JP4203026B2 - Application method - Google Patents

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JP4203026B2
JP4203026B2 JP2005018357A JP2005018357A JP4203026B2 JP 4203026 B2 JP4203026 B2 JP 4203026B2 JP 2005018357 A JP2005018357 A JP 2005018357A JP 2005018357 A JP2005018357 A JP 2005018357A JP 4203026 B2 JP4203026 B2 JP 4203026B2
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substrate
resist
substrate surface
film thickness
coating
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聡史 上島
利奈 鍛治
等 羽立
秀幸 谷津
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TDK Corp
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Description

本発明は、半導体装置の製造のリソグラフィ工程で用いられるレジスト等の樹脂を基板表面に塗布するための塗布方法に関する。   The present invention relates to a coating method for coating a resin such as a resist used in a lithography process for manufacturing a semiconductor device on a substrate surface.

半導体装置は、様々なパターンの導電性膜や絶縁性膜が積み重ねられて素子が形成されている。半導体装置の製造には、これらの膜にパターンを形成するために写真製版技術を応用したリソグラフィ工程とエッチング工程がある。半導体基板上に形成された膜にパターンを形成する方法について、簡単に説明する。なお、以下では、半導体基板だけでなく、半導体基板上に膜を形成したものも含めて、単に基板と称する。   In semiconductor devices, elements are formed by stacking conductive films and insulating films of various patterns. In manufacturing a semiconductor device, there are a lithography process and an etching process in which a photoengraving technique is applied to form a pattern on these films. A method for forming a pattern on a film formed on a semiconductor substrate will be briefly described. Hereinafter, not only a semiconductor substrate but also a substrate in which a film is formed is simply referred to as a substrate.

リソグラフィ工程では、膜上にレジストを塗布し、このレジストに所望のパターンを形成する。ここで用いられるレジストは感光性樹脂成分を有機溶剤に溶解させたものであるため、レジストにパターンを焼き付けた後不要なレジストを除去することで、所望のパターンをレジストに形成することが可能である。その後、エッチング工程でレジストに覆われていない部位の膜を除去した後、レジストを除去する。このようにして、基板上の膜に所望のパターンが形成される。   In the lithography process, a resist is applied on the film, and a desired pattern is formed on the resist. Since the resist used here is obtained by dissolving a photosensitive resin component in an organic solvent, it is possible to form a desired pattern on the resist by removing unnecessary resist after baking the pattern on the resist. is there. Then, after removing the film | membrane of the site | part which is not covered with the resist at the etching process, the resist is removed. In this way, a desired pattern is formed on the film on the substrate.

リソグラフィ工程は大きく分けて３つのプロセスからなる。３つのプロセスとは、レジスト塗布、パターン焼き付けのための露光、および、不要なレジストを除去する現像である。本発明に関連するレジスト塗布方法について、レジスト塗布装置を用いて説明する。なお、レジスト塗布後、加熱して余分な有機溶剤および水分を除去するためのプリベークを行うが、プリベークについては従来と同様なため、その詳細な説明を省略する。   The lithography process is roughly divided into three processes. The three processes are resist application, exposure for pattern printing, and development for removing unnecessary resist. A resist coating method related to the present invention will be described using a resist coating apparatus. In addition, after resist application, it heats and performs prebaking for removing an excess organic solvent and water | moisture content, Since it is the same as that of the past, detailed description is abbreviate | omitted.

図４はレジスト塗布装置の一構成例を示す断面模式図である。   FIG. 4 is a schematic cross-sectional view showing a configuration example of a resist coating apparatus.

