JP4236591B2 - Sample surface analyzer - Google Patents

Sample surface analyzer Download PDF

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JP4236591B2
JP4236591B2 JP2004001522A JP2004001522A JP4236591B2 JP 4236591 B2 JP4236591 B2 JP 4236591B2 JP 2004001522 A JP2004001522 A JP 2004001522A JP 2004001522 A JP2004001522 A JP 2004001522A JP 4236591 B2 JP4236591 B2 JP 4236591B2
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sample
cutting
light
diamond
tip
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JP2005195438A (en
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逸雄 西山
芳雄 木嶋
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ダイプラ・ウィンテス株式会社
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    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N3/00—Investigating strength properties of solid materials by application of mechanical stress
    • G01N3/40—Investigating hardness or rebound hardness
    • G01N3/42—Investigating hardness or rebound hardness by performing impressions under a steady load by indentors, e.g. sphere, pyramid
    • G01N3/46—Investigating hardness or rebound hardness by performing impressions under a steady load by indentors, e.g. sphere, pyramid the indentors performing a scratching movement
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N2203/00—Investigating strength properties of solid materials by application of mechanical stress
    • G01N2203/0001—Type of application of the stress
    • G01N2203/0012—Constant speed test
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N2203/00—Investigating strength properties of solid materials by application of mechanical stress
    • G01N2203/02—Details not specific for a particular testing method
    • G01N2203/022—Environment of the test
    • G01N2203/0248—Tests "on-line" during fabrication
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N2203/00—Investigating strength properties of solid materials by application of mechanical stress
    • G01N2203/02—Details not specific for a particular testing method
    • G01N2203/06—Indicating or recording means; Sensing means
    • G01N2203/0641—Indicating or recording means; Sensing means using optical, X-ray, ultraviolet, infrared or similar detectors

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  • Physics & Mathematics (AREA)
  • Health & Medical Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Biochemistry (AREA)
  • General Health & Medical Sciences (AREA)
  • General Physics & Mathematics (AREA)
  • Immunology (AREA)
  • Pathology (AREA)
  • Sampling And Sample Adjustment (AREA)
  • Investigating Or Analysing Materials By Optical Means (AREA)

Description

本発明は、試料表面分析装置に関し、さらに詳しくは、試料の表面を切削するのと正に同時に試料の切削面のデータを測定することが出来る試料表面分析装置に関する。   The present invention relates to a sample surface analysis apparatus, and more particularly to a sample surface analysis apparatus capable of measuring data on a cutting surface of a sample exactly at the same time as cutting the surface of the sample.

従来、切刃を試料に切り込ませ試料に対し一方向に相対移動して試料の表面を切削し、その切削結果を解析して試料表面の塗装膜の剪断強度および剥離強度を測定する表面物性解析装置が知られている（例えば、特許文献１参照。）。
また、試料の切削とデータの測定をほぼ同時（切削から１０分以内）に行う分析方法が提案されている（例えば、特許文献２参照。）。 Conventionally, a cutting edge is cut into a sample and moved relative to the sample in one direction to cut the surface of the sample, and the cutting results are analyzed to measure the shear strength and peel strength of the coating film on the sample surface. An analysis apparatus is known (for example, refer to Patent Document 1).
In addition, an analysis method has been proposed in which sample cutting and data measurement are performed almost simultaneously (within 10 minutes after cutting) (see, for example, Patent Document 2).

