JP4455093B2 - モールド、モールドを用いた加工装置及びモールドを用いた加工方法 - Google Patents
モールド、モールドを用いた加工装置及びモールドを用いた加工方法 Download PDFInfo
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- JP4455093B2 JP4455093B2 JP2004044727A JP2004044727A JP4455093B2 JP 4455093 B2 JP4455093 B2 JP 4455093B2 JP 2004044727 A JP2004044727 A JP 2004044727A JP 2004044727 A JP2004044727 A JP 2004044727A JP 4455093 B2 JP4455093 B2 JP 4455093B2
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- 238000003672 processing method Methods 0.000 title claims description 3
- 238000003825 pressing Methods 0.000 claims description 17
- 230000005540 biological transmission Effects 0.000 claims description 16
- 238000000034 method Methods 0.000 claims description 13
- 239000000463 material Substances 0.000 claims description 7
- 230000008569 process Effects 0.000 claims description 7
- 239000011347 resin Substances 0.000 description 16
- 229920005989 resin Polymers 0.000 description 16
- 230000007246 mechanism Effects 0.000 description 9
- 238000004519 manufacturing process Methods 0.000 description 5
- 238000005516 engineering process Methods 0.000 description 3
- 239000004065 semiconductor Substances 0.000 description 3
- 230000008859 change Effects 0.000 description 2
- 238000005520 cutting process Methods 0.000 description 2
- 238000009826 distribution Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 239000007788 liquid Substances 0.000 description 2
- 238000001459 lithography Methods 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
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- 238000000018 DNA microarray Methods 0.000 description 1
- 230000006835 compression Effects 0.000 description 1
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- 238000005323 electroforming Methods 0.000 description 1
- 238000000609 electron-beam lithography Methods 0.000 description 1
- 238000004049 embossing Methods 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 230000009477 glass transition Effects 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 238000007373 indentation Methods 0.000 description 1
- 229910052738 indium Inorganic materials 0.000 description 1
- APFVFJFRJDLVQX-UHFFFAOYSA-N indium atom Chemical compound [In] APFVFJFRJDLVQX-UHFFFAOYSA-N 0.000 description 1
- 238000010884 ion-beam technique Methods 0.000 description 1
- 238000003754 machining Methods 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
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- 230000003287 optical effect Effects 0.000 description 1
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- 238000000992 sputter etching Methods 0.000 description 1
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/0002—Lithographic processes using patterning methods other than those involving the exposure to radiation, e.g. by stamping
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
- B29C43/003—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor characterised by the choice of material
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
- B29C43/02—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles
- B29C43/021—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles characterised by the shape of the surface
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C59/00—Surface shaping of articles, e.g. embossing; Apparatus therefor
- B29C59/002—Component parts, details or accessories; Auxiliary operations
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C59/00—Surface shaping of articles, e.g. embossing; Apparatus therefor
- B29C59/02—Surface shaping of articles, e.g. embossing; Apparatus therefor by mechanical means, e.g. pressing
