JP4339753B2 - Thermal spacer - Google Patents

Thermal spacer Download PDF

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JP4339753B2
JP4339753B2 JP2004194126A JP2004194126A JP4339753B2 JP 4339753 B2 JP4339753 B2 JP 4339753B2 JP 2004194126 A JP2004194126 A JP 2004194126A JP 2004194126 A JP2004194126 A JP 2004194126A JP 4339753 B2 JP4339753 B2 JP 4339753B2
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heat
spacer
elastic material
heat conducting
heat conductive
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JP2006019403A (en
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良昭 柳瀬
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Kitagawa Industries Co Ltd
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Kitagawa Industries Co Ltd
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
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    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Description

本発明は、熱伝導スペーサの技術分野に属する。   The present invention belongs to the technical field of thermally conductive spacers.

パソコン等の電子機器においては、例えばＣＰＵ等の発熱するデバイスには放熱のためにヒートシンクが取り付けられている。このヒートシンクの熱を筐体に直接伝えて筐体外に放出させれば、筐体に冷却用のスリット等を設けなくてもよくなる。   In an electronic device such as a personal computer, a heat sink is attached to a heat generating device such as a CPU for heat dissipation. If the heat of the heat sink is directly transmitted to the casing and released from the casing, it is not necessary to provide a cooling slit or the like in the casing.

ヒートシンクの熱を筐体に直接伝えるために、例えば特開平１１−８７５７８号公報（特許文献１）に開示されるような熱伝導パッドを用いる方法がある。
特開平１１−８７５７８号公報 In order to directly transfer the heat of the heat sink to the housing, there is a method using a heat conductive pad as disclosed in, for example, Japanese Patent Application Laid-Open No. 11-87578 (Patent Document 1).
JP-A-11-87578

しかしながら、特許文献１に開示されるような熱伝導パッドは、最大厚みが４ｍｍ程度であるので、ヒートシンクと筐体との隙間が大きいと対応しきれないという問題があった。このような熱伝導パッドを取付ける際の作業性も、位置決めや固定の面からあまりよいとは言えなかった。また、熱伝導パッドを挟み込まなければ密着させられないので、熱伝導パッドの上下に筐体とヒートシンクが配置される必要があった。   However, the heat conduction pad disclosed in Patent Document 1 has a maximum thickness of about 4 mm, and thus has a problem that it cannot be handled if the gap between the heat sink and the housing is large. The workability at the time of attaching such a heat conductive pad was not so good in terms of positioning and fixing. In addition, since the heat conduction pad cannot be brought into close contact unless it is sandwiched, a housing and a heat sink have to be disposed above and below the heat conduction pad.

請求項１記載の熱伝導スペーサは、
第１物体と第２物体間に介装される熱伝導スペーサであって、
少なくとも２平面を有する熱伝導剛性材と、
前記２平面それぞれに接触配置される熱伝導弾性材と、
前記熱伝導弾性材を貫通して前記熱伝導剛性材の前記２平面の少なくとも一方に立設された挟持手段と
を備えることを特徴とする。 The heat conducting spacer according to claim 1 is:
A thermally conductive spacer interposed between the first object and the second object,
A thermally conductive rigid material having at least two planes;
A heat conducting elastic material disposed in contact with each of the two planes;
And sandwiching means that are provided upright on at least one of the two planes of the heat conductive rigid material through the heat conductive elastic material.

この熱伝導スペーサでは、熱伝導の経路は熱伝導弾性材と熱伝導剛性材とによって構成される。
熱伝導弾性材は弾性の熱伝導材（例えばシリコーンゴム、有機合成ゴム、ＥＰＤＭ（エチレン、プロピレン及び少量のジエンモノマーを構成単位とする三元共重合体）、フッ素ゴム、フッ素アロイゴム）からなり、第１物体を接触させるための第１伝導面及び第２物体を接触させるための第２伝導面を形成する。第１伝導面及び第２伝導面は各々第１物体、第２物体の表面形状に対応させるのが望ましく、通常は平面とされる（熱伝導弾性材としては板状にされる）。 In this heat conducting spacer, the heat conducting path is constituted by a heat conducting elastic material and a heat conducting rigid material.
The heat conductive elastic material is made of an elastic heat conductive material (for example, silicone rubber, organic synthetic rubber, EPDM (terpolymer having ethylene, propylene and a small amount of diene monomer), fluorine rubber, fluorine alloy rubber). A first conductive surface for contacting the first object and a second conductive surface for contacting the second object are formed. The first conductive surface and the second conductive surface are preferably made to correspond to the surface shapes of the first object and the second object, respectively, and are usually flat (the heat conductive elastic material is plate-shaped).

熱伝導弾性材は、第１伝導面を形成する部分と第２伝導面を形成する部分とで分かれていてもよいし、一連であってもよい。
熱伝導弾性材を構成する熱伝導材は弾性を有していれば（できるだけ熱伝導率が高いことが望ましいのは当然として）、特に制限はない。但し、入手し易さや加工性等を考慮するとシリコーンゴムが好ましい。 The heat conductive elastic material may be divided into a part forming the first conductive surface and a part forming the second conductive surface, or may be a series.
If the heat conductive material which comprises a heat conductive elastic material has elasticity (it is natural that it is desirable for heat conductivity to be as high as possible), there will be no restriction | limiting in particular. However, silicone rubber is preferable in consideration of availability and processability.

