JP4389168B2 - Wiring board for forming end face electrodes - Google Patents

Wiring board for forming end face electrodes Download PDF

Info

Publication number
JP4389168B2
JP4389168B2 JP2004348438A JP2004348438A JP4389168B2 JP 4389168 B2 JP4389168 B2 JP 4389168B2 JP 2004348438 A JP2004348438 A JP 2004348438A JP 2004348438 A JP2004348438 A JP 2004348438A JP 4389168 B2 JP4389168 B2 JP 4389168B2
Authority
JP
Japan
Prior art keywords
hole
wiring board
penetrating
conductive
face electrode
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP2004348438A
Other languages
Japanese (ja)
Other versions
JP2006156879A (en
Inventor
良治 杉浦
正幸 桜井
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Showa Denko Materials Co Ltd
Original Assignee
Hitachi Chemical Co Ltd
Showa Denko Materials Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Chemical Co Ltd, Showa Denko Materials Co Ltd filed Critical Hitachi Chemical Co Ltd
Priority to JP2004348438A priority Critical patent/JP4389168B2/en
Publication of JP2006156879A publication Critical patent/JP2006156879A/en
Application granted granted Critical
Publication of JP4389168B2 publication Critical patent/JP4389168B2/en
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Landscapes

  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
  • Structure Of Printed Boards (AREA)

Description

本発明は、プリント配線板に関するもので、特に端面電極用の非貫通導通穴を有し、電子部品又は電子部品素子を実装する配線基板に関するものである。   The present invention relates to a printed wiring board, and more particularly to a wiring board having a non-penetrating conduction hole for an end face electrode and mounting an electronic component or an electronic component element.

従来は配線基板に端面電極を形成する場合、プリント配線板の外形側面の近傍に一直線上に貫通導通穴（一般的に、めっきスルーホールと呼ぶ）を設け、配線基板の上下面の導体パタ−ンを電気的に接続する貫通導通穴のほぼ中心線で分割切断して、この分割した貫通導通穴の内部が半円筒状で外部に露呈した端面電極を形成する。
配線基板に電子部品素子、電子部品を実装し、その後配線基板の配線パタ−ンや電子部品素子、電子部品を樹脂モ−ルドして樹脂封止をし端面電極を有するモ−ルドチップ部品とするには、貫通導通穴の内部に封止樹脂が侵入しないように貫通導通穴の上面側に樹脂の侵入を阻止する部材（フィルム、テ−プ、基材など）を設けなければならない。 Conventionally, when forming end face electrodes on a wiring board, through-conduction holes (generally referred to as plating through holes) are provided in a straight line near the outer side of the printed wiring board, and conductor patterns on the upper and lower surfaces of the wiring board are provided. An end face electrode is formed in which the inside of the divided through conduction hole is semicylindrical and exposed to the outside.
Electronic component elements and electronic components are mounted on the wiring board, and then the wiring pattern of the wiring board, electronic component elements, and electronic components are resin-molded and resin-sealed to form a molded chip component having an end face electrode. In order to prevent the sealing resin from entering the inside of the through-conduction hole, a member (film, tape, base material, etc.) for preventing the resin from entering on the upper surface side of the through-conduction hole must be provided.

その一例として、特開平１１−２５１７０４号公報に開示されている端面電極用の配線基板がある。
これは、貫通導通穴の上面側に封止樹脂の侵入を阻止する部材に絶縁膜を使用するものである。
貫通導通穴の上面を塞ぐ部材が絶縁テ−プ、フィルム状などの絶縁膜は通常薄い絶縁性被膜であるため、実装した電子部品素子や電子部品を樹脂で封止する圧力が高くなると、この圧力によって絶縁性被膜が陥没したり、破けたり、貫通スルーホールの内部に封止樹脂が侵入する。
この薄い絶縁性被膜は、機械的強度が不足し、樹脂で封止する熱や圧力が高いトランスファモ−ルド法では、高い圧力と熱によって非貫通導通穴の薄い被膜が陥没したり、破損して端面電極の品質不良となっていた。
特開平１１−２５１７０４号公報。 As an example, there is a wiring board for an end face electrode disclosed in Japanese Patent Laid-Open No. 11-251704.
This uses an insulating film as a member for preventing the sealing resin from entering the upper surface side of the through-conduction hole.
The member that closes the upper surface of the through-conduction hole is an insulating tape, or an insulating film such as a film is usually a thin insulating film. Therefore, if the pressure to seal the mounted electronic component element or electronic component with resin increases, The insulating film sinks or breaks due to pressure, and the sealing resin enters the inside of the through-hole.
This thin insulating film lacks mechanical strength, and in the transfer mold method where the heat and pressure sealed with resin are high, the thin film of the non-through hole is depressed or damaged by high pressure and heat. As a result, the quality of the end face electrode was poor.
Japanese Patent Application Laid-Open No. 11-251704.

配線基板に電子部品素子、電子部品を実装し、その後実装した電子部品素子や電子部品を樹脂封止して端面電極を有するモ−ルドチップ部品とするには、基板に設けた貫通スルーホールの内部に封止樹脂が侵入しないように貫通導通穴の上面側に樹脂の侵入を阻止する部材（絶縁テ−プ、フィルム状、シ−ト状などの阻止部材）を設けなければならない。   In order to mount an electronic component element or electronic component on a wiring board, and then mold the mounted electronic component element or electronic component into a molded chip component having an end face electrode by resin sealing, the inside of a through-through hole provided in the substrate In order to prevent the sealing resin from entering, a member (blocking member such as an insulating tape, a film, or a sheet) that prevents the resin from entering must be provided on the upper surface side of the through conduction hole.

