JP4458045B2 - Circuit connection repair method - Google Patents

Description

本発明は、多数の相対向する回路が接着剤を介して導通接続された回路接続部の補修方法に関する。   The present invention relates to a method for repairing a circuit connection portion in which a large number of opposing circuits are conductively connected via an adhesive.

近年、精密電子機器の分野では回路の高密度化が進んでいるため、配線の脱落、剥離や位置ずれによって電気的接続が不良であったり、回路の接続後に電子部品や回路が不良になることが顕著になっている。このため、回路間を引き剥がす等により剥離し、回路上及び回路間に残った接着剤残さを有機溶剤を含浸させたバフ回転子（例えば特許文献１を参照）や接着剤剥離用組成物（例えば特許文献２及び特許文献３を参照）を用いて除去した後に、新たに良品を、接着剤を用いて接続（以下、再接続と称す）する方法が用いられている。   In recent years, as the density of circuits has increased in the field of precision electronic equipment, electrical connection may be poor due to dropping, peeling, or misalignment of wiring, or electronic components or circuits may become defective after the circuit is connected. Has become prominent. For this reason, it peels by peeling between circuits etc., the buffing rotator (for example, refer patent document 1) which impregnated the adhesive residue which remained on the circuit and between circuits with the organic solvent (for example, patent document 1) ( For example, a method is used in which a non-defective product is newly connected using an adhesive (hereinafter referred to as reconnection) after being removed using, for example, Patent Document 2 and Patent Document 3.

しかしながら、前記の接着剤の除去法では、作業に長時間を必要とし、接着剤の部分的な除去はきわめて困難である。さらに使用する有機溶剤に長時間、回路部材がさらされることによる回路部材の寸法精度のずれや回路端子の脱落等の問題がある。そして、接着剤の除去が不十分な場合、また、使用する溶剤が電子部品や補修する回路の支持材を腐食した場合、再接続後の接続不良や接続信頼性が低下するという問題がある。
特開平６−２２３９４５号公報 特開平６−０８０９３９号公報 特開平６−０８０９４０号公報 However, the above-described method for removing the adhesive requires a long time for work, and partial removal of the adhesive is extremely difficult. Furthermore, there are problems such as deviations in the dimensional accuracy of circuit members and dropouts of circuit terminals due to the circuit members being exposed to the organic solvent used for a long time. And when removal of an adhesive agent is insufficient, and when the solvent to be used corrodes the electronic component and the support material of the circuit to repair, there exists a problem that the connection defect after a reconnection and connection reliability fall.
JP-A-6-223945 JP-A-6-080939 JP-A-6-080940

本発明の目的は、補修に長い時間を要していた接着剤の除去を、短時間で、かつ回路部材を損傷せずに行うことが可能な方法を提供するものである。   An object of the present invention is to provide a method capable of removing an adhesive that has taken a long time for repairing in a short time without damaging a circuit member.

かくして、本発明によれば、下記を提供する：
１．多数の相対向する回路を有する回路部材を接着剤を介して導通接続した回路接続部を補修する方法であって、
補修を要する回路接続部分の相互の接合部を剥離し、少なくとも一方の、接着剤が残存している回路部材に、転写用接着剤を用いて転写用基材を接着し、該回路部材から回路部材に残存している接着剤及び転写用接着剤を転写用基材と共に剥離する回路接続部の補修方法であって、前記回路部材と前記転写用基材の少なくとも一方はフィルム形状である回路接続部の補修方法が提供される。
２．前記フィルム形状回路部材がフレキシブル回路部材（ＦＰＣ）である上記１記載の回路接続部の補修方法。
３．前記フィルム形状転写用基材が粗化銅箔である上記第１項記載の回路接続部の補修方法。
４．補修する回路部材を転写用基材から剥離した後、有機溶剤で、補修する回路部材を洗浄することを特徴とする上記第１〜３項のいずれか一に記載の回路接続部の補修方法。
５．転写用接着剤が補修を要する回路接続部の接合に用いられた接着剤と同一の接着剤であることを特徴とする上記第１〜４項のいずれか一に記載の回路接続部の補修方法。 Thus, according to the present invention, the following is provided:
1. A method of repairing a circuit connecting portion in which circuit members having a large number of opposing circuits are conductively connected via an adhesive,
The circuit connection part that requires repair is peeled off from each other, and the transfer substrate is adhered to the circuit member on which at least one adhesive remains, and the circuit is connected to the circuit member. A method for repairing a circuit connection part in which an adhesive remaining on a member and a transfer adhesive are peeled together with a transfer base material, wherein at least one of the circuit member and the transfer base material is in a film shape Department repair methods are provided.
2. 2. The method for repairing a circuit connecting portion according to 1 above, wherein the film-shaped circuit member is a flexible circuit member (FPC).
3. The method for repairing a circuit connection part according to claim 1, wherein the film shape transfer substrate is a roughened copper foil.
4). 4. The circuit connecting part repairing method according to any one of the above items 1 to 3, wherein the circuit member to be repaired is washed with an organic solvent after the circuit member to be repaired is peeled off from the transfer substrate.
5). The method for repairing a circuit connection part according to any one of the above items 1 to 4, wherein the transfer adhesive is the same adhesive as the adhesive used for joining the circuit connection part requiring repair. .

