JP4353145B2 - 液滴吐出装置 - Google Patents
液滴吐出装置 Download PDFInfo
- Publication number
- JP4353145B2 JP4353145B2 JP2005189508A JP2005189508A JP4353145B2 JP 4353145 B2 JP4353145 B2 JP 4353145B2 JP 2005189508 A JP2005189508 A JP 2005189508A JP 2005189508 A JP2005189508 A JP 2005189508A JP 4353145 B2 JP4353145 B2 JP 4353145B2
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- Prior art keywords
- droplet
- droplet discharge
- droplets
- laser
- stage
- Prior art date
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- Expired - Fee Related
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- 230000003287 optical effect Effects 0.000 claims description 77
- 239000007788 liquid Substances 0.000 claims description 23
- 230000001678 irradiating effect Effects 0.000 claims description 9
- 230000001681 protective effect Effects 0.000 claims description 6
- 239000002245 particle Substances 0.000 claims description 4
- 239000000463 material Substances 0.000 claims description 2
- 238000000034 method Methods 0.000 description 39
- 230000008569 process Effects 0.000 description 27
- 238000010586 diagram Methods 0.000 description 19
- 239000002184 metal Substances 0.000 description 18
- 230000007246 mechanism Effects 0.000 description 12
- 238000001035 drying Methods 0.000 description 9
- 238000003384 imaging method Methods 0.000 description 9
- 239000002904 solvent Substances 0.000 description 9
- 239000010419 fine particle Substances 0.000 description 7
- 230000000052 comparative effect Effects 0.000 description 6
- 239000000758 substrate Substances 0.000 description 6
- 230000015572 biosynthetic process Effects 0.000 description 4
- 239000004020 conductor Substances 0.000 description 4
- 238000004519 manufacturing process Methods 0.000 description 4
- 238000007599 discharging Methods 0.000 description 3
- 238000002474 experimental method Methods 0.000 description 3
- 238000000059 patterning Methods 0.000 description 3
- 230000009467 reduction Effects 0.000 description 3
- 230000007261 regionalization Effects 0.000 description 3
- 230000009471 action Effects 0.000 description 2
- 238000003491 array Methods 0.000 description 2
- 238000012790 confirmation Methods 0.000 description 2
- 238000005401 electroluminescence Methods 0.000 description 2
- 238000010304 firing Methods 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- 238000002955 isolation Methods 0.000 description 2
- 238000005192 partition Methods 0.000 description 2
- 229920005989 resin Polymers 0.000 description 2
- 239000011347 resin Substances 0.000 description 2
- 238000005245 sintering Methods 0.000 description 2
- 239000012620 biological material Substances 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 238000001962 electrophoresis Methods 0.000 description 1
- 238000001704 evaporation Methods 0.000 description 1
- 230000002452 interceptive effect Effects 0.000 description 1
- 239000004973 liquid crystal related substance Substances 0.000 description 1
- 229920002120 photoresistant polymer Polymers 0.000 description 1
- 102000004169 proteins and genes Human genes 0.000 description 1
- 108090000623 proteins and genes Proteins 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 238000003892 spreading Methods 0.000 description 1
- 230000007480 spreading Effects 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 229920001187 thermosetting polymer Polymers 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
