JP4019474B2 - Method for manufacturing light emitting device - Google Patents

Method for manufacturing light emitting device Download PDF

Info

Publication number
JP4019474B2
JP4019474B2 JP32997597A JP32997597A JP4019474B2 JP 4019474 B2 JP4019474 B2 JP 4019474B2 JP 32997597 A JP32997597 A JP 32997597A JP 32997597 A JP32997597 A JP 32997597A JP 4019474 B2 JP4019474 B2 JP 4019474B2
Authority
JP
Japan
Prior art keywords
wiring layer
electrode wiring
light emitting
substrate
emitting device
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP32997597A
Other languages
Japanese (ja)
Other versions
JPH11163409A (en
Inventor
貴史 田畑
忠昭 池田
聡 畠中
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Corp
Panasonic Holdings Corp
Original Assignee
Panasonic Corp
Matsushita Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Panasonic Corp, Matsushita Electric Industrial Co Ltd filed Critical Panasonic Corp
Priority to JP32997597A priority Critical patent/JP4019474B2/en
Publication of JPH11163409A publication Critical patent/JPH11163409A/en
Application granted granted Critical
Publication of JP4019474B2 publication Critical patent/JP4019474B2/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Images

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/52—Encapsulations
    • H01L33/54—Encapsulations having a particular shape
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • H05K3/3431—Leadless components
    • H05K3/3442—Leadless components having edge contacts, e.g. leadless chip capacitors, chip carriers

Landscapes

  • Led Device Packages (AREA)

