JP4301088B2 - Solder coating apparatus and solder coating method - Google Patents

Solder coating apparatus and solder coating method Download PDF

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JP4301088B2
JP4301088B2 JP2004181958A JP2004181958A JP4301088B2 JP 4301088 B2 JP4301088 B2 JP 4301088B2 JP 2004181958 A JP2004181958 A JP 2004181958A JP 2004181958 A JP2004181958 A JP 2004181958A JP 4301088 B2 JP4301088 B2 JP 4301088B2
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solder
vibration
hole
coating apparatus
target surface
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JP2006000913A (en
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浩之 生田
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Toyota Motor Corp
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Description

本発明は，金属部材同士をハンダ付けあるいはロウ付けによって接合するためのハンダ塗布装置およびハンダ塗布方法に関する。さらに詳細には，アルミ合金製の部材の接合面にハンダを塗布するハンダ塗布装置およびハンダ塗布方法に関するものである。   The present invention relates to a solder coating apparatus and a solder coating method for joining metal members together by soldering or brazing. More specifically, the present invention relates to a solder application apparatus and a solder application method for applying solder to a joint surface of an aluminum alloy member.

アルミ合金製の金属部材では，その表面に酸化アルミニウムの強固な不動態皮膜が形成されるため，そのままでは一般的なハンダ付けは難しい。それに対して従来より，超音波振動を利用したハンダ塗布方法が考案されている。この技術では，溶融ハンダ中に浅く振動板を浸漬させるか，振動板で溶融ハンダをすくうかして，振動板上に薄く溶融ハンダが載った状態とする。そして，その上にアルミ合金部材の接合面を載せて，振動板を超音波ホーン等によって振動させるのである。このようにすれば，振動板の振動によりハンダ液にキャビテーションを起こして酸化膜を破壊し，接合面にハンダ材を塗布することができる。なお，本明細書では，特に必要がない限り，ハンダとロウ（鑞）とを区別せず両者を含めてハンダと称する。   In a metal member made of an aluminum alloy, since a strong passive film of aluminum oxide is formed on the surface thereof, general soldering is difficult as it is. In contrast, a solder coating method using ultrasonic vibration has been devised. In this technology, the diaphragm is immersed in the molten solder shallowly, or the molten solder is scooped with the diaphragm so that the molten solder is thinly placed on the diaphragm. Then, the joining surface of the aluminum alloy member is placed thereon, and the diaphragm is vibrated by an ultrasonic horn or the like. By doing so, it is possible to cause cavitation in the solder liquid by the vibration of the vibration plate, break the oxide film, and apply the solder material to the joint surface. In the present specification, unless otherwise required, solder and solder are not distinguished from each other and are collectively referred to as solder.

このような，アルミ合金部材の接合方法では，より適切なハンダ層を接合面に形成するための種々の考案がなされている（例えば，特許文献１参照。）。この文献に記載の方法では，振動板に突起を形成し，その突起上に接合面を載置することにしている。これによって，接合面のうち突起上の部分が他の部分より侵食されるので，その部分にハンダを溜めることができ，接合強度が向上されているというものである。
特開２００１−２２５１６３号公報（第３−４頁，第４図） In such an aluminum alloy member joining method, various devices have been devised for forming a more appropriate solder layer on the joining surface (see, for example, Patent Document 1). In the method described in this document, a protrusion is formed on the diaphragm, and a joint surface is placed on the protrusion. As a result, the portion of the joint surface on the projection is eroded from the other portions, so that solder can be accumulated in that portion, and the joint strength is improved.
Japanese Patent Laid-Open No. 2001-225163 (page 3-4, FIG. 4)

しかしながら，前記した従来の接合方法では，アルミ合金部材の接合面の中央部が振動によって侵食される。そして，侵食されたアルミ合金部材の成分がハンダ中に混入することとなるため，ハンダの成分がいくらか変化するおそれがあった。特に，振動板をハンダ液中に浅く浸漬させた状態とし，接合する部材をとり変えて次々にハンダ塗布を行う場合には，この混入したアルミ成分が振動板上に次第に溜まるおそれがある。その場合には，部材に塗布されるハンダ液の特性が次第に変化してしまい，接合強度が低下するという問題点があった。   However, in the conventional joining method described above, the central portion of the joining surface of the aluminum alloy member is eroded by vibration. And since the component of the eroded aluminum alloy member is mixed in the solder, the component of the solder may be somewhat changed. In particular, when the diaphragm is immersed in a solder solution in a shallow state and soldering is performed one after another by changing the member to be joined, the mixed aluminum component may gradually accumulate on the diaphragm. In that case, there is a problem that the properties of the solder liquid applied to the member gradually change and the bonding strength is lowered.

