JP3938388B2 - Coating device - Google Patents
Coating device Download PDFInfo
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- JP3938388B2 JP3938388B2 JP2005240590A JP2005240590A JP3938388B2 JP 3938388 B2 JP3938388 B2 JP 3938388B2 JP 2005240590 A JP2005240590 A JP 2005240590A JP 2005240590 A JP2005240590 A JP 2005240590A JP 3938388 B2 JP3938388 B2 JP 3938388B2
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- coating
- slit nozzle
- substrate
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- pump
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- 239000011248 coating agent Substances 0.000 title claims description 59
- 238000000576 coating method Methods 0.000 title claims description 59
- 239000007788 liquid Substances 0.000 claims description 39
- 239000000758 substrate Substances 0.000 claims description 33
- 230000007246 mechanism Effects 0.000 claims description 15
- 239000011521 glass Substances 0.000 description 4
- 230000008602 contraction Effects 0.000 description 3
- 230000003028 elevating effect Effects 0.000 description 3
- 239000004973 liquid crystal related substance Substances 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- 238000004140 cleaning Methods 0.000 description 2
- 230000008878 coupling Effects 0.000 description 2
- 238000010168 coupling process Methods 0.000 description 2
- 238000005859 coupling reaction Methods 0.000 description 2
- 239000012530 fluid Substances 0.000 description 2
- 230000001965 increasing effect Effects 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 239000002699 waste material Substances 0.000 description 2
- 230000005484 gravity Effects 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 238000004528 spin coating Methods 0.000 description 1
- 239000007921 spray Substances 0.000 description 1
- 238000005507 spraying Methods 0.000 description 1
Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C5/00—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work
- B05C5/02—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work the liquid or other fluent material being discharged through an outlet orifice by pressure, e.g. from an outlet device in contact or almost in contact, with the work
- B05C5/0225—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work the liquid or other fluent material being discharged through an outlet orifice by pressure, e.g. from an outlet device in contact or almost in contact, with the work characterised by flow controlling means, e.g. valves, located proximate the outlet
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C11/00—Component parts, details or accessories not specifically provided for in groups B05C1/00 - B05C9/00
- B05C11/10—Storage, supply or control of liquid or other fluent material; Recovery of excess liquid or other fluent material
- B05C11/1002—Means for controlling supply, i.e. flow or pressure, of liquid or other fluent material to the applying apparatus, e.g. valves
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/16—Coating processes; Apparatus therefor
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/027—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
Landscapes
- Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- General Physics & Mathematics (AREA)
- Coating Apparatus (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Materials For Photolithography (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
Description
本発明はガラス基板や半導体ウェーハ等の基板に対し、現像液、洗浄液、ＳＯＧ溶液、レジスト液等を塗布する塗布装置に関する。 The present invention relates to a coating apparatus for coating a developing solution, a cleaning solution, an SOG solution, a resist solution or the like on a substrate such as a glass substrate or a semiconductor wafer.
液晶（ＬＣＤ）、ＰＤＰ（プラズマディスプレイ）、半導体素子等の製造プロセスにおいては、基板上に各種被膜を形成したり、洗浄液や現像液を塗布するために塗布装置が使用される。 In a manufacturing process of a liquid crystal (LCD), a PDP (plasma display), a semiconductor element, etc., a coating apparatus is used to form various films on a substrate and to apply a cleaning solution or a developing solution.
従来の塗布装置としては、例えば、特許文献１に開示されるように、基板の中心にノズルから塗布液を滴下し、次いで基板を回転せしめ遠心力で塗布液を基板上に均一に塗布する回転塗布タイプのもの、或いはスプレーによって基板上に均一に塗布するタイプが知られている。
このような、回転塗布タイプやスプレータイプにあっては、基板上に塗布される有効な塗布液の量が少なく無駄が多い。
一方、塗布液の無駄がない塗布装置としては特許文献２に開示されるロールコータがある。しかしながらロールコータにおいては、均一な塗布が困難という問題がある。
As a conventional coating apparatus, for example, as disclosed in Patent Document 1, a coating liquid is dropped from a nozzle to the center of a substrate, and then the substrate is rotated to rotate the coating liquid uniformly on the substrate by centrifugal force. An application type or a type that uniformly applies to a substrate by spraying is known.
In such a spin coating type and spray type, the amount of effective coating liquid applied on the substrate is small and wasteful.
