JP3980621B2 - Electronic component feeder - Google Patents

Electronic component feeder Download PDF

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Publication number
JP3980621B2
JP3980621B2 JP2006052122A JP2006052122A JP3980621B2 JP 3980621 B2 JP3980621 B2 JP 3980621B2 JP 2006052122 A JP2006052122 A JP 2006052122A JP 2006052122 A JP2006052122 A JP 2006052122A JP 3980621 B2 JP3980621 B2 JP 3980621B2
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tape
electronic component
tape guide
chip
lever
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JP2006148171A (en
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中 一 博 竹
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Nagata Seiki Co Ltd
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Nagata Seiki Co Ltd
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Description

本発明は、電子部品を安定した状態で供給する電子部品供給装置に関する。   The present invention relates to an electronic component supply device that supplies electronic components in a stable state.

この種の電子部品供給装置は、機枠の前端部にチップテープ間欠送り機構および機枠下部にテープガイド部のロック機構を設けて構成されていて、プリント基板に電子部品を実装する場合、チップテープを電子部品装着装置のヘッド部に設けた押し棒および電子部品供給装置に設けたプッシュレバーにより所定量だけ送り、チップテープにより吸着点まで搬送されたチップ部品を電子部品装着装置のヘッド部に設けたノズルにより吸着し、チップ部品を予めプログラムされた実装対象の基板上の所定の位置に一定の精度で実装する。ここで、チップテープとは、チップ部品を所定間隔に置いて収容したテープをいう。   This type of electronic component supply device is configured by providing a chip tape intermittent feed mechanism at the front end of the machine frame and a tape guide locking mechanism at the lower part of the machine frame, and when mounting electronic components on a printed circuit board, The tape is fed by a predetermined amount by the push rod provided on the head of the electronic component mounting device and the push lever provided on the electronic component supply device, and the chip component conveyed to the suction point by the chip tape is transferred to the head portion of the electronic component mounting device. The chip component is sucked by the provided nozzle, and the chip component is mounted at a predetermined position on a predetermined substrate to be mounted with a certain accuracy. Here, the chip tape refers to a tape in which chip parts are accommodated at predetermined intervals.

また、上記電子部品供給装置においては、チップテープを上下方向に遊びのないように規制する手段として、例えば、板状のロックレバーにより機械的にロックする方法が採用されている。   In the electronic component supply apparatus, as a means for regulating the chip tape so as not to play in the vertical direction, for example, a method of mechanically locking with a plate-like lock lever is employed.

上記電子部品供給装置は、テープガイド部のロック機構が機枠下部に配置されているので、電子部品装着装置にセットした多数の電子部品供給装置に対してチップテープを補給する場合、電子部品供給装置を取り外してチップテープの補給を行なう必要がある。   In the above electronic component supply device, the tape guide locking mechanism is arranged at the lower part of the machine frame, so when supplying chip tape to a large number of electronic component supply devices set in the electronic component mounting device, the electronic component supply It is necessary to remove the device and supply the chip tape.

また、上記電子部品供給装置は、板状のロックレバーにより機械的にロックするため、構成部品の完成精度によっては精度のばらつきが生じロックレバー自体にチップテープとの隙間の調整機構を設ける必要が生じ、スペース的な制約とコストアップの要因になる。   In addition, since the electronic component supply device is mechanically locked by a plate-like lock lever, the accuracy varies depending on the completion accuracy of the component parts, and the lock lever itself needs to be provided with a mechanism for adjusting a gap with the chip tape. Resulting in space constraints and increased costs.

本発明は、上記した点に鑑みてなされたもので、電子部品装着装置側のノズルによる安定したチップの吸着が可能となり、安定した部品供給を行うことが可能な電子部品供給装置を提供することを目的とする。   The present invention has been made in view of the above points, and provides an electronic component supply device capable of stably adsorbing chips by a nozzle on the electronic component mounting device side and capable of supplying a stable component. With the goal.