上記の阻止部材を張り合わせる為、高密度化や端面電極の低背化、薄厚化が悪くなっていた。
特に、最近ではモ−ルドチップ部品の小型高密度化、低背化、薄厚化、および端面電極の高い接続信頼性が要求されている。
本発明は特に、薄型高密度のモ−ルド樹脂部品を高温高圧で大量生産するトランスファモ−ルド法の熱や圧力に耐えうる樹脂の侵入を阻止する部材構造と、高い電気的及びはんだ接続信頼性の端面電極とする。 Since the blocking members are bonded together, the density increase, the end face electrode height reduction, and the thickness reduction are poor.
In particular, recently, mold chip parts are required to be smaller and higher in density, lower in profile, thinner, and higher connection reliability of end face electrodes.
In particular, the present invention is a member structure that prevents the penetration of resin that can withstand the heat and pressure of the transfer mold method for mass production of thin and high-density molded resin parts at high temperature and high pressure, and high electrical and solder connection reliability. End face electrode.

従って、配線基板の部品搭載面の上部外層導体と下面外層導体とを電気的に接続し、トランスファモ−ルド法の熱や圧力に耐えうる樹脂の侵入を阻止する部材を非貫通導通穴の穴内のほぼ上半部に充填した非貫通導通穴を分割切断して、この非貫通導通穴の穴内のほぼ下半部の穴壁面に露呈している金属導体を端面電極として利用する配線基板である。   Therefore, the upper outer layer conductor and the lower outer layer conductor on the component mounting surface of the wiring board are electrically connected, and a member that prevents the penetration of the resin that can withstand the heat and pressure of the transfer mold method is provided in the hole of the non-through conductive hole. This is a wiring board which uses a metal conductor exposed as an end face electrode by dividing and cutting a non-penetrating conduction hole filled in almost the upper half of the non-penetrating conduction hole and exposing a substantially lower half hole wall surface in the non-penetrating conduction hole. .

上記の課題を解決するため、請求項１は、複数の分割切断線上に端面電極を形成するための非貫通導通穴を配置する配線基板において、この端面電極用の非貫通導通穴は配線基板の上面導体と下面導体を電気的に接続する該非貫通導通穴のスルーホールめっきと、該非貫通導通穴の穴内の略上半部に充填された絶縁樹脂と、該非貫通導通穴の穴内の略下半部の穴壁面に露呈している金属導体と、からなる非貫通導通穴であり、前記の穴内に充填された絶縁樹脂の下端面は該非貫通導通穴の下端から略均一な深さで陥没し、該非貫通導通穴の上端面の穴径（Ｄ１）が該非貫通導通穴の下端面の穴径（Ｄ２）より大きい端面電極を形成する配線基板である。
請求項２は、請求項１において、端面電極用の非貫通導通穴は、上端面に広がるテーパー形状、上端部の一部分の深さのみを上端面の穴径が下端面の穴径より大きくなるようにした形状又は段付き穴であることを特徴とする端面電極を形成する配線基板である。
請求項３は、請求項１又は２において、端面電極用の非貫通導通穴は、上端部の一部分の深さのみを上端面の穴径が下端面の穴径より大きくなるようにザグリ加工又は段付き穴加工することにより形成されることを特徴とする端面電極を形成する配線基板である。
請求項４は、請求項１から３の何れかにおいて、端面電極用の非貫通導通穴は、非貫通導通穴内部に穴埋めされている充填部材が、配線基板下面側からレーザー加工することにより、非貫通導通穴の穴内の略上半部まで充填され、穴内に充填された絶縁樹脂の下端面が、該非貫通導通穴の下端から略均一な深さで陥没していることを特徴とする配線基板である。
In order to solve the above-described problems, claim 1 is a wiring board in which non-through conductive holes for forming end face electrodes are arranged on a plurality of divided cutting lines, and the non-through conductive holes for the end face electrodes are provided on the wiring board. Through hole plating of the non-through conductive hole for electrically connecting the upper surface conductor and the lower surface conductor, an insulating resin filled in a substantially upper half of the hole of the non-through conductive hole, and a substantially lower half of the hole of the non-through conductive hole A non-penetrating conduction hole made of a metal conductor exposed on the wall surface of the hole, and the lower end surface of the insulating resin filled in the hole is depressed at a substantially uniform depth from the lower end of the non-penetrating conduction hole. The wiring board forms an end face electrode in which the hole diameter (D1) of the upper end surface of the non-penetrating conduction hole is larger than the hole diameter (D2) of the lower end surface of the non-penetrating conduction hole .
In a second aspect of the present invention, the non-penetrating conduction hole for the end face electrode has a tapered shape extending to the upper end surface, and the hole diameter of the upper end surface is larger than the hole diameter of the lower end surface only for a part of the upper end portion. It is a wiring board which forms the end face electrode characterized by being the shape or stepped hole which was made.
In a third aspect of the present invention, in the first or second aspect, the non-penetrating conduction hole for the end surface electrode has a depth of only a part of the upper end portion or a counterbore process so that the hole diameter of the upper end surface is larger than the hole diameter of the lower end surface. It is a wiring board for forming an end face electrode, which is formed by processing a stepped hole.
According to a fourth aspect of the present invention, in any one of the first to third aspects, the non-penetrating conductive hole for the end face electrode is laser-processed from the lower surface side of the wiring board by filling the filling member embedded in the non-penetrating conductive hole. The wiring is characterized in that it fills up to approximately the upper half of the hole of the non-penetrating conduction hole, and the lower end surface of the insulating resin filled in the hole is depressed at a substantially uniform depth from the lower end of the non-penetrating conduction hole. It is a substrate.