- 238000009736 wetting Methods 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
- H05K3/1241—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by ink-jet printing or drawing by dispensing
- H05K3/125—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by ink-jet printing or drawing by dispensing by ink-jet printing
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J11/00—Devices or arrangements of selective printing mechanisms, e.g. ink-jet printers or thermal printers, for supporting or handling copy material in sheet or web form
- B41J11/0015—Devices or arrangements of selective printing mechanisms, e.g. ink-jet printers or thermal printers, for supporting or handling copy material in sheet or web form for treating before, during or after printing or for uniform coating or laminating the copy material before or after printing
- B41J11/002—Curing or drying the ink on the copy materials, e.g. by heating or irradiating
- B41J11/0021—Curing or drying the ink on the copy materials, e.g. by heating or irradiating using irradiation
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/0002—Lithographic processes using patterning methods other than those involving the exposure to radiation, e.g. by stamping
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/20—Exposure; Apparatus therefor
- G03F7/2002—Exposure; Apparatus therefor with visible light or UV light, through an original having an opaque pattern on a transparent support, e.g. film printing, projection printing; by reflection of visible or UV light from an original such as a printed image
- G03F7/2014—Contact or film exposure of light sensitive plates such as lithographic plates or circuit boards, e.g. in a vacuum frame
- G03F7/2016—Contact mask being integral part of the photosensitive element and subject to destructive removal during post-exposure processing
- G03F7/2018—Masking pattern obtained by selective application of an ink or a toner, e.g. ink jet printing
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/28—Manufacture of electrodes on semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/268
- H01L21/283—Deposition of conductive or insulating materials for electrodes conducting electric current
- H01L21/288—Deposition of conductive or insulating materials for electrodes conducting electric current from a liquid, e.g. electrolytic deposition
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
- H01L21/768—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics
- H01L21/76838—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics characterised by the formation and the after-treatment of the conductors
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
- H05K3/1283—After-treatment of the printed patterns, e.g. sintering or curing methods
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
- H05K3/1283—After-treatment of the printed patterns, e.g. sintering or curing methods
- H05K3/1291—Firing or sintering at relative high temperatures for patterns on inorganic boards, e.g. co-firing of circuits on green ceramic sheets
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
- H10K71/60—Forming conductive regions or layers, e.g. electrodes
- H10K71/611—Forming conductive regions or layers, e.g. electrodes using printing deposition, e.g. ink jet printing
