JP4360617B2 - 配線基板 - Google Patents
配線基板 Download PDFInfo
- Publication number
- JP4360617B2 JP4360617B2 JP2003428253A JP2003428253A JP4360617B2 JP 4360617 B2 JP4360617 B2 JP 4360617B2 JP 2003428253 A JP2003428253 A JP 2003428253A JP 2003428253 A JP2003428253 A JP 2003428253A JP 4360617 B2 JP4360617 B2 JP 4360617B2
- Authority
- JP
- Japan
- Prior art keywords
- conductor
- wiring
- insulating layer
- signal
- layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/151—Die mounting substrate
- H01L2924/1517—Multilayer substrate
- H01L2924/15172—Fan-out arrangement of the internal vias
- H01L2924/15174—Fan-out arrangement of the internal vias in different layers of the multilayer substrate
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/151—Die mounting substrate
- H01L2924/153—Connection portion
- H01L2924/1531—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface
- H01L2924/15311—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface being a ball array, e.g. BGA
Landscapes
- Production Of Multi-Layered Print Wiring Board (AREA)
- Structure Of Printed Boards (AREA)
Description
4a1:第1の配線導体
4b1:接地または電源用の導体層
4a2:第2の配線導体
Claims (3)
- 絶縁層と、
該絶縁層の一方主面にその中央部から外周部に向けて互いの間隔が拡がる領域を有する複数の第1信号用配線導体と、
前記絶縁層の前記一方主面で、且つ前記第1信号用配線導体の間の部位に、前記一方主面の外周部から中央部に向けて途中まで形成された接地用または電源用の導体層と、
前記絶縁層の他方主面にその中央部から外周部にかけて形成された第2信号用配線導体と、
を具備しており、
前記絶縁層の前記他方主面に設けられた前記第2信号用配線導体が、前記絶縁層の前記一方主面に設けられた前記導体層及び前記第1信号用配線導体と平面視して重畳しないように配置されていることを特徴とする配線基板。 - 請求項1に記載の配線基板において、
前記絶縁層の一方主面のうち、前記第2信号用配線導体に対向する部位を対向領域とすると、
前記導体層は、前記第1信号用配線導体と前記対向領域との間に、前記一方主面の外周部から中央部に向かって形成された延在部を有することを特徴とする配線基板。 - 請求項1に記載の配線基板と、
前記配線基板に搭載された電子部品と、
を具備した電子装置。
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2003428253A JP4360617B2 (ja) | 2003-12-24 | 2003-12-24 | 配線基板 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2003428253A JP4360617B2 (ja) | 2003-12-24 | 2003-12-24 | 配線基板 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2005191142A JP2005191142A (ja) | 2005-07-14 |
JP4360617B2 true JP4360617B2 (ja) | 2009-11-11 |
Family
ID=34787317
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2003428253A Expired - Fee Related JP4360617B2 (ja) | 2003-12-24 | 2003-12-24 | 配線基板 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JP4360617B2 (ja) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP5891585B2 (ja) | 2011-01-24 | 2016-03-23 | 株式会社ソシオネクスト | 半導体装置及び配線基板 |
-
2003
- 2003-12-24 JP JP2003428253A patent/JP4360617B2/ja not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
JP2005191142A (ja) | 2005-07-14 |
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