また、請求項５は、複数の分割切断線上に端面電極を形成するための非貫通導通穴を配置する大版の配線基板において、この大版の配線基板の上面に電子部品又は電子部品素子を実装し、前記の電子部品又は電子部品素子と前記配線基板の上面全体を樹脂封止した後、上面を樹脂封止した該非貫通導通穴の略中心の分割切断線で切断して端面電極を形成するための請求項１から４の何れかの配線基板とするものである。
According to a fifth aspect of the present invention , there is provided a large-sized wiring board in which non-penetrating conduction holes for forming end face electrodes are arranged on a plurality of divided cutting lines, and an electronic component or an electronic component element is provided on the upper surface of the large-sized wiring board. After mounting, the entire upper surface of the electronic component or electronic component element and the wiring board is resin-sealed, and then the upper surface is resin-sealed and cut at a divided cutting line at substantially the center of the non-penetrating conduction hole to form an end face electrode Therefore, a wiring board according to any one of claims 1 to 4 is provided.

請求項１から４の発明は、配線基板の貫通導通穴の穴内に絶縁樹脂を充填する非貫通導通穴ため、チップ部品の小型高密度化、低背化、薄厚化が可能となり、さらに穴埋め絶縁樹脂の下端は非貫通導通穴の下端面から均一な深さで陥没してなる絶縁樹脂の侵入阻止部材とした非貫通導通穴とすることにより、トランスファモ−ルド法の高熱や高圧力に耐えうる樹脂の侵入阻止部材を備えた接続信頼性の高い高密度の端面電極が形成できる。
また、トランスファモ−ルド法の封止樹脂の高熱や高圧力に耐えうる絶縁樹脂の侵入阻止部材とするための非貫通導通穴は、該非貫通導通穴の上端面の穴径（Ｄ１）が該非貫通導通穴の下端面の穴径（Ｄ２）より大きくし、トランスファモ−ルド法の上面側からの高温高圧の樹脂封止加重に耐えうるようにして、絶縁樹脂の侵入阻止部材がずれたり抜けないようにして非貫通導通穴（端面電極）を形成できる。
According to the first to fourth aspects of the present invention, since the non-through conductive hole is filled with an insulating resin in the through-conductive hole of the wiring board, the chip part can be miniaturized, densified, thinned, and thinned. The lower end of the resin is a non-through hole that acts as an intrusion prevention member for insulating resin that is recessed at a uniform depth from the lower end surface of the non-through hole, so that it can withstand the high heat and high pressure of the transfer mold method. It is possible to form a high-density end face electrode with high connection reliability provided with a resin intrusion prevention member.
Further, the non-penetrating conduction hole for the insulating resin intrusion prevention member that can withstand the high heat and high pressure of the transfer mold sealing resin has a hole diameter (D1) of the upper end surface of the non-penetrating conduction hole. Insulating resin intrusion prevention member is displaced or removed so that it is larger than the hole diameter (D2) of the lower end surface of the through-conduction hole and can withstand high temperature and high pressure resin sealing load from the upper surface side of the transfer mold method. In this way, a non-penetrating conduction hole (end face electrode) can be formed.

請求項５の発明は、前記の請求項１から４の何れかの配線基板の非貫通導通穴の略中心の分割切断線で切断して端面電極を形成するチップ部品は小型高密度化、低背化、薄厚化が可能となり、はんだ付性や接続信頼性の高い高密度の端面電極が形成できる。
According to a fifth aspect of the present invention, there is provided a chip component in which the end face electrode is formed by cutting along the divided cutting line substantially at the center of the non-through-conduction hole of the wiring board according to any one of the first to fourth aspects. The height and thickness can be reduced, and high-density end face electrodes with high solderability and connection reliability can be formed.

端面電極を形成する非貫通導通穴を有する配線基板において、この端面電極とする非貫通導通穴は丸穴に限定するものではなく長円穴や角穴でも良く、次の特徴を備えている。（イ）配線基板の部品搭載面の上部外層導体と下面外層導体とを電気的に接続する。（ロ）トランスファモ−ルド法の樹脂封止の高温・高圧である封止樹脂の侵入を完全に阻止する阻止部材を備えている。（ハ）電気的接続信頼性及びはんだ接続信頼性が高い外部接続用の端面電極の構造である。（ニ）配線基板の下面に陥没してなる非貫通導通穴の阻止部材の下端面から配線基板の下面までの非貫通導通穴の内周面は半田付け性が良好な金属導体を備えている。   In a wiring board having a non-penetrating conduction hole for forming an end face electrode, the non-penetrating conducting hole used as the end face electrode is not limited to a round hole but may be an oblong hole or a square hole, and has the following characteristics. (A) The upper outer layer conductor and the lower outer layer conductor on the component mounting surface of the wiring board are electrically connected. (B) A blocking member that completely blocks the intrusion of the sealing resin, which is a high temperature and high pressure of the resin sealing of the transfer mold method, is provided. (C) A structure of an end face electrode for external connection having high electrical connection reliability and high solder connection reliability. (D) The inner peripheral surface of the non-penetrating conduction hole extending from the lower end surface of the non-penetrating conducting hole blocking member formed in the lower surface of the wiring board to the lower surface of the wiring board is provided with a metal conductor having good solderability. .

以下、本発明の配線基板の非貫通導通穴を形成する製造工程を図２を参照してアディティブ法で説明する。
まず、図２（ａ）として乳液状の接着剤が塗布された絶縁基材２の複数の分割切断線上に端面電極を形成するため、所定の箇所にＮＣドリリングマシンにより、穴明け加工を施して貫通穴とする。
次に所定の箇所に銅めっきをし、所定の形状の上面導体と下面導体のめっきパタ−ンである銅めっき導体４と、配線基板の上面導体と下面導体を電気的に接続するスルーホールめっき３からなる貫通導通穴５を形成する。
図２（ｂ）に示すように、トランスファモ−ルド法の熱や圧力に対応できる高耐熱性のエポキシ樹脂系、メラニン系、アクリル樹脂系などの穴埋め樹脂や液状レジストなどの絶縁樹脂６を貫通導通穴５内と配線基板の上、下面に塗布する。それから乾燥工程により半硬化させる。 Hereinafter, the manufacturing process for forming the non-through conductive hole of the wiring board of the present invention will be described with reference to FIG.
First, as shown in FIG. 2 (a), in order to form the end face electrodes on the plurality of divided cutting lines of the insulating base material 2 to which the emulsion adhesive is applied, a drilling process is performed at a predetermined position by an NC drilling machine. It is a through hole.
Next, copper plating is applied to a predetermined location, and through hole plating for electrically connecting the upper surface conductor and the lower surface conductor of the wiring board to the copper plating conductor 4 which is the plating pattern of the upper surface conductor and the lower surface conductor of a predetermined shape. 3 through conduction holes 5 are formed.
As shown in FIG. 2 (b), it penetrates through a heat-resisting epoxy resin, melanin, acrylic resin or other insulating resin 6 such as a liquid resist that can withstand the heat and pressure of the transfer mold method. It is applied to the inside of the conduction hole 5 and the upper and lower surfaces of the wiring board. Then it is semi-cured by a drying process.

