JP3879116B2 - Heat sink support structure - Google Patents

Description

【０００１】
【発明の属する技術分野】
本発明は、基板上に立設した２個の放熱板の間に支持部材を架け渡してなる放熱板の支持構造に関する。
【０００２】
【発明が解決しようとする課題】
一般に、ユニット電源などの各種電子機器においては、プリント基板などの基板に立設してパワートランジスタや整流ダイオードなどの発熱する電子部品が実装されており、こうした電子部品の温度上昇を抑制するために、熱伝導性に優れた例えばアルミニウムなどの放熱板を電子部品の背面に熱接続して用いている。また、この放熱板を支持するために、プリント基板上に立設して向かい合う２個の放熱板の間には、板状の支持部材である支持板金が略水平に懸け渡されている。
【０００３】
図３および図４は、従来の放熱板の支持構造を示す側面図と斜視図である。これらの各図において、１は絶縁層の片面または両面に導電パターンを形成してなる基板すなわちプリント基板、２はこのプリント基板１の表面すなわち部品実装面上に設けられる特に発熱量の大きい電子部品で、これらの電子部品２は部品本体３の下端に延設する導電性のリード４が、プリント基板１の所定位置に形成したメッキスルーホール（図示せず）に挿通し、そこで半田付け接続されるようになっている。
【０００４】
11はアルミニウムなどの導電性に優れた部材で構成される放熱板で、これはプリント基板１に略直交する放熱部としての垂直部12と、この垂直部12の下端部よりＵ字状に折り返された部品取付け部13とを備えていると共に、垂直部12より下方に基板取付け部として複数の脚部15を延設している。そして、この脚部15の下端にあってプリント基板１の上面すなわち部品実装面に当接する折曲げ片16には、基板取付用のタップ孔17がバーリング加工により開口形成される。
【０００５】
部品取付け部13は脚部15とは別に形成され、脚部15の下端にある折曲げ片16よりも上方でＵ字状に折り返されている。そして、部品取付け部13の底面部全体に渡って、この底面部とプリント基板１との間には、電子部品２側に冷風（図３の符号Ｃ参照）を取り入れるための空気取入れ口18が形成される。この空気取入れ口18は、脚部15を下方に延ばすことにより、その開口面積をいくらでも簡単に広げることができる。また、発熱部品２の背面が当接する部品取付け部13の立上り部20は、プリント基板１の端縁に沿って立設する垂直部12に向き合うように形成され、この立上り部20と垂直部12との間には隙間21が形成される。
【０００６】
そして、脚部15の折曲げ片16をプリント基板１の部品実装面に載せた状態で、プリント基板１の下面すなわち半田面側からタップ孔14に止着部材であるねじ（図示せず）を螺着させることで、予め電子部品２を実装したプリント基板１の長手方向両側に沿って、２個の放熱板11，11が向かい合うように取付け固定される。また、電子部品２を構成する部品本体３の背面が部品取付け部13の立上り部20に熱的に接続固定される。なお、立上り部20に密着固定される電子部品２は、各電子部品２のディレーティングが満たされる範囲で、幾つ取付けても可能である。
【０００７】
25は、放熱板11，11間に架け渡された板金状の支持部材であり、これは各放熱板11，11の横方向から加えられる力Ｆにより、プリント基板１にストレス（ねじれ力）が発生するのを防止するために設けられている。具体的には、双方の放熱板11，11間に跨がる水平直線状の横架部26と、この横架部26の両端より垂直に折り曲げられて、前記放熱板11の横方向からの力Ｆを実質的に受ける当接部27とにより構成される。当接部27には、バーリング加工によるタップ孔28が開口形成されており、垂直部12に形成した孔29に止着部材であるねじ30を挿通し、このねじ30をタップ孔28に螺着することで、垂直部12の内側面に当接部27が当接した状態で、放熱板11と支持部材25との取付け固定が図られる。なお、23は横架部26に適合する形状に切り欠かれた溝で、これは支持部材25の位置決め用として、放熱板11の立上り部20上端に形成される。
【０００８】
そして、電子部品２の温度上昇に伴ないこの電子部品２が発熱すると、放熱板11の部品取付け部13に熱が直接伝導し、この部品取付け部13と反対側の垂直部12からその周辺にある空気と熱交換して放熱される。また、電子部品２の発熱に伴ない、その周辺にある熱を帯びた空気が上昇するため、この熱を帯びた空気の下方から、垂直部12の外側周囲にある冷風Ｃが、空気取入れ口18を通過して電子部品２側に取り込まれる。そして、電子部品２自体に冷風Ｃが導かれ、電子部品２と熱交換を行なうことで、熱を帯びた空気が再度上昇し、空気取入れ口18から新たな冷風Ｃが導入される。これを繰り返すことで、放熱板11の外側から電子部品２側に絶えず風の流動性が生じ、電子部品２の温度上昇が抑制される。それと共に、電子部品２の周辺にある他のプリント基板１に実装された発熱部品に対しても、この空気取入れ口18を通過する空気の流動性を利用して、熱のこもりを防止することが可能になる。こうして放熱板11の下部にある空気取入れ口18より空気の流動性が促進され、放熱板11とプリント基板１とにより囲まれた電子部品２の実装空間にある熱を速やかに上方へ放散させることが可能になる。
