JP4455096B2 - Saw wire cutting device - Google Patents

Saw wire cutting device Download PDF

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JP4455096B2
JP4455096B2 JP2004050843A JP2004050843A JP4455096B2 JP 4455096 B2 JP4455096 B2 JP 4455096B2 JP 2004050843 A JP2004050843 A JP 2004050843A JP 2004050843 A JP2004050843 A JP 2004050843A JP 4455096 B2 JP4455096 B2 JP 4455096B2
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wire
saw wire
saw
workpiece
cutting
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JP2005238377A (en
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寛之 大上
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TOKUSEN CO.,LTD
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本発明は、半導体、セラミックなどの硬質材料の切断用ワイヤソーに好適なワイヤ（以下「ソーワイヤ」という）に関する。   The present invention relates to a wire suitable for a wire saw for cutting hard materials such as semiconductors and ceramics (hereinafter referred to as “saw wire”).

現在、半導体材料のマルチワイヤソーによるワイヤスライシング加工において、遊離砥粒を用いた遊離砥粒方式と、ワイヤ表面にダイヤモンド砥粒を固着させたダイヤモンドワイヤ工具を用いた固定砥粒方式とが一般的である。
そして、いずれの方式においても、ソーワイヤには、切断時にかかる張力に耐えうる強度が必要なため、通常高炭素鋼線材やピアノ線材が使用されている。
従来、このようなソーワイヤは、直径５ｍｍ程度の原線に伸線加工とパテンティング処理を繰り返し施すことにより製造されている。したがって、その断面形状を、例えば特許文献１にも記載されているように、円形に形成されている（図１３参照）。
特開２００１−２２５２５５号公報 At present, in wire slicing processing using a multi-wire saw of semiconductor materials, there are two general methods: a loose abrasive method using loose abrasive grains and a fixed abrasive grain method using diamond wire tools with diamond abrasive grains fixed to the wire surface. is there.
In any of the systems, since the saw wire needs to be strong enough to withstand the tension applied at the time of cutting, a high carbon steel wire or a piano wire is usually used.
Conventionally, such a saw wire is manufactured by repeatedly performing a drawing process and a patenting process on an original wire having a diameter of about 5 mm. Therefore, the cross-sectional shape is formed in a circular shape as described in, for example, Patent Document 1 (see FIG. 13).
JP 2001-225255 A

上述のような、断面円形のソーワイヤは、図１４に示すようなワイヤソー装置により、半導体材料（ワーク）０５の切断に使用される。図１４は往復動型ワイヤソー装置を示しており、この装置は、ソーワイヤの送出しおよび巻取り部Ａ、切断加工部Ｂ、ワイヤ張力調整部Ｃで構成されている。
２連のドラム０１から送出されたワイヤ０２は、ガイドプーリー０４を介して切断加工部Ｂ、ワイヤ張力調整部Ｃの順に通り、２連ドラム０１のもう一方の片側に巻取られる。２連ドラム０１はモータ０３が正逆運転するので、ソーワイヤ０２の送出しと巻取りとを同時に行うことによって、ソーワイヤ０２は往復運動し、切断加工部Ｂにおいて、ワーク０５を切断加工することが可能となる。ワイヤ張力調整部Ｃはトルクモータ０８、トルクアーム０６およびテンションプーリー０７から構成されており、トルクモータ０８の回転によりソーワイヤ０２に一定の張力が与えられる。切断加工部Ｂは主にガイドプーリーおよびスライダーから構成されており、スライダーにはワークを取り付けられるための加工台が取り付けている。 The saw wire having a circular cross section as described above is used for cutting the semiconductor material (workpiece) 05 by a wire saw apparatus as shown in FIG. FIG. 14 shows a reciprocating wire saw device, which is composed of a saw wire feeding and winding unit A, a cutting unit B, and a wire tension adjusting unit C.
The wire 02 delivered from the double drum 01 passes through the guide pulley 04 in the order of the cutting portion B and the wire tension adjustment portion C, and is wound around the other side of the double drum 01. Since the motor 03 of the double drum 01 is operated in the forward and reverse directions, the saw wire 02 is reciprocated by simultaneously sending and winding the saw wire 02, and the workpiece 05 can be cut in the cutting portion B. It becomes possible. The wire tension adjusting unit C includes a torque motor 08, a torque arm 06, and a tension pulley 07, and a constant tension is applied to the saw wire 02 by the rotation of the torque motor 08. The cutting part B is mainly composed of a guide pulley and a slider, and a processing table for attaching a work is attached to the slider.