本発明は，前記した従来の接合方法が有する問題点を解決するためになされたものである。すなわちその課題とするところは，複数の部材に次々にハンダ塗布する場合でも，良好な接合強度が得られるハンダ塗布装置およびハンダ塗布方法を提供することにある。   The present invention has been made in order to solve the problems of the conventional joining method described above. That is, an object of the present invention is to provide a solder coating apparatus and a solder coating method capable of obtaining good bonding strength even when solder coating is successively performed on a plurality of members.

この課題の解決を目的としてなされた本発明のハンダ塗布装置は，対象物の対象面にハンダ層を形成するハンダ塗布装置であって，溶融ハンダを収容する浴槽と，浴槽内のハンダを加熱する加熱装置と，浴槽内の溶融ハンダに部分的に浸るとともに，溶融ハンダに浸っている部分が対象物の対象面と対面する振動部材と，振動部材を振動させる振動装置とを有し，振動部材のうち溶融ハンダに浸る部分に，表裏面間を貫通する貫通穴が形成されており，貫通穴が，振動装置により振動部材を振動させたときに定常波振動の節目部となる箇所に形成されているものである。 A solder coating apparatus according to the present invention, which has been made for the purpose of solving this problem, is a solder coating apparatus that forms a solder layer on a target surface of an object, and heats a bathtub containing molten solder and solder in the bathtub. The vibration device includes a heating device, a vibration member that is partially immersed in the molten solder in the bathtub, a portion of the molten solder that faces the target surface of the object, and a vibration device that vibrates the vibration member. A through-hole that penetrates between the front and back surfaces is formed in the part that is immersed in the molten solder, and the through-hole is formed at a portion that becomes a node of standing wave vibration when the vibration member is vibrated by the vibration device. It is what.

本発明のハンダ塗布装置によれば，浴槽内に溶融ハンダが収容され，振動部材は，その溶融ハンダに浸っている部分が対象物の対象面と対面される。このようにして，振動部材が振動装置によって振動されるので，振動部材と対象物の対象面との間の溶融ハンダにキャビテーションを起こして，対象面の酸化膜を破壊する。従って，対象物がアルミ合金部材であっても，その対象面にハンダを塗布することができる。さらに，本発明では，振動部材のうち溶融ハンダに浸る部分に，表裏面間を貫通する貫通穴が形成されているので，その貫通穴を介して振動部材の上下の溶融ハンダが混合される。従って，複数の対象物に続けてハンダ塗布を行った場合でも，対象物から溶出した成分が振動部材上の溶融ハンダ中に溜まることはなく，溶融ハンダ全体とよく混合されて特性の変化は緩和される。これにより，特性が顕著に変化した溶融ハンダが対象物の対象面に対面されるおそれはないので，複数の部材に次々にハンダ塗布する場合でも，良好な接合強度が得られる。   According to the solder coating apparatus of the present invention, the molten solder is accommodated in the bathtub, and the vibrating member has the portion immersed in the molten solder facing the target surface of the object. In this way, since the vibration member is vibrated by the vibration device, cavitation is caused in the molten solder between the vibration member and the target surface of the target object, and the oxide film on the target surface is destroyed. Therefore, even if the object is an aluminum alloy member, it is possible to apply solder to the object surface. Furthermore, in the present invention, since a through hole penetrating between the front and back surfaces is formed in the portion of the vibration member that is immersed in the molten solder, the upper and lower molten solders of the vibration member are mixed through the through hole. Therefore, even when solder is applied to multiple objects, the components eluted from the object do not accumulate in the molten solder on the vibrating member and are well mixed with the entire molten solder, reducing the change in properties. Is done. Thereby, since there is no possibility that the molten solder whose characteristics have changed remarkably will face the target surface of the target object, even when solder is applied to a plurality of members one after another, good bonding strength can be obtained.