On the other hand, there is a roll coater disclosed in Patent Document 2 as an application apparatus that does not waste application liquid. However, a roll coater has a problem that uniform coating is difficult.
そこで、塗布液の無駄を少なくし、しかも均一塗布が可能な装置として、特許文献３や４に開示されるような、スリットノズルと回転とを組み合わせた装置が使用されている。この装置は、スリットノズルによって基板表面にある程度の厚さで塗布液を塗布し、この後基板を回転せしめることで塗布液の厚さの均一化を図るというものである。 In view of this, an apparatus combining slit nozzles and rotation as disclosed in Patent Documents 3 and 4 is used as an apparatus capable of reducing the waste of the coating liquid and performing uniform application. In this apparatus, the coating liquid is applied to the surface of the substrate with a certain thickness by the slit nozzle, and then the thickness of the coating liquid is made uniform by rotating the substrate.
また、液晶表示装置に組み込むガラス基板について述べれば、生産性を上げるに、大きなガラス基板に被膜を形成し、その後に各液晶パネルの大きさに合せて切断した方が有利である。
このような理由から最近では基板の大型化（１辺の長さが１ｍを超える矩形）が進んでいるが、基板寸法の大型化が進むと、基板を回転させることが困難になる。
即ち、１辺が１ｍを超える矩形状基板を数千回転／分の速度で回転させることは、装置の構造が極めて複雑になり、また基板の破損等の事態を考慮すると、大型基板を高速で回転せしめることには不利な点が多い。
As for the glass substrate to be incorporated into the liquid crystal display device, it is advantageous to form a film on a large glass substrate and then cut it according to the size of each liquid crystal panel in order to increase productivity.
For these reasons, the size of the substrate has recently been increasing (a rectangle whose length of one side exceeds 1 m). However, as the size of the substrate increases, it becomes difficult to rotate the substrate.
In other words, rotating a rectangular substrate with a side longer than 1 m at a speed of several thousand revolutions / minute makes the structure of the apparatus extremely complex, and considering the situation such as substrate breakage, a large substrate can be rotated at high speed. There are many disadvantages to rotating.
そこで従来のスリットノズルと回転とを組み合わせた装置から、基板を回転せしめる機構を省き、特許文献５〜７に記載されるように、スリットノズルのみ（非スピン法）に最近では移行しつつある。 Therefore, a mechanism for rotating the substrate is omitted from the conventional apparatus combining the slit nozzle and rotation, and as described in Patent Documents 5 to 7, recently, only the slit nozzle (non-spin method) is being shifted to.
ところで、スリットノズルを用いた非スピン法では、スリットノズルが基板の上方を移動しつつ塗布液を基板表面に供給することになるが、スリットノズルが移動する際に振動が発生する。この振動により基板表面に供給される塗布液の量に変動が生じ、これが原因で膜厚の不均一が発生する。 By the way, in the non-spin method using the slit nozzle, the coating liquid is supplied to the substrate surface while the slit nozzle moves above the substrate. However, vibration occurs when the slit nozzle moves. This vibration causes a variation in the amount of the coating solution supplied to the substrate surface, which causes non-uniform film thickness.
そこで、塗布エレメント（スリットノズル）の振動に起因する膜厚の不均一を解消するために、リニアモータを用いて塗布エレメントを支持する部分をベースに対して非接触状態とする試みがなされている。
このように塗布エレメントを取り付ける部材をベースに対して非接触で移動可能とすることで、振動に起因する塗布ムラを解消することはできるが、これだけでは十分とは言えない。
Therefore, in order to eliminate the film thickness non-uniformity caused by the vibration of the coating element (slit nozzle), an attempt has been made to make the portion supporting the coating element non-contact with the base using a linear motor. .
By making the member for attaching the application element movable in a non-contact manner with respect to the base in this way, application unevenness due to vibration can be eliminated, but this alone is not sufficient.
