JP4222616B2 - Connected device - Google Patents

Connected device Download PDF

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JP4222616B2
JP4222616B2 JP2005286806A JP2005286806A JP4222616B2 JP 4222616 B2 JP4222616 B2 JP 4222616B2 JP 2005286806 A JP2005286806 A JP 2005286806A JP 2005286806 A JP2005286806 A JP 2005286806A JP 4222616 B2 JP4222616 B2 JP 4222616B2
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frame
connection
aggregate
electrode
connecting member
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JP2007095632A (en
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一樹 西東
正己 北山
誠也 松尾
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Japan Aviation Electronics Industry Ltd
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Japan Aviation Electronics Industry Ltd
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Priority to US11/985,915 priority patent/US7448878B2/en
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  • Connecting Device With Holders (AREA)

Description

本発明は、接続装置に関し、詳しくは、カマボコ形状の接続部材を備えた接続装置に関する。   The present invention relates to a connection device, and more particularly, to a connection device provided with a connecting member having a hook shape.

図１２及び図１３は従来技術による基板とＩＣとを接続するコネクタを示す図で、図１２は部分断面図、図１３は斜視図である（特許文献１、参照）。   12 and 13 are views showing a connector for connecting a substrate and an IC according to the prior art, FIG. 12 is a partial sectional view, and FIG. 13 is a perspective view (see Patent Document 1).

図１２及び図１３を参照すると接続装置であるコネクタ装置１０６は、第１の電気回路部材（ＩＣ）８１と第２の電気回路部材８８を接続するために設けられている。コネクタ装置１０６は，グリッド状に配された外部接続電極８１ａを底面８１ｂに配したＩＣ８１を位置決めするための構造体８４と、ＩＣ８１と電気的に接続を果たすためのフレキシブル配線部材（ＦＰＣ）８６と、ＦＰＣ８６を介しＩＣ８１の底面８１ｂに弾性作用するための弾性部材４３とで基本構成されている。   Referring to FIGS. 12 and 13, a connector device 106 as a connecting device is provided for connecting a first electric circuit member (IC) 81 and a second electric circuit member 88. The connector device 106 includes a structure 84 for positioning the IC 81 having the external connection electrodes 81a arranged in a grid shape on the bottom surface 81b, a flexible wiring member (FPC) 86 for electrically connecting the IC 81, and the like. And the elastic member 43 for elastically acting on the bottom surface 81b of the IC 81 through the FPC 86.

構造体８４は、任意のパッド８１ａとＦＰＣ８６の導電体露出部Ａ４６とを係合可能とするようにＩＣ８１の収容位置を定めるための内側壁８４ａと、配列されたパッド８１ａの各列に対応して弾性部材４３を配置するための溝状の保持手段Ａ８５ｃとを備えたハウジング８５を有し、さらに、ＩＣ８１を押し込むためのカバー８２と、これをハウジング８５に固定するための固定手段Ａ８９，８５ａと、弾性部材４３およびＦＰＣ８６を所定の配置でハウジング８５に保持するための保持手段Ｂ８３，８５ｂとを有している。   The structure 84 corresponds to each row of the inner side wall 84a for determining the accommodation position of the IC 81 so that the arbitrary pad 81a and the conductor exposed portion A46 of the FPC 86 can be engaged, and the arranged pads 81a. A housing 85 having a groove-like holding means A85c for disposing the elastic member 43, a cover 82 for pushing the IC 81, and fixing means A89, 85a for fixing the IC 81 to the housing 85. And holding means B83 and 85b for holding the elastic member 43 and the FPC 86 in the housing 85 in a predetermined arrangement.

ＩＣ８１の他に、第２の電気回路部材８８も接続対象とし、これらを相互接続する構成としたところにある。第２の電気回路部材８８は、ＩＣ８１と同様にグリッド状のパッド８７を上面８８ａに配したプリント回路基板（ＰＣ板）を例としている。   In addition to the IC 81, the second electric circuit member 88 is also a connection object, and these are connected to each other. The second electric circuit member 88 is an example of a printed circuit board (PC board) in which a grid-like pad 87 is arranged on the upper surface 88a in the same manner as the IC 81.

ＰＣ板８８は、固定手段Ｂ８９により任意のパッド８７が、ＦＰＣ８６の導電体露出部Ｂ４８と係合するよう構造体８４のハウジング８５に位置決めされている。   The PC board 88 is positioned on the housing 85 of the structure 84 so that an arbitrary pad 87 is engaged with the conductor exposed portion B48 of the FPC 86 by the fixing means B89.

図１２において、ＩＣ８１は、カバー８２によりパッド８１ａの表面が第１の端部４５を介し、バネ先端部Ａ４４を押圧変位させる所定の位置まで押し下げられている。また、ＰＣ板８８は、固定手段Ｂ８９ｂによりパッド８７の表面が第２の端部４７を介し、バネ先端部Ｂ４１を押圧変位させる所定の位置まで引き上げられている。この状態において、それぞれの導電体露出部Ａ４６の裏面側には、バネ先端部Ａ４４が対応して位置決めされており、導電体露出部Ａ４６と、これと係合するパッド８１ａとの当接部には、電気接続を可能とする接触力が発生している。   In FIG. 12, the surface of the pad 81 a is pushed down by the cover 82 to a predetermined position where the surface of the pad 81 a is pressed and displaced via the first end 45. Further, the PC board 88 is pulled up to a predetermined position where the surface of the pad 87 is pressed and displaced by the fixing means B89b via the second end 47. In this state, the spring tip A44 is correspondingly positioned on the back side of each conductor exposed portion A46, and the contact portion between the conductor exposed portion A46 and the pad 81a engaged therewith is located. The contact force that enables electrical connection is generated.