【０００９】
上記構成では、放熱板11，11間に跨って支持部材25を設けると共に、放熱板11，11の両外側からねじ30の締付けを行ない、放熱板11に当接部27を当接させることで、放熱板11，11の横方向からの力Ｆによるプリント基板１のストレスを防いでいる。しかし、支持部材25の当接部27を放熱板11の垂直部12に確実に当接させるには、ねじ30による締付け作業が必要不可欠となり、その際に支持部材25がゆがんだり、傾きが発生する虞れがあって、支持部材25本来の効力を充分発揮できない。
【００１０】
また、各放熱板11に支持部材25を取付け固定する際のねじ30の締付け方向が、それぞれ正反対になっているため、放熱板11，11付きのプリント基板１をいちいち回転させながら、ネジ30の締付け作業を行わざるを得ず、工程数が２つになって作業性の低下を招いていた。
【００１１】
本発明は、上記の課題に着目して成されたものであって、支持部材がゆがんだり傾いたりすることなく、支持部材を放熱板に確実に取付け固定することができ、さらには支持部材の当接部を放熱板の垂直部に確実に当接させることができると共に、支持部材が横方向 にずれることを確実に防止できる放熱板の支持構造をその第１の目的とする。
【００１２】
また、本発明の第２の目的は、止着部材の締付け作業が容易な放熱板の支持構造を提供することにある。
【００１３】
【課題を解決するための手段】
請求項１における放熱板の支持構造は、基板上に立設する２個の放熱板の間に支持部材を架け渡すと共に、前記放熱板は前記支持部材の両端部としての当接部が当接する垂直部と、この垂直部の内側に対向して設けられ、前記基板上に取付けられた電子部品に熱的に接続する部品取付け部とを有する放熱板の支持構造において、前記支持部材の両端部として、前記当接部より下方に延設した折曲片を形成し、前記折曲片を嵌合固定する嵌合部を前記放熱板の部品取付け部に形成し、前記折曲片を前記嵌合部に嵌合すると、前記部品取付け部の弾性復元力により、前記当接部と前記折曲片とを前記垂直部と前記部品取付け部との間に挟持するように構成される。
【００１４】
この場合、放熱板の部品取付け部に形成した嵌合部に、支持部材の両端部にある折曲片が嵌合すると、放熱板の垂直部に支持部材の当接部が当接した状態で、支持部材が各放熱板に取付け固定され、放熱板の垂直部外側からの力による基板のストレスを、支持部材によって防ぐことができる。また、支持部材の両端部が嵌合部に嵌合した段階で、放熱板と支持部材との固定が図られているので、その後止着部材による締付け作業を行なったとしても、支持部材がゆがんだり傾いたりせず、支持部材を放熱板に確実に取付け固定することができる。
【００１５】
さらに、支持部材の折曲片が嵌合部に嵌合すると、部品取付け部の弾性復元力により、支持部材の当接部と折曲片を放熱板の垂直部と部品取付け部で挟持するように構成しているので、支持部材の当接部を放熱板の垂直部に確実に当接させることができると共に、支持部材が横方向にずれることを確実に防止できる。
【００１６】
請求項２における放熱板の支持構造は、前記支持部材を前記放熱板に止着する止着部材をさらに備えると共に、前記止着部材を上方向から締付け可能にする取付孔を前記放熱板に形成して構成される。
【００１７】
この場合、支持部材を各放熱板に止着する際に使用する止着部材を、いずれも同じ上方向から締付けることができるため、止着部材の締付け作業が容易で、一つの工程で行なうことが可能になる。
【００１８】
【発明の実施形態】
以下、本発明における好ましい実施態様について、添付図面を参照して詳細に説明する。なお、前記従来例で示した図３および図４と同一部分には同一符号を付し、その共通する箇所の詳細な説明は重複するため省略する。
【００１９】
本発明の一実施例を示す図１および図２において、本実施例では支持部材25の両端部として、放熱板11の横方向からの力Ｆを実質的に受ける当接部27の他に、この当接部27より下方に延設し、放熱板11の部品取付け部13の立上り部20に向けてくの字状に折り曲げられた折曲片31が形成される。また、折曲片31に対応して、放熱板11の立上り部20には、この折曲片31を嵌合固定するための嵌合孔32が開口形成される。ここでは特に、支持部材25の両端部と放熱板11との嵌合固定を確実なものとするために、垂直部12と立上り部20との向かい合う面の間の横方向距離は、垂直部12に対向する当接部27の外側面から、立上り部20に対向する折曲片31の突出端部33に至る横方向距離よりも短かく形成されると共に、部品取付け部13は若干の弾性を有している。なお、嵌合部としては本実施例のような嵌合孔32ではなく、凹みとしたり、複数の孔や凹みを組み合わせてもよい。また、嵌合孔32に嵌合する折曲片31の形状も、実施例のものに限定されない。