剥離する場所は、回路部材と転写用接着剤及び残存している接着剤の界面である。   The peeling site is the interface between the circuit member, the transfer adhesive, and the remaining adhesive.

本発明は、従来、溶剤によって補修していた回路部材を、無溶剤で且つ短時間に除去する方法であって、再接続の信頼性を大幅に向上させることの出来る回路接続部の補修方法である。   The present invention is a method for removing a circuit member that has been repaired with a solvent in a short time without using a solvent, and is a method for repairing a circuit connection portion that can greatly improve the reliability of reconnection. is there.

本発明に用いる転写用接着剤は、例えば、接着ハンドブック（第2版、日刊工業新聞社刊、日本接着協会編）II．接着剤編で記述されている接着剤であれば好適に用いることが出来る。また、回路部材を接着する接着剤としては主にエポキシ樹脂系の接着剤が用いられており、エポキシ樹脂系の転写用接着剤は異方導電性接着剤に対して強固に接着することが期待されるためより好ましい。更に、異方導電性接着剤そのものを転写用接着剤として用いた場合、同種の接着剤による接着となり、接着力が優れているため特に好ましい。また、転写用接着剤の形状としては液状及びフィルム状が挙げられるが、液状よりもフィルム状の方が作業性に優れるため好ましい。   The transfer adhesive used in the present invention is, for example, an adhesion handbook (2nd edition, published by Nikkan Kogyo Shimbun, edited by Japan Adhesion Association) II. Any adhesive can be suitably used as long as it is described in the adhesive section. In addition, epoxy resin adhesives are mainly used as adhesives for bonding circuit members, and epoxy resin transfer adhesives are expected to adhere strongly to anisotropic conductive adhesives. Therefore, it is more preferable. Furthermore, when the anisotropic conductive adhesive itself is used as a transfer adhesive, it is particularly preferable because the adhesive is of the same kind and has excellent adhesive strength. In addition, examples of the shape of the transfer adhesive include a liquid form and a film form, but a film form is more preferable than a liquid form because the workability is superior.

本発明に用いる転写用基材としては、該転写用基材と転写用接着剤の接着強度が、補修する回路部材と接着剤の接着強度より大きければ特に制限されない。例えば表面を酸、アルカリにより粗化した金属やガラス、表面をプラズマ、紫外線、コロナ処理で活性化させた金属やガラス、エポキシ樹脂やアクリル樹脂、ポリエーテルスルフォン、ポリイミド、ポリプロピレン等のプラスチック及び、前記プラスチックをガラス織布に含浸させ強化させた基材や前記プラズマ、紫外線、コロナ処理で表面を活性化させたプラスチックを好適に用いることが出来る。ここでいう金属とは周期律表中の水素を除く１族及び１１族（アルカリ金属、銅族）、２族及び１２族（アルカリ土類金属、亜鉛族）、硼素を除く３族、珪素を除く４族、８〜１０族（鉄族、白金族）及び５〜７族（Ｖ、VI、VII族の各a亜族）に属する物質及びこれらの少なくとも２種類の物質からなる合金のなかで、その融点が転写用基材から補修する回路を剥離する際に加熱する温度より高いものである。   The transfer substrate used in the present invention is not particularly limited as long as the adhesive strength between the transfer substrate and the transfer adhesive is larger than the adhesive strength between the circuit member to be repaired and the adhesive. For example, metal or glass whose surface is roughened with acid or alkali, metal or glass whose surface is activated by plasma, ultraviolet ray, corona treatment, plastic such as epoxy resin, acrylic resin, polyether sulfone, polyimide, polypropylene, and the above A base material obtained by impregnating and reinforcing a glass woven fabric with a plastic, or a plastic whose surface is activated by the plasma, ultraviolet ray or corona treatment can be suitably used. The metal mentioned here is a group 1 and 11 (alkali metal, copper group) excluding hydrogen in the periodic table, a group 2 and 12 (alkaline earth metal, zinc group), a group 3 excluding boron, silicon. Of the materials belonging to Group 4, Group 8 to 10 (iron group, platinum group) and Group 5 to 7 (each sub-group of Group V, VI, and VII) and alloys composed of at least two of these materials The melting point is higher than the heating temperature when the circuit to be repaired is peeled off from the transfer substrate.

