JP4435868B1 - Heat spreader and manufacturing method thereof - Google Patents
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- JP4435868B1 JP4435868B1 JP2009544336A JP2009544336A JP4435868B1 JP 4435868 B1 JP4435868 B1 JP 4435868B1 JP 2009544336 A JP2009544336 A JP 2009544336A JP 2009544336 A JP2009544336 A JP 2009544336A JP 4435868 B1 JP4435868 B1 JP 4435868B1
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- 238000004519 manufacturing process Methods 0.000 title claims abstract description 29
- 239000011247 coating layer Substances 0.000 claims abstract description 135
- 239000000463 material Substances 0.000 claims abstract description 122
- 239000000758 substrate Substances 0.000 claims abstract description 83
- 230000002093 peripheral effect Effects 0.000 claims abstract description 77
- 229910052751 metal Inorganic materials 0.000 claims abstract description 46
- 239000002184 metal Substances 0.000 claims abstract description 46
- 229910045601 alloy Inorganic materials 0.000 claims abstract description 41
- 239000000956 alloy Substances 0.000 claims abstract description 41
- 239000010410 layer Substances 0.000 claims abstract description 27
- 238000002844 melting Methods 0.000 claims abstract description 26
- 230000008018 melting Effects 0.000 claims abstract description 26
- 238000010304 firing Methods 0.000 claims abstract description 14
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 88
- 229910052782 aluminium Inorganic materials 0.000 claims description 86
- 239000002131 composite material Substances 0.000 claims description 50
- 238000000034 method Methods 0.000 claims description 27
- 229910000838 Al alloy Inorganic materials 0.000 claims description 26
- 230000006835 compression Effects 0.000 claims description 18
- 238000007906 compression Methods 0.000 claims description 18
- 238000000748 compression moulding Methods 0.000 claims description 18
- 229910052710 silicon Inorganic materials 0.000 claims description 10
- 239000010703 silicon Substances 0.000 claims description 10
- 238000000465 moulding Methods 0.000 claims description 7
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 claims description 7
- 230000008569 process Effects 0.000 claims description 6
- 238000003825 pressing Methods 0.000 claims description 5
- 229910010271 silicon carbide Inorganic materials 0.000 claims description 5
- 229910052581 Si3N4 Inorganic materials 0.000 claims description 4
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 claims description 4
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 claims description 2
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 abstract description 30
- 239000000203 mixture Substances 0.000 abstract description 26
- 238000007747 plating Methods 0.000 abstract description 17
- 229910052759 nickel Inorganic materials 0.000 abstract description 15
- 239000000919 ceramic Substances 0.000 description 66
- 239000000843 powder Substances 0.000 description 43
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 14
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 13
- 239000010949 copper Substances 0.000 description 13
- 229910052802 copper Inorganic materials 0.000 description 13
- 239000002245 particle Substances 0.000 description 10
- 239000011888 foil Substances 0.000 description 9
- 229910000679 solder Inorganic materials 0.000 description 9
- 239000010935 stainless steel Substances 0.000 description 9
- 229910001220 stainless steel Inorganic materials 0.000 description 9
- 238000001816 cooling Methods 0.000 description 8
- 238000000879 optical micrograph Methods 0.000 description 8
- CSDREXVUYHZDNP-UHFFFAOYSA-N alumanylidynesilicon Chemical compound [Al].[Si] CSDREXVUYHZDNP-UHFFFAOYSA-N 0.000 description 7
- 229910000881 Cu alloy Inorganic materials 0.000 description 6
- 238000005259 measurement Methods 0.000 description 6
- 238000003892 spreading Methods 0.000 description 6
- 230000007480 spreading Effects 0.000 description 6
- 238000010438 heat treatment Methods 0.000 description 5
- 229910000676 Si alloy Inorganic materials 0.000 description 4
- 239000013078 crystal Substances 0.000 description 4
- 239000011347 resin Substances 0.000 description 4
- 229920005989 resin Polymers 0.000 description 4
- 239000011863 silicon-based powder Substances 0.000 description 4
- 238000011282 treatment Methods 0.000 description 4
- 229910000967 As alloy Inorganic materials 0.000 description 3
- JBRZTFJDHDCESZ-UHFFFAOYSA-N AsGa Chemical compound [As]#[Ga] JBRZTFJDHDCESZ-UHFFFAOYSA-N 0.000 description 3
- 230000003247 decreasing effect Effects 0.000 description 3
- 230000020169 heat generation Effects 0.000 description 3
- 230000007257 malfunction Effects 0.000 description 3
- 239000000155 melt Substances 0.000 description 3
- 238000002156 mixing Methods 0.000 description 3
- 239000004065 semiconductor Substances 0.000 description 3
- 229910018072 Al 2 O 3 Inorganic materials 0.000 description 2
- JMASRVWKEDWRBT-UHFFFAOYSA-N Gallium nitride Chemical compound [Ga]#N JMASRVWKEDWRBT-UHFFFAOYSA-N 0.000 description 2
- -1 InP Chemical compound 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 2
- 238000005266 casting Methods 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 238000009826 distribution Methods 0.000 description 2
- 238000013021 overheating Methods 0.000 description 2
- 230000001590 oxidative effect Effects 0.000 description 2
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 description 2
- 238000005245 sintering Methods 0.000 description 2
- 238000005507 spraying Methods 0.000 description 2
- 238000012360 testing method Methods 0.000 description 2
- 238000007751 thermal spraying Methods 0.000 description 2
- PIGFYZPCRLYGLF-UHFFFAOYSA-N Aluminum nitride Chemical compound [Al]#N PIGFYZPCRLYGLF-UHFFFAOYSA-N 0.000 description 1
- 229910002601 GaN Inorganic materials 0.000 description 1
- GPXJNWSHGFTCBW-UHFFFAOYSA-N Indium phosphide Chemical compound [In]#P GPXJNWSHGFTCBW-UHFFFAOYSA-N 0.000 description 1
- SNAAJJQQZSMGQD-UHFFFAOYSA-N aluminum magnesium Chemical compound [Mg].[Al] SNAAJJQQZSMGQD-UHFFFAOYSA-N 0.000 description 1
- 239000011230 binding agent Substances 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- PMHQVHHXPFUNSP-UHFFFAOYSA-M copper(1+);methylsulfanylmethane;bromide Chemical compound Br[Cu].CSC PMHQVHHXPFUNSP-UHFFFAOYSA-M 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 239000010432 diamond Substances 0.000 description 1
- 229910003460 diamond Inorganic materials 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005242 forging Methods 0.000 description 1
- 230000006698 induction Effects 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 239000012768 molten material Substances 0.000 description 1
- 230000000414 obstructive effect Effects 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 239000011148 porous material Substances 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 238000005096 rolling process Methods 0.000 description 1
- 238000009751 slip forming Methods 0.000 description 1
- 238000012546 transfer Methods 0.000 description 1
- 230000009466 transformation Effects 0.000 description 1
- 230000007704 transition Effects 0.000 description 1
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/367—Cooling facilitated by shape of device
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
- H01L21/4814—Conductive parts
- H01L21/4871—Bases, plates or heatsinks
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/367—Cooling facilitated by shape of device
- H01L23/3675—Cooling facilitated by shape of device characterised by the shape of the housing
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Materials Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
基材の表面、裏面および外周面を被覆する、金属または合金からなる被覆層の厚みをできるだけ均一に、そして薄くし、かつ前記被覆層の表面に、安定してニッケルめっき処理等を施すことができるヒートスプレッダと、前記ヒートスプレッダの製造方法とを提供する。
ヒートスプレッダ１は、前記薄板により基材２の表面３および外周面５の一部を被覆する被覆層７、８の形状に成形した第１成形体９と、基材２の裏面４および外周面５の残部を被覆する被覆層１０、１１の形状に成形した第２成形体１２とを、前記金属等の融点未満の温度での焼成により外周面５において互いに接合し、かつ基材２と接合させて被覆層６を形成した。製造方法は、前記第１および第２成形体９，１２間に、基材２のもとになる材料の混合物２１を充填して、金属等の融点未満の温度で圧縮成形したのち、前記金属等の融点未満の温度で焼成する。
【選択図】図２The surface of the base material, the back surface and the outer peripheral surface are coated, and the thickness of the coating layer made of metal or alloy is made as uniform and thin as possible, and the surface of the coating layer is stably subjected to nickel plating or the like A heat spreader that can be produced and a method for producing the heat spreader are provided.
The heat spreader 1 includes a first molded body 9 formed into the shape of coating layers 7 and 8 that cover a part of the surface 3 and the outer peripheral surface 5 of the substrate 2 with the thin plate, and the back surface 4 and the outer peripheral surface 5 of the substrate 2. The second molded body 12 formed into the shape of the covering layers 10 and 11 covering the remainder of the metal is bonded to each other on the outer peripheral surface 5 by baking at a temperature lower than the melting point of the metal or the like, and bonded to the base material 2. Thus, the coating layer 6 was formed. In the manufacturing method, the mixture 21 of the material to be the base material 2 is filled between the first and second molded bodies 9 and 12 and compression-molded at a temperature lower than the melting point of metal or the like, and then the metal Firing at a temperature below the melting point such as.
[Selection] Figure 2
Description
本発明は、特にパワー半導体素子等の、動作時に大きな発熱を伴う素子から熱を除去するために好適に用いられるヒートスプレッダと、その製造方法に関するものである。 The present invention relates to a heat spreader that is preferably used for removing heat from an element that generates a large amount of heat during operation, such as a power semiconductor element, and a manufacturing method thereof.
動作時に大きな発熱を伴う素子においては、前記熱をできるだけ速やかに除去することが求められる。前記熱を速やかに除去しないと、素子自体が過熱して誤動作（熱暴走）したり、破損したり、あるいは動作の効率が低下したりするおそれがある。かかる素子としては、例えば電気自動車やハイブリッド自動車、鉄道車両等において誘導モータを駆動させる際に直流から交流への電力変換を行うためのインバータ回路に組み込まれる絶縁ゲート型バイポーラトランジスタ等のパワー半導体素子、プラズマディスプレイパネル等の画像表示素子、コンピュータのマイクロプロセッサユニット、あるいはレーザーダイオード等が挙げられる。 In an element that generates a large amount of heat during operation, it is required to remove the heat as quickly as possible. If the heat is not removed quickly, the element itself may overheat, causing malfunction (thermal runaway), damage, or a reduction in operation efficiency. As such an element, for example, a power semiconductor element such as an insulated gate bipolar transistor incorporated in an inverter circuit for performing power conversion from direct current to alternating current when driving an induction motor in an electric vehicle, a hybrid vehicle, a railway vehicle, etc. Examples thereof include an image display element such as a plasma display panel, a microprocessor unit of a computer, or a laser diode.
近年、前記各種装置類のより一層の高性能化や高出力化の進展に伴って、前記素子を、一般的なケイ素（Ｓｉ）系、ガリウム−砒素（ＧａＡｓ）系、インジウム−燐（ＩｎＰ）系の素子から、炭化ケイ素（ＳｉＣ）系、窒化ガリウム（ＧａＮ）系の素子へと移行することが検討されている。その場合、素子の動作可能温度を例えばＳｉ系の素子等の１２０℃前後から、ＳｉＣ系の素子等の２００℃前後まで引き上げることが可能となり、過熱による誤動作や破損、動作効率の低下等をこれまでよりも起こりにくくできると考えられている。 In recent years, with the progress of higher performance and higher output of the various devices, the element is replaced with a general silicon (Si) -based, gallium-arsenic (GaAs) -based, indium-phosphorus (InP). Transition from silicon-based devices to silicon carbide (SiC) -based devices and gallium nitride (GaN) -based devices has been studied. In that case, it becomes possible to raise the operable temperature of the element from around 120 ° C. such as a Si-based element to around 200 ° C. such as a SiC-based element, which may cause malfunction or damage due to overheating or a decrease in operational efficiency. It is thought that it can be harder to happen.
しかし、これらの素子においてもできるだけ速やかに熱を除去する必要があることには変わりはない。前記熱を速やかに除去して素子の誤動作や破損、動作効率の低下等を防止する手段としては、例えば平板状のヒートスプレッダを用いるのが一般的である。すなわち前記素子を、前記平板状のヒートスプレッダの表面に直接に、あるいはセラミック基板等を介してはんだ接合等により搭載する。また前記ヒートスプレッダの裏面は、冷却器やヒートシンク、あるいは前記冷却器等への伝熱部材（以下これらを「冷却部材」と総称する場合がある）と接触させた状態でネジ止め等して固定する。そうすると素子で発生した熱を、前記ヒートスプレッダを介して速やかに冷却部材に熱伝導させて除去できる。 However, it is still necessary for these elements to remove heat as quickly as possible. As a means for quickly removing the heat to prevent malfunction or damage of the element, a decrease in operating efficiency, etc., for example, a flat plate heat spreader is generally used. That is, the element is mounted directly on the surface of the flat plate heat spreader or by solder bonding or the like via a ceramic substrate or the like. The back surface of the heat spreader is fixed by screwing or the like in a state where it is in contact with a cooler, a heat sink, or a heat transfer member to the cooler (hereinafter, these may be collectively referred to as “cooling member”). . If it does so, the heat which generate | occur | produced in the element can be rapidly conducted to a cooling member via the said heat spreader, and can be removed.
従来は、前記ヒートスプレッダをアルミニウムや銅等の金属、もしくは合金によって一体に形成していた。
しかし近時、前記ヒートスプレッダをアルミニウム−セラミック複合材料等によって形成することが検討されている（例えば特許文献１ないし３参照）。前記アルミニウム−セラミック複合材料等の複合材料は、前記金属や合金と同等程度の熱伝導率を有する上、先に説明した各種材料からなる素子や、あるいは窒化アルミニウム（ＡｌＮ）、酸化アルミニウム（Ａｌ２Ｏ３）、窒化ケイ素（Ｓｉ３Ｎ４）等からなるセラミック基板等と熱膨張係数が近い。そのためヒートスプレッダを前記複合材料によって形成することで、前記素子やセラミック基板等との熱膨張係数の差をできるだけ小さくすることができる。したがって、素子の動作による発熱と停止後の冷却とを繰り返した際に、熱膨張係数の違いに基づいて素子に過剰な応力が加わって前記素子自体が破損したり、あるいははんだ接合が破壊されたりするのを抑制できる。
Conventionally, the heat spreader is integrally formed of a metal such as aluminum or copper, or an alloy.
However, recently, it has been studied to form the heat spreader with an aluminum-ceramic composite material or the like (see, for example, Patent Documents 1 to 3). The composite material such as the aluminum-ceramic composite material has a thermal conductivity equivalent to that of the metal or alloy, and is made of the various materials described above, or aluminum nitride (AlN), aluminum oxide (Al 2 ). The thermal expansion coefficient is close to a ceramic substrate made of O 3 ), silicon nitride (Si 3 N 4 ), or the like. Therefore, by forming the heat spreader with the composite material, the difference in thermal expansion coefficient with the element, the ceramic substrate, or the like can be made as small as possible. Therefore, when the heat generation due to the operation of the element and the cooling after the stop are repeated, excessive stress is applied to the element based on the difference in coefficient of thermal expansion and the element itself is damaged, or the solder joint is destroyed. Can be suppressed.
例えば前記アルミニウム−セラミック複合材料からなるヒートスプレッダは、
(i) セラミック粉末と、アルミニウムまたはアルミニウム合金の粉末とを混合した混合物を加熱することで前記アルミニウム等を溶融させて、前記セラミック粉末間に浸透させたのち冷却して一体化させる、
(ii) 前記セラミック粉末を、溶融させたアルミニウム等と混合したのち冷却して一体化させる、
(iii) セラミック粉末を焼結して多孔質体（スケルトンまたはプリフォーム）を作製し、前記多孔質体の細孔中に、溶融させたアルミニウム等を含浸させたのち冷却して一体化させる、
等の工程を経て製造される。
For example, a heat spreader made of the aluminum-ceramic composite material is as follows:
(i) The mixture of ceramic powder and aluminum or aluminum alloy powder is heated to melt the aluminum and the like, and is allowed to penetrate between the ceramic powders, and then cooled and integrated.
(ii) The ceramic powder is mixed with molten aluminum or the like and then cooled and integrated.