即ち、従来にあっては塗布エレメント（スリットノズル）へ塗布液を供給する送液ポンプはベース等の移動しない箇所に固定され、この送液ポンプと塗布エレメント間をフレキシブルチューブでつなげている。このため、塗布エレメントが移動すると、送液ポンプと塗布エレメント間のフレキブルチューブもそれにつれて変形し、配管内容積が変化し、塗布エレメントから吐出される塗布液量が微妙に変化する。そして、これが膜厚不均一の原因になる。 That is, conventionally, a liquid feed pump that supplies a coating liquid to a coating element (slit nozzle) is fixed to a non-moving portion such as a base, and the liquid feeding pump and the coating element are connected by a flexible tube. For this reason, when the application element moves, the flexible tube between the liquid feed pump and the application element is deformed accordingly, the internal volume of the pipe changes, and the amount of the application liquid discharged from the application element changes slightly. This causes uneven film thickness.
最近になって、特許文献５および６に記載されるように、塗布エレメントの移動部材に送液ポンプを取り付け、塗布エレメントの移動に伴なって送液ポンプも移動する技術が開発されている。しかし、送液ポンプからスリットノズルまでの配管（チューブ）が長いため、チューブの伸縮等が原因となって塗布量の定量性の確保が困難となっている。
また、特許文献７には、スリットノズルと一体的に送液ポンプを設置する発明が記載されているが、これでは、スリットノズル交換時に送液ポンプも取外さなくてはならない。このため作業精度を上げる必要が生じ、作業負担が増加し塗布再開までの時間がかかる。
Recently, as described in Patent Documents 5 and 6, a technique has been developed in which a liquid feed pump is attached to a moving member of a coating element, and the liquid feed pump moves as the coating element moves. However, since the pipe (tube) from the liquid feed pump to the slit nozzle is long, it is difficult to ensure the quantitativeness of the coating amount due to expansion and contraction of the tube.
Further, Patent Document 7 describes an invention in which a liquid feed pump is installed integrally with a slit nozzle, but in this case, the liquid feed pump must also be removed when the slit nozzle is replaced. For this reason, it is necessary to increase the work accuracy, the work load is increased, and it takes time until the application is restarted.
また、送液ポンプとしてチューブフラムポンプが知られているが、エアーの噛み込みの問題がある。上述した点に鑑み、本発明は、塗布液の定量供給を確保し、また、スリットノズルの移動時に発生する振動を低減させた塗布装置を提供する。
Also, a tube diaphragm pump is known as a liquid feed pump, but there is a problem of air entrainment. In view of the above-described points, the present invention provides a coating apparatus that ensures the constant supply of the coating liquid and reduces vibrations that occur when the slit nozzle moves.
本発明に係る塗布装置は、一対の平行なレール間に基板載置ステージが配置され、この基板載置ステージを跨ぐようにスリットノズルを備えた門型移動機構がレール間に走行可能に架け渡され、門型移動機構は一対の平行なレールのそれぞれに係合する走行体と、これら走行体間を連結する連結ビームとを備え、連結ビームの略中央部に塗布液送液ポンプが取り付けられた構成とした。 In the coating apparatus according to the present invention, a substrate mounting stage is disposed between a pair of parallel rails, and a portal type moving mechanism having a slit nozzle is laid across the rails so as to run between the rails. The portal-type moving mechanism includes a traveling body that engages with each of the pair of parallel rails, and a coupling beam that couples the traveling bodies, and a coating liquid feed pump is attached to a substantially central portion of the coupling beam. The configuration was as follows.
本発明に係る塗布装置によれば、連結ビームの略中央部に塗布液送液ポンプが取り付けられた構成としたので、例えば、塗布中に送液ポンプと塗布エレメントとの距離が常に一定に保たれる。しかもその距離が短いため、送液ポンプと塗布エレメントをつなぐフレキシブルチューブの配管内容積が変動しない。これにより、塗布エレメントに備えられたスリットノズルからの吐出量も一定となり、均一な膜厚の塗膜を得ることができる。
また、連結ビームの略中央部に送液ポンプが取り付けられているため、左右門柱のバランスの調整が容易である。これにより、移動時に発生する振動やピッチングを低減することができる。
According to the coating apparatus of the present invention, since the coating liquid feeding pump is attached to the substantially central portion of the connection beam, for example, the distance between the liquid feeding pump and the coating element is always kept constant during coating. Be drunk. And since the distance is short, the pipe internal volume of the flexible tube which connects a liquid feeding pump and a coating element does not fluctuate. Thereby, the discharge amount from the slit nozzle provided in the application element is also constant, and a coating film having a uniform film thickness can be obtained.