【００２０】
また本実施例では、支持部材25の取付け位置を規定する位置決め用の溝23が、従来と同様に放熱板11の立上り部20上端に形成されるが、ここには支持部材25の横架部26が載るように水平方向に延びた載置片35が折曲げ形成される。この載置片35には、バーリング加工されたタップ孔36が垂直方向に開口形成されると共に、このタップ孔36に対応して、支持部材25の横架部26には、止着部材であるねじ37が挿通可能な孔38が垂直方向に形成される。各放熱板11にあるタップ孔36が、いずれもねじ37を上から螺着できるように形成されることで、各放熱板11，11と支持部材25とを止着するねじ37は、いずれも同じ締付け方向となる。また、ねじ37を締付けた状態では、放熱板11の載置片35の上面全体に渡って、支持部材25の横架部26が密着当接する。これにより、支持部材25が安定した状態で放熱板11の載置片35上に載置されると共に、部品取付け部13からの熱を、さらに熱伝導性に優れた材料からなる支持部材25で効果的に放熱させることも可能になる。なお、それ以外の構成は、従来例と共通している。
【００２１】
上記構成の放熱板11や支持部材25を組立てる際には、先ず放熱板11の最下部にある脚部15の折曲げ片16をプリント基板１の部品実装面に載せ、プリント基板１の半田面側からタップ孔14にねじを螺着する。これにより、電子部品２を実装したプリント基板１の長手方向両側に沿って、２個の放熱板11，11が向かい合うように取付け固定される。次に、放熱板11の内側にある部品取付け部13の立上り部20に、電子部品２を構成する部品本体３の背面を、例えばねじなどを利用して熱的に接続固定する。
【００２２】
プリント基板１に放熱板11を単に取付けただけでは、放熱板11の横方向からの力Ｆによって、放熱板11に比べて柔軟性に富むプリント基板１にストレスが加わる。このようなことを防止するために、放熱板11，11の間に金属製の支持部材25を取付け固定する。具体的には、支持部材25の横架部26が各々の放熱板11，11に形成した水平な載置片35に載るように、支持部材25を放熱板11，11の上端部から押し込む。すると、この支持部材25の上方からの押圧力によって各放熱板11，11の部品取付け部13が内側に若干弾性変形しながら、放熱板11，11の垂直部12と立上り部20との間に、支持部材25の両端部である当接部27と折曲片31が挿入する。やがて、支持部材25をある程度押し込むと、支持部材25の折曲片31に形成した突出端部33が、各放熱板11，11の嵌合孔32に嵌り込み、部品取付け部13が元の位置に復帰する。これにより、支持部材25の両端部（当接部27と折曲片31）は、放熱板11，11の垂直部12と立上り部20との間に挟持される状態となり、ねじ37を取り付けない状態で、各放熱板11，11に対する支持部材25の取付け固定が、支持部材25を上方から押し込むだけで達成される。それと共に、各放熱板11，11の垂直部12に支持部材25の当接部27が当接することで、放熱板11，11の横方向からの力Ｆによるプリント基板１のストレスを防止できる。
【００２３】
各放熱板11，11に対し支持部材25をさらに強固に固定するには、ねじ37を利用すればよい。具体的には、支持部材25に形成した孔38からねじ38を垂直方向に挿通し、その下にある放熱板11のタップ孔36にねじ38を螺着する。これにより、載置片35の上面全体に渡って横架部26が密着当接した状態で、支持部材25と放熱板11がさらに強固に固着される。その際、各放熱板11，11に対するねじ37の締付けがいずれも同じ上方向からであるため、ねじ37の締め付け作業が容易で、一つの工程で行なうことが可能になる。また、嵌合孔32と突出端部33との嵌合により、放熱板11，11と支持部材25はすでに固定された状態にあるので、ねじ37による締め付けの際に、支持部材25がゆがんだり、傾きが発生することがなく、支持部材25本来の効力を充分発揮できる。
【００２４】
なお、ここでのねじ37は補助的なものであって、嵌合孔32と突出端部33との嵌合により支持部材25が放熱板11，11に確実に固定されているならば、省略しても構わない。またねじ37に代わって、リベットのような止着部材を別に利用してもよい。
【００２５】
以上のように本実施例では、プリント基板１上に立設する２個の放熱板11，11の間に支持部材25を架け渡すと共に、放熱板11，11は支持部材25の両端部である当接部27が当接する垂直部12と、この垂直部12の内側に対向して設けられ、プリント基板１上に取付けられた電子部品２に熱的に接続する部品取付け部13とを有する放熱板11，11の支持構造において、支持部材 25 の両端部として、当接部 27 より下方に延設した折曲片 31 を形成し、この折曲片31を嵌合固定する嵌合部としての嵌合孔32を、放熱板11，11の部品取付け部13に形成している。
【００２６】
