JP3950836B2 - Vehicle control device - Google Patents

Vehicle control device Download PDF

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JP3950836B2
JP3950836B2 JP2003356700A JP2003356700A JP3950836B2 JP 3950836 B2 JP3950836 B2 JP 3950836B2 JP 2003356700 A JP2003356700 A JP 2003356700A JP 2003356700 A JP2003356700 A JP 2003356700A JP 3950836 B2 JP3950836 B2 JP 3950836B2
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gate
power conversion
conversion unit
gate substrate
semiconductor element
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JP2005124308A (en
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成 博 昭 吉
入 正 樹 宮
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Toshiba Corp
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Toshiba Corp
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Abstract

<P>PROBLEM TO BE SOLVED: To provide a controller for a vehicle which is hardly affected by an influence of an electromagnetic noise by most shortening a semiconductor element gate of a power conversion unit, gate wiring between a gate substrate and a control unit. <P>SOLUTION: The controller for the vehicle includes the power conversion unit 2B containing the semiconductor element, a smoothing capacitor 6, a conductor 7 of a thin plate structure for electrically connecting the power conversion unit 2B and the smoothing capacitor 6, a gate substrate 3A for driving the gate of the semiconductor element, the control unit 4 for controlling the gate substrate, and the gate wiring 5B for electrically connecting between the gate substrate and the control unit, individually contained in a case 1 installed under a floor of a railway vehicle for forming a sealed chamber to perform a power conversion by switching the semiconductor element. A gate substrate connector 3B for connecting the gate substrate 3A is disposed to a position deviated to side of the one vehicle body from a center of a sleeper direction of the sealed chamber, and the gate wiring is connected to this gate substrate connector. <P>COPYRIGHT: (C)2005,JPO&amp;NCIPI

Description

本発明は、車両用制御装置に関する。   The present invention relates to a vehicle control device.

車両用制御装置は、主に、電力変換用半導体素子、冷却装置、電源及び半導体素子のゲート基板、平滑コンデンサなどを含む電力変換ユニットと、この電力変換ユニットを制御する制御ユニットとで構成されている。   The vehicle control device is mainly composed of a power conversion unit including a power conversion semiconductor element, a cooling device, a power source and a gate substrate of the semiconductor element, a smoothing capacitor, and the like, and a control unit for controlling the power conversion unit. Yes.

電力変換ユニットと制御ユニットとの間のゲート配線は、電力変換ユニットの裏側に導出され、レール方向に並べて配置された制御ユニットの裏側に通され、この制御ユニットの前面にて結線されている。このような配線経路は電力変換ユニットと制御ユニットとを接続するのに理想とする最短距離よりもかなり長くなってしまう。ゲート配線は配線長が長くなるほど電磁ノイズの影響を受けやすなるため、この影響を緩和するためのコアをゲート配線上に設ける必要があった。   The gate wiring between the power conversion unit and the control unit is led out to the back side of the power conversion unit, passed through the back side of the control unit arranged side by side in the rail direction, and connected at the front surface of the control unit. Such a wiring path is considerably longer than the shortest distance ideal for connecting the power conversion unit and the control unit. Since the gate wiring becomes more susceptible to electromagnetic noise as the wiring length becomes longer, it is necessary to provide a core for mitigating this influence on the gate wiring.

平滑コンデンサは電力変換ユニットの背面部を覆うように配置されており、ゲート基板は平滑コンデンサを避ける位置に配置する必要があることから、電力変換ユニットの半導体素子の近辺に配置することが難しかった。さらに、電力変換ユニットの各相のＰ，Ｎ端子を接続している薄板導体は電力変換ユニット内に半導体素子をカバーするように固定して設置されているため、ゲート基板はこの薄板導体よりも半導体素子側に設置することができなかった。   Since the smoothing capacitor is arranged so as to cover the back part of the power conversion unit, and the gate substrate needs to be arranged at a position avoiding the smoothing capacitor, it is difficult to arrange the smoothing capacitor in the vicinity of the semiconductor element of the power conversion unit. . Further, since the thin plate conductor connecting the P and N terminals of each phase of the power conversion unit is fixed and installed so as to cover the semiconductor element in the power conversion unit, the gate substrate is more than the thin plate conductor. It could not be installed on the semiconductor element side.