本発明で補修する回路を転写用基材から剥離する際、−２０℃〜４００℃の条件で剥離することで良好に回路接続部を補修することができる。接着強度は高温になるほど低下するため１００℃〜４００℃で剥離した場合、回路の損傷等が低減できるため好ましく、１５０℃〜３００℃で剥離した場合、回路の損傷が少なくかつ、補修する回路が熱変形しにくいためより好ましい。   When the circuit to be repaired in the present invention is peeled off from the transfer substrate, the circuit connecting portion can be repaired satisfactorily by peeling off at −20 ° C. to 400 ° C. Since the adhesive strength decreases as the temperature increases, it is preferable when peeling at 100 ° C. to 400 ° C. because damage to the circuit can be reduced. When peeling at 150 ° C. to 300 ° C., there is little damage to the circuit and the circuit to be repaired It is more preferable because it is difficult to be thermally deformed.

また、補修が必要な回路部材側から加熱した場合、温度勾配が生じ、回路部材と接着剤界面の温度が転写用接着剤と転写用基材界面の温度より高温になるため、回路部材と接着剤との接着強度の低下が転写用接着剤と転写用基材との接着強度の低下より大きくなり、容易に回路部材に残存している接着剤を転写できるためより好ましい。   In addition, when heated from the side of the circuit member that requires repair, a temperature gradient occurs, and the temperature at the interface between the circuit member and the adhesive becomes higher than the temperature at the interface between the transfer adhesive and the transfer substrate. The decrease in the adhesive strength between the transfer agent and the transfer base material is greater than the decrease in the adhesive strength between the transfer adhesive and the transfer substrate, and the adhesive remaining on the circuit member can be easily transferred.

本発明によって、補修が必要な回路部材を、溶剤を使用せず短時間で、回路の損傷もなく良好に補修でき且つ、補修した回路部材の再接続後の接続信頼性を大幅に向上させることが出来る。   According to the present invention, a circuit member that requires repair can be repaired without using a solvent in a short time without damage to the circuit, and the connection reliability after reconnection of the repaired circuit member is greatly improved. I can do it.

以下において、本発明を実施例に基づきさらに詳しく説明する。   In the following, the present invention will be described in more detail based on examples.

（実施例１）
ポリイミドと、銅箔を接着する接着剤及び厚さ１８μｍの銅箔からなる３層構成で、ライン幅１００μｍ、ピッチ２００μｍのフレキシブル回路板（３層ＦＰＣ）と厚さ１．１ｍｍのガラス上にインジウム−錫酸化物（ＩＴＯ）を蒸着により形成したＩＴＯ基板（表面抵抗＜２０Ω／口）を異方導電フィルム（エポキシ系、日立化成工業株式会社製商品名、アニソルムＡＣ−７０７３）を用い１８０℃、３ＭＰａで１０秒間加熱加圧して幅２ｍｍにわたり接続した。 Example 1
A three-layer structure consisting of polyimide, an adhesive for bonding copper foil and a copper foil with a thickness of 18 μm, a flexible circuit board (3-layer FPC) with a line width of 100 μm and a pitch of 200 μm, and indium on a glass with a thickness of 1.1 mm -An ITO substrate (surface resistance <20 Ω / mouth) formed by vapor deposition of tin oxide (ITO) is 180 ° C. using an anisotropic conductive film (epoxy, trade name, manufactured by Hitachi Chemical Co., Ltd., Anisolm AC-7073), It was heated and pressurized at 3 MPa for 10 seconds and connected over a width of 2 mm.

次に２５０℃に加熱したホットプレートを用いて、上記で作製した接続体のＩＴＯ基板をホットプレート側にして加熱し、ＦＰＣを剥離した。前記方法で剥離した場合、ＦＰＣ（補修前ＦＰＣ）に異方導電フィルムの残さが固着していた。   Next, using the hot plate heated to 250 ° C., the ITO substrate of the connection body prepared above was heated to the hot plate side, and the FPC was peeled off. When it peeled by the said method, the residue of the anisotropic conductive film was adhering to FPC (FPC before repair).