特開２００２−１９５９３８号公報JP 2002-195938 A 特開２００２−３６５１８３号公報JP 2002-365183 A

従来の表面物性解析装置による切削面の分析は、測定の邪魔にならない位置まで切刃を動かしてから試料の切削面のデータを測定する必要があり、切削と同時に測定できない問題点があった。
また、従来の分析方法では、切削ポイント（試料の正に切削中の点）で測定しているのではなく、切削により生じた切削面で測定している。このため、実際には切削と同時に測定が行われていない問題点があった。
そこで、本発明の目的は、試料の表面を切削するのと正に同時に試料の切削面のデータを測定することが出来る試料表面分析装置を提供することにある。 In the analysis of the cutting surface by the conventional surface property analyzer, it is necessary to measure the data of the cutting surface of the sample after moving the cutting blade to a position that does not interfere with the measurement.
Further, in the conventional analysis method, measurement is not performed at a cutting point (a point being cut right on the sample), but is measured at a cutting surface generated by cutting. For this reason, there was a problem that the measurement was not actually performed simultaneously with the cutting.
Therefore, an object of the present invention is to provide a sample surface analysis apparatus capable of measuring data on a cutting surface of a sample at the same time as cutting the surface of the sample.

第１の観点では、本発明は、ダイヤモンド切刃の先端部を試料に切り込ませ試料に対し一方向に相対移動して試料の表面を切削する試料表面切削手段と、前記ダイヤモンド切刃を透過して前記先端部に測定光を照射するための光源と、前記先端部を経た測定光を受光する検出器とを具備することを特徴とする試料表面分析装置を提供する。
上記第１の観点による試料表面分析装置では、測定光が透過するダイヤモンド切刃を用い、ダイヤモンド切刃を透過し、ダイヤモンド切刃の先端部から出て試料の切削ポイントで反射された測定光を受光する。これにより、試料の表面を切削するのと正に同時に試料の切削面のデータを測定することが出来る。
なお、ダイヤモンド切刃は赤外線に対する透過率が高いため、赤外線分光分析に適している。 In a first aspect, the present invention relates to a sample surface cutting means for cutting the surface of a sample by cutting the tip of the diamond cutting blade into the sample and moving it relative to the sample in one direction, and passing through the diamond cutting blade. And providing a sample surface analysis apparatus comprising: a light source for irradiating the tip portion with measurement light; and a detector for receiving the measurement light having passed through the tip portion.
In the sample surface analysis apparatus according to the first aspect, the diamond cutting blade that transmits the measurement light is used, the measurement light that passes through the diamond cutting blade, exits from the tip of the diamond cutting blade, and is reflected at the cutting point of the sample. Receive light. Thereby, the data of the cut surface of the sample can be measured just as the surface of the sample is cut.
The diamond cutting blade is suitable for infrared spectroscopic analysis because of its high transmittance for infrared rays.

第２の観点では、本発明は、上記構成の試料表面分析装置において、前記ダイヤモンド切刃の先端部および測定光の入出射部を除く全表面または一部表面を遮光膜で被覆したことを特徴とする試料表面分析装置を提供する。
上記第２の観点による試料表面分析装置では、ダイヤモンド切刃の先端部および測定光の入出射部を除く表面からノイズ光が混入することを抑制でき、分析精度を向上させることが出来る。 In a second aspect, the present invention is the sample surface analysis apparatus having the above-described configuration, wherein the entire surface or a part of the surface excluding the tip of the diamond cutting edge and the measurement light incident / exit portion is covered with a light shielding film. A sample surface analysis apparatus is provided.
In the sample surface analysis apparatus according to the second aspect, noise light can be prevented from being mixed from the surface excluding the tip portion of the diamond cutting blade and the incident / exit portion of the measurement light, and the analysis accuracy can be improved.

本発明の試料表面分析装置によれば、試料の表面を切削するのと正に同時に試料の切削面を測定することが出来る。   According to the sample surface analysis apparatus of the present invention, the cutting surface of the sample can be measured just at the same time as the surface of the sample is cut.

以下、図に示す実施の形態により本発明をさらに詳細に説明する。なお、これにより本発明が限定されるものではない。   Hereinafter, the present invention will be described in more detail with reference to embodiments shown in the drawings. Note that the present invention is not limited thereby.