(iii) Sintering the ceramic powder to produce a porous body (skeleton or preform), impregnating molten aluminum or the like into the pores of the porous body, and cooling to integrate them.
It is manufactured through such processes.
略平板状のヒートスプレッダの表面または裏面に、前記素子やセラミック基板等を、熱伝導の妨げになるボイド等を生じることなく良好にはんだ接合するためには、前記表面または裏面を、前記はんだに対する濡れ性、親和性に優れたニッケルめっき膜等で被覆するのが好ましい。しかし複合材料からなるヒートスプレッダの場合、前記複合材料を構成する各種の材料、例えばアルミニウムとセラミックとではめっきの条件が大きく異なるため、前記表面または裏面に直接に、安定で均一なニッケルめっき膜を形成するのは困難である。 In order to satisfactorily solder the element or ceramic substrate to the front or back surface of the substantially flat heat spreader without causing voids or the like that hinder heat conduction, the front surface or back surface is wetted with respect to the solder. It is preferable to coat with a nickel plating film having excellent properties and affinity. However, in the case of a heat spreader made of a composite material, the various plating materials for the composite material, for example, aluminum and ceramic, differ greatly in plating conditions, so a stable and uniform nickel plating film is formed directly on the front or back surface. It is difficult to do.
特許文献４ないし６には、複合材料からなる平板状の基材の表面および裏面に、前記複合材料に含まれるのと同じまたは異なる金属または合金からなる被覆層を積層したヒートスプレッダが記載されている。前記積層構造を有するヒートスプレッダは、素子やセラミック基板等との接続面である前記表面または裏面が単一の金属または合金からなる平滑な被覆層で覆われているため、前記被覆層上に安定で均一なニッケルめっき膜を形成できる。 Patent Documents 4 to 6 describe a heat spreader in which a coating layer made of the same or different metal or alloy contained in the composite material is laminated on the front and back surfaces of a flat substrate made of a composite material. . Since the heat spreader having the laminated structure is covered with a smooth coating layer made of a single metal or alloy on the front surface or the back surface, which is a connection surface with an element or a ceramic substrate, the heat spreader is stable on the coating layer. A uniform nickel plating film can be formed.
そのためニッケルめっき膜を形成した前記表面または裏面に、前記素子やセラミック基板等を、熱伝導の妨げになるボイド等を生じることなく良好にはんだ接合できる。また、被覆層を構成する金属または合金としてはんだに対する濡れ性、親和性に優れたものを選択してニッケルめっき膜を省略することもできる。
しかし、前記積層構造を有するヒートスプレッダは面方向の外周面（前記表面および裏面と交差する側面）において基材が露出しているため、前記基材に含まれるセラミック粉末等が、先に説明した(i)ないし(iii)等の工程を経て基材を形成する際や、あるいは形成した基材の表面および裏面に被覆層を積層する工程等において用いる金型や治具等を傷つけたり摩耗させたりしやすいという問題がある。これはセラミック粉末等が、前記金型や治具等を形成する金属材料よりも硬いためである。前記問題が生じるのを防止するために、例えば金型や治具等のうち、少なくとも基材と直接に接する面を超硬材料やダイヤモンド等で形成することが考えられる。しかし前記超硬材料等は、セラミック等と比べてさらに硬質の難加工材であるため、任意の立体形状を有する金型や治具等の表面を前記超硬材料等によって形成するのは困難であり、かかる対策は実現性に乏しい。
Therefore, the element, the ceramic substrate, and the like can be satisfactorily soldered to the front surface or the back surface on which the nickel plating film is formed without generating voids that hinder heat conduction. Further, a nickel plating film can be omitted by selecting a metal or alloy constituting the coating layer having excellent wettability and affinity for solder.
However, since the base material is exposed on the outer peripheral surface in the plane direction (side surface intersecting with the front surface and the back surface) of the heat spreader having the laminated structure, the ceramic powder and the like contained in the base material have been described above ( When a substrate is formed through the steps i) to (iii), or a mold or jig used in the step of laminating a coating layer on the front and back surfaces of the formed substrate is damaged or worn. There is a problem that it is easy to do. This is because ceramic powder or the like is harder than the metal material forming the mold or jig. In order to prevent the above problems from occurring, for example, it is conceivable that at least a surface directly in contact with the base material of a mold, a jig, or the like is formed of a super hard material or diamond. However, since the superhard material is a harder material that is harder than ceramic or the like, it is difficult to form the surface of a mold or jig having an arbitrary three-dimensional shape with the superhard material or the like. Yes, such measures are not feasible.
特許文献３の実施例２（段落[００４３]〜[００４４]）には、前記(ii)の工程を経てアルミニウム−セラミック複合材料からなるヒートスプレッダを製造する際に、セラミック粉末をヒートスプレッダの表面、裏面、および外周面において極力露出させないように、前記セラミック粉末の量を調整すると共に熱処理の条件を調整することが記載されている。この方法によって製造されるヒートスプレッダは、前記各面において基本的にセラミック粉末が露出しない状態となるため、前記セラミック粉末が金型や治具等を傷つけたり摩耗させたりするのを抑制できる。 In Example 2 (paragraphs [0043] to [0044]) of Patent Document 3, when manufacturing a heat spreader made of an aluminum-ceramic composite material through the step (ii), ceramic powder is used on the front and back surfaces of the heat spreader. And adjusting the amount of the ceramic powder and adjusting the heat treatment conditions so as not to expose the outer peripheral surface as much as possible. Since the heat spreader manufactured by this method is basically in a state where the ceramic powder is not exposed on each of the surfaces, the ceramic powder can be prevented from damaging or wearing a mold, a jig or the like.
しかし前記(ii)の工程を実施する際には、セラミックと共に基材を形成するアルミニウム等として、純アルミニウムではなく、前記純アルミニウムよりも溶融時の粘性が低く流動性に優れたアルミニウム合金、例えばアルミニウム−ケイ素合金等を用いる必要がある。そのため、ヒートスプレッダの各面にはケイ素等の結晶成分が析出しやすく、特に前記結晶成分が析出した表面や裏面には、安定で均一なニッケルめっき膜を形成するのは困難である。 However, when carrying out the step (ii), aluminum or the like that forms the base material together with the ceramic, not pure aluminum, an aluminum alloy having a low viscosity at the time of melting than the pure aluminum and excellent in fluidity, for example, It is necessary to use an aluminum-silicon alloy or the like. Therefore, a crystal component such as silicon is likely to be deposited on each surface of the heat spreader, and it is difficult to form a stable and uniform nickel plating film on the front and back surfaces where the crystal component is deposited.
特許文献３には、前記複合材料からなるヒートスプレッダの表面および裏面に、下記いずれかの処理を施すことが記載されている。
(iv) ヒートスプレッダの表面および裏面にアルミニウム等を溶射する（段落[００４５]ないし[００４９]の実施例３、４）。
(v) ヒートスプレッダの表面および裏面にアルミニウム箔を貼り付ける（段落[００５０]ないし[００５２]の実施例５）。
(vi) ヒートスプレッダを製造する型内の、表面および裏面に対応する位置にアルミニウム箔をセットする（段落[００５３]ないし[００５４]の実施例６）。
Patent Document 3 describes that one of the following treatments is performed on the front and back surfaces of the heat spreader made of the composite material.
(iv) Spraying aluminum or the like on the front and back surfaces of the heat spreader (Examples 3 and 4 in paragraphs [0045] to [0049]).
(v) Affixing aluminum foil on the front and back surfaces of the heat spreader (Example 5 in paragraphs [0050] to [0052]).
(vi) An aluminum foil is set at a position corresponding to the front and back surfaces in a mold for manufacturing a heat spreader (Example 6 in paragraphs [0053] to [0054]).
特に実施例４では、ヒートスプレッダとして、先に説明した実施例２で製造されたものを用いており、アルミニウム等を溶射した表面、および裏面だけでなく、前記処理をしていない外周面においても、セラミックの粉末は殆ど露出していないと考えられる。
しかし、(iv)の溶射によって基材の表面、および裏面に形成される層は、前記溶射時に発生するアルミニウムの酸化物を含んでおり、前記酸化物が層の外面に析出しやすい傾向がある。そのため、酸化物が析出した前記外面に、安定で均一なニッケルめっき膜を形成するのは困難である。また、アルミニウム等を溶射する工程が増加する分、ヒートスプレッダの生産性が低下するという問題もある。同様に(v)のアルミニウム箔を貼り付ける方法では、前記工程が増加する分、ヒートスプレッダの生産性が低下するという問題がある。
Particularly in Example 4, as the heat spreader, the one manufactured in Example 2 described above is used, and not only on the surface and the back surface sprayed with aluminum or the like, but also on the outer peripheral surface not subjected to the above treatment, The ceramic powder is considered to be barely exposed.
However, the layer formed on the front surface and the back surface of the base material by the thermal spraying of (iv) contains an oxide of aluminum generated during the thermal spraying, and the oxide tends to precipitate on the outer surface of the layer. . Therefore, it is difficult to form a stable and uniform nickel plating film on the outer surface on which the oxide is deposited. In addition, there is a problem that the productivity of the heat spreader is reduced by the increase in the step of spraying aluminum or the like. Similarly, the method (v) of attaching the aluminum foil has a problem that the productivity of the heat spreader is reduced by the increase in the number of steps.
(vi)の型内にアルミニウム箔をセットする方法では、アルミニウム等の溶融物を型内に注入する際に、ごく薄いアルミニウム箔（実施例６では７μｍ）が前記溶融物と接触することで溶融して失われやすい。そのため、ヒートスプレッダの表面および裏面には、特許文献４ないし６に記載された被覆層のように、アルミニウム箔にのみ起源を有する連続した被覆層は形成されていない可能性が高い。 In the method of setting the aluminum foil in the mold of (vi), when a melt such as aluminum is poured into the mold, a very thin aluminum foil (7 μm in Example 6) is brought into contact with the melt to melt. And easily lost. Therefore, there is a high possibility that a continuous coating layer originating only in the aluminum foil is not formed on the front and back surfaces of the heat spreader, like the coating layers described in Patent Documents 4 to 6.
すなわち前記アルミニウム箔は、単独で被覆層を形成するために機能するのではなく、製造されるヒートスプレッダの表面および裏面におけるアルミニウム等の存在比率を高めると共に、セラミックの粉末が前記表面および裏面に露出するのを妨げるために機能しつつ、型内に注入されたアルミニウム等の溶融物と渾然一体となって、前記表面および裏面に、セラミックの粉末の存在比率が小さい領域を形成すると考えられる。したがって前記表面および裏面には、依然として、特許文献３の実施例２の場合と同様に、注入したアルミニウム−ケイ素合金等に起因するケイ素等の結晶成分が析出しやすい傾向があり、前記結晶成分が析出した表面や裏面には、安定で均一なニッケルめっき膜を形成するのは困難である。 That is, the aluminum foil does not function to form a coating layer alone, but increases the abundance ratio of aluminum and the like on the front and back surfaces of the manufactured heat spreader, and the ceramic powder is exposed on the front and back surfaces. It is considered that a region having a small ceramic powder abundance ratio is formed on the front surface and the back surface of the melted material such as aluminum injected into the mold. Therefore, as in the case of Example 2 of Patent Document 3, there is still a tendency that crystal components such as silicon resulting from the injected aluminum-silicon alloy tend to precipitate on the front and back surfaces. It is difficult to form a stable and uniform nickel plating film on the deposited front and back surfaces.
特許文献４の段落[００１５]ないし[００１９]には、前記アルミニウム箔に代えて、あらかじめヒートスプレッダの立体形状に成形した有底四角筒状の金属容器内にセラミック等の粉末を充填した後、前記金属容器内にアルミニウム等の溶融物を注入してヒートスプレッダを製造することが記載されている。この方法によれば、金属容器は所定の肉厚を有するため、例えば平板状のヒートスプレッダである場合は、前記表面および裏面だけでなく外周面にも、前記金属容器に起源を有する連続した被覆層を形成できる。 In paragraphs [0015] to [0019] of Patent Document 4, instead of the aluminum foil, after filling a powder such as a ceramic into a bottomed rectangular tube-shaped metal container previously formed into a three-dimensional shape of a heat spreader, It describes that a heat spreader is manufactured by injecting a melt such as aluminum into a metal container. According to this method, since the metal container has a predetermined thickness, for example, in the case of a flat plate-shaped heat spreader, not only the front and back surfaces but also the outer peripheral surface has a continuous coating layer originating from the metal container. Can be formed.
しかしこの方法では、金属容器内に注入したアルミニウム等の溶融物と接触することで、前記金属容器の少なくとも内周面が溶融することが確認されている。そのため、金属容器の全体が溶融して前記アルミニウム箔と同様の問題を生じないようにするためには、前記金属容器の厚みを大きめに設定する必要がある。
ところが金属容器の厚みを大きく設定した場合には、基材と、ヒートスプレッダの表面または裏面に接合される素子やセラミック基板等との間に、前記金属容器に起源を有する厚みの大きい金属の層が、前記被覆層として介在することになる。そのため、基材を複合材料によって形成しているにも拘らず、素子の動作による発熱と停止後の冷却とを繰り返した際には、前記被覆層を形成する金属と、素子やセラミック基板等との熱膨張係数の違いに基づいて素子に過剰な応力が加わって前記素子自体が破損したり、あるいははんだ接合が破壊されたりするおそれがある。また、前記のように金属容器の厚みを大きめに設定しなければならない分、ヒートスプレッダを小型化することが難しいため、特に近年の、前記ヒートスプレッダを含む機器類の小型化、省スペース化の要求に十分に対応できないという問題もある。
However, in this method, it has been confirmed that at least the inner peripheral surface of the metal container is melted by contact with a molten material such as aluminum injected into the metal container. Therefore, in order to prevent the entire metal container from melting and causing the same problem as the aluminum foil, it is necessary to set the metal container to a large thickness.
However, when the thickness of the metal container is set to be large, a thick metal layer originating in the metal container is formed between the base material and the element or ceramic substrate bonded to the front or back surface of the heat spreader. , And intervene as the coating layer. Therefore, even when the base material is formed of a composite material, when the heat generated by the operation of the element and the cooling after the stop are repeated, the metal that forms the covering layer, the element, the ceramic substrate, etc. Based on the difference in thermal expansion coefficient, excessive stress is applied to the element, which may damage the element itself or destroy the solder joint. In addition, since it is difficult to reduce the size of the heat spreader because the thickness of the metal container has to be set larger as described above, particularly in recent years, there has been a demand for downsizing and space saving of devices including the heat spreader. There is also the problem of not being able to respond adequately.
特許文献７の段落[０００６]には、前記(iii)の多孔質体を、それよりも大きいキャビティを有する金型内に収容した状態で、溶融させたアルミニウム等を流し込んで多孔質体に含浸させると共に、前記多孔質体と金型との隙間にアルミニウム等を充填して被覆層を形成することが記載されている。しかしこの方法でも、前記アルミニウム等としては、純アルミニウムよりも溶融時の粘性が低く流動性に優れたアルミニウム−ケイ素合金等を用いる必要があり、かかる合金によって形成した前記層の外面にはケイ素等の結晶成分が析出しやすいため、前記結晶成分が析出した外面に、安定で均一なニッケルめっき膜を形成するのは困難である。 Paragraph [0006] of Patent Document 7 impregnates the porous body by pouring molten aluminum or the like in a state where the porous body of (iii) is accommodated in a mold having a larger cavity. In addition, it is described that the gap between the porous body and the mold is filled with aluminum or the like to form a coating layer. However, even in this method, it is necessary to use an aluminum-silicon alloy or the like that has a lower viscosity at the time of melting than the pure aluminum and has excellent fluidity as the aluminum or the like, and silicon or the like is formed on the outer surface of the layer formed by such an alloy. Therefore, it is difficult to form a stable and uniform nickel plating film on the outer surface on which the crystal component is deposited.