このようにすると、放熱板11，11の部品取付け部13に形成した嵌合孔32に、支持部材25の両端部にある折曲片31が嵌合すると、放熱板11，11の垂直部12に支持部材25の当接部27が当接した状態で、支持部材25が各放熱板11，11に取付け固定され、放熱板11，11の垂直部12外側からの力Ｆによるプリント基板１のストレスを、支持部材25によって防ぐことができる。また、支持部材25の折曲片31が嵌合孔32に嵌合した段階で、放熱板11，11と支持部材25との固定が図られているので、その後でねじ37による締付け作業を行なったとしても、支持部材25がゆがんだり傾いたりせず、支持部材25を放熱板11，11に確実に取付け固定することができる。
【００２７】
また本実施例では、支持部材25の折曲片31が嵌合孔32に嵌合すると、部品取付け部13の弾性復元力により、支持部材25の両端部（当接部27と折曲片31）を放熱板11，11の垂直部12と部品取付け部13で挟持するように構成しているので、支持部材25の当接部27を放熱板11，11の垂直部12に確実に当接させることができると共に、支持部材25が横方向にずれることを確実に防止できる。
【００２８】
また本実施例では、支持部材25を放熱板11，11に止着（螺着）する止着部材としてのねじ37を備えると共に、このねじ37を上方向から止着可能にする取付孔としてのタップ孔36を放熱板11，11に形成している。
【００２９】
こうすると、支持部材25を各放熱板11，11に止着する際に使用するねじ37を、いずれも同じ上方向から締付けることができるため、ねじ37の締め付け作業が容易で、一つの工程で行なうことが可能になる。
【００３０】
さらに、ねじ37により支持部材25を各放熱板11，11に止着すると、タップ孔38の周囲に形成した載置片35の上面全体に渡って支持部材25が密着当接するので、部品取付け部13から載置片35に達した熱を、さらに支持部材25で効果的に放熱させることも可能になる。
【００３１】
以上、前記実施例に基づき、電源装置に適用される放熱板の支持構造について説明してきたが、本発明は前記実施例に限定されるものではなく、種々の変形実施が可能である。
【００３２】
【発明の効果】
請求項１の放熱板の支持構造によれば、支持部材がゆがんだり傾いたりすることなく、支持部材を放熱板に確実に取付け固定することができ、さらには支持部材の当接部を放熱板の垂直部に確実に当接させることができると共に、支持部材が横方向にずれることを確実に防止できる。
【００３３】
請求項２の放熱板の支持構造によれば、止着部材の締付け作業が容易で、一つの工程で行なうことが可能になる。
【図面の簡単な説明】
【図１】 本発明の一実施例における放熱板の支持構造を示した側面図である。
【図２】同上要部の斜視図である。
【図３】 従来例における放熱板の支持構造を示した側面図である。
【図４】 従来例における要部の斜視図である。
【符号の説明】
１ プリント基板（基板）
２ 電子部品
11 放熱板
12 垂直部
13 部品取付け部
25 支持部材
27 当接部（両端部）
31 折曲片（両端部）
32 嵌合孔（嵌合部）
36 タップ孔（取付孔）[0001]
BACKGROUND OF THE INVENTION
The present invention relates to a heat sink support structure in which a support member is bridged between two heat sinks erected on a substrate.
[0002]
[Problems to be solved by the invention]
Generally, in various electronic devices such as unit power supplies, electronic components that generate heat such as power transistors and rectifier diodes are mounted on a printed circuit board or the like. In order to suppress the temperature rise of these electronic components For example, a heat radiating plate such as aluminum having excellent thermal conductivity is used by being thermally connected to the back surface of the electronic component. Further, in order to support the heat radiating plate, a support metal plate, which is a plate-like support member, is suspended substantially horizontally between two heat radiating plates that are erected on the printed board and face each other.