図９は電力変換ユニット、平滑コンデンサ、制御装置の従来の代表的な車両用制御装置を水平に切断して車体への取付側から見た断面図である（例えば、特許文献１参照。）。同図において、電力変換ユニット２Ａは、箱体１の外側に突出させた状態に取り付けられた冷却装置１４の冷却器ブロック部に半導体素子が取付けられ、各相のＰ，Ｎ接続端子７ａは薄板導体７に接続されている。平滑コンデンサ６は電力変換ユニット２Ａの内部もしくは車両用制御ユニット４側に配置されるが、図示したように、電力変換ユニット２Ａの内部に配置された場合には各相のＰ，Ｎ接続端子７ａの導出側を覆うように配置されるため、これらＰ，Ｎ接続端子７ａに対する点検、取付け、取り外しの作業が難しかった。   FIG. 9 is a cross-sectional view of a conventional typical vehicle control device including a power conversion unit, a smoothing capacitor, and a control device, as viewed from the side attached to the vehicle body (see, for example, Patent Document 1). In the figure, a power conversion unit 2A has a semiconductor element mounted on a cooler block portion of a cooling device 14 mounted in a state of projecting to the outside of a box 1, and P and N connection terminals 7a for each phase are thin plates. It is connected to the conductor 7. The smoothing capacitor 6 is arranged inside the power conversion unit 2A or on the vehicle control unit 4 side. However, when it is arranged inside the power conversion unit 2A, as shown in the figure, the P and N connection terminals 7a of each phase. Since it is arranged so as to cover the lead-out side, it is difficult to perform inspection, attachment, and removal operations on these P and N connection terminals 7a.

また、ゲート基板３Ａは平滑コンデンサ６の横もしくは分割配置された平滑コンデンサの間に収納可能ではあるが、ゲート基板コネクタ３Ｂの挿脱の操作性を確保するために、Ｐ，Ｎ薄板導体７の後方に配置され、ゲート基板３Ａと制御ユニット４とを接続するゲート配線５Ｂは、制御ユニット４の裏側に引き回され、ゲート配線５Ｂの途中の経路にコア１７が設けられる。この電力変換ユニット２Ａはブレーキチョッパ部１５Ａを含み、このブレーキチョッパ部１５Ａは他の電力変換部とはユニット構造が異なっており、Ｐ，Ｎ薄板導体７及びブレーキチョッパコンデンサ１１は他の電力変換部と併置されてはいなかった。
特開２０００−２７８９３４号公報 Further, the gate substrate 3A can be accommodated between the smoothing capacitors arranged beside or separately from the smoothing capacitor 6, but in order to ensure the operability of inserting and removing the gate substrate connector 3B, the P and N thin plate conductors 7 The gate wiring 5B that is arranged behind and connects the gate substrate 3A and the control unit 4 is routed to the back side of the control unit 4, and a core 17 is provided in a path in the middle of the gate wiring 5B. The power conversion unit 2A includes a brake chopper portion 15A. The brake chopper portion 15A has a unit structure different from that of other power conversion portions, and the P and N thin plate conductors 7 and the brake chopper capacitor 11 include other power conversion portions. Was not juxtaposed with.
JP 2000-278934 A

従来の車両用制御装置のゲート基板３Ａと制御ユニット４とを接続するゲート配線５Ｂは、制御ユニット４の裏側に引きまわされる結果、配線経路は理想的な最短配線長よりもかなり長く、配線経路上にノイズ対策用コアを設置しないと電磁ノイズの影響を受けやすく、誤制御の原因になりやすかった。   As a result of the gate wiring 5B connecting the gate substrate 3A and the control unit 4 of the conventional vehicle control device being drawn to the back side of the control unit 4, the wiring path is considerably longer than the ideal shortest wiring length. Unless a noise countermeasure core was installed on the top, it was easily affected by electromagnetic noise and could easily cause erroneous control.

その理由は、電力変換ユニット２Ａに平滑コンデンサ６、Ｐ，Ｎ薄板導体７及びゲート基板３Ａが一体構造となっていることと、一体型の平滑コンデンサ６の占めるスペースが大きく、このスペース以外でゲート基板３Ａの操作性を考慮してゲート基板３Ａを配置しようとすると、ゲート基板３Ａを制御ユニット４から離さざるを得ないことによる。そこで、もしも、半導体素子のゲートの近傍にゲート基板を配置しようとすると、平滑コンデンサの形状が複雑なものになってしまう。さらに、Ｐ，Ｎ薄板導体７は半導体素子の前面に配置されるため、半導体素子ゲートに近づけることは難しかった。   The reason is that the smoothing capacitor 6, the P and N thin plate conductors 7 and the gate substrate 3A are integrated in the power conversion unit 2A, and the space occupied by the integrated smoothing capacitor 6 is large. If the gate substrate 3A is to be arranged in consideration of the operability of the substrate 3A, the gate substrate 3A must be separated from the control unit 4. Therefore, if the gate substrate is arranged in the vicinity of the gate of the semiconductor element, the shape of the smoothing capacitor becomes complicated. Furthermore, since the P and N thin plate conductors 7 are arranged in front of the semiconductor element, it is difficult to bring them close to the gate of the semiconductor element.