本発明の電子部品供給装置は、機枠の前端部一側にチップテープ間欠送り機構を設け、チップテープを電子部品装着装置に間欠送りする電子部品供給装置において、機枠の前端部他側にチップテープのテープを押さえるテープガイドとテープガイドをロックするロック機構を設け、テープガイドは回動可能に機枠に軸着され、ロック機構はピンを設けた弾性部材を備えテープガイドを覆うように配置され、機枠には偏芯ピンが設けられ、テープガイドは、弾性部材のピンが挿入されるテープガイドの位置を規制するための孔と機枠に設けた偏芯ピンが嵌入されるテープガイドの閉鎖位置における間隔を規制するための孔とを有する。 The electronic component supply device of the present invention is provided with a chip tape intermittent feed mechanism on one side of the front end portion of the machine frame, and in the electronic component supply device that intermittently feeds the chip tape to the electronic component mounting device, on the other side of the front end portion of the machine frame. A tape guide that holds the tape of the chip tape and a lock mechanism that locks the tape guide are provided, the tape guide is pivotally mounted on the machine frame, and the lock mechanism is provided with an elastic member provided with a pin so as to cover the tape guide An eccentric pin is provided on the machine frame, and the tape guide is a tape into which the eccentric pin provided on the machine frame and a hole for regulating the position of the tape guide into which the pin of the elastic member is inserted And a hole for restricting the interval at the closed position of the guide .

本発明によれば、チップテープの上下左右方向の動きを規制するロック機構により電子部品装着装置側のノズルによる安定したチップの吸着が可能となり、安定した部品供給を行うことを可能にする。   According to the present invention, the lock mechanism that restricts the movement of the chip tape in the up / down / left / right directions enables the chip to be stably adsorbed by the nozzle on the electronic component mounting apparatus side, thereby enabling stable component supply.

以下、本発明による電子部品供給装置の一実施形態について、添付の図面を参照しながら説明する。
図１は本発明による電子部品供給装置を示し、電子部品供給装置の機枠１の前端部一側には、図１および図２に示すように、ラチェット２およびレバー３が配置されている。ラチェット２およびレバー３は、押さえ板４を介して支軸５に回動可能に保持されている。レバー３にピン６が突設されている。ピン６に送り爪７および連結板８が軸支されている。ピン６に設けた送り爪７は、スプリング（図示なし）により常時ラチェット２に係合するようにばね付勢されている。連結板８は、緩衝機構を構成する緩衝ばね９を介して連結板１０に連結されている。 Hereinafter, an electronic component supply device according to an embodiment of the present invention will be described with reference to the accompanying drawings.
FIG. 1 shows an electronic component supply apparatus according to the present invention. A ratchet 2 and a lever 3 are arranged on one side of a front end portion of a machine casing 1 of the electronic component supply apparatus as shown in FIGS. The ratchet 2 and the lever 3 are rotatably held on the support shaft 5 via the pressing plate 4. A pin 6 protrudes from the lever 3. A feed claw 7 and a connecting plate 8 are pivotally supported on the pin 6. The feed claw 7 provided on the pin 6 is spring-biased so as to be always engaged with the ratchet 2 by a spring (not shown). The connecting plate 8 is connected to the connecting plate 10 via a buffer spring 9 constituting a buffer mechanism.

すなわち、連結板８は、図４および図５に示すように、ピン６と反対側の端部に緩衝ばね９の巻線部９ａに対応する溝を形成した突部８ａを有する。また、連結板１０は、端部に緩衝ばね９の巻線部９ａに対応する溝を形成した突部１０ａを有する。   That is, as shown in FIGS. 4 and 5, the connecting plate 8 has a protrusion 8 a in which a groove corresponding to the winding portion 9 a of the buffer spring 9 is formed at the end opposite to the pin 6. In addition, the connecting plate 10 has a protrusion 10 a in which a groove corresponding to the winding portion 9 a of the buffer spring 9 is formed at the end.