補修前ＦＰＣと厚さ３５μｍの粗化銅箔（古河サーキットフォイル株式会社製、商品名ＧＴＳ−３５）を前記異方導電フィルムＡＣ−７０７３を用い、１８０℃、３ＭＰａで１０秒間加熱加圧して幅２ｍｍにわたり接着した。   FPC before repair and roughened copper foil with a thickness of 35 μm (product name GTS-35, manufactured by Furukawa Circuit Foil Co., Ltd.) are heated and pressed at 180 ° C. and 3 MPa for 10 seconds using the anisotropic conductive film AC-7073. Bonded over 2 mm.

次いで、２５０℃に加熱したホットプレートを用いて、補修前ＦＰＣをホットプレート側にして加熱しながら粗化銅箔を剥離した。この工程によって、補修前ＦＰＣに固着していた異方導電フィルムの残さは銅箔に転写され、ＦＰＣの電極は完全に露出した。   Next, using a hot plate heated to 250 ° C., the roughened copper foil was peeled off while heating with the FPC before repair being the hot plate side. By this step, the residue of the anisotropic conductive film fixed to the FPC before repair was transferred to the copper foil, and the FPC electrode was completely exposed.

（実施例２）
転写用接着剤にシアノアクリレート系接着剤（東亞合成株式会社製、商品名アロンアルファ）を用い、実施例１と同様に作製した補修前ＦＰＣと厚さ３５μｍの粗化銅箔（古河サーキットフォイル株式会社製、商品名ＧＴＳ−３５）を室温で幅２ｍｍにわたり接着した。 (Example 2)
A cyanoacrylate adhesive (trade name Aron Alpha, manufactured by Toagosei Co., Ltd.) was used as the transfer adhesive, and FPC before repair produced in the same manner as in Example 1 and a roughened copper foil with a thickness of 35 μm (Furukawa Circuit Foil Co., Ltd.) Product, trade name GTS-35) was bonded over a width of 2 mm at room temperature.

次いで、５０℃に加熱したホットプレートを用いて、補修前ＦＰＣをホットプレート側にして加熱しながら粗化銅箔を剥離した。   Next, using a hot plate heated to 50 ° C., the roughened copper foil was peeled off while heating with the FPC before repair being the hot plate side.

（実施例３）
フェノキシ樹脂（ユニオンカーバイド株式会社製、商品名：ＰＫＨＣ、平均分子量：４５０００）５０ｇを、重量比でトルエン／酢酸エチル＝５０／５０の混合溶剤に溶解して、固形分４０重量％の溶液とした。 (Example 3)
50 g of phenoxy resin (manufactured by Union Carbide Co., Ltd., trade name: PKHC, average molecular weight: 45000) was dissolved in a mixed solvent of toluene / ethyl acetate = 50/50 by weight to obtain a solution having a solid content of 40% by weight. .

転写用接着剤１の作製
フィルム形成材として上記フェノキシ樹脂５０重量部、ラジカル重合性物質としてトリヒドロキシエチルグリコールジメタクリレート（共栄社株式会社製、商品名８０ＭＦＡ）４９重量部、リン酸エステル型アクリレート（共栄社株式会社製、商品名Ｐ−２Ｍ）１重量部、遊離ラジカル発生剤としてｔ−ヘキシルパーオキシ−２−エチルヘキサノネートの５０重量％ＤＯＰ溶液（日本油脂株式会社製、商品名パーキュアＨＯ）５重量部になるように配合し、厚さ８０μmの片面を表面処理したＰＥＴフィルムに塗工装置を用いて塗布し、７０℃、１０分の熱風乾燥をすることにより、接着剤層の厚さが３５μmの転写用接着剤１を得た。 Preparation of Transfer Adhesive 1 50 parts by weight of the above phenoxy resin as a film forming material, 49 parts by weight of trihydroxyethyl glycol dimethacrylate (trade name: 80MFA) manufactured by Kyoeisha Co., Ltd., phosphate ester acrylate (Kyoeisha) 1 part by weight manufactured by Co., Ltd., trade name P-2M), 50% by weight DOP solution of t-hexylperoxy-2-ethylhexanonate as a free radical generator (trade name Percure HO, manufactured by NOF Corporation) 5 The thickness of the adhesive layer is reduced by applying it to a PET film, which is blended so as to be part by weight, and having a surface treated on one side with a thickness of 80 μm using a coating apparatus and drying with hot air at 70 ° C. for 10 minutes. A 35 μm transfer adhesive 1 was obtained.