Description

【０００１】
【発明の属する技術分野】
本発明は、固体発光素子を備えた発光装置、とりわけ、絶縁性の基板上に発光素子を搭載したものを、プリント基板にアップサイドダウンに設置することが可能な発光装置に関するものである。
【０００２】
【従来の技術】
近年、アッセンブリ基板の簡素化のため、プリント基板に孔をあけ、この孔に発光部を挿入して実装することが可能な、表面実装型発光装置が提案されている。
【０００３】
従来の表面実装型発光装置を、図２（ａ）及び（ｂ）に、斜視図及び概略正面図で示す。この表面実装型発光装置は、発光部１を有する絶縁性の基板２の表面側の電極配線層３を、プリント基板の配線層電極部にアップサイドダウンに設置して、半田付けする方法で実装される。この場合、絶縁性の基板２の裏面側の電極配線層４はプリント基板への実装面ではないことから課題視されておらず、基板２の裏面側の電極配線層４の基板端面からの長さＤ1は、基板２の表面側の電極配線層３の基板端面からの長さＤ2よりも、小さくなっている。
【０００４】
【発明が解決しようとする課題】
しかし、図２に示す、従来の表面実装型発光装置は、発光部１を樹脂で封止するとき、発光部１を有する基板２の表面側の電極配線層３に、少なからず、樹脂漏れが生じる。この基板２の表面側の電極配線層３の縁からの樹脂漏れを生ずる理由は、樹脂封止において、基板２の表裏両面を封止成形金型で押さえているとき、基板２の裏面側の電極配線層４の長さＤ1が、基板２の表面側の電極配線層３の長さＤ2より小さく、裏面側の電極配線層で覆われていない部分６の、長さＤ3の領域の押さえが十分でないためである。
【０００５】
図３の斜視図は、発光部１を有する基板２の表面側の電極配線層３に樹脂漏れ７が生じた状態を示す。
【０００６】
この従来例の表面実装型発光装置の場合、発光部１を有する基板２の表面側の電極配線層３を半田付けするとき、前記樹脂漏れ７により、電極配線層３の半田濡れ性を低下させる。この結果、表面実装部品の一般的な半田付け法であるリフロー半田付け時に半田の溶融時間の差や半田量のばらつき等のリフロー条件により、両方の電極配線層にはたらく半田の表面張力に差が生じてしまい、図４の概略正面図に示すように、予め、半田８の付着された電極部を持ったプリント基板９から、片方の電極配線層側が浮き、半田付け不良が発生するという事態が起こる。
【０００７】
つまり、図２に示す、従来の表面実装型発光装置で、基板２の裏面側の電極配線層で覆われていない部分６があると、基板２の表面側の電極配線層３を、封止成形金型が完全に押さえきれず、電極配線層３の表面に樹脂漏れが生じ、この樹脂漏れが半田濡れ性低下の原因となる。
【０００８】
【課題を解決するための手段】
本発明は、前記表面実装型発光装置で、リフロー半田付け時に、片方の電極側が浮き、半田付け不良が発生する事態を解決するもので、基板の裏面側の電極配線層４の長さを、前記基板の端部から測って基板の表面側の電極配線層３の長さと同等あるいはそれより大きくなるように設けたものである。
【０００９】
本発明によると、プリント基板の孔に発光部を挿入するような実装が可能な表面実装型発光装置の、表面側の電極配線層３上に樹脂漏れが発生せず、電極の半田濡れ性の低下は生じない。
【００１０】
【発明の実施の形態】
本発明は、絶縁性の基板の表面の電極層に固体発光素子を搭載し、前記電極層から前記基板の表裏両面にわたって繋がる配線層を、前記基板の端部から測って前記裏面部側の長さが前記表面部側の長さ以上になるように設け、前記固体発光素子を樹脂により封止した発光装置である。
【００１１】
これにより、発光部を有する絶縁性の基板の表面側の電極配線層の押さえが十分になり、樹脂漏れが生じないので、半田濡れ性もよく、プリント基板の配線層電極部への設置が確実となる。
【００１２】
【実施例】
以下、本発明の実施例を、図１を用いて説明する。図１（ａ）及び（ｂ）は、実施例の表面実装型発光装置の斜視図及び概略正面図である。発光部１は発光素子を透光性樹脂でほぼ円柱状に封止して形成したものである。前記発光部１の土台となる絶縁性の基板２には耐熱性の樹脂、又はセラミックスが利用できる。前記基板２には、表面側に電極配線層３を形成し、裏面側に電極配線層４を形成している。ここで裏面側の電極配線層４の長さＤ1は表面側の電極配線層３の長さＤ2と同等あるいはそれより大きく形成するものとする。前記発光部１の樹脂封止の際、発光部１以外の部分は封止成形金型の枠面で押さえるが、発光部１を有する基板２の表面側の電極配線層で覆われていない部分５は、電極配線層の厚み分だけ、隙間ができ、樹脂がはいりこむ。この時、封止成形金型の枠面と電極配線層３の表面が密着していないと、このわずかな隙間へも樹脂が侵入し、図３に示す樹脂漏れ７が生じてしまうことになる。この封止成形金型の枠面と電極配線層３の表面が密着しない原因として、裏面側の電極配線層４の長さＤ1が表面側の電極配線層３の長さＤ2よりも小さい場合、表面側の電極配線層３の側から封止成形金型が基板２を押す力を裏面側の電極配線層４の側で受け止める部分が少ないため、基板２が裏面側の電極配線層がない部分６の側にわずかにたわんでしまうことが挙げられる。
【００１３】
そこで、図１に示すように、基板２の裏面側の電極配線層４の長さＤ1を、基板２の表面側の電極配線層３の長さＤ2と同等あるいはそれより大きくすることにより、表面側の電極配線層３を全面にわたって封止成形金型の枠面と密着させることができ、電極配線層３の上には、樹脂漏れが生じない。
【００１４】
次に電極配線層の幅について図５を用いて説明する。図５は樹脂漏れが発生しやすい電極配線層の幅を持った発光装置の例を示したもので、図５（ａ）はその斜視図、図５（ｂ）はその概略側面図である。ここで述べる電極配線層の幅についても、電極配線層の長さと同様のことがいえる。つまり、図５（ａ）及び（ｂ）に示すように、表面側の電極配線層３の幅Ｄ5より裏面側の電極配線層の幅Ｄ4が小さいと樹脂封止の際、封止成形金型の枠面と電極配線層３の表面のわずかな隙間へ樹脂が侵入し、電極配線層３の上に樹脂漏れが生ずる。そこで裏面側の電極配線層の幅が表面側の電極配線層の幅と同等あるいはそれ以上とすることにより、表面側の電極配線層３の上には樹脂漏れは生じない。
【００１５】
これらにより、電極配線層の表面の半田濡れ性の低下を防止し、発光装置のプリント基板への実装時における半田付け不良を防止できる。
【００１６】
【発明の効果】
以上に説明したように、本発明により、プリント基板の孔に発光部を挿入して実装するような構造の表面実装型発光装置で、発光部を有する側の電極に樹脂漏れは発生せず、したがって、半田濡れ性もよくなり、プリント基板の配線層電極部への設置が確実な表面実装型発光装置が実現できる。
【図面の簡単な説明】
【図１】 （ａ）本発明の実施例の発光装置の斜視図
（ｂ）本発明の実施例の発光装置の概略正面図
【図２】 （ａ）従来の発光装置の斜視図
（ｂ）従来の発光装置の概略正面図
【図３】従来の発光装置の樹脂漏れ状態を表す斜視図
【図４】従来の発光装置の半田付け不良状態を表す概略正面図
【図５】（ａ）従来の発光装置の斜視図
（ｂ）従来の発光装置の概略側面図
【符号の説明】
１ 発光部
２ 基板
３ 表面側の電極配線層
４ 裏面側の電極配線層
５ 基板の表面側で電極配線層に覆われていない部分
６ 基板の裏面側で電極配線層で覆われていない部分
７ 樹脂漏れ
８ 半田
９ プリント基板
１０ 孔[0001]
BACKGROUND OF THE INVENTION
The present invention relates to a light-emitting device including a solid-state light-emitting element, and more particularly to a light-emitting device in which a light-emitting element mounted on an insulating substrate can be installed upside down on a printed circuit board.
[0002]
[Prior art]
In recent years, in order to simplify the assembly substrate, a surface-mount type light emitting device that can be mounted by making a hole in a printed circuit board and inserting a light emitting portion into the hole has been proposed.
[0003]
A conventional surface-mounted light-emitting device is shown in FIGS. 2A and 2B in a perspective view and a schematic front view. This surface mount type light emitting device is mounted by a method in which an electrode wiring layer 3 on the surface side of an insulating substrate 2 having a light emitting portion 1 is placed upside down on a wiring layer electrode portion of a printed board and soldered. Is done. In this case, the electrode wiring layer 4 on the back surface side of the insulating substrate 2 is not viewed as a problem because it is not a mounting surface on the printed circuit board, and the length of the electrode wiring layer 4 on the back surface side of the substrate 2 from the substrate end surface is long. The length D1 is smaller than the length D2 from the substrate end surface of the electrode wiring layer 3 on the surface side of the substrate 2.
[0004]
[Problems to be solved by the invention]