図１は、実施例１に係る試料表面分析装置１００の構成説明図である。
この試料表面分析装置１００は、ダイヤモンド切刃１と、ダイヤモンド切刃１を固定する切刃取付部材１１と、切刃取付部材１１を介してダイヤモンド切刃１を矢印αのように移動させる切刃移動機構１２と、ダイヤモンド切刃１の先端部１ａにダイヤモンド切刃１を透過して測定光を照射するための光源３と、ダイヤモンド切刃１の先端部１ａから出て試料Ｐで反射され再びダイヤモンド切刃１を透過した測定光を受光する光検出器４と、ダイヤモンド切刃１で試料Ｐの表面を切削すると共に光検出器４による受光結果を基に物性解析を行う表面物性解析装置本体１０と、試料Ｐを保持する試料保持台２０とを具備している。 FIG. 1 is an explanatory diagram of a configuration of a sample surface analysis apparatus 100 according to the first embodiment.
The sample surface analysis apparatus 100 includes a diamond cutting blade 1, a cutting blade mounting member 11 that fixes the diamond cutting blade 1, and a cutting blade that moves the diamond cutting blade 1 as indicated by an arrow α via the cutting blade mounting member 11. The moving mechanism 12, the light source 3 for transmitting the diamond cutting blade 1 to the tip 1a of the diamond cutting blade 1 and irradiating the measuring light, and the light emitted from the tip 1a of the diamond cutting blade 1 and reflected by the sample P are again Photodetector 4 for receiving measurement light transmitted through the diamond cutting edge 1 and surface physical property analyzing apparatus main body for cutting the surface of the sample P with the diamond cutting edge 1 and analyzing physical properties based on the light reception result by the photodetector 4 10 and a sample holder 20 for holding the sample P.

図１に示すように、ダイヤモンド切刃１の側面は、遮光膜２ｓで被覆されている。
また、図２に示すように、ダイヤモンド切刃１の先端部１ａを除く底面１ｃは、遮光膜２ｃで被覆されている。また、ダイヤモンド切刃１の先端部１ａを除くすくい面１ｄは、遮光膜２ｄで被覆されている。
遮光膜２ｓ，２ｃ，２ｄは、例えばＴｉＮ膜，Ｔｉ膜または無機物膜を蒸着したものである。 As shown in FIG. 1, the side surface of the diamond cutting edge 1 is covered with a light shielding film 2s.
Further, as shown in FIG. 2, the bottom surface 1c excluding the tip 1a of the diamond cutting blade 1 is covered with a light shielding film 2c. Further, the rake face 1d excluding the tip 1a of the diamond cutting edge 1 is covered with a light shielding film 2d.
The light shielding films 2s, 2c, and 2d are formed by depositing, for example, a TiN film, a Ti film, or an inorganic film.

表面物性解析装置本体１０は、従来公知の構成もしくは特願２００１−３９３３２２号や特願２００２−０６８８２０号で本願出願人が提案している構成である。   The surface physical property analyzing apparatus main body 10 has a conventionally known configuration or a configuration proposed by the present applicant in Japanese Patent Application Nos. 2001-393322 and 2002-068820.

図２は、切削と正に同時に測定を行っている状態を示す概念図である。
測定光は、光源３からダイヤモンド切刃１の光入出射面１ｂを通ってダイヤモンド切刃１内に入射し、ダイヤモンド切刃１の先端部１ａに照射される。
ダイヤモンド切刃１の先端部１ａから出て試料Ｐの切削ポイントＰｐで反射された測定光は、ダイヤモンド切刃１の先端部１ａを通ってダイヤモンド切刃１内に入射し、ダイヤモンド切刃１の光入出射面１ｂから出て、光検出器４で受光される。 FIG. 2 is a conceptual diagram showing a state in which measurement is performed simultaneously with cutting.
The measurement light is incident on the diamond cutting blade 1 from the light source 3 through the light incident / exit surface 1 b of the diamond cutting blade 1 and is irradiated on the tip 1 a of the diamond cutting blade 1.
The measurement light that exits from the tip 1a of the diamond cutting blade 1 and is reflected at the cutting point Pp of the sample P enters the diamond cutting blade 1 through the tip 1a of the diamond cutting blade 1, and the diamond cutting blade 1 The light exits from the light incident / exit surface 1 b and is received by the photodetector 4.