- B29C59/022—Surface shaping of articles, e.g. embossing; Apparatus therefor by mechanical means, e.g. pressing characterised by the disposition or the configuration, e.g. dimensions, of the embossments or the shaping tools therefor
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
- B81C99/00—Subject matter not provided for in other groups of this subclass
- B81C99/0075—Manufacture of substrate-free structures
- B81C99/0085—Manufacture of substrate-free structures using moulds and master templates, e.g. for hot-embossing
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B82—NANOTECHNOLOGY
- B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
- B82Y10/00—Nanotechnology for information processing, storage or transmission, e.g. quantum computing or single electron logic
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B82—NANOTECHNOLOGY
- B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
- B82Y40/00—Manufacture or treatment of nanostructures
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
- B29C43/02—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles
- B29C43/021—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles characterised by the shape of the surface
- B29C2043/023—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles characterised by the shape of the surface having a plurality of grooves
- B29C2043/025—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles characterised by the shape of the surface having a plurality of grooves forming a microstructure, i.e. fine patterning
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
- B29C43/32—Component parts, details or accessories; Auxiliary operations
- B29C43/36—Moulds for making articles of definite length, i.e. discrete articles
- B29C43/361—Moulds for making articles of definite length, i.e. discrete articles with pressing members independently movable of the parts for opening or closing the mould, e.g. movable pistons
- B29C2043/3615—Forming elements, e.g. mandrels or rams or stampers or pistons or plungers or punching devices
- B29C2043/3634—Forming elements, e.g. mandrels or rams or stampers or pistons or plungers or punching devices having specific surface shape, e.g. grooves, projections, corrugations
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C59/00—Surface shaping of articles, e.g. embossing; Apparatus therefor
- B29C59/02—Surface shaping of articles, e.g. embossing; Apparatus therefor by mechanical means, e.g. pressing
- B29C59/022—Surface shaping of articles, e.g. embossing; Apparatus therefor by mechanical means, e.g. pressing characterised by the disposition or the configuration, e.g. dimensions, of the embossments or the shaping tools therefor
- B29C2059/023—Microembossing
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C35/00—Heating, cooling or curing, e.g. crosslinking or vulcanising; Apparatus therefor
- B29C35/02—Heating or curing, e.g. crosslinking or vulcanizing during moulding, e.g. in a mould
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
- B81C2201/00—Manufacture or treatment of microstructural devices or systems
- B81C2201/03—Processes for manufacturing substrate-free structures
- B81C2201/034—Moulding
Landscapes
- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Nanotechnology (AREA)
- Mechanical Engineering (AREA)
- Physics & Mathematics (AREA)
- Crystallography & Structural Chemistry (AREA)
- Manufacturing & Machinery (AREA)
- General Physics & Mathematics (AREA)
- Mathematical Physics (AREA)
- Theoretical Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Shaping Of Tube Ends By Bending Or Straightening (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