However, in the conventional surface-mounted light-emitting device shown in FIG. 2, when the light-emitting portion 1 is sealed with resin, the electrode wiring layer 3 on the surface side of the substrate 2 having the light-emitting portion 1 has a considerable amount of resin leakage. Arise. The reason for the resin leakage from the edge of the electrode wiring layer 3 on the front surface side of the substrate 2 is that when the front and back surfaces of the substrate 2 are pressed by a sealing mold in resin sealing, The length D1 of the electrode wiring layer 4 is smaller than the length D2 of the electrode wiring layer 3 on the front surface side of the substrate 2 and the area 6 of the length D3 of the portion 6 not covered with the electrode wiring layer on the back surface side is suppressed. This is because it is not enough.
[0005]
The perspective view of FIG. 3 shows a state in which a resin leak 7 has occurred in the electrode wiring layer 3 on the surface side of the substrate 2 having the light emitting portion 1.
[0006]
In the case of this conventional surface mount type light emitting device, when the electrode wiring layer 3 on the surface side of the substrate 2 having the light emitting portion 1 is soldered, the solder leakage of the electrode wiring layer 3 is lowered due to the resin leakage 7. . As a result, there is a difference in the surface tension of the solder acting on both electrode wiring layers due to reflow conditions such as differences in the melting time of the solder and variations in the amount of solder during reflow soldering, which is a general soldering method for surface mount components. As shown in the schematic front view of FIG. 4, there is a situation in which one electrode wiring layer side floats from the printed board 9 having the electrode portion to which the solder 8 is attached in advance, resulting in poor soldering. Occur.
[0007]
That is, in the conventional surface mount light emitting device shown in FIG. 2, if there is a portion 6 not covered with the electrode wiring layer on the back surface side of the substrate 2, the electrode wiring layer 3 on the front surface side of the substrate 2 is sealed. The molding die cannot be completely pressed down, and resin leakage occurs on the surface of the electrode wiring layer 3, and this resin leakage causes a decrease in solder wettability.
[0008]
[Means for Solving the Problems]
The present invention solves the situation where one electrode side floats during reflow soldering in the surface mount type light emitting device and a soldering failure occurs, and the length of the electrode wiring layer 4 on the back side of the substrate is It is provided so as to be equal to or larger than the length of the electrode wiring layer 3 on the surface side of the substrate as measured from the end portion of the substrate.
[0009]
According to the present invention, there is no resin leakage on the electrode wiring layer 3 on the surface side of the surface mount type light emitting device that can be mounted by inserting the light emitting portion into the hole of the printed circuit board, and the solder wettability of the electrode There is no decline.
[0010]
DETAILED DESCRIPTION OF THE INVENTION
In the present invention, a solid light emitting element is mounted on an electrode layer on the surface of an insulating substrate, and a wiring layer connected from the electrode layer to both the front and back surfaces of the substrate is measured from an end portion of the substrate, and the length on the back surface side is measured. Is a light emitting device provided with a length equal to or longer than the length on the surface portion side, and sealing the solid light emitting element with a resin.
[0011]
As a result, the electrode wiring layer on the surface side of the insulating substrate having the light emitting portion is sufficiently pressed, and no resin leakage occurs, so that the solder wettability is good and the printed circuit board is securely installed on the wiring layer electrode portion. It becomes.
[0012]
【Example】