円形断面のソーワイヤを使用して、上述のようなワイヤソー装置により、半導体材料（ワーク）の切断を行うと、その切断加工時に、ソーワイヤの断面形状が従来は円形であるため、ワーク面圧が均一に分散し、その結果加工能率が低くなるという課題がある。   When a semiconductor material (workpiece) is cut by a wire saw device as described above using a saw wire with a circular cross section, the work surface pressure is uniform because the cross-sectional shape of the saw wire is conventionally circular during the cutting process. There is a problem that the processing efficiency is lowered as a result.

本発明は、このような課題を解決しようとするもので、本発明は、ソーワイヤの断面形状として断面三角形状の捩れを有しないワイヤを利用することにより、エッジ効果（ソーワイヤの角部がワークに当接した時にワーク当接面積が減少し、その結果ワーク面圧が上昇して切削性能が向上するという効果）と、ソーワイヤがガイドプーリーとワーク面との間を移動中に発生するソーワイヤの捩れ効果（ソーワイヤがガイドプーリーとワーク面との間を移動中にソーワイヤに捩れが発生し、この捩れにより、切り粉の排出が促進されるという効果）とにより、切断能率の向上を可能にしたソーワイヤによる切断装置を提供しようとするものである。
The present invention is intended to solve such problems. The present invention uses a wire that does not have a twist of a triangular cross-section as a cross- sectional shape of the saw wire. The contact area of the workpiece decreases when it abuts, resulting in an increase in workpiece surface pressure and improved cutting performance), and the saw wire twisting while the saw wire moves between the guide pulley and the workpiece surface Saw wire that can improve cutting efficiency due to the effect (the saw wire is twisted while the saw wire is moving between the guide pulley and the work surface, and this twist promotes the discharge of chips) It is intended to provide a cutting device .

本発明は、ソーワイヤの断面を三角形形状に形成したものを利用し、且つＶ型溝でソーワイヤを案内する切断装置とすることで課題解決の手段としている。
The present invention is a means for solving the problem by utilizing a saw wire having a triangular cross section and guiding the saw wire with a V-shaped groove .

さらに、ソーワイヤの表面に、砥粒、例えばダイヤモンド砥粒を固定、特に電着方式により固定したものを用いると尚良い。
Furthermore, it is more preferable to use abrasive grains fixed on the surface of the saw wire, for example, diamond abrasive grains, particularly those fixed by an electrodeposition method .

本発明のソーワイヤでは、その断面が三角形状に形成されているので、ソーワイヤの角部がワークに当接した時にワーク当接面積が減少し、その結果、加工時の単位当たりのワーク面圧を上昇させることができて、切削性能を向上することが可能となる（この効果を「エッジ効果」という）。 In the saw wire of the present invention, since the cross section is formed in a triangular shape , the work contact area decreases when the corner of the saw wire comes into contact with the work, and as a result, the work surface pressure per unit during processing is reduced. The cutting performance can be improved (this effect is referred to as “edge effect”).

また、ソーワイヤがガイドプーリーとワーク面との間を移動中にソーワイヤに捩れが発生する。このソーワイヤの捩れにより、切り粉のソーワイヤからの分離がスムーズとなって目詰まりが減り、さらにソーワイヤのワークに当たっていない面に沿って切り粉がソーワイヤとともに切断箇所から外部に連れ出される現象が発生し、これにより切り粉の排出が良好に行われて切断能率の向上が可能になる（この効果を「ソーワイヤの捩れ効果」という）。   Further, the saw wire is twisted while the saw wire moves between the guide pulley and the work surface. Due to this twisting of the saw wire, the separation of the chips from the saw wire becomes smoother and clogging is reduced, and further, a phenomenon occurs in which the chips are taken out together with the saw wire from the cut portion along the surface not hitting the workpiece of the saw wire, As a result, the chips are discharged well and the cutting efficiency can be improved (this effect is referred to as “the twisting effect of the saw wire”).