また、車両用制御装置の電力変換ユニット２Ａはブレーキチョッパユニットを含んでおり、ブレーキチョッパ部分は他の電力変換部と構造が異なっているため、最短距離でゲート基板３Ａと制御ユニット４とをゲート配線５Ｂで接続しようとすると、その配線経路とブレーキチョッパ部分とが干渉するため、ゲート基板３Ａと制御ユニット４との間の理想的な最短ゲート配線はできない構造になっていた。   Further, the power conversion unit 2A of the vehicle control device includes a brake chopper unit, and the brake chopper part is different in structure from the other power conversion units, so the gate substrate 3A and the control unit 4 are gated at the shortest distance. If the wiring 5B is to be connected, the wiring path and the brake chopper part interfere with each other, so that an ideal shortest gate wiring between the gate substrate 3A and the control unit 4 cannot be formed.

そこで、本発明は、電力変換ユニットの半導体素子ゲート、ゲート基板及び制御ユニット間のゲート配線を最短化して電磁ノイズの影響を受け難い車両用制御装置を提供することを目的とする。   Therefore, an object of the present invention is to provide a vehicle control device that is less susceptible to electromagnetic noise by minimizing the gate wiring between the semiconductor element gate, the gate substrate, and the control unit of the power conversion unit.

請求項１に係る発明は、鉄道車両の床下に設置され、半導体素子のスイッチングにより電力変換を行なう車両用制御装置において、密閉室を形成する箱体に、半導体素子が収納された電力変換ユニット、平滑コンデンサ、これらを電気的に接続する薄板構造の導体、前記半導体素子のゲートを駆動するゲート基板、前記ゲート基板を制御する制御ユニット、前記ゲート基板及び前記制御ユニット間を電気的に接続するゲート配線が個々に収納され、前記密閉室の枕木方向中央よりも一方の車体の側方に偏倚させた位置にゲート基板を接続するためのゲート基板コネクタが配置され、このゲート基板コネクタに前記ゲート配線が接続され、更に、前記半導体素子が収納された電力変換ユニットも、前記密閉室の枕木方向中央よりも一方の車体の側方に偏倚させた位置に配置され、前記平滑コンデンサは１個の電力変換ユニットに対して２個備えられ、これらが電力変換ユニットのレール方向の両端部に分割配置され、前記電力変換ユニットの主回路端子及び前記ゲート基板コネクタが分割配置された前記平滑コンデンサに挟まれる位置に配置されている、ことを特徴とする。 The invention according to claim 1 is a vehicle control device that is installed under the floor of a railway vehicle and performs power conversion by switching of the semiconductor elements, and a power conversion unit in which a semiconductor element is housed in a box that forms a sealed chamber, A smoothing capacitor, a conductor having a thin plate structure for electrically connecting them, a gate substrate for driving the gate of the semiconductor element, a control unit for controlling the gate substrate, and a gate for electrically connecting the gate substrate and the control unit A gate substrate connector for connecting the gate substrate is disposed at a position where the wiring is individually stored and is biased to the side of one vehicle body from the center of the sealed room in the sleeper direction, and the gate wiring is connected to the gate substrate connector. There are connected, further, the semiconductor element is housed a power conversion unit is also the sealed chamber sleepers direction center than the one body of Disposed towards was biased position, the smoothing capacitor 2 provided for one power conversion unit, it is divided and arranged at both ends of the rail direction of the power conversion unit, the main of the power converter unit The circuit terminal and the gate substrate connector are disposed at positions sandwiched between the divided smoothing capacitors.

本発明によれば、電力変換ユニット、平滑コンデンサ、薄板導体は、ゲート基板への操作性能を低下させることが無いように配置されるため、ゲート基板を電力変換ユニットの半導体素子近傍に設置することができるので、ゲート基板と半導体ゲート間の配線距離を最短にすることができる。さらに、車両枕木方向に電力変換ユニット、ゲート基板、Ｐ，Ｎ薄板導体、平滑コンデンサの順に車両制御装置内で単独に配置できるため、任意の位置から制御ユニットへのゲート配線を引き出すことができる。このためゲート基板からの配線は薄板導体、平滑コンデンサを回避することなく、制御ユニットの前方から最短経路で引き回すことができる。このため、ゲート配線経路上にノイズ対策用のコアを設置しなくても対ノイズ性能を大幅に向上させることができるので、従来装置の課題であった電磁ノイズの影響を受け難い制御装置機器配置を提供することができる。   According to the present invention, since the power conversion unit, the smoothing capacitor, and the thin plate conductor are arranged so as not to deteriorate the operation performance to the gate substrate, the gate substrate is installed in the vicinity of the semiconductor element of the power conversion unit. Therefore, the wiring distance between the gate substrate and the semiconductor gate can be minimized. Furthermore, since the power conversion unit, the gate substrate, the P and N thin plate conductors, and the smoothing capacitor can be arranged independently in the vehicle sleeper order in the vehicle control device, the gate wiring to the control unit can be drawn from an arbitrary position. Therefore, the wiring from the gate substrate can be routed by the shortest path from the front of the control unit without avoiding the thin plate conductor and the smoothing capacitor. For this reason, it is possible to significantly improve noise performance without installing a noise countermeasure core on the gate wiring path. Can be provided.