またこの方法では、型内での多孔質体の位置決めが容易でなく、位置ずれを生じやすい。位置ずれした多孔質体がヒートスプレッダの表面、裏面、または外周面において露出するのを防止するためには、前記隙間の寸法によって規定される被覆層の厚みを大きくしなければならない。そのため、やはり基材と、ヒートスプレッダの表面または裏面に接合される素子やセラミック基板等との間には、厚みの大きい被覆層が介在することになる。したがって基材を複合材料で形成しているにも拘らず、素子の動作による発熱と停止後の冷却とを繰り返した際には、前記被覆層を形成するアルミニウム等と、素子やセラミック基板等との熱膨張係数の違いに基づいて素子に過剰な応力が加わって前記素子自体が破損したり、あるいははんだ接合が破壊されたりするおそれがある。 In this method, the positioning of the porous body in the mold is not easy, and misalignment tends to occur. In order to prevent the misaligned porous body from being exposed on the front surface, back surface, or outer peripheral surface of the heat spreader, the thickness of the coating layer defined by the size of the gap must be increased. Therefore, a coating layer having a large thickness is also interposed between the base material and the element or ceramic substrate bonded to the front or back surface of the heat spreader. Therefore, even though the base material is formed of a composite material, when the heat generation due to the operation of the element and the cooling after the stop are repeated, aluminum or the like that forms the covering layer, and the element or ceramic substrate Based on the difference in thermal expansion coefficient, excessive stress is applied to the element, which may damage the element itself or destroy the solder joint.
また、前記のように被覆層の厚みを大きめに設定しなければならない分、ヒートスプレッダを小型化することが難しいため、特に近年の、前記ヒートスプレッダを含む機器類の小型化、省スペース化の要求に十分に対応できないという問題もある。さらに、ヒートスプレッダ内で多孔質体の位置がずれることによって、その周囲に形成される被覆層の厚みがばらついて、同一のヒートスプレッダの同一の面内で熱伝導の特性がばらついたり、前記方法で生産される複数のヒートスプレッダ間で熱伝導の特性がばらついたりするおそれもある。 In addition, since it is difficult to reduce the size of the heat spreader because the thickness of the coating layer has to be set larger as described above, particularly in recent years, there has been a demand for downsizing and space saving of devices including the heat spreader. There is also the problem of not being able to respond adequately. Furthermore, when the position of the porous body in the heat spreader is shifted, the thickness of the coating layer formed around it varies, and the heat conduction characteristics vary within the same surface of the same heat spreader. There is also a possibility that the heat conduction characteristics may vary among a plurality of heat spreaders.
本発明の目的は、複合材料等からなる略平板状の基材の表面、裏面、および面方向の外周面を被覆する、金属または合金からなる被覆層の厚みができるだけ均一で、かつ薄い上、前記被覆層の表面に、安定で均一なニッケルめっき膜を形成できるヒートスプレッダと、前記ヒートスプレッダの製造方法とを提供することにある。 The object of the present invention is to cover the surface, the back surface, and the outer peripheral surface in the surface direction of a substantially flat substrate made of a composite material, etc., and the thickness of the coating layer made of metal or alloy is as uniform and thin as possible. An object of the present invention is to provide a heat spreader capable of forming a stable and uniform nickel plating film on the surface of the coating layer, and a method for manufacturing the heat spreader.
本発明は、略平板状の基材と、前記基材の表面、裏面、および面方向の外周面が、いずれも金属または合金からなり互いに連続する被覆層で被覆されたヒートスプレッダであって、前記金属または合金からなる薄板により、前記基材の表面、および外周面のうち前記表面と連続する領域を被覆する被覆層の形状に成形された第１成形体と、前記薄板により、前記基材の裏面、および前記外周面のうち前記裏面と連続する領域を被覆する被覆層の形状に成形された第２成形体との間に前記基材のもとになる材料の粉末を充填して、前記金属または合金の融点未満の温度での圧縮成形および焼成によって前記基材が形成され、かつ前記第１成形体と第２成形体とが前記外周面において互いに接合されるとともに前記基材と接合されて前記被覆層が形成されていることを特徴とする。 The present invention is a heat spreader in which the substantially flat substrate and the front surface, the back surface, and the outer circumferential surface of the substrate are each made of a metal or an alloy and are coated with a continuous coating layer, A first molded body formed into a shape of a coating layer that covers a region continuous with the surface of the surface of the substrate and an outer peripheral surface by a thin plate made of metal or an alloy, and the thin plate, Filling the back surface and the powder of the material to be the base material between the outer peripheral surface and the second molded body formed in the shape of the coating layer covering the region continuous with the back surface , The base material is formed by compression molding and firing at a temperature lower than the melting point of the metal or alloy, and the first molded body and the second molded body are bonded to each other on the outer peripheral surface and bonded to the base material. The coating layer is Made is characterized in that is.
本発明では、前記金属または合金からなる薄板によってあらかじめ被覆層の形状に成形された前記第１および第２成形体間に基材のもとになる材料の粉末を充填して、前記金属または合金の融点未満の温度での圧縮成形および焼成によって前記基材が形成され、かつ前記両成形体が、その形状および組成を維持しながら、形成された基材の外周面で互いに接合されるとともに、前記基材と接合されて被覆層が形成される。そのため前記被覆層は、前記第１および第２成形体のみを起源とし、しかも基材の表面、裏面、および外周面において互いに連続して形成される。また、特に素子やセラミック基板等の接続面として主に用いられるヒートスプレッダの表面および裏面の被覆層は、前記両成形体における厚みの精度を維持できる。しかも前記両成形体のもとになる薄板の厚みを極力薄くすることで、前記被覆層の厚みをできるだけ薄くすることもできる。 In the present invention, the metal or alloy is filled with a powder of a material serving as a base material between the first and second molded bodies, which are previously formed into the shape of a coating layer by a thin plate made of the metal or alloy. is the substrate by compression molding and sintering at a temperature below the melting point of formation, and the two molded bodies, while maintaining the shape and composition of that, in the outer peripheral surface of the formed substrate while being joined together Then, it is bonded to the base material to form a coating layer. Therefore, the coating layer originates only from the first and second molded bodies, and is continuously formed on the front surface, the back surface, and the outer peripheral surface of the base material. In particular, the coating layers on the front and back surfaces of the heat spreader mainly used as a connection surface of an element, a ceramic substrate or the like can maintain the accuracy of the thickness in both the molded bodies. And the thickness of the said coating layer can also be made as thin as possible by making the thickness of the thin plate used as the basis of both said molded bodies as thin as possible.
また前記薄板を、ニッケルめっき膜を形成する妨げとなる成分を含まない金属または合金によって形成することで、前記被覆層の表面に、安定で均一なニッケルめっき膜を形成することもできる。そのため本発明のヒートスプレッダによれば、前記素子やセラミック基板等との間での熱膨張係数の差に基づく先に説明した様々な問題が生じるのを防止しながら、前記各部の間での良好な熱伝導を確保することが可能となる。 Moreover, a stable and uniform nickel plating film can also be formed on the surface of the coating layer by forming the thin plate with a metal or alloy that does not contain a component that hinders the formation of the nickel plating film. Therefore, according to the heat spreader of the present invention, while preventing the various problems described above based on the difference in the thermal expansion coefficient between the element and the ceramic substrate, etc., it is possible to obtain good results between the respective parts. It becomes possible to ensure heat conduction.
また前記第１成形体および第２成形体のうち少なくとも一方の、前記基材の表面または裏面を被覆する被覆層となる領域に凹凸形状を設けることにより、圧縮成形によって形成される前記基材の該当する領域に凹凸形状を形成でき、しかも前記凹凸形状を含む表面、裏面、および外周面を、成形体の厚みの精度を維持した連続した薄い被覆層で被覆できる。 In addition, by providing a concavo-convex shape in a region serving as a coating layer covering the front surface or the back surface of the base material of at least one of the first molded body and the second molded body, the base material formed by compression molding An uneven shape can be formed in the corresponding region, and the front surface, back surface, and outer peripheral surface including the uneven shape can be covered with a continuous thin coating layer that maintains the accuracy of the thickness of the molded body.
被覆層の厚みの誤差は、そのもとになる薄板の厚みの精度を向上することにより、前記基材の外周面を被覆する被覆層のうち、前記第１成形体と第２成形体との接合部を除く領域と、前記基材の表面および裏面を被覆する被覆層のうち、前記基材の面方向と平行な領域とで±１０％以内とすることが可能である。
基材としては、熱膨張係数が１５×１０−６／Ｋ以下で、かつ熱伝導率が１５０Ｗ／ｍ・Ｋ以上である種々の複合材料からなるものが挙げられる。かかる条件を満足する複合材料にて基材を形成することにより、前記素子やセラミック基板等との間での熱膨張係数の差に基づく先に説明した様々な問題が生じるのを防止しながら、前記素子で発生した熱をできるだけ速やかに除去できる。
An error in the thickness of the coating layer is achieved by improving the accuracy of the thickness of the thin plate that is the basis of the coating layer covering the outer peripheral surface of the base material, and between the first molded body and the second molded body. It is possible to make it within ± 10% between the region excluding the bonding portion and the region parallel to the surface direction of the base material in the covering layer covering the front and back surfaces of the base material.
Examples of the base material include those made of various composite materials having a thermal expansion coefficient of 15 × 10 −6 / K or less and a thermal conductivity of 150 W / m · K or more. By forming the base material with a composite material that satisfies such conditions, while preventing various problems described above based on the difference in thermal expansion coefficient between the element and the ceramic substrate, etc., Heat generated in the device can be removed as quickly as possible.
前記基材を形成する複合材料としては、例えば、アルミニウムまたはアルミニウム合金と、炭化ケイ素、窒化ケイ素、アルミナ、およびケイ素からなる群より選ばれた少なくとも一種との混合物が挙げられる。また前記複合材料からなる基材の表面を被覆する被覆層を形成する金属または合金としては、アルミニウムまたはアルミニウム合金が挙げられる。前記複合材料と被覆層との組み合わせによれば、特に基材の熱膨張率や熱伝導率、被覆層の熱伝導率等を、前記範囲内でも、先に説明した各種装置類との組み合わせに適した任意の範囲に調整できる。また、前記被覆層の融点未満の温度での圧縮成形や焼成によって十分な強度を有する基材や被覆層を形成できる。 Examples of the composite material forming the base material include a mixture of aluminum or an aluminum alloy and at least one selected from the group consisting of silicon carbide, silicon nitride, alumina, and silicon. Examples of the metal or alloy that forms the coating layer that covers the surface of the base material made of the composite material include aluminum and aluminum alloys. According to the combination of the composite material and the coating layer, the thermal expansion coefficient and thermal conductivity of the base material, the thermal conductivity of the coating layer, etc., in combination with the various devices described above, even within the above range. Can be adjusted to any suitable range. Moreover, the base material and coating layer which have sufficient intensity | strength can be formed by the compression molding and baking at the temperature below melting | fusing point of the said coating layer.
前記材料を組み合わせたヒートスプレッダは、下記本発明の製造方法によって製造できる。すなわち本発明は、アルミニウムまたはアルミニウム合金を含む複合材料からなる略平板状の基材の表面、裏面、および面方向の外周面が、いずれもアルミニウムまたはアルミニウム合金からなり互いに連続する被覆層で被覆されたヒートスプレッダを製造する製造方法であって、
(a) 前記被覆層のもとになるアルミニウムまたはアルミニウム合金からなる薄板を、前記基材の表面、および外周面のうち前記表面と連続する領域を被覆する被覆層の形状に成形して第１成形体を作製するとともに、前記薄板を前記基材の裏面、および前記外周面のうち前記裏面と連続する領域を被覆する被覆層の形状に成形して第２成形体を作製する工程と、
(b) 前記基材の裏面を被覆する被覆層の表面形状に略一致する上面を有する下型、および前記基材の外周面を被覆する被覆層の表面形状に略一致する内周面を有するダイを用意し、前記下型とダイとを組み合わせて前記上面および内周面でキャビティを構成し、前記キャビティ内に前記第２成形体を嵌め合わせて前記複合材料を充填したのち前記第１成形体を重ね合わせる工程と、
(c) 前記基材の表面を被覆する被覆層の表面形状に略一致する下面を有する上型を用意し、前記上型を前記キャビティ内に挿入して、前記アルミニウムまたはアルミニウム合金の融点未満の温度で、前記上型および下型のうちの一方または両方を相手側の方向に押し込むことによって、前記第１成形体、第２成形体、および複合材料を圧縮成形して圧縮成形体を作製する工程と、
(d) 前記圧縮成形体を、前記アルミニウムまたはアルミニウム合金の融点未満の温度で焼成する工程と、
を含むことを特徴とする。
The heat spreader combining the materials can be manufactured by the manufacturing method of the present invention described below. That is, according to the present invention, the front surface, the back surface, and the outer circumferential surface of the substantially flat substrate made of a composite material containing aluminum or an aluminum alloy are all coated with a coating layer made of aluminum or an aluminum alloy and continuous with each other. A manufacturing method for manufacturing a heat spreader comprising:
(a) A thin plate made of aluminum or an aluminum alloy that is the basis of the coating layer is molded into a shape of a coating layer that covers the surface of the base material and a region continuous with the surface of the outer peripheral surface. A step of forming a molded body and forming a second molded body by molding the thin plate into a shape of a coating layer covering a region continuous with the back surface of the back surface of the base material and the outer peripheral surface;
(b) a lower mold having an upper surface substantially matching the surface shape of the coating layer covering the back surface of the substrate, and an inner peripheral surface substantially matching the surface shape of the coating layer covering the outer peripheral surface of the substrate. A die is prepared, the lower mold and the die are combined to form a cavity on the upper surface and the inner peripheral surface, the second molded body is fitted into the cavity and the composite material is filled, and then the first molding is performed. Superimposing the body,
(c) preparing an upper mold having a lower surface substantially matching the surface shape of the coating layer covering the surface of the substrate, inserting the upper mold into the cavity, and having a melting point lower than that of the aluminum or aluminum alloy By pressing one or both of the upper mold and the lower mold in the opposite direction at a temperature, the first molded body, the second molded body, and the composite material are compression molded to produce a compression molded body. Process,
(d) firing the compression-molded body at a temperature lower than the melting point of the aluminum or aluminum alloy;
It is characterized by including.
なお本発明では、前記基材の表面、裏面および外周面の全面が、被覆層によって完全に覆われていなくてもよい。例えば基材の表面や裏面のうち素子やセラミック基板等がはんだ接合される領域以外の領域や、あるいは外周面の一部等に、被覆層が形成されずに基材が露出した箇所が１つまたは２つ以上あってもよい。前記露出箇所は、何らかの目印として意図的に設けてもよいし、自然発生的なものであってもよい。前記露出箇所は、前記はんだ接合を阻害しない程度の、またはヒートスプレッダの製造時に金型や治具等を殆ど摩耗させない程度の大きさであるのが好ましい。特に１つの露出箇所の面積が１ｍｍ２以下程度であるのが好ましい。 In the present invention, the entire surface of the base material, the back surface and the outer peripheral surface may not be completely covered with the coating layer. For example, there is one location where the base material is exposed without forming a coating layer in a region other than the region where the element or ceramic substrate is solder-bonded on the front surface or the back surface of the base material, or a part of the outer peripheral surface. Or there may be two or more. The exposed portion may be intentionally provided as some mark or may be naturally generated. It is preferable that the exposed portion has a size that does not hinder the solder joint or that hardly wears a mold, a jig, or the like during manufacturing of the heat spreader. In particular, the area of one exposed portion is preferably about 1 mm 2 or less.
本発明によれば、複合材料等からなる略平板状の基材の表面、裏面、および面方向の外周面を被覆する、金属または合金からなる被覆層の厚みができるだけ均一で、かつ薄い上、前記被覆層の表面に、安定で均一なニッケルめっき膜を形成できるヒートスプレッダと、前記ヒートスプレッダの製造方法とを提供できる。 According to the present invention, the thickness of the coating layer made of a metal or an alloy that covers the front surface, the back surface, and the outer peripheral surface of the substantially flat substrate made of a composite material is as uniform and thin as possible. It is possible to provide a heat spreader capable of forming a stable and uniform nickel plating film on the surface of the coating layer, and a method for manufacturing the heat spreader.
