JP4242220B2

JP4242220B2 - Electronic device cover structure

Info

Publication number: JP4242220B2
Application number: JP2003192728A
Authority: JP
Inventors: 芳裕三野
Original assignee: Alps Electric Co Ltd
Current assignee: Alps Alpine Co Ltd
Priority date: 2003-07-07
Filing date: 2003-07-07
Publication date: 2009-03-25
Anticipated expiration: 2023-07-07
Also published as: JP2005033252A

Description

【０００１】
【発明の属する技術分野】
本発明はテレビチューナ等に使用して好適な電子機器のカバー構造に関する。
【０００２】
【従来の技術】
従来の電子機器のカバー構造の図面を説明すると、図９は従来の電子機器のカバー構造を示す分解斜視図、図１０は従来の電子機器のカバー構造に係る要部断面図である。
【０００３】
次に、従来の電子機器のカバー構造の構成を図９，図１０に基づいて説明すると、金属板がロ字状に折曲されて形成された枠体５１は、両側に設けられた開放部５１ａ、５１ｂと、ロ字状のそれぞれの四辺に設けられたコ字状の孔５１ｃと、コ字状の孔５１ｃ内に位置し、枠体５１に繋がって片持ち状に形成された舌片５１ｄと、４角の近傍から下方に突出する複数個の取付足５１ｅを有する。
【０００４】
金属板からなるシールド板５２は、下方に突出する突片５２ａを有し、このシールド板５２は、枠体５１内に配置されて、枠体５１内が複数個の区画室に区画されると共に、シールド板５２が枠体５１内に配置された際、突片５２ａは、舌片５１ｄに位置した状態となる。
【０００５】
絶縁基板からなる回路基板５３は、外周縁に複数個の切り欠き部５３ａを有すると共に、表面には、配線用の導電パターン（図示せず）が設けられ、この回路基板５３には、種々の電子部品５４が搭載されて、所望の電気回路が形成されている。
【０００６】
この回路基板５３は、切り欠き部５３ａ内にシールド板５２の突片５２ａが位置した状態で、枠体５１内に収納され、半田５５によって、舌片５１ｄと突片５２ａ、及び回路基板５３に設けられた接地用パターン（図示せず）が接続、固定される。
【０００７】
この時、舌片５１ｄは、回路基板５３の接地用パターンを枠体５１に接地すると共に、半田５５付の際の熱の逃げを少なくして、半田５５付を良くするようにしている。
【０００８】
金属板からなる第１のカバー（上カバー）５６と第２のカバー（下カバー）５７のそれぞれは、四角形の平坦な平板状部５６ａ、５７ａと、この平板状部５６ａ、５７ａの４辺のそれぞれから直角に折り曲げられた側板５６ｂ、５７ｂと、この側板５６ｂ、５７ｂから突出し、根本部と先端部とが同じ幅をなした複数個の取付脚５６ｃ、５７ｃを有する。
【０００９】
このような構成を有する第１のカバー５６は、枠体５１の開放部５１ａを平板状部５６ａで覆った状態で、枠体５１の平坦面に取付脚５６ｃの先端部を弾接させて、枠体５１に取り付けられる。
【００１０】
この時、取付脚５６ｃは、根本部と先端部とが同じ幅をなしているため、先端部の弾圧力が弱く、また、取付脚５６ｃが外方に開いた状態で枠体５１に弾接した状態となるが、取付脚５６ｃは、根本部と先端部とが同じ幅となっているため、根本部の反力が弱く、開いた状態で塑性変形する。
【００１１】
また、第２のカバー５７は、枠体５１の開放部５１ｂを平板状部５７ａで覆った状態で、枠体５１の平坦面に取付脚５７ｃの先端部を弾接させて、枠体５１に取り付けられる。
【００１２】
この時、取付脚５７ｃは、根本部と先端部とが同じ幅をなしているため、先端部の弾圧力が弱く、また、取付脚５７ｃが外方に開いた状態で枠体５１に弾接した状態となるが、取付脚５７ｃは、根本部と先端部とが同じ幅となっているため、根本部の反力が弱く、開いた状態で塑性変形する。
【００１３】
また、第１，第２のカバー５６，５７が取り付けられた際、取付脚５６ｃ、５７ｃ同士は、上下方向に間隔を置いた状態で対向して配置され、このため、枠体５１が上下方向に大きくなって、大型となる。（例えば、特許文献１参照）
【００１４】
このような構成を有する従来の電子機器は、ここでは図示しないが、取付足５１ｅがマザー基板に挿通されて、枠体５１がマザー基板に取り付けられる。
この時、下カバーである第２のカバー５７の平板状部５７ａは、マザー基板と対向し、且つ、マザー基板に近接した状態になる。
【００１５】