以下、図面とともに本発明の一実施形態について説明する。
図１はソーワイヤの製作工程を示す概略図断面図、図２、図３はソーワイヤの加工能率の実験結果を示すグラフ、図４はソーワイヤの切断方向における加工面粗さの実験結果を示すグラフ、図５は同ワイヤ走行方向における加工面粗さの実験結果を示すグラフ、図６はソーワイヤの切断方向における加工面うねりの実験結果を示すグラフ、図７は同ワイヤ走行方向における加工面うねりの実験結果を示すグラフ、図８はソーワイヤのワイヤ走行方向における平均砥粒径と加工面粗さとの関係の実験結果を示すグラフ、図９はソーワイヤの加工能率と加工面うねりとの関係の実験結果を示すグラフ、図１０は切断加工部「Ｂ」の模試図、図１１（ａ）は図１０のＸ−Ｘ線断面図、（ｂ）は図１０のＹ−Ｙ線断面図、（ｃ）は図１０のＺ−Ｚ線断面図、図１２はソーワイヤによる切断部の一部の拡大断面図である。 Hereinafter, an embodiment of the present invention will be described with reference to the drawings.
1 is a schematic cross-sectional view showing a manufacturing process of a saw wire, FIG. 2 and FIG. 3 are graphs showing experimental results of the processing efficiency of the saw wire, and FIG. 4 is a graph showing experimental results of the processing surface roughness in the cutting direction of the saw wire, FIG. 5 is a graph showing experimental results of the machined surface roughness in the wire running direction, FIG. 6 is a graph showing experimental results of the machined surface waviness in the saw wire cutting direction, and FIG. 7 is an experiment of machined surface waviness in the wire running direction. FIG. 8 is a graph showing results, FIG. 8 is a graph showing experimental results of the relationship between the average abrasive grain size in the wire traveling direction of the saw wire and the processed surface roughness, and FIG. 9 is an experimental result of the relationship between the processing efficiency of the saw wire and the waviness of the processed surface. FIG. 10 is a schematic diagram of the cutting portion “B”, FIG. 11A is a cross-sectional view taken along the line XX of FIG. 10, (b) is a cross-sectional view taken along the line Y-Y of FIG. 10, and FIG. ZZ line break in FIG. FIG, 12 is an enlarged cross-sectional view of a portion of the cut by the saw wire.

図１に示すように、この実施形態のソーワイヤ４は、ＳＷＲＳ８２材（φ５．５mm）１（母材）にパテンティングおよび冷間伸線加工を施し、線径０．２ｍｍのワイヤに仕上げ、次にこのワイヤを圧延して一片の長さが約０．２３ｍｍ、高さ約０．２１ｍｍの断面形状が略正三角形のワイヤ２を製作する。
ついで、このワイヤ２の表面に、通常の方法により、つまり電着方式により、ダイヤモンド砥粒３を固着して、断面正三角形のダイヤモンド砥粒ソーワイヤ４（以下「ソーワイヤ４」という）を得ることができる。この実施形態のものでは、ダイヤモンド砥粒３はその平均砥粒径が０．０３〜の０．０４ｍｍ、砥粒層の厚みは０．０５０ｍｍである。 As shown in FIG. 1, the saw wire 4 of this embodiment is subjected to patenting and cold drawing on a SWRS82 material (φ5.5 mm) 1 (base material) to finish a wire having a wire diameter of 0.2 mm. The wire 2 is rolled to produce a wire 2 having a substantially equilateral triangular cross section with a piece length of about 0.23 mm and a height of about 0.21 mm.
Then, diamond abrasive grains 3 are fixed to the surface of the wire 2 by a normal method, that is, by electrodeposition, to obtain a diamond abrasive saw wire 4 (hereinafter referred to as “saw wire 4”) having a regular triangular cross section. it can. In this embodiment, the diamond abrasive grain 3 has an average abrasive grain size of 0.03 to 0.04 mm, and the abrasive grain layer has a thickness of 0.050 mm.