Hereinafter, an embodiment of the present invention will be described with reference to FIG. 1A and 1B are a perspective view and a schematic front view of a surface-mounted light-emitting device of an example. The light emitting unit 1 is formed by sealing a light emitting element in a substantially cylindrical shape with a translucent resin. A heat-resistant resin or ceramics can be used for the insulating substrate 2 that becomes the base of the light emitting unit 1. On the substrate 2, an electrode wiring layer 3 is formed on the front surface side, and an electrode wiring layer 4 is formed on the back surface side. Here, the length D1 of the electrode wiring layer 4 on the back surface side is formed to be equal to or larger than the length D2 of the electrode wiring layer 3 on the front surface side. At the time of resin sealing of the light emitting part 1, the part other than the light emitting part 1 is pressed by the frame surface of the sealing mold, but is not covered by the electrode wiring layer on the surface side of the substrate 2 having the light emitting part 1. No. 5 has a gap corresponding to the thickness of the electrode wiring layer, and the resin enters. At this time, if the frame surface of the sealing mold and the surface of the electrode wiring layer 3 are not in close contact with each other, the resin enters the slight gap and the resin leakage 7 shown in FIG. 3 occurs. . As a cause that the frame surface of the sealing mold and the surface of the electrode wiring layer 3 do not adhere to each other, when the length D1 of the electrode wiring layer 4 on the back surface side is smaller than the length D2 of the electrode wiring layer 3 on the front surface side, Since there are few portions where the sealing molding die receives the pressing force of the substrate 2 from the side of the electrode wiring layer 3 on the front side on the side of the electrode wiring layer 4 on the back side, the portion where the substrate 2 does not have the electrode wiring layer on the back side It is mentioned that it will bend slightly to the 6 side.
[0013]
Therefore, as shown in FIG. 1, the length D1 of the electrode wiring layer 4 on the back surface side of the substrate 2 is made equal to or larger than the length D2 of the electrode wiring layer 3 on the front surface side of the substrate 2, thereby The electrode wiring layer 3 on the side can be brought into close contact with the frame surface of the sealing mold over the entire surface, and no resin leakage occurs on the electrode wiring layer 3.
[0014]
Next, the width of the electrode wiring layer will be described with reference to FIG. FIG. 5 shows an example of a light emitting device having a width of an electrode wiring layer in which resin leakage is likely to occur. FIG. 5 (a) is a perspective view thereof, and FIG. 5 (b) is a schematic side view thereof. The same applies to the width of the electrode wiring layer described here as the length of the electrode wiring layer. That is, as shown in FIGS. 5A and 5B, when the width D4 of the electrode wiring layer on the back surface side is smaller than the width D5 of the electrode wiring layer 3 on the front surface side, a sealing mold is used at the time of resin sealing. The resin enters a slight gap between the frame surface of the electrode and the surface of the electrode wiring layer 3, and resin leakage occurs on the electrode wiring layer 3. Therefore, when the width of the electrode wiring layer on the back surface side is equal to or larger than the width of the electrode wiring layer on the front surface side, no resin leakage occurs on the electrode wiring layer 3 on the front surface side.
[0015]
Accordingly, it is possible to prevent a decrease in solder wettability on the surface of the electrode wiring layer and to prevent a soldering failure when the light emitting device is mounted on a printed board.
[0016]
【The invention's effect】
As described above, according to the present invention, in a surface mount type light emitting device having a structure in which a light emitting portion is inserted and mounted in a hole of a printed circuit board, resin leakage does not occur in the electrode on the side having the light emitting portion, Therefore, the solder wettability is improved, and a surface-mounted light-emitting device that is surely installed on the wiring layer electrode portion of the printed board can be realized.
[Brief description of the drawings]
1A is a perspective view of a light emitting device according to an embodiment of the present invention. FIG. 1B is a schematic front view of a light emitting device according to an embodiment of the present invention. FIG. 2A is a perspective view of a conventional light emitting device. FIG. 3 is a perspective view showing a resin leakage state of a conventional light emitting device. FIG. 4 is a schematic front view showing a poor soldering state of the conventional light emitting device. (B) Schematic side view of a conventional light emitting device
DESCRIPTION OF SYMBOLS 1 Light emission part 2 Substrate 3 Electrode wiring layer 4 on the surface side Electrode wiring layer 5 on the back side 5 Portion that is not covered with the electrode wiring layer on the surface side of the substrate 6 Portion 7 that is not covered with the electrode wiring layer on the back side of the substrate Resin leak 8 Solder 9 Printed circuit board 10 Hole