熱伝導剛性材は少なくとも２平面を有しており、熱伝導弾性材がその２平面に接触配置される。熱伝導弾性材との接触面は熱伝導効率を良好にするために、板状の熱伝導弾性材に対応して平面とされる。そのために、熱伝導剛性材は請求項５に記載のように直方体状にするとよい。   The heat conducting rigid material has at least two planes, and the heat conducting elastic material is disposed in contact with the two planes. The contact surface with the heat conductive elastic material is flat to correspond to the plate-shaped heat conductive elastic material in order to improve the heat transfer efficiency. For this purpose, the heat conductive rigid member may be formed in a rectangular parallelepiped shape as described in claim 5.

熱伝導剛性材を構成する熱伝導材は剛性でありさえすれば（できるだけ熱伝導率が高いことが望ましいのは当然として）、特に制限はない。但し、入手し易さや加工性等を考慮すると金属（すなわち、請求項４記載の構成）、特にアルミニウム、金、銀、銅等が好ましい。コストを考慮した場合、これらの中でもアルミニウムと銅が好ましい。   The heat conductive material constituting the heat conductive rigid material is not particularly limited as long as it is rigid (it is desirable that the heat conductivity be as high as possible). However, in view of availability, workability, and the like, metals (that is, the configuration described in claim 4), particularly aluminum, gold, silver, copper, and the like are preferable. Among these, aluminum and copper are preferable in view of cost.

熱伝導剛性材の熱伝導弾性材との接触面を互いに平行な２面にすれば、熱伝導弾性材／熱伝導弾性材／熱伝導弾性材の層構造になる。その層構造の片面の熱伝導弾性材を第１物体を接触させ、他面の熱伝導弾性材を第２物体を接触させれば、第１物体から第２物体へと（又はこの逆に）熱を伝導させることができる。   If the contact surfaces of the heat conductive rigid material with the heat conductive elastic material are two parallel surfaces, a layer structure of heat conductive elastic material / heat conductive elastic material / heat conductive elastic material is obtained. When the first object is brought into contact with the heat conducting elastic material on one side of the layer structure and the second object is brought into contact with the heat conducting elastic material on the other side, the first object is moved to the second object (or vice versa). Heat can be conducted.

そして、挟持手段にて第１物体又は第２物体を熱伝導弾性材共々熱伝導剛性材の一方の平面との間に挟持するので、上述の熱伝導が良好になる。挟持手段による第１物体又は２物体の挟持は、熱伝導スペーサの取り付けにもなる。   And since a 1st object or a 2nd object is clamped between one surface of a heat conductive rigid material together with a heat conductive elastic material by a clamping means, the above-mentioned heat conduction becomes favorable. The sandwiching of the first object or the two objects by the sandwiching means also attaches the heat conducting spacer.

挟持手段を２平面の一方だけに立設した場合、第１物体又は２物体の内で挟持されない方とは熱伝導弾性材との接触だけとなるが、熱伝導スペーサは挟持手段によって他方に取り付けられているから、互いの位置がずれたりするおそれはない。この構成は第１物体と２物体の一方が発熱素子（例えばＣＰＵ）で他方が筐体である場合に適している。   When the clamping means is erected only on one of the two planes, the one that is not clamped in the first object or the two objects is only in contact with the heat conducting elastic material, but the heat conducting spacer is attached to the other by the clamping means. Therefore, there is no possibility that the positions of each other shift. This configuration is suitable when one of the first object and the two objects is a heating element (for example, a CPU) and the other is a casing.

また、請求項２に記載のように、挟持手段を２平面それぞれに１以上立設することもできる。この場合は、第１の挟持手段にて第１物体を上述のように挟持し、第２の挟持手段にて第２物体を熱伝導弾性材共々熱伝導剛性材の他方の平面との間に挟持するので、上述の熱伝導が良好になる。また、２つの挟持手段による第１、２物体の挟持は、熱伝導スペーサを第１、２物体に取り付けることにもなる。構成は第１物体と２物体の一方がヒートシンク、他方が筐体である場合に適している。   Further, as described in claim 2, one or more clamping means can be erected on each of two planes. In this case, the first object is held by the first holding means as described above, and the second object is held by the second holding means between the heat conduction elastic material and the other plane of the heat conduction rigid material. Since it pinches, the above-mentioned heat conduction becomes favorable. In addition, holding the first and second objects by the two holding means also attaches the heat conducting spacer to the first and second objects. The configuration is suitable when one of the first object and the second object is a heat sink and the other is a housing.

熱伝導弾性材の厚みが４ｍｍ程度を上限にするとしても、熱伝導剛性材の厚みは制約されないので、第１物体と第２物体（例えばヒートシンクと筐体）との隙間が大きくても確実に対応できる。   Even if the thickness of the heat conduction elastic material is about 4 mm, the thickness of the heat conduction rigid material is not limited. Therefore, even if the gap between the first object and the second object (for example, the heat sink and the housing) is large, it is ensured. Yes.