以下、本発明を図面に示す好適な実施形態及び参考例に基づいて詳細に説明する。図１は本発明に係る車両用制御装置の第１の参考例の構成を説明するために、車体への取付端の近傍で水平に切断して車体への取付側から見た断面図であり、図２はそのＡ−Ａ矢視断面図である。図中、従来装置を示す図９と同一の要素には同一の符号を付してその説明を省略する。これら各図において、電力変換ユニット２Ｂは主に半導体素子及びその冷却装置１４で構成され、Ｐ，Ｎ薄板導体７は電力変換ユニット２Ｂから離隔配置され、電力変換ユニット２Ｂとは複数のボルトでＰ，Ｎ接続端子７ａに固定されている。Ｐ，Ｎ薄板導体７には電力変換ユニット２Ｂと反対側に配置された平滑コンデンサ６も接続される。ゲート基板３Ａは電力変換ユニット２ＢとＰ，Ｎ薄板導体７との間に配置されており、車両枕木方向に対して、電力変換ユニット２Ｂ、ゲート基板３Ａ、Ｐ，Ｎ接続端子７ａ及び平滑コンデンサ６の順に個々に配設される。このうち、特にゲート基板３Ａに付帯するゲート基板コネクタ３Ｂは、密閉室を構成する箱体１の枕木方向中央よりも一方の車体の側方に偏倚させた位置に配置され、このゲート基板コネクタ３Ｂにゲート配線が接続されている。また、ゲート基板３Ａと制御ユニット４とを接続するゲート配線５Ｂは、図１に示したように、Ｐ，Ｎ薄板導体７と電力変換ユニット２Ｂとの間に配置される。 Hereinafter, the present invention will be described in detail based on preferred embodiments and reference examples shown in the drawings. FIG. 1 is a cross-sectional view of a first reference example of a vehicle control apparatus according to the present invention, cut horizontally in the vicinity of an attachment end to a vehicle body and viewed from the attachment side to the vehicle body. FIG. 2 is a sectional view taken along the line AA. In the figure, the same elements as those in FIG. 9 showing the conventional apparatus are denoted by the same reference numerals, and the description thereof is omitted. In each of these drawings, the power conversion unit 2B is mainly composed of a semiconductor element and its cooling device 14, and the P and N thin plate conductors 7 are spaced apart from the power conversion unit 2B. , N connection terminal 7a. A smoothing capacitor 6 disposed on the opposite side of the power conversion unit 2B is also connected to the P and N thin plate conductors 7. The gate substrate 3A is disposed between the power conversion unit 2B and the P, N thin plate conductor 7, and the power conversion unit 2B, the gate substrate 3A, the P, N connection terminal 7a, and the smoothing capacitor 6 with respect to the vehicle sleeper direction. Are arranged individually in this order. Among these, the gate substrate connector 3B attached to the gate substrate 3A in particular is arranged at a position biased to the side of one vehicle body from the center of the sleeper direction of the box 1 constituting the sealed chamber, and this gate substrate connector 3B Is connected to the gate wiring. Further, the gate wiring 5B connecting the gate substrate 3A and the control unit 4 is disposed between the P and N thin plate conductors 7 and the power conversion unit 2B as shown in FIG.

かくして、第１の参考例によれば、平滑コンデンサ６及びＰ，Ｎ薄板導体７を電力変換ユニット２Ｂから離隔させて個々に配置することによって、電力変換ユニット２Ｂの半導体素子の近傍にゲート基板３Ａを配置することができる。このため、ゲート基板３Ａから制御ユニット４までのゲート配線５Ｂが、電力変換ユニット２Ｂの半導体素子とＰ，Ｎ薄板導体７との間で直線的な最短距離で配線することができる。これにより電磁ノイズの影響を受け難いゲート配線経路とすることができる。 Thus, according to the first reference example , the smoothing capacitor 6 and the P and N thin plate conductors 7 are individually arranged separately from the power conversion unit 2B, so that the gate substrate 3A is located near the semiconductor element of the power conversion unit 2B. Can be arranged. For this reason, the gate wiring 5B from the gate substrate 3A to the control unit 4 can be wired between the semiconductor element of the power conversion unit 2B and the P and N thin plate conductors 7 at a linear shortest distance. As a result, a gate wiring path that is not easily affected by electromagnetic noise can be obtained.