連結板８の突部８ａを緩衝ばね９の一端側に挿入し、突部８ａの溝に緩衝ばね９の巻線部９ａを係合することで連結板８に緩衝ばね９の一端側が連結される。同様に、連結板１０の突部１０ａを緩衝ばね９の他端側に挿入し、突部１０ａの溝に緩衝ばね９の巻線部９ａを係合することで連結板１０に緩衝ばね９の他端側が連結される。   The protrusion 8a of the coupling plate 8 is inserted into one end side of the buffer spring 9, and the coil spring 9a of the buffer spring 9 is engaged with the groove of the projection 8a so that one end side of the buffer spring 9 is coupled to the coupling plate 8. The Similarly, the protrusion 10a of the coupling plate 10 is inserted into the other end of the buffer spring 9, and the winding portion 9a of the buffer spring 9 is engaged with the groove of the projection 10a, whereby the buffer plate 9 is connected to the coupling plate 10. The other end side is connected.

しかして、連結板８と連結板１０は、緩衝ばね９により弾性的に連結されるので、連結板８と連結板１０は、図４に示す緩衝ばね９の圧縮状態においても図５に示す緩衝ばね９の伸長状態においても直接当接することがなく、連結板１０の送り量は、緩衝ばね９を介して連結板８に伝えられることになり、連結板１０の過剰な送り量は緩衝ばね９により緩衝される。   Therefore, since the connecting plate 8 and the connecting plate 10 are elastically connected by the buffer spring 9, the connecting plate 8 and the connecting plate 10 are also shown in FIG. 5 even in the compressed state of the buffer spring 9 shown in FIG. There is no direct contact even when the spring 9 is extended, and the feed amount of the connecting plate 10 is transmitted to the connecting plate 8 via the buffer spring 9, and the excess feed amount of the connecting plate 10 is transmitted to the buffer spring 9. Buffered by

上記連結板１０の緩衝ばね９と反対側の端部はピン１１を介してレバー１２の一端に連結されている。このレバー１２は、中央部分を軸１３を介して機枠１に回動可能に軸支されている。このレバー１２の連結板１０と反対側の端部はピン１４を介して連結板１５に連結されている。連結板１５のレバー１２と反対側の端部はピン１６を介してレバー１７に連結されている。レバー１７は、中央部分を軸１８により機枠１に軸支されている。レバー１７は、図示を省略した駆動手段によって軸１８を中心に揺動する。このレバー１７の揺動は、レバー１７と機枠１を連結するスプリング１９により規制されている。   The end of the connecting plate 10 opposite to the buffer spring 9 is connected to one end of the lever 12 via a pin 11. The lever 12 is pivotally supported by the machine frame 1 through a shaft 13 at the center portion. The end of the lever 12 opposite to the connecting plate 10 is connected to the connecting plate 15 via a pin 14. The end of the connecting plate 15 opposite to the lever 12 is connected to the lever 17 via a pin 16. The lever 17 is pivotally supported on the machine frame 1 by a shaft 18 at the center. The lever 17 swings around the shaft 18 by driving means (not shown). The swing of the lever 17 is regulated by a spring 19 that connects the lever 17 and the machine casing 1.

一方、上記機枠１の送り爪７の近傍には偏芯ストッパー２０が取付けられている。この偏芯ストッパー２０は、送り爪７がラチェット２を送る際に、送り爪７に当接して送り爪７の正確な位置を規制する。同様に、レバー１７の近傍にも偏芯ストッパー２１が取付けられている。この偏芯ストッパー２１は、レバー１７の作動量を規制する。   On the other hand, an eccentric stopper 20 is attached in the vicinity of the feed claw 7 of the machine frame 1. The eccentric stopper 20 abuts on the feed claw 7 when the feed claw 7 sends the ratchet 2 and regulates the exact position of the feed claw 7. Similarly, an eccentric stopper 21 is attached in the vicinity of the lever 17. The eccentric stopper 21 regulates the operation amount of the lever 17.