熱伝導剛性材の熱伝導弾性材との接触面を互いに垂直な２面（例えば直方体の隣り合う２面）にすれば、第１物体と第２物体（例えばヒートシンクと筐体）の表面が垂直になる場合に適用できる。この場合も、第１物体に接触させた熱伝導弾性材（第１伝導面）〜熱伝導剛性材〜第２物体に接触させた熱伝導弾性材（第１伝導面）の経路で、第１物体から第２物体へと（又はこの逆に）熱を伝導させることができ、熱伝導弾性材の厚みが４ｍｍ程度を上限にするとしても、熱伝導剛性材の寸法は制約されないので、第１物体と第２物体（例えばヒートシンクと筐体）との隙間が大きくても確実に対応できる。   If the contact surfaces of the heat conductive rigid material and the heat conductive elastic material are two surfaces that are perpendicular to each other (for example, two adjacent surfaces of a rectangular parallelepiped), the surfaces of the first object and the second object (for example, the heat sink and the housing) are vertical. Applicable when Also in this case, the path from the heat conductive elastic material (first conductive surface) brought into contact with the first object to the heat conductive rigid material to the heat conductive elastic material (first conductive surface) brought into contact with the second object is the first. Since heat can be conducted from the object to the second object (or vice versa) and the thickness of the heat conducting elastic material is limited to about 4 mm, the size of the heat conducting rigid material is not limited. Even if the gap between the object and the second object (for example, the heat sink and the housing) is large, the object can be reliably handled.

請求項５記載のように熱伝導剛性材を直方体状にすれば、その２面（平行な２面でも垂直な２面でも）に熱伝導弾性材を被着するのに適している。
また、請求項６記載のように、前記熱伝導剛性材の前記熱伝導弾性材で覆われない部分に放熱フィンを設ければ、熱伝導スペーサ（熱伝導剛性材）自体が放熱部品としても機能するので、例えばヒートシンクからの放熱効率が向上する。 If the heat conductive rigid material is formed in a rectangular parallelepiped shape as described in claim 5, it is suitable for depositing the heat conductive elastic material on its two surfaces (whether two parallel surfaces or two vertical surfaces).
Further, as described in claim 6, if a heat radiation fin is provided in a portion of the heat conduction rigid material that is not covered with the heat conduction elastic material, the heat conduction spacer (heat conduction rigid material) itself also functions as a heat radiation component. Therefore, for example, the heat dissipation efficiency from the heat sink is improved.

熱伝導スペーサの取付けは、上述したように２つの挟持手段による第１、２物体の挟持によるので、作業性は良好になる。
その際に、第１、２物体の被挟持部分の板厚に応じて熱伝導弾性材の厚みを変更すれば、第１挟持手段及び第２挟持手段による挟持を確実に行える。 As described above, the heat conductive spacer is attached by holding the first and second objects by the two holding means, so that the workability is improved.
At that time, if the thickness of the heat conducting elastic material is changed in accordance with the thickness of the sandwiched portion of the first and second objects, the first and second clamping means can be securely held.

請求項３記載のように、挟持手段を合成樹脂製のスナップにすれば、第１物体、第２物体それぞれに設けられたスナップのための穴を用いてスナップを装着するだけで熱伝導スペーサを取付けできるから、作業性はさらに良好になる。   If the holding means is made of a synthetic resin snap as described in claim 3, the heat conducting spacer can be attached only by mounting the snap using the snap holes provided in each of the first object and the second object. Since it can be attached, workability is further improved.

挟持手段を合成樹脂製のスナップとする場合には、請求項３記載の通り、インサート成形にて熱伝導剛性材と一体化すればよい。
スナップの材質はインサート成形での成形性、材料強度、コスト等を考慮して適宜選択すればよく、例えばナイロン６、ナイロン６６が好適である。 When the holding means is a synthetic resin snap, as described in claim 3, it may be integrated with the heat conductive rigid material by insert molding.
The material of the snap may be appropriately selected in consideration of moldability in insert molding, material strength, cost, and the like. For example, nylon 6 and nylon 66 are suitable.

次に、本発明の実施例等により発明の実施の形態を説明する。なお、本発明は下記の実施例等に限定されるものではなく、本発明の要旨を逸脱しない範囲でさまざまに実施できることは言うまでもない。
［実施例１］
図１に示すように、本実施例の熱伝導スペーサ１０は、アルミニウム製の熱伝導剛性材１２、ナイロン製の取付部材１４及び２枚のシリコーンゴム製の熱伝導弾性材１６にて構成されている。 Next, embodiments of the present invention will be described based on examples of the present invention. The present invention is not limited to the following examples and the like, and it goes without saying that the present invention can be implemented in various ways without departing from the gist of the present invention.
[Example 1]
As shown in FIG. 1, the heat conductive spacer 10 of this embodiment is composed of a heat conductive rigid material 12 made of aluminum, a mounting member 14 made of nylon, and two heat conductive elastic materials 16 made of silicone rubber. Yes.