図２、３は上記工程により製作されたソーワイヤ４の切断加工試験の結果を示している。この切断加工試験の加工条件は次の通りである。
工作物：ソーダガラス
工作物寸法：５０×４０×１０ｍｍ
ソーワイヤの長さ：１２ｍ
加工荷重：１．９６Ｎ／Ｗｉｒｅ
ソーワイヤ張力：１９．６Ｎ
ソーワイヤ走行速度：１００ｍ／ｍｉｎ．
加工液：軽油
加工時間：１５ｍｉｎ．
図２、３に示す通り、従来のソーワイヤでは、固定されている砥粒３の径φが１０〜４０μｍの範囲のソーワイヤ４の加工能率は、加工回数１０回前後で安定している。しかし、砥粒径φが６５〜８０μｍのソーワイヤでは、砥粒の保持力を向上させるため、メッキ層が厚くなり、その結果ソーワイヤの径が太くなって、ねじり強度が弱くなり加工回数１０回前後で破断してしまう結果となった。
これに較べて、この実施形態のソーワイヤ４は、加工能率がほぼ５３０μｍ／ｍｉｎで安定している。このような加工能率のものを従来の円形断面のソーワイヤで得ようとすると、そのソーワイヤでは砥粒径φが１２０〜１５０μm となり実用上問題がある。つまり砥粒径φが６５〜８０μｍのソーワイヤですら加工回数１０回前後で破断してしまうことからみて、加工能率がほぼ５３０μｍ／ｍｉｎ．という加工能率のものを、従来の円形断面のソーワイヤで得ようとするのは到底実現不可能なことである。 2 and 3 show the results of a cutting test of the saw wire 4 manufactured by the above process. The processing conditions of this cutting processing test are as follows.
Workpiece: Soda glass Workpiece dimension: 50 × 40 × 10mm
Saw wire length: 12m
Processing load: 1.96N / Wire
Saw wire tension: 19.6N
Saw wire traveling speed: 100 m / min.
Processing fluid: Light oil Processing time: 15 min.
As shown in FIGS. 2 and 3, in the conventional saw wire, the processing efficiency of the saw wire 4 in the range where the diameter φ of the fixed abrasive grain 3 is 10 to 40 μm is stable around the number of processing 10 times. However, in the case of a saw wire having an abrasive grain diameter φ of 65 to 80 μm, in order to improve the holding power of the abrasive grain, the plating layer becomes thick, and as a result, the diameter of the saw wire becomes thicker and the torsion strength becomes weaker, and the number of times of processing is around 10 times. As a result, it was broken.
In comparison, the saw wire 4 of this embodiment is stable at a processing efficiency of approximately 530 μm / min. If an attempt is made to obtain such a processing efficiency with a conventional saw wire having a circular cross section, the saw wire has an abrasive particle diameter φ of 120 to 150 μm, which is problematic in practice. In other words, even a saw wire with an abrasive grain diameter φ of 65 to 80 μm is broken when the number of times of machining is around 10, and the machining efficiency is about 530 μm / min. It is impossible to achieve the processing efficiency of the conventional circular saw wire.

このように、この実施形態のソーワイヤ４は、加工能率がほぼ５３０μｍ／ｍｉｎ．で３０回以上の加工回数にも耐えうることが試験の結果判明した。加工能率がほぼ５３０μｍ／ｍｉｎ．であるということは、砥粒径φが１５〜３０μｍの従来の一般的な円形断面のソーワイヤのものの約２倍の加工能率であるということができる。
さらに、加工面（表面）粗さ、および加工面（表面）うねりについては、試験により、それぞれ図４〜７に示す通りの結果が得られた。なお、図４〜７における従来のソーワイヤは、線径：０．２９ｍｍ、砥粒径：０．０３０〜０．０４０ｍｍ、母線径：０．２０ｍｍである。 Thus, the saw wire 4 of this embodiment has a processing efficiency of approximately 530 μm / min. As a result of testing, it was found that it can withstand more than 30 machining cycles. The processing efficiency is approximately 530 μm / min. It can be said that the processing efficiency is about twice that of a conventional general circular cross-section saw wire having an abrasive grain diameter φ of 15 to 30 μm.
Further, with respect to the processed surface (surface) roughness and the processed surface (surface) waviness, the results as shown in FIGS. In addition, the conventional saw wire in FIGS. 4-7 is wire diameter: 0.29mm, abrasive grain diameter: 0.030-0.040mm, bus-bar diameter: 0.20mm.