その結果、電子機器の振動や外部環境によって、第２のカバー５７の平板状部５７ａの中央部が下方に弛んだり、或いは下方に突出し、平板状部５７ａの中央部は、マザー基板上の配線パターン（図示せず）等に接触して、マザー基板側の電気的な損傷が生じる。
【００１６】
【特許文献１】
特開２００２−９４６９号公報
【００１７】
【発明が解決しようとする課題】
従来の電子機器のカバー構造は、下カバーである第２のカバー５７の平板状部５７ａがマザー基板と対向し、且つ、マザー基板に近接した状態でになるため、電子機器の振動や外部環境によって、第２のカバー５７の平板状部５７ａの中央部が下方に弛んだり、或いは下方に突出し、平板状部５７ａの中央部は、マザー基板上の配線パターン（図示せず）等に接触して、マザー基板側の電気的な損傷が生じるという問題がある。
【００１８】
そこで、本発明は下カバーによるマザー基板側の電気的な損傷の無い電子機器のカバー構造を提供することを目的とする。
【００１９】
【課題を解決するための手段】
上記課題を解決するための第１の解決手段として、掛け止め孔を有する箱形の枠体と、この枠体内に取り付けられた回路基板と、前記枠体の開放部を覆った状態で、前記枠体に掛け止めされて取り付けられた金属板からなる下カバーとを備え、前記下カバーは、前記開放部を覆う平板状部と、この平板状部から折り曲げられた取付脚と、この取付脚の端部に設けられ、前記掛け止め孔に係止される係止部と、前記枠体内に突出するように、前記平板状部の少なくとも中央部に設けられた凹み部を有し、前記下カバーの前記平板状部は、前記枠体を取り付けたマザー基板と対向し、且つ、前記マザー基板に近接した状態で配置された構成とした。
【００２０】
また、第２の解決手段として、前記凹み部は、前記平板状部の中央部全体が凹んだ状態で形成された構成とした。
また、第３の解決手段として、前記平板状部の全外周部には、非凹み部を残存させ、前記凹み部が前記非凹み部の内方に形成された構成とした。
【００２１】
また、第４の解決手段として、前記枠体には、前記下カバーの前記平板状部を越えて突出する取付足が設けられ、前記平板状部が前記マザー基板に対向した状態で、前記取付足を前記マザー基板に取り付けた構成とした。
【００２２】
【発明の実施の形態】
本発明の電子機器のカバー構造の図面を説明すると、図１は本発明の電子機器のカバー構造を示す下面図、図２は本発明の電子機器のカバー構造に係り、カバーの一部を切り欠いた状態を示す平面図、図３は本発明の電子機器のカバー構造を示す正面図、図４は本発明の電子機器のカバー構造に係り、カバーを取り去った状態を示す正面図である。
【００２３】
また、図５は本発明の電子機器のカバー構造を示す側面図、図６は本発明の電子機器のカバー構造に係り、カバーを取り去った状態を示す側面図、図７は図３の７−７線における断面図、図８は図３の８−８線における断面図である。
【００２４】
次に、本発明の電子機器のカバー構造の構成を図１〜図８に基づいて説明すると、金属板がロ字状に折曲されて形成された枠体１は、両側に設けられた開放部１ａ、１ｂと、ロ字状のそれぞれの四辺に設けられたコ字状の孔１ｃと、コ字状の孔１ｃ内に位置し、枠体１に繋がって片持ち状に形成された接触片２と、接触片２に並設して形成された掛け止め孔１ｄと、４角の近傍から下方に突出する複数個の取付足１ｅを有する。
【００２５】
また、接触片２は、枠体１に繋がった細幅の連結部２ａと、この連結部２ａの端部に設けられ、幅寸法が連結部２ａより大きな当接部２ｂからなると共に、コ字状の孔１ｃは、接触片２の一辺側に位置し、孔１ｃの一部で形成される掛け止め孔３ａと、接触片２の他辺側に位置し、孔１ｃの一部で形成される掛け止め孔３ｂを有する。
【００２６】
そして、掛け止め孔１ｄは、掛け止め孔３ａ、３ｂよりも枠体１の中央部に設けられ、掛け止め孔３ａ、３ｂと掛け止め孔１ｄは、図４に示すように、互いに平行な異なる直線Ｓ１，Ｓ２，Ｓ３上に位置して、互いに位置ずれした状態で配置されている。
【００２７】
なお、上記実施例では、２個の掛け止め孔３ａ、３ｂを設けたもので説明したが、掛け止め孔３ａ、３ｂは、何れか一方のみでも良い。
また、接触片２は、片持ち状のもので説明したが、両持ち状のものを使用しても良い。
また、枠体１は、両側に開放部１ａ、１ｂを設けたもので説明したが、一方の開放部のみでも良い。
【００２８】
セラミック基板等からなる回路基板４は、両面、或いは片面に設けられた配線用の導電パターン５と、端面４ａの凹部４ｂ内に設けられた接地用のサイド電極６を有し、この回路基板４には、種々の電子部品７が搭載されて、所望の電気回路が形成されている。
【００２９】
この回路基板４は、枠体１内に位置した状態で、適宜手段によって枠体１に取り付けられおり、回路基板４が取り付けられた際、回路基板４の凹部４ｂが接触片２に対向すると共に、端面４ａが掛け止め孔１ｄと対向した状態となっている。