熱伝導剛性材１２は外形が直方体状で、対向状に対をなす１組の面がそれぞれ熱伝導弾性材１６の装着面１７、１８とされる。また熱伝導剛性材１２の内部には、装着面１７から装着面１８にわたって貫通する第１充填孔１９と、これに直交して連通して熱伝導剛性材１２を貫通する第２充填孔２０とが設けられている。第１充填孔１９、第２充填孔２０とも、開口部分１９ａ、２０ａは内部よりも口径が大きい。   The heat conducting rigid material 12 has a rectangular parallelepiped shape, and a pair of opposing faces form mounting surfaces 17 and 18 for the heat conducting elastic material 16, respectively. Further, in the inside of the heat conduction rigid member 12, a first filling hole 19 penetrating from the attachment surface 17 to the attachment surface 18, and a second filling hole 20 communicating perpendicularly to the heat conduction rigid member 12 and passing through the heat conduction rigid member 12 are provided. Is provided. In both the first filling hole 19 and the second filling hole 20, the opening portions 19a and 20a have a larger diameter than the inside.

取付部材１４には、インサート成形にて第１充填孔１９及び第２充填孔２０内に充填された充填部２２があり、これにより熱伝導剛性材１２と一体化されている。第１充填孔１９と第２充填孔２０とが互いに直交していること、支柱部２３の基部２３ａが開口部分１９ａに充填されていること及び開口部分２０ａに充填された樹脂にて鍔部２４が形成されていることにより、取付部材１４と熱伝導剛性材１２との相対位置が固定されている（ずれやぐらつきは生じない）。   The attachment member 14 has a filling portion 22 filled in the first filling hole 19 and the second filling hole 20 by insert molding, and is thereby integrated with the heat conduction rigid material 12. The first filling hole 19 and the second filling hole 20 are orthogonal to each other, the base portion 23a of the column portion 23 is filled in the opening portion 19a, and the flange portion 24 is made of resin filled in the opening portion 20a. As a result, the relative position between the mounting member 14 and the heat conduction rigid member 12 is fixed (no deviation or wobble occurs).

取付部材１４の一部は熱伝導剛性材１２の装着面１７、１８からそれぞれ突出しており、その部分にはそれぞれスナップ２５、２６（挟持手段）が設けられている。詳しくは、スナップ２５は支柱部２３と支柱部２３の頭部から対をなして延出された弾性片２７とによって構成され、スナップ２６も同様に支柱部２３と弾性片２８とによって構成される。弾性片２７、２８は支柱部２３との連結部分を支点として、図示の位置から支柱部２３に近づく側に弾性変形し、また該変形から図示の位置へと弾性復帰できる。弾性片２７、２８の先端部には突起２７ａ、２８ａが設けられており、これに隣接して圧接面２７ｂ、２８ｂが形成されている。圧接面２７ｂ、２８ｂは突起２７ａ、２８ａ側で熱伝導弾性材１６（装着面１７、１８）との間隔が小さく、外縁側で同間隔が大きくなる傾斜面である。   A part of the mounting member 14 protrudes from the mounting surfaces 17 and 18 of the heat conductive rigid member 12, respectively, and snaps 25 and 26 (clamping means) are provided at the portions. Specifically, the snap 25 is constituted by a support portion 23 and an elastic piece 27 extending in a pair from the head portion of the support portion 23, and the snap 26 is similarly constituted by the support portion 23 and the elastic piece 28. . The elastic pieces 27 and 28 are elastically deformed from the position shown in the drawing to the side closer to the pillar portion 23 with the connecting portion with the column portion 23 as a fulcrum, and can be elastically returned from the deformation to the position shown in the drawing. Protrusions 27a and 28a are provided at the tip portions of the elastic pieces 27 and 28, and press contact surfaces 27b and 28b are formed adjacent to the protrusions 27a and 28a. The pressure contact surfaces 27b and 28b are inclined surfaces in which the distance from the heat conductive elastic material 16 (mounting surfaces 17 and 18) is small on the protrusions 27a and 28a side and the same distance is large on the outer edge side.

熱伝導弾性材１６は、熱伝導剛性材１２の装着面１７、１８の輪郭に整合する四角形（本例では正方形）の板体である。熱伝導弾性材１６の中央部には取付部材１４の支柱部２３に対応した穴が設けられており、この穴にスナップ２５（又はスナップ２６）をくぐらせるようにして熱伝導剛性材１２の装着面１７、１８に取り付けられている。   The heat conducting elastic material 16 is a quadrangular (square in this example) plate that matches the contours of the mounting surfaces 17 and 18 of the heat conducting rigid material 12. A hole corresponding to the column portion 23 of the mounting member 14 is provided in the center of the heat conductive elastic material 16, and the heat conductive rigid material 12 is mounted so that the snap 25 (or the snap 26) passes through the hole. Attached to the surfaces 17 and 18.

熱伝導スペーサ１０は、図２に示すように例えばヒートシンク３１（第１物体）と筐体３２（第２物体）とに取り付けられる。
ヒートシンク３１及び筐体３２には、スペーサ取付穴３１ａ、３２ａが設けられている。 As shown in FIG. 2, the heat conducting spacer 10 is attached to, for example, a heat sink 31 (first object) and a housing 32 (second object).
Spacers mounting holes 31 a and 32 a are provided in the heat sink 31 and the housing 32.