図４に示すように、レジスト塗布装置は、基板１０を真空吸着して保持する保持部１２と、基板１０を載せた保持部１２を所定の回転速度で回転させるための回転駆動部１４と、配管１５を介してタンクから基板１０にレジストを所定量吐出する吐出部１６と、レジストの飛び散りを防止するためのコータカップ１８と、各部を制御する制御部（不図示）とを有している。また、レジスト塗布前の基板１０を保持部１２に載せたり、レジスト塗布後の基板１０を保持部１２から搬出したりする移載部（不図示）が設けられている。回転駆動部１４、吐出部１６および移載部は制御部と信号線で接続されている。吐出部１６のレジスト吐出口となるノズル２０は、少なくともレジスト吐出時には、保持部１２上に載せられた基板１０の中心の真上に位置している。   As shown in FIG. 4, the resist coating apparatus includes a holding unit 12 that holds the substrate 10 by vacuum suction, a rotation driving unit 14 that rotates the holding unit 12 on which the substrate 10 is placed, at a predetermined rotation speed, A discharge unit 16 that discharges a predetermined amount of resist from the tank to the substrate 10 through the pipe 15, a coater cup 18 for preventing the resist from scattering, and a control unit (not shown) that controls each unit are provided. . Further, a transfer unit (not shown) is provided for placing the substrate 10 before resist application on the holding unit 12 and carrying out the substrate 10 after resist application from the holding unit 12. The rotation drive unit 14, the discharge unit 16, and the transfer unit are connected to the control unit through signal lines. The nozzle 20 serving as a resist discharge port of the discharge unit 16 is located immediately above the center of the substrate 10 placed on the holding unit 12 at least during resist discharge.

次に、図４に示したレジスト塗布装置の動作を簡単に説明する。   Next, the operation of the resist coating apparatus shown in FIG. 4 will be briefly described.

操作者が基板１０を収納したカセットをレジスト塗布装置にセットし、処理開始の指示を入力すると、制御部は移載部にカセットから基板１０を１枚取り出させて保持部１２に移動させる。続いて、制御部は、保持部１２に真空吸着で基板１０を保持させた後、吐出部１６に所定量のレジストをノズル２０を介して基板上に吐出させる。その後、予め設定された回転速度で回転駆動部１４を回転させる。基板１０のほぼ中心にレジストが滴下されているため、遠心力によりレジストが基板中心から周辺方向に広がる。レジストを吐出させてから予め決められた時間だけ基板１０を回転させた後、制御部は回転駆動部１４に回転を停止させる。続いて、移載部に基板１０を保持部１２から搬出させる。このようにして基板１０を回転させてレジストを基板表面に均一に塗布する方法をスピンコート法と言う。基板を回転させながらレジストを吐出させたり、レジストを吐出させながら、ノズルを移動させたりすることもある。   When the operator sets the cassette containing the substrate 10 in the resist coating apparatus and inputs a processing start instruction, the control unit causes the transfer unit to take one substrate 10 out of the cassette and move it to the holding unit 12. Subsequently, the control unit causes the holding unit 12 to hold the substrate 10 by vacuum suction, and then causes the discharge unit 16 to discharge a predetermined amount of resist onto the substrate through the nozzle 20. Thereafter, the rotation drive unit 14 is rotated at a preset rotation speed. Since the resist is dripped almost at the center of the substrate 10, the resist spreads in the peripheral direction from the center of the substrate by centrifugal force. After rotating the substrate 10 for a predetermined time after discharging the resist, the control unit causes the rotation driving unit 14 to stop the rotation. Subsequently, the substrate 10 is unloaded from the holding unit 12 to the transfer unit. A method in which the substrate 10 is rotated in this manner and the resist is uniformly applied to the substrate surface is called a spin coating method. The resist may be discharged while the substrate is rotated, or the nozzle may be moved while discharging the resist.

上述のようにしてレジストを基板上に塗布する際、基板上の全体に膜厚が均一になるようにレジストを塗布するのが望ましい。基板上にレジストを均一に塗布する方法として、レジスト塗布前に予備塗布液を塗布することが開示されている（例えば、特許文献１参照）。この特許文献１に開示された方法は、レジストを溶解可能な予備塗布液を基板上に塗布した後、基板表面に残留する予備塗布液の上にレジストを塗布するものである。
特開平９−２４６１７３号公報 When applying the resist on the substrate as described above, it is desirable to apply the resist so that the film thickness is uniform over the entire substrate. As a method for uniformly applying a resist on a substrate, it has been disclosed to apply a preliminary application liquid before applying a resist (see, for example, Patent Document 1). In the method disclosed in Patent Document 1, a pre-coating liquid capable of dissolving a resist is applied onto a substrate, and then the resist is applied onto the pre-coating liquid remaining on the substrate surface.
Japanese Patent Laid-Open No. 9-246173