【００３０】
そして、接触片２が枠体１の外方から枠体１の内方に向けて押し圧されて、連結部２ａが曲げられると、当接部２ｂがサイド電極６に接触した状態となって、サイド電極６が枠体１に接地される。
また、ここでは図示しないが、当接部２ｂとサイド電極６とは、半田付けされて、両者が確実に導通された状態となっている。
【００３１】
金属板からなる第１のカバー（上カバー）７と第２のカバー（下カバー）８のそれぞれは、四角形の平板状部７ａ、８ａと、この平板状部７ａ、８ａの４辺のそれぞれから直角に折り曲げられた側板７ｂ、８ｂと、この側板７ｂ、８ｂに根本部が連結されて延びる複数個の取付脚７ｃ、８ｃと、この取付脚７ｃ、８ｃの一端に設けられたく字状の係止部７ｄ、８ｄを有する。
【００３２】
また、下カバーである第２のカバー８の平板状部８ａの中央部には、突き出し加工（リブ加工）によって形成された凹み部８ｅを有し、この凹み部８ｅは、平板状部８ａの中央部全体が凹んだ状態で形成されると共に、平板状部８ａの全外周部には非凹み部８ｆが設けられ、この非凹み部８ｆを残存させた状態で、非凹み部８ｆの内方に凹み部８ｅが形成されている。
また、平板状部８ａの４角の近傍には、取付足１ｅを挿通するための孔８ｇが設けられている。
【００３３】
そして、取付脚７ｃ、８ｃは、係止部７ｄ、８ｄから側板７ｂ、８ｂ、或いは平板状部７ａ、８ａに近づくに従って、漸次幅広となるように形成されており、この実施例では、取付脚７ｃ、８ｃの両側辺側で漸次幅広となして、取付脚７ｃ、８ｃがハ字状に形成されている。
【００３４】
なお、この実施例では、取付脚７ｃ、８ｃがハ字状に形成されたもので説明したが、取付脚７ｃ、８ｃの片方の側辺のみが漸次幅広となしたものでも良く、また、取付脚７ｃ、８ｃの根本部が平板状部７ａ、８ａに直接繋がったものでも良い。
【００３５】
このような構成を有する第１のカバー７は、枠体１の開放部１ａを平板状部７ａで覆った状態で、係止部７ｄを掛け止め孔３ａに係止して、枠体１に取り付けられる。
【００３６】
この時、係止部７ｄが掛け止め孔３ａに嵌入するまでの間において、取付脚７ｃが外方に開いた状態となるが、取付脚７ｃは、係止部７ｄから離れるに従って、漸次幅広となっているため、取付脚７ｃが開いた状態から戻されて、係止部７ｄが掛け止め孔３ａに嵌入するようになる。
即ち、取付脚７ｃは、開いた状態で塑性変形することなく、開く前の元の状態に確実に戻されると共に、係止部７ｄが掛け止め孔３ａに強く係止されるようになる。
【００３７】
なお、上記実施例では、係止部７ｄが掛け止め孔３ａに係止されたもので説明したが、係止部７ｄが掛け止め孔３ｂに係止されるようにしたものでも良い。
【００３８】
また、第２のカバー８は、枠体１の開放部１ｂを平板状部８ａで覆った状態で、係止部８ｄを掛け止め孔１ｄに係止して、枠体１に取り付けられると共に、孔８ｇからは取付足１ｅが突出し、凹み部８ｅが枠体１内に突出した状態となる。
【００３９】
この時、係止部８ｄが掛け止め孔１ｄに嵌入するまでの間において、取付脚８ｃが外方に開いた状態となるが、取付脚８ｃは、係止部８ｄから離れるに従って、漸次幅広となっているため、取付脚８ｃが開いた状態から戻されて、係止部８ｄが掛け止め孔１ｄに嵌入するようになる。
【００４０】
即ち、取付脚８ｃは、開いた状態で塑性変形することなく、開く前の元の状態に確実に戻されると共に、係止部８ｄが掛け止め孔１ｄに強く係止されるようになる。
【００４１】
また、図３に示すように、第１，第２のカバー７，８の側板７ｂ、８ｂには、根本部が幅広となった取付脚７ｃ、８ｃを２個以上並設しているため、隣り合う取付脚７ｃ同士間の側板７ｂ、或いは取付脚８ｃ同士間の側板８ｂは、根本部が幅広となった取付脚７ｃ、８ｃによって、上下方向に幅広の側板７ｂ、８ｂが存在するような状態となって、曲がり（枠体１からの浮き上がり）を少なくできて、枠体１との接触を良好にできる。
【００４２】
更に、根本部が幅広となった取付脚７ｃ、８ｃによって、上下方向に幅広の側板７ｂ、８ｂが存在するような状態となって、側板７ｂ、８ｂの上下方向の幅を小さくできて、小型の枠体１に適したものが得られると共に、第１，第２のカバー７，８の取付脚７ｃ、８ｃは、互い違いに配置された状態となって、枠体１を上下方向に小型化できる。
【００４３】
なお、上記実施例では、第１のカバー７の係止部７ｄが掛け止め孔３ａに係止され、第２のカバー８の係止部８ｄが掛け止め孔１ｄに係止したもので説明したが、係止部７ｄが掛け止め孔１ｄに係止されると共に、係止部８ｄが掛け止め孔３ａ、或いは、３ｂに係止されるようにしたものでも良い。
【００４４】
また、掛け止め孔１ｄを無くして、第１のカバー７の係止部７ｄが掛け止め孔３ａに係止され、第２のカバー８の係止部８ｄが掛け止め孔３ｂに係止されるようにしても良い。
