JP4202764B2 - 研磨装置 - Google Patents
研磨装置 Download PDFInfo
- Publication number
- JP4202764B2 JP4202764B2 JP2002579171A JP2002579171A JP4202764B2 JP 4202764 B2 JP4202764 B2 JP 4202764B2 JP 2002579171 A JP2002579171 A JP 2002579171A JP 2002579171 A JP2002579171 A JP 2002579171A JP 4202764 B2 JP4202764 B2 JP 4202764B2
- Authority
- JP
- Japan
- Prior art keywords
- pad
- polishing
- polishing pad
- polishing apparatus
- working surface
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 238000005498 polishing Methods 0.000 title claims description 79
- 239000006260 foam Substances 0.000 claims description 43
- 229920001971 elastomer Polymers 0.000 claims description 6
- 238000009423 ventilation Methods 0.000 claims 1
- 238000007373 indentation Methods 0.000 description 15
- 239000010410 layer Substances 0.000 description 11
- 229920000642 polymer Polymers 0.000 description 6
- 229920002635 polyurethane Polymers 0.000 description 3
- 239000004814 polyurethane Substances 0.000 description 3
- 238000001816 cooling Methods 0.000 description 2
- 238000010030 laminating Methods 0.000 description 2
- 230000007246 mechanism Effects 0.000 description 2
- 239000002245 particle Substances 0.000 description 2
- -1 polydiene Polymers 0.000 description 2
- 239000012790 adhesive layer Substances 0.000 description 1
- 230000008878 coupling Effects 0.000 description 1
- 238000010168 coupling process Methods 0.000 description 1
- 238000005859 coupling reaction Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 239000013013 elastic material Substances 0.000 description 1
- 238000005187 foaming Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 229920001748 polybutylene Polymers 0.000 description 1
- 229920000098 polyolefin Polymers 0.000 description 1
- 239000002002 slurry Substances 0.000 description 1
- 229920001169 thermoplastic Polymers 0.000 description 1
- 239000004416 thermosoftening plastic Substances 0.000 description 1
- 229920002554 vinyl polymer Polymers 0.000 description 1
Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
- B24D13/00—Wheels having flexibly-acting working parts, e.g. buffing wheels; Mountings therefor
- B24D13/14—Wheels having flexibly-acting working parts, e.g. buffing wheels; Mountings therefor acting by the front face
-
- A—HUMAN NECESSITIES
- A47—FURNITURE; DOMESTIC ARTICLES OR APPLIANCES; COFFEE MILLS; SPICE MILLS; SUCTION CLEANERS IN GENERAL
- A47L—DOMESTIC WASHING OR CLEANING; SUCTION CLEANERS IN GENERAL
- A47L11/00—Machines for cleaning floors, carpets, furniture, walls, or wall coverings
- A47L11/40—Parts or details of machines not provided for in groups A47L11/02 - A47L11/38, or not restricted to one of these groups, e.g. handles, arrangements of switches, skirts, buffers, levers
- A47L11/4036—Parts or details of the surface treating tools
- A47L11/4041—Roll shaped surface treating tools
-
- A—HUMAN NECESSITIES
- A47—FURNITURE; DOMESTIC ARTICLES OR APPLIANCES; COFFEE MILLS; SPICE MILLS; SUCTION CLEANERS IN GENERAL
- A47L—DOMESTIC WASHING OR CLEANING; SUCTION CLEANERS IN GENERAL
- A47L11/00—Machines for cleaning floors, carpets, furniture, walls, or wall coverings
- A47L11/02—Floor surfacing or polishing machines