- Micromachines (AREA)
Description
被加工物をモールドにより加工するための加工装置であって、
前記モールドを支持し、加圧するための第1の支持部と、
前記第1の支持部と対向して配置された前記被加工物を支持し、加圧するための第2の支持部と、
前記第1と第2の支持部とを近接させて、前記モールドの加工面と前記被加工物の被加工面とを接触させ、前記被加工物を加工するために、前記モールドと前記被加工物とを前記近接方向に押圧するための押圧手段とを備え、
前記モールドの前記第1の支持部側の面、前記第1の支持部の前記モールド側の面、前記第2の支持部の前記被加工物側の面の内、少なくとも一つに前記モールド又は前記被加工物への加圧力の伝達を抑制するための凹部を有し、
該凹部は、前記モールドの前記加工面の凹部のうち、該凹部の幅と深さの比が20:1を超える凹部と対応して設けられることを特徴とする加工装置を提供するものである。
以下、図面を用いて、本発明の第1の実施例について以下に詳細な説明を行う。
以下、図面を用いて、本発明の第2の実施例について以下に詳細な説明を行う。
以下、図面を用いて、本発明の第3の実施例について以下に詳細な説明を行う。
本実施例の構成は実施例1、2に示した用途の他、ゴム301により、非溝部における加工力の分布を均一化できるため、モールド加圧部材103、モールド104、ウエハ106、ウエハ加圧部材等各種部材の形状精度が加工上、コスト上の制約から確保できない場合、装置精度が不十分でモールド104とウエハ106が十分平行に加圧できない場合等に好適である。
102 加圧機構
103 モールド加圧部材(第1の支持部材)
104 モールド
105 樹脂
106 ウエハ
107 ウエハ加圧部材(第2の支持部材)
201 ヒータ
301 ゴム
Claims (4)
- 被加工物をモールドにより加工するための加工装置であって、
前記モールドを支持し、加圧するための第1の支持部と、
前記第1の支持部と対向して配置された前記被加工物を支持し、加圧するための第2の支持部と、
前記第1と第2の支持部とを近接させて、前記モールドの加工面と前記被加工物の被加工面とを接触させ、前記被加工物を加工するために、前記モールドと前記被加工物とを前記近接方向に押圧するための押圧手段とを備え、
前記モールドの前記第1の支持部側の面、前記第1の支持部の前記モールド側の面、前記第2の支持部の前記被加工物側の面の内、少なくとも一つに前記モールド又は前記被加工物への加圧力の伝達を抑制するための凹部を有し、
該凹部は、前記モールドの前記加工面の凹部のうち、該凹部の幅と深さの比が20:1を超える凹部と対応して設けられることを特徴とする加工装置。 - 前記凹部に加工力の伝達力を抑制する部材が配置された請求項1に記載の加工装置。
- 前記加工力の伝達力を抑制する部材が、前記モールドと前記第1の支持部と前記第2の支持部のいずれよりもヤング率が小さい材料を用いている請求項1又は2に記載の加工装置。
- 被加工物をモールドにより加工するための加工方法であって、
前記モールドを支持し、加圧するための第1の支持部に前記モールドを設置し、前記被加工物を支持し、加圧するための第2の支持部に前記被加工物を設置する工程と、
前記第1と第2の支持部とを近接させ、前記モールドの加工面と前記被加工物の被加工面とを接触させ、前記モールドと前記被加工物とを前記近接方向に押圧し、前記被加工物を加工する工程とを備え、
前記モールドの前記第1の支持部との接触面、前記第1の支持部の前記モールドとの接触面、前記第2の支持部の前記被加工物との接触面の内、少なくとも一つに前記モールド又は前記被加工物への加圧力の伝達を抑制するための凹部を有し、
該凹部は、前記モールドの前記加工面の凹部のうち、該凹部の幅と深さの比が20:1を超える凹部と対応して設けられることを特徴とする加工方法。
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2004044727A JP4455093B2 (ja) | 2004-02-20 | 2004-02-20 | モールド、モールドを用いた加工装置及びモールドを用いた加工方法 |
US11/058,195 US7347683B2 (en) | 2004-02-20 | 2005-02-16 | Mold and molding apparatus using the same |
US12/024,354 US7678319B2 (en) | 2004-02-20 | 2008-02-01 | Mold and molding apparatus using the same |
US12/024,338 US7674104B2 (en) | 2004-02-20 | 2008-02-01 | Mold and molding apparatus using the same |
Applications Claiming Priority (1)
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JP2004044727A JP4455093B2 (ja) | 2004-02-20 | 2004-02-20 | モールド、モールドを用いた加工装置及びモールドを用いた加工方法 |
Related Child Applications (1)
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JP2009132094A Division JP4810592B2 (ja) | 2009-06-01 | 2009-06-01 | モールド、モールドを用いた加工装置及びモールドを用いた加工方法 |
Publications (3)
Publication Number | Publication Date |
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JP2005231247A JP2005231247A (ja) | 2005-09-02 |
JP2005231247A5 JP2005231247A5 (ja) | 2009-02-26 |
JP4455093B2 true JP4455093B2 (ja) | 2010-04-21 |
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JP2004044727A Expired - Fee Related JP4455093B2 (ja) | 2004-02-20 | 2004-02-20 | モールド、モールドを用いた加工装置及びモールドを用いた加工方法 |
Country Status (2)
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US (3) | US7347683B2 (ja) |
JP (1) | JP4455093B2 (ja) |
Families Citing this family (18)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20080160129A1 (en) * | 2006-05-11 | 2008-07-03 | Molecular Imprints, Inc. | Template Having a Varying Thickness to Facilitate Expelling a Gas Positioned Between a Substrate and the Template |
JP4455092B2 (ja) * | 2004-02-20 | 2010-04-21 | キヤノン株式会社 | 加工装置及び加工方法 |
US7557051B2 (en) * | 2004-03-17 | 2009-07-07 | The Board Of Trustees Of The Leland Stanford Junior University | 3-D interconnected multi-layer microstructure of thermoplastic materials |