さらに本発明では，振動部材の貫通穴は，対象物の対象面と対面する範囲内に形成されていることが望ましい。
このようにすれば，振動部材の上下の溶融ハンダが，対象物の対象面と対面する範囲で特によく混合されるので，次々にハンダ塗布を行っても，特性が顕著に変化した溶融ハンダが対象物に対面するおそれはない。また，この範囲は，対象物が侵食されることによってハンダに混入される対象物の成分が，他の部分よりも多いと考えられるため，特によく混合することが望まれる箇所である。 Furthermore, in the present invention, it is desirable that the through hole of the vibration member is formed within a range facing the target surface of the target object.
In this way, the molten solder on the top and bottom of the vibrating member is particularly well mixed within the range facing the target surface of the object, so that even if solder is applied one after another, the molten solder whose characteristics have changed significantly There is no risk of facing the object. Also, this range is a place where mixing of the object is particularly desirable because it is considered that there are more components of the object mixed in the solder when the object is eroded than other parts.

また，本発明のハンダ塗布方法は，対象物の対象面にハンダ層を形成するハンダ塗布方法であって，溶融ハンダ内で，対象物の対象面と，表裏面間を貫通する貫通穴が形成されている振動部材とを対面させ，その状態で振動部材を振動させ，振動部材として，貫通穴が定常波振動の節目部となる箇所に形成されているものを用いるものである。 The solder coating method of the present invention is a solder coating method for forming a solder layer on the target surface of an object, and a through hole penetrating between the target surface of the object and the front and back surfaces is formed in the molten solder. it is faced with a vibration member which is the vibration member is vibrated in this state, as the vibrating member, is shall used as a through hole is formed in the portion which becomes milestone of standing wave oscillation.

本発明のハンダ塗布方法によれば，対象物の対象面にハンダを塗布することによって，振動部材上の溶融ハンダに対象物の成分が混入した場合でも，貫通穴を介して振動部材の上下の溶融ハンダが混合される。従って，特性が顕著に変化した溶融ハンダが対象物の対象面に対面されるおそれはないので，複数の部材に次々にハンダ塗布する場合でも，良好な接合強度が得られる。   According to the solder coating method of the present invention, by applying solder to the target surface of the target object, even when the component of the target object is mixed into the molten solder on the vibration member, the top and bottom of the vibration member are Molten solder is mixed. Therefore, there is no possibility that the melted solder whose characteristics have changed remarkably will face the target surface of the object, so that even when solder is applied to a plurality of members one after another, good bonding strength can be obtained.

さらに本発明では，振動部材として，対象物の対象面と対面する範囲内に貫通穴が形成されているものを用いることが望ましい。
このようにすれば，振動部材の上下の溶融ハンダが，対象物の対象面と対面する範囲で特によく混合されるので，次々にハンダ塗布を行っても，特性が顕著に変化した溶融ハンダが対象物に対面するおそれはない。 Furthermore, in the present invention, it is desirable to use a vibrating member in which a through hole is formed in a range facing the target surface of the target object.
In this way, the molten solder on the top and bottom of the vibrating member is particularly well mixed within the range facing the target surface of the object, so that even if solder is applied one after another, the molten solder whose characteristics have changed significantly There is no risk of facing the object.

本発明のハンダ塗布装置およびハンダ塗布方法によれば，複数の部材に次々にハンダ塗布する場合でも，良好な接合強度が得られる。また，長尺状の部材に連続してハンダを塗布する場合にも同様に，良好な接合強度が得られる。   According to the solder coating apparatus and the solder coating method of the present invention, even when solder is applied to a plurality of members one after another, good bonding strength can be obtained. Similarly, when solder is continuously applied to a long member, good bonding strength can be obtained.

以下，本発明を具体化した最良の形態について，添付図面を参照しつつ詳細に説明する。本形態は，アルミ合金等の金属部材を接合するために，その接合面にハンダを塗布するハンダ塗布装置に本発明の接合方法を適用したものである。   DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, the best mode for embodying the present invention will be described in detail with reference to the accompanying drawings. In the present embodiment, the joining method of the present invention is applied to a solder coating apparatus that coats solder on the joining surfaces in order to join metal members such as aluminum alloys.