塗布したレジストに塗布ムラが生じて膜厚の厚いところと薄いところの差があまりに大きいと、基板内で同一露光量の露光処理をしたとき、基板内でレジストパターンの寸法ばらつきが大きくなってしまう。レジストパターンの寸法ばらつきは、エッチング工程でそのまま膜に転写される。その結果、同一基板に形成される複数の素子の特性ばらつきが大きくなってしまうことなる。   If coating unevenness occurs in the applied resist and the difference between the thick and thin portions is too large, the resist pattern size variation will increase within the substrate when exposure processing is performed with the same exposure amount in the substrate. . The dimensional variation of the resist pattern is directly transferred to the film in the etching process. As a result, the characteristic variation of a plurality of elements formed on the same substrate becomes large.

また、レジストを基板に塗布した際、レジストがはじかれてしまうことがある。この場合、基板上にレジストが全く塗布されていない部位ができてしまうことになる。上記文献の方法ではレジストのはじきについては解決できないという問題があった。   Further, when the resist is applied to the substrate, the resist may be repelled. In this case, a portion where no resist is applied on the substrate is formed. There is a problem that the resist repelling cannot be solved by the method described in the above document.

本発明は上述したような従来の技術が有する問題点を解決するためになされたものであり、樹脂を基板表面に塗布する際に塗布ムラの発生を防止した塗布方法を提供することを目的とする。   The present invention has been made to solve the problems of the conventional techniques as described above, and an object thereof is to provide a coating method that prevents the occurrence of coating unevenness when a resin is coated on a substrate surface. To do.

上記目的を達成するための本発明の塗布方法は、
基板表面に揮発性の有機溶剤をスピンコート法で均一に塗布し、気化熱を利用して基板表面の温度を下げ、結露現象により前記基板表面に均一に水分を付着する工程と、
前記水分が付着した前記基板表面に樹脂をスピンコート法を用いて塗布する工程と、
を有するものである。 To achieve the above object, the coating method of the present invention comprises:
A step of uniformly applying a volatile organic solvent to the substrate surface by a spin coating method, lowering the temperature of the substrate surface using heat of vaporization, and uniformly attaching moisture to the substrate surface due to a dew condensation phenomenon;
A step of applying the resin by spin coating on the substrate surface on which the water is attached,
It is what has.

本発明では、基板表面に均一に水分が付着しているので、樹脂は、直接基板に接しているのではなく、水分の上を基板表面の中心から周辺方向に均一に拡散する。   In the present invention, since moisture uniformly adheres to the substrate surface, the resin does not directly contact the substrate but diffuses uniformly on the moisture from the center of the substrate surface to the peripheral direction.

本発明では、表面が疎水性の基板でも、樹脂と相性の悪い基板であっても、その基板に樹脂を塗布する際、樹脂がはじかれることなく、膜厚分布と膜厚再現性分布が従来よりも向上する。   In the present invention, even if the surface is a hydrophobic substrate or a substrate that is not compatible with the resin, when the resin is applied to the substrate, the resin is not repelled, and the film thickness distribution and the film thickness reproducibility distribution are conventional. Better than.

本発明の塗布方法は、基板表面に水分が均一に付着した状態で樹脂を塗布するものである。   In the coating method of the present invention, the resin is coated in a state where moisture is uniformly attached to the substrate surface.

本実施例の塗布方法を実行するためのレジスト塗布装置について説明する。図１は本実施例で使用したレジスト塗布装置の一構成例を示す断面模式図である。なお、図４と同様な構成については同一の符号を付し、その詳細な説明を省略する。   A resist coating apparatus for executing the coating method of this embodiment will be described. FIG. 1 is a schematic cross-sectional view showing a configuration example of the resist coating apparatus used in this embodiment. In addition, the same code | symbol is attached | subjected about the structure similar to FIG. 4, and the detailed description is abbreviate | omitted.