筐体３２のスペーサ取付穴３２ａをスナップ２５に合わせて、筐体３２を図中Ｘで示す方向に沿って熱伝導スペーサ１０に近づけると（又は熱伝導スペーサ１０を筐体３２に近づけると）、スペーサ取付穴３２ａの内周が弾性片２７に接触する。さらに筐体３２（又は熱伝導スペーサ１０）を同方向に移動させると、スペーサ取付穴３２ａの内周から及ぼされる力によって弾性片２７が支柱部２３側に弾性変形する（図中、２点差線で表示）。スペーサ取付穴３２ａの内周面が弾性片２７の圧接面２７ｂの外縁を通過すると、弾性片２７が弾性復帰する。但し、この弾性復帰は突起２７ａがスペーサ取付穴３２ａの内周に当たる位置までに規制される。これにより、筐体３２は熱伝導弾性材１６とスナップ２５の弾性片２７との間に保持される。   When the spacer mounting hole 32a of the housing 32 is aligned with the snap 25 and the housing 32 is brought closer to the heat conducting spacer 10 along the direction indicated by X in the figure (or the heat conducting spacer 10 is brought closer to the housing 32), The inner periphery of the spacer mounting hole 32 a contacts the elastic piece 27. Further, when the casing 32 (or the heat conducting spacer 10) is moved in the same direction, the elastic piece 27 is elastically deformed to the column portion 23 side by the force exerted from the inner periphery of the spacer mounting hole 32a (in the figure, two-dot chain line). Display). When the inner peripheral surface of the spacer mounting hole 32a passes the outer edge of the pressure contact surface 27b of the elastic piece 27, the elastic piece 27 is elastically restored. However, this elastic return is restricted to a position where the projection 27a hits the inner periphery of the spacer mounting hole 32a. Accordingly, the housing 32 is held between the heat conducting elastic material 16 and the elastic piece 27 of the snap 25.

このとき圧接面２７ｂが上述の通りの傾斜面であるために、圧接面２７ｂと筐体３２との間には、筐体３２を熱伝導弾性材１６（装着面１７）に押し着ける力が発生する。これにより熱伝導弾性材１６が圧縮され、その反発力により筐体３２と熱伝導弾性材１６とが密着状態になる。また、熱伝導弾性材１６と装着面１７とも密着状態になる。この熱伝導弾性材１６弾性反発に由来する力で、筐体３２は熱伝導弾性材１６とスナップ２５との間に挟持される。   At this time, since the pressure contact surface 27b is an inclined surface as described above, a force is generated between the pressure contact surface 27b and the housing 32 to press the housing 32 against the heat conducting elastic material 16 (mounting surface 17). To do. Thereby, the heat conductive elastic material 16 is compressed, and the casing 32 and the heat conductive elastic material 16 are brought into a close contact state by the repulsive force. Further, the heat conducting elastic material 16 and the mounting surface 17 are in close contact with each other. The housing 32 is sandwiched between the heat conductive elastic material 16 and the snap 25 by a force derived from the elastic repulsion of the heat conductive elastic material 16.

なお、言うまでもないことではあるが、熱伝導弾性材１６の厚みは、上述のように筐体３２に熱伝導スペーサ１０を取り付けた際に圧縮されて弾性反発する厚みに設定されている。また、スペーサ取付穴３２ａの寸法、形状は、弾性片２７を弾性変形させてスナップ２５を通過させる寸法、形状に設定されている。   Needless to say, the thickness of the heat conductive elastic material 16 is set to a thickness that is compressed and elastically repelled when the heat conductive spacer 10 is attached to the housing 32 as described above. The size and shape of the spacer mounting hole 32a are set to a size and shape that elastically deforms the elastic piece 27 and allows the snap 25 to pass.

スナップ２６によるヒートシンク３１と熱伝導スペーサ１０との連結（熱伝導弾性材１６の厚み設定、スペーサ取付穴３１ａの寸法、形状の設定）も上記と同様であり、ヒートシンク３１は熱伝導弾性材１６とスナップ２６の弾性片２８との間に挟持され、ヒートシンク３１と熱伝導弾性材１６、熱伝導弾性材１６と装着面１８はともに密着状態になっている。   The connection between the heat sink 31 and the heat conducting spacer 10 by the snap 26 (setting of the thickness of the heat conducting elastic material 16 and the setting of the dimension and shape of the spacer mounting hole 31a) is the same as described above. The heat sink 31 and the heat conductive elastic material 16, and the heat conductive elastic material 16 and the mounting surface 18 are both in close contact with each other.

ヒートシンク３１が取り付けられているデバイス（例えばＣＰＵ）が発熱すると、その熱はヒートシンク３１に伝導し、ヒートシンク３１から熱伝導弾性材１６に伝わる。熱伝導弾性材１６の熱は装着面１８から熱伝導剛性材１２に伝わり、その装着面１７から熱伝導弾性材１６を経て筐体３２に伝わって、筐体３２から放熱される。   When a device (for example, CPU) to which the heat sink 31 is attached generates heat, the heat is transmitted to the heat sink 31 and is transmitted from the heat sink 31 to the heat conductive elastic material 16. The heat of the heat conductive elastic material 16 is transmitted from the mounting surface 18 to the heat conductive rigid material 12, is transmitted from the mounting surface 17 through the heat conductive elastic material 16 to the housing 32, and is radiated from the housing 32.