上記電子部品供給装置は、底面に設けた基準ピン２２，２３を電子部品装着装置に設けた係合孔（図示なし）に挿着することで電子部品装着装置の所定位置にセットされる。電子部品供給装置に装着されるチップテープ２４は、図示しないチップ部品を基板上の所定の位置に実装した後、チップテープ２４のカバーテープ２５がカバーテープ巻取部２６に巻き取られ、キャリアテープ２８が案内部２７に沿って外部に送り出される。   The electronic component supply device is set at a predetermined position of the electronic component mounting device by inserting the reference pins 22 and 23 provided on the bottom surface into engagement holes (not shown) provided in the electronic component mounting device. The chip tape 24 to be mounted on the electronic component supply device is such that a chip component (not shown) is mounted at a predetermined position on the substrate, and then the cover tape 25 of the chip tape 24 is wound around the cover tape take-up portion 26 and the carrier tape. 28 is sent out along the guide 27.

また、上記機枠１の前端部他側には、図３に示すように、テープガイド３０が軸３１により回動可能に配設されている。このテープガイド３０には孔３２，３３が設けられている。また、テープガイド３０を覆いテープガイド３０をロックするように弾性部材３４が取付けられている。   Further, as shown in FIG. 3, a tape guide 30 is rotatably disposed on a shaft 31 on the other side of the front end portion of the machine casing 1. The tape guide 30 is provided with holes 32 and 33. An elastic member 34 is attached so as to cover the tape guide 30 and lock the tape guide 30.

この弾性部材３４は、ピン３５を有し、このピン３５をテープガイド３０の孔３３に挿入することによりテープガイド３０の位置を規制する。また、テープガイド３０は、テープガイド３０に設けた孔３２を機枠１に設けた偏芯ピン３６に嵌入することにより、テープガイド３０の閉鎖位置における間隔が規制される。   The elastic member 34 has a pin 35, and the position of the tape guide 30 is regulated by inserting the pin 35 into the hole 33 of the tape guide 30. Further, the tape guide 30 is regulated in the interval at which the tape guide 30 is closed by fitting the hole 32 provided in the tape guide 30 into the eccentric pin 36 provided in the machine frame 1.

つぎに、本発明による電子部品供給装置の作用を説明する。
レバー１７が、図示を省略したエアシリンダの作動により図１で矢印Ａ方向に動くと、このレバー１７は軸１８を中心に反時計方向に回動し、レバー１７に連結した連結板１５を介して軸１３に軸支されたレバー１２が反時計方向へ回動する。このレバー１２が反時計方向へ回動すると、このレバー１２にピン１１で連結された連結板１０に緩衝バネ９を介して連結された連結板８が引っ張り作用を受ける。この連結板８が動くと、連結板８にピン６で軸支された送り爪７がピン６を中心に回動し、送り爪７がラチェット２を所定角度回動する。この送り爪７の送り量は偏芯ストッパー２０により規制されているので、送り爪７の送り時においては、緩衝ばね９は、図５に示すように伸長して連結板１０による送り量を緩衝し、送り爪７の戻り時には、スプリング１９によるレバー１７の戻りにより、レバー１７が緩衝ばね９を図４に示す圧縮状態で連結板１０による送り量を緩衝する状態で偏芯ストッパー２１に突き当たる。このように、送り爪７は、送り時よび戻り時の両方において作用が規制されるので、送り爪７によるラチェットの送りは確実に行なわれる。 Next, the operation of the electronic component supply apparatus according to the present invention will be described.
When the lever 17 is moved in the direction of arrow A in FIG. 1 by the operation of the air cylinder (not shown), the lever 17 rotates counterclockwise about the shaft 18 and is connected via the connecting plate 15 connected to the lever 17. Thus, the lever 12 pivotally supported by the shaft 13 rotates counterclockwise. When the lever 12 rotates counterclockwise, the connecting plate 8 connected to the connecting plate 10 connected to the lever 12 by the pin 11 via the buffer spring 9 is subjected to a pulling action. When the connecting plate 8 moves, the feed claw 7 pivotally supported on the connecting plate 8 by the pin 6 rotates about the pin 6, and the feed claw 7 rotates the ratchet 2 by a predetermined angle. Since the feed amount of the feed claw 7 is regulated by the eccentric stopper 20, when the feed claw 7 is fed, the buffer spring 9 extends as shown in FIG. 5 to buffer the feed amount by the connecting plate 10. When the feed claw 7 returns, the lever 17 returns to the eccentric stopper 21 in a state where the buffer spring 9 buffers the feed amount by the connecting plate 10 in the compressed state shown in FIG. In this way, the action of the feeding claw 7 is restricted both during feeding and when returning, so that the ratchet is reliably fed by the feeding claw 7.

