JP4370616B2 - 表面実装型電子部品 - Google Patents
表面実装型電子部品 Download PDFInfo
- Publication number
- JP4370616B2 JP4370616B2 JP2003390053A JP2003390053A JP4370616B2 JP 4370616 B2 JP4370616 B2 JP 4370616B2 JP 2003390053 A JP2003390053 A JP 2003390053A JP 2003390053 A JP2003390053 A JP 2003390053A JP 4370616 B2 JP4370616 B2 JP 4370616B2
- Authority
- JP
- Japan
- Prior art keywords
- electronic component
- insulating plate
- lead terminal
- lead terminals
- circuit board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 238000007789 sealing Methods 0.000 claims description 4
- 230000001105 regulatory effect Effects 0.000 claims description 2
- 238000005452 bending Methods 0.000 claims 1
- 239000002184 metal Substances 0.000 description 11
- 230000004907 flux Effects 0.000 description 10
- 238000005476 soldering Methods 0.000 description 10
- 229910000679 solder Inorganic materials 0.000 description 9
- 239000000758 substrate Substances 0.000 description 7
- 239000000853 adhesive Substances 0.000 description 4
- 230000001070 adhesive effect Effects 0.000 description 4
- 239000000463 material Substances 0.000 description 3
- 239000011521 glass Substances 0.000 description 2
- 239000011810 insulating material Substances 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 239000010409 thin film Substances 0.000 description 2
- 238000007872 degassing Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 230000000149 penetrating effect Effects 0.000 description 1
- 239000010453 quartz Substances 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
Images
Landscapes
- Piezo-Electric Or Mechanical Vibrators, Or Delay Or Filter Circuits (AREA)
Description
2・・・リード端子
4,5・・・絶縁板
41,42・・・貫通孔
43,44・・・溝
51,52・・・切り欠き
Claims (1)
- 電気的に独立して設けられた複数のリード端子を有するベースと当該ベースを気密封止してなるキャップを有した電子部品本体と、前記電子部品本体の下面に配置される絶縁板とを具備してなり、前記電子部品本体のリード端子を前記絶縁板に沿って折り曲げ、表面実装化された状態で回路基板に搭載してなる表面実装型電子部品において、
前記絶縁板には、前記電子部品のリード端子を挿通してなる貫通孔と、この貫通孔に連続して、前記リード端子が延在する溝とが形成され、
この溝は、前記折り曲げられたリード端子を延在させたとき、上部に空隙部を有する深溝と、この溝の先端部分に前記折り曲げられたリード端子の先端部分を前記絶縁板の底面と略同一平面に位置規制する浅溝の段差部とが形成されてなることを特徴とする表面実装型電子部品。
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2003390053A JP4370616B2 (ja) | 2003-11-20 | 2003-11-20 | 表面実装型電子部品 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2003390053A JP4370616B2 (ja) | 2003-11-20 | 2003-11-20 | 表面実装型電子部品 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2005151480A JP2005151480A (ja) | 2005-06-09 |
JP4370616B2 true JP4370616B2 (ja) | 2009-11-25 |
Family
ID=34696553
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2003390053A Expired - Fee Related JP4370616B2 (ja) | 2003-11-20 | 2003-11-20 | 表面実装型電子部品 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JP4370616B2 (ja) |
-
2003
- 2003-11-20 JP JP2003390053A patent/JP4370616B2/ja not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
JP2005151480A (ja) | 2005-06-09 |
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