次に図２（ｃ）に示すように、配線基板１の部品搭載面とはんだ付面の所定の箇所に所定の形状でＵＶ露光、現像、ポストキュアをするか又は熱硬化してトランスファモ−ルド法の高温高圧の樹脂封止加重に耐えうる穴埋め絶縁樹脂６とする。
さらに貫通導通穴内から溢れた穴埋め絶縁樹脂６を研磨して配線基板１の両面の上面導体と下面導体のめっきパタ−ンである銅めっき導体４と同一になるように平坦な形状である非貫通導通穴７を形成した。 Next, as shown in FIG. 2 (c), UV exposure, development, post-cure or heat curing is performed at predetermined locations on the component mounting surface and soldering surface of the wiring board 1 in a predetermined shape. The hole-filling insulating resin 6 that can withstand the high temperature and high pressure resin sealing load of the gold method is used.
Further, the filling resin overflowing from the through-conduction hole is polished, and the non-penetrating shape is flat so as to be the same as the copper plating conductor 4 which is the plating pattern of the upper surface conductor and the lower surface conductor of the wiring board 1. A conduction hole 7 was formed.

それから図２（ｄ）に示すように、はんだ付面の内部側の非貫通導通穴７内に穴埋めされている樹脂をはんだ付面（下面側）から炭酸ガスレーザー加工により余分の穴埋め絶縁樹脂６を除去し、非貫通導通穴７の穴内の略上半部まで充填された状態にする。
かつ、非貫通導通穴７の穴内に充填された絶縁樹脂６の下端面は配線基板１の該非貫通導通穴７の下端からの深さが略均一な深さで陥没している非貫通導通穴７の穴埋め絶縁樹脂６とする。 Then, as shown in FIG. 2 (d), the resin buried in the non-penetrating conduction hole 7 on the inner side of the soldering surface is filled with an extra hole-filling insulating resin 6 by carbon dioxide laser processing from the soldering surface (lower surface side). Is removed and the upper half of the non-through hole 7 is filled.
Further, the non-penetrating conducting hole in which the lower end surface of the insulating resin 6 filled in the non-penetrating conducting hole 7 is recessed with a substantially uniform depth from the lower end of the non-penetrating conducting hole 7 of the wiring board 1. 7 is filled with insulating resin 6.

この配線基板の下面からの深さが均一となるようにした後、非貫通導通穴７のほぼ中心線上の分割切断線１８で切断して端面電極９を備えた非貫通導通溝１３を形成する。
こ非貫通導通溝の内部が半円筒状で一方のみが外部に露呈した端面電極となり電気的及びはんだ接続信頼性の高い端面電極を形成する。
つまり端面電極の電気的及びはんだ接続信頼性の安定性と高品質を図りチップ部品は小型高密度化、低背化、薄厚化が可能となる。 After the depth from the lower surface of the wiring board is made uniform, the non-through conductive groove 13 having the end face electrode 9 is formed by cutting along the divided cutting line 18 substantially on the center line of the non-through conductive hole 7. .
This non-penetrating conductive groove has a semi-cylindrical shape and only one end electrode is exposed to the outside, thereby forming an end surface electrode with high electrical and solder connection reliability.
That is, the stability and high quality of the electrical and solder connection reliability of the end face electrodes can be achieved, and the chip component can be made smaller, higher density, lower profile, and thinner.

図１に本願発明の端面電極を形成する配線基板について説明する。
まず、絶縁基材２の所定の箇所に穴明け加工を施して複数の貫通穴とし、この貫通穴と外層表面の所定の箇所に銅めっきをし、所定の形状の上面導体のめっき導体４、下面導体のめっき導体４、および貫通穴内壁の銅めっき導体４と、配線基板の上面導体と下面導体を電気的に接続するスルーホールめっき３によって貫通導通穴５を形成する。 FIG. 1 illustrates a wiring board on which end face electrodes of the present invention are formed.
First, a predetermined portion of the insulating substrate 2 is drilled to form a plurality of through holes, and copper plating is performed on the predetermined portions of the through holes and the outer layer surface, and the plated conductor 4 of the upper surface conductor having a predetermined shape, The through conduction hole 5 is formed by the plated conductor 4 of the lower surface conductor, the copper plated conductor 4 of the inner wall of the through hole, and the through hole plating 3 that electrically connects the upper surface conductor and the lower surface conductor of the wiring board.