本形態のハンダ塗布装置１は，図１に示すように，ハンダ溶融槽１１と，そのハンダ溶融槽１１内を高温に保つためのヒータ１２とを備えている。ハンダ溶融槽１１の槽内には，ハンダ１３が収容される。また，振動板１４は，階段状に曲げられたＳＵＳ等の金属板であり，その下段部がハンダ１３のごく浅い位置に浸漬される。振動板１４の上段部には，超音波発振器１５に接続された超音波ホーン１６が取り付けられている。さらに，このハンダ塗布装置１では，図２に示すように，振動板１４の下段部に複数の貫通孔１７が設けられている。   As shown in FIG. 1, the solder coating apparatus 1 according to the present embodiment includes a solder melting tank 11 and a heater 12 for keeping the inside of the solder melting tank 11 at a high temperature. Solder 13 is accommodated in the solder melting tank 11. The vibration plate 14 is a metal plate such as SUS bent in a staircase shape, and its lower step is immersed in a very shallow position of the solder 13. An ultrasonic horn 16 connected to an ultrasonic oscillator 15 is attached to the upper stage of the diaphragm 14. Further, in the solder coating apparatus 1, as shown in FIG. 2, a plurality of through holes 17 are provided in the lower stage portion of the diaphragm 14.

このハンダ塗布装置１によってハンダを塗布されるワーク２１は，アルミ合金部材等の金属部材である。ワーク２１は，図１に示すように，ハンダを塗布する接合面をハンダ１３中にごく浅く浸漬した状態で水平に保持される。さらに言えば，ワーク２１の接合面は，振動板１４の下段部の上側で，振動板１４の下段部上面にごく近接した深さ位置に配置される。図１では，ワーク２１が，２本のワーク固定棒２２によって貫通されて，それらの接合面が水平に保持されている例を示している。ワーク２１がアルミ合金部材である場合には，ハンダ１３としては亜鉛アルミ系または亜鉛アルミ銅系のハンダを用いることが好ましい。   The workpiece 21 to which the solder is applied by the solder applying apparatus 1 is a metal member such as an aluminum alloy member. As shown in FIG. 1, the workpiece 21 is held horizontally with the joining surface to which the solder is applied immersed in the solder 13 very shallowly. More specifically, the joining surface of the workpiece 21 is disposed on the upper side of the lower step portion of the vibration plate 14 and at a depth position very close to the upper surface of the lower step portion of the vibration plate 14. FIG. 1 shows an example in which the workpiece 21 is penetrated by two workpiece fixing rods 22 and their joint surfaces are held horizontally. When the workpiece 21 is an aluminum alloy member, it is preferable to use zinc aluminum or zinc aluminum copper solder as the solder 13.

このハンダ塗布装置１では，超音波発振器１５を駆動して超音波ホーン１６を振動させることにより，振動板１４全体を振動させることができる。貫通孔１７の形成されていない振動板１４において，各部での振動の様子を解析したところ，図３に示すように，格子状に振幅の大きい山谷部（図中黒丸）が配置される定常波振動となることが分かった。さらにそれらの間には，振幅のごく小さい節目部（図中白丸）が配置される。例えば，図３のＡ−Ａ断面では，図４に示すように，５箇所の山谷部（Ｐ１〜Ｐ５）と４箇所の節目部（Ｑ１〜Ｑ４）ができている。なお，図３に示したのは，振動板１４の振動モードの一例である。実際の振動モードは，振動板１４の形状等の種々の要因によって異なるものとなる。例えば，六方配置等となることもある。   In this solder coating apparatus 1, the entire vibration plate 14 can be vibrated by driving the ultrasonic oscillator 15 to vibrate the ultrasonic horn 16. In the diaphragm 14 in which the through-hole 17 is not formed, the vibration state at each part was analyzed. As shown in FIG. I found out that Further, a node portion (white circle in the figure) having a very small amplitude is arranged between them. For example, in the AA cross section of FIG. 3, as shown in FIG. 4, five mountain valleys (P1 to P5) and four nodes (Q1 to Q4) are formed. Note that FIG. 3 shows an example of the vibration mode of the diaphragm 14. The actual vibration mode differs depending on various factors such as the shape of the diaphragm 14. For example, it may be a hexagonal arrangement.