すなわち、加工面（表面）粗さについては、平均砥粒径がほぼ同じ場合、従来の（断面
円形の）ソーワイヤに較べて、切断方向およびワイヤ走行方向について、若干性能の低下が認められた（図４、５参照）。
また、加工面（表面）うねりについては、平均砥粒径がほぼ同じ場合、従来の（断面円形の）ソーワイヤに較べて、切断方向およびワイヤ走行方向について、若干性能の低下が認められた（図６、７参照）。 In other words, with respect to the processed surface (surface) roughness, when the average abrasive grain size was almost the same, a slight decrease in performance was observed in the cutting direction and the wire running direction as compared to the conventional (circular cross-section) saw wire ( (See FIGS. 4 and 5).
In addition, with respect to the processed surface (surface) waviness, when the average abrasive grain size was almost the same, a slight decrease in performance was observed in the cutting direction and the wire running direction compared to the conventional (circular cross-section) saw wire (Fig. 6 and 7).

しかしながら、図８、９に示す通り、この実施形態のソーワイヤ４は、加工面（表面）粗さについては、平均砥粒径がφ３０〜４０μｍの従来の（断面円形の）ソーワイヤの加工面（表面）粗さに相当する性能をそなえ（図８参照）、また加工面（表面）うねりについては、φ１０〜２０μｍの従来の（断面円形の）ソーワイヤの加工面（表面）うねりに相当する性能をそなえている（図９参照）ことが判明した。   However, as shown in FIGS. 8 and 9, the saw wire 4 of this embodiment has a processed surface (surface) roughness of the processed surface (surface) of a conventional (circular cross-section) saw wire having an average abrasive grain size of φ30 to 40 μm. ) Providing performance equivalent to roughness (see FIG. 8), and processing surface (surface) waviness has performance equivalent to the processing surface (surface) waviness of conventional (circular cross-section) φ10-20 μm saw wires. (See FIG. 9).

さらに、この実施形態のソーワイヤ４の切断加工状態を高速度カメラにより撮影し、その画像を解析することにより、ソーワイヤ４はガイドプーリーとワークとの間において、捩れながら走行していることが判明した。
この「捩れ」は、次に述べる理由により発生するものと推測される。 Further, the cutting state of the saw wire 4 of this embodiment was photographed with a high-speed camera, and by analyzing the image, it was found that the saw wire 4 was running while being twisted between the guide pulley and the workpiece. .
This “twist” is presumed to occur for the following reason.

すなわち、図１１に示すように、ソーワイヤ４は三角形断面に形成されている。一方ガイドプーリー１４はＶ型溝をそなえており、このＶ型溝でソーワイヤ４を案内する構成となっている。ソーワイヤ４には所定値の張力が付与され、一方ワーク１５は矢Ｗ方向に押圧されていることから、ガイドプーリー１４に接当する箇所では、ソーワイヤ４は、その角部（エッジ）がＶ型溝の鋭角状の内径面に当接する状態となる〔図１１（ａ）、（ｃ）〕。なお図１０中符号「Ａ」、「Ｂ」、「Ｃ」はそれぞれ図１４中の「Ａ」、「Ｂ」、「Ｃ」と同じ部分を示す。   That is, as shown in FIG. 11, the saw wire 4 is formed in a triangular cross section. On the other hand, the guide pulley 14 has a V-shaped groove, and the saw wire 4 is guided by the V-shaped groove. Since a predetermined value of tension is applied to the saw wire 4 and the workpiece 15 is pressed in the direction of the arrow W, the corner portion (edge) of the saw wire 4 is V-shaped at a location where it contacts the guide pulley 14. It will be in the state contact | abutted to the acute-angle-shaped inner diameter surface of a groove | channel [FIG. Note that reference numerals “A”, “B”, and “C” in FIG. 10 indicate the same portions as “A”, “B”, and “C” in FIG. 14, respectively.