図１に示すように、本実施例のレジスト塗布装置は、図４に示した構成の他に、有機溶剤を基板上に塗布するための吐出機構と、保持部１２に保持させた基板１０の表面付近の湿度を調整する湿度調整機構とを備えている。   As shown in FIG. 1, in addition to the configuration shown in FIG. 4, the resist coating apparatus of this embodiment includes a discharge mechanism for applying an organic solvent on a substrate, and a substrate 10 held by a holding unit 12. A humidity adjusting mechanism for adjusting the humidity in the vicinity of the surface.

有機溶剤の吐出機構は、図４に示したレジスト用吐出機構と同様であり、吐出部３６と、ノズル３０と、有機溶剤をタンクから吐出部３６に供給するための配管３５とを有する構成である。吐出部３６は制御部（不図示）と信号線で接続されている。   The organic solvent discharge mechanism is the same as the resist discharge mechanism shown in FIG. 4, and includes a discharge portion 36, a nozzle 30, and a pipe 35 for supplying the organic solvent from the tank to the discharge portion 36. is there. The discharge unit 36 is connected to a control unit (not shown) by a signal line.

湿度調整機構は、湿度をモニタするための湿度センサ４２と、純水の空気バブリング部を備えた加湿部４４と、加湿部４４で湿度調整されたエアーをコータカップ１８に供給するファン４８とを有している。湿度センサ４２と加湿部４４は湿度制御部４６と信号線５０で接続されている。湿度制御部４６は、湿度センサ４２の値をモニタし、予め設定された湿度を維持するように加湿部４４を動作させる。なお、湿度の調整を、湿度制御部４６の代わりに、レジスト塗布装置の全体を制御する制御部（不図示）が行ってもよい。湿度調整機構を備えたレジスト塗布装置として、大日本スクリーン製造株式会社製の製品モデル「６０Ｂ」の装置がある。湿度調整機構については、特開平１１−２１６３１７号公報および特開２０００−１６４６７０号公報にその構成例が開示されているため、ここではその詳細な説明を省略する。   The humidity adjusting mechanism includes a humidity sensor 42 for monitoring humidity, a humidifying unit 44 having an air bubbling unit for pure water, and a fan 48 for supplying air adjusted in humidity by the humidifying unit 44 to the coater cup 18. Have. The humidity sensor 42 and the humidifying unit 44 are connected to the humidity control unit 46 through a signal line 50. The humidity control unit 46 monitors the value of the humidity sensor 42 and operates the humidification unit 44 so as to maintain a preset humidity. The humidity adjustment may be performed by a controller (not shown) that controls the entire resist coating apparatus instead of the humidity controller 46. As a resist coating apparatus provided with a humidity adjusting mechanism, there is an apparatus of a product model “60B” manufactured by Dainippon Screen Mfg. Co., Ltd. The humidity adjustment mechanism is disclosed in Japanese Patent Laid-Open Nos. 11-216317 and 2000-164670, and a detailed description thereof is omitted here.

次に、図１を参照しながら本実施例の塗布方法について説明する。   Next, the coating method of the present embodiment will be described with reference to FIG.

湿度調整機構によりコータカップ１８内の湿度を４０〜５０％の範囲に維持する。従来と同様にして基板１０を保持部１２に保持させる。その後、有機溶剤を基板上に所定量吐出させ、基板１０を回転数２０００ｒｐｍで回転させる。揮発性により有機溶剤が蒸発すると、気化熱により基板表面の熱が奪われ基板表面の温度が周囲よりも低下し、基板表面に結露現象による結露水が生成される。基板１０を回転させることで、有機溶剤を基板上に均一に塗布させていたため、結露水が基板表面に均一に付着した状態になっている。結露水が基板表面に付着した状態のままレジストをノズル２０から基板１０に滴下させる。それ以降は、従来と同様に行う。   The humidity in the coater cup 18 is maintained in the range of 40 to 50% by the humidity adjusting mechanism. The substrate 10 is held by the holding unit 12 in the same manner as in the prior art. Thereafter, a predetermined amount of organic solvent is discharged onto the substrate, and the substrate 10 is rotated at a rotational speed of 2000 rpm. When the organic solvent evaporates due to volatility, the heat of the substrate surface is taken away by the heat of vaporization, the temperature of the substrate surface is lower than the surroundings, and dew condensation water due to the dew condensation phenomenon is generated on the substrate surface. By rotating the substrate 10, the organic solvent is uniformly applied on the substrate, so that the dew condensation water is uniformly attached to the substrate surface. The resist is dropped from the nozzle 20 onto the substrate 10 with the condensed water adhering to the substrate surface. After that, it is performed in the same manner as before.