そこで，貫通孔１７の大きさや個数，配置等は，接合するワーク２１や振動板１４の大きさ等に応じて，適宜選択する。望ましくは，貫通孔１７は，振動板１４の振動の各節目部に設ける。このようにすれば，貫通孔１７を設けても，振動板１４の振動に影響を与えにくいからである。また，全ての節目部に貫通孔１７を設けても良いが，図２に示すように，所定の箇所のみに設けても良い。例えば，ワーク２１と相対する範囲のみに設けるようにしても良い。また，この貫通孔１７は，それぞれ直径１ｍｍ〜１０ｍｍ程度の円あるいは多角形の孔が好ましい。   Therefore, the size, number, arrangement, and the like of the through holes 17 are appropriately selected according to the size of the workpiece 21 and the diaphragm 14 to be joined. Desirably, the through-hole 17 is provided at each node of vibration of the diaphragm 14. This is because even if the through hole 17 is provided, the vibration of the diaphragm 14 is hardly affected. Moreover, although the through-hole 17 may be provided in all the joint parts, as shown in FIG. 2, you may provide only in a predetermined location. For example, you may make it provide only in the range facing the workpiece | work 21. FIG. The through holes 17 are preferably circular or polygonal holes each having a diameter of about 1 mm to 10 mm.

このように貫通孔１７を設けた振動板１４をハンダ１３中で振動させると，図５に示すように，振動によって貫通孔１７をハンダ１３が通り抜ける。従って，振動板１４の上のハンダ１３と周囲のハンダ１３とが混合される。ここで，貫通孔１７の径が１ｍｍより小さいと，ハンダ１３が貫通孔１７をあまり通り抜けられないので効果が小さい。また，貫通孔１７の径が１０ｍｍより大きいと，振動板１４の振動が安定しなくなるおそれがある。あるいは，振動板１４の振動によるワーク２１の酸化膜の破壊が不十分なものとなるおそれがある。これらから，貫通孔１７の径は１〜１０ｍｍの範囲内が好ましい。   When the vibration plate 14 provided with the through hole 17 is vibrated in the solder 13 as described above, the solder 13 passes through the through hole 17 by vibration as shown in FIG. Therefore, the solder 13 on the diaphragm 14 and the surrounding solder 13 are mixed. Here, if the diameter of the through hole 17 is smaller than 1 mm, the solder 13 cannot pass through the through hole 17 so much, and thus the effect is small. If the diameter of the through hole 17 is larger than 10 mm, the vibration of the diaphragm 14 may not be stable. Alternatively, there is a possibility that the oxide film of the workpiece 21 is not sufficiently broken by the vibration of the diaphragm 14. From these, the diameter of the through hole 17 is preferably within a range of 1 to 10 mm.

次に，このハンダ塗布装置１によるハンダ塗布方法について説明する。このハンダ塗布装置１では，まず，ハンダ溶融槽１１にハンダ１３を入れ，ヒータ１２によって加熱する。そして，ハンダ溶融槽１１内をハンダ１３の融点＋２０℃程度に保つ。一般に，このハンダ１３の融点が高いものをロウ付け，低いものをハンダ付けと呼んで区別することがあるが，このハンダ塗布装置１は，そのいずれにも適用可能である。   Next, a solder coating method using the solder coating apparatus 1 will be described. In this solder coating apparatus 1, first, solder 13 is placed in a solder melting tank 11 and heated by a heater 12. The inside of the solder melting tank 11 is kept at the melting point of the solder 13 + 20 ° C. In general, the solder 13 having a high melting point is sometimes referred to as brazing and the solder having a low melting point is referred to as soldering. However, the solder coating apparatus 1 can be applied to any of them.

そして，溶融したハンダ１３中に振動板１４の下段部を浸漬する。さらに，振動板１４の下段部の上にワーク２１をセットし，超音波発振器１５を駆動して振動板１４を振動させる。ここで，山谷部は振動板１４の振幅が大きく，ワーク２１の接合面に対するキャビテーションのエネルギーが大きい。従って，ワーク２１の表面のうち山谷部に相対する箇所では，酸化膜が容易に破壊され，ワーク２１の素材とハンダ１３とが金属接触する。その一方，節目部では，振動板１４の振幅が小さいことから，ワーク２１の接合面に対するキャビテーションのエネルギーも小さく，酸化膜が破壊されにくい。すなわち，振動板１４の定常波振動により，キャビテーションのエネルギーを山谷部に集中させ，局所的に酸化膜を破壊しているのである。   Then, the lower part of the diaphragm 14 is immersed in the molten solder 13. Further, the workpiece 21 is set on the lower part of the diaphragm 14 and the ultrasonic oscillator 15 is driven to vibrate the diaphragm 14. Here, in the valley portion, the amplitude of the diaphragm 14 is large, and the cavitation energy with respect to the joint surface of the workpiece 21 is large. Therefore, the oxide film is easily broken at the portion of the surface of the work 21 that faces the mountain and valley portions, and the material of the work 21 and the solder 13 are in metal contact. On the other hand, since the amplitude of the vibration plate 14 is small at the joint, the cavitation energy with respect to the joint surface of the work 21 is also small, and the oxide film is hardly broken. That is, the cavitation energy is concentrated in the peaks and valleys by the standing wave vibration of the diaphragm 14, and the oxide film is locally destroyed.

