JP4134261B1 - Gold alloy wire for ball bonding - Google Patents

Gold alloy wire for ball bonding Download PDF

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Publication number
JP4134261B1
JP4134261B1 JP2007276104A JP2007276104A JP4134261B1 JP 4134261 B1 JP4134261 B1 JP 4134261B1 JP 2007276104 A JP2007276104 A JP 2007276104A JP 2007276104 A JP2007276104 A JP 2007276104A JP 4134261 B1 JP4134261 B1 JP 4134261B1
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Japan
Prior art keywords
wire
mass
bonding
calcium
ball
Prior art date
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Application number
JP2007276104A
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Japanese (ja)
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JP2009105250A (en
Inventor
満生 高田
聡 手島
岳 桑原
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Tanaka Denshi Kogyo KK
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Tanaka Denshi Kogyo KK
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Priority to JP2007276104A priority Critical patent/JP4134261B1/en
Application filed by Tanaka Denshi Kogyo KK filed Critical Tanaka Denshi Kogyo KK
Priority to MYPI20084383A priority patent/MY155023A/en
Priority to CN2008800001948A priority patent/CN101601126B/en
Priority to PCT/JP2008/061424 priority patent/WO2009054164A1/en
Priority to EP08790566.7A priority patent/EP2204846A4/en
Priority to KR1020087025455A priority patent/KR101047827B1/en
Priority to US12/224,212 priority patent/US8147750B2/en
Application granted granted Critical
Publication of JP4134261B1 publication Critical patent/JP4134261B1/en
Priority to TW097134412A priority patent/TWI371812B/en
Publication of JP2009105250A publication Critical patent/JP2009105250A/en
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    • H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L24/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24—Selection of soldering or welding materials proper
    • B23K35/30—Selection of soldering or welding materials proper with the principal constituent melting at less than 1550 degrees C
    • B23K35/3013—Au as the principal constituent
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
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Abstract

【課題】 溶融ボール形成性やステッチ接合性やワイヤ強度に優れている金合金線でありながら、更に圧着ボール形状の真円性に優れた、半導体装置の高密度配線に対応可能な金合金線を提供する。
【解決手段】 マグネシウム（Ｍｇ）を１０〜５０質量ｐｐｍ、ユーロピウム（Ｅｕ）を５〜２０質量ｐｐｍ、カルシウム（Ｃａ）を２〜９質量ｐｐｍ、および残部が純度９９．９９５質量％以上の金（Ａｕ）からなる金合金であって、カルシウム（Ｃａ）はユーロピウム（Ｅｕ）の半分以下の質量であるボールボンディング用金合金線である。
【選択図】 図４PROBLEM TO BE SOLVED: To provide a gold alloy wire excellent in molten ball forming property, stitch joining property and wire strength, and further excellent in roundness of a press-bonded ball shape and capable of being used for high-density wiring of a semiconductor device. I will provide a.
SOLUTION: 10 to 50 mass ppm of magnesium (Mg), 5 to 20 mass ppm of europium (Eu), 2 to 9 mass ppm of calcium (Ca), and the balance having a purity of 99.995 mass% or more ( A gold alloy wire made of Au), and calcium (Ca) is a gold alloy wire for ball bonding having a mass less than half that of europium (Eu).
[Selection] Figure 4

Description

本発明はボールボンディング用金合金線に係り、ワイヤ伸び率４％時の引張り試験の破断荷重（以下、ワイヤ強度と記す）に優れ、溶融ボールを形成した際の溶融ボール表面に全面的な酸化物による汚れや引け巣が少なく、溶融して形成するボール形状の安定性（以下、溶融ボール形成性と記す）に優れ、溶融して形成したオールをボールボンドしたときの圧着ボール形状の真円性（以下、圧着ボール形状の真円性と記す）に優れ、ワイヤをキャピラリーによってフレームや基板などに押し付けて接合するステッチ接合性（以下、ステッチ接合性と記す）に優れた金合金線に関する。   The present invention relates to a gold alloy wire for ball bonding, which is excellent in a breaking load (hereinafter referred to as wire strength) in a tensile test when the wire elongation is 4%, and is entirely oxidized on the surface of the molten ball when a molten ball is formed. A ball that is melted and formed, has excellent stability in the shape of a ball that is formed by melting (hereinafter referred to as “melted ball formation”), and is a perfect circle of a pressure-bonded ball shape when a ball-bonded oar is formed. The present invention relates to a gold alloy wire excellent in stitch bonding (hereinafter referred to as “stitch bonding”), which has excellent properties (hereinafter referred to as “roundness of a press-bonded ball shape”) and is bonded by pressing a wire against a frame or a substrate with a capillary.

ＩＣチップの電極と外部配線を接続する場合、ワイヤを介して配線するワイヤボンディング方法が知られている。この中でもＩＣチップのアルミニウム電極とワイヤを接合する方式により、超音波併用熱圧着接合及び超音波接合が主流を占めている。
ここで超音波併用熱圧着接合は、通常、ボールボンドボンディング方法により行われている。ボールボンドボンディング方法による接合法を、特許文献１に示されている図面を図１に再掲して説明する。 When connecting an electrode of an IC chip and external wiring, a wire bonding method for wiring through a wire is known. Among them, the thermocompression bonding with ultrasonic waves and the ultrasonic bonding dominate by the method of bonding the aluminum electrode of the IC chip and the wire.
Here, the ultrasonic thermocompression bonding is usually performed by a ball bond bonding method. A bonding method using the ball bond bonding method will be described with reference to FIG.

図１（ａ）に示す様に、ワイヤ２をキャピラリー１に挿通し、その先端に電気トーチ３を対向させ、ワイヤ２との間で放電させることにより、ワイヤ２の先端を加熱、溶融してボール４を形成する。
次いで、図１（ｂ）に示すように、キャピラリー１を下降させて該ボール４をＩＣチップ６上のアルミニウム電極５の上に押圧接合する。この時、図示しないが、超音波振動がキャピラリー１を通して付加されると共に、ＩＣチップ６はヒーターブロックで加熱されるため、上記ボール４は熱圧着され、圧着ボール４’となる。 As shown in FIG. 1A, the tip of the wire 2 is heated and melted by inserting the wire 2 into the capillary 1, causing the electric torch 3 to face the tip and discharging between the wire 2. Ball 4 is formed.
Next, as shown in FIG. 1B, the capillary 1 is lowered to press-bond the ball 4 onto the aluminum electrode 5 on the IC chip 6. At this time, although not shown, since ultrasonic vibration is applied through the capillary 1 and the IC chip 6 is heated by the heater block, the ball 4 is thermocompression-bonded to form a pressure-bonded ball 4 ′.

次いで、図１（ｃ）に示すように、キャピラリー１は所定の軌跡を描いて、外部配線８の上に移動し、下降する。この時、図示しないが、超音波振動がキャピラリー１を通して付加され、外部配線８はヒーターブロックで加熱されるため、ワイヤ２側面が熱圧着される。この熱圧着による接合をステッチ接合と呼ぶ。
次いで、図１（ｄ）に示すように、クランパー７はワイヤ２をクランプしたまま上昇することにより、ワイヤ２が切断され、配線が完了する。 Next, as shown in FIG. 1C, the capillary 1 moves on the external wiring 8 along a predetermined locus and descends. At this time, although not shown, since ultrasonic vibration is applied through the capillary 1 and the external wiring 8 is heated by the heater block, the side surface of the wire 2 is thermocompression bonded. This joining by thermocompression bonding is called stitch joining.
Next, as shown in FIG. 1D, the clamper 7 is lifted while the wire 2 is clamped, whereby the wire 2 is cut and the wiring is completed.