次に、この貫通導通穴５に穴埋め絶縁樹脂６を充填し、配線基板１の下面側から炭酸ガスレーザー加工により下方の余分の穴埋め絶縁樹脂６を除去し、非貫通導通穴７の下端から穴埋め絶縁樹脂６の下端面までの深さ（ｔ）が配線基板１の板厚のほぼ２／３〜１／３とする。
そして、この非貫通導通穴７のほぼ中心線上の分割切断線１８で切断して非貫通導通溝１３の略下半部（穴埋め絶縁樹脂６の下方）の穴壁面に露呈している金属導体（非貫通導通穴７内壁の銅めっき導体４）が端面電極９となるように形成する。
つまり、炭酸ガスレーザー加工により下方の余分の穴埋め絶縁樹脂６を除去するため非貫通導通穴７の下端から穴埋め絶縁樹脂６の下端面までの深さ（ｔ）が均一で寸法精度良く、品質の高い端面電極９となる。 Next, the through-conduction hole 5 is filled with a filling insulating resin 6, and the lower excess filling resin 6 is removed from the lower surface side of the wiring substrate 1 by carbon dioxide laser processing, and the non-through-conduction hole 7 is filled from the lower end. The depth (t) to the lower end surface of the insulating resin 6 is approximately 2/3 to 1/3 of the thickness of the wiring board 1.
The metal conductor exposed on the hole wall surface of the substantially lower half of the non-penetrating conductive groove 13 (below the hole-filling insulating resin 6) by cutting along the divided cutting line 18 substantially on the center line of the non-penetrating conductive hole 7 The copper plated conductor 4) on the inner wall of the non-penetrating conduction hole 7 is formed to be the end face electrode 9.
In other words, in order to remove the excess hole-filling insulating resin 6 below by carbon dioxide laser processing, the depth (t) from the lower end of the non-penetrating conduction hole 7 to the lower end surface of the hole-filling insulating resin 6 is uniform, with high dimensional accuracy, and quality. A high end face electrode 9 is obtained.

図３は本願発明の端面電極を形成するための大版の配線基板１１について説明する。
図３において、外形寸法が大きく形成された、いわゆる大版の配線基板１１であって、この大版の配線基板１１から多数枚（本例では便宜上９枚）の個別の配線基板１が形成される。
すなわち、大版の配線基板１１には、プレス加工やルーター加工、ライシング加工によって多数の個々の配線基板１が切断される分割切断線１８上に沿って、多数の穴埋め絶縁樹脂を充填した非貫通導通穴７が配置されている。 FIG. 3 illustrates a large-sized wiring board 11 for forming the end face electrode of the present invention.
In FIG. 3, a so-called large-sized wiring board 11 having a large outer dimension is formed, and a large number (9 in this example, for convenience) of individual wiring boards 1 are formed from the large-sized wiring board 11. The
That is, the large-sized wiring board 11 is filled with a large number of hole-filling insulating resins along the divided cutting lines 18 where a large number of individual wiring boards 1 are cut by pressing, router processing, or licing. A conduction hole 7 is arranged.

大版の配線基板１１の状態で炭酸ガスレーザー処理を行い、余分の穴埋め絶縁樹脂（非貫通導通穴７の略下半部の絶縁樹脂）を除去し、非貫通導通穴７の穴内の上端部に絶縁樹脂のみが充填された非貫通導通穴７を形成する。
その後、大版の配線基板１１に繋がってる多数の個々の配線基板１に電子部品素子、電子部品を実装し、実装した電子部品素子や電子部品と大版の配線基板１１の上方面を樹脂封止してから分割切断線１８で非貫通導通穴７のほぼ中心で切断することによって、端面電極を有するモ−ルド型チップ部品とするものである。 Carbon dioxide laser treatment is performed in the state of the large-sized wiring board 11 to remove the excess hole-filling insulating resin (the insulating resin in the substantially lower half of the non-penetrating conductive hole 7), and the upper end portion in the non-penetrating conductive hole 7 A non-penetrating conduction hole 7 filled with only insulating resin is formed.
Thereafter, electronic component elements and electronic components are mounted on a large number of individual wiring substrates 1 connected to the large-sized wiring board 11, and the upper surface of the mounted electronic component elements and electronic components and the large-sized wiring board 11 are sealed with resin. After being stopped, by cutting at substantially the center of the non-penetrating conduction hole 7 with the divided cutting line 18, a molded chip component having an end face electrode is obtained.

次に図４（ａ）に示すような端面電極を形成するための非貫通導通穴７は、この非貫通導通穴７の上端面の穴径（Ｄ１）を、この非貫通導通穴７の下端面の穴径（Ｄ２）より大きくして上端面に広がるテーパー形状としたものである。
配線基板１の下面側から炭酸ガスレーザー加工により下方の余分の穴埋め絶縁樹脂６を除去し、非貫通導通穴７の下端から穴埋め絶縁樹脂６の下端面までの深さ（ｔ）が配線基板１の板厚のほぼ１／３〜２／３になるようにする。 Next, the non-penetrating conduction hole 7 for forming the end face electrode as shown in FIG. 4A has a hole diameter (D1) of the upper end surface of the non-penetrating conducting hole 7 below the non-penetrating conduction hole 7. The taper shape is larger than the hole diameter (D2) of the end surface and spreads to the upper end surface.
The excess hole-filling insulating resin 6 below is removed from the lower surface side of the wiring board 1 by carbon dioxide laser processing, and the depth (t) from the lower end of the non-penetrating conduction hole 7 to the lower end surface of the hole-filling insulating resin 6 is the wiring board 1. The plate thickness is set to approximately 1/3 to 2/3.