また、一方のみに開放部を有する枠体にあっては、一つのカバーを用いることは勿論である。
【００４５】
このような構成を有する電子機器は、図３，図８に示すように、取付足１ｅがマザー基板９に挿通された状態で、取付足１ｅがマザー基板９に半田付けされて、電子機器は、マザー基板９に対して、伏せ型で取り付けられる。
【００４６】
この時、第２のカバー８の平板状部８ａは、マザー基板９と対向し、且つ、マザー基板９に近接した状態になると共に、平板状部８ａの中央部は、凹み部８ｅによって、マザー基板９から非凹み部８ｆよりも離れた状態となる。
【００４７】
その結果、電子機器の振動や外部環境によって、第２のカバー８の平板状部８ａの中央部が下方に弛んだり、或いは下方に突出したりしても、凹み部８ｅによって、平板状部８ａの中央部は、マザー基板９上の配線パターン（図示せず）等に接触せず、マザー基板９側の電気的な損傷が無くなる。
【００４８】
【発明の効果】
本発明の電子機器のカバー構造は、掛け止め孔を有する箱形の枠体と、この枠体内に取り付けられた回路基板と、枠体の開放部を覆った状態で、枠体に掛け止めされて取り付けられた金属板からなる下カバーとを備え、下カバーは、開放部を覆う平板状部と、この平板状部から折り曲げられた取付脚と、この取付脚の端部に設けられ、掛け止め孔に係止される係止部と、枠体内に突出するように、平板状部の少なくとも中央部に設けられた凹み部を有し、下カバーの平板状部は、枠体を取り付けたマザー基板と対向し、且つ、マザー基板に近接した状態で配置された構成とした。
このような構成によって、電子機器の振動や外部環境によって、下カバーの平板状部の中央部が下方に弛んだり、或いは下方に突出したりしても、凹み部によって、平板状部の中央部は、マザー基板上の配線パターン等に接触せず、マザー基板側の電気的な損傷の無いものが得られる。
【００４９】
また、凹み部は、平板状部の中央部全体が凹んだ状態で形成されたため、下カバーの平板状部の中央部のマザー基板への非接触を一層確実できて、電気的な損傷の無いものが得られる。
また、その加工が簡単で、生産性の良いものが得られる。
【００５０】
また、平板状部の全外周部には、非凹み部を残存させ、凹み部が非凹み部の内方に形成されたため、凹み部の強度を大きくできて、平板状部の中央部の下方への弛みの極めて少ないものが得られる。
【００５１】
また、枠体には、下カバーの平板状部を越えて突出する取付足が設けられ、平板状部がマザー基板に対向した状態で、取付足をマザー基板に取り付けたため、枠体の取付が簡単であると共に、下カバーとマザー基板との間の取付精度の良いものが得られる。
【図面の簡単な説明】
【図１】本発明の電子機器のカバー構造を示す下面図。
【図２】本発明の電子機器のカバー構造に係り、カバーの一部を切り欠いた状態を示す平面図。
【図３】本発明の電子機器のカバー構造を示す正面図。
【図４】本発明の電子機器のカバー構造に係り、カバーを取り去った状態を示す正面図。
【図５】本発明の電子機器のカバー構造を示す側面図。
【図６】本発明の電子機器のカバー構造に係り、カバーを取り去った状態を示す側面図。
【図７】図３の７−７線における断面図。
【図８】図３の８−８線における断面図。
【図９】従来の電子機器のカバー構造を示す分解斜視図。
【図１０】従来の電子機器のカバー構造に係る要部断面図。
【符号の説明】
１枠体
１ａ開放部
１ｂ開放部
１ｃ孔
１ｄ掛け止め孔
１ｅ取付足
２接触片
２ａ連結部
２ｂ当接部
３ａ掛け止め孔
３ｂ掛け止め孔
４回路基板
４ａ端面
４ｂ凹部
５導電パターン
６サイド電極
７第１のカバー（上カバー）
７ａ平板状部
７ｂ側板
７ｃ取付脚
７ｄ係止部
８第２のカバー（下カバー）
８ａ平板状部
８ｂ側板
８ｃ取付脚
８ｄ係止部
８ｅ凹み部
８ｆ非凹み部
８ｇ孔
Ｓ１〜Ｓ３直線[0001]
BACKGROUND OF THE INVENTION
The present invention relates to a cover structure for an electronic device suitable for use in a television tuner or the like.
[0002]
[Prior art]
FIG. 9 is an exploded perspective view showing a cover structure of a conventional electronic device, and FIG. 10 is a cross-sectional view of a main part of the cover structure of the conventional electronic device.