一般的なボールボンディング用金合金線は、ワイヤ強度、溶融ボール形成性、圧着ボール形状の真円性、ステッチ接合性が実用に耐える必要がある。また、一般的なボールボンディング用金合金線の伸び率は２〜６％に設定されているが、ループ形成性を考慮すると、伸び率は３％以上が望ましく、特に４％が望ましいとされている。
ウェッジ接合用金合金線として、特許文献１では、高純度金にカルシウム（Ｃａ）を１〜１００質量ｐｐｍ添加した金合金線であって、該金合金線の金純度が９９．９質量％以上であり、引張強さが３３．０ｋｇ／ｍｍ2以上、伸び率が１〜３％であることを特徴とする金合金線が開発されていた。この金合金線は、高温の接合強度に優れ、ＩＣチップの高密度配線として好適で、ウェッジボンディングによっても良好に接合していた。 A general gold alloy wire for ball bonding is required to withstand practically the wire strength, molten ball formability, roundness of the press-bonded ball shape, and stitch bondability. In addition, the elongation rate of a general gold alloy wire for ball bonding is set to 2 to 6%, but considering the loop formability, the elongation rate is preferably 3% or more, particularly 4%. Yes.
As a gold alloy wire for wedge bonding, Patent Document 1 discloses a gold alloy wire obtained by adding 1 to 100 mass ppm of calcium (Ca) to high-purity gold, and the gold alloy wire has a gold purity of 99.9% by mass or more. A gold alloy wire characterized by a tensile strength of 33.0 kg / mm 2 or more and an elongation of 1 to 3% has been developed. This gold alloy wire has excellent high-temperature bonding strength, is suitable as a high-density wiring of an IC chip, and has been bonded well by wedge bonding.

しかし、この金合金線をボールボンディングワイヤとして利用しようとすると、圧着ボール形状の真円性が悪くなるため、安定したボールボンディング接合を行うことはできない。さらに、伸び率が低いのでループ形状が描きにくく、ループ形成性が悪くなる。そのため、用途がウェッジ接合に限定され、半導体装置として利用できる範囲が限定されていた。   However, when this gold alloy wire is used as a ball bonding wire, the roundness of the press-bonded ball shape is deteriorated, so that stable ball bonding cannot be performed. Further, since the elongation rate is low, it is difficult to draw a loop shape, and the loop forming property is deteriorated. Therefore, the application is limited to wedge bonding, and the range that can be used as a semiconductor device is limited.

他方、特許文献２では、その実施例１３に、マグネシウム（Ｍｇ）を２９重量ｐｐｍ、カルシウム（Ｃａ）を１０重量ｐｐｍ、ユーロピウム（Ｅｕ）を８重量ｐｐｍおよび残部が純度９９．９９９％の高純度金からなることを特徴とするボンディングワイヤが開示されている。このボンディングワイヤは、半導体組み立て時のワイヤの断線が起きにくく、半導体デバイスの組立収率が低下しないことを特徴とする。
しかし、このボンディングワイヤは、ワイヤ強度に優れているものの、後述する比較例２で明らかなとおり、圧着ボール形状の真円性が悪く、また、ステッチ接合性も満足のいくものとはいえないものであった。 On the other hand, in Patent Document 2, in Example 13, magnesium (Mg) is 29 ppm by weight, calcium (Ca) is 10 ppm by weight, europium (Eu) is 8 ppm by weight, and the balance is 99.999% purity. A bonding wire made of gold is disclosed. This bonding wire is characterized in that wire breakage during semiconductor assembly hardly occurs and the assembly yield of the semiconductor device does not decrease.
However, although this bonding wire is excellent in wire strength, as will be apparent from Comparative Example 2 to be described later, the roundness of the press-bonded ball shape is poor and the stitch bondability is not satisfactory. Met.

特許第３６５７０８７号公報Japanese Patent No. 3657087 特開平１０−４１１４号公報Japanese Patent Laid-Open No. 10-4114

本発明は、前述の従来事情に鑑み、これまでと同様に溶融ボール形成性やステッチ接合性やワイヤ強度に優れている金合金線でありながら、更に圧着ボール形状の真円性に優れた、半導体装置の高密度配線に対応可能な金合金線を提供することを目的とする。   In view of the above-mentioned conventional circumstances, the present invention is excellent in the roundness of the press-bonded ball shape, while being a gold alloy wire excellent in molten ball formability, stitch bondability and wire strength as before, An object of the present invention is to provide a gold alloy wire that can be used for high-density wiring of a semiconductor device.

本発明者は、ワイヤ強度に優れている金合金線について鋭意研究を重ねた結果、微量な添加元素であるカルシウム（Ｃａ）がユーロピウム（Ｅｕ）の半分以下の添加量であれば、所定範囲のＣａ−Ｍｇ−Ｅｕの微量な添加元素系からなる金合金またはＣａ−Ｍｇ−Ｅｕ−Ｓｎの微量な添加元素系からなる金合金がワイヤ強度および溶融ボール形成性および圧着ボール形状の真円性およびステッチ接合性に優れた効果を発揮することを新たに知見し、本発明を完成するに至った。   As a result of intensive studies on a gold alloy wire excellent in wire strength, the present inventor has obtained a predetermined range of calcium (Ca), which is a trace amount of additive element, if the added amount is less than half that of europium (Eu). A gold alloy composed of a small amount of additive element system of Ca-Mg-Eu or a gold alloy composed of a small amount of additive element system of Ca-Mg-Eu-Sn has the following advantages: The inventors have newly found that an effect excellent in stitch jointability is exhibited, and have completed the present invention.

具体的には、本発明によれば、マグネシウム（Ｍｇ）を１０〜５０質量ｐｐｍ、ユーロピウム（Ｅｕ）を５〜２０質量ｐｐｍ、カルシウム（Ｃａ）を２〜９質量ｐｐｍ、および残部が純度９９．９９８質量％以上の金（Ａｕ）からなる金合金であって、カルシウム（Ｃａ）はユーロピウム（Ｅｕ）の半分以下の添加量であることを特徴とするボールボンディング用金合金線が提供される。   Specifically, according to the present invention, magnesium (Mg) is 10 to 50 mass ppm, europium (Eu) is 5 to 20 mass ppm, calcium (Ca) is 2 to 9 mass ppm, and the balance is 99.000 ppm. There is provided a gold alloy wire for ball bonding, which is a gold alloy composed of 998% by mass or more of gold (Au), wherein calcium (Ca) is added in an amount less than half of europium (Eu).

また、本発明によれば、マグネシウム（Ｍｇ）を１０〜５０質量ｐｐｍ、スズ（Ｓｎ）を１〜３０質量ｐｐｍ、ユーロピウム（Ｅｕ）を５〜２０質量ｐｐｍ、カルシウム（Ｃａ）を２〜９質量ｐｐｍ、および残部が純度９９．９９８質量％以上の金（Ａｕ）からなる金合金であって、カルシウム（Ｃａ）はユーロピウム（Ｅｕ）の半分以下の添加量であることを特徴とするボールボンディング用金合金線が提供される。   Moreover, according to this invention, magnesium (Mg) is 10-50 mass ppm, tin (Sn) is 1-30 mass ppm, europium (Eu) is 5-20 mass ppm, and calcium (Ca) is 2-9 mass. It is a gold alloy composed of gold (Au) having a purity of 99.998% by mass or more with the balance being 99.998% by mass, and calcium (Ca) is added in an amount less than half of europium (Eu). A gold alloy wire is provided.

また、本発明によれば、マグネシウム（Ｍｇ）を１０〜５０質量ｐｐｍ、ユーロピウム（Ｅｕ）を５〜２０質量ｐｐｍ、カルシウム（Ｃａ）を２〜９質量ｐｐｍ、および残部が純度９９．９９８質量％以上の金（Ａｕ）からなる金合金であって、カルシウム（Ｃａ）はユーロピウム（Ｅｕ）の半分以下の添加量であり、かつ、微量な添加元素であるユーロピウム（Ｅｕ）とカルシウム（Ｃａ）合計の添加量が２５質量ｐｐｍ以下の添加量であることを特徴とする。   Further, according to the present invention, magnesium (Mg) is 10 to 50 mass ppm, europium (Eu) is 5 to 20 mass ppm, calcium (Ca) is 2 to 9 mass ppm, and the balance is 99.998 mass%. A gold alloy composed of the above gold (Au), calcium (Ca) is less than half the amount of europium (Eu), and a total of europium (Eu) and calcium (Ca), which are trace amounts of added elements It is characterized in that the addition amount of is an addition amount of 25 ppm by mass or less.