また、図４（ｂ）に示すように非貫通導通穴７の上端部の一部分の深さ（ｓ）のみを上端面の穴径（Ｄ１）が非貫通導通穴７の下端面の穴径（Ｄ２）より大きくなるようにザグリ加工したり、二段となるＴ字状の段付き穴加工しても良い。（二段穴は図示なし）   Further, as shown in FIG. 4B, only the depth (s) of a part of the upper end portion of the non-penetrating conduction hole 7 is changed so that the hole diameter (D1) of the upper end face is the hole diameter of the lower end face of the non-penetrating conduction hole 7 ( D2) Counterbore processing may be performed to be larger, or T-shaped stepped holes that are two steps may be formed. (The double hole is not shown)

上記のようにテーパー形状、二段や三段となる段付き加工してからスルーホールめっきをして穴埋め絶縁樹脂６を充填し、穴埋めされている絶縁樹脂６をはんだ付面（下面側）から炭酸ガスレーザー加工により余分の穴埋め絶縁樹脂６を除去し、非貫通導通穴７の穴内のほぼ上半部まで絶縁樹脂６が充填された状態にしたものである。
そして配線基板の上面に電子部品又は電子部品素子を実装した後、トランスファモ−ルド法の上面側から樹脂封止する際の高温高圧の樹脂封止加重に耐えうる端面電極を形成するための非貫通導通穴７とするものである。 As described above, taper-shaped, stepped into two or three steps, and then through-hole plating is performed to fill the hole-filling insulating resin 6, and the hole-filled insulating resin 6 is removed from the soldering surface (lower surface side). The excess hole-filling insulating resin 6 is removed by carbon dioxide laser processing, and the insulating resin 6 is filled up to almost the upper half of the non-penetrating conduction hole 7.
Then, after mounting an electronic component or an electronic component element on the upper surface of the wiring board, a non-electrode for forming an end face electrode capable of withstanding a high temperature and high pressure resin sealing load when resin sealing is performed from the upper surface side of the transfer mold method. The through-conduction hole 7 is used.

図５は本発明の端面電極用の非貫通導通穴を有する配線基板１にはんだペ−スト１４で電子部品１０を実装したチップ部品の断面図である。
まず、図１に示すように、非貫通導通穴７のほぼ中心線上の分割切断線１８で分割切断して端面電極９を備えた非貫通導通溝１３を形成する。
つまり図５のこの個々の配線基板１の非貫通導通溝１３を閉口させている穴埋め絶縁樹脂６は高耐熱性でるエポキシ樹脂系としたため樹脂の軟化点温度が高く、また穴埋め絶縁樹脂６の上端は個々の配線基板１の部品搭載面の上部の銅めっき導体４と同一面としたものである。 FIG. 5 is a cross-sectional view of a chip component in which the electronic component 10 is mounted on the wiring board 1 having the non-through conductive hole for the end face electrode of the present invention by the solder paste 14.
First, as shown in FIG. 1, a non-penetrating conductive groove 13 having an end face electrode 9 is formed by dividing and cutting along a dividing cutting line 18 substantially on the center line of the non-penetrating conductive hole 7.
That is, since the hole-filling insulating resin 6 closing the non-penetrating conductive grooves 13 of the individual wiring boards 1 in FIG. 5 is made of an epoxy resin system having high heat resistance, the softening point temperature of the resin is high and the upper end of the hole-filling insulating resin 6 is also high. Is the same surface as the copper-plated conductor 4 above the component mounting surface of each wiring board 1.

尚、穴埋め絶縁樹脂６の下端は貫通導通穴の下面から均一な深さで陥没してなるエポキシ樹脂系の部材である非貫通導通穴を有する配線基板とする。次に配線基板に電子部品素子、電子部品１０を実装し、この実装した電子部品１０又は電子部品素子と前記配線基板の上面全体を樹脂封止した後、樹脂封止した該非貫通導通穴の略中心の分割切断線で切断して端面電極９を備えた非貫通導通溝１３を形成する。
この非貫通導通溝１３の溝内の略下半部の穴壁面に露呈している金属導体を端面電極９として活用するモ−ルド型チップ部品とする。 The lower end of the hole-filling insulating resin 6 is a wiring board having a non-penetrating conduction hole which is an epoxy resin-based member that is depressed at a uniform depth from the lower surface of the penetrating conduction hole. Next, the electronic component element and the electronic component 10 are mounted on the wiring board, the mounted electronic component 10 or the electronic component element and the entire upper surface of the wiring board are resin-sealed, and then the non-through-conduction hole that is resin-sealed is abbreviated. A non-penetrating conductive groove 13 provided with the end face electrode 9 is formed by cutting along a central dividing line.
A mold-type chip component that utilizes the metal conductor exposed on the hole wall surface of the substantially lower half in the non-penetrating conductive groove 13 as the end face electrode 9 is used.

また配線基板の表面の金属導体パターンや下面側だけに開口している非貫通導通穴の金属導体の露呈面は接続信頼性の向上、はんだ付性の向上、ワイヤーボンデング作業等の必要性からソルダーレジストの形成やＮｉ−Ａｕ、Ｎｉ−Ａｇめっき等を行う場合もある。また、本発明の非貫通導通穴を有する配線基板はサブトラクティブ法で作製しても良い。
また、穴埋め絶縁樹脂はアクリル樹脂系の液状レジスト、ＵＶレジストや熱乾燥タイプの熱硬化樹脂を使用しても良い。 In addition, the metal conductor pattern on the surface of the wiring board and the exposed surface of the metal conductor with a non-through hole opened only on the lower surface side are necessary for improving connection reliability, solderability, wire bonding work, etc. In some cases, solder resist formation, Ni-Au, Ni-Ag plating, or the like is performed. Further, the wiring board having the non-penetrating conduction hole of the present invention may be manufactured by a subtractive method.
As the hole-filling insulating resin, an acrylic resin liquid resist, UV resist, or heat drying type thermosetting resin may be used.