転写用接着剤に転写用接着剤１を用い、実施例１と同様に作製した補修前ＦＰＣと厚さ３５μｍの粗化銅箔（古河サーキットフォイル株式会社製、商品名ＧＴＳ−３５）を１５０℃、３ＭＰａで１０秒間加熱加圧して幅２ｍｍにわたり接着した以外は実施例１と同様にしてＦＰＣの補修を行った。   The transfer adhesive 1 was used as the transfer adhesive, and FPC before repair produced in the same manner as in Example 1 and a roughened copper foil having a thickness of 35 μm (product name: GTS-35, manufactured by Furukawa Circuit Foil Co., Ltd.) were 150 ° C. The FPC was repaired in the same manner as in Example 1 except that it was heated and pressurized at 3 MPa for 10 seconds and adhered over a width of 2 mm.

（実施例４）
３層ＦＰＣを、ポリイミド上に直接１２μｍの銅箔からなるライン幅５０μｍ、ピッチ１００μｍの回路を形成したフレキシブル回路板（２層ＦＰＣ）にした以外は実施例１と同様にしてＦＰＣの補修を行った。 Example 4
The FPC is repaired in the same manner as in Example 1 except that the three-layer FPC is a flexible circuit board (two-layer FPC) in which a circuit having a line width of 50 μm and a pitch of 100 μm made of 12 μm copper foil is directly formed on polyimide. It was.

（実施例５）
ポリプロピレン基材上に粘着層を形成した粘着フィルム（日立化成工業（株）製、商品名ヒタレックス Ｌ−３３６０）を補修前ＦＰＣに張り付け、次いで、室温で粘着フィルムをＦＰＣから剥離した。この工程によって、補修前ＦＰＣに固着していた異方導電フィルムの残さは粘着フィルムに転写され、ＦＰＣの電極は完全に露出した。 (Example 5)
An adhesive film having an adhesive layer formed on a polypropylene substrate (manufactured by Hitachi Chemical Co., Ltd., trade name: Hitalex L-3360) was attached to the FPC before repair, and then the adhesive film was peeled from the FPC at room temperature. By this process, the residue of the anisotropic conductive film fixed to the FPC before repair was transferred to the adhesive film, and the FPC electrode was completely exposed.

（実施例６）
粗化銅箔を厚さ０．８ｍｍのガラス繊維入りエポキシ板にした他は実施例３と同様にしてＦＰＣの補修を行った。 (Example 6)
The FPC was repaired in the same manner as in Example 3 except that the roughened copper foil was replaced with a glass fiber epoxy plate having a thickness of 0.8 mm.

（実施例７）
粗化銅箔を、表面をプラズマ処理した厚さ１ｍｍのステンレス板にした他は実施例３と同様にしてＦＰＣの補修を行った。 (Example 7)
The FPC was repaired in the same manner as in Example 3 except that the roughened copper foil was changed to a 1 mm thick stainless steel plate whose surface was plasma treated.

（実施例８）
粗化銅箔を、表面をプラズマ処理した厚さ１ｍｍの銅板にした他は実施例３と同様にしてＦＰＣの補修を行った。 (Example 8)
The FPC was repaired in the same manner as in Example 3 except that the roughened copper foil was changed to a 1 mm thick copper plate whose surface was plasma-treated.

（実施例９）
粗化銅箔を、表面をプラズマ処理した厚さ１ｍｍのソーダガラスにした他は実施例３と同様にしてＦＰＣの補修を行った。 Example 9
The FPC was repaired in the same manner as in Example 3 except that the roughened copper foil was made into 1 mm thick soda glass whose surface was plasma-treated.

（実施例１０）
転写用接着剤２の作製
フィルム形成材として上記フェノキシ樹脂５０重量部、ラジカル重合性物質としてエポキシアクリレートオリゴマー（新中村化学工業株式会社製、商品名ＮＫオリゴＥＡ−１０２０）４０重量部、アクリレートモノマー（新中村化学工業株式会社製、商品名ＮＫエステルＡ−ＴＭＭ−３Ｌ）１０重量部、遊離ラジカル発生剤としてベンゾフェノン５重量部、これに増感剤として４，４’−ビスジエチルアミノベンゾフェノン（保土ケ谷化学工業株式会社製、商品名ＥＡＢ）を１重量部になるように配合し、厚さ８０μmの片面を表面処理したＰＥＴフィルムに塗工装置を用いて塗布し、７０℃、１０分の熱風乾燥により、接着剤層の厚さが３５μmの転写用接着剤２を得た。 (Example 10)
Production of Transfer Adhesive 2 50 parts by weight of the phenoxy resin as a film forming material, 40 parts by weight of an epoxy acrylate oligomer (made by Shin-Nakamura Chemical Co., Ltd., trade name NK Oligo EA-1020) as a radical polymerizable substance, an acrylate monomer ( Shin-Nakamura Chemical Co., Ltd., trade name NK Ester A-TMM-3L 10 parts by weight, free radical generator 5 parts by weight benzophenone, and sensitizer 4,4'-bisdiethylaminobenzophenone (Hodogaya Chemical Industries) Co., Ltd., trade name EAB) is blended so as to be 1 part by weight, applied to a PET film having a surface treated on one side having a thickness of 80 μm using a coating apparatus, and dried with hot air at 70 ° C. for 10 minutes. A transfer adhesive 2 having an adhesive layer thickness of 35 μm was obtained.