また、本発明によれば、マグネシウム（Ｍｇ）を１０〜５０質量ｐｐｍ、スズ（Ｓｎ）を１〜３０質量ｐｐｍ、ユーロピウム（Ｅｕ）を５〜２０質量ｐｐｍ、カルシウム（Ｃａ）を２〜９質量ｐｐｍ、および残部が純度９９．９９８質量％以上の金（Ａｕ）からなる金合金であって、カルシウム（Ｃａ）はユーロピウム（Ｅｕ）の半分以下の添加量であり、かつ、微量な添加元素であるユーロピウム（Ｅｕ）とカルシウム（Ｃａ）合計の添加量が２５質量ｐｐｍ以下の添加量であることを特徴とする。
好ましい態様においては、微量な添加元素であるマグネシウム（Ｍｇ）は、１５〜４０質量ｐｐｍ添加する。 Moreover, according to this invention, magnesium (Mg) is 10-50 mass ppm, tin (Sn) is 1-30 mass ppm, europium (Eu) is 5-20 mass ppm, and calcium (Ca) is 2-9 mass. It is a gold alloy made of gold (Au) with a purity of 99.998% by mass or more with the balance being 99.998% by mass, and calcium (Ca) is an addition amount less than half that of europium (Eu), and a trace amount of additive elements The total addition amount of certain europium (Eu) and calcium (Ca) is an addition amount of 25 ppm by mass or less.
In a preferred embodiment, 15 to 40 mass ppm of magnesium (Mg), which is a trace amount of additive element, is added.

本発明によるボールボンディング用金合金線によれば、所定範囲のＣａ−Ｍｇ−Ｅｕの微量な添加元素系からなる金合金またはＣａ−Ｍｇ−Ｅｕ−Ｓｎの微量な添加元素系からなる金合金が、ワイヤ強度およびステッチ接合性および圧着ボール形状の真円性および溶融ボール形成性に優れた効果を発揮することができ、半導体装置の生産性向上に効果的である。特に、ステッチ接合部における部材の固定が難しいためにステッチ接合が困難と言われるＱＦＰ，ＱＦＮパッケージの実装などにおいて、安定して接合することが可能なことから、半導体装置作製の生産性向上に効果的である。   According to the gold alloy wire for ball bonding according to the present invention, a gold alloy composed of a small amount of additive element system of Ca—Mg—Eu within a predetermined range or a gold alloy composed of a small amount of additive element system of Ca—Mg—Eu—Sn In addition, it is possible to exhibit excellent effects in wire strength, stitch bondability, roundness of the press-bonded ball shape, and melt ball formation, and it is effective in improving the productivity of the semiconductor device. In particular, since it is difficult to fix the members at the stitch joint, it is possible to stably join the QFP and QFN packages, which are said to be difficult to join the stitches. Is.

本発明においては、微量な添加元素の種類が少なく、成分範囲が狭く、限定的である。また、本発明の微量な添加元素の配合比のバランスが崩れると、ワイヤ強度またはステッチ接合性または圧着ボール形状の真円性または溶融ボール形成性に悪影響する恐れがあるので、金（Ａｕ）の純度はできるだけ高純度のものが望ましい。また、本発明の合金系において、金以外の微量な添加元素および不純物元素の合計が１００質量ｐｐｍ未満であれば、９９．９９質量％以上の高純度金ボンディングワイヤとして表示できるので、商業上有利である。   In the present invention, there are few kinds of a trace amount of additive elements, the component range is narrow, and it is limited. Further, if the balance of the mixing ratio of the trace amount of additive elements of the present invention is lost, there is a risk of adversely affecting the wire strength, stitch bondability, roundness of the press-bonded ball shape, or melt ball formation. The purity is preferably as high as possible. Further, in the alloy system of the present invention, if the total amount of the trace amount of additive elements and impurity elements other than gold is less than 100 mass ppm, it can be displayed as a high-purity gold bonding wire of 99.99 mass% or more, which is commercially advantageous. It is.

（ステッチ接合性とワイヤ強度）
ボンディングワイヤのステッチ接合は固相接合に分類される。固相接合に良い影響を及ぼす現象として、密着部形成の為の変形がし易く、密着部における結合力が高いことが知られている。
密着部形成の為の変形がし易いとは、弾性変形、塑性変形、クリープ変形、拡散による変形などがし易いことを意味している。この現象はステッチ接合においても同様であり、ボンディングワイヤの場合は、ワイヤ強度が低いほど密着部形成の為の変形がし易いと考えられるため、ワイヤ強度とステッチ接合性には負相関の関係がある。 (Stitch bondability and wire strength)
Bond bonding stitch bonding is classified as solid phase bonding. As a phenomenon that has a good effect on solid-phase bonding, it is known that deformation for forming a close contact portion is easy to perform, and that the bonding strength at the close contact portion is high.
The phrase “easy to deform for forming the contact portion” means that it is easy to undergo elastic deformation, plastic deformation, creep deformation, deformation due to diffusion, and the like. This phenomenon is also true for stitch bonding. In the case of bonding wires, the lower the wire strength, the easier it is to deform for the formation of a close contact portion. Therefore, there is a negative correlation between wire strength and stitch bonding. is there.

一方、密着部における結合力は、化学結合力、凝着、表面粗さ、表面状態などさまざまな現象に起因する。しかし、一般的なボールボンディング用金合金線は、元々他の金属ボンディングワイヤよりも結合力が高い。これは組成の純度９９質量％から純度９９．９９質量％以上が大気中でほとんど酸化しない金で構成されているからである。したがって、ボンディングワイヤ表面に存在する添加元素や添加元素の酸化物による悪影響が少ないほど、より高い密着部の接合力が得られると考えられる。   On the other hand, the bond strength at the close contact portion is caused by various phenomena such as chemical bond strength, adhesion, surface roughness, and surface condition. However, a general gold alloy wire for ball bonding originally has a higher bonding strength than other metal bonding wires. This is because the composition has a purity of 99% by mass to a purity of 99.99% by mass or more and is composed of gold that hardly oxidizes in the atmosphere. Therefore, it can be considered that the lower the adverse effect of the additive element existing on the surface of the bonding wire and the oxide of the additive element, the higher the bonding strength of the adhesion portion.

純度９９．９９９質量％以上の高純度金を用いて、添加元素を全く添加せずにボールボンディング金線を作製すると、ワイヤが柔らかいため、密着部形成の為の変形がし易い点と、ワイヤ表面に存在する添加元素や添加元素の酸化物による悪影響がないことから、最もステッチ接合性に優れたボンディングワイヤであると考えられる。ところが、ボンディングワイヤには複数の機能を同時に求められ、例えば、一定以上のワイヤ強度がないと樹脂モールド時のワイヤ流れや、ループ形成性が劣るなど実用上問題が発生する。その結果、ワイヤ強度を向上させるために、微量な添加元素を用いる必要がある。本発明が用いた微量なすべての添加元素は、密着部における結合力への影響に関して純金と比較してもステッチ接合性を阻害しにくい元素である。   When a high-purity gold having a purity of 99.999 mass% or more is used and a ball bonding gold wire is produced without adding any additional elements, the wire is soft, so that the wire is easily deformed to form an adhesive portion, and the wire Since there is no adverse effect due to the additive elements existing on the surface and oxides of the additive elements, it is considered that the bonding wire has the most excellent stitch bondability. However, the bonding wire is required to have a plurality of functions at the same time. For example, if the wire strength does not exceed a certain level, problems such as wire flow during resin molding and inferior loop formability occur. As a result, it is necessary to use a trace amount of additive elements in order to improve the wire strength. All of the trace amounts of additive elements used in the present invention are elements that hardly inhibit the stitch bondability even when compared with pure gold with respect to the influence on the bonding strength in the adhesion portion.