- A47L11/10—Floor surfacing or polishing machines motor-driven
- A47L11/14—Floor surfacing or polishing machines motor-driven with rotating tools
- A47L11/16—Floor surfacing or polishing machines motor-driven with rotating tools the tools being disc brushes
- A47L11/164—Parts or details of the brushing tools
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Polishing Bodies And Polishing Tools (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
- Cleaning Implements For Floors, Carpets, Furniture, Walls, And The Like (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
Description
(a)弾性圧縮可能なディスク状の発泡体研磨パッドであって、第1及び第2の反対側の主要な作用表面を有し、この作用表面のそれぞれが、間隔を空けて配置された、ほぼ先端を切り取られた錐体状の複数のくぼみ(随意に、くぼみの底部を形成する先端を切り取られた端部は丸められている)を有し、これらの間には先端を切り取られた形状の錐体が存在し、ここで随意に丸められていてよい先端を切り取られた錐体の頂部が全て同一面上にあり、作用表面を形成している、弾性圧縮可能なディスク状の発泡研磨パッド;
(b)一方の作用表面がバックアップパッドから出るようにし、且つ他方の作用表面がバックアップパッドと接触するようにして、発泡体研磨パッドと接触して発泡体研磨パッドを保持するバックアップパッド;
(c)研磨パッドの一方の表面がバックアップパッドに脱離可能に接触するように保持する保持体。
Claims (14)
- 第1及び第2の反対側の主要な作用表面を有し、これらの作用表面がそれぞれ、先端を切り取られた略錐体型の凹部の形の、間隔を空けて配置された複数のくぼみを有し、これらのくぼみの間には、先端を切り取られた形状の錐体が存在し、この先端を切り取られた形状の錐体の頂部が全て同一面上にあって作用表面を形成している、ディスク状の弾性圧縮可能発泡体研磨パッド;
前記研磨パッドの1つの作用表面がバックアップパッドから突出し、且つ前記研磨パッドの他の作用表面がバックアップパッドと接触するようにして、前記研磨パッドと接触して前記研磨パッドを保持する、バックアップパッド;及び
前記研磨パッドの1つの表面を前記バックアップパッドと脱離可能なように接触させて保持する、保持体;
を有する、オービタル研磨機と組み合わせて使用するようにされている研磨装置。 - 前記くぼみの底部を形成する先端を切り取られた端部、及び研磨パッドの作用表面の一部を形成する先端を切り取られた錐体の頂部が丸められている、請求項1に記載の研磨装置。
- 前記バックアップパッドがカップ状ホルダーの形であり、このカップ状ホルダー内に研磨パッドの一部が保持されており、このカップ状ホルダーが、研磨パッドの周囲の凹部と協働する保持体を具備して、カップ状ホルダーに対する研磨パッドの回転運動を制限する、請求項1に記載の研磨装置。
- 前記カップ状ホルダーの底部が浅いボスを具備し、このボスが、カップ状ホルダー内に配置される発泡体パッドの作用表面に接触する、請求項3に記載の研磨装置。
- オービタル研磨機に取り付けられるようにされている、請求項3に記載の研磨装置。
- 前記研磨パッドの第1の作用表面を提供する発泡体の圧縮性と、前記研磨パッドの第2の作用表面を提供する発泡体の圧縮性とが異なっている、請求項3に記載の研磨装置。
- 前記研磨パッドが、ゴム状ポリマーの中間層によって積層された2つの発泡体パッドを有する、請求項3に記載の研磨装置。
- 前記カップ状ホルダーが複数の通気孔を有する、請求項3に記載の研磨装置。
- 前記バックアップパッドが軸方向の延長棒を有するプレート状であり;前記研磨パッドが、前記延長棒に適合するようにされ、且つ研磨パッドのそれぞれの表面の近くで前記延長棒の直径よりも大きい直径の領域を有する軸方向に配置された孔を有し、;且つ前記保持体が、前記延長棒の端部に脱離可能に取り付けられ、それによって研磨パッドの1つの表面をバックアッププレートに接触するように保持する、請求項1に記載の研磨装置。
- 前記プレートが一連の突起を有し、これらの突起が前記研磨パッドに貫入して、このプレートに対する研磨パッドの回転運動を制限する、請求項9に記載の研磨装置。
- オービタル研磨機に取り付けられるようにされている、請求項9に記載の研磨装置。
- 前記研磨パッドの第1の作用表面を提供する発泡体の圧縮性と、前記研磨パッドの第2の作用表面を提供する発泡体の圧縮性とが異なっている、請求項9に記載の研磨装置。
- 前記研磨パッドが、ゴム状ポリマーの中間層によって積層された2つの発泡体を有する、請求項9に記載の研磨装置。
- 前記保持体が、前記バックアッププレートの延長棒のねじ山と協働するねじ山をつけられた部材を有する、請求項9に記載の研磨装置。
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US09/826,343 US6523215B2 (en) | 2001-04-04 | 2001-04-04 | Polishing pad and system |
PCT/US2002/009466 WO2002081149A1 (en) | 2001-04-04 | 2002-03-28 | Polishing pad and system |
Related Child Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2008185114A Division JP4955619B2 (ja) | 2001-04-04 | 2008-07-16 | 研磨パッド |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2004533333A JP2004533333A (ja) | 2004-11-04 |
JP4202764B2 true JP4202764B2 (ja) | 2008-12-24 |
Family
ID=25246291
Family Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2002579171A Expired - Fee Related JP4202764B2 (ja) | 2001-04-04 | 2002-03-28 | 研磨装置 |
JP2008185114A Expired - Fee Related JP4955619B2 (ja) | 2001-04-04 | 2008-07-16 | 研磨パッド |