図１は、本発明のヒートスプレッダの、実施の形態の一例を示す斜視図である。図２は、図１の例のヒートスプレッダの内部構造を示す拡大断面図である。両図を参照して、この例のヒートスプレッダ１は、基材２を備えている。基材２は、表面３および裏面４がともに平面である矩形平板状に形成されている。前記基材２の表面３、裏面４、および矩形の４辺を構成し前記両面３、４と直交する４つの側面（外周面）５は、いずれも金属または合金からなり互いに連続する被覆層６で被覆されている。 FIG. 1 is a perspective view showing an example of an embodiment of a heat spreader of the present invention. FIG. 2 is an enlarged cross-sectional view showing the internal structure of the heat spreader in the example of FIG. The heat spreader 1 of this example is provided with the base material 2 with reference to both figures. The base material 2 is formed in a rectangular flat plate shape in which the front surface 3 and the back surface 4 are both flat. The four side surfaces (outer peripheral surfaces) 5 constituting the front surface 3, the back surface 4, and the four sides of the rectangle 2 that are orthogonal to the both surfaces 3 and 4 are made of metal or alloy and are continuous with each other. It is covered with.
前記ヒートスプレッダ１は、
(A) 前記金属または合金からなる薄板により、前記基材２の表面３を被覆する被覆層７、および外周面５のうち前記表面３と連続する領域を被覆し、前記被覆層７と連続する被覆層８の形状に成形された第１成形体９と、
(B) 前記薄板により、前記基材２の裏面４を被覆する被覆層１０、および前記外周面５のうち前記裏面４と連続する領域を被覆し、前記被覆層１０と連続する被覆層１１の形状に成形された第２成形体１２との間に
基材のもとになる材料の粉末を充填して、前記金属または合金の融点未満の温度で圧縮成形および焼成することによって形成される。それによって図１、図２に示すヒートスプレッダが製造される。
The heat spreader 1
(A) The thin layer made of the metal or alloy covers the surface 3 of the substrate 2 and the outer peripheral surface 5 of the outer surface 5 and the region continuous with the surface 3, and is continuous with the coating layer 7. A first molded body 9 molded into the shape of the covering layer 8;
(B) The coating layer 10 that covers the back surface 4 of the base material 2 and the region that continues to the back surface 4 of the outer peripheral surface 5 are covered with the thin plate, and the coating layer 11 that is continuous with the coating layer 10 between the second molded body 12 which is molded into a shape
It is formed by filling a powder of a material to be a base material , compression molding and firing at a temperature lower than the melting point of the metal or alloy. Thereby, the heat spreader shown in FIGS. 1 and 2 is manufactured.
詳しくは、前記第１および第２成形体９、１２間に、基材２のもとになる材料の粉末を充填して、前記金属または合金の融点未満の温度で、形成する基材２の厚み方向に圧縮成形して基材２を形成したのち、さらに前記金属または合金の融点未満の温度で焼成して、前記両成形体９、１２を、外周面５の接合部１３において互いに接合するとともに基材２と接合することによって、前記基材２の表面３、裏面４および外周面５が互いに連続する被覆層６で被覆されたヒートスプレッダ１が製造される。 Specifically, prior SL between the first and second molded bodies 9 and 12, by filling a powder material composed under the substrate 2, at a temperature below the melting point of the metal or alloy, formed to the substrate 2 of After by compression molding in the thickness direction to form the substrate 2, and further fired at the metal or a temperature lower than the melting point of the alloy, the both molded bodies 9 and 12, together joined at the junction 13 of the outer peripheral surface 5 At the same time, the heat spreader 1 in which the front surface 3, the back surface 4 and the outer peripheral surface 5 of the base material 2 are coated with the continuous coating layer 6 is manufactured by bonding to the base material 2.
基材２の熱膨張係数は１５×１０−６／Ｋ以下であるのが好ましい。これによりＳｉ系、ＧａＡｓ系、ＩｎＰ系、ＳｉＣ系、ＧａＮ系等の各種の半導体材料からなる素子や、あるいはＡｌＮ、Ａｌ２Ｏ３、Ｓｉ３ＮＯ４等の各種の材料からなるセラミック基板等と、基材２との熱膨張係数の差を小さくできる。そのため素子の動作による発熱と、停止後の冷却とを繰り返した際に、前記熱膨張係数の違いに基づいて素子に過剰な応力が加わって前記素子自体が破損したり、あるいは素子とヒートスプレッダ１との間のはんだ接合が破壊されたりするのを抑制できる。 The thermal expansion coefficient of the substrate 2 is preferably 15 × 10 −6 / K or less. As a result, elements made of various semiconductor materials such as Si, GaAs, InP, SiC, and GaN, or ceramic substrates made of various materials such as AlN, Al 2 O 3 , Si 3 NO 4, etc. The difference in thermal expansion coefficient from the base material 2 can be reduced. Therefore, when the heat generation due to the operation of the element and the cooling after the stop are repeated, excessive stress is applied to the element based on the difference in the thermal expansion coefficient, or the element itself is damaged, or the element and the heat spreader 1 It is possible to prevent the solder joint between the two from being broken.
また基材２の熱膨張係数は、例えばアルミニウム−セラミック複合材料等からなる基材２の場合、前記範囲内でも２×１０−６／Ｋ以上であるのが好ましい。前記複合材料からなる基材２の熱膨張係数は、セラミックの含有割合を増減させることで調整できる。しかし熱膨張係数を２×１０−６／Ｋ未満とするためにはセラミックの含有割合を過剰に多くしなければならず、相対的に結合材としてのアルミニウム等の含有割合が少なくなりすぎて、実質的に前記複合構造を有する基材２を形成するのが容易でなくなるためである。また基材２を形成できたとしても強度が不足して、十分に実用に供しえなくなるおそれがあるためである。他の材料からなる基材２についても、それぞれの材料に固有の事情に応じて熱膨張係数の下限を設定すればよい。 The thermal expansion coefficient of the substrate 2 is preferably 2 × 10 −6 / K or more even in the above range in the case of the substrate 2 made of, for example, an aluminum-ceramic composite material. The thermal expansion coefficient of the base material 2 made of the composite material can be adjusted by increasing or decreasing the ceramic content ratio. However, in order to make the thermal expansion coefficient less than 2 × 10 −6 / K, the content ratio of the ceramic must be excessively increased, and the content ratio of aluminum or the like as the binder is relatively decreased, This is because it becomes difficult to form the base material 2 having the composite structure substantially. Moreover, even if the base material 2 can be formed, the strength is insufficient, and there is a possibility that the base material 2 may not be practically used. For the base material 2 made of other materials, the lower limit of the thermal expansion coefficient may be set according to the circumstances specific to each material.
基材２の熱伝導率は１５０Ｗ／ｍ・Ｋ以上であるのが好ましい。これにより、素子において発生した熱をできるだけ速やかに冷却部材に伝導して除去できるため、素子自体が過熱して誤動作したり破損したり、あるいは動作の効率が低下したりするのを防止できる。
前記条件を満足する基材２としては、例えば、
(1) アルミニウム−セラミック複合材料、
(2) 銅−セラミック複合材料、
(3) ケイ素−セラミック複合材料、および
(4) アルミニウム−ケイ素複合材料
からなる群より選ばれた少なくとも一種からなるものが挙げられる。
The thermal conductivity of the substrate 2 is preferably 150 W / m · K or more. As a result, heat generated in the element can be conducted and removed to the cooling member as quickly as possible, so that the element itself can be prevented from overheating and malfunctioning or being damaged, or the efficiency of operation being lowered.
As the base material 2 that satisfies the above conditions, for example,
(1) Aluminum-ceramic composite material,
(2) Copper-ceramic composite material,
(3) a silicon-ceramic composite material, and
(4) Aluminum - include those made of at least one selected from the group consisting of silicon composite materials <br/>.
このうち(1)のアルミニウム−セラミック複合材料からなる基材２としては、例えば下記のいずれかの形成方法によって形成したもの等が挙げられる。
(1-1) アルミニウムまたはアルミニウム合金の粉末とセラミック粉末との混合物を基材２の形状に圧縮成形したのち、例えば非酸化性雰囲気中で、前記アルミニウム等の融点未満の温度で焼成する。
Of these, the base material 2 made of the aluminum-ceramic composite material (1) includes, for example, those formed by any of the following forming methods.
(1-1) A mixture of aluminum or aluminum alloy powder and ceramic powder is compression-molded into the shape of the substrate 2 and then fired in a non-oxidizing atmosphere at a temperature lower than the melting point of aluminum or the like.
(1-2) 前記(1-1)で得た成形体を、再度アルミニウム等の融点未満の温度に加熱しながら圧縮成形して複合構造の緻密化を図る。
具体的には、前記のように(1-1)の混合物を第１および第２成形体９、１２の間に充填して、前記両成形体９、１２と共に圧縮成形したり、かかる圧縮成形によって得た圧縮成形体を(1-2)においてさらに圧縮成形したりすると、基材２が形成されるのと同時に両成形体９、１２が一体化された圧縮成形体が得られる。
(1-2) The compact obtained in (1-1) is compression-molded while being heated again to a temperature lower than the melting point of aluminum or the like, thereby densifying the composite structure .
Specifically, as described above , the mixture of (1-1) is filled between the first and second molded bodies 9, 12, and is compression-molded together with the both molded bodies 9, 12, or such compression molding is performed. When the compression molded body obtained by the above is further compression molded in (1-2), a compression molded body in which both molded bodies 9 and 12 are integrated at the same time as the base material 2 is formed is obtained.
前記(1-1)(1-2)の方法において用いるアルミニウムまたはアルミニウム合金の粉末としては、例えばアトマイズ法等によって作製した純アルミニウム粉末や、ケイ素（Ｓｉ）を１２質量％以下の割合で含有するアルミニウム−ケイ素合金の粉末等が挙げられる。また、日本工業規格ＪＩＳ Ｈ４０００：２００６「アルミニウム及びアルミニウム合金の板及び条」において規定された合金番号Ａ１０５０、Ａ１０７０、Ａ１１００等の純アルミニウム系の展延材、Ａ２０１４、Ａ３００４、Ａ５００５等のアルミニウム−マグネシウム合金系材料、あるいはＡＣ３Ａ、ＡＣ４Ａといった鋳造用アルミニウム系合金等の粉末も使用可能である。前記アルミニウム等の粉末は、平均粒径が３０μｍ以上、６０μｍ以下であるのが好ましい。これにより、基材２中でアルミニウム等とセラミックとをできるだけ細かくかつ均等に分布させて、両者の分布に偏りがない基材２を形成できる。 As the powder of aluminum or aluminum alloy used in the methods (1-1) and (1-2), for example, pure aluminum powder produced by an atomizing method or the like, or silicon (Si) is contained at a ratio of 12% by mass or less. Examples thereof include aluminum-silicon alloy powder. Also, pure aluminum-based wrought materials such as alloy numbers A1050, A1070, and A1100 defined in Japanese Industrial Standard JIS H4000: 2006 “Aluminum and Aluminum Alloy Plates and Strips”, and aluminum-magnesium such as A2014, A3004, and A5005 An alloy-based material or powder such as a casting aluminum-based alloy such as AC3A or AC4A can also be used. The powder of aluminum or the like preferably has an average particle size of 30 μm or more and 60 μm or less. Thereby, aluminum etc. and ceramic are distributed as finely and uniformly as possible in the base material 2, and the base material 2 with no bias in the distribution of both can be formed.
セラミック粉末としては、例えば炭化ケイ素（ＳｉＣ）、窒化ケイ素（Ｓｉ３Ｎ４）、酸化アルミニウム（Ａｌ２Ｏ３）等のセラミックからなる粉末が挙げられる。前記粒径範囲を有するアルミニウム等の粉末と組み合わせるセラミック粉末は、平均粒径が３０μｍ以上、６０μｍ以下であるのが好ましい。特に組み合わせるアルミニウム等の粉末と平均粒径が等しいのがさらに好ましい。これにより、アルミニウム等とセラミックとを基材２中でできるだけ細かくかつ均等に分布させて、両者の分布に偏りがない基材２を形成できる。 Examples of the ceramic powder include powder made of ceramic such as silicon carbide (SiC), silicon nitride (Si 3 N 4 ), aluminum oxide (Al 2 O 3 ). The ceramic powder combined with the powder of aluminum having the above particle size range preferably has an average particle size of 30 μm or more and 60 μm or less. In particular, it is more preferable that the average particle diameter is equal to the powder of aluminum or the like to be combined. Thereby, aluminum etc. and a ceramic can be distributed as finely and uniformly as possible in the base material 2, and the base material 2 without a bias | inclination can be formed in both distribution.
前記アルミニウムまたはアルミニウム合金の粉末とセラミック粉末との配合割合は任意に設定できる。先に説明したようにアルミニウム−セラミック複合材料からなる基材２の熱膨張係数は、セラミックの含有割合を増減させることで調整可能である。そのため前記基材２の熱膨張係数が１５×１０−６／Ｋ以下の任意の値となるように両粉末の配合割合を調整すればよい。 The mixing ratio of the aluminum or aluminum alloy powder and the ceramic powder can be arbitrarily set. As described above, the thermal expansion coefficient of the base material 2 made of an aluminum-ceramic composite material can be adjusted by increasing or decreasing the ceramic content ratio. Therefore, what is necessary is just to adjust the mixture ratio of both powder so that the thermal expansion coefficient of the said base material 2 may become arbitrary values of 15 * 10 < -6 > / K or less.
(2)の銅−セラミック複合材料からなる基材２としては、アルミニウムまたはアルミニウム合金に代えて銅または銅合金を用いること以外は前記(1)のアルミニウム−セラミック複合材料からなる基材２と同様にして、例えば下記の形成方法によって形成したもの等が挙げられる。 The base material 2 made of the copper-ceramic composite material (2) is the same as the base material 2 made of the aluminum-ceramic composite material (1) except that copper or copper alloy is used instead of aluminum or aluminum alloy. Examples thereof include those formed by the following forming method.
(2-1) 銅または銅合金の粉末とセラミック粉末との混合物を基材２の形状に圧縮成形したのち、例えば非酸化性雰囲気中で、前記銅等の融点未満の温度で焼成する。
(2-2) 前記(2-1)で得た基材２を、再度銅等の融点未満の温度に加熱しながら圧縮成形して複合構造の緻密化を図る。
(2-1) A mixture of a copper or copper alloy powder and a ceramic powder is compression-molded into the shape of the substrate 2 and then fired in a non-oxidizing atmosphere at a temperature lower than the melting point of the copper or the like.
(2-2) The base material 2 obtained in the above (2-1) is compression-molded while being heated again to a temperature lower than the melting point of copper or the like, thereby densifying the composite structure .
このうち(2-1)(2-2)の形成方法において用いる銅または銅合金の粉末としては、例えばアトマイズ法等によって作製された純銅粉末や、日本工業規格ＪＩＳ Ｈ３１００：２００６「銅及び銅合金の板並びに条」において規定された合金番号Ｃ１０２０「無酸素銅」、Ｃ１１００「タフピッチ銅」等の粉末が挙げられる。 Among these, as the powder of copper or copper alloy used in the forming method of (2-1) and (2-2), for example, pure copper powder produced by an atomizing method or the like, Japanese Industrial Standard JIS H3100: 2006 “copper and copper alloy And powders such as alloy numbers C1020 “oxygen-free copper” and C1100 “tough-pitch copper” defined in “Sheet and strips” .
(3)のケイ素−セラミック複合材料からなる基材２としても、アルミニウムまたはアルミニウム合金に代えてケイ素を用いること以外は前記(1)のアルミニウム−セラミック複合材料からなる基材２と同様にして形成したもの等が挙げられる。 The base material 2 made of the silicon-ceramic composite material (3) is formed in the same manner as the base material 2 made of the aluminum-ceramic composite material (1) except that silicon is used instead of aluminum or an aluminum alloy. And the like .