[0003]
Next, the structure of the cover structure of the conventional electronic device will be described with reference to FIGS. 9 and 10. The frame body 51 formed by bending a metal plate into a square shape has open portions provided on both sides. 51a, 51b, a U-shaped hole 51c provided on each of the four sides of the square shape, and a tongue piece that is located in the U-shaped hole 51c and is connected to the frame 51 in a cantilever shape. 51d and a plurality of mounting feet 51e protruding downward from the vicinity of the four corners.
[0004]
The shield plate 52 made of a metal plate has a projecting piece 52a that protrudes downward. The shield plate 52 is disposed in the frame body 51, and the frame body 51 is partitioned into a plurality of compartments. When the shield plate 52 is disposed in the frame 51, the projecting piece 52a is positioned on the tongue piece 51d.
[0005]
The circuit board 53 made of an insulating substrate has a plurality of notches 53a on the outer peripheral edge, and a conductive pattern (not shown) for wiring is provided on the surface. An electronic component 54 is mounted to form a desired electric circuit.
[0006]
The circuit board 53 is accommodated in the frame 51 with the protruding piece 52 a of the shield plate 52 positioned in the notch 53 a, and is attached to the tongue piece 51 d and the protruding piece 52 a and the circuit board 53 by the solder 55. A grounding pattern (not shown) provided is connected and fixed.
[0007]
At this time, the tongue piece 51d grounds the grounding pattern of the circuit board 53 to the frame body 51, and reduces the escape of heat when the solder 55 is attached so as to improve the solder 55 attachment.
[0008]
Each of the first cover (upper cover) 56 and the second cover (lower cover) 57 made of a metal plate has a rectangular flat plate-like portion 56a, 57a and four sides of the plate-like portions 56a, 57a. Side plates 56b and 57b that are bent at right angles from each side, and a plurality of mounting legs 56c and 57c that protrude from the side plates 56b and 57b and have the same width at the root and the tip.
[0009]
The first cover 56 having such a configuration is such that the tip of the mounting leg 56c is elastically contacted with the flat surface of the frame 51 in a state where the open portion 51a of the frame 51 is covered with the flat plate portion 56a. It is attached to the frame 51.
[0010]
At this time, since the mounting leg 56c has the same width at the base part and the tip part, the elastic force at the tip part is weak, and the mounting leg 56c is elastically contacted with the frame 51 in a state where the mounting leg 56c is opened outward. However, since the base portion and the tip portion have the same width, the mounting leg 56c is plastically deformed in an open state because the reaction force of the base portion is weak.
[0011]
In addition, the second cover 57 is configured so that the distal end portion of the mounting leg 57 c is elastically contacted with the flat surface of the frame 51 in a state where the open portion 51 b of the frame 51 is covered with the flat plate portion 57 a. It is attached.
[0012]
At this time, since the mounting leg 57c has the same width at the base part and the tip part, the elastic pressure at the tip part is weak, and the mounting leg 57c is elastically contacted with the frame body 51 with the mounting leg 57c opened outward. However, since the root portion and the tip end portion have the same width, the attachment leg 57c is plastically deformed in an open state because the reaction force of the root portion is weak.
[0013]
Further, when the first and second covers 56 and 57 are attached, the attachment legs 56c and 57c are arranged to face each other with a space in the vertical direction, and thus the frame 51 is arranged in the vertical direction. It becomes large and becomes large. (For example, see Patent Document 1)
[0014]
In the conventional electronic device having such a configuration, although not shown here, the attachment legs 51e are inserted into the mother board, and the frame 51 is attached to the mother board.
At this time, the flat plate portion 57a of the second cover 57, which is the lower cover, faces the mother substrate and is in a state close to the mother substrate.
[0015]
As a result, the central portion of the flat plate portion 57a of the second cover 57 is slackened or protrudes downward due to the vibration of the electronic device or the external environment, and the central portion of the flat plate portion 57a is the wiring on the mother board. Contact with a pattern (not shown) or the like causes electrical damage on the mother substrate side.
[0016]
[Patent Document 1]
Japanese Patent Laid-Open No. 2002-9469
[Problems to be solved by the invention]
In the cover structure of the conventional electronic device, the flat plate portion 57a of the second cover 57, which is the lower cover, faces the mother substrate and is close to the mother substrate. As a result, the central portion of the flat plate portion 57a of the second cover 57 is slackened or protrudes downward, and the central portion of the flat plate portion 57a contacts a wiring pattern (not shown) on the mother board. Thus, there is a problem that electrical damage occurs on the mother substrate side.
[0018]
SUMMARY OF THE INVENTION Accordingly, an object of the present invention is to provide a cover structure for an electronic device that is free from electrical damage on the mother board side by a lower cover.
[0019]
[Means for Solving the Problems]
As a first solving means for solving the above-mentioned problem, the box-shaped frame body having a retaining hole, a circuit board attached to the frame body, and a state in which the open portion of the frame body is covered, A lower cover made of a metal plate attached to the frame body, the lower cover covering the open portion, a mounting leg bent from the flat plate portion, and the mounting leg And a recess portion provided at least in the center of the flat plate-like portion so as to protrude into the frame body. The flat plate-like portion of the cover is arranged to face the mother substrate to which the frame body is attached and to be disposed in a state close to the mother substrate.
[0020]
Further, as a second solving means, the dent portion is formed in a state where the entire central portion of the flat plate portion is recessed.