熱伝導弾性材１６がシリコンゴム製、熱伝導剛性材１２がアルミニウム製であるために、熱伝導スペーサ１０としての熱伝導率は高い。しかも、ヒートシンク３１、熱伝導弾性材１６、装着面１８（熱伝導剛性材１２）が互いに密着状態になり、筐体３２、熱伝導弾性材１６、装着面１７（熱伝導剛性材１２）も互いに密着状態になっているので、ヒートシンク３１が取り付けられているデバイス（例えばＣＰＵ）の熱は効率よく筐体３２に伝導して放熱される。   Since the heat conducting elastic material 16 is made of silicon rubber and the heat conducting rigid material 12 is made of aluminum, the heat conductivity as the heat conducting spacer 10 is high. In addition, the heat sink 31, the heat conductive elastic material 16, and the mounting surface 18 (heat conductive rigid material 12) are in close contact with each other, and the housing 32, the heat conductive elastic material 16, and the mounting surface 17 (heat conductive rigid material 12) are also mutually connected. Since they are in close contact, the heat of the device (for example, CPU) to which the heat sink 31 is attached is efficiently conducted to the housing 32 and radiated.

熱伝導弾性材１６の厚みが４ｍｍ程度を上限にするとしても、熱伝導剛性材１２の厚みは制約されないので、ヒートシンク３１と筐体３２との隙間が大きくても確実に対応できる。   Even if the thickness of the heat conductive elastic material 16 is about 4 mm, the thickness of the heat conductive rigid material 12 is not limited. Therefore, even if the gap between the heat sink 31 and the housing 32 is large, it can be dealt with with certainty.

熱伝導スペーサ１０の取付けは、上述したようにスナップ２５にて筐体３２を挟持し、スナップ２６にてヒートシンク３１を挟持することでなされ、スペーサ取付穴３１ａ、３２ａを用いてスナップ２５、２６を装着するだけで熱伝導スペーサ１０を取付けできるから、作業性はきわめて良好である。   The heat conductive spacer 10 is attached by holding the housing 32 with the snap 25 and holding the heat sink 31 with the snap 26 as described above. The snaps 25 and 26 are attached using the spacer attachment holes 31a and 32a. Since the heat conductive spacer 10 can be attached simply by mounting, workability is very good.

その際に、ヒートシンク３１、筐体３２の板厚に応じて熱伝導弾性材１６の厚みを設定すれば、スナップ２５、２６による挟持を確実に行える。
［実施例２］
この実施例は、熱伝導剛性材１２にフィンを設けた例である。なお、多くの部分が実施例１と同様であるから、それらは実施例１と同符号を使用して説明を省略する。 At that time, if the thickness of the heat conductive elastic material 16 is set according to the plate thickness of the heat sink 31 and the casing 32, the holding by the snaps 25 and 26 can be surely performed.
[Example 2]
In this embodiment, fins are provided on the heat conductive rigid member 12. In addition, since many parts are the same as that of Example 1, they use the same code | symbol as Example 1, and abbreviate | omit description.

図３に示すように、この実施例の熱伝導スペーサ４０においては、熱伝導剛性材１２の２側面にそれぞれ複数のフィン３３が設けられている。
この熱伝導スペーサ４０の取付や使用方法等は実施例１と同様であり、実施例１と同様の効果が得られる。さらに、熱伝導剛性材１２に複数のフィン３３が設けられているので、熱伝導スペーサ４０を介して行われるヒートシンク３１から筐体３２への伝導による放熱だけでなく、フィン３３を備えた熱伝導剛性材１２自体が放熱部品としても機能するので、ヒートシンク３１からの放熱効率が向上する。
［実施例３］
この実施例は、熱伝導剛性材１２の隣り合う２面に熱伝導弾性材１６を配置し、またスナップ２５、２６も熱伝導弾性材１６に対応させて同様に配置した例である。なお、実施例１と共通の部分については実施例１と同符号を使用して説明を省略する。 As shown in FIG. 3, in the heat conducting spacer 40 of this embodiment, a plurality of fins 33 are provided on two side surfaces of the heat conducting rigid material 12.
The mounting and usage of the heat conductive spacer 40 are the same as those in the first embodiment, and the same effects as those in the first embodiment can be obtained. Furthermore, since the heat conducting rigid material 12 is provided with a plurality of fins 33, not only heat dissipation by conduction from the heat sink 31 to the housing 32 performed via the heat conducting spacer 40 but also heat conduction provided with the fins 33. Since the rigid member 12 itself also functions as a heat dissipation component, the heat dissipation efficiency from the heat sink 31 is improved.
[Example 3]
In this embodiment, the heat conducting elastic material 16 is arranged on two adjacent surfaces of the heat conducting rigid material 12, and the snaps 25 and 26 are also arranged in the same manner corresponding to the heat conducting elastic material 16. In addition, about the part which is common in Example 1, description is abbreviate | omitted using the same code | symbol as Example 1. FIG.

図４に示すように、熱伝導スペーサ５０では、隣り合う２面が装着面１７、１８とされて、それぞれ熱伝導弾性材１６が取り付けられ、その熱伝導弾性材１６を貫通した状態でスナップ２５、２６が装着面１７、１８から突出している。   As shown in FIG. 4, in the heat conductive spacer 50, the two adjacent surfaces are the mounting surfaces 17 and 18, the heat conductive elastic material 16 is attached to each, and the snap 25 is passed through the heat conductive elastic material 16. , 26 protrude from the mounting surfaces 17, 18.