JP2006346974A (ja) * | 2005-06-15 | 2006-12-28 | Konica Minolta Holdings Inc | 成形方法及び成形装置 |
CN104317161A (zh) * | 2005-12-08 | 2015-01-28 | 分子制模股份有限公司 | 用于衬底双面图案形成的方法和*** |
JP2007180315A (ja) * | 2005-12-28 | 2007-07-12 | Toshiba Mach Co Ltd | 転写装置 |
JP4814682B2 (ja) * | 2006-04-18 | 2011-11-16 | 株式会社日立ハイテクノロジーズ | 微細構造パターンの転写方法及び転写装置 |
US20070284779A1 (en) * | 2006-06-13 | 2007-12-13 | Wei Wu | Imprint lithography apparatus and methods |
JP5173311B2 (ja) * | 2007-08-09 | 2013-04-03 | キヤノン株式会社 | インプリント方法、インプリント装置および半導体製造方法 |
US20100015270A1 (en) * | 2008-07-15 | 2010-01-21 | Molecular Imprints, Inc. | Inner cavity system for nano-imprint lithography |
FR2950043B1 (fr) * | 2009-09-17 | 2011-10-14 | Commissariat Energie Atomique | Moule pour la lithographie par nanoimpression thermique, son procede de preparation, et procede de nanoimpression thermique le mettant en ?uvre. |
JP5395756B2 (ja) * | 2010-07-07 | 2014-01-22 | 株式会社東芝 | インプリント用テンプレートの製造方法及びパターン形成方法 |
FR2964338B1 (fr) | 2010-09-07 | 2012-10-05 | Commissariat Energie Atomique | Moule pour la lithographie par nano-impression thermique, son procede de preparation, et procede de nano-impression thermique le mettant en ?uvre. |
DE102011054789A1 (de) * | 2011-10-25 | 2013-04-25 | Universität Kassel | Nano-Formgebungsstruktur |
TWI672212B (zh) * | 2016-08-25 | 2019-09-21 | 國立成功大學 | 奈米壓印組合體及其壓印方法 |
CN107030951B (zh) * | 2017-06-15 | 2023-04-11 | 吉林大学 | 一种泥浆泵仿生活塞铸造成型方法和成型装置 |
WO2019156695A1 (en) * | 2018-02-09 | 2019-08-15 | Didrew Technology (Bvi) Limited | Method of manufacturing fan out package with carrier-less molded cavity |
CN112092145A (zh) * | 2020-09-25 | 2020-12-18 | 石月(天津)云科技有限公司 | 一种绿色板材及其制备***与方法 |
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US5259752A (en) * | 1990-10-05 | 1993-11-09 | Stephen Scolamiero | Insulation board for molding machine |
KR100237564B1 (ko) * | 1991-12-20 | 2000-01-15 | 김영환 | 반도체 패키지 성형용 금형 |
US5772905A (en) | 1995-11-15 | 1998-06-30 | Regents Of The University Of Minnesota | Nanoimprint lithography |
US6809802B1 (en) * | 1999-08-19 | 2004-10-26 | Canon Kabushiki Kaisha | Substrate attracting and holding system for use in exposure apparatus |
JP3638513B2 (ja) | 2000-09-25 | 2005-04-13 | 株式会社東芝 | 転写装置及び転写方法 |
US6712598B2 (en) * | 2000-11-20 | 2004-03-30 | Superior Concrete Fence Of Texas, Inc. | Mold battery with improved member separation |
CA2380114C (en) * | 2002-04-04 | 2010-01-19 | Obducat Aktiebolag | Imprint method and device |
WO2004086471A1 (en) * | 2003-03-27 | 2004-10-07 | Korea Institute Of Machinery & Materials | Uv nanoimprint lithography process using elementwise embossed stamp and selectively additive pressurization |
US7150622B2 (en) * | 2003-07-09 | 2006-12-19 | Molecular Imprints, Inc. | Systems for magnification and distortion correction for imprint lithography processes |
JP4455092B2 (ja) | 2004-02-20 | 2010-04-21 | キヤノン株式会社 | 加工装置及び加工方法 |
-
2004
- 2004-02-20 JP JP2004044727A patent/JP4455093B2/ja not_active Expired - Fee Related
-
2005
- 2005-02-16 US US11/058,195 patent/US7347683B2/en not_active Expired - Fee Related
-
2008
- 2008-02-01 US US12/024,338 patent/US7674104B2/en not_active Expired - Fee Related
- 2008-02-01 US US12/024,354 patent/US7678319B2/en not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
JP2005231247A (ja) | 2005-09-02 |
US7678319B2 (en) | 2010-03-16 |
US20080131550A1 (en) | 2008-06-05 |
US7674104B2 (en) | 2010-03-09 |
US20050208171A1 (en) | 2005-09-22 |
US20080128945A1 (en) | 2008-06-05 |
US7347683B2 (en) | 2008-03-25 |
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