Family Applications After (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2008185114A Expired - Fee Related JP4955619B2 (ja) | 2001-04-04 | 2008-07-16 | 研磨パッド |
Country Status (21)
Country | Link |
---|---|
US (2) | US6523215B2 (ja) |
JP (2) | JP4202764B2 (ja) |
KR (1) | KR100571689B1 (ja) |
CN (1) | CN100563934C (ja) |
AT (1) | AT500571B1 (ja) |
AU (1) | AU2002306908B2 (ja) |
BE (1) | BE1014743A3 (ja) |
BR (1) | BR0208567B1 (ja) |
CA (1) | CA2441383C (ja) |
DE (1) | DE10296621B4 (ja) |
ES (1) | ES2251281B2 (ja) |
FR (1) | FR2823145B1 (ja) |
GB (1) | GB2389516B (ja) |
HK (1) | HK1070019A1 (ja) |
MX (1) | MXPA03009088A (ja) |
NZ (1) | NZ528154A (ja) |
RU (1) | RU2253560C1 (ja) |
SE (1) | SE527121C2 (ja) |
TW (1) | TW541225B (ja) |
WO (1) | WO2002081149A1 (ja) |
ZA (1) | ZA200307176B (ja) |
Families Citing this family (32)
Publication number | Priority date | Publication date | Assignee | Title |
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US6523215B2 (en) * | 2001-04-04 | 2003-02-25 | Saint-Gobain Abrasives Technology Company | Polishing pad and system |
US7014550B2 (en) * | 2001-09-14 | 2006-03-21 | Saint-Gobain Abrasives Technology Company | Sanding system |
AU2003231153A1 (en) * | 2002-04-26 | 2003-11-10 | Zynon Technologies, Llc | Article for cleaning optical fibers |
CN1327344C (zh) * | 2003-08-19 | 2007-07-18 | 英特尔公司 | 无交流电源时保存和恢复工作状态的基本输入/输出*** |
US7814613B1 (en) | 2003-10-23 | 2010-10-19 | R.E. Whittaker Company, Inc. | Rollers and disks for carpet cleaning |
US7354334B1 (en) * | 2004-05-07 | 2008-04-08 | Applied Materials, Inc. | Reducing polishing pad deformation |
US20070214592A1 (en) * | 2006-03-15 | 2007-09-20 | Boler Lewyn B | Pad, system and method for polishing, buffing, compounding and glazing |
EP2089333B1 (en) * | 2006-12-14 | 2011-02-16 | DSM IP Assets B.V. | D1363 bt radiation curable primary coatings on optical fiber |
US8897039B2 (en) * | 2007-06-12 | 2014-11-25 | Bcd Semiconductor Manufacturing Limited | Method and system for pulse frequency modulated switching mode power supplies |
US8845395B2 (en) | 2008-10-31 | 2014-09-30 | Araca Inc. | Method and device for the injection of CMP slurry |
US8197306B2 (en) * | 2008-10-31 | 2012-06-12 | Araca, Inc. | Method and device for the injection of CMP slurry |
FR2943240B1 (fr) * | 2009-03-17 | 2011-04-01 | Pascal Ratel | Necessaire pour le polissage d'une prothese dentaire |
US8045348B2 (en) | 2009-04-09 | 2011-10-25 | Bcd Semiconductor Manufacturing Limited | Switching mode power supply controller with high voltage startup circuits |
US20110097977A1 (en) * | 2009-08-07 | 2011-04-28 | Abrasive Technology, Inc. | Multiple-sided cmp pad conditioning disk |
WO2011142764A1 (en) * | 2010-05-14 | 2011-11-17 | Araca, Inc. | Method for cmp using pad in a bottle |
DE102010029792A1 (de) * | 2010-06-08 | 2011-12-08 | Robert Bosch Gmbh | Schleifwerkzeug für ein Schleifgerät mit Drehoszillationsantrieb |
US8429782B2 (en) | 2011-03-16 | 2013-04-30 | Timothy M. Russo | Polishing system, sub-system and pads |
US20120302148A1 (en) * | 2011-05-23 | 2012-11-29 | Rajeev Bajaj | Polishing pad with homogeneous body having discrete protrusions thereon |