Moreover, since the liquid feed pump is attached to the substantially center part of the connection beam, it is easy to adjust the balance between the left and right portal columns. Thereby, the vibration and pitching which generate | occur | produce at the time of movement can be reduced.
塗布液送液ポンプとしては、非圧縮流体によりチューブの外周部に均一な圧力を加えて作動させるチューブフラムポンプであることが好ましい。また、前記塗布液送液ポンプから前記塗布エレメントまでの配管は、チューブの伸縮の影響を避けるため最長で１ｍまでであることが好ましい。 The coating liquid feed pump is preferably a tube diaphragm pump that is operated by applying a uniform pressure to the outer periphery of the tube with an incompressible fluid. Moreover, it is preferable that the piping from the coating liquid feeding pump to the coating element is up to 1 m in order to avoid the influence of expansion and contraction of the tube.
また、塗布液送液ポンプとしては、重心を低く保って移動部材の振動を減少させるため、前記昇降フレーム中央部近辺の側面に横斜め方向に取り付けられることが好ましい。
この際、横斜め方向に取り付けるとチューブフラム内の出入り口付近の接合部に液溜りが発生しやすいので、これを解消する構造とするのが好ましい。
In addition, the coating liquid feed pump is preferably attached to the side surface near the center of the lifting frame in a laterally oblique direction in order to reduce the vibration of the moving member while keeping the center of gravity low.
At this time, if it is attached in the horizontal oblique direction, a liquid pool is likely to be generated at the joint near the entrance / exit in the tube frame.
本発明の塗布装置によれば、例えば、塗布エレメントに備えられたスリットノズルからの吐出量を一定にすることができ、均一な厚さの塗膜を得ることが可能になる。
また、左右門柱のバランスの調整が容易であり、移動時に発生する振動やピッチングを低減することが可能になる。
従って、高性能且つ信頼性の向上した塗布装置を実現することができる。
According to the coating apparatus of the present invention, for example, the discharge amount from the slit nozzle provided in the coating element can be made constant, and a coating film having a uniform thickness can be obtained.
In addition, the balance of the left and right portal columns can be easily adjusted, and vibration and pitching that occur during movement can be reduced.
Therefore, a coating apparatus with high performance and improved reliability can be realized.
以下、本発明の実施の形態を添付図面に基づいて説明する。
図１は本発明に係る塗布装置の一部を拡大した一実施の形態を示す平面図である。また、図２は図１のＡ方向矢視図、図３は図１のＢ方向矢視図、図４はスリットノズルの取り付け状態を説明した拡大側面図である。
Hereinafter, embodiments of the present invention will be described with reference to the accompanying drawings.
FIG. 1 is a plan view showing an embodiment in which a part of a coating apparatus according to the present invention is enlarged. 2 is a view in the direction of the arrow A in FIG. 1, FIG. 3 is a view in the direction of the arrow B in FIG. 1, and FIG. 4 is an enlarged side view illustrating the attachment state of the slit nozzle.
本実施の形態に係る塗布装置は、図１〜図３に示すように、ベースフレーム１を介して支持されている。
ベースフレーム１上には一対のレール２，２が水平方向に且つ平行に設けられ、これら一対のレール２には門型移動機構３が係合し、ベースフレーム１上にはガラス基板Ｗ等を載置する基板載置ステージ４が設けられている。
The coating apparatus according to the present embodiment is supported via a base frame 1 as shown in FIGS.
A pair of rails 2 and 2 are provided on the base frame 1 in a horizontal direction and in parallel. The pair of rails 2 are engaged with a gate-type moving mechanism 3, and a glass substrate W or the like is placed on the base frame 1. A substrate mounting stage 4 for mounting is provided.
門型移動機構３はレール２を抱持する形状の走行体としてのガントリーフレーム５を有しており、このガントリーフレーム５の内側面にはレール２との間に隙間を形成するエアパッド６が備えられている。 The portal moving mechanism 3 has a gantry frame 5 as a traveling body that holds the rail 2, and an air pad 6 that forms a gap with the rail 2 is provided on the inner surface of the gantry frame 5. It has been.
左右のガントリーフレーム５，５は２本の連結ビーム７，７にて連結一体化され、平面視で枠状をなしている。このように枠状をなすことで走行中の歪を少なくできる。
なお、連結ビーム７，７については１本のみの構成とすることもできる。
The left and right gantry frames 5 and 5 are connected and integrated by two connecting beams 7 and 7 and have a frame shape in plan view. By making the frame shape in this way, distortion during traveling can be reduced.