ＰＣ板８８が位置決めされる側においても、各部材の設定要件を上記ＩＣ８１が位置決めされる側の各部材の設定要件と同様にしているため、それぞれの導電体露出部Ｂ４８の裏面側には、バネ先端部Ｂ４１が対応して位置決めされており、導電体露出部Ｂ４８と、これと係合するパッド８７との当接部には、電気的接続を可能とする接触力が発生している。   Even on the side where the PC board 88 is positioned, the setting requirements of each member are the same as the setting requirements of each member on the side where the IC 81 is positioned. Therefore, on the back surface side of each conductor exposed portion B48, The spring tip B41 is positioned correspondingly, and a contact force enabling electrical connection is generated at the contact portion between the conductor exposed portion B48 and the pad 87 engaged therewith.

図１４は従来技術による接続装置を示す部分図である（特許文献２，参照）。また、図１５は、図１４のＸＶＩ−ＸＶＩ線断面図である。図１４及び図１５を参照すると、従来技術による接続装置１１０は、接続部材６０と、圧入された接続部材６０を保持するフレーム２０とを備えている。   FIG. 14 is a partial view showing a connection device according to the prior art (see Patent Document 2). FIG. 15 is a cross-sectional view taken along line XVI-XVI in FIG. Referring to FIGS. 14 and 15, the connection device 110 according to the related art includes a connection member 60 and a frame 20 that holds the press-fitted connection member 60.

図１５に示すように、接続部材６０は、細長く一側の角部が丸く形成された、いわゆるカマボコ形状の電極部１と、電極部１の他側に突出して設けられたダボ６１とを備え、これらは断面略Ｔ字形状の柔軟な弾性材料によって、一体に形成されている。また、電極部１の一側は、両端面から一側面を覆うように、細長い導電性膜からなる電極３を備えている。   As shown in FIG. 15, the connecting member 60 includes a so-called “kamaboko-shaped” electrode portion 1 that is elongated and has a rounded corner on one side, and a dowel 61 that protrudes from the other side of the electrode portion 1. These are integrally formed of a flexible elastic material having a substantially T-shaped cross section. In addition, one side of the electrode unit 1 includes an electrode 3 made of an elongated conductive film so as to cover one side surface from both end surfaces.

図１４に示すように、電極３は、接続部材６０の長さ方向に定ピッチで形成されている。Ｔ字形状の接続部材６０のカマボコ形状の電極３が、フレーム２０の桟１３の間の接続部材収容部２１に、矢印６５に示すように、圧入され、ダボ６１によって、収容部２１内に保持される。この圧入ダボ６１は、例えば、１つのカマボコ形状の接続部材６０に電極３に対応して複数個設けられている。したがって、等間隔で、Ｔ字形状の接続部材６０は、保持される。   As shown in FIG. 14, the electrodes 3 are formed at a constant pitch in the length direction of the connection member 60. As shown by an arrow 65, the scallop-shaped electrode 3 of the T-shaped connecting member 60 is press-fitted into the connecting member accommodating portion 21 between the crosspieces 13 of the frame 20 and held in the accommodating portion 21 by the dowel 61. Is done. For example, a plurality of press-fitting dowels 61 are provided corresponding to the electrodes 3 on one connecting member 60 having a hook shape. Accordingly, the T-shaped connecting members 60 are held at regular intervals.

このように、従来技術においては、フレーム２０には、等間隔にフレーム２０の桟１３が形成されていた。 Thus, in the prior art, the crosspieces 13 of the frame 20 are formed on the frame 20 at equal intervals.

しかしながら、接続部材６０のダボ６１で、フレーム２０の桟１３間に圧入し、治具などで、カマボコ形状の接続部材６０の上下方向の位置合わせも行わなければならないフレーム２０に保持されていたために、柔らかいゴムを圧入関係でフレーム２０の接続部材収容部（溝）に挿入するのは、とても挿入しずらく、組み立て性が良くなかった。   However, because the dowel 61 of the connecting member 60 is press-fitted between the crosspieces 13 of the frame 20 and is held by the frame 20 that must be aligned in the vertical direction with the jig or the like. Inserting the soft rubber into the connecting member accommodating portion (groove) of the frame 20 in a press-fit relationship is very difficult to insert, and the assemblability is not good.

また、ダボ６１でフレーム２０に圧入保持しているために、接続部材６０のダボ６１の圧入代６２で、桟１３に圧入し、その反力で桟１３が割れたり、ひびが入ったり、折れることがあった。桟１３が折れると、接続部材６１の姿勢制御、位置ずれや短絡防止に支障をきたした。   Further, since the dowel 61 is press-fitted and held in the frame 20, the dowel 61 of the connecting member 60 is press-fitted into the crosspiece 13 by the press-fitting allowance 62, and the crosspiece 13 is cracked, cracked or broken by the reaction force. There was a thing. When the crosspiece 13 is broken, it hinders the posture control of the connecting member 61, position shift and short circuit prevention.

また、接続部材６０の狭いピッチ化に伴い、桟１３が細くなり、桟１３の形成が、射出成形では、ショートしたりして形成できなくなった。   Further, as the connecting member 60 has a narrow pitch, the crosspiece 13 becomes thinner, and the formation of the crosspiece 13 cannot be formed due to a short circuit in the injection molding.

また、搬送時の振動、衝撃で圧入関係のみで、フレーム２０に保持される圧入保持だけなので、接続部材６０がフレーム２０から外れたり、位置がずれてしまっていた。   In addition, the connection member 60 is disengaged from the frame 20 or shifted in position because only the press-fitting is held by the frame 20 due to the vibration and impact during conveyance.