(4)のアルミニウム−ケイ素複合材料からなる基材２としては、例えばセラミック粉末に代えてケイ素粉末を用いること以外は前記(1)のアルミニウム−セラミック複合材料からなる基材２と同様にして形成したもの等が挙げられる。具体的には、(1-1)の混合物のうちセラミック粉末に代えてケイ素粉末を配合した混合物を第１および第２成形体９、１２の間に充填して、前記両成形体９、１２と共に圧縮成形したり、かかる圧縮成形によって得た圧縮成形体をさらに圧縮成形したりすると、基材２が形成されるのと同時に両成形体９、１２が一体化された圧縮成形体が得られる。 The base material 2 made of the aluminum-silicon composite material (4) is formed in the same manner as the base material 2 made of the aluminum-ceramic composite material (1) except that, for example, silicon powder is used instead of the ceramic powder. And the like. Specifically, a mixture in which silicon powder is blended in place of the ceramic powder in the mixture of (1-1) is filled between the first and second molded bodies 9 and 12, and both the molded bodies 9 and 12 are filled. When compression molding is performed together with the compression molding body obtained by such compression molding, the compression molding body in which both the molding bodies 9 and 12 are integrated at the same time as the base material 2 is formed is obtained. .
第１および第２成形体９、１２のもとになる金属または合金としては、先に説明したように安定で均一なニッケルめっき膜を形成する妨げとなる成分を含まない金属または合金が好ましい。また前記金属または合金には、前記両成形体９、１２のもとになる薄板の厚みをできるだけ均一に仕上げるための加工性や、前記薄板を成形して前記両成形体９、１２を形成する際の加工性等に優れる上、基材２と同等またはそれ以上の良好な熱伝導率を有することも求められる。中でも試験力４９．０３Ｎ（試験荷重５ｋｇｆ）でのビッカース硬さＨｖが２００以下の金属または合金、特にアルミニウム、アルミニウム合金、銅、または銅合金が好ましい。 As the metal or alloy used as the basis of the 1st and 2nd molded objects 9 and 12, the metal or alloy which does not contain the component which becomes obstructive in forming a stable and uniform nickel plating film as mentioned above is preferable. In addition, the metal or alloy is formed to form the two molded bodies 9 and 12 by forming the thin plates into a workability for finishing the thickness of the thin plates as a basis of the molded bodies 9 and 12 as uniform as possible. In addition to being excellent in workability at the time, it is also required to have good thermal conductivity equal to or higher than that of the substrate 2. Among them, a metal or an alloy having a Vickers hardness Hv of 200 or less at a test force of 49.03 N (test load of 5 kgf), particularly aluminum, an aluminum alloy, copper, or a copper alloy is preferable.
アルミニウムまたはアルミニウム合金の薄板としては、合金番号Ａ１０５０、Ａ１０７０、Ａ１１００等の純アルミニウム系の展延材や、ＡＣ３Ａ、ＡＣ４Ａ等の鋳造用合金を圧延した板材等が挙げられる。また銅または銅合金の薄板としては、先に説明したＪＩＳ Ｈ３１００：２００６において規定された合金番号Ｃ１０２０「無酸素銅」、Ｃ１１００「タフピッチ銅」等からなる板材等が挙げられる。 Examples of the aluminum or aluminum alloy thin plate include a pure aluminum-based spread material such as alloy numbers A1050, A1070, and A1100, and a plate material obtained by rolling a casting alloy such as AC3A and AC4A. Examples of the copper or copper alloy thin plate include a plate made of alloy number C1020 “oxygen-free copper”, C1100 “tough pitch copper” or the like defined in JIS H3100: 2006 described above.
第１および第２成形体９、１２は、互いに同じ金属または合金によって形成してもよいし、互いに異なる金属または合金によって形成してもよい。前記薄板の厚みは任意に設定できる。しかし前記両成形体９、１２によって形成される被覆層６の厚みをできるだけ小さくして、熱膨張係数の違いに基づいて素子に過剰な応力が加わって前記素子自体が破損したり、はんだ接合が破壊されたりするのを防止することや、ヒートスプレッダ１自体を極力小型化することを考慮すると、前記薄板の厚みは０．５ｍｍ以下であるのが好ましく、特に０．１ｍｍ以上、０．３ｍｍ以下であるのが好ましい。 The first and second molded bodies 9 and 12 may be formed of the same metal or alloy, or may be formed of different metals or alloys. The thickness of the thin plate can be arbitrarily set. However, the thickness of the covering layer 6 formed by both the molded bodies 9 and 12 is made as small as possible, and the element itself is damaged due to excessive stress applied to the element based on the difference in thermal expansion coefficient. In consideration of preventing breakage and miniaturization of the heat spreader 1 itself, the thickness of the thin plate is preferably 0.5 mm or less, particularly 0.1 mm or more and 0.3 mm or less. Preferably there is.
前記図１、図２の例のヒートスプレッダ１のうち、例えば基材２が(1)のアルミニウム−セラミック複合材料、または(4)のアルミニウム−ケイ素複合材料からなり、かつ被覆層６がアルミニウムまたはアルミニウム合金からなるものは、例えば下記の工程を経て製造できる。
すなわち、前記被覆層６のもとになる第１および第２成形体９、１２の間に、基材２のもとになる前記(1-1)(4)で説明した混合物を充填した後、前記基材２のもとになる複合材料中に含まれるアルミニウム等、および両成形体９、１２を形成するアルミニウム等の融点未満の温度で、形成する基材２の厚み方向に圧縮成形したのち、前記アルミニウム等の融点未満の温度で焼成する。
In the heat spreader 1 of the example of FIGS. 1 and 2, for example, the base 2 is made of an aluminum-ceramic composite material (1) or an aluminum-silicon composite material (4) , and the covering layer 6 is aluminum or aluminum. What consists of an alloy can be manufactured through the following process, for example.
That is, after the mixture described in the above (1-1) (4) serving as the base material 2 is filled between the first and second molded bodies 9 and 12 serving as the coating layer 6. Compressed and molded in the thickness direction of the base material 2 to be formed at a temperature lower than the melting point of aluminum or the like contained in the composite material that forms the base material 2 and aluminum forming both molded bodies 9 and 12. After that, firing is performed at a temperature lower than the melting point of the aluminum or the like.
前記ヒートスプレッダ１においては、前記両成形体９、１２のもとになる薄板の厚みの精度を向上することにより、接合部１３を除く被覆層６の厚みの誤差を±１０％以内、特に±５％以内とすることが可能である。
また前記方法では、例えば第１および第２成形体９、１２のうちの少なくとも一方の、基材２の表面３または裏面４を被覆する被覆層７、１０となる領域に凹凸形状を設けることによって、前記基材２の該当する領域に凹凸形状が形成され、前記凹凸形状を含む表面３、裏面４、および外周面５のほぼ全面が被覆層６で被覆されたヒートスプレッダ１を製造することもできる。
In the heat spreader 1, by improving the accuracy of the thickness of the thin plate on which the molded bodies 9 and 12 are based, the error in the thickness of the coating layer 6 excluding the joint portion 13 is within ± 10%, particularly ± 5. % Or less.
Moreover, in the said method, by providing uneven | corrugated shape in the area | region used as the coating layers 7 and 10 which coat | covers the surface 3 or the back surface 4 of the base material 2, for example of at least one of the 1st and 2nd molded objects 9 and 12. The heat spreader 1 can also be manufactured in which a concavo-convex shape is formed in a corresponding region of the base material 2 and almost the entire surface 3, back surface 4, and outer peripheral surface 5 including the concavo-convex shape are covered with the coating layer 6. .
図３は、本発明のヒートスプレッダの、実施の形態の他の例としての、前記凹凸形状を有するヒートスプレッダを示す断面図である。図３を参照して、この例のヒートスプレッダ１は、基材２を備えている。基材２は、表面３が平面で、かつ裏面４が前記凹凸形状を有する凹凸面とされている。
すなわち裏面４は、外周面５と連続する一定幅の環状の領域４ａが、表面３と平行な平面とされている。裏面４の中央には、領域４ａよりも表面３の方向に凹入させた位置に、前記表面３と平行な平面４ｂが設けられている。領域４ａの内側で、かつ平面４ｂの周囲には、前記平面４ｂよりも表面３の方向に凹入させて、前記表面３と平行な一定幅の環状の領域４ｃが設けられている。領域４ａと領域４ｃとの間は、前記両領域４ａ、４ｃと直交する段差面４ｄによって繋がれている。また領域４ｃと平面４ｂとの間は連続する傾斜面４ｅによって繋がれている。外周面５は、表面３、裏面４の外縁を構成し、前記両面３、４と直交している。
FIG. 3 is a cross-sectional view showing a heat spreader having the concavo-convex shape as another example of the embodiment of the heat spreader of the present invention. Referring to FIG. 3, the heat spreader 1 of this example includes a base material 2. The substrate 2 has a surface 3 with a flat surface and a back surface 4 with an uneven surface having the uneven shape.
That is, on the back surface 4, an annular region 4 a having a constant width continuous with the outer peripheral surface 5 is a plane parallel to the front surface 3. In the center of the back surface 4, a flat surface 4b parallel to the surface 3 is provided at a position recessed in the direction of the surface 3 from the region 4a. An annular region 4c having a constant width parallel to the surface 3 is provided inside the region 4a and around the flat surface 4b so as to be recessed in the direction of the surface 3 relative to the flat surface 4b. The region 4a and the region 4c are connected by a step surface 4d orthogonal to the regions 4a and 4c. The region 4c and the plane 4b are connected by a continuous inclined surface 4e. The outer peripheral surface 5 constitutes the outer edge of the front surface 3 and the back surface 4 and is orthogonal to the both surfaces 3 and 4.
前記ヒートスプレッダ１は、第２成形体１２として、基材２の裏面４を被覆する被覆層１０となる領域に図３に示す凹凸形状を設けたものを用いて、先に説明した工程を経ることによって製造できる。前記ヒートスプレッダ１においては、前記両成形体９、１２のもとになる薄板の厚みの精度を向上することにより、接合部１３と、段差面４ｄ、および傾斜面４ｅに対応する領域を除く被覆層６の厚みの誤差を±１０％以内、特に±５％以内とすることが可能である。言い換えれば、基材２の外周面５を被覆する被覆層８、１１のうち前記第１成形体９と第２成形体１２との接合部１３を除く領域と、前記基材２の表面３および裏面４を被覆する被覆層７、１０のうち前記基材２の面方向と平行な領域（被覆層７の全面、被覆層１０のうち領域４ａおよび平面４ｂに対応する領域）とで、その厚みの誤差を±１０％以内、特に±５％以内とすることができる。 The heat spreader 1 is subjected to the above-described steps by using the second molded body 12 having the uneven shape shown in FIG. 3 in the region to be the coating layer 10 that covers the back surface 4 of the substrate 2. Can be manufactured. In the heat spreader 1, by improving the accuracy of the thickness of the thin plate on which the molded bodies 9 and 12 are based, the coating layer excluding the region corresponding to the joint portion 13, the stepped surface 4d, and the inclined surface 4e. The thickness error of 6 can be within ± 10%, particularly within ± 5%. In other words, in the coating layers 8 and 11 covering the outer peripheral surface 5 of the substrate 2, the region excluding the joint portion 13 between the first molded body 9 and the second molded body 12, the surface 3 of the substrate 2, and Of the coating layers 7 and 10 covering the back surface 4, the region parallel to the surface direction of the substrate 2 (the entire surface of the coating layer 7, the region corresponding to the region 4 a and the plane 4 b of the coating layer 10), and its thickness Can be within ± 10%, in particular within ± 5%.
図４は、本発明のヒートスプレッダの、実施の形態のさらに他の例としての、前記凹凸形状を有するヒートスプレッダを示す断面図である。図４を参照して、この例のヒートスプレッダ１は、基材２を備えている。基材２は、表面３が平面で、かつ裏面４が前記凹凸形状を有する凹凸面とされている。
すなわち裏面４は、外周面５と連続する一定幅の環状の領域４ｆが、表面３と平行な平面とされている。裏面４の中央には、領域４ｆと同一平面となるように、表面３と平行な平面４ｇが設けられている。領域４ｆの内側には、前記領域４ｆよりも表面３の方向と反対方向に突出させて、前記表面３と平行な一定幅の環状の領域４ｈが設けられている。領域４ｈの内側で、かつ平面４ｇの周囲には、前記平面４ｇよりも表面３の方向に凹入させて、前記表面３と平行な一定幅の環状の領域４ｉが設けられている。領域４ｆと領域４ｈとの間、領域４ｈと領域４ｉとの間、および領域４ｉと平面４ｇとの間は、それぞれ連続する傾斜面４ｊ、４ｋ、４ｍによって繋がれている。外周面５は、表面３、裏面４の外縁を構成し、前記両面３、４と直交している。
FIG. 4 is a cross-sectional view showing a heat spreader having the concavo-convex shape as still another example of the embodiment of the heat spreader of the present invention. With reference to FIG. 4, the heat spreader 1 of this example includes a base material 2. The substrate 2 has a surface 3 with a flat surface and a back surface 4 with an uneven surface having the uneven shape.
That is, on the back surface 4, a constant width annular region 4 f continuous with the outer peripheral surface 5 is a plane parallel to the front surface 3. A flat surface 4g parallel to the front surface 3 is provided at the center of the back surface 4 so as to be flush with the region 4f. An annular region 4h having a constant width parallel to the surface 3 is provided inside the region 4f so as to protrude in a direction opposite to the direction of the surface 3 relative to the region 4f. An annular region 4i having a constant width parallel to the surface 3 is provided inside the region 4h and around the flat surface 4g so as to be recessed in the direction of the surface 3 with respect to the flat surface 4g. The region 4f and the region 4h, the region 4h and the region 4i, and the region 4i and the plane 4g are connected by continuous inclined surfaces 4j, 4k, and 4m, respectively. The outer peripheral surface 5 constitutes the outer edge of the front surface 3 and the back surface 4 and is orthogonal to the both surfaces 3 and 4.
前記ヒートスプレッダ１は、第２成形体１２として、基材２の裏面４を被覆する被覆層１０となる領域に図４に示す凹凸形状を設けたものを用いて、先に説明した工程を経ることによって製造できる。前記ヒートスプレッダ１においては、前記両成形体９、１２のもとになる薄板の厚みの精度を向上することにより、接合部１３と、傾斜面４ｊ、４ｋ、４ｍに対応する領域を除く被覆層６の厚みの誤差を±１０％以内、特に±５％以内とすることが可能である。言い換えれば、基材２の外周面５を被覆する被覆層８、１１のうち前記第１成形体９と第２成形体１２との接合部１３を除く領域と、前記基材２の表面３および裏面４を被覆する被覆層７、１０のうち前記基材２の面方向と平行な領域（被覆層７の全面、被覆層１０のうち領域４ｆ、４ｊ、４ｉおよび平面４ｇに対応する領域）とで、その厚みの誤差を±１０％以内、特に±５％以内とすることができる。 The heat spreader 1 is subjected to the above-described steps by using the second molded body 12 having an uneven shape as shown in FIG. 4 in a region to be the coating layer 10 that covers the back surface 4 of the substrate 2. Can be manufactured. In the heat spreader 1, by improving the accuracy of the thickness of the thin plate on which the molded bodies 9 and 12 are based, the coating layer 6 excluding the joint portion 13 and the region corresponding to the inclined surfaces 4j, 4k, and 4m. It is possible to make the thickness error within ± 10%, particularly within ± 5%. In other words, in the coating layers 8 and 11 covering the outer peripheral surface 5 of the substrate 2, the region excluding the joint portion 13 between the first molded body 9 and the second molded body 12, the surface 3 of the substrate 2, and Of the coating layers 7 and 10 covering the back surface 4, a region parallel to the surface direction of the substrate 2 (the entire surface of the coating layer 7, a region corresponding to the regions 4f, 4j, 4i and the plane 4g of the coating layer 10) Therefore, the thickness error can be within ± 10%, particularly within ± 5%.
図示していないが、第１成形体９の、基材２の表面３を被覆する被覆層７となる領域に凹凸形状を設ければ、基材２の表面３の該当する領域に凹凸形状が形成され、かつ前記凹凸形状を含む平板の表面３および裏面４のほぼ全面が被覆層６で被覆されたヒートスプレッダ１を製造できる。また両方の成形体９、１２の、被覆層７、１０となる領域にそれぞれ凹凸形状を設ければ、基材２の表面３および裏面４の該当する領域にそれぞれ凹凸形状が形成され、かつ前記凹凸形状を含む平板の表面３および裏面４のほぼ全面が被覆層６で被覆されたヒートスプレッダ１を製造できる。 Although not shown in the drawing, if an uneven shape is provided in the region of the first molded body 9 that becomes the coating layer 7 that covers the surface 3 of the substrate 2, the uneven shape is formed in the corresponding region of the surface 3 of the substrate 2. The heat spreader 1 which is formed and in which almost the entire surface 3 and back surface 4 of the flat plate including the uneven shape is covered with the coating layer 6 can be manufactured. Moreover, if uneven | corrugated shape is each provided in the area | region used as the coating layers 7 and 10 of both the molded objects 9 and 12, an uneven | corrugated shape is each formed in the applicable area | region of the surface 3 and the back surface 4 of the base material 2, and the said The heat spreader 1 in which almost the entire surface 3 and the back surface 4 of the flat plate including the uneven shape is coated with the coating layer 6 can be manufactured.