Claims (1)

平面視して矩形状の基板に表裏両面にわたって繋がる電極配線層を形成し、表面側の電極配線層に固体発光素子を搭載し、封止成形金型で前記固体発光素子を樹脂封止して円柱状の発光部を形成した表面実装型発光装置を、プリント基板に孔をあけ、前記孔に前記発光部を挿入し、前記プリント基板の配線層電極部と前記表面実装型発光装置の基板の表面側の電極配線層を半田付けして実装する表面実装型発光装置の製造方法において、
前記基板の長手方向両端部の表面側及び裏面側に、前記基板の幅と同じ幅の電極配線層を形成し、裏面側に形成した電極配線層の長手方向端部から発光部方向への長さが、表面側に形成した電極配線層の長手方向端部から発光部方向への長さと同等あるいはそれ以上になるように設け、前記発光部以外の部分は封止成形金型の枠面で押さえて封止することを特徴とする発光装置の製造方法。 An electrode wiring layer connected to both front and back surfaces is formed on a rectangular substrate in plan view, a solid light emitting element is mounted on the electrode wiring layer on the front surface side, and the solid light emitting element is sealed with a sealing mold. A surface-mounted light-emitting device having a cylindrical light-emitting portion is formed, a hole is formed in a printed circuit board, the light-emitting portion is inserted into the hole, a wiring layer electrode portion of the printed circuit board, and a substrate of the surface-mounted light-emitting device. In the method of manufacturing a surface-mounted light-emitting device that is mounted by soldering the electrode wiring layer on the surface side,
An electrode wiring layer having the same width as the width of the substrate is formed on the front side and the back side of both ends in the longitudinal direction of the substrate, and the length from the longitudinal end of the electrode wiring layer formed on the back side to the light emitting unit direction Is provided to be equal to or longer than the length from the end in the longitudinal direction of the electrode wiring layer formed on the surface side to the light emitting portion, and the portion other than the light emitting portion is a frame surface of the sealing mold. A method for manufacturing a light emitting device , characterized by pressing and sealing .
JP32997597A 1997-12-01 1997-12-01 Method for manufacturing light emitting device Expired - Lifetime JP4019474B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP32997597A JP4019474B2 (en) 1997-12-01 1997-12-01 Method for manufacturing light emitting device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP32997597A JP4019474B2 (en) 1997-12-01 1997-12-01 Method for manufacturing light emitting device

Publications (2)

Publication Number Publication Date
JPH11163409A JPH11163409A (en) 1999-06-18
JP4019474B2 true JP4019474B2 (en) 2007-12-12

Family

ID=18227375

Family Applications (1)

Application Number Title Priority Date Filing Date
JP32997597A Expired - Lifetime JP4019474B2 (en) 1997-12-01 1997-12-01 Method for manufacturing light emitting device

Country Status (1)

