JP4320611B2 - モータ駆動装置 - Google Patents
モータ駆動装置 Download PDFInfo
- Publication number
- JP4320611B2 JP4320611B2 JP2004101051A JP2004101051A JP4320611B2 JP 4320611 B2 JP4320611 B2 JP 4320611B2 JP 2004101051 A JP2004101051 A JP 2004101051A JP 2004101051 A JP2004101051 A JP 2004101051A JP 4320611 B2 JP4320611 B2 JP 4320611B2
- Authority
- JP
- Japan
- Prior art keywords
- fet
- motor
- field effect
- effect transistor
- steering
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/02—Bonding areas; Manufacturing methods related thereto
- H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
- H01L2224/05—Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area
- H01L2224/0554—External layer
- H01L2224/0555—Shape
- H01L2224/05552—Shape in top view
- H01L2224/05553—Shape in top view being rectangular
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/484—Connecting portions
- H01L2224/4847—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond
- H01L2224/48472—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond the other connecting portion not on the bonding area also being a wedge bond, i.e. wedge-to-wedge
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
- H01L2224/491—Disposition
- H01L2224/4912—Layout
- H01L2224/49175—Parallel arrangements
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/13—Discrete devices, e.g. 3 terminal devices
- H01L2924/1304—Transistor
- H01L2924/1306—Field-effect transistor [FET]
- H01L2924/13091—Metal-Oxide-Semiconductor Field-Effect Transistor [MOSFET]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
Landscapes
- Power Steering Mechanism (AREA)
- Control Of Motors That Do Not Use Commutators (AREA)
- Inverter Devices (AREA)
Description
より具体的には、2つの電界効果トランジスタのドレイン電極が1つの放熱フィンに導通可能に固着され、その放熱フィンに、これら2つの電界効果トランジスタに共通のドレイン端子が接続されていることを特徴とする。
図3および図4を用いて、本発明のFET42〜53の第1の構成例について説明する。本発明の構成に用いられるFETは周知のパワーMOSFET(Metal Oxide Semiconductor Field-Effect Transistor)であるが、FETの種類に特に制約を設けるものではない。また、FETのほかにトランジスタ等のスイッチング素子を用いてもよい。
図5を用いて、本発明のFET42〜53の第2の構成例について説明する。なお、本構成例は上述した第1の構成例の変形例であるため、第1の構成例と同じ符号を用いて説明する。また、FETチップの構造は図3に準ずるものとする。
32 ゲート端子
33 ドレイン端子
34 樹脂パッケージ
35 放熱フィン
36 FETチップ
37 ソース電極
38 ゲート電極
39 ボンディングワイヤ
40 ボンディングワイヤ
41 FETチップ
42,44,46,48,50,52 電界効果トランジスタ(第2の電界効果トランジスタ)
43,45,47,49,51,53 電界効果トランジスタ(第1の電界効果トランジスタ)
70 ドレイン電極
101 電動パワーステアリング装置
108 電流検出回路
114 モータドライバ
114a ドライブ回路
115 モータ
Claims (3)
- 寄生ダイオードが電源に対して逆方向となるように配置された第1の電界効果トランジスタおよび、寄生ダイオードが電源に対して順方向となるように配置された第2の電界効果トランジスタとを直列接続して形成されたスイッチング素子を含むブリッジ回路によってモータを駆動するモータ駆動装置であって、前記第1の電界効果トランジスタおよび前記第2の電界効果トランジスタのドレイン端子を共通として、これら2つの電界効果トランジスタを同一パッケージ内に形成することを特徴とするモータ駆動装置。
- 前記2つの電界効果トランジスタのドレイン電極が1つの放熱フィンに導通可能に固着され、その放熱フィンに、これら2つの電界効果トランジスタに共通のドレイン端子が接続されていることを特徴とする請求項1に記載のモータ駆動装置。
- 運転者のステアリング動作に基づいて、モータを駆動してステアリング機構に操舵補助トルクを与える車両の電動パワーステアリング装置において、前記モータを駆動することを特徴とする請求項1または請求項2に記載のモータ駆動装置。
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2004101051A JP4320611B2 (ja) | 2004-03-30 | 2004-03-30 | モータ駆動装置 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2004101051A JP4320611B2 (ja) | 2004-03-30 | 2004-03-30 | モータ駆動装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2005280615A JP2005280615A (ja) | 2005-10-13 |
JP4320611B2 true JP4320611B2 (ja) | 2009-08-26 |
Family
ID=35179456
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2004101051A Expired - Fee Related JP4320611B2 (ja) | 2004-03-30 | 2004-03-30 | モータ駆動装置 |
Country Status (1)
Country | Link |
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JP (1) | JP4320611B2 (ja) |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP5152526B2 (ja) * | 2009-04-24 | 2013-02-27 | 株式会社デンソー | 車載電力変換装置 |
CN104185950B (zh) * | 2012-03-22 | 2016-12-07 | 日立汽车***株式会社 | 电力变换装置、电动动力转向***、电动汽车、电子控制节流阀、电动制动器 |
JP6286149B2 (ja) * | 2013-08-02 | 2018-02-28 | 日立オートモティブシステムズ株式会社 | 電力変換装置、電動パワーステアリングシステム、電気自動車、電子制御スロットル、電動ブレーキ |
JP2019170033A (ja) * | 2018-03-22 | 2019-10-03 | パナソニックIpマネジメント株式会社 | 電力変換装置 |
-
2004
- 2004-03-30 JP JP2004101051A patent/JP4320611B2/ja not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
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JP2005280615A (ja) | 2005-10-13 |
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