これにより，ワーク２１の接合面に効率的にハンダ１３が塗布される。所定時間の振動によってハンダ１３が塗布されたワーク２１はハンダ溶融槽１１から引き上げられる。さらに，次のワーク２１が振動板１４の上にセットされ，再び振動板１４が振動されてハンダ１３が塗布される。   Thereby, the solder 13 is efficiently applied to the joint surface of the workpiece 21. The workpiece 21 to which the solder 13 is applied by vibration for a predetermined time is pulled up from the solder melting tank 11. Further, the next workpiece 21 is set on the vibration plate 14, and the vibration plate 14 is again vibrated to apply the solder 13.

このとき，貫通孔１７を貫通して振動板１４上のハンダ１３とハンダ溶融槽１１中のハンダ１３とが混合される。従って，振動板１４の振動によって，ワーク２１の接合面からアルミが溶けだして，振動板１４上に溜まることはない。すなわち，振動板１４上にあるハンダ１３の特性が大きく変化するおそれはない。   At this time, the solder 13 on the vibration plate 14 and the solder 13 in the solder melting tank 11 are mixed through the through hole 17. Accordingly, the vibration of the vibration plate 14 does not cause aluminum to melt from the joint surface of the workpiece 21 and accumulate on the vibration plate 14. That is, there is no possibility that the characteristics of the solder 13 on the diaphragm 14 will change greatly.

このハンダ塗布装置１によるハンダ塗布方法は，次のような用途に適用できる。例えば，シリンダヘッドとシリンダブロックとの接合では，シリンダヘッドとシリンダブロックとそれぞれの接合面に，ハンダ塗布装置１によってハンダ１３を塗布する。その後，両接合面を予熱して合わせ加圧する。あるいは，シリンダブロックにシリンダライナーを接合する場合にはシリンダライナーの接合面に，ハンダ塗布装置１でハンダ１３を塗布する。そのシリンダライナーを予熱して，ダイカスト金型にセットし，シリンダブロックを鋳ぐるみ鋳造する。   The solder coating method using the solder coating apparatus 1 can be applied to the following applications. For example, in joining the cylinder head and the cylinder block, the solder 13 is applied to the joint surfaces of the cylinder head and the cylinder block by the solder applying device 1. Thereafter, both joint surfaces are preheated and pressed together. Or when joining a cylinder liner to a cylinder block, the solder 13 is apply | coated with the solder application | coating apparatus 1 to the joining surface of a cylinder liner. The cylinder liner is preheated, set in a die-casting die, and the cylinder block is cast.

以上詳細に説明したように，本形態のハンダ塗布装置１によれば，振動板１４に貫通孔１７が設けられているので，振動板１４上のハンダ１３が貫通孔１７を通り抜けて周囲のものと混じる。従って，超音波発振器１５によって振動板１４を振動させることにより，振動板１４上に常時高純度のハンダ１３が供給される。これにより，複数のワーク２１に次々にハンダ１３を塗布する場合でも，接合強度を良好に保つことができる。   As described above in detail, according to the solder coating apparatus 1 of the present embodiment, since the through-hole 17 is provided in the vibration plate 14, the solder 13 on the vibration plate 14 passes through the through-hole 17 and has a surrounding thing. Mixed with. Accordingly, the high-purity solder 13 is always supplied onto the diaphragm 14 by vibrating the diaphragm 14 by the ultrasonic oscillator 15. Thereby, even when the solder 13 is applied to the plurality of workpieces 21 one after another, the bonding strength can be kept good.

なお，本形態は単なる例示にすぎず，本発明を何ら限定するものではない。したがって本発明は当然に，その要旨を逸脱しない範囲内で種々の改良，変形が可能である。
例えば，上記の形態では，ワーク２１をワーク固定棒２２で保持するとしたが，接合面を適切な位置に保持できればその保持方法はこれに限るものではない。例えば，ロボットハンドや吸着装置等によって保持することもできる。 In addition, this form is only a mere illustration and does not limit this invention at all. Therefore, the present invention can naturally be improved and modified in various ways without departing from the gist thereof.
For example, in the above embodiment, the workpiece 21 is held by the workpiece fixing rod 22, but the holding method is not limited to this as long as the joining surface can be held at an appropriate position. For example, it can be held by a robot hand or a suction device.