In addition, about the connection beams 7 and 7, it can also be set as the structure of only one.
また、左右のガントリーフレーム５はそれぞれ図示しないリニアモータの可動部(コア部)に連結されている。そして、左右のリニアモータを同期して駆動することで、門型移動機構３はレール２に沿って振動なく移動する。
ここで、連結ビーム７，７はガントリーフレーム５の上面に取り付けられているが、この位置は走行時に連結ビーム７，７が基板(基板載置ステージ４)に干渉しない範囲で最も低い位置である。
このように連結ビーム７，７の高さを低くすることで、走行時のピッチングを抑制することができる。
The left and right gantry frames 5 are connected to a movable part (core part) of a linear motor (not shown). And the portal type moving mechanism 3 moves along the rail 2 without vibration by driving the left and right linear motors synchronously.
Here, the connection beams 7 and 7 are attached to the upper surface of the gantry frame 5, but this position is the lowest position in a range where the connection beams 7 and 7 do not interfere with the substrate (substrate mounting stage 4) during traveling. .
Thus, the pitching at the time of driving | running | working can be suppressed by making the height of the connection beams 7 and 7 low.
また、左右のガントリーフレーム５の上面にはシリンダユニットなどで構成されるノズル昇降機構８が固設され、左右のノズル昇降機構８，８間にノズルベースプレート９が水平且つ昇降自在に架設され、このノズルベースプレート９にスリットノズル１０が取り付けられている。
而して、昇降機構８，８を駆動することでノズルベースプレート９とスリットノズル１０は一体的に昇降動する。
In addition, a nozzle elevating mechanism 8 composed of a cylinder unit or the like is fixed on the upper surfaces of the left and right gantry frames 5, and a nozzle base plate 9 is installed between the left and right nozzle elevating mechanisms 8 and 8 so as to be movable up and down horizontally. A slit nozzle 10 is attached to the nozzle base plate 9.
Thus, by driving the elevating mechanisms 8 and 8, the nozzle base plate 9 and the slit nozzle 10 move up and down integrally.
ノズルベースプレート９の一部にはスリットノズル１０の下端と基板Ｗとの間隔を測定するレーザセンサ１１が取り付けられている。 A laser sensor 11 that measures the distance between the lower end of the slit nozzle 10 and the substrate W is attached to a part of the nozzle base plate 9.
そして、本実施の形態の塗布装置おいては特に、塗布方向を基準として前方の連結ビーム７の幅方向の中央部に、塗布液送液ポンプとして、非圧縮流体によりチューブの外周部に均一な圧力を加えて作動させるチューブフラムポンプ１２が配置されている。 In the coating apparatus of the present embodiment, in particular, the coating liquid feeding pump is uniformly applied to the outer peripheral portion of the tube by the non-compressed fluid at the center in the width direction of the front connecting beam 7 with respect to the coating direction. A tube diaphragm pump 12 that is operated by applying pressure is disposed.
このチューブフラムポンプ１２は連結ビーム７上面に取り付けた楔部材１３に固定されている。
本実施の形態では、この楔部材１３が、図２及び図３に示すように、一方に傾斜した形状であるため（紙面垂直方向から見て）、チューブフラムポンプ１２は斜めに配置されている。この場合、チューブフラムポンプ１２は、出口側（アウト）が上方に、入口側（イン）が下方になるように固定されている。
このように、チューブフラムポンプ１２が斜めに配置されることで、エアーの噛み込みを防止することができる。
なお、チューブフラムポンプ１２において、出口側と入口側の構成は、液溜がない構造とすることがボタ落ちなどを防ぐ上で好ましい。
The tube diaphragm pump 12 is fixed to a wedge member 13 attached to the upper surface of the connecting beam 7.
In the present embodiment, as shown in FIGS. 2 and 3, the wedge member 13 has a shape inclined to one side (viewed from the direction perpendicular to the paper surface), so the tube diaphragm pump 12 is disposed obliquely. . In this case, the tube diaphragm pump 12 is fixed so that the outlet side (out) is upward and the inlet side (in) is downward.
As described above, the tube diaphragm pump 12 is disposed obliquely, thereby preventing air from being caught.