ソーワイヤ４がワーク１５に接当する箇所切断加工では、ソーワイヤ４は平面部がワーク１５に接当する状態〔（図１１（ｂ））となり、この状態でワークの切断が行われる。   In the part cutting process in which the saw wire 4 comes into contact with the workpiece 15, the saw wire 4 is in a state in which the flat portion comes into contact with the workpiece 15 (FIG. 11B), and the workpiece is cut in this state.

このように、ソーワイヤ４は、ガイドプーリー１４からワーク１５に進むうちに、ほぼ６０°捩じられ、ワーク１５から離れて巻取り側のガイドプーリー１４に進むうちに、ほぼ６０°捩じられた分が戻されて、ソーワイヤ４は、巻取り側のガイドプーリー１４のＶ型溝に適応するように、角部（エッジ）が内側（図１０において右側）に向かう状態に戻る〔図１１（ｃ）〕。   In this way, the saw wire 4 was twisted by approximately 60 ° while proceeding from the guide pulley 14 to the work 15, and was twisted by approximately 60 ° while proceeding from the work 15 to the guide pulley 14 on the winding side. The minute portion is returned, and the saw wire 4 returns to a state in which the corner (edge) faces inward (right side in FIG. 10) so as to adapt to the V-shaped groove of the guide pulley 14 on the winding side [FIG. ]].

すなわち、ソーワイヤ４は、ワーク切断加工時に、捩れ現象を伴いながら、移動することになる。したがって、ソーワイヤ４に付着した切り粉は、ソーワイヤ４がワーク切断部から外方に露出した直後に、ソーワイヤ４のねじれによる振動で振り落とされることになり、その結果ソーワイヤ４の目詰まりが抑制される。すなわち「ソーワイヤの捩れ効果」が奏される。   That is, the saw wire 4 moves while being twisted during workpiece cutting. Therefore, immediately after the saw wire 4 is exposed to the outside from the workpiece cutting portion, the chips adhering to the saw wire 4 are shaken off by vibration due to the twist of the saw wire 4, and as a result, clogging of the saw wire 4 is suppressed. The That is, the “saw wire twist effect” is achieved.

さらに、ワークの切断箇所においても、ソーワイヤ４は常にその平面部がワーク１５に当接した状態で走行し続けるのではなく、捩れながらワーク１５に当接して走行していることも、高速度カメラによる撮影映像の解析により判明した。つまり、ソーワイヤ４によるワーク１５の切断は、ソーワイヤ４の平面部がワーク１５に当接したり、ソーワイヤ４の角部（エッジ）４ａがワーク１５に当接したり（図１２参照）しながらソーワイヤ４が走行することにより、行われるということが判明した。そして、ソーワイヤ４の角部４ａがワーク１５に当接する時には、ソーワイヤ４のワーク１５に対する当接面積が減少し、その結果、加工時の単位当たりのワーク面圧が上昇することとなるので、切削性能が向上する。すなわち「エッジ効果」が奏される。   Furthermore, the saw wire 4 does not always travel with the flat portion thereof in contact with the work 15 even at the work cutting position, but is also in contact with the work 15 while being twisted. It was revealed by the analysis of the video shot by. That is, the workpiece 15 is cut by the saw wire 4 when the saw wire 4 is in contact with the workpiece 15 or the corner (edge) 4a of the saw wire 4 is in contact with the workpiece 15 (see FIG. 12). It turns out that it is done by running. And when the corner | angular part 4a of the saw wire 4 contact | abuts to the workpiece | work 15, since the contact | abutting area with respect to the workpiece | work 15 of the saw wire 4 will decrease, the workpiece surface pressure per unit at the time of a process will raise, Therefore Performance is improved. That is, an “edge effect” is produced.