本実施例の塗布方法で、基板表面の膜の種類によらず、基板上にレジストを均一に、再現性よく塗布することができた。その効果をより正確に確認するための塗布実験を行ったので、以下に、その実験について説明する。   With the coating method of this example, it was possible to apply the resist uniformly and reproducibly on the substrate regardless of the type of film on the substrate surface. Since the application experiment for confirming the effect more accurately was conducted, the experiment will be described below.

塗布実験には、直径６インチのシリコン基板の表面にアルミナを成膜したものを基板として用いた。レジストとしてポリイミド（東レ株式会社製のフォトニース（登録商標））を用いた。基板上目標膜厚は０．２μｍである。塗布方法はスピンコート法である。基板の回転数を２０００ｒｐｍとした。使用した有機溶剤は、乳酸エチル、ＮＭＰ（Ｎ−メチル−２−ピロリドン）およびＰＧＭＥＡ（プロピレングリコールモノメチルエーテルアセテート（１−メトキシ−２−プロピルアセテート））である。   In the coating experiment, an alumina film formed on the surface of a 6-inch diameter silicon substrate was used as the substrate. Polyimide (Photo Nice (registered trademark) manufactured by Toray Industries, Inc.) was used as a resist. The target film thickness on the substrate is 0.2 μm. The coating method is a spin coating method. The rotation speed of the substrate was 2000 rpm. The organic solvents used are ethyl lactate, NMP (N-methyl-2-pyrrolidone) and PGMEA (propylene glycol monomethyl ether acetate (1-methoxy-2-propyl acetate)).

次に、実験水準について説明する。図２は塗布実験の水準を示す表である。   Next, the experimental level will be described. FIG. 2 is a table showing the level of the coating experiment.

図２に示すように、水準１はポリイミド塗布前に何も処理をしない場合である。水準２は、特許文献１に開示された方法であり、有機溶剤を塗布した後、基板表面に有機溶剤が残っている間にポリイミドを塗布する場合である。水準３は、本発明の塗布方法に相当するものであり、塗布した有機溶剤が蒸発して基板表面に結露が発生し、結露水が残っている間にポリイミドを塗布する場合である。基板表面付近の湿度を２０〜６０％の範囲とした。水準４は、生成された結露水が蒸発して基板表面が乾燥してからポリイミドを塗布する場合である。   As shown in FIG. 2, level 1 is a case where no treatment is performed before polyimide coating. Level 2 is a method disclosed in Patent Document 1, in which polyimide is applied while the organic solvent remains on the substrate surface after the organic solvent is applied. Level 3 corresponds to the coating method of the present invention, in which the applied organic solvent evaporates and condensation occurs on the substrate surface, and polyimide is applied while the condensed water remains. The humidity near the substrate surface was in the range of 20-60%. Level 4 is a case where polyimide is applied after the generated condensed water evaporates and the substrate surface is dried.

続いて、膜厚評価方法について説明する。   Subsequently, a film thickness evaluation method will be described.

ポリイミドの膜厚評価に、基板内膜厚分布と、塗布再現性を示す膜厚再現性を行った。各基板の面内の２５点で膜厚を測定し、膜厚分布を次式の計算により求めた。なお、２５点の膜厚測定点のうち最大値をＭａｘとし、最小値をＭｉｎとしている。Ａｖｅは、測定した２５点の膜厚の平均値である。
膜厚分布（％）＝（（Ｍａｘ−Ｍｉｎ）／Ａｖｅ）×１００ In the film thickness evaluation of polyimide, the film thickness distribution in the substrate and the film thickness reproducibility showing the coating reproducibility were performed. The film thickness was measured at 25 points in the plane of each substrate, and the film thickness distribution was calculated by the following formula. Of the 25 film thickness measurement points, the maximum value is Max, and the minimum value is Min. Ave is the average value of the measured film thickness at 25 points.
Film thickness distribution (%) = ((Max−Min) / Ave) × 100