In the tube diaphragm pump 12, it is preferable that the configurations on the outlet side and the inlet side have a structure that does not have a liquid reservoir in order to prevent the dropping of the liquid.
また出口とスリットノズル１０とはフレキシブルチューブ１４にて連結され、入口と図示しないタンクとはフレキシブルチューブ１５にて連結されている。
ここで、チューブフラムポンプ１２はスリットノズル１０と一体的に移動する連結ビーム７に取り付けられており、スリットノズル１０の昇降動分だけフレキシブルチューブ１４に余裕があればよい。
従って、本実施の形態の場合では、フレキシブルチューブ１４の長さを１ｍ以下と短くし、チューブの伸縮による塗布液供給量の微妙な増減を避けている。
The outlet and the slit nozzle 10 are connected by a flexible tube 14, and the inlet and a tank (not shown) are connected by a flexible tube 15.
Here, the tube diaphragm pump 12 is attached to the connection beam 7 that moves integrally with the slit nozzle 10, and it is sufficient that the flexible tube 14 has a margin for the up and down movement of the slit nozzle 10.
Therefore, in the case of the present embodiment, the length of the flexible tube 14 is shortened to 1 m or less to avoid a delicate increase / decrease in the amount of coating liquid supplied due to the expansion / contraction of the tube.
次に、チューブフラムポンプ１２をガントリーフレーム５に取り付けた場合（Ａ）と、連結ビーム７に取り付けた場合（Ｂ）について、門型移動機構３の振幅安定性の比較を行った結果を下記表１に示す。 Next, the results of comparison of amplitude stability of the portal moving mechanism 3 in the case where the tube diaphragm pump 12 is attached to the gantry frame 5 (A) and the case where it is attached to the connecting beam 7 (B) are shown in the following table. It is shown in 1.
〔表中、移動速度は、レール２に沿って門型移動機構３が移動する速度を、整定距離はガントリーの振幅が安定するまでの距離を示す。〕
[In the table, the moving speed indicates the speed at which the portal moving mechanism 3 moves along the rail 2, and the settling distance indicates the distance until the amplitude of the gantry is stabilized. ]
表１に示したとおり、チューブフラムポンプ１２を連結ビーム７の中央部近辺に取り付けたＢの場合は、ガントリーフレームに取り付けたＡの場合に比較して２０ｍｍ以上も早くガントリーが安定することが分かる。 As shown in Table 1, in the case of B in which the tube diaphragm pump 12 is attached in the vicinity of the central portion of the connecting beam 7, it is understood that the gantry is stabilized 20 mm or more faster than in the case of A in which the tube fram pump 12 is attached to the gantry frame. .
本実施の形態の塗布装置によれば、上述したように、連結ビームの中央部にチューブフラムポンプが取り付けられた構成としたので、塗布中に送液ポンプと塗布エレメントとの距離が常に一定に保たれる。しかもこの距離が短いため、送液ポンプと塗布エレメントをつなぐフレキシブルチューブの配管内容積が変動しない。 これにより、塗布エレメントに備えられたスリットノズルからの吐出量も一定となり、均一な塗膜厚を得ることができる。
また、連結ビームの中央部に送液ポンプが取り付けられているため、左右門柱のバランスの調整が容易であり、移動時に発生する振動やピッチングを低減することができる。
According to the coating apparatus of the present embodiment, as described above, since the tube diaphragm pump is attached to the central portion of the connection beam, the distance between the liquid feed pump and the coating element is always constant during coating. Kept. And since this distance is short, the piping internal volume of the flexible tube which connects a liquid feeding pump and a coating element does not fluctuate. Thereby, the discharge amount from the slit nozzle provided in the coating element is also constant, and a uniform coating thickness can be obtained.
In addition, since the liquid feed pump is attached to the central portion of the connection beam, it is easy to adjust the balance of the left and right portal columns, and vibration and pitching that occur during movement can be reduced.
なお、本発明は、上述の実施の形態に限定されるものではなく、本発明の要旨を逸脱しない範囲でその他様々な構成が取り得る。 The present invention is not limited to the above-described embodiment, and various other configurations can be taken without departing from the gist of the present invention.