特開平１１−３０７２１２号公報Japanese Patent Laid-Open No. 11-307212 特開２００３−２２８５０４号公報JP 2003-228504 A

そこで、本発明の第１の技術的課題は、狭ピッチ化になると、接続部材の姿勢制御、隣接した接続部材の短絡防止用のフレームの桟がともに細くなり、桟が折れたりフレームにひびが入ったりすることを防止することができる接続装置を提供することにある。   Therefore, the first technical problem of the present invention is that when the pitch is narrowed, the frame of the frame for preventing the short-circuiting of the connecting member and the shorting of the adjacent connecting member are thinned, the frame is broken or the frame is cracked. It is an object of the present invention to provide a connection device that can prevent entry.

また、本発明の第２の技術的課題は、狭ピッチ化になると、接続部材の姿勢制御、隣接した接続部材の短絡防止用のフレームの桟がともに細くなり、成形で形成できなくなるので、その桟を必要とせず、成形性が良く且つ短絡しない接続部材を用いた接続装置を提供することにある。   Further, the second technical problem of the present invention is that when the pitch is narrowed, both the posture control of the connecting member and the frame of the frame for preventing short circuit of the adjacent connecting member become thin and cannot be formed by molding. An object of the present invention is to provide a connection device using a connection member that does not require a crosspiece, has good moldability, and does not short-circuit.

また、本発明の第３の技術的課題は、フレームへの接続部材の保持方法を改善した接続装置を提供することにある。   A third technical problem of the present invention is to provide a connection device in which the method for holding the connection member to the frame is improved.

また、本発明の第４の技術的課題は、接続部材により組み立て性を改善した接続装置を提供することにある。   The fourth technical problem of the present invention is to provide a connecting device having improved assemblability by a connecting member.

さらに、本発明の第５の技術的課題は、取り扱いの際や搬送の際に外れたり位置ずれすることのない接続部材を用いた接続装置を提供することにある。   Furthermore, a fifth technical problem of the present invention is to provide a connection device using a connection member that does not come off or shift in position during handling or conveyance.

本発明によれば、接続対象物間を接続する接続部材と、複数の前記接続部材を保持するフレームとを備えた接続装置において、前記接続部材は、弾性体と、前記弾性体内に配置された骨材と、前記弾性体の所定位置に所定のパターンで配置された導体とを有し、前記骨材は、前記弾性体から突出する突出部を有し、前記フレームは、前記突出部と係合する係合部を有し、前記弾性体は、前記導体が形成された電極部と、前記電極部から突出したピッチ間部とを備え、前記弾性体に前記電極部とピッチ間部とは一体形成され、前記電極と前記ピッチ間部とで、断面略Ｔ字形状に形成され、前記ピッチ間部は、断面角型に形成されるとともに、隣接する前記接続部材間を所定の間隔に維持することを特徴とする接続装置が得られる。 According to the present invention, in the connection device including the connection member that connects the objects to be connected and the frame that holds the plurality of connection members, the connection member is disposed in the elastic body and the elastic body. An aggregate, and a conductor arranged in a predetermined pattern at a predetermined position of the elastic body, the aggregate has a protrusion protruding from the elastic body, and the frame is engaged with the protrusion. The elastic body includes an electrode portion on which the conductor is formed, and a pitch portion protruding from the electrode portion, and the elastic body includes the electrode portion and the pitch portion. It is formed integrally, and the electrode and the inter-pitch portion are formed in a substantially T-shaped cross section, and the inter-pitch portion is formed in a square cross section and is maintained at a predetermined interval between the adjacent connecting members. Thus, a connecting device is obtained.

また、本発明によれば、前記接続装置において、前記係合部は、前記骨材の突出部が挿入されるものであり、前記骨材を前記フレームへ挿入する際のフレーム挿入側において、前記フレームは前記係合部の少なくとも一部を覆う蓋部材を有することを特徴とする接続装置が得られる。   Further, according to the present invention, in the connecting device, the engaging portion is a portion into which the protruding portion of the aggregate is inserted, and on the frame insertion side when the aggregate is inserted into the frame, The frame has a lid member that covers at least a part of the engaging portion.

本発明によれば、狭ピッチ化になると、例えば、接続部材の姿勢制御、隣接した接続部材の短絡防止用のフレームの桟がともに細くなり、桟が折れたりフレームにひびが入ったりするが、そのことを防止することができる接続装置を提供することができる。   According to the present invention, when the pitch is narrowed, for example, the posture of the connecting member, the frame of the frame for preventing short circuit of the adjacent connecting member is thinned, the frame is broken or the frame is cracked, A connection device that can prevent this can be provided.

また、本発明によれば、狭ピッチ化になると、例えば、接続部材の姿勢制御、隣接した接続部材の短絡防止用のフレームの桟がともに細くなり、成形で形成できなくなるので、接続部材を断面略Ｔ字形状にし、電極部とピッチ間部を形成することで、その桟を必要とせず、成形性が良く且つ短絡しない接続部材を用いた接続装置を提供することができる。   Further, according to the present invention, when the pitch is narrowed, for example, the frame of the frame for preventing the short-circuit of the connecting member adjacent to the posture of the connecting member becomes thin and cannot be formed by molding. By forming an approximately T-shape and forming an electrode portion and a pitch-interval portion, it is possible to provide a connecting device that uses a connecting member that does not require a crosspiece, has good moldability, and does not short-circuit.

また、本発明によれば、フレームへの接続部材の保持方法を改善した接続装置を提供することができる。   Moreover, according to this invention, the connection apparatus which improved the holding method of the connection member to a flame | frame can be provided.

また、本発明によれば、接続部材により組み立て性を改善した接続装置を提供することができる。   Moreover, according to this invention, the connection apparatus which improved assembly property with the connection member can be provided.