このため、第１充填孔１９の一方の開口部分１９ａは実施例１と同様にスナップ２６の支柱部２３の基部２３ａが充填されているが、他方の開口部分１９ｂは開放状態になり、ここに充填された樹脂にて鍔部２４ａが形成されている。また、第２充填孔２０の一方の開口部分２０ａは実施例１と同様に開放状態で、充填された樹脂にて鍔部２４が形成されているが、他方の開口部分２０ｂにはスナップ２５の支柱部２３の基部２３ａが充填されている。   Therefore, one opening portion 19a of the first filling hole 19 is filled with the base portion 23a of the column portion 23 of the snap 26 as in the first embodiment, but the other opening portion 19b is in an open state. The flange portion 24a is formed of the filled resin. In addition, one opening portion 20a of the second filling hole 20 is in an open state as in the first embodiment, and the flange portion 24 is formed of the filled resin, but the other opening portion 20b has a snap 25. The base portion 23a of the column portion 23 is filled.

図示するとおり、この熱伝導スペーサ５０では、隣り合って直交する２面が装着面１７、１８とされて熱伝導弾性材１６が取り付けられ、また装着面１７から突出しているスナップ２５と装着面１８から突出しているスナップ２６の突出方向も直交しているので、第１物体（例えば実施例１で説明したヒートシンク３１）の表面と第２物体（例えば実施例１で説明した筐体３２）の表面とが直交状態にある場合の使用に好適である。   As shown in the figure, in this heat conductive spacer 50, two adjacent and orthogonal surfaces are set as mounting surfaces 17 and 18, the heat conductive elastic material 16 is mounted, and the snap 25 and the mounting surface 18 protruding from the mounting surface 17 are attached. Since the protruding directions of the snaps 26 protruding from the right angle are also orthogonal, the surface of the first object (for example, the heat sink 31 described in the first embodiment) and the surface of the second object (for example, the casing 32 described in the first embodiment). Is suitable for use in a state where and are in an orthogonal state.

この熱伝導スペーサ５０の第１物体（ヒートシンク３１）と第２物体（筐体３２）への取付は、実施例１と同様であり（但しヒートシンク３１と筐体３２が直交状態であるから、取付方向は変化する。）、実施例１と同様の効果が得られる。
［変形例１］
図５に示すように、スナップ２５、２６の一方（この例ではスナップ２５）を廃した熱伝導スペーサ５１とすることもできる。図示の例ではプリント基板５３に発熱素子（例えばＣＰＵ）５４が実装されており、筐体３２に取り付けられた熱伝導スペーサ５１の熱伝導弾性材１６を発熱素子５４の表面に密接させている。この熱伝導スペーサ５１は、第１物体と２物体の一方が発熱素子（例えばＣＰＵ）５４で、スナップによる挟持が実質上不可能な使用状態に適している。
［変形例２］
図６に示すように、変形例１と同様にスナップ２５、２６の一方（この例ではスナップ２５）を廃した構成において、熱伝導弾性材１６を熱伝導剛性材１２の隣接する２平面に設けることもできる。
［その他］
実施例１〜３では、熱伝導弾性材をシリコーンゴム製、熱伝導剛性材をアルミニウム製、スナップを含む取付部材をナイロン製としているが、それぞれ他の材質にすることもできる。また、熱伝導弾性材、熱伝導剛性材、スナップの形状やサイズ等も適宜に変更できる。 The mounting of the heat conducting spacer 50 to the first object (heat sink 31) and the second object (housing 32) is the same as that of the first embodiment (however, since the heat sink 31 and the housing 32 are orthogonal to each other) The direction changes.), The same effect as in Example 1 can be obtained.
[Modification 1]
As shown in FIG. 5, one of the snaps 25 and 26 (in this example, the snap 25) can be used as a heat conductive spacer 51. In the illustrated example, a heat generating element (for example, CPU) 54 is mounted on a printed circuit board 53, and the heat conductive elastic material 16 of the heat conductive spacer 51 attached to the housing 32 is in close contact with the surface of the heat generating element 54. The heat conducting spacer 51 is suitable for a use state in which one of the first object and the second object is a heat generating element (for example, CPU) 54 and the holding by the snap is substantially impossible.
[Modification 2]
As shown in FIG. 6, in the configuration in which one of the snaps 25 and 26 (the snap 25 in this example) is eliminated as in the first modification, the heat conductive elastic material 16 is provided on two adjacent flat surfaces of the heat conductive rigid material 12. You can also.
[Others]
In Examples 1 to 3, the heat conducting elastic material is made of silicone rubber, the heat conducting rigid material is made of aluminum, and the mounting member including the snap is made of nylon, but other materials can also be used. Further, the shape and size of the heat conducting elastic material, the heat conducting rigid material, and the snap can be changed as appropriate.