さらに、ソーワイヤ４が図１２に示す状態、つまりソーワイヤ４の角部（エッジ）４ａがワーク１５に当接したときには、ソーワイヤ４の平面部４ｂに切り粉１６が付着し、その切り粉１６は、そのままソーワイヤ４とともに切断部外方に運び出されることも高速度カメラによる撮影映像の解析により判明した。このように、この実施形態のソーワイヤ４による切断では、切断部からの切り粉の積極的な排出が行われており、このことも切断能率の向上に寄与していると考えられる。   Furthermore, when the saw wire 4 is in the state shown in FIG. 12, that is, when the corner (edge) 4a of the saw wire 4 is in contact with the workpiece 15, the chip 16 adheres to the flat portion 4b of the saw wire 4, and the chip 16 is The fact that it was carried out with the saw wire 4 to the outside of the cut part was also found by analysis of the video image taken by the high-speed camera. Thus, in the cutting | disconnection by the saw wire 4 of this embodiment, the active discharge | emission of the swarf from a cutting part is performed, and it is thought that this has also contributed to the improvement of cutting efficiency.

上述の説明は、断面形状が正三角形のソーワイヤを対象としているが、正三角形断面のほかの三角形断面（たとえば二等辺三角形断面）のソーワイヤにおいても、同様の効果が得られることは、いうまでもない。なお製作コストの面からみた場合、断面形状が正三角形形状ものもが最も有利である。さらに、三角形断面のほかの多角形断面形状のソーワイヤにおいても、ほぼ同様の効果が得られることは明らかである。   Although the above description is directed to a saw wire having an equilateral triangle cross section, it goes without saying that the same effect can be obtained with a saw wire having a triangular section other than the equilateral triangle section (for example, an isosceles triangle section). Absent. From the viewpoint of production cost, the one having a regular triangular cross section is most advantageous. Further, it is clear that substantially the same effect can be obtained with a saw wire having a polygonal cross section other than a triangular cross section.

本発明の一実施形態としてのソーワイヤの製作工程を示す概略図である。It is the schematic which shows the manufacturing process of the saw wire as one Embodiment of this invention. 同ソーワイヤの加工能率の実験結果を示すグラフである。It is a graph which shows the experimental result of the processing efficiency of the saw wire. 同ソーワイヤの加工能率の実験結果を示すグラフである。It is a graph which shows the experimental result of the processing efficiency of the saw wire. 同ソーワイヤの切断方向における加工面粗さの実験結果を示すグラフである。It is a graph which shows the experimental result of the processing surface roughness in the cutting direction of the saw wire. 同ワイヤ走行方向における加工面粗さの実験結果を示すグラフである。It is a graph which shows the experimental result of the processing surface roughness in the wire running direction. 同ソーワイヤの切断方向における加工面うねりの実験結果を示すグラフである。It is a graph which shows the experimental result of the process surface waviness in the cutting direction of the saw wire. 同ワイヤ走行方向における加工面うねりの実験結果を示すグラフである。It is a graph which shows the experimental result of the processing surface waviness in the wire running direction. 同ソーワイヤのワイヤ走行方向における平均砥粒径と加工面粗さとの関係の実験結果を示すグラフである。It is a graph which shows the experimental result of the relationship between the average abrasive grain diameter in the wire traveling direction of the saw wire, and a processed surface roughness. 同ソーワイヤの加工能率と加工面うねりとの関係の実験結果を示すグラフである。It is a graph which shows the experimental result of the relationship between the processing efficiency of the saw wire, and processing surface waviness. 同切断加工部「Ｂ」の模試図である。It is a trial drawing of the cutting process part "B". （ａ）は図１０のＸ−Ｘ線断面図である。 （ｂ）は図１０のＹ−Ｙ線断面図である。 （ｃ）は図１０のＺ−Ｚ線断面図である。(A) is XX sectional drawing of FIG. (B) is the YY sectional view taken on the line of FIG. (C) is a ZZ line sectional view of Drawing 10. 同ソーワイヤによる切断部の一部の拡大断面図である。It is a partial expanded sectional view of the cutting part by the saw wire. 従来のソーワイヤの断面図である。It is sectional drawing of the conventional saw wire. 一般的なワイヤソー装置の概略斜視図である。It is a schematic perspective view of a general wire saw apparatus.