さらに、本発明によれば、取り扱いの際や搬送の際に外れたり位置ずれすることのない接続部材を用いた接続装置を提供することができる。   Furthermore, according to the present invention, it is possible to provide a connection device using a connection member that does not come off or shift in position during handling or conveyance.

以下、本発明の実施の形態について図面を参照しながら説明する。   Hereinafter, embodiments of the present invention will be described with reference to the drawings.

図１は本発明の第１の実施の形態による接続装置の部分平面図である。図２は図１のＩＩ−ＩＩ線断面図である。図１及び図２を参照すると、本発明の第１の実施の形態による接続装置１００は、Ｔ字形状の接続部材１０ａと、接続部材１０ａを長さ方向に貫通する棒状の骨材５と、骨材５を保持するフレーム２０とを備えている。   FIG. 1 is a partial plan view of a connection device according to a first embodiment of the present invention. 2 is a cross-sectional view taken along the line II-II in FIG. Referring to FIGS. 1 and 2, a connecting device 100 according to the first embodiment of the present invention includes a T-shaped connecting member 10a, a rod-shaped aggregate 5 penetrating the connecting member 10a in the length direction, and And a frame 20 that holds the aggregate 5.

図２に示すように、接続部材１０ａは、細長く一側の角部が丸く形成された、いわゆるカマボコ形状の電極部１と、電極部１の他側に設けられた断面角型のピッチ間部２とを備え、これらは断面略Ｔ字形状の柔軟な弾性材料によって、一体に形成されている。電極部１の他側には、骨材５が貫通する細長い貫通穴４ａが設けられている。また、電極部１の一側は、両端面から一側面を覆うように、細長い導電性膜からなる電極（導体）３を備えている。電極３は、無電解めっきによって形成しても良いし、導電性薄膜、例えば、金属箔を貼り付けても良いし、また、導電性塗料もしくは導電性ペーストを塗布形成しても良い。   As shown in FIG. 2, the connecting member 10 a includes a long and narrow electrode portion 1 having a rounded corner on one side, and a pitch-shaped portion having a square cross section provided on the other side of the electrode portion 1. 2 and these are integrally formed of a flexible elastic material having a substantially T-shaped cross section. On the other side of the electrode part 1, an elongated through hole 4a through which the aggregate 5 passes is provided. In addition, one side of the electrode unit 1 includes an electrode (conductor) 3 made of an elongated conductive film so as to cover one side surface from both end surfaces. The electrode 3 may be formed by electroless plating, a conductive thin film such as a metal foil may be attached, or a conductive paint or conductive paste may be applied and formed.

図１に戻って、電極３は、接続部材１０ａの長さ方向に定ピッチで形成されている。フレーム２０は、接続部材１０ａを貫通するとともに、この接続部材１０ａよりも長く、両端に露出して形成された骨材５の両側に露出する突出部５ａを係合して収容する係合部をなす骨溝１１が形成されている。Ｔ字形状の接続部材１０ａのカマボコ形状の電極部１の両端の露出した骨材５がフレーム２０に、この骨材５の長さ方向と垂直な方向に一定のピッチで形成されたの骨溝１１に入り係合し、したがって、等間隔で、Ｔ字形状の接続部材１０ａのカマボコ形状の電極部１は保持される。   Returning to FIG. 1, the electrodes 3 are formed at a constant pitch in the length direction of the connecting member 10a. The frame 20 penetrates through the connecting member 10a and is longer than the connecting member 10a. The engaging portion accommodates the protruding portions 5a exposed on both sides of the aggregate 5 formed exposed at both ends. An osteotomy groove 11 is formed. Bone grooves formed by exposing the aggregate 5 exposed at both ends of the scalloped electrode portion 1 of the T-shaped connecting member 10a to the frame 20 at a constant pitch in a direction perpendicular to the length direction of the aggregate 5 11 is engaged, and therefore, the rim-shaped electrode portion 1 of the T-shaped connecting member 10a is held at equal intervals.

このように、本発明の第１の実施の形態においては、カマボコ形状の電極部１を備えた接続部材１０ａのフレーム２０への挿入時、圧入で押し込むことはなく、楽に挿入でき、組み立て性を改善することができる。   As described above, in the first embodiment of the present invention, when inserting the connecting member 10a including the electrode portion 1 having the scallop shape into the frame 20, it is not pushed in by press-fitting, and can be inserted easily and can be assembled. Can be improved.

なお、図示の例においては、断面カマボコ形状の電極部１は、断面カマボコ形状の電極部１に形成されているが、電極３の間には、溝が設けられて、断面角型とし、電極部１が形成されている部分のみカマボコ形状としても良い。   In the example shown in the figure, the electrode portion 1 having a cross-sectional shape is formed on the electrode portion 1 having a cross-sectional shape, but a groove is provided between the electrodes 3 to form a square cross-section. Only the portion where the portion 1 is formed may be shaped like a paddle.

また、電極部１に貫通穴４ａを設けて、この貫通穴４ａに骨材を設けることで、接続部材１０ａの取り扱い性を良くすることができる。また、電極部１を断面カマボコ形状とすることによって、狭いピッチ化に対応している。   Moreover, the handleability of the connection member 10a can be improved by providing the electrode part 1 with the through hole 4a and providing the aggregate in the through hole 4a. Further, the electrode portion 1 has a cross-sectional shape, which corresponds to a narrow pitch.

Ｔ字形状の接続部材１０ａの両端の露出した骨材５がフレーム２０の骨溝１１に入り、等間隔で、Ｔ字形状の接続部材１０ａは整列保持される。   The exposed aggregate 5 at both ends of the T-shaped connecting member 10a enters the bone groove 11 of the frame 20, and the T-shaped connecting member 10a is aligned and held at equal intervals.