実施例１と同様に作製した補修前ＦＰＣと、表面をプラズマ処理した厚さ１ｍｍのソーダガラスを前記転写用接着剤２を用い、紫外線照射併用型熱圧着装置（加熱方式：コンスタントヒート型、東レエンジニアリング株式会社製）を用いて１３０℃、２ＭＰａで２０秒間の加熱加圧およびソーダガラス側からの紫外線照射を同時に行って幅２ｍｍにわたり接続した。この時の接着剤に照射される紫外線照射量は２．０Ｊ／ｃｍ^２とした。 A pre-repair FPC produced in the same manner as in Example 1 and a 1 mm thick soda glass whose surface was plasma-treated using the transfer adhesive 2 were combined with an ultraviolet irradiation type thermocompression bonding apparatus (heating method: constant heat type, Toray Industries, Inc.). Engineering Co., Ltd.) was used, and heating and pressurization at 130 ° C. and 2 MPa for 20 seconds and ultraviolet irradiation from the soda glass side were simultaneously performed for connection over a width of 2 mm. The ultraviolet irradiation amount irradiated to the adhesive at this time was 2.0 J / cm ² .

次いで、２５０℃に加熱したホットプレートを用いて、ソーダガラスをホットプレート側にして加熱しながらＦＰＣを剥離した。この工程によって、補修前ＦＰＣに固着していた異方導電フィルムの残さはソーダガラスに転写され、ＦＰＣの電極は完全に露出した。   Next, using a hot plate heated to 250 ° C., the FPC was peeled off while heating with the soda glass facing the hot plate. By this step, the residue of the anisotropic conductive film fixed to the FPC before repair was transferred to soda glass, and the electrodes of the FPC were completely exposed.

（実施例１１）
粗化銅箔をホットプレート側にして加熱した他は、実施例３と同様にしてＦＰＣの補修を行った。 (Example 11)
The FPC was repaired in the same manner as in Example 3 except that the roughened copper foil was heated on the hot plate side.

（実施例１２）
ホットプレートの代わりにスポットヒータ（白光株式会社製）で３層ＦＰＣ側から加熱した他は実施例３と同様にしてＦＰＣの補修を行った。 (Example 12)
The FPC was repaired in the same manner as in Example 3 except that it was heated from the three-layer FPC side with a spot heater (manufactured by Hakuko Co., Ltd.) instead of the hot plate.

（実施例１３）
実施例３で補修した３層ＦＰＣを、アセトンを含浸した綿棒で１分間僅かに残る接着剤を除去した。 (Example 13)
The 3-layer FPC repaired in Example 3 was removed with a cotton swab impregnated with acetone to remove the remaining adhesive for a minute.

（比較例１）
実施例１においてＦＰＣの補修を行わなかった。 (Comparative Example 1)
In Example 1, the FPC was not repaired.

（比較例２）
アセトンを含浸した綿棒で補修前ＦＰＣの電極部に残っている残さを除去し、ＦＰＣの電極を露出させた。 (Comparative Example 2)
The residue remaining in the electrode part of the FPC before repairing was removed with a cotton swab impregnated with acetone to expose the FPC electrode.

（回路の接続）
上記、実施例１〜１３と比較例1及び２で作製したＦＰＣを各々、厚さ１．１ｍｍのガラス上にインジウム−錫酸化物（ＩＴＯ）を蒸着により形成したＩＴＯ基板（表面抵抗＜２０Ω／□）と、異方導電フィルムを用い１８０℃、３ＭＰａで１０秒間加熱加圧して幅２ｍｍにわたり接続した。 (Circuit connection)
The FPCs produced in Examples 1 to 13 and Comparative Examples 1 and 2 were each ITO substrates formed by vapor deposition of indium-tin oxide (ITO) on glass having a thickness of 1.1 mm (surface resistance <20Ω / □) and an anisotropic conductive film, and heated and pressurized at 180 ° C. and 3 MPa for 10 seconds to connect over a width of 2 mm.