図３は本発明に係る車両用制御装置の第２の参考例の構成を説明するために、前述した図２中の平滑コンデンサ６を除去した状態を表し、さらに、平滑コンデンサ６と制御ユニット４とを分割収納する箱体１の側板の一部を破断して示した断面図であり、図１又は図２と同一の要素には同一の符号を付してその説明を省略する。この参考例は、電力変換ユニット２Ｂ、平滑コンデンサ６、Ｐ，Ｎ薄板導体７及び制御ユニット４を予め組み立てることなく、それぞれを単品として箱体１の内部に配置したものである。そして、ゲート配線５Ｂは制御ユニット４から下方の箱体１の底部に向かい、この箱体底部にてレール方向に施設される。 FIG. 3 shows a state in which the smoothing capacitor 6 in FIG. 2 is removed in order to explain the configuration of the second reference example of the vehicle control device according to the present invention. Further, the smoothing capacitor 6 and the control unit 4 are further shown. Is a cross-sectional view showing a part of the side plate of the box body 1 that is divided and stored, and the same elements as those in FIG. 1 or FIG. In this reference example , the power conversion unit 2B, the smoothing capacitor 6, the P and N thin plate conductors 7, and the control unit 4 are arranged in the box 1 as individual items without being assembled in advance. The gate wiring 5B is directed from the control unit 4 to the bottom of the lower box 1 and is provided in the rail direction at the bottom of the box.

これによって、電力変換ユニット２Ｂの半導体素子の近傍にゲート基板３Ａを配置することができるため、制御ユニット４からゲート基板コネクタ３Ｂまで、ゲ−ト配線５Ｂをレール方向にほぼ直線状に配線することができる。   As a result, the gate substrate 3A can be disposed in the vicinity of the semiconductor element of the power conversion unit 2B. Therefore, the gate wiring 5B is wired substantially linearly in the rail direction from the control unit 4 to the gate substrate connector 3B. Can do.

図４は本発明に係る車両用制御装置の第３の参考例の構成を説明するために、図２と同様な位置での断面図を示したもので、図１と同一の要素には同一の符号を付してその説明を省略する。上述した第１及び第２の参考例は電力変換ユニット２ＢとＰ，Ｎ薄板導体７との間に板面を垂直にして半導体素子のゲートをゲート基板３Ａに接続したため、その接続線の長さが幾分長くなっていた。 FIG. 4 is a cross-sectional view at the same position as in FIG. 2 for explaining the configuration of the third reference example of the vehicle control device according to the present invention. The description is abbreviate | omitted and attached | subjected. In the first and second reference examples described above, the gate of the semiconductor element is connected to the gate substrate 3A with the plate surface vertical between the power conversion unit 2B and the P and N thin plate conductors 7, so that the length of the connecting line is long. Was somewhat longer.

図４に示した第３の参考例はゲート基板３Ａはその板面を水平にして、半導体素子１０Ａが取り付けられる冷却器ブロック部１３の真下に配置され、半導体ゲート１０Ｂからゲート基板３Ａに対してゲート配線５Ａが垂直にして接続されている。 In the third reference example shown in FIG. 4, the gate substrate 3A is disposed directly below the cooler block portion 13 to which the semiconductor element 10A is attached, with the plate surface thereof being horizontal, and the semiconductor gate 10B to the gate substrate 3A The gate wiring 5A is connected vertically.

この構成により、半導体ゲート１０Ｂとゲート基板３Ａとのゲート配線５Ａの配線長を最短にすることができ、電磁ノイズの影響を受け難くすることができる。   With this configuration, the wiring length of the gate wiring 5A between the semiconductor gate 10B and the gate substrate 3A can be minimized, and the influence of electromagnetic noise can be reduced.

図５は本発明に係る車両用制御装置の第４の参考例の構成を説明するために、図１と同様に車体への取付端の近傍で水平に切断して車体への取付側から見た断面図であり、図中、図４と同一の要素には同一の符号を付してその説明を省略する。この図５において、電力変換ユニット２Ｂの下部にゲート基板３Ａが配置され、ゲート基板コネクタ３Ｂは箱体底部よりも上方に離れた位置でレール方向に挿脱可能に装着され、このゲート基板コネクタ３Ｂからそれぞれ導出されたゲート配線５Ｂは箱体底部よりも上方に離れた位置で、平滑コンデンサ６やＰ，Ｎ薄板導体７よりも電力変換ユニット２Ｂに近い位置、すなわち、半導体素子の近傍から配線され、制御ユニット４の前方よりに配線される。 FIG. 5 shows a fourth reference example of the control apparatus for a vehicle according to the present invention, in the same manner as in FIG. 1, cut horizontally in the vicinity of the attachment end to the vehicle body and viewed from the attachment side to the vehicle body. In the figure, the same elements as those in FIG. 4 are denoted by the same reference numerals, and the description thereof is omitted. In FIG. 5, a gate substrate 3A is disposed below the power conversion unit 2B, and the gate substrate connector 3B is removably mounted in the rail direction at a position spaced above the bottom of the box body. The gate substrate connector 3B 5B is routed from a position closer to the power conversion unit 2B than the smoothing capacitor 6 and the P and N thin plate conductors 7, that is, from the vicinity of the semiconductor element, at a position away from the bottom of the box body. Wiring is performed from the front of the control unit 4.