いずれの場合も、両成形体９、１２のもとになる薄板の厚みの精度を向上することにより、基材２の外周面５を被覆する被覆層８、１１のうち前記第１成形体９と第２成形体１２との接合部１３を除く領域と、前記基材２の表面３および裏面４を被覆する被覆層７、１０のうち前記基材２の面方向と平行な領域とで、その厚みの誤差を±１０％以内、特に±５％以内とすることができる。 In any case, the first molded body 9 of the covering layers 8 and 11 covering the outer peripheral surface 5 of the base material 2 is improved by improving the accuracy of the thickness of the thin plate on which the molded bodies 9 and 12 are based. And a region excluding the joint portion 13 between the second molded body 12 and a region parallel to the surface direction of the substrate 2 in the coating layers 7 and 10 covering the front surface 3 and the back surface 4 of the substrate 2, The thickness error can be within ± 10%, particularly within ± 5%.
図５ないし図９は、基材２が(1)のアルミニウム−セラミック複合材料、または(4)のアルミニウム−ケイ素複合材料からなり、かつ被覆層６がアルミニウムまたはアルミニウム合金からなる矩形平板状のヒートスプレッダ１（図１、図２のもの）を、本発明の製造方法によって製造する各工程を示す断面図である。
これらの図を参照して、この例の製造方法では、まず前記アルミニウム等からなる薄板をあらかじめ成形して第１成形体９と第２成形体１２とを用意する。また基材２の裏面４を被覆する被覆層１０の表面形状に一致する上面１４を有する下型（下杵）１５と、前記基材２の表面３を被覆する被覆層７の表面形状に一致する下面１６を有する上型（上杵）１７と、前記基材２の外周面５を被覆する被覆層８、１１の表面形状に一致する内周面１８を有するダイ（臼）１９とを用意する。なお図では下型１５をダイ１９に挿入可能な形状としているが、前記下型としてダイ１９の下側の開口を塞ぐアンビルを用いて、構造を簡略化してもよい。
5 to 9 show a rectangular flat plate-shaped heat spreader in which the substrate 2 is made of the aluminum-ceramic composite material (1) or the aluminum-silicon composite material (4) and the covering layer 6 is made of aluminum or an aluminum alloy. It is sectional drawing which shows each process which manufactures 1 (the thing of FIG. 1, FIG. 2) by the manufacturing method of this invention.
With reference to these drawings, in the manufacturing method of this example, first, a thin plate made of aluminum or the like is previously formed to prepare a first formed body 9 and a second formed body 12. In addition, the lower die (lower arm) 15 having an upper surface 14 that matches the surface shape of the coating layer 10 that covers the back surface 4 of the substrate 2 and the surface shape of the coating layer 7 that covers the surface 3 of the substrate 2 are matched. An upper die 17 having a lower surface 16 and a die 19 having an inner peripheral surface 18 that matches the surface shape of the coating layers 8 and 11 covering the outer peripheral surface 5 of the substrate 2 are prepared. To do. In the drawing, the lower die 15 is shaped to be inserted into the die 19, but the structure may be simplified by using an anvil that closes the lower opening of the die 19 as the lower die.
次に前記下型１５とダイ１９とを組み合わせてキャビティ２０を形成し、前記キャビティ２０内に第２成形体１２を嵌め合わせて、基材２のもとになる複合材料、すなわちアルミニウム等の粉末と、セラミック、ケイ素等の粉末との混合物２１を充填する（図５、図６）。混合物の充填量は、前記混合物２１を構成するセラミックまたはケイ素の粉末の密度や粒径、アルミニウム等の粉末の粒径、前記両成分の配合割合、形成する基材２の密度等に応じて任意に設定できる。 Next, the lower mold 15 and the die 19 are combined to form a cavity 20, and the second molded body 12 is fitted into the cavity 20, and a composite material that becomes the base material 2, that is, a powder of aluminum or the like. And a mixture 21 of ceramic and silicon powder (FIGS. 5 and 6). The filling amount of the mixture is arbitrary depending on the density or particle size of the ceramic or silicon powder constituting the mixture 21, the particle size of the powder such as aluminum, the blending ratio of the two components, the density of the substrate 2 to be formed, etc. Can be set.
次に、充填した混合物２１の上に第１成形体９を重ね合わせた後、上型１７をキャビティ２０内に挿入して図８、９中に黒矢印で示すように前記上型１７を、製造するヒートスプレッダ１の厚みになるまで下型１５の方向に押し込んで圧縮成形体２２を得る（図７ないし図９）。圧縮成形は、第１および第２成形体９、１２を溶融させないため、アルミニウム等の融点未満の温度で行なう必要があり、特に積極的に加熱をしない常温環境下で行なうのが好ましい。 Next, after superposing the first molded body 9 on the filled mixture 21, the upper mold 17 is inserted into the cavity 20, and the upper mold 17 is moved as shown by the black arrows in FIGS. A compression molded body 22 is obtained by pushing in the direction of the lower mold 15 until the thickness of the heat spreader 1 to be manufactured is reached (FIGS. 7 to 9). The compression molding does not melt the first and second molded bodies 9 and 12, and therefore must be performed at a temperature lower than the melting point of aluminum or the like, and is preferably performed in a room temperature environment in which no positive heating is performed.
圧縮成形時の圧力は９８ＭＰａ以上、６８６ＭＰａ以下に設定するのが好ましい。圧力が９８ＭＰａ未満では、圧縮成形体２２の強度が不足して、特に焼成のためにダイ１９から取り出す際や取り出した後の焼成工程等において型崩れしやすくなるおそれがある。また、圧力が６８６ＭＰａを超えても圧縮成形体２２の強度をそれ以上高める効果は得られない上、前記高圧の圧縮成形を行うために下型１５、上型１７およびダイ１９等の装置が大掛かりになりすぎるという問題もある。 The pressure at the time of compression molding is preferably set to 98 MPa or more and 686 MPa or less. When the pressure is less than 98 MPa, the strength of the compression-molded body 22 is insufficient, and there is a possibility that the mold may be easily lost in the firing process after taking out from the die 19 for firing or the like. Further, even if the pressure exceeds 686 MPa, the effect of further increasing the strength of the compression molded body 22 is not obtained, and in addition, a large apparatus such as the lower mold 15, the upper mold 17 and the die 19 is required to perform the high pressure compression molding. There is also the problem of becoming too much.
次に前記圧縮成形体２２を、アルミニウム等の融点未満の温度で焼成すると、圧縮成形体２２のうち混合物２１が焼結されて基材２が形成される。それと共に前記第１および第２成形体９、１２が基材２の外周面５の接合部１３において互いに接合され、かつ前記両成形体９、１２が基材２と接合されることで、前記基材２の表面３、裏面４および面方向の外周面５を被覆する連続した被覆層６が形成されて図１、図２に示す平板状のヒートスプレッダ１が製造される。 Next, when the compression molded body 22 is fired at a temperature lower than the melting point of aluminum or the like, the mixture 21 in the compression molded body 22 is sintered to form the base material 2. At the same time, the first and second molded bodies 9 and 12 are joined to each other at the joint portion 13 of the outer peripheral surface 5 of the base material 2, and both the molded bodies 9 and 12 are joined to the base material 2. A continuous coating layer 6 that covers the front surface 3, the back surface 4, and the outer peripheral surface 5 in the surface direction of the substrate 2 is formed, and the flat plate-shaped heat spreader 1 shown in FIGS. 1 and 2 is manufactured.
圧縮成形体２２は、いわゆるホットプレス成形法により、図９の圧縮状態を維持しながら下型１５、上型１７およびダイ１９ごと図示しない加熱手段によって加熱して焼成してもよい。しかし前記下型１５、上型１７およびダイ１９は、先に説明したように圧縮成形時におよそ９８ＭＰａ以上という過大な圧力が加えられるため大掛かりであり、必然的に熱容量も大きい。そのためホットプレス成形法を採用した場合には、前記圧縮成形体２２を、前記下型１５、上型１７およびダイ１９ごと、焼成に要する時間（通常は０．５時間以上）の間、加熱し続けなければならないので、１つのヒートスプレッダ１を製造するのに要するエネルギーおよび時間が増大する。 The compression molded body 22 may be fired by heating means (not shown) together with the lower mold 15, the upper mold 17 and the die 19 while maintaining the compressed state of FIG. 9 by a so-called hot press molding method. However, the lower mold 15, the upper mold 17 and the die 19 are large because excessive pressure of about 98 MPa or more is applied during compression molding as described above, and the heat capacity is inevitably large. Therefore, when the hot press molding method is adopted, the compression molded body 22 is heated together with the lower mold 15, the upper mold 17 and the die 19 for a time required for firing (usually 0.5 hours or more). Since it must continue, the energy and time required to manufacture one heat spreader 1 is increased.
そのため本発明では、圧縮成形によって得た圧縮成形体２２を、図示していないがダイ１９から取り出した後にそのままの状態で、あるいは型崩れを防止するための簡単な（熱容量の小さい）型枠に嵌め込む等した状態で焼成するのが好ましい。これにより焼成に要するエネルギーと時間とを削減でき、ヒートスプレッダ１の生産性を向上できる。
焼成の温度は、アルミニウムまたはアルミニウム合金の融点未満であればよい。しかし基材２を形成するセラミック等の粉末とアルミニウム等の粉末とができるだけ良好に結合され、かつアルミニウム等からなる被覆層６が、前記基材２とできるだけ強固に一体化されたヒートスプレッダ１を、できるだけ効率よく製造するためには、焼成の温度は５５０℃以上、６５０℃以下であるのが好ましい。また同様の理由で、焼成の時間は０．５時間以上、２時間以下であるのが好ましい。
Therefore, in the present invention, the compression-molded body 22 obtained by compression molding is not shown in the drawing, but is used as it is after being taken out from the die 19 or in a simple (small heat capacity) mold frame for preventing the deformation of the mold. It is preferable to fire in a state of being fitted. Thereby, the energy and time required for firing can be reduced, and the productivity of the heat spreader 1 can be improved.
The firing temperature may be lower than the melting point of aluminum or aluminum alloy. However, a heat spreader 1 in which a powder such as ceramic and a powder such as aluminum forming the base 2 are bonded as well as possible and a coating layer 6 made of aluminum or the like is integrated with the base 2 as firmly as possible, In order to produce as efficiently as possible, the firing temperature is preferably 550 ° C. or higher and 650 ° C. or lower. For the same reason, the firing time is preferably 0.5 hours or more and 2 hours or less.
前記各工程を経て製造したヒートスプレッダ１は、先に(1-2)において説明したように、さらに加熱下で加圧（プレス）処理してもよい。具体的には、図９に示すように焼成後のヒートスプレッダ１を再びキャビティ２０内にセットし、下型１５と上型１７とで挟んで所定の温度に加熱しながら、前記上型１７を下型１５の方向に押し込んで加圧する。そうすると、焼成時に発生する変形（歪み等）や被覆層７、１０の凹凸等を矯正し、かつ基材２を高密度化して熱伝導率を向上させることができる。 As described in (1-2) above, the heat spreader 1 manufactured through the above-described steps may be further pressurized (pressed) under heating. Specifically, as shown in FIG. 9, the fired heat spreader 1 is set in the cavity 20 again, and is sandwiched between the lower mold 15 and the upper mold 17 and heated to a predetermined temperature. Press in the direction of the mold 15 to apply pressure. If it does so, the deformation | transformation (distortion etc.) which generate | occur | produces at the time of baking, the unevenness | corrugation of the coating layers 7 and 10 etc. can be corrected, and the base material 2 can be densified and thermal conductivity can be improved.
前記加圧工程においては、前記変形や凹凸等をできるだけ良好に矯正して熱伝導率を向上することを考慮すると、加熱の温度（金型温度）は３００℃以上、６５０℃以下、加圧の圧力は２４５ＭＰａ以上、４９０ＭＰａ以下、加圧の時間は０．１秒以上、５秒以下であるのが好ましい。なおヒートスプレッダ１の変形や凹凸等を矯正すると共に基材２を高密度化するためには、前記加圧処理に代えて、例えば６２０℃程度での熱間鍛造等を採用しても良い。 In the pressurizing step, in consideration of improving the thermal conductivity by correcting the deformation and the unevenness as well as possible, the heating temperature (mold temperature) is 300 ° C. or higher, 650 ° C. or lower, The pressure is preferably 245 MPa or more and 490 MPa or less, and the pressurization time is preferably 0.1 second or more and 5 seconds or less. In addition, in order to correct the deformation and unevenness of the heat spreader 1 and to increase the density of the base material 2, for example, hot forging at about 620 ° C. or the like may be employed instead of the pressure treatment.
例えば図３、図４に示すように基材２の裏面４側に凹凸形状が形成されたヒートスプレッダ１を、前記本発明の製造方法によって製造したり、必要に応じて加圧処理したりするためには、前記下型１５として、上面１４の、第２成形体１２の被覆層１０に対応する領域に、前記凹凸形状と一致する凹凸形状が形成されたものを用いればよい。前記凹凸形状に第２成形体１２の凹凸形状を嵌め合わせた状態で前記各工程を実施すれば、図３、図４に示すように基材２の裏面４側に凹凸形状が形成されたヒートスプレッダ１を製造できる。 For example, as shown in FIG. 3 and FIG. 4, the heat spreader 1 having a concavo-convex shape formed on the back surface 4 side of the substrate 2 is manufactured by the manufacturing method of the present invention, or is subjected to pressure treatment as necessary. For the lower mold 15, it is only necessary to use a lower surface 15 having a concavo-convex shape that matches the concavo-convex shape in a region corresponding to the coating layer 10 of the second molded body 12. When each step is performed in a state where the uneven shape of the second molded body 12 is fitted to the uneven shape, a heat spreader in which the uneven shape is formed on the back surface 4 side of the substrate 2 as shown in FIGS. 1 can be manufactured.
基材２の表面３側に凹凸形状が形成される場合、両面３、４に凹凸形状が形成される場合も同様である。基材の表面３側に凹凸形状が形成される場合は、上型１７として、その下面１６に対応する凹凸形状が形成されたものを用いればよく、両面３、４に凹凸形状が形成される場合は、下型１５および上型１７として、それぞれの上面１４および下面１６に、対応する凹凸形状が形成されたものを用いればよい。 The same applies to the case where an uneven shape is formed on the surface 3 side of the substrate 2 and the case where the uneven shape is formed on both surfaces 3 and 4. In the case where a concavo-convex shape is formed on the surface 3 side of the substrate, the upper mold 17 may be formed with a concavo-convex shape corresponding to the lower surface 16, and the concavo-convex shape is formed on both surfaces 3, 4. In this case, the lower mold 15 and the upper mold 17 may be those having corresponding upper and lower surfaces 14 and 16 formed with corresponding uneven shapes.
本発明の構成は、以上で説明した図の例のものには限定されず、本発明の要旨を逸脱しない範囲で、種々の設計変更を施すことができる。 The configuration of the present invention is not limited to the example of the drawings described above, and various design changes can be made without departing from the gist of the present invention.
〈実施例１〉
図１、図２に示す矩形平板状で横２５ｍｍ、縦２５ｍｍ、厚み２．０ｍｍのヒートスプレッダ１を、図５ないし図９の製造方法によって製造することとして、下記の各種材料と、下型１５、上型１７、ダイ１９等とを用意した。
（基材２のもとになる混合物２１）
セラミックの粒子としての炭化ケイ素の粒子（平均粒径５０μｍ）７０質量部と、アルミニウムの粉末（平均粒径５０μｍ）３０質量部とを配合して調製した。
<Example 1>
The heat spreader 1 having a rectangular flat plate shape shown in FIGS. 1 and 2 having a width of 25 mm, a length of 25 mm, and a thickness of 2.0 mm is manufactured by the manufacturing method of FIGS. An upper mold 17 and a die 19 were prepared.