また、膜厚再現性を次式の計算により求めた。ただし、水準内での膜厚平均値を比較し、膜厚平均値の最大値をＭａｘとし、最小値をＭｉｎとしている。Ａｖｅは、各基板の膜厚平均値について水準内で平均した値である。
膜厚再現性（％）＝（（Ｍａｘ−Ｍｉｎ）／Ａｖｅ）×１００ Further, the film thickness reproducibility was obtained by calculation of the following equation. However, the film thickness average values within the standard are compared, the maximum value of the film thickness average value is set to Max, and the minimum value is set to Min. Ave is a value obtained by averaging the film thickness average values of the respective substrates within the level.
Film thickness reproducibility (%) = ((Max−Min) / Ave) × 100

次に、レジスト塗布実験の結果について説明する。   Next, the result of the resist coating experiment will be described.

図３はレジスト塗布実験の結果を示す表である。図３の水準１に示すように、直接にポリイミドを塗布したらポリイミドがはじかれてしまって、膜厚の評価ができなかった。水準２のうち予備塗布液が乳酸エチルの場合、乳酸エチルが基板表面に残ったままの状態ではポリイミドがはじかれてしまって、膜厚分布および膜厚再現性を評価できなかった。予備塗布液がＮＭＰの場合ではポリイミドを塗布することが可能であったが、膜厚再現性が５％以上であった。   FIG. 3 is a table showing the results of a resist coating experiment. As shown in Level 1 in FIG. 3, when polyimide was applied directly, the polyimide was repelled and the film thickness could not be evaluated. In Level 2, when the pre-coating solution was ethyl lactate, the polyimide was repelled while the ethyl lactate remained on the substrate surface, and the film thickness distribution and film thickness reproducibility could not be evaluated. When the preliminary coating solution was NMP, it was possible to apply polyimide, but the film thickness reproducibility was 5% or more.

一方、水準３では、湿度２０％の場合にポリイミドがはじかれてしまったが、湿度３０〜６０％の範囲では有機溶剤が乳酸エチルおよびＰＧＭＥＡのいずれの場合も膜厚分布が１％以下であり、膜厚再現性が１％以下であった。   On the other hand, at level 3, the polyimide was repelled when the humidity was 20%, but the film thickness distribution was 1% or less when the organic solvent was either ethyl lactate or PGMEA when the humidity ranged from 30 to 60%. The film thickness reproducibility was 1% or less.

また、水準４では、結露水が基板表面に生成されたが、基板表面が乾燥した後にポリイミドを塗布しており、ポリイミドがはじかれてしまって、膜厚の評価ができなかった。   In Level 4, condensed water was generated on the substrate surface. However, polyimide was applied after the substrate surface was dried, and the polyimide was repelled, making it impossible to evaluate the film thickness.

水準毎の結果をまとめると、以下のようになる。水準１ではポリイミドが表面ではじかれ、塗布ムラが発生した。水準２では膜厚再現性が乏しかった。水準４は、水準１に近い状態であるため、ポリイミドが表面ではじかれ、塗布ムラが発生した。一方、本発明の塗布方法に相当する水準３では、湿度３０〜６０％の範囲で塗布ムラがなく、膜厚分布と膜厚再現性が良好であった。   The results for each level are summarized as follows. In level 1, the polyimide was repelled on the surface and coating unevenness occurred. At level 2, film thickness reproducibility was poor. Since level 4 is a state close to level 1, polyimide was repelled on the surface and coating unevenness occurred. On the other hand, at level 3 corresponding to the coating method of the present invention, there was no coating unevenness in the humidity range of 30 to 60%, and the film thickness distribution and film thickness reproducibility were good.

なお、水準３で湿度２０％の場合にポリイミドがはじかれてしまったのは、結露水の発生量が少なく、水分が基板表面に均一に付着していなかったためと考えられる。また、水準３の結果からは、湿度２０％と３０％の間でいずれの値から塗布性が向上するのか不明であるが、少なくとも湿度３０％以上で良好であることがわかる。さらに、表には示していないが、湿度が６０％よりも大きい場合、極端に大きくなると塗布性は改善されなかった。   The reason why the polyimide was repelled when the humidity was 20% at level 3 is considered to be because the amount of condensed water generated was small and moisture was not uniformly attached to the substrate surface. Further, from the result of level 3, it is unclear from which value the applicability is improved between humidity 20% and 30%, but it is understood that it is good at least at a humidity of 30% or more. Further, although not shown in the table, when the humidity is larger than 60%, the coating property is not improved when the humidity becomes extremely large.