かくして、第４の参考例によれば、電力変換ユニット２Ｂの半導体素子の近傍にゲート基板コネクタ３Ｂを配置することができるため、制御ユニット４をゲート基板３Ａよりも後方に配置することで、ゲート基板から制御ユニット前面へ最短経路でゲ−ト配線することができる。 Thus, according to the fourth reference example , since the gate substrate connector 3B can be disposed in the vicinity of the semiconductor element of the power conversion unit 2B, the control unit 4 is disposed behind the gate substrate 3A. Gate wiring can be performed from the substrate to the front surface of the control unit through the shortest path.

図６は本発明に係る車両用制御装置の実施形態の構成を説明するために、図５と同様に車体への取付端の近傍で水平に切断して車体への取付側から見た断面図であり、図中、図５と同一の要素には同一の符号を付してその説明を省略する。この図６において、電力変換ユニット２Ｂと電力変換ユニットに含まれるブレーキチョッパユニット１５Ｂの薄板導体７との接続端子７ａがそれぞれレール方向に２つに分割配置された平滑コンデンサ６間に収まるように配置されるている。ゲート基板３Ａは半導体素子の直近に配置されているが、２分割された平滑コンデンサ６間でコンデンサの配置に影響されずにゲート基板コネクタ３Ｂのコネクタが着脱可能となる。 FIG. 6 is a cross-sectional view viewed horizontally from the side attached to the vehicle body and cut horizontally in the vicinity of the attachment end to the vehicle body to explain the configuration of the embodiment of the vehicle control device according to the present invention. In the figure, the same elements as those in FIG. In FIG. 6, the connection terminals 7a between the power conversion unit 2B and the thin plate conductor 7 of the brake chopper unit 15B included in the power conversion unit are arranged so as to be accommodated between the smoothing capacitors 6 that are separately arranged in two in the rail direction. Has been. Although the gate substrate 3A is disposed in the immediate vicinity of the semiconductor element, the connector of the gate substrate connector 3B can be attached and detached without being affected by the capacitor arrangement between the two divided smoothing capacitors 6.

かくして、図６に示した本発明の実施形態によれば、平滑コンデンサを２つ分割配置することでゲート基板のコネクタの操作性が向上し、半導体素子近傍でもゲート基板を配置することができるため、ゲート基板コネクタ３Ｂから制御ユニット４の前面へ最短経路でゲ−ト配線することができる。 Thus, according to the embodiment of the present invention shown in FIG. 6, the operability of the connector of the gate substrate is improved by dividing the smoothing capacitor into two parts, and the gate substrate can be arranged even in the vicinity of the semiconductor element. The gate wiring can be performed from the gate substrate connector 3B to the front surface of the control unit 4 through the shortest path.

図７は本発明に係る車両用制御装置の第５の参考例の構成を説明するために、図４と同様な位置での断面図であり、図４と同一の要素には同一の符号を付してその説明を省略する。この図７において、電力変換ユニット２Ｂのフレーム９の下端部に装置外部からその開閉が可能な補助カバー１６を設置し、開放側より補助カバー１６を開けてゲート基板３Ａに対する取付け、取り外しが可能となる。 FIG. 7 is a cross-sectional view at the same position as in FIG. 4 for explaining the configuration of the fifth reference example of the vehicle control device according to the present invention, and the same elements as those in FIG. A description thereof will be omitted. In FIG. 7, an auxiliary cover 16 that can be opened and closed from the outside of the apparatus is installed at the lower end of the frame 9 of the power conversion unit 2B, and the auxiliary cover 16 can be opened from the open side to be attached to and detached from the gate substrate 3A. Become.

なお、補助カバー１６は電力変換ユニットフレーム９の下端部に限らず、箱体の側方の下端部であってもよい。   The auxiliary cover 16 is not limited to the lower end portion of the power conversion unit frame 9 but may be the lower end portion on the side of the box.

かくして、第５の参考例によれば、車両用制御装置の密閉側の構造に影響を受けるゲート基板の操作性を確保することができるため、車両用制御装置の密閉側の構造によらずゲート基板を半導体近傍に配置することができ、ゲート配線の最短化が可能となる。 Thus, according to the fifth reference example , the operability of the gate substrate affected by the structure on the sealed side of the vehicle control device can be ensured, so that the gate is independent of the structure on the sealed side of the vehicle control device. The substrate can be arranged near the semiconductor, and the gate wiring can be minimized.