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/10—Using electric, magnetic and electromagnetic fields; Using laser light
- H05K2203/107—Using laser light
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- General Physics & Mathematics (AREA)
- Physics & Mathematics (AREA)
- Power Engineering (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Computer Hardware Design (AREA)
- Ceramic Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Inorganic Chemistry (AREA)
- Health & Medical Sciences (AREA)
- General Health & Medical Sciences (AREA)
- Toxicology (AREA)
- Coating Apparatus (AREA)
- Manufacturing Of Printed Wiring (AREA)
- Application Of Or Painting With Fluid Materials (AREA)
Description
2 基台(防振台)
2a ブリッジ
3 描画系
4 光学系
4a,4b,4c 第1〜第3の光路
5 撮像系
31 液滴吐出ヘッド
32 キャリッジ
33 キャリッジ用θ方向回転体
33 ゴニオステージ
34 キャリッジ用Z軸方向移動体
35 キャリッジ用フィード方向移動体
3a ステージ
3b ステージ用θ方向回転体
3c ステージ用フィード方向移動体
3d ステージ用スキャン方向移動体
40 レーザ光源
51 第1のCCDカメラ(第1の電子カメラ)
52 第1のCCDカメラ用Z軸方向移動体
53 第2のCCDカメラ(第2の電子カメラ)
55 仕切り
56 ビームディフューザ
60 制御部
D 液滴
P 配線パターン
S レーザスポット
Claims (5)
- 基台と、
機能液を液滴にして吐出する液滴吐出ヘッドと、前記液滴吐出ヘッドを保持するキャリッジと、前記液滴が描画されるワークを保持するステージと、
レーザ光を出力する光源と、
_前記液滴吐出ヘッドを覆う保護カバーと、
を有し、
_前記レーザ光は、前記ステージに対して平行な方向から前記液滴に照射され、
_前記保護カバーに前記レーザ光を照射することによって、前記レーザ光の光路を調整することを特徴とする液滴吐出装置。 - 前記基台上に設けられ、前記ワークと前記液滴の着弾位置のアライメントをとるための第1のカメラと、前記液滴の着弾位置と前記レーザ光のレーザスポットのアライメントをとるための第2のカメラと、を有することを特徴とする請求項1記載の液滴吐出装置。
- 前記キャリッジ及び前記液滴吐出ヘッドは前記基台に対して位置が固定され、前記ステージが移動して描画を行うことを特徴とする請求項1記載の液滴吐出装置。
- 前記機能液は電気的素子、光学的素子又は電気光学的素子の材料を含み、
前記液滴を前記ワーク上に吐出して所定のパターンを描画し、前記液滴に前記レーザ光を照射することによりパターンを定着させることを特徴とする請求項1記載の液滴吐出装置。 - 前記機能液は導電性粒子を含み、
前記液滴を前記ワーク上に吐出して所定のパターンを描画し、前記液滴に前記レーザ光を照射することにより該液滴を乾燥し前記導電性粒子を焼結させて配線パターンを形成することを特徴とする請求項1記載の液滴吐出装置。
Priority Applications (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2005189508A JP4353145B2 (ja) | 2005-06-29 | 2005-06-29 | 液滴吐出装置 |
US11/421,545 US7726803B2 (en) | 2005-06-29 | 2006-06-01 | Droplet ejection apparatus |
TW095122948A TWI301800B (en) | 2005-06-29 | 2006-06-26 | Droplet ejection apparatus |
KR1020060058018A KR100786211B1 (ko) | 2005-06-29 | 2006-06-27 | 액적 토출 장치 |
CN2006100956985A CN1891461B (zh) | 2005-06-29 | 2006-06-29 | 液滴喷出装置 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2005189508A JP4353145B2 (ja) | 2005-06-29 | 2005-06-29 | 液滴吐出装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2007007522A JP2007007522A (ja) | 2007-01-18 |
JP4353145B2 true JP4353145B2 (ja) | 2009-10-28 |
Family
ID=37588941
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2005189508A Expired - Fee Related JP4353145B2 (ja) | 2005-06-29 | 2005-06-29 | 液滴吐出装置 |
Country Status (5)
Country | Link |
---|---|
US (1) | US7726803B2 (ja) |
JP (1) | JP4353145B2 (ja) |
KR (1) | KR100786211B1 (ja) |
CN (1) | CN1891461B (ja) |
TW (1) | TWI301800B (ja) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2013063371A (ja) * | 2011-09-15 | 2013-04-11 | Ricoh Co Ltd | 薄膜製造装置のアライメント調整方法、薄膜製造装置、該薄膜製造装置により製造した電気機械変換膜、電気機械変換素子、液滴吐出ヘッド及び液滴吐出装置 |
US8833921B2 (en) | 2010-07-30 | 2014-09-16 | Ricoh Company, Limited | Thin-film forming apparatus, thin-film forming method, piezoelectric-element forming method, droplet discharging head, and ink-jet recording apparatus |
Families Citing this family (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4442677B2 (ja) * | 2007-10-11 | 2010-03-31 | セイコーエプソン株式会社 | 液滴吐出装置の液滴乾燥方法及び液滴吐出装置 |
CN102407665B (zh) * | 2010-07-30 | 2015-03-04 | 株式会社理光 | 薄膜形成设备及方法、压电元件形成方法、排放头和设备 |