図３は本発明の第２の実施の形態による接続装置の部分平面図である。図４は図３のＩＶ−ＩＶ線断面図である。図３及び図４を参照すると、本発明の第２の実施の形態による接続装置１０１は、接続部材１０ｂと、接続部材１０ｂを長さ方向に貫通する骨材５と、骨材５を保持するフレーム２０と、骨材５のフレーム２０からの離脱を防止する蓋３０とを備えている。   FIG. 3 is a partial plan view of a connection device according to the second embodiment of the present invention. 4 is a cross-sectional view taken along line IV-IV in FIG. 3 and 4, the connection device 101 according to the second embodiment of the present invention holds the connection member 10 b, the aggregate 5 that penetrates the connection member 10 b in the length direction, and the aggregate 5. A frame 20 and a lid 30 that prevents the aggregate 5 from being detached from the frame 20 are provided.

図４に示すように、接続部材１０ｂは、細長く一側の角部が丸く形成された、いわゆるカマボコ形状の電極部１を備えている。断面カマボコ形状の柔軟な弾性材料によって、一体に形成されている。電極部１の他側には、骨材５が貫通する細長い貫通溝４ｂが設けられている。また、電極部１の一側は、両端面から一側面を覆うように、細長い導電性膜からなる電極（導体）３を備えている。電極３は、無電解めっきによって形成しても良いし、導電性薄膜、例えば、金属箔を貼り付けても良いし、また、導電性塗料もしくはペーストを塗布形成しても良い。   As shown in FIG. 4, the connecting member 10 b includes a so-called scallop-shaped electrode portion 1 that is elongated and has a corner portion on one side rounded. It is integrally formed of a flexible elastic material having a cross-sectionally shaped cross section. On the other side of the electrode part 1, an elongated through groove 4b through which the aggregate 5 passes is provided. In addition, one side of the electrode unit 1 includes an electrode (conductor) 3 made of an elongated conductive film so as to cover one side surface from both end surfaces. The electrode 3 may be formed by electroless plating, a conductive thin film such as a metal foil may be attached, or a conductive paint or paste may be applied and formed.

図４に示すように、電極３は、接続部材１０ｂの長さ方向に定ピッチで形成されている。フレーム２０は、接続部材１０ｂを貫通するとともに、この接続部材１０ａよりも長く、両端に露出して形成された骨材５の両側の突出部５ａを係合して収容する係合部をなす骨溝１１が形成されている。また、骨溝１１の間には、フレームの桟１３が設けられ、接続部材収容部２１を構成している。ピッチ方向の隣接の電極３間の短絡を防ぐために、カマボコ状の電極部１間には、フレーム２０の桟１３が入っている。かまぼこ形状の電極部１の両端の骨材５でフレーム２０の骨溝１１に挿入し、最後に上から蓋部材３０によって蓋をして、Ｔ字形状の接続部材１０ｂのフレーム２０の保持が完了する。この蓋部材３０は、図示しない螺子等によって、フレーム２０に固定されている。即ち、接続部材１０ｂのカマボコ形状の電極部１の両端の露出した骨材５がフレーム２０に、この骨材５の長さ方向と垂直な方向に一定のピッチで形成された骨溝１１に入って係合し、したがって、等間隔で、接続部材１０ｂのカマボコ形状の電極部１は、接続部材収容部２１内で保持される。また、骨溝１１には、蓋部材３０が覆い被さるために、骨材５の骨溝１１からの離脱を防止することができる。   As shown in FIG. 4, the electrodes 3 are formed at a constant pitch in the length direction of the connection member 10b. The frame 20 penetrates the connecting member 10b and is longer than the connecting member 10a. The bone 20 forms an engaging portion that engages and accommodates the protruding portions 5a on both sides of the aggregate 5 formed exposed at both ends. A groove 11 is formed. Further, a frame cross 13 is provided between the bone grooves 11 to form a connection member accommodating portion 21. In order to prevent a short circuit between the adjacent electrodes 3 in the pitch direction, a crosspiece 13 of the frame 20 is provided between the electrode portions 1 having a crest shape. The frame 5 is inserted into the bone groove 11 of the frame 20 with the aggregate 5 at both ends of the kamaboko-shaped electrode portion 1, and finally the lid member 30 is covered with the lid member 30 to complete the holding of the frame 20 of the T-shaped connecting member 10b To do. The lid member 30 is fixed to the frame 20 by screws or the like (not shown). That is, the exposed aggregate 5 at both ends of the scallop-shaped electrode portion 1 of the connecting member 10b enters the bone groove 11 formed in the frame 20 at a constant pitch in a direction perpendicular to the length direction of the aggregate 5. Therefore, at a regular interval, the scalloped electrode portion 1 of the connecting member 10b is held in the connecting member accommodating portion 21. Moreover, since the lid member 30 covers the bone groove 11, it is possible to prevent the aggregate 5 from being detached from the bone groove 11.

このように、本発明の第２の実施の形態においては、カマボコ形状の電極部１を備えた接続部材１０ｂのフレーム２０への挿入時、圧入で押し込むことはなく、楽に挿入でき、組み立て性を改善することができる。   As described above, in the second embodiment of the present invention, when the connecting member 10b having the squirrel-shaped electrode portion 1 is inserted into the frame 20, it is not pushed in by press-fitting, and can be inserted easily and can be assembled. Can be improved.

なお、図示の例においては、断面カマボコ形状の電極部１は、断面カマボコ形状の電極部１に形成されているが、電極３の間には、溝を設けて、断面角型とし、電極３が形成されている部分のみカマボコ形状としても良い。   In the example shown in the drawing, the electrode part 1 having a cross-sectional shape is formed in the electrode part 1 having a cross-sectional shape, but a groove is provided between the electrodes 3 to form a square cross-section. Only the portion where the is formed may be shaped like a paddle.