図８は本発明に係る車両用制御装置の第６の参考例の構成を説明するために、図６と同様に車体への取付端の近傍で水平に切断して車体への取付側から見た断面図であり、図中、図６と同一の要素には同一の符号を付してその説明を省略する。この図８において電力変換ユニットを各相モジュール８に分解し、電力変換ユニットのブレーキチョッパユニット１５Ｂを各相モジュール８と奥行きが同寸法のモジュールにすることによって、各ゲート基板３Ａの取付位置を同じにしたもので、ゲート基板の配線経路は隣接するブレーキチョッパ部分１５Ｂの形状が要因で引き回すことなく、制御ユニット４まで直線的に配線することが可能となる。 FIG. 8 shows a sixth reference example of the control apparatus for a vehicle according to the present invention, in the same manner as in FIG. 6, cut horizontally in the vicinity of the attachment end to the vehicle body and viewed from the attachment side to the vehicle body. In the figure, the same elements as those in FIG. 6 are denoted by the same reference numerals, and the description thereof is omitted. In FIG. 8, the power conversion unit is disassembled into each phase module 8, and the brake chopper unit 15B of the power conversion unit is made a module having the same depth as each phase module 8, so that the mounting position of each gate substrate 3A is the same. Thus, the wiring path of the gate substrate can be linearly routed to the control unit 4 without being routed due to the shape of the adjacent brake chopper portion 15B.

かくして、第６の参考例によれば、ゲート配線経路上での隣接するブレーキチョッパ部分との干渉がなく、各ゲート基板から同じ経路でゲート配線を制御ユニットへ引き通すことができるため、制御ユニット前面へ最短経路でゲ−ト配線することができる。 Thus, according to the sixth reference example , since there is no interference with the adjacent brake chopper portion on the gate wiring path, the gate wiring can be led from each gate substrate through the same path to the control unit. Gate wiring can be made to the front surface with the shortest path.

本発明に係る車両用制御装置の第１の参考例の構成を説明するために、車体への取付端の近傍で水平に切断して車体への取付側から見た断面図。Sectional drawing cut | disconnected horizontally in the vicinity of the attachment end to a vehicle body, and was seen from the attachment side to a vehicle body in order to demonstrate the structure of the 1st reference example of the control apparatus for vehicles which concerns on this invention. 第１の参考例のＡ−Ａ矢視断面図。AA arrow sectional drawing of a 1st reference example . 本発明の第２の参考例の構成を説明するために、図２と同様な断面のうち、一部を破断して示した断面図。Sectional drawing which fractured | ruptured and showed one part among the cross sections similar to FIG. 2, in order to demonstrate the structure of the 2nd reference example of this invention. 本発明に係る車両用制御装置の第３の参考例の構成を説明するために、図２と同様な位置での断面図。Sectional drawing in the position similar to FIG. 2 in order to demonstrate the structure of the 3rd reference example of the control apparatus for vehicles which concerns on this invention. 本発明に係る車両用制御装置の第４の参考例の構成を説明するために、図１と同様に車体への取付端の近傍で水平に切断して車体への取付側から見た断面図。FIG. 5 is a cross-sectional view of the fourth embodiment of the control device for a vehicle according to the present invention, viewed horizontally from the side of the vehicle body, cut horizontally in the vicinity of the vehicle body attachment end, similar to FIG. . 本発明に係る車両用制御装置の実施形態の構成を説明するために、図５と同様に車体への取付端の近傍で水平に切断して車体への取付側から見た断面図。FIG. 6 is a cross-sectional view of the vehicle control apparatus according to the embodiment of the present invention, viewed horizontally from the side attached to the vehicle body by cutting horizontally in the vicinity of the attachment end to the vehicle body, similarly to FIG. 5. 本発明に係る車両用制御装置の第５の参考例の構成を説明するために、図４と同様な位置での断面図。Sectional drawing in the position similar to FIG. 4 in order to demonstrate the structure of the 5th reference example of the control apparatus for vehicles which concerns on this invention. 本発明に係る車両用制御装置の第６の参考例の構成を説明するために、図６と同様に車体への取付端の近傍で水平に切断して車体への取付側から見た断面図。FIG. 6 is a cross-sectional view of the sixth embodiment of the control apparatus for a vehicle according to the present invention, as viewed from the attachment side to the vehicle body, cut horizontally in the vicinity of the attachment end to the vehicle body as in FIG. . 従来の車両用制御装置の構成を説明するために、車体への取付端の近傍で水平に切断して車体への取付側から見た断面図。Sectional drawing cut | disconnected horizontally in the vicinity of the attachment end to a vehicle body, and was seen from the attachment side to a vehicle body in order to demonstrate the structure of the conventional vehicle control apparatus.