１・・・ベース、２・・・レール、３・・・門型移動機構、４・・・基板載置ステージ、５・・・ガントリーフレーム、６・・・エアパッド、７・・・連結ビーム、８・・・ノズル昇降機構、９・・・ノズルベースプレート、１０・・・スリットノズル、１１・・・レーザセンサ、１２・・・チューブフラムポンプ、１３・・・楔部材、１４、１５・・・フレキシブルチューブ、Ｗ・・・被処理基板
DESCRIPTION OF SYMBOLS 1 ... Base, 2 ... Rail, 3 ... Gate type moving mechanism, 4 ... Substrate mounting stage, 5 ... Gantry frame, 6 ... Air pad, 7 ... Connection beam, DESCRIPTION OF SYMBOLS 8 ... Nozzle raising / lowering mechanism, 9 ... Nozzle base plate, 10 ... Slit nozzle, 11 ... Laser sensor, 12 ... Tube fram pump, 13 ... Wedge member, 14, 15 ... Flexible tube, W ... Processed substrate
Claims (1)
Priority Applications (4)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2005240590A JP3938388B2 (en) | 2005-08-23 | 2005-08-23 | Coating device |
| TW095126258A TW200716263A (en) | 2005-08-23 | 2006-07-18 | A coating device for glass substrate or semiconductor wafer |
| CNA2006101112955A CN1919476A (en) | 2005-08-23 | 2006-08-21 | Applying device |
| KR1020070075305A KR20070079346A (en) | 2005-08-23 | 2007-07-26 | Coating apparatus |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2005240590A JP3938388B2 (en) | 2005-08-23 | 2005-08-23 | Coating device |
Related Child Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2006325174A Division JP2007083237A (en) | 2006-12-01 | 2006-12-01 | Coating apparatus |
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| Publication Number | Publication Date |
|---|---|
| JP2007054698A JP2007054698A (en) | 2007-03-08 |
| JP3938388B2 true JP3938388B2 (en) | 2007-06-27 |
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| JP2005240590A Active JP3938388B2 (en) | 2005-08-23 | 2005-08-23 | Coating device |
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| Country | Link |
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| JP (1) | JP3938388B2 (en) |
| KR (1) | KR20070079346A (en) |
| CN (1) | CN1919476A (en) |
| TW (1) | TW200716263A (en) |
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| KR100796425B1 (en) | 2005-08-23 | 2008-01-21 | 도쿄 오카 고교 가부시키가이샤 | Coating apparatus |
| CN102933314A (en) * | 2010-06-09 | 2013-02-13 | 夏普株式会社 | Leveling apparatus, coating film manufacturing apparatus provided with same, and coating film manufacturing method |
| CN103809390B (en) * | 2012-11-14 | 2016-08-31 | 沈阳芯源微电子设备有限公司 | A kind of development shower nozzle |
| US20180085774A1 (en) * | 2015-03-25 | 2018-03-29 | Lintec Corporation | Method for manufacturing molded article provided with gas barrier layer |
| JP7004546B2 (en) * | 2017-11-10 | 2022-01-21 | 東京応化工業株式会社 | Pump, coating device and coating method |
| US11660632B2 (en) * | 2018-03-28 | 2023-05-30 | Ecosys S.R.L. | Device for coating, in particular painting, the main surfaces of rigid panels with liquid products |
| CN111871710A (en) * | 2020-08-26 | 2020-11-03 | 深圳市宏锦电子有限公司 | Glue dispensing device |
| CN114405744B (en) * | 2022-02-08 | 2022-10-21 | 浙江荣泰电工器材股份有限公司 | Sizing process of low-solvent high-viscosity composite adhesive |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| US4715795A (en) * | 1985-02-14 | 1987-12-29 | Siemens Aktiengesellschaft | Metering pump |
| JPH09164357A (en) * | 1995-12-18 | 1997-06-24 | Dainippon Screen Mfg Co Ltd | Liquid coater |
| JP4301694B2 (en) * | 2000-05-02 | 2009-07-22 | 東京応化工業株式会社 | Coating device |
| JP4447331B2 (en) * | 2004-01-08 | 2010-04-07 | 大日本スクリーン製造株式会社 | Substrate processing apparatus and substrate processing method |
-
2005
- 2005-08-23 JP JP2005240590A patent/JP3938388B2/en active Active
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| TWI296944B (en) | 2008-05-21 |
| CN1919476A (en) | 2007-02-28 |
| KR20070079346A (en) | 2007-08-06 |
| TW200716263A (en) | 2007-05-01 |
| JP2007054698A (en) | 2007-03-08 |
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