Country Link
JP (1) JP4019474B2 (en)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1119058A4 (en) * 1999-07-29 2006-08-23 Citizen Electronics Light-emitting diode
JP2001111772A (en) 1999-10-07 2001-04-20 Mitsubishi Electric Corp Line light source and image sensor using the same
CN1173417C (en) 2000-03-17 2004-10-27 松下电器产业株式会社 Light-emitting semiconductor device and surface-emitting device
JP2003179271A (en) * 2000-03-17 2003-06-27 Matsushita Electric Ind Co Ltd Semiconductor light emission device, its manufacturing method, and surface light emission device
JP4833421B2 (en) * 2001-03-08 2011-12-07 ローム株式会社 Light emitting device and mounting board
JP4813691B2 (en) * 2001-06-06 2011-11-09 シチズン電子株式会社 Light emitting diode
US20060292747A1 (en) * 2005-06-27 2006-12-28 Loh Ban P Top-surface-mount power light emitter with integral heat sink
JP5290543B2 (en) * 2007-07-20 2013-09-18 スタンレー電気株式会社 Light emitting device
JP6521681B2 (en) * 2015-03-13 2019-05-29 シチズン電子株式会社 Side-mounted light emitting device

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0350338U (en) * 1989-09-20 1991-05-16
JP2572421Y2 (en) * 1992-06-12 1998-05-25 スタンレー電気株式会社 Chip LED
JPH065926A (en) * 1992-06-18 1994-01-14 Rohm Co Ltd Chip type light emitting diode
JP3193194B2 (en) * 1993-07-09 2001-07-30 三菱電線工業株式会社 Method of molding lens coating layer on LED chip mounted on substrate and substrate structure for molding the same
JPH08321634A (en) * 1995-05-26 1996-12-03 Stanley Electric Co Ltd Surface mount type light-emitting diode
JP3656316B2 (en) * 1996-04-09 2005-06-08 日亜化学工業株式会社 Chip-type LED and manufacturing method thereof

Also Published As

Publication number Publication date
JPH11163409A (en) 1999-06-18

Similar Documents

Publication Publication Date Title
JP2004111964A (en) Surface-mounted electronic device
CA2342440A1 (en) L.e.d. thermal management
JP3065509B2 (en) Surface mount type light emitting diode
JP2717076B2 (en) Surface mount microminiature current fuse
JP2006302557A (en) Base board to base board connector
JPH09223531A (en) Wicking preventive mechanism of electric connector
JP4019474B2 (en) Method for manufacturing light emitting device
EP0384927B1 (en) Molded circuit board
JP3365882B2 (en) Structure to prevent solder wicking of electronic component terminals
JP4023698B2 (en) Manufacturing method of side-use electronic component with bottom electrode
JP4431756B2 (en) Resin-sealed semiconductor device
US7881067B2 (en) Circuit board assembly
JP3576030B2 (en) Semiconductor device and manufacturing method thereof
JP3751472B2 (en) Double-sided pattern sheet metal parts and printed wiring board
US20050064745A1 (en) Terminal for electrical connector
KR100245381B1 (en) Electronic component
JP2007012483A (en) Male connector
JPH10303060A (en) Electronic component
JPH1051034A (en) Surface-mount electronic component, its manufacture, method for mounting the component on circuit board, and circuit board mounting the component
US20060037777A1 (en) Mounting structure of electronic components and mounting method thereof
JP3358844B2 (en) Chip type resistor
JP2000010500A (en) Liquid crystal display device
JPH0935784A (en) Contact
JPH09116078A (en) Sealed semiconductor device
JP2004349413A (en) Surface mounting clamp

Legal Events

Date Code Title Description
A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20041102

RD01 Notification of change of attorney

Free format text: JAPANESE INTERMEDIATE CODE: A7421

Effective date: 20041214

RD01 Notification of change of attorney

Free format text: JAPANESE INTERMEDIATE CODE: A7421

Effective date: 20050624

A977 Report on retrieval

Free format text: JAPANESE INTERMEDIATE CODE: A971007

Effective date: 20070608

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20070612

A521 Written amendment

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20070806

TRDD Decision of grant or rejection written
A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

Effective date: 20070904

A61 First payment of annual fees (during grant procedure)

Free format text: JAPANESE INTERMEDIATE CODE: A61

Effective date: 20070917

FPAY Renewal fee payment (prs date is renewal date of database)

Free format text: PAYMENT UNTIL: 20101005

Year of fee payment: 3

FPAY Renewal fee payment (prs date is renewal date of database)

Free format text: PAYMENT UNTIL: 20101005

Year of fee payment: 3

FPAY Renewal fee payment (prs date is renewal date of database)

Free format text: PAYMENT UNTIL: 20111005

Year of fee payment: 4

FPAY Renewal fee payment (prs date is renewal date of database)

Free format text: PAYMENT UNTIL: 20121005

Year of fee payment: 5