一方、図６に示すテープガイド３０のセット位置において、弾性部材３４の上部を機枠１から離れる方向に開くと、弾性部材３４に設けたピン３５がテープガイド３０の孔３３から外れる。   On the other hand, when the upper portion of the elastic member 34 is opened away from the machine frame 1 at the set position of the tape guide 30 shown in FIG. 6, the pin 35 provided on the elastic member 34 is removed from the hole 33 of the tape guide 30.

この状態において、テープガイド３０を図７で矢印Ｂに示す方向に押すと、テープガイド３０は、図７で２点鎖線で示す位置から実線で示す位置に軸３１を中心に回動する。これにより、テープガイド３０の先端部は機枠１から上昇した位置にある。   In this state, when the tape guide 30 is pushed in the direction indicated by the arrow B in FIG. 7, the tape guide 30 rotates around the shaft 31 from the position indicated by the two-dot chain line in FIG. 7 to the position indicated by the solid line. As a result, the tip of the tape guide 30 is at a position raised from the machine casing 1.

図８に示すテープガイド３０の先端部が上昇した位置においては、先端部が機枠１から上昇し、テープガイド３０と機枠１の間に空間が形成されるので、電子部品供給装置を取り外すことなく、チップテープ２４の補給を装置後方より行なうことができる。   At the position where the tip portion of the tape guide 30 shown in FIG. 8 is raised, the tip portion rises from the machine casing 1 and a space is formed between the tape guide 30 and the machine casing 1, so that the electronic component supply device is removed. The chip tape 24 can be replenished from the rear of the apparatus.

チップテープ２４の補給が終わったら、弾性部材３４の上部を機枠１から離れる方向に開くと、テープガイド３０の軸３１に格納してある巻スプリング（図示なし）によりテープガイド３０が時計方向に回動し、テープガイド３０は通常動作の体制に入る。この状態に置いて、テープガイド３０の先端部を図９で矢印Ｃで示す方向に押すと、テープガイド３０は図６に示すセット位置に戻される。テープガイド３０の図８に示すセット位置においては、テープガイド３０の孔３２に偏芯ピン３６が係合するので、チップテープ２４は確実に押さえられ、チップテープ２４の送りが可能になる。   When the replenishment of the chip tape 24 is completed, when the upper part of the elastic member 34 is opened away from the machine frame 1, the tape guide 30 is rotated clockwise by a winding spring (not shown) stored in the shaft 31 of the tape guide 30. The tape guide 30 is rotated and enters a normal operation system. In this state, when the tip of the tape guide 30 is pushed in the direction indicated by the arrow C in FIG. 9, the tape guide 30 is returned to the set position shown in FIG. In the set position shown in FIG. 8 of the tape guide 30, the eccentric pin 36 engages with the hole 32 of the tape guide 30, so that the chip tape 24 is securely pressed and the chip tape 24 can be fed.

本発明によるの電子部品供給装置の概略を示す図。The figure which shows the outline of the electronic component supply apparatus by this invention. 本発明による電子部品供給装置の先端部分を右上からみた斜視図。The perspective view which looked at the front-end | tip part of the electronic component supply apparatus by this invention from the upper right. 本発明による電子部品供給装置の先端部分を左上からみた斜視図。The perspective view which looked at the front-end | tip part of the electronic component supply apparatus by this invention from the upper left. 緩衝機構の圧縮した状態を示す図。The figure which shows the state which the buffer mechanism compressed. 緩衝機構の伸長した状態を示す図。The figure which shows the state which the buffer mechanism extended. 本発明による電子部品供給装置のテープガイドのセット段階を示す図。The figure which shows the setting step of the tape guide of the electronic component supply apparatus by this invention. 本発明による電子部品供給装置のテープガイドの第１動作段階を示す図。The figure which shows the 1st operation | movement stage of the tape guide of the electronic component supply apparatus by this invention. 本発明による電子部品供給装置のテープガイドの第２動作段階を示す図。The figure which shows the 2nd operation | movement stage of the tape guide of the electronic component supply apparatus by this invention. 本発明による電子部品供給装置のテープガイドにチップテープ２４を装着した状態を示す図。The figure which shows the state which mounted | wore the chip tape 24 with the tape guide of the electronic component supply apparatus by this invention.