As a third solving means, a non-recessed portion is left on the entire outer peripheral portion of the flat plate-like portion, and the recessed portion is formed inside the non-recessed portion.
[0021]
Further, as a fourth solving means, the frame body is provided with mounting feet that protrude beyond the flat plate portion of the lower cover, and the mounting plate is mounted with the flat plate portion facing the mother board. The foot was attached to the mother substrate.
[0022]
DETAILED DESCRIPTION OF THE INVENTION
FIG. 1 is a bottom view showing a cover structure of an electronic device according to the present invention, and FIG. 2 relates to the cover structure of the electronic device according to the present invention. FIG. 3 is a front view showing the cover structure of the electronic device of the present invention, and FIG. 4 is a front view showing the cover structure of the electronic device of the present invention with the cover removed.
[0023]
5 is a side view showing the cover structure of the electronic device of the present invention, FIG. 6 is a side view showing the cover structure of the electronic device of the present invention, with the cover removed, and FIG. FIG. 8 is a cross-sectional view taken along line 8-8 in FIG.
[0024]
Next, the configuration of the cover structure of the electronic device according to the present invention will be described with reference to FIGS. 1 to 8. The frame body 1 formed by bending a metal plate into a square shape is open on both sides. Parts 1a, 1b, U-shaped holes 1c provided on each of the four sides of the square shape, and contacts located within the U-shaped holes 1c and connected to the frame 1 in a cantilevered manner It has a piece 2, a retaining hole 1d formed in parallel with the contact piece 2, and a plurality of mounting feet 1e protruding downward from the vicinity of the four corners.
[0025]
The contact piece 2 includes a narrow connecting portion 2a connected to the frame body 1 and an end portion of the connecting portion 2a. The contact piece 2 includes a contact portion 2b having a width dimension larger than that of the connecting portion 2a. The hole 1c in the shape of the contact piece 2 is located on one side of the contact piece 2 and is formed on a part of the hole 1c, and the latch hole 3a is located on the other side of the contact piece 2 and is formed on a part of the hole 1c. There is a retaining hole 3b.
[0026]
The latch hole 1d is provided at the center of the frame 1 rather than the latch holes 3a and 3b. The latch holes 3a and 3b and the latch hole 1d are different from each other in parallel as shown in FIG. Located on the straight lines S1, S2, S3, they are arranged in a mutually displaced state.
[0027]
In the above embodiment, the description has been given of the case where the two retaining holes 3a and 3b are provided. However, only one of the retaining holes 3a and 3b may be provided.
Further, the contact piece 2 has been described as being cantilevered, but a double-sided contact piece may be used.
The frame 1 has been described as having the opening portions 1a and 1b on both sides, but only one opening portion may be provided.
[0028]
A circuit board 4 made of a ceramic substrate or the like has a conductive pattern 5 for wiring provided on both sides or one side, and a side electrode 6 for grounding provided in a recess 4b of the end face 4a. A variety of electronic components 7 are mounted to form a desired electric circuit.
[0029]
The circuit board 4 is attached to the frame body 1 by appropriate means while being located in the frame body 1, and when the circuit board 4 is attached, the concave portion 4 b of the circuit board 4 faces the contact piece 2. The end face 4a faces the retaining hole 1d.
[0030]
When the contact piece 2 is pressed from the outside of the frame 1 toward the inside of the frame 1 and the connecting portion 2a is bent, the contact portion 2b is in contact with the side electrode 6. The side electrode 6 is grounded to the frame 1.
In addition, although not shown here, the contact portion 2b and the side electrode 6 are soldered so that the two are reliably conducted.
[0031]
Each of the first cover (upper cover) 7 and the second cover (lower cover) 8 made of a metal plate includes a rectangular flat plate-like portion 7a, 8a and four sides of the flat plate-like portion 7a, 8a. Side plates 7b and 8b bent at a right angle, a plurality of mounting legs 7c and 8c extending with the root portions connected to the side plates 7b and 8b, and a rectangular-shaped engagement provided at one end of the mounting legs 7c and 8c. Stop portions 7d and 8d are provided.
[0032]
In addition, a central portion of the flat plate-like portion 8a of the second cover 8 that is the lower cover has a concave portion 8e formed by a protruding process (rib processing), and the concave portion 8e corresponds to the flat plate-like portion 8a. The central portion is formed in a recessed state, and a non-recessed portion 8f is provided on the entire outer peripheral portion of the flat plate-like portion 8a, and the inner portion of the non-recessed portion 8f is left with the non-recessed portion 8f remaining. A recess 8e is formed in the bottom.
Moreover, the hole 8g for inserting the attachment leg 1e is provided in the vicinity of the four corners of the flat plate-like portion 8a.
[0033]
The mounting legs 7c, 8c are formed so as to gradually become wider as they approach the side plates 7b, 8b or the flat plate-like parts 7a, 8a from the locking portions 7d, 8d. In this embodiment, the mounting legs The mounting legs 7c and 8c are formed in a letter C shape with the width gradually increasing on both sides of 7c and 8c.