（接続抵抗の測定）
回路の再接続後、上記接続部を含むＦＰＣの隣接回路間の抵抗値を、初期と、８５℃、８５％ＲＨの高温高温槽中に５００時間保持した後にマルチメータで測定した。抵抗値は隣接回路間の抵抗１５０点の平均で示した。 (Measurement of connection resistance)
After reconnection of the circuit, the resistance value between adjacent circuits of the FPC including the connection portion was measured with a multimeter after being initially held in a high-temperature high-temperature bath at 85 ° C. and 85% RH for 500 hours. The resistance value is shown as an average of 150 resistances between adjacent circuits.

（接着強度の測定）
回路の接続後、９０°剥離、剥離速度５０ｍｍ／分で接着強度測定を行った。 (Measurement of adhesive strength)
After connecting the circuits, the adhesive strength was measured at 90 ° peeling and a peeling speed of 50 mm / min.

（絶縁性の評価）
補修した回路と、ライン幅１００μｍ、ピッチ２００μｍ、厚さ１８μｍの銅回路を交互に２５０本配置した櫛形回路を有するプリント基板を１６０℃、３ＭＰａで１０秒間加熱加圧して幅２ｍｍにわたり接続した。この接続体の櫛形回路に１００Ｖの電圧を印加し、８５℃、８５％ＲＨでの高温高湿試験５００時間後の絶縁抵抗値を測定した。 (Insulation evaluation)
A printed circuit board having a repaired circuit and a comb-shaped circuit in which 250 copper circuits having a line width of 100 μm, a pitch of 200 μm, and a thickness of 18 μm were alternately arranged was heated and pressed at 160 ° C. and 3 MPa for 10 seconds to be connected over a width of 2 mm. A voltage of 100 V was applied to the comb circuit of this connection body, and the insulation resistance value after 500 hours of a high temperature and high humidity test at 85 ° C. and 85% RH was measured.

これらの測定結果を表１に示した。   These measurement results are shown in Table 1.

実施例１は初期、高温高湿試験処理後の接続抵抗及び接着強度、高温高湿処理後絶縁抵抗に関して良好な特性が得られた。また、比較例１のＦＰＣの補修に要した時間と比較して１／４の短時間で補修できた。   In Example 1, good characteristics were obtained in the initial stage regarding the connection resistance and adhesive strength after the high temperature and high humidity test treatment and the insulation resistance after the high temperature and high humidity treatment. Moreover, compared with the time required for the repair of the FPC of Comparative Example 1, the repair was completed in a short time of 1/4.

実施例２においても良好な接続が得られ、且つ転写用接着剤が室温で接着できるため、実施例１と比較して短時間でＦＰＣを補修できた。   Also in Example 2, good connection was obtained, and the transfer adhesive could be adhered at room temperature, so that the FPC could be repaired in a shorter time than Example 1.

実施例３では実施例１より低温で転写用接着剤を接着できるためＦＰＣの回路の損傷が少なくなったため、実施例１と比較して良好な接続抵抗値が得られた。   In Example 3, since the transfer adhesive could be bonded at a lower temperature than in Example 1, damage to the circuit of the FPC was reduced, so that a favorable connection resistance value was obtained as compared with Example 1.

実施例４において２層ＦＰＣの補修においても良好な接続が得られることが確認された。   In Example 4, it was confirmed that good connection could be obtained even in the repair of the two-layer FPC.

実施例５では転写用接着剤である粘着剤層があらかじめ転写用基材であるポリプロピレン上に形成されており且つ、室温で接着できるため、短時間でＦＰＣを補修できた。   In Example 5, since the pressure-sensitive adhesive layer as the transfer adhesive was previously formed on the polypropylene as the transfer base material and could be bonded at room temperature, the FPC could be repaired in a short time.

実施例６〜９では転写用基材を変更しても良好にＦＰＣを補修できることを確認できた。   In Examples 6 to 9, it was confirmed that the FPC could be repaired satisfactorily even when the transfer substrate was changed.

実施例１０では実施例１より低温で転写用接着剤を接着できるためＦＰＣの回路の損傷が少なくなったため、実施例１と比較して良好な接続抵抗値が得られた。   In Example 10, since the transfer adhesive could be bonded at a lower temperature than in Example 1, damage to the circuit of the FPC was reduced. Therefore, a favorable connection resistance value was obtained as compared with Example 1.