符号の説明Explanation of symbols

１ 機枠
２ ラチェット
３ レバー
４ 押さえ板
５ 支軸
７ 送り爪
８ 連結板
９ 緩衝バネ
１０ 連結板
１２ レバー
１５ 連結板
１７ レバー
２４ チップテープ
３０ テープガイド
３１ 軸
３２ 孔
３３ 孔
３４ 弾性部材 DESCRIPTION OF SYMBOLS 1 Machine frame 2 Ratchet 3 Lever 4 Holding plate 5 Support shaft 7 Feeding claw 8 Connection plate 9 Buffer spring 10 Connection plate 12 Lever 15 Connection plate 17 Lever 24 Chip tape 30 Tape guide 31 Axis 32 Hole 33 Hole 34 Elastic member

Claims (1)

機枠の前端部一側にチップテープ間欠送り機構を設け、チップテープを電子部品装着装置に間欠送りする電子部品供給装置において、上記機枠の前端部他側にチップテープのテープを押さえるテープガイドとテープガイドをロックするロック機構を設け、テープガイドは回動可能に機枠に軸着され、ロック機構はピンを設けた弾性部材を備えテープガイドを覆うように配置され、機枠には偏芯ピンが設けられ、テープガイドは、弾性部材のピンが挿入されるテープガイドの位置を規制するための孔と、機枠に設けた偏芯ピンが嵌入されるテープガイドの閉鎖位置における間隔を規制するための孔とを有することを特徴とする電子部品供給装置。 In an electronic component supply device that has a chip tape intermittent feed mechanism on one side of the front end of the machine frame and intermittently feeds the chip tape to the electronic component mounting device, a tape guide that holds the tape of the chip tape to the other side of the front end of the machine frame And a lock mechanism for locking the tape guide . The tape guide is pivotally attached to the machine frame, and the lock mechanism is arranged to cover the tape guide with an elastic member provided with a pin. A core pin is provided, and the tape guide has a gap between a hole for restricting the position of the tape guide into which the pin of the elastic member is inserted and a closed position of the tape guide into which the eccentric pin provided on the machine frame is inserted. An electronic component supply device comprising a hole for regulating .
JP2006052122A 2006-02-28 2006-02-28 Electronic component feeder Expired - Lifetime JP3980621B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2006052122A JP3980621B2 (en) 2006-02-28 2006-02-28 Electronic component feeder

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Application Number Priority Date Filing Date Title
JP2006052122A JP3980621B2 (en) 2006-02-28 2006-02-28 Electronic component feeder

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
JP23447896A Division JP3801693B2 (en) 1996-09-04 1996-09-04 Electronic component feeder

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JP2006148171A JP2006148171A (en) 2006-06-08
JP3980621B2 true JP3980621B2 (en) 2007-09-26

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104813761A (en) * 2012-11-28 2015-07-29 松下知识产权经营株式会社 Tape feeder

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5021368B2 (en) * 2007-05-29 2012-09-05 株式会社日立ハイテクインスツルメンツ Parts supply device
KR101546431B1 (en) 2009-01-05 2015-08-25 한화테크윈 주식회사 Tape guide reorganization structure of tape feeder

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104813761A (en) * 2012-11-28 2015-07-29 松下知识产权经营株式会社 Tape feeder
US9611115B2 (en) 2012-11-28 2017-04-04 Panasonic Intellectual Property Management Co., Ltd. Tape feeder

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