(Mixture 21 which becomes the base material 2)
It was prepared by blending 70 parts by mass of silicon carbide particles (average particle size 50 μm) as ceramic particles and 30 parts by mass of aluminum powder (average particle size 50 μm).
（第１成形体９）
純アルミニウム系の展延材（合金番号Ａ１０５０）からなる厚み０．３ｍｍの薄板を成形して、基材２の表面３を被覆する矩形平板状の被覆層７と、前記被覆層７の矩形の４辺を構成し前記表面３と交差する４つの外周面５を被覆する被覆層８の形状に一体に形成された第１成形体９を作製した。前記第１成形体９の被覆層７の外周寸法は、製造するヒートスプレッダ１の縦横寸法と一致する横２５ｍｍ、縦２５ｍｍとした。また被覆層８の、被覆層７の面方向と直交する高さ方向の寸法は１．５ｍｍとした。
(First molded body 9)
A thin plate having a thickness of 0.3 mm made of a pure aluminum-based spreading material (alloy number A1050) is formed to form a rectangular flat plate-like covering layer 7 that covers the surface 3 of the substrate 2, and a rectangular shape of the covering layer 7. A first molded body 9 that was integrally formed in the shape of a covering layer 8 that formed four sides and covered four outer peripheral surfaces 5 that intersected the surface 3 was produced. The outer peripheral dimensions of the coating layer 7 of the first molded body 9 were 25 mm in width and 25 mm in length, which coincided with the vertical and horizontal dimensions of the heat spreader 1 to be manufactured. Moreover, the dimension of the height direction of the coating layer 8 orthogonal to the surface direction of the coating layer 7 was 1.5 mm.
（第２成形体１２）
純アルミニウム系の展延材（合金番号Ａ１０５０）からなる厚み０．３ｍｍの薄板を成形して、基材２の裏面４を被覆する矩形平板状の被覆層１０と、前記被覆層１０の矩形の４辺を構成し前記裏面４と交差する４つの外周面５を被覆する被覆層１１の形状に一体に形成された第２成形体１２を作製した。前記第２成形体１２の被覆層１０の外周寸法は、製造するヒートスプレッダ１の縦横寸法と一致する横２５ｍｍ、縦２５ｍｍとした。また被覆層１１の、被覆層１０の面方向と直交する高さ方向の寸法は１．５ｍｍとした。
(Second molded body 12)
A thin plate having a thickness of 0.3 mm made of a pure aluminum-based spreading material (alloy number A1050) is formed, and a rectangular flat coating layer 10 that covers the back surface 4 of the substrate 2, and a rectangular shape of the coating layer 10. A second molded body 12 formed integrally with the shape of the coating layer 11 that covers the four outer peripheral surfaces 5 that configure the four sides and intersect the back surface 4 was produced. The outer peripheral dimensions of the coating layer 10 of the second molded body 12 were 25 mm in width and 25 mm in length, which coincided with the vertical and horizontal dimensions of the heat spreader 1 to be manufactured. Moreover, the dimension of the height direction orthogonal to the surface direction of the coating layer 10 of the coating layer 11 was 1.5 mm.
（下型１５）
製造するヒートスプレッダ１の裏面４の平面形状と一致する矩形平面状とされた上面１４を備えたステンレス鋼製の下型１５を用意した。
（上型１７）
製造するヒートスプレッダ１の表面３の平面形状と一致する矩形平面状とされた下面１６を備えたステンレス鋼製の上型１７を用意した。
(Lower mold 15)
A lower mold 15 made of stainless steel having an upper surface 14 having a rectangular planar shape that matches the planar shape of the back surface 4 of the heat spreader 1 to be manufactured was prepared.
(Upper mold 17)
A stainless steel upper die 17 having a lower surface 16 having a rectangular planar shape matching the planar shape of the surface 3 of the heat spreader 1 to be manufactured was prepared.
（ダイ１９）
製造するヒートスプレッダ１の外周面５と一致する４面が矩形状に配置された内周面１８を備えたステンレス鋼製のダイ１９を用意した。
（ヒートスプレッダ１の製造）
下型１５とダイ１９とを組み合わせてキャビティ２０を形成し、前記キャビティ２０内に第２成形体１２を嵌め合わせて、基材２のもとになる混合物２１を充填した。次に、充填した混合物２１の上に第１成形体９を重ね合わせた後、上型１７をキャビティ２０内に挿入し、前記上型１７を、常温環境下で製造するヒートスプレッダ１の厚み（＝２．０ｍｍ）になるまで、圧力５０ＭＰａで下型１５の方向に押し込んで圧縮成形体２２を得た後、前記圧縮成形体２２をダイ１９から取り出し、６５０℃で２時間焼成してヒートスプレッダ１を製造した。
(Die 19)
A stainless steel die 19 having an inner peripheral surface 18 in which four surfaces that coincide with the outer peripheral surface 5 of the heat spreader 1 to be manufactured were arranged in a rectangular shape was prepared.
(Manufacture of heat spreader 1)
The lower mold 15 and the die 19 were combined to form a cavity 20, and the second molded body 12 was fitted into the cavity 20, and the mixture 21 serving as the base material 2 was filled. Next, after superposing the first molded body 9 on the filled mixture 21, the upper mold 17 is inserted into the cavity 20, and the thickness of the heat spreader 1 for manufacturing the upper mold 17 in a room temperature environment (= 2.0 mm) to obtain the compression molded body 22 by pressing in the direction of the lower mold 15 at a pressure of 50 MPa, and then the compression molded body 22 is taken out from the die 19 and fired at 650 ° C. for 2 hours to obtain the heat spreader 1. Manufactured.
（切断面の観察）
前記ヒートスプレッダ１を固定用の樹脂中に埋め込んで前記樹脂ごと厚み方向に切断し、その切断面の光学顕微鏡写真（図１０）を撮影して、基材２の表面３、裏面４および外周面５に形成された被覆層６の状態を観察した。また図１１に示すように、前記図１０の光学顕微鏡写真中の、(1)〜(10)の１０箇所での被覆層６の厚みを測定したところ、前記被覆層６は、下記表１に示すように前記１０箇所での厚みがいずれも約０．３ｍｍで、その全周に亘って厚みがほぼ均一であることが判った。
(Observation of cut surface)
The heat spreader 1 is embedded in a fixing resin, and the entire resin is cut in the thickness direction. An optical micrograph (FIG. 10) of the cut surface is taken, and the front surface 3, the back surface 4 and the outer peripheral surface 5 of the substrate 2 are taken. The state of the coating layer 6 formed on was observed. Moreover, as shown in FIG. 11, when the thickness of the coating layer 6 in ten places of (1)-(10) in the optical micrograph of the said FIG. 10 was measured, the said coating layer 6 is shown in following Table 1. As shown, the thicknesses at the 10 locations were all about 0.3 mm, and the thickness was found to be substantially uniform over the entire circumference.
（熱膨張係数の測定）
前記ヒートスプレッダ１の、面方向の熱膨張係数を、示差熱膨張計を用いて測定したところ１２×１０−６／Ｋであった。
（熱伝導率の測定）
前記ヒートスプレッダ１の、厚み方向の熱伝導率を、レーザーフラッシュ法によって測定したところ１８２Ｗ／ｍ・Ｋであった。
(Measurement of thermal expansion coefficient)
It was 12 * 10 < -6 > / K when the thermal expansion coefficient of the surface direction of the said heat spreader 1 was measured using the differential thermal dilatometer.
(Measurement of thermal conductivity)
It was 182 W / m * K when the heat conductivity of the thickness direction of the said heat spreader 1 was measured by the laser flash method.
〈実施例２〉
矩形平板状で、その下面側に図３に示す凹凸形状が形成された、横４２．５ｍｍ、縦４２．５ｍｍ、最大厚み３．０ｍｍ、最小厚み１．８ｍｍのヒートスプレッダ１を、図５ないし図９の製造方法によって製造することとして、実施例１で調整したのと同じ混合物２１と、下記の各種材料と、下型１５、上型１７、ダイ１９等とを用意した。
<Example 2>
A heat spreader 1 having a rectangular flat plate shape with the concave-convex shape shown in FIG. 3 formed on its lower surface side and having a width of 42.5 mm, a height of 42.5 mm, a maximum thickness of 3.0 mm, and a minimum thickness of 1.8 mm is shown in FIGS. As the manufacturing method No. 9, the same mixture 21 prepared in Example 1, the following various materials, the lower mold 15, the upper mold 17, the die 19 and the like were prepared.
（第１成形体９）
純アルミニウム系の展延材（合金番号Ａ１０５０）からなる厚み０．３ｍｍの薄板を成形して、基材２の表面３を被覆する矩形平板状の被覆層７と、前記被覆層７の矩形の４辺を構成し前記表面３と交差する４つの外周面５を被覆する被覆層８の形状に一体に形成された第１成形体９を作製した。前記第１成形体９の被覆層７の外周寸法は、製造するヒートスプレッダ１の縦横寸法と一致する横４２．５ｍｍ、縦４２．５ｍｍとした。また被覆層８の、被覆層７の面方向と直交する高さ方向の寸法は１．５ｍｍとした。
(First molded body 9)
A thin plate having a thickness of 0.3 mm made of a pure aluminum-based spreading material (alloy number A1050) is formed to form a rectangular flat plate-like covering layer 7 that covers the surface 3 of the substrate 2, and a rectangular shape of the covering layer 7. A first molded body 9 that was integrally formed in the shape of a covering layer 8 that formed four sides and covered four outer peripheral surfaces 5 that intersected the surface 3 was produced. The outer peripheral dimensions of the covering layer 7 of the first molded body 9 were 42.5 mm in width and 42.5 mm in length, which coincided with the vertical and horizontal dimensions of the heat spreader 1 to be manufactured. Moreover, the dimension of the height direction of the coating layer 8 orthogonal to the surface direction of the coating layer 7 was 1.5 mm.
（第２成形体１２）
純アルミニウム系の展延材（合金番号Ａ１０５０）からなる厚み０．３ｍｍの薄板を成形して、基材２の裏面４を被覆する、図３の立体形状を有する平面形状が矩形の被覆層１０と、前記被覆層１０の矩形の４辺を構成し前記裏面４と交差する４つの外周面５を被覆する被覆層１１の形状に一体に形成された第２成形体１２を作製した。前記第２成形体１２の被覆層１０の外周寸法は、製造するヒートスプレッダ１の縦横寸法と一致する横４２．５ｍｍ、縦４２．５ｍｍとした。また被覆層１１の、被覆層１０の面方向と直交する高さ方向の寸法は３．０ｍｍとした。
(Second molded body 12)
A coating layer 10 having a rectangular shape in plan view having the three-dimensional shape shown in FIG. 3 is formed by forming a 0.3 mm thick thin plate made of a pure aluminum-based spreading material (alloy number A1050). Then, the second molded body 12 formed integrally with the shape of the coating layer 11 that covers the four outer peripheral surfaces 5 constituting the four rectangular sides of the coating layer 10 and intersecting the back surface 4 was produced. The outer peripheral dimensions of the coating layer 10 of the second molded body 12 were 42.5 mm in width and 42.5 mm in length, which coincided with the vertical and horizontal dimensions of the heat spreader 1 to be manufactured. Moreover, the dimension of the height direction orthogonal to the surface direction of the coating layer 10 of the coating layer 11 was 3.0 mm.
（下型１５）
製造するヒートスプレッダ１の裏面４の形状と一致する立体形状を有する矩形状とされた上面１４を備えたステンレス鋼製の下型１５を用意した。
（上型１７）
製造するヒートスプレッダ１の表面３の平面形状と一致する矩形平面状とされた下面１６を備えたステンレス鋼製の上型１７を用意した。
(Lower mold 15)
A stainless steel lower mold 15 provided with a rectangular upper surface 14 having a three-dimensional shape that matches the shape of the back surface 4 of the heat spreader 1 to be manufactured was prepared.
(Upper mold 17)
A stainless steel upper die 17 having a lower surface 16 having a rectangular planar shape matching the planar shape of the surface 3 of the heat spreader 1 to be manufactured was prepared.
（ダイ１９）
製造するヒートスプレッダ１の外周面５と一致する４面が矩形状に配置された内周面１８を備えたステンレス鋼製のダイ１９を用意した。
（ヒートスプレッダ１の製造）
下型１５とダイ１９とを組み合わせてキャビティ２０を形成し、前記キャビティ２０内に第２成形体１２を嵌め合わせて、基材２のもとになる混合物２１を充填した。次に、充填した混合物２１の上に第１成形体９を重ね合わせた後、上型１７をキャビティ２０内に挿入し、前記上型１７を、常温環境下で製造するヒートスプレッダ１の厚み（最大厚み＝３．０ｍｍ、最小厚み＝１．８ｍｍ）になるまで、圧力５０ＭＰａで下型１５の方向に押し込んで圧縮成形体２２を得た後、前記圧縮成形体２２をダイ１９から取り出し、６５０℃で２時間焼成してヒートスプレッダ１を製造した。
(Die 19)
A stainless steel die 19 having an inner peripheral surface 18 in which four surfaces that coincide with the outer peripheral surface 5 of the heat spreader 1 to be manufactured were arranged in a rectangular shape was prepared.
(Manufacture of heat spreader 1)
The lower mold 15 and the die 19 were combined to form a cavity 20, and the second molded body 12 was fitted into the cavity 20, and the mixture 21 serving as the base material 2 was filled. Next, after superposing the first molded body 9 on the filled mixture 21, the upper mold 17 is inserted into the cavity 20, and the thickness (maximum) of the heat spreader 1 for manufacturing the upper mold 17 in a room temperature environment. The compression molded body 22 was obtained by pressing in the direction of the lower mold 15 at a pressure of 50 MPa until the thickness = 3.0 mm and the minimum thickness = 1.8 mm), and then the compression molded body 22 was taken out from the die 19 and 650 ° C. The heat spreader 1 was manufactured by baking for 2 hours.
（切断面の観察）
前記ヒートスプレッダ１について、実施例１と同様に厚み方向に切断し、その切断面の光学顕微鏡写真を撮影して、基材２の表面３、裏面４および外周面５に形成された被覆層６の状態を観察すると共に、被覆層６の厚みを測定したところ、前記被覆層６は、その全周に亘って厚みがほぼ均一であることが判った。
(Observation of cut surface)
About the said heat spreader 1, it cut | disconnects in the thickness direction similarly to Example 1, the optical microscope photograph of the cut surface was image | photographed, and the coating layer 6 formed in the surface 3, the back surface 4, and the outer peripheral surface 5 of the base material 2 was taken. While observing the state and measuring the thickness of the coating layer 6, it was found that the thickness of the coating layer 6 was substantially uniform over the entire circumference.
（熱膨張係数の測定）
前記ヒートスプレッダ１の、面方向の熱膨張係数を、示差熱膨張計を用いて測定したところ１１×１０−６／Ｋであった。
（熱伝導率の測定）
前記ヒートスプレッダ１の、厚み方向の熱伝導率を、レーザーフラッシュ法によって測定したところ１７１Ｗ／ｍ・Ｋであった。
(Measurement of thermal expansion coefficient)
It was 11 * 10 < -6 > / K when the thermal expansion coefficient of the surface direction of the said heat spreader 1 was measured using the differential thermal dilatometer.
(Measurement of thermal conductivity)
It was 171 W / m * K when the heat conductivity of the thickness direction of the said heat spreader 1 was measured by the laser flash method.
〈実施例３〉
矩形平板状で、その下面側に図４に示す凹凸形状が形成された、横４２．５ｍｍ、縦４２．５ｍｍ、最大厚み２．７ｍｍ、最小厚み１．４ｍｍのヒートスプレッダ１を、図５ないし図９の製造方法によって製造することとして、実施例１で調整したのと同じ混合物２１と、下記の各種材料と、下型１５、上型１７、ダイ１９等とを用意した。
<Example 3>
A heat spreader 1 having a rectangular flat plate shape with the concave and convex shapes shown in FIG. 4 formed on its lower surface side and having a width of 42.5 mm, a height of 42.5 mm, a maximum thickness of 2.7 mm, and a minimum thickness of 1.4 mm is shown in FIGS. As the manufacturing method No. 9, the same mixture 21 prepared in Example 1, the following various materials, the lower mold 15, the upper mold 17, the die 19 and the like were prepared.
