JP4108717B2 - プリント回路基板 - Google Patents
プリント回路基板 Download PDFInfo
- Publication number
- JP4108717B2 JP4108717B2 JP2006183025A JP2006183025A JP4108717B2 JP 4108717 B2 JP4108717 B2 JP 4108717B2 JP 2006183025 A JP2006183025 A JP 2006183025A JP 2006183025 A JP2006183025 A JP 2006183025A JP 4108717 B2 JP4108717 B2 JP 4108717B2
- Authority
- JP
- Japan
- Prior art keywords
- power supply
- pattern
- circuit board
- printed circuit
- resistor
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 239000003990 capacitor Substances 0.000 claims description 52
- 239000007787 solid Substances 0.000 claims description 26
- 230000000644 propagated effect Effects 0.000 claims description 2
- 230000007257 malfunction Effects 0.000 description 9
- 239000000758 substrate Substances 0.000 description 9
- 238000000034 method Methods 0.000 description 6
- 238000010586 diagram Methods 0.000 description 4
- 230000000694 effects Effects 0.000 description 3
- 230000001902 propagating effect Effects 0.000 description 3
- 230000007704 transition Effects 0.000 description 3
- 230000002411 adverse Effects 0.000 description 2
- 230000005855 radiation Effects 0.000 description 2
- 238000002310 reflectometry Methods 0.000 description 2
- 235000013405 beer Nutrition 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 230000015556 catabolic process Effects 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 238000013016 damping Methods 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 238000006731 degradation reaction Methods 0.000 description 1
- 230000006870 function Effects 0.000 description 1
- 230000010365 information processing Effects 0.000 description 1
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000003071 parasitic effect Effects 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 230000004044 response Effects 0.000 description 1
- 230000000087 stabilizing effect Effects 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
- H05K1/023—Reduction of cross-talk, noise or electromagnetic interference using auxiliary mounted passive components or auxiliary substances
- H05K1/0234—Resistors or by disposing resistive or lossy substances in or near power planes
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
- H05K1/023—Reduction of cross-talk, noise or electromagnetic interference using auxiliary mounted passive components or auxiliary substances
- H05K1/0231—Capacitors or dielectric substances
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/09218—Conductive traces
- H05K2201/09236—Parallel layout
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/0929—Conductive planes
- H05K2201/09309—Core having two or more power planes; Capacitive laminate of two power planes
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10007—Types of components
- H05K2201/10022—Non-printed resistor
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10007—Types of components
- H05K2201/10159—Memory
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Electromagnetism (AREA)
- Structure Of Printed Boards (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
- Dram (AREA)
Description
V1’=V1×[(1/ωC−Z0)/(1/ωC+Z0)]
で表される。
V1’=V1[(R+1/ωC−Z0)/(R+1/ωC+Z0)]
で表される。
10 表面
20 VTT電源パターン
30 GNDパターン
41 メモリコントローラ
42 高速DRAM
43 メモリバス配線
44 並列終端抵抗
45、66 コンデンサ
46、67 抵抗
50 裏面
61 第1層(表面)
61−1、64−1 配線
62 第2層(GNDパターン)
63 第3層(電源べたパターン)
65 ビアホール
Claims (6)
- 高速DRAMとメモリコントローラとを搭載したプリント回路基板において、
メモリバス配線に設けられた並列終端抵抗用電源(以下、VTT電源と略す)パターンと、GNDパターンとの間に、コンデンサと、前記VTT電源パターンの特性インピーダンスと同じ抵抗値を持つ抵抗との直列接続回路が設けられ、前記高速DRAM及び前記メモリコントローラの動作に伴って前記VTT電源パターンに発生あるいは伝搬するノイズを前記直列接続回路で消費させることを特徴とするプリント回路基板。 - 当該プリント回路基板には前記高速DRAMが複数個搭載され、
前記直列接続回路は前記高速DRAM毎に設けられることを特徴とする請求項1に記載のプリント回路基板。 - 当該プリント回路基板には前記高速DRAMが複数個搭載され、
前記直列接続回路をN個(Nは自然数)並列に接続したものを備え、
前記電源パターンの特性インピーダンスをZ0とした場合、