また、本発明の微量な添加元素を所定の配合比で使用することで、ワイヤ強度向上にも効果がある。なお、ワイヤ表面に存在する添加元素の酸化物は、最終伸線加工後に施される融点の３割〜６割程度の温度で行われるアニール処理によるものと考えられる。不活性雰囲気でアニール処理することや、アニール処理後にワイヤ表面を化学的に洗浄することでワイヤ表面の酸化物は減少可能と考えられるが、コスト面で製造上問題があり、本発明の方法の方が実用的である。   In addition, the use of a small amount of additive element of the present invention at a predetermined blending ratio is effective in improving wire strength. The oxide of the additive element present on the wire surface is considered to be due to an annealing process performed at a temperature of about 30% to 60% of the melting point applied after the final wire drawing. It is considered that the oxide on the wire surface can be reduced by annealing in an inert atmosphere or by chemically cleaning the wire surface after annealing, but there is a manufacturing problem in terms of cost. Is more practical.

（溶融ボール形成性）
溶融ボールとは、大気中でスパークを飛ばしてボンディングワイヤの先端を溶かして得られたボールのことである。いくつかの添加元素について、添加量が多くなるとボール全面や、ボールとワイヤとの境界（ネックという）部分に添加元素の酸化物が確認される。また、場合によっては、ボール底辺に引け巣が発生することもある。ボンディングワイヤの性能上、溶融ボール形成性は重要であり、酸化物や引け巣は極力少なくすることが求められている。本発明の微量な添加元素を所定の配合比で使用することで実用性に耐え満足する溶融ボール形成性が得られる。 (Molten ball formation)
The molten ball is a ball obtained by blowing a spark in the atmosphere to melt the tip of the bonding wire. As for some additive elements, when the additive amount increases, oxides of the additive elements are confirmed on the entire surface of the ball or on the boundary (called neck) between the ball and the wire. In some cases, a shrinkage nest may be generated at the bottom of the ball. Molten ball formation is important for the performance of bonding wires, and it is required to reduce oxides and shrinkage as much as possible. By using a small amount of the additive element of the present invention at a predetermined blending ratio, it is possible to obtain a molten ball forming property that can withstand and satisfy practicality.

（圧着ボール形状の真円性）
半導体装置の高密度実装化によりＩＣチップ上のアルミニウム電極の間隔および面積が狭小化してきている。間隔および面積が狭小化したアルミニウム電極上にボンディングする際には、隣接する圧着ボール同士の接触を防止するために、圧着ボール形状の真円性向上が必要不可欠となる。圧着ボール形状の真円性に対しては添加元素の配合比の影響が大きく、配合比のバランスが崩れることにより溶融ボールを圧着させた際の変形が不均一となり圧着ボール形状の真円性が保てなくなる。さらに圧着ボール形状の真円性は、ステッチ接合性と同様に、ワイヤ強度と負相関の傾向にある。本発明の微量な添加元素を所定の配合比で使用することで実用性に耐えうる圧着ボール形状の真円性とワイヤ強度の両立が達成される。 (Circularity of crimped ball shape)
With the high density mounting of semiconductor devices, the distance and area of aluminum electrodes on an IC chip have been reduced. When bonding on an aluminum electrode whose space and area are narrowed, it is essential to improve the roundness of the pressure-bonded ball shape in order to prevent contact between adjacent pressure-bonded balls. The effect of the compounding ratio of the additive elements on the roundness of the press-bonded ball shape is large, and the balance when the melted ball is pressed due to the loss of the balance of the compounding ratio makes the roundness of the press-bonded ball shape non-uniform. I can't keep it. Furthermore, the roundness of the press-bonded ball shape tends to have a negative correlation with the wire strength, similar to the stitch bondability. By using the trace amount of the additive element of the present invention at a predetermined blending ratio, both the roundness of the press-bonded ball shape that can withstand practicality and the wire strength can be achieved.

〔Ｍｇ〕
本発明の合金系において、マグネシウム（Ｍｇ）は圧着ボール形状の真円性に最も効果的な元素である。
本発明の合金系において、マグネシウム（Ｍｇ）はワイヤ強度にはあまり効果をもたらさない添加元素である。
本発明の合金系において、マグネシウム（Ｍｇ）は１０質量ｐｐｍ以上必要である。これ未満では圧着ボール形状の真円性に効果がないからである。本発明の合金系において、圧着ボール形状の真円性を安定させるには、マグネシウム（Ｍｇ）は１５質量ｐｐｍ以上が好ましい。他方、本発明の合金系において、マグネシウム（Ｍｇ）が５０質量ｐｐｍを超えて多くなりすぎても、溶融ボール形成性に悪影響を及ぼす。本発明の合金系において、良好な溶融ボール形成性を得るには、マグネシウム（Ｍｇ）は４０質量ｐｐｍ以下が好ましい。 [Mg]
In the alloy system of the present invention, magnesium (Mg) is the most effective element for the roundness of the press-bonded ball shape.
In the alloy system of the present invention, magnesium (Mg) is an additive element that has little effect on wire strength.
In the alloy system of the present invention, magnesium (Mg) needs to be 10 mass ppm or more. This is because if it is less than this, the roundness of the press-bonded ball shape is not effective. In the alloy system of the present invention, magnesium (Mg) is preferably 15 ppm by mass or more in order to stabilize the roundness of the press-bonded ball shape. On the other hand, in the alloy system of the present invention, even if magnesium (Mg) exceeds 50 mass ppm and becomes too much, it adversely affects molten ball formation. In the alloy system of the present invention, magnesium (Mg) is preferably 40 ppm by mass or less in order to obtain good molten ball formation.

〔Ｅｕ〕
本発明の合金系において、ユーロピウム（Ｅｕ）はボンディングワイヤのワイヤ強度に効果的な元素であるが、後述のカルシウム（Ｃａ）ほどの効果はない。
また、本発明の合金系において、ユーロピウム（Ｅｕ）は圧着ボール形状の真円性に効果的な元素であるが、マグネシウム（Ｍｇ）ほどの効果はない。
本発明の合金系において、ユーロピウム（Ｅｕ）は５質量ｐｐｍ以上必要である。これ未満ではワイヤ強度に効果がないからである。他方、本発明の合金系において、ユーロピウム（Ｅｕ）が２０質量ｐｐｍを超えると、溶融ボール形成性に悪影響を及ぼす。 [Eu]
In the alloy system of the present invention, europium (Eu) is an element effective for the wire strength of the bonding wire, but is not as effective as calcium (Ca) described later.
In the alloy system of the present invention, europium (Eu) is an element effective for the roundness of the press-bonded ball shape, but is not as effective as magnesium (Mg).
In the alloy system of the present invention, europium (Eu) needs to be 5 ppm by mass or more. This is because the wire strength is not effective below this range. On the other hand, when europium (Eu) exceeds 20 ppm by mass in the alloy system of the present invention, it adversely affects molten ball formation.

〔Ｃａ〕
本発明の合金系において、カルシウム（Ｃａ）はボンディングワイヤのワイヤ強度に最も効果的な元素である。しかしながら、カルシウム（Ｃａ）は、圧着ボール形状の真円性に悪影響を及ぼす元素でもある。そのため本発明の合金系において、カルシウム（Ｃａ）が有効な組成範囲は２〜９質量ｐｐｍと非常に狭い範囲に限定される。この範囲内でしかカルシウム（Ｃａ）は本発明の合金系において効果を発揮しない。
本発明の合金系において、カルシウム（Ｃａ）が２質量ｐｐｍ未満ではワイヤ強度に効果がなく、９質量ｐｐｍを超えると圧着ボール形状の真円性に悪影響を及ぼすからである。 [Ca]
In the alloy system of the present invention, calcium (Ca) is the most effective element for the wire strength of the bonding wire. However, calcium (Ca) is also an element that adversely affects the roundness of the press-bonded ball shape. Therefore, in the alloy system of the present invention, the effective composition range of calcium (Ca) is limited to a very narrow range of 2 to 9 ppm by mass. Only within this range, calcium (Ca) exhibits an effect in the alloy system of the present invention.
In the alloy system of the present invention, if calcium (Ca) is less than 2 mass ppm, the wire strength is not effective, and if it exceeds 9 mass ppm, the roundness of the press-bonded ball shape is adversely affected.