[0034]
In this embodiment, the mounting legs 7c and 8c are formed in a C shape. However, only one side of the mounting legs 7c and 8c may be gradually widened. The base portion of the legs 7c and 8c may be directly connected to the flat plate portions 7a and 8a.
[0035]
The first cover 7 having such a structure is configured such that the locking portion 7d is locked to the latching hole 3a in a state where the open portion 1a of the frame 1 is covered with the flat plate-like portion 7a. It is attached.
[0036]
At this time, until the engaging portion 7d is fitted into the latching hole 3a, the mounting leg 7c is opened outward, but the mounting leg 7c gradually increases in width as it moves away from the engaging portion 7d. Therefore, the attachment leg 7c is returned from the opened state, and the locking portion 7d is fitted into the latching hole 3a.
That is, the mounting leg 7c is reliably returned to the original state before opening without being plastically deformed in the opened state, and the locking portion 7d is strongly locked in the latching hole 3a.
[0037]
In the above-described embodiment, the locking portion 7d is locked to the latching hole 3a. However, the locking portion 7d may be locked to the latching hole 3b.
[0038]
The second cover 8 is attached to the frame 1 with the locking portion 8d locked to the latching hole 1d with the open portion 1b of the frame 1 covered with the flat plate portion 8a. The mounting foot 1e protrudes from the hole 8g, and the recessed portion 8e protrudes into the frame body 1.
[0039]
At this time, until the engaging portion 8d is fitted into the latching hole 1d, the mounting leg 8c is in a state of opening outward, but the mounting leg 8c gradually increases in width as it moves away from the engaging portion 8d. Therefore, the attachment leg 8c is returned from the opened state, and the locking portion 8d is inserted into the locking hole 1d.
[0040]
That is, the mounting leg 8c is reliably returned to the original state before opening without being plastically deformed in the opened state, and the locking portion 8d is firmly locked in the latching hole 1d.
[0041]
Further, as shown in FIG. 3, since the base plates 7b and 8b of the first and second covers 7 and 8 are provided with two or more mounting legs 7c and 8c whose base portions are wide, Side plates 7b between adjacent mounting legs 7c or side plates 8b between mounting legs 8c have side plates 7b, 8b that are wide in the vertical direction due to mounting legs 7c, 8c having a wide base portion. In this state, bending (lifting from the frame body 1) can be reduced, and contact with the frame body 1 can be improved.
[0042]
Further, the mounting legs 7c and 8c having the wide base portion are in a state in which the wide side plates 7b and 8b exist in the vertical direction, so that the vertical width of the side plates 7b and 8b can be reduced. And the mounting legs 7c and 8c of the first and second covers 7 and 8 are alternately arranged to reduce the size of the frame 1 in the vertical direction. it can.
[0043]
In the above-described embodiment, the description has been given on the assumption that the locking portion 7d of the first cover 7 is locked to the latching hole 3a and the locking portion 8d of the second cover 8 is locked to the latching hole 1d. However, the engaging portion 7d may be engaged with the retaining hole 1d and the engaging portion 8d may be engaged with the retaining hole 3a or 3b.
[0044]
Further, the latching hole 1d is eliminated, the latching part 7d of the first cover 7 is latched to the latching hole 3a, and the latching part 8d of the second cover 8 is latched to the latching hole 3b. You may do it.
Of course, in the case of a frame having an open portion on only one side, one cover is used.
[0045]
As shown in FIGS. 3 and 8, the electronic device having such a configuration is such that the mounting foot 1 e is soldered to the mother substrate 9 with the mounting foot 1 e inserted through the mother substrate 9, and the electronic device is , It is attached to the mother substrate 9 in a face down form.
[0046]
At this time, the flat plate-like portion 8a of the second cover 8 faces the mother substrate 9 and is close to the mother substrate 9, and the central portion of the flat plate-like portion 8a is formed by the recess portion 8e. The substrate 9 is separated from the non-recessed portion 8f.
[0047]
As a result, even if the central portion of the flat plate portion 8a of the second cover 8 is slackened or protrudes downward due to vibration of the electronic device or the external environment, the depression of the flat plate portion 8a is caused by the recess portion 8e. The central portion does not come into contact with a wiring pattern (not shown) or the like on the mother board 9, and electrical damage on the mother board 9 side is eliminated.
[0048]
【The invention's effect】
The cover structure of the electronic device according to the present invention is hung on the frame body in a state of covering the box-shaped frame body having the retaining holes, the circuit board attached to the frame body, and the open portion of the frame body. A lower cover made of a metal plate attached to the flat plate. The lower cover is provided on a flat plate portion covering the open portion, a mounting leg bent from the flat plate portion, and an end of the mounting leg. There is a locking portion locked to the stop hole, and a recess portion provided at least in the center of the flat plate-like portion so as to protrude into the frame body, and the flat plate-like portion of the lower cover has a frame attached It was set as the structure arrange | positioned in the state which opposes the mother board | substrate and was close to the mother board | substrate.
With such a configuration, even if the central portion of the flat plate portion of the lower cover is slacked downward or protrudes downward due to vibration of the electronic device or the external environment, the central portion of the flat plate portion is Thus, a substrate that does not come into contact with the wiring pattern on the mother substrate and that is not electrically damaged on the mother substrate side can be obtained.