塗布実験の結果から、本発明の塗布方法は、表面が疎水性の基板など、樹脂と相性の悪い基板に対して、膜厚分布と膜厚再現性が良好に樹脂を塗布できることがわかる。   From the results of the coating experiment, it can be seen that the coating method of the present invention can apply a resin with good film thickness distribution and film thickness reproducibility to a substrate having a poor compatibility with the resin, such as a hydrophobic substrate.

本発明の塗布方法では、基板表面に樹脂を塗布する際、予め表面に水分が均一に付着しているため、ポリイミド等の樹脂がアルミナ表面の上に接して拡散するのではなく、水分上を拡散していると考えられる。そのため、疎水性の基板でも、樹脂との相性が悪い基板でも、その表面に均一に水分が付着していることで、樹脂が水分上を均一に拡散することが可能となる。樹脂が基板表面に均一に広がった後では、水分が樹脂から蒸発して、樹脂が直接基板上に塗布された状態になる。   In the coating method of the present invention, when the resin is applied to the surface of the substrate, since moisture is uniformly attached to the surface in advance, the resin such as polyimide does not come into contact with and diffuse on the alumina surface. It is thought that it is spreading. Therefore, even if the substrate is hydrophobic or has poor compatibility with the resin, the resin can be uniformly diffused on the moisture because the moisture is uniformly attached to the surface of the substrate. After the resin spreads uniformly on the substrate surface, the water evaporates from the resin, and the resin is applied directly on the substrate.

また、スピンコート法では回転する基板と空気との摩擦で静電気が発生し、基板表面が帯電する。この静電気が塗布ムラを起こす原因とも考えられている。本発明の塗布方法では、基板表面に付着した水分が帯電を瞬間的に空気中にスムーズに逃がすことになる。そのため、帯電による影響を抑制して樹脂を基板上に均一に塗布することができる。   In the spin coating method, static electricity is generated by friction between the rotating substrate and air, and the substrate surface is charged. It is also considered that this static electricity causes uneven coating. In the coating method of the present invention, the moisture adhering to the surface of the substrate allows the charge to escape smoothly into the air instantaneously. Therefore, it is possible to uniformly apply the resin on the substrate while suppressing the influence of charging.

本発明の塗布方法では、結露水は気化するため、基板表面の膜を改質させるものではない。そのため、樹脂が塗布される基板表面は、金属膜でもよく、酸化膜および窒化膜等の無機膜でもよく、有機膜でもよい。   In the coating method of the present invention, the condensed water is vaporized, so that the film on the substrate surface is not modified. Therefore, the substrate surface to which the resin is applied may be a metal film, an inorganic film such as an oxide film and a nitride film, or an organic film.

なお、本実施例では、基板表面に有機溶剤を塗布することで、有機溶剤が蒸発するときに気化熱を生成させて基板表面の温度を下げているが、他の方法で基板表面の温度を下げてもよい。基板表面の温度を下げる他の方法として、冷却空気を基板表面に吹き付ける方法がある。この場合、レジスト塗布装置に冷却機構を予め設けて制御部と信号線で接続する。そして、制御部は冷却機構が基板表面に冷却空気を吹き付けるタイミングを制御する。   In this embodiment, the organic solvent is applied to the substrate surface to generate the heat of vaporization when the organic solvent evaporates to lower the temperature of the substrate surface. It may be lowered. As another method for lowering the temperature of the substrate surface, there is a method of blowing cooling air to the substrate surface. In this case, the resist coating apparatus is provided with a cooling mechanism in advance and is connected to the control unit via a signal line. The control unit controls the timing at which the cooling mechanism blows cooling air onto the substrate surface.