〔Ｅｕ＋Ｃａ〕
本発明の合金系において、ユーロピウム（Ｅｕ）はカルシウム（Ｃａ）と相互作用をしていると考えられる。すなわち、ユーロピウム（Ｅｕ）とカルシウム（Ｃａ）はいずれもワイヤ強度に効果的な添加元素であるが、これらの微量な添加元素を共に添加することによって更にワイヤ強度を向上させる効果がある。ただし、合計の添加量は２５質量ｐｐｍ以下にすることが望ましい。２５質量ｐｐｍを超えると、ステッチ接合性および圧着ボール形状の真円性に悪影響を及ぼすからである。
また、カルシウム（Ｃａ）はユーロピウム（Ｅｕ）の半分以下の添加量であることが必要である。カルシウム（Ｃａ）はワイヤ強度に最も効果的な元素であるが、圧着ボール形状の真円性に悪影響を及ぼすからである。 [Eu + Ca]
In the alloy system of the present invention, europium (Eu) is considered to interact with calcium (Ca). That is, europium (Eu) and calcium (Ca) are both additive elements effective for wire strength, but there is an effect of further improving the wire strength by adding these trace amounts of additive elements together. However, the total addition amount is preferably 25 ppm by mass or less. This is because if it exceeds 25 ppm by mass, the stitch bondability and the roundness of the press-bonded ball shape are adversely affected.
Calcium (Ca) needs to be added in an amount less than half that of europium (Eu). This is because calcium (Ca) is the most effective element for wire strength but adversely affects the roundness of the press-bonded ball shape.

〔Ｓｎ〕
本発明の合金系において、スズ（Ｓｎ）は圧着ボール形状の真円性を良くする元素であるが、マグネシウム（Ｍｇ）ほどの効果はない。
本発明の合金系において、スズ（Ｓｎ）はボンディングワイヤのワイヤ強度にはあまり効果をもたらさない元素である。
本発明の合金系において、スズ（Ｓｎ）が効果を発揮するためにはマグネシウム（Ｍｇ）の存在を必要とする。
本発明の合金系において、スズ（Ｓｎ）が効果を発揮するには、スズ（Ｓｎ）が１質量ｐｐｍ以上必要である。これ未満ではマグネシウム（Ｍｇ）の圧着ボール形状の真円性の改善効果に打ち消されてしまい、スズ（Ｓｎ）の添加効果が現れないからである。本発明の合金系において、スズ（Ｓｎ）が３０質量ｐｐｍを超えて多くなりすぎると、溶融ボール形成性に悪影響を及ぼす。 [Sn]
In the alloy system of the present invention, tin (Sn) is an element that improves the roundness of the press-bonded ball shape, but is not as effective as magnesium (Mg).
In the alloy system of the present invention, tin (Sn) is an element that has little effect on the wire strength of the bonding wire.
In the alloy system of the present invention, the presence of magnesium (Mg) is required for tin (Sn) to exert its effect.
In the alloy system of the present invention, tin (Sn) needs to be 1 mass ppm or more in order for tin (Sn) to exert its effect. If it is less than this, the effect of improving the roundness of the press-bonded ball shape of magnesium (Mg) is canceled, and the effect of adding tin (Sn) does not appear. In the alloy system of the present invention, if the amount of tin (Sn) exceeds 30 ppm by mass, the molten ball formation is adversely affected.

（１）ワイヤ強度
伸び率を４％に調製したときの本発明の金合金のワイヤ強度に関して、従来と同様の測定方法を用いて評価した。なお、伸び率は、室温で標点距離を１００ｍｍとして、引張試験機により金合金線を引張速度１０ｍｍ／分で引っ張り、破断した時の伸び量を次式に代入して、求めた。 (1) Wire strength The wire strength of the gold alloy of the present invention when the elongation was adjusted to 4% was evaluated using the same measurement method as before. The elongation rate was determined by substituting the elongation amount when the gold alloy wire was pulled at a tensile speed of 10 mm / min with a tensile tester at a room temperature and the fracture distance was 100 mm at room temperature, and was broken into the following equation.

Figure 0004134261
Figure 0004134261

判定は、φ２５μｍのワイヤを最終熱処理により伸び率を４．０％に調製し、測定数５本の平均値を測定値とし、値が高い試料を良好とした。
具体的には、ワイヤ強度１１．５ｇ（１１２．７ｍＮ）以上あるものを◎印で、ワイヤ強度１１．５ｇ（１１２．７ｍＮ）未満〜１０．０ｇ（９８ｍＮ）以上のものを○印で、ワイヤ強度１０．０ｇ（９８ｍＮ）未満〜８．５ｇ（８３．３ｍＮ）以上のものを△印で、ワイヤ強度８．５ｇ（８３．３ｍＮ）未満のものを×印で表した。 The determination was made by adjusting the elongation rate of a wire having a diameter of 25 μm to 4.0% by final heat treatment, and taking the average value of 5 measurement values as a measured value, and making a sample having a high value good.
Specifically, a wire strength of 11.5 g (112.7 mN) or more is marked with ◎, and a wire strength of less than 11.5 g (112.7 mN) to 10.0 g (98 mN) or more is marked with a circle. Those having a strength of less than 10.0 g (98 mN) to 8.5 g (83.3 mN) or more were represented by Δ, and those having a wire strength of less than 8.5 g (83.3 mN) were represented by x.

（２）溶融ボール形成性
溶融ボール形成性は、一般的な走査電子顕微鏡観察、光学顕微鏡観察により容易に確認することが可能である。
本発明では、判定は、測定数を１０個とし、走査電子顕微鏡観察により全面的な酸化物による汚れや引け巣が６個以上確認された試料を×、５個〜２個確認された試料を△、１個以下の試料を○と判定した。 (2) Molten ball formation property Molten ball formation property can be easily confirmed by general scanning electron microscope observation and optical microscope observation.
In the present invention, the determination is made with 10 samples, and samples with 6 or more oxide-contaminated or shrinkage cavities confirmed by scanning electron microscope observation x 5 to 2 samples confirmed Δ: One or less samples were judged as ◯.

（３）ステッチ接合性
ステッチ接合とは、ボンディングワイヤにキャピラリーを介して荷重・超音波などを加えながら押し付けて変形させ、Ａｇ、Ａｕ、Ｐｄなどによりめっき処理されたフレームまたは基板上に接合させることをいう。ステッチ接合性に関して、本発明の金合金は、従来の金合金と同様に、ステッチ接合性を高く維持させることができる。 (3) Stitch bonding Stitch bonding is a process of pressing and deforming a bonding wire through a capillary while applying a load or ultrasonic wave, and bonding it onto a frame or substrate plated with Ag, Au, Pd, or the like. Say. With respect to stitch bondability, the gold alloy of the present invention can maintain high stitch bondability as in the case of conventional gold alloys.

本発明の測定方法は、銀（Ａｇ）めっきされた４２アロイからなるリードフレームを用いて、図３に示すように、測定位置を圧着ボールの中心部を０％、リード端子接合部を１００％とした場合、９０％のリード端子接合部付近で行なった。
測定方法は、ボンディング直後の試料を用い、ＩＣチップ側とリード端子を治具で固定し、ワイヤを上方に引っ張り剥離強度を測定した。判定は、測定数３０個の平均値を測定値とし、値が高い試料を良いとした。
具体的には、剥離強度７．０ｇ（６８．６ｍＮ）以上のものを◎印で、剥離強度７．０ｇ（６８．６ｍＮ）未満〜５．０ｇ（４９．０ｍＮ）以上のものを○印で、剥離強度５．０ｇ（４９．０ｍＮ）未満〜３．０ｇ（２９．４ｍＮ）のもの以上を△印で、剥離強度３．０ｇ（２９．４ｍＮ）未満を×印で表した。 The measurement method of the present invention uses a lead alloy composed of 42 alloy plated with silver (Ag), and as shown in FIG. 3, the measurement position is 0% at the center of the press-bonded ball and 100% at the lead terminal joint. In this case, it was performed in the vicinity of the lead terminal joint portion of 90%.
As a measuring method, a sample immediately after bonding was used, the IC chip side and the lead terminal were fixed with a jig, the wire was pulled upward, and the peel strength was measured. In the determination, an average value of 30 measurements was taken as a measurement value, and a sample having a high value was considered good.
Specifically, those with a peel strength of 7.0 g (68.6 mN) or more are marked with ◎, and those with a peel strength of less than 7.0 g (68.6 mN) to 5.0 g (49.0 mN) or more are marked with ○. The peel strength of less than 5.0 g (49.0 mN) to 3.0 g (29.4 mN) or more was represented by Δ, and the peel strength of less than 3.0 g (29.4 mN) was represented by x.