そして、封止樹脂の穴埋め阻止部材である絶縁樹脂６を個々の配線基板１の下面側から炭酸ガスレーザー加工により余分の絶縁樹脂６を除去し、個々の配線基板１の非貫通導通穴７の下端から絶縁樹脂６の下端面までの深さ（ｔ）が略均一な深さ（ｔ）となるようにし、個々の配線基板１の非貫通導通穴７の下端から略均一な深さで陥没している端面電極である。
しかしトランスファモ−ルド法の高温高圧の樹脂封止加重を考慮した端面電極の設計仕様に応じ、配線基板１の板厚（また非貫通導通穴の全体厚み）の１／３〜２／３として阻止部材の絶縁樹脂６の余分の樹脂を除去し、非貫通導通穴７の絶縁樹脂６の下端面の底面が均一で平坦となるように形成することもできる。 Then, excess insulating resin 6 is removed from the lower surface side of each wiring substrate 1 by insulating carbon 6 that is a sealing resin hole filling prevention member by carbon dioxide laser processing, and non-through-conduction holes 7 of each wiring substrate 1 are removed. The depth (t) from the lower end to the lower end surface of the insulating resin 6 is made to be a substantially uniform depth (t), and is depressed at a substantially uniform depth from the lower end of the non-through-conduction hole 7 of each wiring board 1. This is an end face electrode.
However, according to the design specification of the end face electrode considering the high temperature and high pressure resin sealing load of the transfer mold method, 1/3 to 2/3 of the thickness of the wiring board 1 (and the total thickness of the non-through-conduction hole) The excess resin of the insulating resin 6 of the blocking member can be removed, and the bottom surface of the lower end surface of the insulating resin 6 of the non-penetrating conduction hole 7 can be formed to be uniform and flat.

配線基板に電子部品素子、電子部品１０を実装し、実装した電子部品素子や電子部品を樹脂封止して端面電極を有するモ−ルド型チップ部品とする際にトランスファモ−ルド法の熱や圧力に対応できる封止樹脂の侵入を阻止する部材である。
つまり貫通導通穴内に充填する穴埋め樹脂は樹脂の軟化点温度（Ｔｇ）が高く高耐熱であるほうが有利である。 When the electronic component element or electronic component 10 is mounted on a wiring board and the mounted electronic component element or electronic component is sealed with a resin to form a molded chip component having an end face electrode, It is a member that prevents intrusion of the sealing resin that can cope with pressure.
That is, it is advantageous that the filling resin filled in the through-conduction hole has a high softening point temperature (Tg) and high heat resistance.

本発明の端面電極を形成するための配線基板の断面図である。It is sectional drawing of the wiring board for forming the end surface electrode of this invention. 本発明の端面電極を形成する配線基板を説明する製造工程図。The manufacturing process figure explaining the wiring board which forms the end surface electrode of this invention. 本発明の端面電極を形成する大版の配線基板の平面図である。It is a top view of the large-sized wiring board which forms the end surface electrode of this invention. 本発明の他の実施例を説明する配線基板の断面図である。It is sectional drawing of the wiring board explaining the other Example of this invention. 本発明の配線基板に電子部品を実装したチップ部品の断面図である。It is sectional drawing of the chip component which mounted the electronic component on the wiring board of this invention.

符号の説明Explanation of symbols

１…配線基板、２…絶縁基材、４…めっき導体、５…貫通導通穴、
６…絶縁樹脂、７…非貫通導通穴、９…端面電極、１０…電子部品、
１３…非貫通導通溝、１５…封止樹脂、１８…分割切断線。 DESCRIPTION OF SYMBOLS 1 ... Wiring board, 2 ... Insulation base material, 4 ... Plating conductor, 5 ... Through conduction hole,
6 ... Insulating resin, 7 ... Non-penetrating conduction hole, 9 ... End face electrode, 10 ... Electronic component,
13 ... Non-penetrating conductive grooves, 15 ... Sealing resin, 18 ... Divided cutting lines.

Claims (5)

複数の分割切断線上に端面電極を形成するための非貫通導通穴を配置する配線基板において、
この端面電極用の非貫通導通穴は配線基板の上面導体と下面導体を電気的に接続する該非貫通導通穴のスルーホールめっきと、該非貫通導通穴の穴内の略上半部に充填された絶縁樹脂と、該非貫通導通穴の穴内の略下半部の穴壁面に露呈している金属導体と、からなる非貫通導通穴であり、
前記の穴内に充填された絶縁樹脂の下端面は該非貫通導通穴の下端から略均一な深さで陥没し、
該非貫通導通穴の上端面の穴径（Ｄ１）が該非貫通導通穴の下端面の穴径（Ｄ２）より大きいことを特徴とする端面電極を形成する配線基板。 In a wiring board that arranges non-through conductive holes for forming end face electrodes on a plurality of divided cutting lines,
The non-through conductive hole for the end face electrode is formed by through-hole plating of the non-through conductive hole for electrically connecting the upper surface conductor and the lower surface conductor of the wiring board, and insulation filled in the substantially upper half of the hole of the non-through conductive hole. A non-penetrating conduction hole comprising a resin and a metal conductor exposed on the hole wall surface of the substantially lower half in the non-penetrating conduction hole;
The lower end surface of the insulating resin filled in the hole is depressed at a substantially uniform depth from the lower end of the non-through hole ,
A wiring board for forming an end face electrode, wherein a hole diameter (D1) of an upper end surface of the non-through conductive hole is larger than a hole diameter (D2) of a lower end surface of the non-through conductive hole . 請求項１において、In claim 1,
端面電極用の非貫通導通穴は、上端面に広がるテーパー形状、上端部の一部分の深さのみを上端面の穴径が下端面の穴径より大きくなるようにした形状又は段付き穴であることを特徴とする端面電極を形成する配線基板。The non-through hole for the end face electrode is a tapered shape that extends to the upper end surface, or a stepped hole in which only the depth of a part of the upper end portion is such that the hole diameter of the upper end surface is larger than the hole diameter of the lower end surface. A wiring board on which an end face electrode is formed. 請求項１又は２において、In claim 1 or 2,
端面電極用の非貫通導通穴は、上端部の一部分の深さのみを上端面の穴径が下端面の穴径より大きくなるようにザグリ加工又は段付き穴加工することにより形成されることを特徴とする端面電極を形成する配線基板。The non-through hole for the end face electrode is formed by counterboring or stepping a hole so that only the depth of a part of the upper end portion is larger than the hole diameter of the lower end surface. A wiring board for forming a featured end face electrode. 請求項１から３の何れかにおいて、In any one of Claim 1 to 3,
端面電極用の非貫通導通穴は、非貫通導通穴内部に穴埋めされている充填部材が、配線基板下面側からレーザー加工することにより、非貫通導通穴の穴内の略上半部まで充填され、穴内に充填された絶縁樹脂の下端面が、該非貫通導通穴の下端から略均一な深さで陥没していることを特徴とする配線基板。The non-penetrating conductive hole for the end face electrode is filled up to the substantially upper half of the non-penetrating conductive hole by laser processing the filling member embedded in the non-penetrating conductive hole from the lower surface side of the wiring board, A wiring board, wherein a lower end surface of an insulating resin filled in a hole is depressed with a substantially uniform depth from a lower end of the non-through-conduction hole. 複数の分割切断線上に端面電極を形成するための非貫通導通穴を配置する大版の配線基板において、この大版の配線基板の上面に電子部品又は電子部品素子を実装し、前記の電子部品又は電子部品素子と前記配線基板の上面全体を樹脂封止した後、該非貫通導通穴の略中心の分割切断線で切断して端面電極を形成することを特徴とする請求項１から４の何れかの配線基板。 In a large-sized wiring board in which non-through conductive holes for forming end face electrodes are arranged on a plurality of divided cutting lines, an electronic component or an electronic component element is mounted on the upper surface of the large-sized wiring board, and the electronic component or after the electronic component element the entire top surface of the wiring substrate was sealed with a resin to any of claims 1, characterized in that to form a substantially center edge electrode was cut with dividing section line of the non-through conducting holes 4 or of the wiring board.
JP2004348438A 2004-12-01 2004-12-01 Wiring board for forming end face electrodes Expired - Fee Related JP4389168B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2004348438A JP4389168B2 (en) 2004-12-01 2004-12-01 Wiring board for forming end face electrodes