また、基板表面に水分を均一に付着するために結露水を用いたが、他の方法で水分を基板表面に均一に発生させるようにしてもよい。水分を基板表面に均一に発生させる他の方法として、水分のミストを基板表面に噴霧する方法がある。この場合、レジスト塗布装置に噴霧器を予め設けて制御部と信号線で接続する。そして、制御部は噴霧器が水分のミストを基板表面に噴霧するタイミングを制御する。   In addition, although dew condensation water is used to uniformly adhere moisture to the substrate surface, moisture may be uniformly generated on the substrate surface by other methods. As another method of uniformly generating moisture on the substrate surface, there is a method of spraying moisture mist on the substrate surface. In this case, a sprayer is provided in advance in the resist coating apparatus and connected to the control unit via a signal line. The control unit controls the timing at which the sprayer sprays the mist of moisture on the substrate surface.

また、基板表面に結露水を発生させるために有機溶剤を用いているので、有機溶剤は樹脂の可溶性である必要はない。有機溶剤には、実施例で用いたＮＭＰやＰＧＭＥＡの他に、ＥＣＡ（Ｅｔｈｙｌ Ｃｅｌｌｏｓｌｖｅ Ａｃｅｔａｔｅ）、ＥＬ（Ｅｔｈｙｌ Ｌａｃｔａｔｅ）およびＮＢＡ（ｎ−Ｂｕｔｙｌ Ａｃｅｔａｔｅ）がある。   Moreover, since the organic solvent is used in order to generate dew condensation water on the substrate surface, the organic solvent does not need to be soluble in the resin. Organic solvents include ECA (Ethyl Cellolate Acetate), EL (Ethyl Lactate) and NBA (n-Butyl Acetate) in addition to NMP and PGMEA used in the examples.

さらに、塗布する樹脂は、感光性樹脂に限らない。また、有機溶剤系樹脂に限らず、水溶性樹脂であってもよい。利用可能な樹脂として、ノボラック系のレジスト、ＰＨＳ（ポリヒドロキシシチレン）系の化学増幅型レジスト等がある。   Furthermore, the resin to be applied is not limited to a photosensitive resin. Moreover, not only organic solvent resin but water-soluble resin may be used. Examples of the resin that can be used include a novolak-based resist and a PHS (polyhydroxystyrene) -based chemically amplified resist.

本実施例で用いたレジスト塗布装置の一構成例を示す断面模式図である。It is a cross-sectional schematic diagram which shows one structural example of the resist coating apparatus used in the present Example. 塗布実験の水準を示す表である。It is a table | surface which shows the level of application | coating experiment. 塗布実験の結果を示す表である。It is a table | surface which shows the result of an application | coating experiment. レジスト塗布装置の一構成例を示す断面模式図である。It is a cross-sectional schematic diagram which shows one structural example of a resist coating apparatus.

符号の説明Explanation of symbols

１０ 基板
１２ 保持部
１４ 回転駆動部
１５、３５ 配管
１６、３６ 吐出部
１８ コータカップ
２０、３０ ノズル
４２ 湿度センサ
４４ 加湿部
４６ 湿度制御部
４８ ファン
５０ 信号線 DESCRIPTION OF SYMBOLS 10 Board | substrate 12 Holding part 14 Rotation drive part 15, 35 Piping 16, 36 Discharge part 18 Coater cup 20, 30 Nozzle 42 Humidity sensor 44 Humidification part 46 Humidity control part 48 Fan 50 Signal line

Claims (2)

基板表面に揮発性の有機溶剤をスピンコート法で均一に塗布し、気化熱を利用して基板表面の温度を下げ、結露現象により前記基板表面に均一に水分を付着する工程と、
前記水分が付着した前記基板表面に樹脂をスピンコート法を用いて塗布する工程と、
を有する塗布方法。 A step of uniformly applying a volatile organic solvent to the substrate surface by a spin coating method, lowering the temperature of the substrate surface using heat of vaporization, and uniformly attaching moisture to the substrate surface due to a dew condensation phenomenon;
A step of applying the resin by spin coating on the substrate surface on which the water is attached,
A coating method comprising: 前記基板表面の湿度を３０％から６０％の間に維持する請求項１に記載の塗布方法。 The coating method according to claim 1, wherein the humidity of the substrate surface is maintained between 30% and 60%.
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