実施例１の熱伝導スペーサの説明図であり、（ａ）は平面図、（ｂ）は正面図、（ｃ）は側面図、（ｄ）はＢ−Ｂ断面図、（ｅ）はＡ−Ａ断面図、（ｆ）はＣ−Ｃ断面図。It is explanatory drawing of the heat conductive spacer of Example 1, (a) is a top view, (b) is a front view, (c) is a side view, (d) is BB sectional drawing, (e) is A-. A sectional drawing, (f) is CC sectional drawing. 実施例１の熱伝導スペーサの使用状態の説明図Explanatory drawing of the use condition of the heat conductive spacer of Example 1 実施例２の熱伝導スペーサの説明図であり、（ａ）は平面図、（ｂ）は正面図、（ｃ）は側面図、（ｄ）はＡ−Ａ断面図。It is explanatory drawing of the heat conductive spacer of Example 2, (a) is a top view, (b) is a front view, (c) is a side view, (d) is AA sectional drawing. 実施例３の熱伝導スペーサの説明図であり、（ａ）は平面図、（ｂ）は正面図、（ｃ）は右側面図、（ｄ）は左側面図、（ｅ）は底面図、（ｆ）はＡ−Ａ断面図。It is explanatory drawing of the heat conductive spacer of Example 3, (a) is a top view, (b) is a front view, (c) is a right view, (d) is a left view, (e) is a bottom view, (F) is AA sectional drawing. 変形例１の熱伝導スペーサの説明図。Explanatory drawing of the heat conductive spacer of the modification 1. FIG. 変形例２の熱伝導スペーサの説明図。Explanatory drawing of the heat conductive spacer of the modification 2. FIG.

符号の説明Explanation of symbols

１０・・・熱伝導スペーサ、
１２・・・熱伝導剛性材、
１４・・・取付部材、
１６・・・熱伝導弾性材、
１７、１８・・・装着面、
１９・・・第１充填孔、
２０・・・第２充填孔、
２２・・・充填部、
２３・・・支柱部、
２５、２６・・・スナップ（挟持手段）、
３１・・・ヒートシンク、
３２・・・筐体、
３３・・・フィン、
４０・・・熱伝導スペーサ、
５０、５１、５２・・・熱伝導スペーサ。 10 ... Thermal conductive spacer,
12 ... Heat conduction rigid material,
14: Mounting member,
16 ... heat conduction elastic material,
17, 18 ... mounting surface,
19 ... 1st filling hole,
20 ... second filling hole,
22 ... filling part,
23 .. support part,
25, 26 ... snap (clamping means),
31 ... heat sink,
32 ... Case,
33 ... Fins,
40 ... Thermal conductive spacer,
50, 51, 52 ... Thermal conductive spacers.

Claims (6)

第１物体と第２物体間に介装される熱伝導スペーサであって、
少なくとも２平面を有する熱伝導剛性材と、
前記２平面それぞれに接触配置される熱伝導弾性材と、
前記熱伝導弾性材を貫通して前記熱伝導剛性材の前記２平面の少なくとも一方に立設された挟持手段と
を備えることを特徴とする熱伝導スペーサ。 A thermally conductive spacer interposed between the first object and the second object,
A thermally conductive rigid material having at least two planes;
A heat conducting elastic material disposed in contact with each of the two planes;
A heat conducting spacer, comprising: a sandwiching means that extends through at least one of the two planes of the heat conducting rigid material through the heat conducting elastic material. 請求項１記載の熱伝導スペーサにおいて、
前記熱伝導弾性材を貫通して前記熱伝導剛性材の前記２平面それぞれに１以上立設された前記挟持手段
を備えることを特徴とする熱伝導スペーサ。 The thermally conductive spacer according to claim 1,
A heat conducting spacer comprising one or more clamping means that penetrate through the heat conducting elastic material and are erected on each of the two planes of the heat conducting rigid material. 請求項１又は２記載の熱伝導スペーサにおいて、
前記挟持手段は合成樹脂製のスナップであり、インサート成形にて前記熱伝導剛性材と一体化されている
ことを特徴とする熱伝導スペーサ。 The heat conducting spacer according to claim 1 or 2,
The heat conduction spacer is characterized in that the clamping means is a synthetic resin snap, and is integrated with the heat conduction rigid material by insert molding. 請求項１、２又は３記載の熱伝導スペーサにおいて、
前記熱伝導剛性材は金属製であることを特徴とする熱伝導スペーサ。 The heat conductive spacer according to claim 1, 2, or 3,
The heat conducting spacer is characterized in that the heat conducting rigid material is made of metal. 請求項１ないし４のいずれか記載の熱伝導スペーサにおいて、
前記熱伝導剛性材は直方体状である
ことを特徴とする熱伝導スペーサ。 In the heat conductive spacer in any one of Claims 1 thru | or 4,
The thermally conductive spacer is characterized in that the thermally conductive rigid material has a rectangular parallelepiped shape. 請求項１ないし５のいずれか記載の熱伝導スペーサにおいて、
前記熱伝導剛性材の前記熱伝導弾性材で覆われない部分に放熱フィンが設けられている
ことを特徴とする熱伝導スペーサ。 In the heat conductive spacer in any one of Claims 1 thru | or 5,
A heat-conducting spacer, wherein a radiation fin is provided in a portion of the heat-conducting rigid material that is not covered with the heat-conducting elastic material.
JP2004194126A 2004-06-30 2004-06-30 Thermal spacer Expired - Fee Related JP4339753B2 (en)

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JP7372843B2 (en) 2020-01-08 2023-11-01 日本製紙株式会社 Vertical sealing tape used for paper containers and paper containers vertically sealed with vertical sealing tape

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