(1/R1+1/R2+・・・1/RN)(但し、R1は1個目の直列接続回路における抵抗の抵抗値、R2は2個目の直列接続回路における抵抗の抵抗値、・・・、RNはN個目の直列接続回路における抵抗の抵抗値)が前記特性インピーダンスZ0の逆数と等しくなるように各直列接続回路における抵抗の抵抗値が選ばれることを特徴とする請求項1に記載のプリント回路基板。 - 前記複数個の高速DRAMは当該プリント回路基板の表面、裏面のうち少なくとも片方の面に搭載されることを特徴とする請求項2又は3に記載のプリント回路基板。
- 前記高速DRAMは前記VTT電源パターンや基準電圧(Vref)用パターンが動作に必要なことを特徴とする請求項1〜4のいずれかに記載のプリント回路基板。
- 前記VTT電源パターン及び前記GNDパターンは、それぞれ、べたパターンであることを特徴とする請求項1〜5のいずれかに記載のプリント回路基板。
Priority Applications (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2006183025A JP4108717B2 (ja) | 2006-07-03 | 2006-07-03 | プリント回路基板 |
US11/764,439 US20080002373A1 (en) | 2006-07-03 | 2007-06-18 | Printed circuit board |
CNA2007101271015A CN101102641A (zh) | 2006-07-03 | 2007-06-28 | 印刷电路板 |
TW096123635A TW200814881A (en) | 2006-07-03 | 2007-06-29 | Printed circuit board |
KR1020070066681A KR100913711B1 (ko) | 2006-07-03 | 2007-07-03 | 인쇄 회로 보드 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2006183025A JP4108717B2 (ja) | 2006-07-03 | 2006-07-03 | プリント回路基板 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2008016470A JP2008016470A (ja) | 2008-01-24 |
JP4108717B2 true JP4108717B2 (ja) | 2008-06-25 |
Family
ID=38876390
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2006183025A Active JP4108717B2 (ja) | 2006-07-03 | 2006-07-03 | プリント回路基板 |
Country Status (5)
Country | Link |
---|---|
US (1) | US20080002373A1 (ja) |
JP (1) | JP4108717B2 (ja) |
KR (1) | KR100913711B1 (ja) |
CN (1) | CN101102641A (ja) |
TW (1) | TW200814881A (ja) |
Families Citing this family (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP5035039B2 (ja) * | 2008-03-11 | 2012-09-26 | 日本電気株式会社 | 電子回路基板の電源雑音解析方法とシステム並びにプログラム |
JP5151571B2 (ja) * | 2008-03-11 | 2013-02-27 | 日本電気株式会社 | 電子回路基板の電源雑音解析装置とプログラム |
TW201026217A (en) * | 2008-12-31 | 2010-07-01 | Htc Corp | Electronic device and high frequency circuit board thereof |
KR102083488B1 (ko) | 2013-09-12 | 2020-03-02 | 삼성전자 주식회사 | 테스트 인터페이스 보드 및 이를 포함하는 테스트 시스템 |
KR102432861B1 (ko) * | 2017-06-15 | 2022-08-16 | 삼성전자주식회사 | 거리 측정을 위한 이미지 센서 |
JP7112301B2 (ja) * | 2018-09-25 | 2022-08-03 | 日立Astemo株式会社 | 電子制御装置 |
JP2021111738A (ja) * | 2020-01-15 | 2021-08-02 | 国立研究開発法人産業技術総合研究所 | ノイズ抑制回路、回路基板、及び電子機器 |
Family Cites Families (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
IT1274537B (it) * | 1994-05-20 | 1997-07-17 | Fujitsu Ltd | Apparato a circuito elettronico per trasmettere segnali attraverso un bus e dispositivo a semiconduttore per generare una predeterminata tensione stabile |
JP2000284873A (ja) * | 1999-03-31 | 2000-10-13 | Adtec:Kk | メモリ回路基板 |
US6445590B1 (en) * | 2000-06-15 | 2002-09-03 | Intel Corporation | Capacitor for DRAM connector |
US6449166B1 (en) * | 2000-08-24 | 2002-09-10 | High Connection Density, Inc. | High capacity memory module with higher density and improved manufacturability |
TWI242132B (en) * | 2002-07-01 | 2005-10-21 | Renesas Tech Corp | Equal-amplitude directional coupling bus system |
JP3886425B2 (ja) * | 2002-07-29 | 2007-02-28 | エルピーダメモリ株式会社 | メモリモジュール及びメモリシステム |
JP4221238B2 (ja) * | 2002-09-26 | 2009-02-12 | エルピーダメモリ株式会社 | メモリモジュール |
US7542305B2 (en) * | 2004-08-25 | 2009-06-02 | Ocz Technology Group, Inc. | Memory module having on-package or on-module termination |
-
2006
- 2006-07-03 JP JP2006183025A patent/JP4108717B2/ja active Active
-
2007
- 2007-06-18 US US11/764,439 patent/US20080002373A1/en not_active Abandoned
- 2007-06-28 CN CNA2007101271015A patent/CN101102641A/zh active Pending
- 2007-06-29 TW TW096123635A patent/TW200814881A/zh unknown
- 2007-07-03 KR KR1020070066681A patent/KR100913711B1/ko not_active IP Right Cessation
Also Published As
Publication number | Publication date |
---|---|
KR100913711B1 (ko) | 2009-08-24 |
JP2008016470A (ja) | 2008-01-24 |
US20080002373A1 (en) | 2008-01-03 |
CN101102641A (zh) | 2008-01-09 |
TW200814881A (en) | 2008-03-16 |
KR20080003739A (ko) | 2008-01-08 |
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