また、電極部１に貫通溝４ｂを設けて、この貫通溝４ｂに骨材５を設けることで、接続部材１０ｂの取り扱い性を良くすることができる。また、電極部１を断面カマボコ形状とすることによって、狭ピッチ化に対応している。   Moreover, the handleability of the connecting member 10b can be improved by providing the electrode part 1 with the through groove 4b and providing the aggregate 5 in the through groove 4b. Further, the electrode portion 1 has a cross-sectionally shaped cross section to cope with a narrow pitch.

Ｔ字形状の接続部材１０ｂの両端に露出した骨材５がフレーム２０の骨溝１１に入り、等間隔で、Ｔ字形状の接続部材１０ｂは整列保持される。   The aggregate 5 exposed at both ends of the T-shaped connecting member 10b enters the bone groove 11 of the frame 20, and the T-shaped connecting member 10b is aligned and held at equal intervals.

本発明の第２の実施の形態によれば、狭ピッチ化で、桟１３が細くなっても外力を受けないので、桟１３が折れたりすることはない。   According to the second embodiment of the present invention, since the pitch is narrowed and no external force is applied even if the crosspiece 13 becomes thin, the crosspiece 13 does not break.

また、最後に蓋部材３０によって、骨溝１１に蓋をすることで、物理的にＴ字形状の接続部材１０ｂがフレーム２０から抜けたり、位置ずれをしたりすることがない。   Further, by finally covering the bone groove 11 with the lid member 30, the physical T-shaped connecting member 10 b does not come off from the frame 20 and is not displaced.

図５は本発明の第３の実施の形態による接続装置のフレームを示す図で、図６は図５のフレームに接続部材を装着した接続装置の適用例を示す図である。図５及び図６では、基板間を接続する例を示している。   FIG. 5 is a view showing a frame of the connection device according to the third embodiment of the present invention, and FIG. 6 is a view showing an application example of the connection device in which a connection member is mounted on the frame of FIG. 5 and 6 show examples of connecting the substrates.

図５を参照すると、接続装置１０２は、フレーム２０とこのフレーム２０の接続部材収容部に挿入された接続部材１０とを有している。接続部材１０は、第１の実施の形態による接続部材１０ａであっても、第２の実施の形態による接続部材１０ｂであっても良い。上下に突出して、溝６を介して水平方向に定ピッチで並んで設けられた電極３が図示しない上下に配置された基板の導体パターン（ランド）に、夫々圧接することで、基板間の接続がなされる。尚、突出部５ａと係合部の構成は図示されていない。   Referring to FIG. 5, the connection device 102 includes a frame 20 and a connection member 10 inserted into a connection member housing portion of the frame 20. The connection member 10 may be the connection member 10a according to the first embodiment or the connection member 10b according to the second embodiment. The electrodes 3 that protrude in the vertical direction and are arranged at a constant pitch in the horizontal direction via the grooves 6 are brought into pressure contact with the conductor patterns (lands) of the substrate that are arranged in the vertical direction (not shown), thereby connecting the substrates. Is made. In addition, the structure of the protrusion part 5a and an engaging part is not illustrated.

図７は本発明の第４の実施の形態による接続装置のフレームを示す図で、図８は図７のフレームに接続部材を装着した接続装置の適用例を示す図である。図７及び図８では、基板と半導体素子（ＩＣ）との間を接続する例を示している。   FIG. 7 is a view showing a frame of a connection device according to the fourth embodiment of the present invention, and FIG. 8 is a view showing an application example of the connection device in which a connection member is mounted on the frame of FIG. 7 and 8 show an example in which a substrate and a semiconductor element (IC) are connected.

図７を参照すると、接続装置１０３は、フレーム２０と、このフレーム２０の４辺寄りに設けられた４本の接続部材収容部２１に挿入された接続部材１０とを有している。接続部材１０は、勿論、第１の実施の形態によるものであっても、第２の実施の形態によるものであっても良い。上部に突出して定ピッチで並んで設けられた電極３が図示しない上方に配置された半導体素子（ＩＣ）の導体パターン（パッド）に、夫々圧接するとともに、下部に同様に突出して定ピッチで並んで設けられた電極３が図示しない下方に配置された基板の導体パターン（ランド）に、夫々圧接することで基板とＩＣもしくは半導体基板間の接続がなされる。尚、突出部５ａと係合部の構成は図示されていない。   Referring to FIG. 7, the connection device 103 includes a frame 20 and connection members 10 inserted into four connection member accommodating portions 21 provided near the four sides of the frame 20. Of course, the connecting member 10 may be the one according to the first embodiment or the second embodiment. The electrodes 3 that protrude upward and are arranged at a constant pitch are in pressure contact with conductor patterns (pads) of a semiconductor element (IC) disposed above (not shown), respectively, and protrude in the same way at the lower portion and are aligned at a constant pitch. The substrate 3 and the IC or semiconductor substrate are connected by press-contacting the electrode 3 provided in step 1 to a conductor pattern (land) of the substrate disposed below (not shown). In addition, the structure of the protrusion part 5a and an engaging part is not illustrated.

図９は本発明の第５の実施の形態による接続装置のフレームを示す図で、図１０は図９のフレームに接続部材を装着した接続装置の適用例を示す図である。図９及び図１０では、基板と半導体素子（ＩＣ）との間を接続する例を示している。   FIG. 9 is a view showing a frame of a connection device according to the fifth embodiment of the present invention, and FIG. 10 is a view showing an application example of the connection device in which a connection member is mounted on the frame of FIG. 9 and 10 show examples in which a substrate and a semiconductor element (IC) are connected.