実施例１１では転写用基材側から加熱してもＦＰＣの補修が可能であることを確認できた。   In Example 11, it was confirmed that the FPC could be repaired by heating from the transfer substrate side.

実施例１２ではホットプレートと比較してスポットヒータの方が効率よくＦＰＣを加熱できるため、補修に要する時間をより短縮できた。   In Example 12, since the spot heater can heat the FPC more efficiently than the hot plate, the time required for repair can be further shortened.

実施例１３では溶剤で洗浄することで実施例３で補修したＦＰＣに微量に残存していた異方導電性接着剤残さを取り除くことが出来たため、実施例１と比較して良好な接続抵抗値が得られた。   In Example 13, the anisotropic conductive adhesive residue remaining in a small amount in the FPC repaired in Example 3 could be removed by washing with a solvent. was gotten.

比較例１では異方導電性接着剤がＦＰＣ上に多量に残っているため、再接続時に異方導電性接着剤残さのため電気的接続が得られなかった。   In Comparative Example 1, since the anisotropic conductive adhesive remained in a large amount on the FPC, electrical connection could not be obtained due to the residual anisotropic conductive adhesive at the time of reconnection.

比較例２では溶剤による補修のためＦＰＣが溶剤に侵され、ＦＰＣ電極の脱落が発生し、接続抵抗が高くなった。   In Comparative Example 2, the FPC was attacked by the solvent due to the repair by the solvent, the FPC electrode dropped off, and the connection resistance increased.

本発明は、従来、溶剤によって補修していた回路部材を、無溶剤で、且つ短時間に回路部材の損傷なく除去する方法であって、再接続後の信頼性を大幅に向上させることが出来る。   The present invention is a method for removing a circuit member that has been conventionally repaired with a solvent without any solvent and without damaging the circuit member in a short time, and can greatly improve the reliability after reconnection. .

Claims (6)

補修を要する回路接続部分の相互の接合部を剥離し、少なくとも一方の、接着剤が残存している回路部材に、転写用接着剤を用いて転写用基材を接着し、該回路部材から回路部材に残存している接着剤及び転写用接着剤を転写用基材と共に剥離する回路接続部の補修方法であって、該転写用基材がフィルム形状であり、該転写用基材が粗化銅箔である回路接続部の補修方法。 The circuit connection part that requires repair is peeled off from each other, and the transfer substrate is adhered to the circuit member on which at least one adhesive remains, and the circuit is connected to the circuit member. A method of repairing a circuit connection part in which an adhesive remaining on a member and a transfer adhesive are peeled together with a transfer substrate, wherein the transfer substrate has a film shape, and the transfer substrate is roughened A method for repairing circuit connections that are copper foil . 前記回路部材がフィルム形状である請求項１記載の回路接続部の補修方法。The method for repairing a circuit connecting portion according to claim 1, wherein the circuit member has a film shape. 前記フィルム形状回路部材がフレキシブル回路部材（ＦＰＣ）である請求項２記載の回路接続部の補修方法。 The method for repairing a circuit connection portion according to claim 2, wherein the film-shaped circuit member is a flexible circuit member (FPC). 補修する回路部材を転写用基材から剥離した後、有機溶剤で、補修する回路部材を洗浄することを特徴とする請求項第１〜３項記載の回路接続部の補修方法。 After stripping the repair circuitry member from the transfer base material, an organic solvent, method of repairing a circuit connection portion as in claim 1 to 3 wherein wherein the washing circuit members to repair. 転写用接着剤が補修を要する回路接続部の接合に用いられた接着剤と同一の接着剤であることを特徴とする請求項第１〜４項のいずれか一に記載の回路接続部の補修方法。 The repair of a circuit connection part according to any one of claims 1 to 4, wherein the transfer adhesive is the same adhesive as that used for joining the circuit connection part requiring repair. Method. 補修を要する回路接続部分の相互の接合部を剥離し、少なくとも一方の、接着剤が残存している回路部材に接着され、該回路部材から回路部材に残存している接着剤を剥離する回路接続部の補修方法に使用される転写用接着剤つきフィルム形状転写用基材であって、該フィルム形状転写用基材が粗化銅箔であることを特徴とする転写用接着剤つきフィルム形状転写用基材。Circuit connection that peels off the mutual joints of circuit connection parts that require repair, adheres to at least one circuit member where adhesive remains, and peels the adhesive remaining on the circuit member from the circuit member Film shape transfer substrate with transfer adhesive used for repairing part of film, wherein the film shape transfer substrate is a roughened copper foil Substrate for use.