（４）圧着ボール形状の真円性
圧着ボール形状の真円性の評価は、シリコンチップ上のアルミニウム電極（アルミニウム厚：約７×１０-8ｍ）に圧着ボール径がおおよそ６３μｍとなる条件でボールボンディングをし、その後、銀（Ａｇ）めっきされた４２アロイからなるリードとの間でステッチ接合をし、ボールボンディング法にて結線した。その際、スパンは３×１０-3ｍで、本数を２００本とし、結線したワイヤのうちから任意で５０個の圧着ボールを用いて圧着ボール形状の真円性を評価した。超音波の印加方向と平行方向の圧着径および垂直方向の圧着径を測定し、合計５０個の圧着ボールの標準偏差が低い試料を良好とした。
具体的には、標準偏差０．７μｍ未満を◎印で、標準偏差０．７μｍ以上〜１．０μｍ未満を○印で、標準偏差１．０μｍ以上〜１．５μｍ未満を△印で、標準偏差１．５μｍ以上を×印で表した。 (4) Roundness of the press-bonded ball shape The roundness of the press-bonded ball shape was evaluated under the condition that the press-bonded ball diameter was approximately 63 μm on the aluminum electrode (aluminum thickness: about 7 × 10 −8 m) on the silicon chip. Ball bonding was performed, and then stitch bonding was performed with a lead made of 42 alloy plated with silver (Ag), and was connected by a ball bonding method. At that time, the span was 3 × 10 −3 m, the number was 200, and the roundness of the pressure-bonded ball shape was evaluated using arbitrarily 50 pressure-bonded balls from the connected wires. The crimp diameter in the direction parallel to the application direction of ultrasonic waves and the crimp diameter in the vertical direction were measured, and a sample with a low standard deviation of a total of 50 crimp balls was determined as good.
Specifically, a standard deviation of less than 0.7 μm is marked with ◎, a standard deviation of 0.7 μm or more to less than 1.0 μm is marked with ◯, and a standard deviation of 1.0 μm or more to less than 1.5 μm is marked with △. 1.5 μm or more is indicated by a cross.

（５）金合金線の製造方法
本発明に係る金合金線の好ましい製造方法を説明する。
高純度金に所定量の元素を添加し真空溶解炉で溶解し鋳造する。鋳造したインゴットに溝ロール圧延機を用いた圧延加工および伸線機を用いた冷間加工と中間アニールを施し、最終伸線加工により直径２５μｍの細線とした後、最終アニールをして伸び率を４％に調製するものである。 (5) Manufacturing method of gold alloy wire The preferable manufacturing method of the gold alloy wire which concerns on this invention is demonstrated.
A predetermined amount of element is added to high-purity gold and melted and cast in a vacuum melting furnace. The cast ingot is subjected to a rolling process using a grooved roll mill and a cold process using a wire drawing machine and an intermediate annealing. After the final drawing process is performed to form a thin wire having a diameter of 25 μm, the final annealing is performed to increase the elongation rate. Prepare to 4%.

本発明に係る合金組成の場合、最終アニールの温度が上昇するにつれて伸び率は４％を維持したまま、引張り強さが徐々に低下する温度領域がある。また同一組成であっても最終の伸線加工率の大きさによって引張り強さは変わってくる。このため最終の伸線加工率と最終アニール温度を制御して伸び率と引張り強さを調整する。このようにして伸び率の４％を維持した。   In the case of the alloy composition according to the present invention, there is a temperature range in which the tensile strength gradually decreases while the elongation rate is maintained at 4% as the final annealing temperature increases. Even with the same composition, the tensile strength varies depending on the final drawing rate. Therefore, the elongation rate and the tensile strength are adjusted by controlling the final drawing rate and the final annealing temperature. In this way, 4% of the elongation was maintained.

［作用］
純度９９．９９９質量％以上の金線は、ワイヤ強度が低く、ワイヤ強度の経時低下もみられる。そのため、ボンディングワイヤとして用いられる金合金線は、それぞれ任意の添加元素を所定量添加し、純度９９．９９９質量％以上の金線よりもワイヤ強度が高められている。市販されている大多数のボンディングワイヤは、ベリリウム（Ｂｅ）、カルシウム（Ｃａ）、いくつかの希土類元素などが添加されているが、これらの添加元素にはワイヤ強度向上効果がある。 [Action]
A gold wire having a purity of 99.999% by mass or more has low wire strength, and a decrease in wire strength with time is also observed. Therefore, the gold alloy wire used as the bonding wire is added with a predetermined amount of an arbitrary additive element, and the wire strength is higher than that of a gold wire having a purity of 99.999% by mass or more. Most bonding wires on the market contain beryllium (Be), calcium (Ca), some rare earth elements, and the like, and these additive elements have an effect of improving wire strength.

一方、ボンディングワイヤに要求されるステッチ接合性は、ワイヤ強度が高くなると、前記した密着部形成の為の変形がしづらくなり、また、ワイヤ強度を高くするために添加した、添加元素が増えることで密着部における結合力が低くなり、ステッチ接合性が悪化する。本発明では、添加元素の種類によって、ワイヤ強度を向上させながら、密着部における結合力に悪影響が少なく、ステッチ接合性を悪化させづらい添加元素をいくつか特定し、カルシウム（Ｃａ）とユーロピウム（Ｅｕ）が最適な添加元素であることを見出した。   On the other hand, the stitch bondability required for the bonding wire is that when the wire strength is increased, the deformation for forming the above-mentioned adhesion portion is difficult, and the added elements added to increase the wire strength are increased. As a result, the bonding strength at the close contact portion is lowered, and the stitch bondability is deteriorated. According to the present invention, depending on the type of the additive element, while improving the wire strength, some of the additive elements that have little adverse effect on the bonding strength at the adhesion portion and hardly deteriorate the stitch bondability are identified, and calcium (Ca) and europium (Eu) are identified. ) Was found to be the optimum additive element.

ところが、一般的なボンディングワイヤには、ワイヤ強度、ステッチ接合性に加えて圧着ボール形状の真円性も要求される。しかし、一般的にはワイヤ強度が高くなると、圧着ボール形状の真円性が確保されにくいことが判明しており、本発明の合金系ではワイヤ強度に影響が少ないマグネシウム（Ｍｇ）を用いることで圧着ボール形状の真円性を確保している。ところが、ワイヤ強度およびステッチ接合性に優れているカルシウム（Ｃａ）について、マグネシウム（Ｍｇ）を用いた合金系であっても、添加量やワイヤ強度を向上させる他の添加元素との相互作用を考慮せずに使用した場合は、圧着ボール形状の真円性を良くすることができないことを突き止めた。   However, a general bonding wire is required to have a roundness of a press-bonded ball shape in addition to wire strength and stitch bondability. However, in general, it has been found that as the wire strength increases, it is difficult to ensure the roundness of the press-bonded ball shape, and in the alloy system of the present invention, by using magnesium (Mg), which has little influence on the wire strength, The roundness of the press-bonded ball shape is secured. However, regarding calcium (Ca), which is excellent in wire strength and stitch bondability, even if it is an alloy system using magnesium (Mg), the amount of addition and interaction with other additive elements that improve wire strength are considered. It was found that the roundness of the press-bonded ball shape could not be improved when it was used without it.

