JP4479380B2 (en) | 2004-06-30 | 2004-06-30 | CONNECTION BODY, ELECTRONIC COMPONENT CONNECTION STRUCTURE, AND ELECTRONIC COMPONENT DEVICE |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2004193433A JP4479380B2 (en) | 2004-06-30 | 2004-06-30 | CONNECTION BODY, ELECTRONIC COMPONENT CONNECTION STRUCTURE, AND ELECTRONIC COMPONENT DEVICE |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2006019367A JP2006019367A (en) | 2006-01-19 |
| JP4479380B2 true JP4479380B2 (en) | 2010-06-09 |
Family
ID=35793374
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2004193433A Expired - Fee Related JP4479380B2 (en) | 2004-06-30 | 2004-06-30 | CONNECTION BODY, ELECTRONIC COMPONENT CONNECTION STRUCTURE, AND ELECTRONIC COMPONENT DEVICE |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP4479380B2 (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2012043266A1 (en) * | 2010-09-30 | 2012-04-05 | 新神戸電機株式会社 | Bus bar and structure for connecting bus bar |
Families Citing this family (22)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4847359B2 (en) * | 2007-01-30 | 2011-12-28 | 株式会社小松製作所 | Electronic component cooling device and electronic component module |
| JP4748460B2 (en) * | 2007-04-17 | 2011-08-17 | Ｔｄｋラムダ株式会社 | Conductor mounting structure |
| JP5347565B2 (en) * | 2009-02-27 | 2013-11-20 | 株式会社明電舎 | Power conversion unit |
| JP5662441B2 (en) * | 2009-07-24 | 2015-01-28 | ブラックベリー リミテッド | Low noise battery |
| US8541117B2 (en) * | 2009-11-11 | 2013-09-24 | Blackberry Limited | Low noise battery with a magnetic compensation structure for wireless mobile communication device |
| JP5645544B2 (en) * | 2010-08-23 | 2014-12-24 | 株式会社指月電機製作所 | Capacitor |
| JP5789946B2 (en) * | 2010-10-01 | 2015-10-07 | 株式会社明電舎 | Capacitor device |
| JP5578088B2 (en) * | 2011-01-18 | 2014-08-27 | 日産自動車株式会社 | Assembled battery |
| EP2675053A4 (en) | 2011-02-10 | 2015-01-07 | Mitsubishi Electric Corp | Power conversion device |
| US8772634B2 (en) * | 2011-02-28 | 2014-07-08 | General Electric Company | Busbar for power conversion applications |
| KR101740174B1 (en) | 2013-06-17 | 2017-05-25 | 도시바 미쓰비시덴키 산교시스템 가부시키가이샤 | Power conversion device |
| JP6609928B2 (en) * | 2015-01-28 | 2019-11-27 | 株式会社明電舎 | Capacitor mounting structure and power converter |
| JP6569978B2 (en) * | 2015-07-17 | 2019-09-04 | パナソニックＩｐマネジメント株式会社 | Power line lead-in device and non-contact insulating trolley using the same |
| JP6482438B2 (en) * | 2015-09-09 | 2019-03-13 | 高周波熱錬株式会社 | Induction heating power supply |
| JP6326038B2 (en) * | 2015-12-24 | 2018-05-16 | 太陽誘電株式会社 | Electrical circuit device |
| TWI665941B (en) * | 2017-03-09 | 2019-07-11 | 日商高周波熱錬股份有限公司 | Induction heating power supply apparatus |
| JP7258481B2 (en) * | 2018-07-02 | 2023-04-17 | 株式会社エンビジョンＡｅｓｃジャパン | battery module |
| JP6581323B1 (en) * | 2019-05-16 | 2019-09-25 | 株式会社日立製作所 | In-wheel electric system |
| JP7338480B2 (en) * | 2020-01-10 | 2023-09-05 | トヨタ自動車株式会社 | Battery cooling structure in vehicle |
| CN112701878B (en) * | 2020-12-08 | 2022-07-08 | 日立电梯（中国）有限公司 | Bus capacitor structure and elevator frequency converter |
| JP2022108691A (en) * | 2021-01-13 | 2022-07-26 | 日立Astemo株式会社 | power converter |
| CN116868494A (en) * | 2021-05-25 | 2023-10-10 | 日立能源瑞士股份公司 | Power electronics building block for modular multilevel converter |
-
2004
- 2004-06-30 JP JP2004193433A patent/JP4479380B2/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2012043266A1 (en) * | 2010-09-30 | 2012-04-05 | 新神戸電機株式会社 | Bus bar and structure for connecting bus bar |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2006019367A (en) | 2006-01-19 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JP4479380B2 (en) | CONNECTION BODY, ELECTRONIC COMPONENT CONNECTION STRUCTURE, AND ELECTRONIC COMPONENT DEVICE | |
| CN108511666B (en) | Conductive module and battery pack | |
| JP7410287B2 (en) | Soft-pack battery modules, battery packs, and devices using soft-pack battery modules | |
| JP6247448B2 (en) | Power supply | |
| JP2020013655A (en) | Circuit body and battery module | |
| JP5747812B2 (en) | Power converter | |
| WO2013058322A1 (en) | Power supply device | |
| JP3912201B2 (en) | Cell module | |
| JP5203310B2 (en) | Metallized film capacitors | |
| US20140308560A1 (en) | Wire arranging device | |
| WO2014181806A1 (en) | Busbar module and power source device | |
| US10673053B2 (en) | Connector system, battery module, method for forming a tap, and operating device | |
| JP5045343B2 (en) | Capacitor | |
| JP2006319027A (en) | Low-inductance capacitor | |
| JP2019036475A (en) | Bus bar module and battery pack | |
| JP2014053390A (en) | Capacitor module | |
| JP5800671B2 (en) | Connection control body for battery pack | |
| JP4292494B2 (en) | Inverter device | |
| JP2004127775A (en) | Fuel cell | |
| JP2006100507A (en) | Capacitor connecting structure | |
| JP2006310490A (en) | Capacitor device | |
| JP2006060967A (en) | Connector, connection structure of electronic component, and electronic component device | |
| JP2019037048A5 (en) | ||
| JP6609928B2 (en) | Capacitor mounting structure and power converter | |
| JP2021022618A (en) | Capacitor module |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20070611 |
|
| A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20091124 |
|
| A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20100121 |
|
| TRDD | Decision of grant or rejection written | ||
| A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 Effective date: 20100223 |
|
| A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 |
|
| A61 | First payment of annual fees (during grant procedure) |
Free format text: JAPANESE INTERMEDIATE CODE: A61 Effective date: 20100308 |
|
| FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20130326 Year of fee payment: 3 |
|
| R150 | Certificate of patent or registration of utility model |
Ref document number: 4479380 Country of ref document: JP Free format text: JAPANESE INTERMEDIATE CODE: R150 Free format text: JAPANESE INTERMEDIATE CODE: R150 |
|
| FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20130326 Year of fee payment: 3 |
|
| FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20140326 Year of fee payment: 4 |
|
| LAPS | Cancellation because of no payment of annual fees |