本形態のハンダ塗布装置を示す概略構成図である。It is a schematic block diagram which shows the solder application | coating apparatus of this form. 振動板を示す斜視図である。It is a perspective view which shows a diaphragm. 振動板の振動状態を示す説明図である。It is explanatory drawing which shows the vibration state of a diaphragm. 振動板の振動状態を示す説明図である。It is explanatory drawing which shows the vibration state of a diaphragm. 本形態のハンダ塗布装置によるハンダ塗布状況を示す説明図である。It is explanatory drawing which shows the solder application | coating condition by the solder application | coating apparatus of this form.

符号の説明Explanation of symbols

１ ハンダ塗布装置
１１ ハンダ溶融槽（浴槽）
１２ ヒータ（加熱装置）
１３ ハンダ
１４ 振動板（振動部材）
１５ 超音波発振器（振動装置）
１６ 超音波ホーン（振動装置）
１７ 貫通孔（貫通穴）
２１ ワーク（対象物） 1 Solder coating device 11 Solder melting tank (bathtub)
12 Heater (heating device)
13 Solder 14 Diaphragm (Vibration member)
15 Ultrasonic oscillator (vibration device)
16 Ultrasonic horn (vibration device)
17 Through hole (through hole)
21 Workpiece (object)

Claims (4)

対象物の対象面にハンダ層を形成するハンダ塗布装置において，
溶融ハンダを収容する浴槽と，
前記浴槽内のハンダを加熱する加熱装置と，
前記浴槽内の溶融ハンダに部分的に浸るとともに，溶融ハンダに浸っている部分が対象物の対象面と対面する振動部材と，
前記振動部材を振動させる振動装置とを有し，
前記振動部材のうち溶融ハンダに浸る部分に，表裏面間を貫通する貫通穴が形成されており，
前記貫通穴が，前記振動装置により前記振動部材を振動させたときに定常波振動の節目部となる箇所に形成されていることを特徴とするハンダ塗布装置。 In a solder coating apparatus that forms a solder layer on the target surface of an object,
A bathtub containing molten solder;
A heating device for heating the solder in the bathtub;
A vibration member that is partially immersed in the molten solder in the bath and in which the portion immersed in the molten solder faces the target surface of the object;
A vibration device that vibrates the vibration member;
A through hole penetrating between the front and back surfaces is formed in a portion of the vibrating member immersed in the molten solder ,
The solder coating apparatus , wherein the through hole is formed at a location that becomes a node portion of standing wave vibration when the vibration member is vibrated by the vibration device. 請求項１に記載するハンダ塗布装置において，
前記振動部材の貫通穴は，対象物の対象面と対面する範囲内に形成されていることを特徴とするハンダ塗布装置。 The solder coating apparatus according to claim 1,
The through-hole of the said vibration member is formed in the range which faces the target surface of a target object, The solder application | coating apparatus characterized by the above-mentioned. 対象物の対象面にハンダ層を形成するハンダ塗布方法において，
溶融ハンダ内で，対象物の対象面と，表裏面間を貫通する貫通穴が形成されている振動部材とを対面させ，
その状態で前記振動部材を振動させ，
前記振動部材として，貫通穴が定常波振動の節目部となる箇所に形成されているものを用いることを特徴とするハンダ塗布方法。 In a solder coating method for forming a solder layer on the target surface of an object,
In the molten solder, the target surface of the target object and the vibrating member in which a through hole penetrating between the front and back surfaces is faced,
In this state, the vibrating member is vibrated ,
As the vibration member, the solder coating method comprising Rukoto used as a through hole is formed in the portion which becomes milestone of standing wave oscillation. 請求項３に記載するハンダ塗布方法において，
前記振動部材として，対象物の対象面と対面する範囲内に貫通穴が形成されているものを用いることを特徴とするハンダ塗布方法。 In the solder application method according to claim 3,
A solder coating method using a vibrating member in which a through hole is formed within a range facing a target surface of an object.
JP2004181958A 2004-06-21 2004-06-21 Solder coating apparatus and solder coating method Expired - Fee Related JP4301088B2 (en)

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