US9108291B2 (en) * | 2011-09-22 | 2015-08-18 | Dow Global Technologies Llc | Method of forming structured-open-network polishing pads |
US9067298B2 (en) | 2011-11-29 | 2015-06-30 | Nexplanar Corporation | Polishing pad with grooved foundation layer and polishing surface layer |
US9067297B2 (en) | 2011-11-29 | 2015-06-30 | Nexplanar Corporation | Polishing pad with foundation layer and polishing surface layer |
CA2874498A1 (en) | 2012-05-22 | 2013-11-28 | Owens Corning Intellectual Capital, Llc | Laminated foam product and methods for making laminated foam products |
US9597769B2 (en) | 2012-06-04 | 2017-03-21 | Nexplanar Corporation | Polishing pad with polishing surface layer having an aperture or opening above a transparent foundation layer |
JP6254383B2 (ja) * | 2013-08-29 | 2017-12-27 | 株式会社荏原製作所 | ドレッシング装置及びそれを備えた化学的機械的研磨装置、それに用いるドレッサーディスク |
US9798093B2 (en) * | 2014-07-11 | 2017-10-24 | Zynon Technologies, Llc | Article for cleaning optical fibers |
US9682461B2 (en) | 2014-10-03 | 2017-06-20 | Showroom Polishing Systems Llc. | Sloped polishing pad with hybrid cloth and foam surface |
KR101647717B1 (ko) * | 2016-04-23 | 2016-08-11 | (주)라코텍 | 랩핑용 연마휠 및 그 제조 방법 |
EP3272456B1 (en) * | 2016-07-21 | 2019-03-13 | Delamare Sovra | A method for manufacturing in series optical grade polishing tools |
US9925637B2 (en) * | 2016-08-04 | 2018-03-27 | Rohm And Haas Electronic Materials Cmp Holdings, Inc. | Tapered poromeric polishing pad |
CN107471090A (zh) * | 2017-09-30 | 2017-12-15 | 德清晶生光电科技有限公司 | 具有散热结构的游星轮 |
CN109202694B (zh) * | 2018-09-27 | 2020-07-24 | 江西龙正科技发展有限公司 | 一种多层纳米纤维化学机械抛光垫 |
CN113183008B (zh) * | 2021-03-31 | 2022-11-25 | 安徽禾臣新材料有限公司 | 一种多孔聚氨酯抛光垫及其抛光垫凹部成型方法 |
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US1777915A (en) * | 1927-08-03 | 1930-10-07 | Douglas Richard | Polisher |
US2319873A (en) * | 1941-10-13 | 1943-05-25 | William W Linz | Resilient body |
DE811671C (de) | 1950-04-12 | 1951-08-23 | Kurt R Dipl-Ing Scherer | Polierwerkzeug |
US3008168A (en) | 1958-12-08 | 1961-11-14 | Doyle Thomas | Abrasive polishing wheel |
US3317944A (en) * | 1965-12-15 | 1967-05-09 | Maurice A Napier | Multi-purpose sponge brush |
US3707012A (en) * | 1968-11-18 | 1972-12-26 | Levoy Inc S | Disposable scrub brush |
US3703739A (en) * | 1971-03-02 | 1972-11-28 | Beatrice Foods Co | Multiple layer surface working pads |
US3990124A (en) * | 1973-07-26 | 1976-11-09 | Mackay Joseph H Jun | Replaceable buffing pad assembly |
JPS55139845A (en) * | 1979-04-18 | 1980-11-01 | Hitachi Ltd | Motor ice shaver |
US4403367A (en) * | 1981-08-17 | 1983-09-13 | Miliken Research Corporation | Yarn pad |
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US4962562A (en) | 1989-01-18 | 1990-10-16 | Minnesota Mining And Manufacturing Company | Compounding, glazing or polishing pad |
US5396737B1 (en) | 1989-01-18 | 1997-12-23 | Minnesota Mining & Mfg | Compound glazing or polishing pad |
US5185964A (en) * | 1989-01-18 | 1993-02-16 | Minnesota Mining And Manufacturing Company | Compounding, glazing or polishing pad |
US5007128B1 (en) | 1989-01-18 | 1993-12-07 | Minnesota Mining And Manufacturing Company | Compounding,glazing or polishing pad |