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2004348438A JP4389168B2 (en) 2004-12-01 2004-12-01 Wiring board for forming end face electrodes

Publications (2)

Publication Number Publication Date
JP2006156879A JP2006156879A (en) 2006-06-15
JP4389168B2 true JP4389168B2 (en) 2009-12-24

Family

ID=36634745

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2004348438A Expired - Fee Related JP4389168B2 (en) 2004-12-01 2004-12-01 Wiring board for forming end face electrodes

Country Status (1)

Country Link
JP (1) JP4389168B2 (en)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007005741A (en) * 2005-06-24 2007-01-11 Nippon Micron Kk Package for electronic component
JP2008235655A (en) * 2007-03-22 2008-10-02 Hitachi Aic Inc Substrate and method for manufacturing substrate

Also Published As

Publication number Publication date
JP2006156879A (en) 2006-06-15

Similar Documents

Publication Publication Date Title
US7028400B1 (en) Integrated circuit substrate having laser-exposed terminals
US7345888B2 (en) Component built-in wiring board and manufacturing method of component built-in wiring board
CN100561696C (en) The structure of embedded with semi-conductor chip and method for making thereof
JPH09321408A (en) High density mounting structure of electronic circuit board
KR20010104680A (en) Electronic Component Device and Method of Manufacturing the Same
KR100820633B1 (en) Printed circuit board having embedded electronic component and manufacturing method thereof
JP2008263188A (en) Circuit substrate manufacturing method
JP4184396B2 (en) Manufacturing method of wiring board with built-in electronic components
KR20200015974A (en) Printed circuit board and package substrate comprising same
KR100315588B1 (en) Manufacturing method of multilayer wiring board
JP2000114681A (en) Printed wiring board and its manufacture
JP4478870B2 (en) Wiring board and chip-type electronic component using the same
JP4389168B2 (en) Wiring board for forming end face electrodes
KR20150065029A (en) Printed circuit board, manufacturing method thereof and semiconductor package
JP3835614B2 (en) WIRING BOARD HAVING NON-THROUGH CONDUCTIVE HOLE AND ITS MANUFACTURING METHOD
CN112040629B (en) Circuit board and manufacturing method thereof
JP2000261152A (en) Printed wiring board assembly
KR100237330B1 (en) Solder ball land manufacture method of ball grid array semiconductor package type pcb and the structure include pcb to ball grid array
JP4396839B2 (en) Cavity structure printed wiring board, manufacturing method thereof, and mounting structure
US11641720B2 (en) Circuit board and manufacturing method thereof
KR100797669B1 (en) Printed Circuit Board and Fabricating Method of the same
JP3610769B2 (en) Multi-layer electronic component mounting board
JP4207654B2 (en) Printed wiring board with built-in capacitor
JP4081718B2 (en) Multilayer substrate with blind vias
KR100992664B1 (en) Method for manufacturing circuit board

Legal Events

Date Code Title Description
A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20061219

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20090416

A521 Written amendment

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20090610

TRDD Decision of grant or rejection written
A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

Effective date: 20090910

A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

A61 First payment of annual fees (during grant procedure)

Free format text: JAPANESE INTERMEDIATE CODE: A61

Effective date: 20090923

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20121016

Year of fee payment: 3

R150 Certificate of patent or registration of utility model

Free format text: JAPANESE INTERMEDIATE CODE: R150

A711 Notification of change in applicant

Free format text: JAPANESE INTERMEDIATE CODE: A711

Effective date: 20090930

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20121016

Year of fee payment: 3

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20131016

Year of fee payment: 4

S531 Written request for registration of change of domicile

Free format text: JAPANESE INTERMEDIATE CODE: R313531

S533 Written request for registration of change of name

Free format text: JAPANESE INTERMEDIATE CODE: R313533

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20131016

Year of fee payment: 4

R350 Written notification of registration of transfer

Free format text: JAPANESE INTERMEDIATE CODE: R350

LAPS Cancellation because of no payment of annual fees