（第１成形体９）
純アルミニウム系の展延材（合金番号Ａ１０５０）からなる厚み０．３ｍｍの薄板を成形して、基材２の表面３を被覆する矩形平板状の被覆層７と、前記被覆層７の矩形の４辺を構成し前記表面３と交差する４つの外周面５を被覆する被覆層８の形状に一体に形成された第１成形体９を作製した。前記第１成形体９の被覆層７の外周寸法は、製造するヒートスプレッダ１の縦横寸法と一致する横４２．５ｍｍ、縦４２．５ｍｍとした。また被覆層８の、被覆層７の面方向と直交する高さ方向の寸法は１．５ｍｍとした。
(First molded body 9)
A thin plate having a thickness of 0.3 mm made of a pure aluminum-based spreading material (alloy number A1050) is formed to form a rectangular flat plate-like covering layer 7 that covers the surface 3 of the substrate 2, and a rectangular shape of the covering layer 7. A first molded body 9 that was integrally formed in the shape of a covering layer 8 that formed four sides and covered four outer peripheral surfaces 5 that intersected the surface 3 was produced. The outer peripheral dimensions of the covering layer 7 of the first molded body 9 were 42.5 mm in width and 42.5 mm in length, which coincided with the vertical and horizontal dimensions of the heat spreader 1 to be manufactured. Moreover, the dimension of the height direction of the coating layer 8 orthogonal to the surface direction of the coating layer 7 was 1.5 mm.
（第２成形体１２）
純アルミニウム系の展延材（合金番号Ａ１０５０）からなる厚み０．３ｍｍの薄板を成形して、基材２の裏面４を被覆する、図４の立体形状を有する平面形状が矩形の被覆層１０と、前記被覆層１０の矩形の４辺を構成し前記裏面４と交差する４つの外周面５を被覆する被覆層１１の形状に一体に形成された第２成形体１２を作製した。前記第２成形体１２の被覆層１０の外周寸法は、製造するヒートスプレッダ１の縦横寸法と一致する横４２．５ｍｍ、縦４２．５ｍｍとした。また被覆層１１の、被覆層１０の面方向と直交する高さ方向の寸法は１．５ｍｍとした。
(Second molded body 12)
A coating layer 10 having a three-dimensional shape as shown in FIG. 4 is formed by forming a 0.3 mm-thick thin plate made of a pure aluminum-based spreading material (alloy number A1050) and covering the back surface 4 of the substrate 2. Then, the second molded body 12 formed integrally with the shape of the coating layer 11 that covers the four outer peripheral surfaces 5 constituting the four rectangular sides of the coating layer 10 and intersecting the back surface 4 was produced. The outer peripheral dimensions of the coating layer 10 of the second molded body 12 were 42.5 mm in width and 42.5 mm in length, which coincided with the vertical and horizontal dimensions of the heat spreader 1 to be manufactured. Moreover, the dimension of the height direction orthogonal to the surface direction of the coating layer 10 of the coating layer 11 was 1.5 mm.
（下型１５）
製造するヒートスプレッダ１の裏面４の形状と一致する立体形状を有する矩形状とされた上面１４を備えたステンレス鋼製の下型１５を用意した。
（上型１７）
製造するヒートスプレッダ１の表面３の平面形状と一致する矩形平面状とされた下面１６を備えたステンレス鋼製の上型１７を用意した。
(Lower mold 15)
A stainless steel lower mold 15 provided with a rectangular upper surface 14 having a three-dimensional shape that matches the shape of the back surface 4 of the heat spreader 1 to be manufactured was prepared.
(Upper mold 17)
A stainless steel upper die 17 having a lower surface 16 having a rectangular planar shape matching the planar shape of the surface 3 of the heat spreader 1 to be manufactured was prepared.
（ダイ１９）
製造するヒートスプレッダ１の外周面５と一致する４面が矩形状に配置された内周面１８を備えたステンレス鋼製のダイ１９を用意した。
（ヒートスプレッダ１の製造）
下型１５とダイ１９とを組み合わせてキャビティ２０を形成し、前記キャビティ２０内に第２成形体１２を嵌め合わせて、基材２のもとになる混合物２１を充填した。次に、充填した混合物２１の上に第１成形体９を重ね合わせた後、上型１７をキャビティ２０内に挿入し、前記上型１７を、常温環境下で製造するヒートスプレッダ１の厚み（最大厚み＝２．７ｍｍ、最小厚み＝１．４ｍｍ）になるまで、圧力５０ＭＰａで下型１５の方向に押し込んで圧縮成形体２２を得た後、前記圧縮成形体２２をダイ１９から取り出し、６５０℃で２時間焼成してヒートスプレッダ１を製造した。
(Die 19)
A stainless steel die 19 having an inner peripheral surface 18 in which four surfaces that coincide with the outer peripheral surface 5 of the heat spreader 1 to be manufactured were arranged in a rectangular shape was prepared.
(Manufacture of heat spreader 1)
The lower mold 15 and the die 19 were combined to form a cavity 20, and the second molded body 12 was fitted into the cavity 20, and the mixture 21 serving as the base material 2 was filled. Next, after superposing the first molded body 9 on the filled mixture 21, the upper mold 17 is inserted into the cavity 20, and the thickness (maximum) of the heat spreader 1 for manufacturing the upper mold 17 in a room temperature environment. Until the thickness reaches 2.7 mm and the minimum thickness equals 1.4 mm, the compression molded body 22 is obtained by pressing in the direction of the lower mold 15 at a pressure of 50 MPa. The heat spreader 1 was manufactured by baking for 2 hours.
（切断面の観察）
前記ヒートスプレッダ１を固定用の樹脂中に埋め込んで前記樹脂ごと厚み方向に切断し、その切断面の光学顕微鏡写真（図１２）を撮影して、基材２の表面３、裏面４および外周面５に形成された被覆層６の状態を観察した。なお図１２は、ヒートスプレッダ１の面方向の半分のみを示している。
(Observation of cut surface)
The heat spreader 1 is embedded in a fixing resin, and the entire resin is cut in the thickness direction. An optical micrograph (FIG. 12) of the cut surface is taken, and the front surface 3, the back surface 4 and the outer peripheral surface 5 of the substrate 2 are taken. The state of the coating layer 6 formed on was observed. FIG. 12 shows only half of the surface direction of the heat spreader 1.
また図１３に示すように、前記図１２の光学顕微鏡写真中の、(1)〜(10)の１０箇所での被覆層６の厚みを測定したところ、前記被覆層６は、下記表２に示すように前記１０箇所での厚みがいずれも約０．３ｍｍで、その全周に亘って厚みがほぼ均一であることが判った。 Moreover, as shown in FIG. 13, when the thickness of the coating layer 6 in 10 places of (1)-(10) in the optical micrograph of the said FIG. 12 was measured, the said coating layer 6 is shown in following Table 2. As shown, the thicknesses at the 10 locations were all about 0.3 mm, and the thickness was found to be substantially uniform over the entire circumference.
（熱膨張係数の測定）
前記ヒートスプレッダ１の、面方向の熱膨張係数を、示差熱膨張計を用いて測定したところ１１．０×１０−６／Ｋであった。
（熱伝導率の測定）
前記ヒートスプレッダ１の、厚み方向の熱伝導率を、レーザーフラッシュ法によって測定したところ１７０Ｗ／ｍ・Ｋであった。
(Measurement of thermal expansion coefficient)
It was 11.0 * 10 < -6 > / K when the thermal expansion coefficient of the surface direction of the said heat spreader 1 was measured using the differential thermal dilatometer.
(Measurement of thermal conductivity)
When the heat conductivity in the thickness direction of the heat spreader 1 was measured by a laser flash method, it was 170 W / m · K.
１：ヒートスプレッダ、２：基材、３：表面、４：裏面、４ａ、４ｃ、４ｆ、４ｈ、４ｉ：領域、４ｂ、４ｇ：平面、４ｄ：段差面、４ｅ：傾斜面、４ｊ、４ｋ、４ｍ：傾斜面、５：外周面、６、７、８、１０、１１：被覆層、９、１２：成形体、１３：接合部、１４：上面、１５：下型、１６：下面、１７：上型、１８：内周面、１９：ダイ、２０：キャビティ、２１：混合物、２２：圧縮成形体 1: heat spreader, 2: base material, 3: front surface, 4: back surface, 4a, 4c, 4f, 4h, 4i: region, 4b, 4g: flat surface, 4d: step surface, 4e: inclined surface, 4j, 4k, 4m : Inclined surface, 5: outer peripheral surface, 6, 7, 8, 10, 11: coating layer, 9, 12: molded body, 13: joined portion, 14: upper surface, 15: lower mold, 16: lower surface, 17: upper Mold: 18: Inner peripheral surface, 19: Die, 20: Cavity, 21: Mixture, 22: Compression molding
Claims (6)
前記金属または合金からなる薄板により、前記基材の表面、および外周面のうち前記表面と連続する領域を被覆する被覆層の形状に成形された第１成形体と、前記薄板により、前記基材の裏面、および前記外周面のうち前記裏面と連続する領域を被覆する被覆層の形状に成形された第２成形体との間に前記基材のもとになる材料の粉末を充填して、前記金属または合金の融点未満の温度での圧縮成形および焼成によって前記基材が形成され、かつ前記第１成形体と第２成形体とが前記外周面において互いに接合されるとともに前記基材と接合されて前記被覆層が形成されていることを特徴とするヒートスプレッダ。A substantially flat base material and a heat spreader in which the front surface, the back surface, and the outer peripheral surface in the surface direction of the base material are each made of a metal or an alloy and are coated with a coating layer continuous with each other,
A first molded body formed into a shape of a covering layer that covers a region continuous with the surface of the surface of the substrate and an outer peripheral surface by the thin plate made of the metal or alloy, and the substrate by the thin plate Between the back surface of the outer peripheral surface and the second molded body formed in the shape of the coating layer covering the region continuous with the back surface of the outer peripheral surface , The base material is formed by compression molding and firing at a temperature lower than the melting point of the metal or alloy, and the first molded body and the second molded body are bonded to each other on the outer peripheral surface and bonded to the base material. The heat spreader is characterized in that the coating layer is formed.
(a) 前記被覆層のもとになるアルミニウムまたはアルミニウム合金からなる薄板を、前記基材の表面、および外周面のうち前記表面と連続する領域を被覆する被覆層の形状に成形して第１成形体を作製するとともに、前記薄板を前記基材の裏面、および前記外周面のうち前記裏面と連続する領域を被覆する被覆層の形状に成形して第２成形体を作製する工程と、
(b) 前記基材の裏面を被覆する被覆層の表面形状に略一致する上面を有する下型、および前記基材の外周面を被覆する被覆層の表面形状に略一致する内周面を有するダイを用意し、前記下型とダイとを組み合わせて前記上面および内周面でキャビティを構成し、前記キャビティ内に前記第２成形体を嵌め合わせて前記複合材料を充填したのち前記第１成形体を重ね合わせる工程と、
(c) 前記基材の表面を被覆する被覆層の表面形状に略一致する下面を有する上型を用意し、前記上型を前記キャビティ内に挿入して、前記アルミニウムまたはアルミニウム合金の融点未満の温度で、前記上型および下型のうちの一方または両方を相手側の方向に押し込むことによって、前記第１成形体、第２成形体、および複合材料を圧縮成形して圧縮成形体を作製する工程と、
(d) 前記圧縮成形体を、前記アルミニウムまたはアルミニウム合金の融点未満の温度で焼成する工程と、
を含むことを特徴とするヒートスプレッダの製造方法。A heat spreader in which the front surface, the back surface, and the outer circumferential surface of a substantially flat substrate made of a composite material containing aluminum or an aluminum alloy are all made of aluminum or an aluminum alloy and are coated with a continuous coating layer is manufactured. A manufacturing method comprising:
(a) A thin plate made of aluminum or an aluminum alloy that is the basis of the coating layer is molded into a shape of a coating layer that covers the surface of the base material and a region continuous with the surface of the outer peripheral surface. A step of forming a molded body and forming a second molded body by molding the thin plate into a shape of a coating layer covering a region continuous with the back surface of the back surface of the base material and the outer peripheral surface;
(b) a lower mold having an upper surface substantially matching the surface shape of the coating layer covering the back surface of the substrate, and an inner peripheral surface substantially matching the surface shape of the coating layer covering the outer peripheral surface of the substrate. A die is prepared, the lower mold and the die are combined to form a cavity on the upper surface and the inner peripheral surface, the second molded body is fitted into the cavity and the composite material is filled, and then the first molding is performed. Superimposing the body,
(c) preparing an upper mold having a lower surface substantially matching the surface shape of the coating layer covering the surface of the substrate, inserting the upper mold into the cavity, and having a melting point lower than that of the aluminum or aluminum alloy By pressing one or both of the upper mold and the lower mold in the opposite direction at a temperature, the first molded body, the second molded body, and the composite material are compression molded to produce a compression molded body. Process,
(d) firing the compression-molded body at a temperature lower than the melting point of the aluminum or aluminum alloy;
The manufacturing method of the heat spreader characterized by including.
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2008196575 | 2008-07-30 | ||
| JP2008196575 | 2008-07-30 | ||
| PCT/JP2009/002785 WO2010013383A1 (en) | 2008-07-30 | 2009-06-18 | Heat spreader and method for manufacturing the heat spreader |
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| Publication Number | Publication Date |
|---|---|
| JP4435868B1 true JP4435868B1 (en) | 2010-03-24 |
| JPWO2010013383A1 JPWO2010013383A1 (en) | 2012-01-05 |
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| JP2009544336A Expired - Fee Related JP4435868B1 (en) | 2008-07-30 | 2009-06-18 | Heat spreader and manufacturing method thereof |
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| WO (1) | WO2010013383A1 (en) |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| JP6108533B2 (en) * | 2013-03-19 | 2017-04-05 | 住友精密工業株式会社 | High thermal conductive plate |
| JP6580385B2 (en) * | 2015-06-19 | 2019-09-25 | 昭和電工株式会社 | Composite of aluminum and carbon particles and method for producing the same |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS63282201A (en) * | 1987-05-14 | 1988-11-18 | Furukawa Alum Co Ltd | Method for forging powder metallurgical material |
| JPH11323409A (en) * | 1998-05-18 | 1999-11-26 | Daido Steel Co Ltd | Composite member and its production |
| JP2000022055A (en) * | 1998-07-07 | 2000-01-21 | Furukawa Electric Co Ltd:The | Carbon fabric composite radiator plate |
| JP2002235126A (en) * | 2001-02-06 | 2002-08-23 | Toyota Industries Corp | Method for producing composite material |
| JP2005276962A (en) * | 2004-03-24 | 2005-10-06 | Allied Material Corp | Semiconductor devices and substrate thereof |
-
2009
- 2009-06-18 JP JP2009544336A patent/JP4435868B1/en not_active Expired - Fee Related
- 2009-06-18 WO PCT/JP2009/002785 patent/WO2010013383A1/en active Application Filing
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS63282201A (en) * | 1987-05-14 | 1988-11-18 | Furukawa Alum Co Ltd | Method for forging powder metallurgical material |
| JPH11323409A (en) * | 1998-05-18 | 1999-11-26 | Daido Steel Co Ltd | Composite member and its production |
| JP2000022055A (en) * | 1998-07-07 | 2000-01-21 | Furukawa Electric Co Ltd:The | Carbon fabric composite radiator plate |
| JP2002235126A (en) * | 2001-02-06 | 2002-08-23 | Toyota Industries Corp | Method for producing composite material |
| JP2005276962A (en) * | 2004-03-24 | 2005-10-06 | Allied Material Corp | Semiconductor devices and substrate thereof |
Also Published As
| Publication number | Publication date |
|---|---|
| JPWO2010013383A1 (en) | 2012-01-05 |
| WO2010013383A1 (en) | 2010-02-04 |
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