JPH0325588A (ja) * | 1989-06-22 | 1991-02-04 | Nec Corp | 電子回路モジュール |
JPH0372482U (ja) * | 1989-11-21 | 1991-07-22 | ||
JPH0417742A (ja) * | 1990-05-02 | 1992-01-22 | Toyota Motor Corp | 過給希薄燃焼ガソリン内燃機関の空燃比制御装置 |
JPH0715732Y2 (ja) * | 1990-05-25 | 1995-04-12 | ミネソタ マイニング アンド マニユフアクチユアリング カンパニー | 研磨用ディスクホルダ組立体 |
JPH05294211A (ja) * | 1992-04-21 | 1993-11-09 | Giichi Wada | 自動車の車体表面磨き具 |
US5311634A (en) * | 1993-02-03 | 1994-05-17 | Nicholas Andros | Sponge cleaning pad |
JPH08228983A (ja) * | 1994-12-27 | 1996-09-10 | Yoshie Shimada | 摺擦具 |
US5461750A (en) * | 1995-02-02 | 1995-10-31 | Kaiser; Richard A. | Double curved backing plate with cushioned support for rotary buffing pads |
AU7480896A (en) | 1995-12-04 | 1997-06-27 | Minnesota Mining And Manufacturing Company | Abrasive article back up pad with foam layer |
US5822826A (en) * | 1996-05-15 | 1998-10-20 | Parker; Merilyn Stevens Mitchell | Decorating paint applying device |
JPH1014840A (ja) * | 1996-07-09 | 1998-01-20 | Dekusutaa Pacific Kk | 清掃用布体 |
US5806135A (en) * | 1996-09-12 | 1998-09-15 | Earle; John R. | Apparatus for removing dust from an object |
US6523215B2 (en) * | 2001-04-04 | 2003-02-25 | Saint-Gobain Abrasives Technology Company | Polishing pad and system |
-
2001
- 2001-04-04 US US09/826,343 patent/US6523215B2/en not_active Expired - Lifetime
-
2002
- 2002-03-15 US US10/099,166 patent/US6807705B2/en not_active Expired - Lifetime
- 2002-03-19 TW TW091105217A patent/TW541225B/zh not_active IP Right Cessation
- 2002-03-28 JP JP2002579171A patent/JP4202764B2/ja not_active Expired - Fee Related
- 2002-03-28 GB GB0323505A patent/GB2389516B/en not_active Expired - Fee Related
- 2002-03-28 CA CA002441383A patent/CA2441383C/en not_active Expired - Fee Related
- 2002-03-28 AT AT0906602A patent/AT500571B1/de not_active IP Right Cessation
- 2002-03-28 ES ES200350062A patent/ES2251281B2/es not_active Expired - Fee Related
- 2002-03-28 WO PCT/US2002/009466 patent/WO2002081149A1/en active IP Right Grant
- 2002-03-28 BR BRPI0208567-4A patent/BR0208567B1/pt not_active IP Right Cessation
- 2002-03-28 RU RU2003129800/02A patent/RU2253560C1/ru not_active IP Right Cessation
- 2002-03-28 AU AU2002306908A patent/AU2002306908B2/en not_active Ceased
- 2002-03-28 NZ NZ528154A patent/NZ528154A/en not_active IP Right Cessation
- 2002-03-28 DE DE10296621T patent/DE10296621B4/de not_active Expired - Fee Related
- 2002-03-28 CN CNB028079213A patent/CN100563934C/zh not_active Expired - Fee Related
- 2002-03-28 MX MXPA03009088A patent/MXPA03009088A/es active IP Right Grant
- 2002-03-28 KR KR1020037012968A patent/KR100571689B1/ko not_active IP Right Cessation
- 2002-03-29 FR FR0204104A patent/FR2823145B1/fr not_active Expired - Fee Related
- 2002-04-04 BE BE2002/0241A patent/BE1014743A3/fr active
-
2003
- 2003-09-12 ZA ZA200307176A patent/ZA200307176B/en unknown
- 2003-10-02 SE SE0302605A patent/SE527121C2/sv not_active IP Right Cessation
-
2005
- 2005-02-24 HK HK05101545.3A patent/HK1070019A1/xx not_active IP Right Cessation
-
2008
- 2008-07-16 JP JP2008185114A patent/JP4955619B2/ja not_active Expired - Fee Related
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