図９及び図１０を参照すると、接続装置１０４は、フレーム２０と、このフレーム２０に縦方向に３列に複数並んで設けられた複数列の接続部材収容部２１に挿入された接続部材１０とを有している。接続部材１０は、勿論、第１の実施の形態による接続部材１０ａであっても、第２の実施の形態による接続部材２ｂであっても良い。上部に突出して定ピッチで並んで設けられた電極３が図示しない上方に配置された半導体素子（ＩＣ）の導体パターン（パッド）に、夫々圧接するとともに、下部に同様に突出して定ピッチで並んで設けられた電極３が図示しない下方に配置された基板の導体パターン（ランド）に、夫々圧接することで基板とＩＣもしくはチップ間の接続がなされる。尚、突出部５ａと係合部の構成は図示されていない。   Referring to FIGS. 9 and 10, the connection device 104 includes a frame 20, and a connection member 10 inserted into a plurality of rows of connection member accommodating portions 21 provided in the frame 20 in a plurality of rows in the vertical direction. have. Of course, the connecting member 10 may be the connecting member 10a according to the first embodiment or the connecting member 2b according to the second embodiment. The electrodes 3 that protrude upward and are arranged at a constant pitch are in pressure contact with conductor patterns (pads) of a semiconductor element (IC) disposed above (not shown), respectively, and protrude in the same way at the lower portion and are aligned at a constant pitch. The electrodes 3 provided in (1) are brought into pressure contact with the conductor patterns (lands) of the substrate disposed below (not shown), thereby connecting the substrate and the IC or chip. In addition, the structure of the protrusion part 5a and an engaging part is not illustrated.

図１１は、本発明の第６の実施の形態による接続装置を用いた半導体チップの実装例を示している。図１１を参照すると、図８及び図１０に示された接続装置１０３，１０４を基板５０上に実装し、半導体素子を収容して、枠状の蓋部材５１によってこの半導体素子を固定する構成である。なお、符号２５は接続装置を押さえ込むためのばねである。   FIG. 11 shows a mounting example of a semiconductor chip using the connection device according to the sixth embodiment of the present invention. Referring to FIG. 11, the connection devices 103 and 104 shown in FIGS. 8 and 10 are mounted on a substrate 50, a semiconductor element is accommodated, and the semiconductor element is fixed by a frame-shaped lid member 51. is there. Reference numeral 25 denotes a spring for pressing the connecting device.

このように、本発明の実施の形態による接続装置は、接続部材を圧入する必要がなく、単にフレーム２０に装着するだけであるので、簡単に接続装置を搬送、及び組み立てができるとともに、電極間の短絡を防止することができるので、成形も容易で小型化に対応することができる。   As described above, the connection device according to the embodiment of the present invention does not need to press-fit the connection member, and is simply mounted on the frame 20, so that the connection device can be easily transported and assembled, and between the electrodes. Therefore, the molding can be easily performed and the size can be reduced.

以上の説明の通り、本発明に係る接続装置は、半導体装置と基板間の電気接続や基板間の電気接続に適用することができる。   As described above, the connection device according to the present invention can be applied to electrical connection between a semiconductor device and a substrate and electrical connection between substrates.

本発明の第１の実施の形態による接続装置の部分平面図である。1 is a partial plan view of a connection device according to a first embodiment of the present invention. 図１のＩＩ−ＩＩ線断面図である。It is the II-II sectional view taken on the line of FIG. 本発明の第２の実施の形態による接続装置の部分平面図である。It is a partial top view of the connection apparatus by the 2nd Embodiment of this invention. 図３のＩＶ−ＩＶ線断面図である。It is the IV-IV sectional view taken on the line of FIG. 本発明の第３の実施の形態による接続装置のフレームを示す図である。It is a figure which shows the flame | frame of the connection apparatus by the 3rd Embodiment of this invention. 図５のフレームに接続部材を装着した接続装置の適用例を示す図である。It is a figure which shows the example of application of the connection apparatus which attached the connection member to the flame | frame of FIG. 本発明の第４の実施の形態による接続装置のフレームを示す図である。It is a figure which shows the flame | frame of the connection apparatus by the 4th Embodiment of this invention. 図７のフレームに接続部材を装着した接続装置の適用例を示す図である。It is a figure which shows the example of application of the connection apparatus which attached the connection member to the flame | frame of FIG. 本発明の第５の実施の形態による接続装置のフレームを示す図である。It is a figure which shows the flame | frame of the connection apparatus by the 5th Embodiment of this invention. 図９のフレームに接続部材を装着した接続装置の適用例を示す図である。It is a figure which shows the example of application of the connection apparatus which attached the connection member to the flame | frame of FIG. 本発明の第６の実施の形態による接続装置を用いた半導体チップの実装例を示している。The example of mounting of the semiconductor chip using the connection apparatus by the 6th Embodiment of this invention is shown. 従来技術による基板とＩＣとを接続するコネクタを示す部分断面図である。It is a fragmentary sectional view which shows the connector which connects the board | substrate and IC by a prior art. 従来技術による基板とＩＣとを接続するコネクタを示す斜視図である。It is a perspective view which shows the connector which connects the board | substrate and IC by a prior art. 従来技術による接続装置を示す部分図である。It is a fragmentary figure which shows the connection apparatus by a prior art. 図１４のＸＶＩ−ＸＶＩ線断面図である。It is the XVI-XVI sectional view taken on the line of FIG.