[0049]
Moreover, since the dent part was formed in the state where the whole center part of the flat plate-like part was depressed, the non-contact to the mother substrate of the central part of the flat plate part of the lower cover can be further ensured, and there is no electrical damage. Things are obtained.
Moreover, the process is easy and a product with good productivity can be obtained.
[0050]
In addition, since the non-recessed portion remains on the entire outer periphery of the flat plate-like portion and the concave portion is formed inward of the non-recessed portion, the strength of the concave portion can be increased, and the lower portion of the central portion of the flat plate-like portion A product with very little slackening is obtained.
[0051]
Also, the frame is provided with mounting feet that protrude beyond the flat plate portion of the lower cover, and the mounting feet are attached to the mother substrate in a state where the flat plate portion faces the mother substrate. In addition to being simple, it is possible to obtain a device with good mounting accuracy between the lower cover and the mother board.
[Brief description of the drawings]
FIG. 1 is a bottom view showing a cover structure of an electronic apparatus according to the invention.
FIG. 2 is a plan view showing a state in which a part of the cover is cut away, according to the cover structure of the electronic apparatus of the present invention.
FIG. 3 is a front view illustrating a cover structure of the electronic device according to the invention.
FIG. 4 is a front view showing a state in which the cover is removed according to the cover structure of the electronic apparatus of the invention.
FIG. 5 is a side view showing a cover structure of an electronic apparatus according to the invention.
FIG. 6 is a side view showing a state in which the cover is removed according to the cover structure of the electronic apparatus of the invention.
7 is a cross-sectional view taken along line 7-7 in FIG.
8 is a cross-sectional view taken along line 8-8 in FIG.
FIG. 9 is an exploded perspective view showing a cover structure of a conventional electronic device.
FIG. 10 is a cross-sectional view of a main part according to a cover structure of a conventional electronic device.
[Explanation of symbols]
DESCRIPTION OF SYMBOLS 1 Frame 1a Opening part 1b Opening part 1c Hole 1d Latching hole 1e Mounting leg 2 Contact piece 2a Connection part 2b Contact part 3a Latching hole 3b Latching hole 4 Circuit board 4a End surface 4b Recessed part 5 Conductive pattern 6 Side electrode 7 First cover (upper cover)
7a Flat portion 7b Side plate 7c Mounting leg 7d Locking portion 8 Second cover (lower cover)
8a Flat plate portion 8b Side plate 8c Mounting leg 8d Locking portion 8e Recessed portion 8f Non-recessed portion 8g Holes S1 to S3 Straight line

Claims

掛け止め孔を有する箱形の枠体と、この枠体内に取り付けられた回路基板と、前記枠体の開放部を覆った状態で、前記枠体に掛け止めされて取り付けられた金属板からなる下カバーとを備え、前記下カバーは、前記開放部を覆う平板状部と、この平板状部から折り曲げられた取付脚と、この取付脚の端部に設けられ、前記掛け止め孔に係止される係止部と、前記枠体内に突出するように、前記平板状部の少なくとも中央部に設けられた凹み部を有し、前記下カバーの前記平板状部は、前記枠体を取り付けたマザー基板と対向し、且つ、前記マザー基板に近接した状態で配置されたことを特徴とする電子機器のカバー構造。A box-shaped frame having a latching hole, a circuit board mounted in the frame, and a metal plate that is latched and attached to the frame while covering an open portion of the frame. A lower cover, and the lower cover is provided on a flat plate portion covering the open portion, an attachment leg bent from the flat plate portion, and an end of the attachment leg, and is latched in the latch hole. And a recessed portion provided at least in the center of the flat plate-like portion so as to protrude into the frame body, and the flat plate-like portion of the lower cover has the frame attached thereto A cover structure for an electronic device, wherein the cover structure is disposed so as to face a mother substrate and be close to the mother substrate.

前記凹み部は、前記平板状部の中央部全体が凹んだ状態で形成されたことを特徴とする請求項１記載の電子機器のカバー構造。2. The cover structure for an electronic device according to claim 1, wherein the recessed portion is formed in a state where the entire central portion of the flat plate-shaped portion is recessed.

前記平板状部の全外周部には、非凹み部を残存させ、前記凹み部が前記非凹み部の内方に形成されたことを特徴とする請求項１、又は２記載の電子機器のカバー構造。The cover of the electronic device according to claim 1, wherein a non-recessed portion is left on the entire outer peripheral portion of the flat plate-like portion, and the recessed portion is formed inward of the non-recessed portion. Construction.

前記枠体には、前記下カバーの前記平板状部を越えて突出する取付足が設けられ、前記平板状部が前記マザー基板に対向した状態で、前記取付足を前記マザー基板に取り付けたことを特徴とする請求項１から３の何れかに記載の電子機器のカバー構造。The frame body is provided with mounting feet that protrude beyond the flat plate-like portion of the lower cover, and the mounting feet are attached to the mother substrate in a state where the flat plate-like portion faces the mother substrate. The cover structure for an electronic device according to claim 1, wherein the cover structure is an electronic device.