符号の説明Explanation of symbols

１ 箱体
１ａ 箱体吊耳１ａ
２Ａ，２Ｂ 電力変換ユニット
３Ａ ゲート基板
３Ｂ ゲート基板コネクタ
４ 制御ユニット
５Ａ，５Ｂ ゲート配線
６ 平滑コンデンサ
７ Ｐ，Ｎ薄板導体
７ａ Ｐ，Ｎ接続端子
８ 電力変換ユニット相モジュール
９ 電力変換ユニットフレーム
１０Ａ 半導体素子
１０Ｂ 半導体ゲート
１１ ブレーキチョッパコンデンサ
１３ 冷却器ブロック部
１４ 冷却装置
１５Ａ，１５Ｂ ブレーキチョッパ部
１６ 補助カバー
１７ コア 1 box 1a box hanging ear 1a
2A, 2B Power conversion unit 3A Gate substrate 3B Gate substrate connector 4 Control unit 5A, 5B Gate wiring 6 Smoothing capacitor 7 P, N thin plate conductor 7a P, N connection terminal 8 Power conversion unit phase module 9 Power conversion unit frame 10A Semiconductor element 10B Semiconductor gate 11 Brake chopper capacitor 13 Cooler block 14 Cooling devices 15A and 15B Brake chopper 16 Auxiliary cover 17 Core

Claims (1)

鉄道車両の床下に設置され、半導体素子のスイッチングにより電力変換を行なう車両用制御装置において、
密閉室を形成する箱体に、半導体素子が収納された電力変換ユニット、平滑コンデンサ、これらを電気的に接続する薄板構造の導体、前記半導体素子のゲートを駆動するゲート基板、前記ゲート基板を制御する制御ユニット、前記ゲート基板及び前記制御ユニット間を電気的に接続するゲート配線が個々に収納され、
前記密閉室の枕木方向中央よりも一方の車体の側方に偏倚させた位置にゲート基板を接続するためのゲート基板コネクタが配置され、このゲート基板コネクタに前記ゲート配線が接続され、
更に、前記半導体素子が収納された電力変換ユニットも、前記密閉室の枕木方向中央よりも一方の車体の側方に偏倚させた位置に配置され、
前記平滑コンデンサは１個の電力変換ユニットに対して２個備えられ、これらが電力変換ユニットのレール方向の両端部に分割配置され、前記電力変換ユニットの主回路端子及び前記ゲート基板コネクタが分割配置された前記平滑コンデンサに挟まれる位置に配置されている、
ことを特徴とする車両用制御装置。 In a vehicle control device that is installed under the floor of a railway vehicle and performs power conversion by switching semiconductor elements,
A box that forms a sealed chamber, a power conversion unit in which a semiconductor element is housed, a smoothing capacitor, a conductor with a thin plate structure that electrically connects them, a gate substrate that drives the gate of the semiconductor element, and a control of the gate substrate The control unit, the gate substrate and the gate wiring for electrically connecting the control unit are individually housed,
A gate substrate connector for connecting the gate substrate is disposed at a position biased to the side of one vehicle body from the center of the sleeper direction of the sealed chamber, and the gate wiring is connected to the gate substrate connector,
Furthermore, the power conversion unit in which the semiconductor element is housed is also arranged at a position that is biased to the side of one vehicle body from the center of the sealed room in the sleeper direction,
Two smoothing capacitors are provided for one power conversion unit, these are divided and arranged at both ends in the rail direction of the power conversion unit, and the main circuit terminal and the gate substrate connector of the power conversion unit are divided and arranged. Is arranged at a position sandwiched between the smoothing capacitors,
A control apparatus for a vehicle.
JP2003356700A 2003-10-16 2003-10-16 Vehicle control device Expired - Fee Related JP3950836B2 (en)

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JP2003356700A JP3950836B2 (en) 2003-10-16 2003-10-16 Vehicle control device
CNB2004100841840A CN100345360C (en) 2003-10-16 2004-10-15 Controlling apparatus for vehicle

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JPH10225138A (en) * 1997-02-04 1998-08-21 Meidensha Corp Power converter circuit and inverter device
CN1254443A (en) * 1997-03-26 2000-05-24 株式会社日立制作所 Flat semiconductor device and power converter employing the same
WO1998053546A1 (en) * 1997-05-23 1998-11-26 Kabushiki Kaisha Toshiba Power converter wherein mos gate semiconductor device is used
JP3690108B2 (en) * 1998-04-10 2005-08-31 富士電機システムズ株式会社 Main circuit of power converter
JP3834764B2 (en) * 1999-03-24 2006-10-18 株式会社日立製作所 Main circuit structure of power converter
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