そこで、本発明の合金系におけるカルシウム（Ｃａ）は、添加量やワイヤ強度を向上させる他の添加元素との相互作用を考慮しながら配合した結果、カルシウム（Ｃａ）とユーロピウム（Ｅｕ）との配合比に着目し、圧着ボール形状の真円性を向させる効果を維持し、ステッチ接合性とワイヤ強度を同時に良くすることに成功した。
具体的には、本発明の合金系において、カルシウム（Ｃａ）はユーロピウム（Ｅｕ）よりもボンディングワイヤのワイヤ強度に効き目が強い。そこで、ボンディングワイヤのワイヤ強度に及ぼすカルシウム（Ｃａ）の影響を従とし、ユーロピウム（Ｅｕ）の影響を主とするため、カルシウム（Ｃａ）はユーロピウム（Ｅｕ）の半分以下の添加量であるとした。 Therefore, calcium (Ca) in the alloy system of the present invention is blended in consideration of the interaction with other additive elements that improve the addition amount and wire strength, and as a result, blend of calcium (Ca) and europium (Eu). Focusing on the ratio, the effect of improving the roundness of the press-bonded ball shape was maintained, and the stitch bondability and wire strength were improved at the same time.
Specifically, in the alloy system of the present invention, calcium (Ca) is more effective in bonding wire strength than europium (Eu). Therefore, since the influence of calcium (Ca) on the wire strength of the bonding wire is subordinate and mainly the influence of europium (Eu), the amount of calcium (Ca) added is less than half that of europium (Eu). .

以下に、実施例及び比較例について、表１を参照しながら説明する。
純度９９．９９９質量％の高純度金に所定量の添加元素を微量に添加し、真空溶解炉で溶解した後鋳造して表１左欄に示す組成の金合金インゴットを得た。該当インゴットに溝ロール圧延機を用いた圧延加工および伸線機を用いた冷間加工と中間アニールを施し、最終伸線加工により直径２５μｍの細線とした後、最終アニールをして伸び率４％になるように調製した。 Hereinafter, Examples and Comparative Examples will be described with reference to Table 1.
A predetermined amount of an additional element was added to high-purity gold having a purity of 99.999 mass%, melted in a vacuum melting furnace, and cast to obtain a gold alloy ingot having the composition shown in the left column of Table 1. The ingot is subjected to rolling using a grooved roll mill and cold working using a wire drawing machine and intermediate annealing. After the final wire drawing is performed to form a fine wire having a diameter of 25 μm, the final annealing is performed and the elongation is 4%. It prepared so that it might become.

この金合金線は、ボールボンディング装置（株式会社新川製 ＵＴＣ１０００型）を用いて、ＩＣチップのアルミニウム電極上にボールを圧着して接合し、銀めっきされたリード端子にステッチ接合を行った。ボールの圧着の一例を図４に、ステッチ接合の例を図５に、写真で示す。
このときＩＣチップ側の接合条件は、荷重を３０ｇ、接合時間を１２ミリ秒、超音波出力を３００ｍＷとした。一方、リード端子側の接合条件は、荷重を４０ｇ、接合時間を１０ミリ秒、超音波出力を４００ｍＷとした。共通の接合条件である接合温度は２００℃で行い、キャピラリーはエスピーティ株式会社製のＳＢＮＳ―３３ＣＤ―ＡＺＭ―１／１６―ＸＬを用いた。
次に、ボンディング直後の試料を用いて、圧着ボール形状の真円性はアルミニウム電極上から測定し、ステッチ接合性はリード端子付近のワイヤ剥離強度から測定した。それぞれの測定結果を表１右欄に示す。 This gold alloy wire was bonded by bonding a ball onto an aluminum electrode of an IC chip using a ball bonding apparatus (UTC1000 type manufactured by Shinkawa Co., Ltd.) and stitched to a silver-plated lead terminal. An example of the pressure bonding of the balls is shown in FIG. 4, and an example of stitch joining is shown in FIG.
At this time, the bonding conditions on the IC chip side were a load of 30 g, a bonding time of 12 milliseconds, and an ultrasonic output of 300 mW. On the other hand, the bonding conditions on the lead terminal side were a load of 40 g, a bonding time of 10 milliseconds, and an ultrasonic output of 400 mW. The common bonding condition was a bonding temperature of 200 ° C., and SBNS-33CD-AZM-1 / 16-XL manufactured by SPT Corporation was used as the capillary.
Next, using the sample immediately after bonding, the roundness of the press-bonded ball shape was measured from above the aluminum electrode, and the stitch bondability was measured from the wire peel strength near the lead terminal. The respective measurement results are shown in the right column of Table 1.

Figure 0004134261
Figure 0004134261

測定結果から次のことがわかる。
（１）実施例１〜１２は、走査電子顕微鏡観察により観察したところ、全面的な酸化物による汚れや引け巣があまりなく、溶融ボール形成性が実用性に耐え満足するものであった。これに対して、マグネシウム（Ｍｇ）添加量が上限値を超えている比較例４、および、スズ（Ｓｎ）添加量が上限値を超えている比較例５は、走査電子顕微鏡観察により全面的な酸化物による汚れや引け巣が数多く観察され、溶融ボール形成性が実用性に耐えず満足するものでなかった。 The following can be seen from the measurement results.
(1) In Examples 1 to 12, when observed through a scanning electron microscope, there was not much dirt and shrinkage due to oxides on the entire surface, and the molten ball formation was practical and satisfactory. On the other hand, Comparative Example 4 in which the addition amount of magnesium (Mg) exceeds the upper limit value and Comparative Example 5 in which the addition amount of tin (Sn) exceeds the upper limit value are comprehensively observed with a scanning electron microscope. Numerous stains and shrinkage cavities due to oxides were observed, and the molten ball formation was not satisfactory because it was not practical.

（２）実施例１〜１２は、圧着ボール形状の真円性がいずれも実用性に耐え満足するものであった。これに対して、カルシウム（Ｃａ）の添加量が上限値を超えている比較例１（比較例１はユーロピウム（Ｅｕ）とカルシウム（Ｃａ）合計の添加量も上限値２５質量ｐｐｍを超えている）、および、比較例２は、溶融ボールを圧着した時の圧着ボール形状の真円性が実用性に耐えず満足するものでなかった。また、カルシウム（Ｃａ）はユーロピウム（Ｅｕ）の半分以下の添加量とならない比較例３（比較例３はユーロピウム（Ｅｕ）とカルシウム（Ｃａ）合計の添加量も上限値２５質量ｐｐｍを超えている）についても、圧着ボール形状の真円性が実用性に耐えず満足するものでなかった (2) In each of Examples 1 to 12, the roundness of the press-bonded ball shape was satisfactory with practicality. On the other hand, the addition amount of calcium (Ca) exceeds the upper limit value in Comparative Example 1 (Comparative Example 1 has a total addition amount of europium (Eu) and calcium (Ca) exceeding the upper limit value of 25 ppm by mass. ) And Comparative Example 2 were not satisfactory because the roundness of the pressure-bonded ball shape when the molten ball was pressure-bonded could not withstand practicality. In addition, Comparative Example 3 in which calcium (Ca) does not become less than half the amount of Europium (Eu) (Comparative Example 3 has a total addition amount of Europium (Eu) and calcium (Ca) exceeding 25 ppm by mass) ) Was not satisfactory because the roundness of the pressure-bonded ball shape could not withstand practicality.

（３）実施例１〜１２は、ステッチ接合性がいずれも安定しており、その結果としていずれも実用性に耐え満足するものであった。これに対して、カルシウム（Ｃａ）とユーロピウム（Ｅｕ）の添加量が下限値を満たさない比較例４のものは、ステッチ接合性が安定しているものの、ワイヤ強度が十分でなく、実用性に耐えず満足のいくものではなかった。また、カルシウム（Ｃａ）の添加量が上限値を超えている比較例１および比較例３は、ワイヤ強度は満足のいくものであるが、ステッチ接合性が十分でなく、実用性に耐えず満足のいくものでなかった。 (3) In Examples 1 to 12, the stitch bondability was all stable, and as a result, all of them were practical and satisfied. On the other hand, the comparative example 4 in which the addition amount of calcium (Ca) and europium (Eu) does not satisfy the lower limit value is stable in stitch bondability, but has insufficient wire strength and is practical. I couldn't stand it and wasn't satisfied. Further, Comparative Example 1 and Comparative Example 3 in which the added amount of calcium (Ca) exceeds the upper limit value are satisfactory in wire strength, but are not satisfactory in stitch jointability and are not practical and satisfactory. It wasn't what it meant.