符号の説明Explanation of symbols

１：母材
２：ワイヤ
３：ダイヤモンド砥粒
４：ソーワイヤ
４ａ：角部（エッジ）
４ｂ：平面部
１４：ガイドプーリー
１５：ワーク
１６：切り粉

1: Base material 2: Wire 3: Diamond abrasive grains 4: Saw wire 4a: Corner (edge)
4b: Plane portion 14: Guide pulley 15: Workpiece 16: Chip

Claims (1)

ダイヤモンドを固着させたソーワイヤの走行によってワークを切断加工する装置であって、断面が三角形で捻りを有さないワイヤを用い、且つＶ型溝を設けたガイドプーリーをワークの前後に設置し、Ｖ型溝に沿って方向付けされたワイヤが走行し、ガイドプーリー間で、該ガイドプーリーが設置された側から断面三角形ワイヤの鋭角部にワークを当接することで捻れが生じ、ワイヤの平面部と角部とでワークを切断する加工装置。
An apparatus for cutting a workpiece by traveling a saw wire with diamonds fixed thereto , using a wire having a triangular cross-section and having no twist, and having guide pulleys with V-shaped grooves provided before and after the workpiece, V A wire directed along the mold groove runs , and twists occur between the guide pulleys by bringing the workpiece into contact with the acute angle part of the cross-section triangular wire from the side where the guide pulley is installed, and the plane part of the wire A processing device that cuts workpieces at corners.
JP2004050843A 2004-02-26 2004-02-26 Saw wire cutting device Expired - Fee Related JP4455096B2 (en)

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Publication number Priority date Publication date Assignee Title
EP2464485A2 (en) 2009-08-14 2012-06-20 Saint-Gobain Abrasives, Inc. Abrasive articles including abrasive particles bonded to an elongated body
US9028948B2 (en) 2009-08-14 2015-05-12 Saint-Gobain Abrasives, Inc. Abrasive articles including abrasive particles bonded to an elongated body, and methods of forming thereof
TWI466990B (en) 2010-12-30 2015-01-01 Saint Gobain Abrasives Inc Abrasive article and method of forming
JP2014530770A (en) 2011-09-16 2014-11-20 サンーゴバンアブレイシブズ，インコーポレイティド Abrasive article and forming method
EP2572818A1 (en) 2011-09-23 2013-03-27 NV Bekaert SA A fixed abrasive sawing wire with improved abrasive particle retention
KR20140075717A (en) 2011-09-29 2014-06-19 생-고뱅 어브레이시브즈, 인코포레이티드 Abrasive articles including abrasive particles bonded to an elongated substrate body having a barrier layer, and methods of forming thereof
TW201404527A (en) 2012-06-29 2014-02-01 Saint Gobain Abrasives Inc Abrasive article and method of forming
TW201402274A (en) 2012-06-29 2014-01-16 Saint Gobain Abrasives Inc Abrasive article and method of forming
TWI477343B (en) 2012-06-29 2015-03-21 Saint Gobain Abrasives Inc Abrasive article and method of forming
TWI474889B (en) 2012-06-29 2015-03-01 Saint Gobain Abrasives Inc Abrasive article and method of forming
TW201441355A (en) 2013-04-19 2014-11-01 Saint Gobain Abrasives Inc Abrasive article and method of forming
JP6172053B2 (en) * 2014-05-28 2017-08-02 信越半導体株式会社 Fixed abrasive wire, wire saw and workpiece cutting method
CN104742263B (en) * 2015-04-21 2016-04-13 浙江东尼电子股份有限公司 A kind of Buddha's warrior attendant wire rod of cutting sapphire
TWI621505B (en) 2015-06-29 2018-04-21 聖高拜磨料有限公司 Abrasive article and method of forming

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