US10611136B2 (en) * | 2014-07-13 | 2020-04-07 | Stratasys Ltd. | Method and system for rotational 3D printing |
JP6390407B2 (ja) * | 2014-12-16 | 2018-09-19 | 富士ゼロックス株式会社 | 乾燥装置、画像形成装置、及び乾燥プログラム |
NL2016137B1 (en) * | 2016-01-21 | 2017-07-25 | Meyer Burger (Netherlands) B V | Inkjet printing system and method for processing substrates. |
CN111822256A (zh) * | 2020-07-30 | 2020-10-27 | 重庆盛泰光电有限公司 | 基于转盘的摄像头模组点胶*** |
Family Cites Families (16)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5132248A (en) | 1988-05-31 | 1992-07-21 | The United States Of America As Represented By The United States Department Of Energy | Direct write with microelectronic circuit fabrication |
GB2233928B (en) * | 1989-05-23 | 1992-12-23 | Brother Ind Ltd | Apparatus and method for forming three-dimensional article |
EP1223615A1 (en) | 2001-01-10 | 2002-07-17 | Eidgenössische Technische Hochschule Zürich | A method for producing a structure using nanoparticles |
GB2379413A (en) | 2001-09-10 | 2003-03-12 | Seiko Epson Corp | Printhead alignment method |
JP2003318193A (ja) | 2002-04-22 | 2003-11-07 | Seiko Epson Corp | デバイス、その製造方法及び電子装置 |
JP2003326691A (ja) | 2002-05-09 | 2003-11-19 | Konica Minolta Holdings Inc | 画像記録方法、エネルギー線硬化インク及び画像記録装置 |
JP4741192B2 (ja) * | 2003-01-17 | 2011-08-03 | 株式会社半導体エネルギー研究所 | 半導体装置の作製方法 |
JP4225076B2 (ja) * | 2003-02-19 | 2009-02-18 | セイコーエプソン株式会社 | 液滴吐出装置 |
JP4244382B2 (ja) * | 2003-02-26 | 2009-03-25 | セイコーエプソン株式会社 | 機能性材料定着方法及びデバイス製造方法 |
JP2004337709A (ja) * | 2003-05-14 | 2004-12-02 | Seiko Epson Corp | 液滴吐出装置、カラーフィルター製造装置、カラーフィルター及びその製造方法、液晶装置、電子機器 |
JP4232541B2 (ja) * | 2003-06-04 | 2009-03-04 | セイコーエプソン株式会社 | マイクロレンズ装置の製造方法 |
JP2005040665A (ja) | 2003-07-23 | 2005-02-17 | Fuji Photo Film Co Ltd | パターン形成方法およびパターン形成装置 |
JP2005081159A (ja) * | 2003-09-04 | 2005-03-31 | Ricoh Co Ltd | 機能性基体製造装置ならびに製造される機能性基体 |
JP3941066B2 (ja) | 2003-09-11 | 2007-07-04 | 俊次 村野 | ライン状均一吐出装置、霧化装置、薄膜形成装置、パターン形成装置、三次元造形装置および洗浄装置。 |
JP2006035184A (ja) | 2004-07-30 | 2006-02-09 | Seiko Epson Corp | 液滴塗布方法と液滴塗布装置及び電気光学装置並びに電子機器 |
JP4715147B2 (ja) | 2004-09-28 | 2011-07-06 | セイコーエプソン株式会社 | 導電膜の形成方法 |
-
2005
- 2005-06-29 JP JP2005189508A patent/JP4353145B2/ja not_active Expired - Fee Related
-
2006
- 2006-06-01 US US11/421,545 patent/US7726803B2/en not_active Expired - Fee Related
- 2006-06-26 TW TW095122948A patent/TWI301800B/zh not_active IP Right Cessation
- 2006-06-27 KR KR1020060058018A patent/KR100786211B1/ko not_active IP Right Cessation
- 2006-06-29 CN CN2006100956985A patent/CN1891461B/zh not_active Expired - Fee Related
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US8833921B2 (en) | 2010-07-30 | 2014-09-16 | Ricoh Company, Limited | Thin-film forming apparatus, thin-film forming method, piezoelectric-element forming method, droplet discharging head, and ink-jet recording apparatus |
JP2013063371A (ja) * | 2011-09-15 | 2013-04-11 | Ricoh Co Ltd | 薄膜製造装置のアライメント調整方法、薄膜製造装置、該薄膜製造装置により製造した電気機械変換膜、電気機械変換素子、液滴吐出ヘッド及び液滴吐出装置 |
Also Published As
Publication number | Publication date |
---|---|
JP2007007522A (ja) | 2007-01-18 |
US7726803B2 (en) | 2010-06-01 |
CN1891461A (zh) | 2007-01-10 |
US20070002114A1 (en) | 2007-01-04 |
TW200706381A (en) | 2007-02-16 |
TWI301800B (en) | 2008-10-11 |
KR20070001805A (ko) | 2007-01-04 |
CN1891461B (zh) | 2010-12-08 |
KR100786211B1 (ko) | 2007-12-17 |
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