本発明によるボールボンディング用金合金線によれば、所定範囲のＣａ―Ｍｇ―Ｅｕの微量な添加元素系からなるＡｕ合金またはＣａ―Ｍｇ―Ｅｕ―Ｓｎの微量な添加元素系からなる金合金が圧着ボール形状の真円性に優れた効果を発揮することができ、また、従来と同様に溶融ボール形成性およびステッチ接合性やワイヤ強度と半導体装置の信頼性向上に効果的であり、その産業上の利用価値は極めて高い。   According to the gold alloy wire for ball bonding according to the present invention, an Au alloy composed of a small amount of additive element system of Ca—Mg—Eu within a predetermined range or a gold alloy composed of a small amount of additive element system of Ca—Mg—Eu—Sn It can demonstrate the excellent roundness of the crimped ball shape, and is effective in improving the melt ball forming and stitch bonding properties, wire strength and semiconductor device reliability as in the past. The above utility value is extremely high.

ボールボンディング方法による接合法を説明するための模式図である。It is a schematic diagram for demonstrating the joining method by a ball bonding method. （ａ）および（ｂ）は、それぞれボールボンディング方法およびステッチ接合方法による接合部の形状、寸法を示す。(A) And (b) shows the shape and dimension of the junction part by a ball bonding method and a stitch joining method, respectively. ボンディングワイヤの接合強度測定を説明するための模式図である。It is a schematic diagram for demonstrating the joint strength measurement of a bonding wire. 本発明のボールボンディング用金合金線をによるボールボンディング接合の例を示す写真である。It is a photograph which shows the example of the ball bonding joining by the gold alloy wire for ball bonding of this invention. 本発明のボールボンディング用金合金線をによるステッチ接合の例を示す写真である。It is a photograph which shows the example of the stitch joining by the gold alloy wire for ball bonding of this invention.

符号の説明Explanation of symbols

１：キャピラリー
２：ワイヤ
３：電気トーチ
４：ボール
４′：圧着ボール
５：Ａｌ電極
６：ＩＣチップ
７：クランパー
８：外部配線
Ｄ：ワイヤ径
Ｌ1：圧着ボール径
Ｌ2：つぶれ幅 1: Capillary 2: Wire 3: Electric torch 4: Ball 4 ′: Crimp ball 5: Al electrode 6: IC chip 7: Clamper 8: External wiring D: Wire diameter L 1 : Crimp ball diameter L 2 : Collapse width

Claims (5)

マグネシウム（Ｍｇ）を１０〜５０質量ｐｐｍ、ユーロピウム（Ｅｕ）を５〜２０質量ｐｐｍ、カルシウム（Ｃａ）を２〜９質量ｐｐｍ、および残部が純度９９．９９８質量％以上の金（Ａｕ）からなる金合金であって、カルシウム（Ｃａ）はユーロピウム（Ｅｕ）の半分以下の添加量であることを特徴とするボールボンディング用金合金線。   Magnesium (Mg) is 10-50 mass ppm, europium (Eu) is 5-20 mass ppm, calcium (Ca) is 2-9 mass ppm, and the balance is gold (Au) with a purity of 99.998 mass% or more. A gold alloy wire for ball bonding, characterized in that calcium (Ca) is added in an amount less than half that of europium (Eu). マグネシウム（Ｍｇ）を１０〜５０質量ｐｐｍ、スズ（Ｓｎ）を１〜３０質量ｐｐｍ、ユーロピウム（Ｅｕ）を５〜２０質量ｐｐｍ、カルシウム（Ｃａ）を２〜９質量ｐｐｍ、および残部が純度９９．９９８質量％以上の金（Ａｕ）からなる金合金であって、カルシウム（Ｃａ）はユーロピウム（Ｅｕ）の半分以下の添加量であることを特徴とするボールボンディング用金合金線。   Magnesium (Mg) is 10-50 mass ppm, tin (Sn) is 1-30 mass ppm, europium (Eu) is 5-20 mass ppm, calcium (Ca) is 2-9 mass ppm, and the balance is 99.000 ppm. A gold alloy wire for ball bonding, wherein the gold alloy wire is made of 998% by mass or more of gold (Au), and calcium (Ca) is added in an amount less than half of europium (Eu). マグネシウム（Ｍｇ）が１０〜５０質量ｐｐｍ、ユーロピウム（Ｅｕ）を５〜２０質量ｐｐｍ、カルシウム（Ｃａ）を２〜９質量ｐｐｍ、および残部が純度９９．９９８質量％以上の金（Ａｕ）からなる金合金であって、カルシウム（Ｃａ）はユーロピウム（Ｅｕ）の半分以下の質量であり、かつ、ユーロピウム（Ｅｕ）とカルシウム（Ｃａ）合計の添加量が２５質量ｐｐｍ以下の添加量であることを特徴とするボールボンディング用金合金線。   Magnesium (Mg) is 10 to 50 ppm by mass, Europium (Eu) is 5 to 20 ppm by mass, Calcium (Ca) is 2 to 9 ppm by mass, and the balance is gold (Au) having a purity of 99.998% by mass or more. It is a gold alloy, and calcium (Ca) is less than half the mass of europium (Eu), and the total amount of europium (Eu) and calcium (Ca) is 25 ppm by mass or less. A gold alloy wire for ball bonding. マグネシウム（Ｍｇ）を１０〜５０質量ｐｐｍ、スズ（Ｓｎ）を１〜３０質量ｐｐｍ、ユーロピウム（Ｅｕ）を５〜２０質量ｐｐｍ、カルシウム（Ｃａ）を２〜９質量ｐｐｍ、および残部が純度が９９．９９８質量％以上の金（Ａｕ）からなる金合金であって、カルシウム（Ｃａ）はユーロピウム（Ｅｕ）の半分以下の添加量であり、かつ、ユーロピウム（Ｅｕ）とカルシウム（Ｃａ）合計の添加量が２５質量ｐｐｍ以下の添加量であることを特徴とするボールボンディング用金合金線。   Magnesium (Mg) is 10-50 mass ppm, tin (Sn) is 1-30 mass ppm, europium (Eu) is 5-20 mass ppm, calcium (Ca) is 2-9 mass ppm, and the balance has a purity of 99. .998% by mass of gold (Au) gold alloy, calcium (Ca) is less than half of europium (Eu), and total addition of europium (Eu) and calcium (Ca) A gold alloy wire for ball bonding, wherein the amount is an addition amount of 25 ppm by mass or less. マグネシウム（Ｍｇ）が１５〜４０質量ｐｐｍであることを特徴とする請求項１ないし請求項４のいずれかに記載のボールボンディング用金合金線。   The gold alloy wire for ball bonding according to any one of claims 1 to 4, wherein magnesium (Mg) is 15 to 40 ppm by mass.
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CN2008800001948A CN101601126B (en) 2007-10-24 2008-06-23 Gold alloy wire for ball bonding
PCT/JP2008/061424 WO2009054164A1 (en) 2007-10-24 2008-06-23 Gold alloy wire for ball bonding
EP08790566.7A EP2204846A4 (en) 2007-10-24 2008-06-23 Gold alloy wire for ball bonding
MYPI20084383A MY155023A (en) 2007-10-24 2008-06-23 Gold alloy wire for ball bonding
KR1020087025455A KR101047827B1 (en) 2007-10-24 2008-06-23 Gold Alloy Wire for Ball Bonding
US12/224,212 US8147750B2 (en) 2007-10-24 2008-06-23 Gold alloy wire for ball bonding
TW097134412A TWI371812B (en) 2007-10-24 2008-09-08 Gold alloy wire for ball bonding

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EP2204846A4 (en) 2014-01-15
US8147750B2 (en) 2012-04-03

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