符号の説明Explanation of symbols

１ 電極部
３ 電極
４ａ 貫通穴
４ｂ 貫通溝
５ 骨材
５ａ 突出部
１１ 骨溝
１０，１０ａ，１０ｂ 接続部材
１３ 桟
２０ フレーム
２１ 接続部材収容部
２５ ばね
３０ 蓋
４３ 弾性部材
４４ バネ先端部Ａ
４５ 第１の端部
４６ 導電体露出部Ａ
４７ 第２の端部
４８ 導電体露出部Ｂ
５０ 基板
５１ 蓋部材
６０ 接続部材
６１ ダボ
６２ 圧入代
６５ 矢印
８１ 第１の電気回路部材（ＩＣ）
８１ａ 外部接続電極（パッド）
８１ｂ 底面
８２ カバー
８３，８５ｂ 保持手段Ｂ
８４ 構造体
８４ａ 内側壁
８５ ハウジング
８５ａ 固定手段Ａ
８５ｃ 保持手段Ａ
８６ フレキシブル配線部材（ＦＰＣ）
８７ パッド
８８ 第２の電気回路部材（ＰＣ板）
８８ａ 上面
８９ａ 固定手段Ａ
８９ｂ 固定手段Ｂ
１００、１０１、１０２，１０３，１０４，１０５ 接続装置
１１０ 接続装置 DESCRIPTION OF SYMBOLS 1 Electrode part 3 Electrode 4a Through hole 4b Through groove 5 Aggregate 5a Protrusion part 11 Bone groove 10, 10a, 10b Connection member 13 Crosspiece 20 Frame 21 Connection member accommodating part 25 Spring 30 Lid 43 Elastic member 44 Spring front-end | tip part A
45 First end 46 Conductor exposed portion A
47 Second end 48 Conductor exposed portion B
50 Substrate 51 Lid member 60 Connecting member 61 Dowel 62 Press-fit allowance 65 Arrow 81 First electric circuit member (IC)
81a External connection electrode (pad)
81b Bottom face 82 Cover 83, 85b Holding means B
84 Structure 84a Inner wall 85 Housing 85a Fixing means A
85c Holding means A
86 Flexible wiring member (FPC)
87 Pad 88 Second electric circuit member (PC board)
88a Upper surface 89a Fixing means A
89b Fixing means B
100, 101, 102, 103, 104, 105 Connection device 110 Connection device

Claims (2)

接続対象物間を接続する接続部材と、複数の前記接続部材を保持するフレームとを備えた接続装置において、
前記接続部材は、弾性体と、前記弾性体内に配置された骨材と、前記弾性体の所定位置に所定のパターンで配置された導体とを有し、
前記骨材は、前記弾性体から突出する突出部を有し、前記フレームは、前記突出部と係合する係合部を有し、
前記弾性体は、前記導体が形成された電極部と、前記電極部から突出したピッチ間部とを備え、前記弾性体に前記電極部とピッチ間部とは一体形成され、前記電極と前記ピッチ間部とで、断面略Ｔ字形状に形成され、前記ピッチ間部は、断面角型に形成されるとともに、隣接する前記接続部材間を所定の間隔に維持することを特徴とする接続装置。 In a connection device comprising a connection member for connecting between connection objects, and a frame for holding a plurality of the connection members,
The connection member includes an elastic body, an aggregate disposed in the elastic body, and a conductor disposed in a predetermined pattern at a predetermined position of the elastic body,
The aggregate has a protruding portion that protrudes from the elastic body, and the frame has an engaging portion that engages with the protruding portion,
The elastic body includes an electrode portion on which the conductor is formed and an inter-pitch portion protruding from the electrode portion, and the electrode portion and the inter-pitch portion are integrally formed on the elastic body, and the electrode and the pitch A connecting device, wherein the connecting portion is formed in a substantially T-shaped cross section, and the inter-pitch portion is formed in a square cross section and maintains a predetermined distance between the adjacent connecting members. 請求項１に記載の接続装置において、前記係合部は、前記骨材の突出部が挿入されるものであり、前記骨材を前記フレームへ挿入する際のフレーム挿入側において、前記フレームは前記係合部の少なくとも一部を覆う蓋部材を有することを特徴とする接続装置。   2. The connection device according to claim 1, wherein the engagement portion is a portion into which a protruding portion of the aggregate is inserted, and the frame is inserted into the frame when the aggregate is inserted into the frame. A connection device comprising a lid member covering at least a part of the engaging portion.
JP2005286806A 2005-09-30 2005-09-30 Connected device Expired - Fee Related JP4222616B2 (en)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP2005286806A JP4222616B2 (en) 2005-09-30 2005-09-30 Connected device
US11/540,439 US7329130B2 (en) 2005-09-30 2006-09-29 Intervening connection apparatus capable of easily and accurately positioning a conductor
US11/985,915 US7448878B2 (en) 2005-09-30 2007-11-19 Intervening connection apparatus capable of easily and accurately positioning a conductor

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2005286806A JP4222616B2 (en) 2005-09-30 2005-09-30 Connected device

Publications (2)

Publication Number Publication Date
JP2007095632A JP2007095632A (en) 2007-04-12
JP4222616B2 true JP4222616B2 (en) 2009-02-12

Family

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Family Applications (1)

Application Number Title Priority Date Filing Date
JP2005286806A Expired - Fee Related JP4222616B2 (en) 2005-09-30 2005-09-30 Connected device

Country Status (1)

Country Link
JP (1) JP4222616B2 (en)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009176474A (en) * 2008-01-22 2009-08-06 Japan Aviation Electronics Industry Ltd Connector
JP2009272246A (en) * 2008-05-09 2009-11-19 Fujikura Ltd Socket
JP4828576B2 (en) * 2008-06-05 2011-11-30 日本航空電子工業株式会社 Multi-core socket
JP2012151126A (en) * 2012-04-03 2012-08-09 Japan Aviation Electronics Industry Ltd Connector
JP5970237B2 (en) 2012-05-25 2016-08-17 日本航空電子工業株式会社 connector

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