実施例１の試料表面分析装置１００によれば、試料Ｐの表面を切削するのと正に同時にリアルタイムで分析するため試料Ｐの切削ポイントＰｐの深さに対応したデータを測定することが出来る。また、遮光膜２ｓ，２ｃ，２ｄによりノイズ光の混入を抑制でき、分析精度を向上させることが出来る。   According to the sample surface analysis apparatus 100 of the first embodiment, data corresponding to the depth of the cutting point Pp of the sample P can be measured because the analysis is performed in real time just as the surface of the sample P is cut. Further, the mixing of noise light can be suppressed by the light shielding films 2s, 2c, and 2d, and the analysis accuracy can be improved.

本発明の試料表面分析装置は、自動車等の塗装膜の性能評価を行うのに利用できる。   The sample surface analysis apparatus of the present invention can be used to evaluate the performance of a coating film of an automobile or the like.

実施例１に係る試料表面分析装置を示す構成説明図である。BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a configuration explanatory view showing a sample surface analyzer according to a first embodiment. 切削と正に同時に測定を行っている状態を示す概念図である。It is a conceptual diagram which shows the state which is measuring at the same time as cutting.

符号の説明Explanation of symbols

１ ダイヤモンド切刃
１ａ 先端部
１ｂ 光入出射面
１ｃ 底面
１ｄ すくい面
２ｃ，２ｄ，２ｓ 遮光膜
３ 光源
４ 光検出器
１０ 表面物性解析装置本体
１１ 切刃取付部材
１２ 切刃移動機構
２０ 試料保持台
１００ 試料表面分析装置
Ｃ 切削片
Ｐ 試料
Ｐｐ 切削ポイント DESCRIPTION OF SYMBOLS 1 Diamond cutting edge 1a Tip part 1b Light incident / exit surface 1c Bottom surface 1d Rake face 2c, 2d, 2s Light-shielding film 3 Light source 4 Photodetector 10 Surface physical property analyzer main body 11 Cutting blade mounting member 12 Cutting edge moving mechanism 20 Sample holding stand 100 Sample surface analyzer C Cutting piece P Sample Pp Cutting point

Claims (2)

ダイヤモンド切刃の先端部を試料に切り込ませ試料に対し一方向に相対移動して試料の表面を切削する試料表面切削手段と、前記ダイヤモンド切刃を透過して前記先端部に測定光を照射するための光源と、試料の切削中に前記先端部から出て試料の切削ポイントで反射された測定光を前記ダイヤモンド切刃を透過して受光する検出器とを具備し、試料の切削深さに対応した試料切削面の光学的データを測定することを特徴とする試料表面分析装置。 Sample surface cutting means for cutting the surface of the sample by cutting the tip of the diamond cutting edge into the sample and moving the sample relative to the sample in one direction, and irradiating the tip with the measurement light through the diamond cutting blade light source and exits from the tip during cutting of the sample measurement light reflected by the cutting point of the sample and a detector for receiving light transmitted through the diamond cutting edge, the cutting depth of the sample to A sample surface analysis apparatus for measuring optical data of a sample cutting surface corresponding to the above . 請求項１に記載の試料表面分析装置において、前記先端部および測定光の入出射部を除く全表面または一部表面を遮光膜で被覆したダイヤモンド切刃を用いることを特徴とする試料表面分析装置。 Te sample surface analyzer smell of claim 1, the sample surface, which comprises using a diamond cutting edge coated with a light-shielding film the entire surface or part of the surface except for the input and output portions of the destination end and the measuring beam Analysis equipment.
JP2004001522A 2004-01-07 2004-01-07 Sample surface analyzer Expired - Lifetime JP4236591B2 (en)

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