[0003]
3 and 4 are a side view and a perspective view showing a conventional support structure for a heat sink. In each of these figures, 1 is a substrate formed by forming a conductive pattern on one or both sides of an insulating layer, that is, a printed circuit board, and 2 is an electronic component having a particularly large heat generation provided on the surface of this printed circuit board 1, that is, on the component mounting surface. In these electronic components 2, conductive leads 4 extending to the lower end of the component body 3 are inserted into plated through holes (not shown) formed at predetermined positions on the printed circuit board 1, and soldered there. It has become so.
[0004]
Reference numeral 11 denotes a heat radiating plate made of a member having excellent conductivity such as aluminum, which is folded in a U shape from a vertical portion 12 as a heat radiating portion substantially orthogonal to the printed circuit board 1 and a lower end portion of the vertical portion 12. And a plurality of leg portions 15 extending as substrate attachment portions below the vertical portion 12. Then, a tapped hole 17 for mounting the board is formed in the bent piece 16 at the lower end of the leg portion 15 and in contact with the upper surface of the printed circuit board 1, that is, the component mounting surface, by burring.
[0005]
The component mounting portion 13 is formed separately from the leg portion 15 and is folded back in a U shape above the folding piece 16 at the lower end of the leg portion 15. An air intake 18 is provided between the bottom surface portion and the printed circuit board 1 over the entire bottom surface portion of the component mounting portion 13 for taking in cold air (see symbol C in FIG. 3) on the electronic component 2 side. It is formed. The air intake port 18 can easily expand the opening area as much as possible by extending the leg portion 15 downward. Further, the rising portion 20 of the component mounting portion 13 with which the back surface of the heat generating component 2 abuts is formed so as to face the vertical portion 12 erected along the edge of the printed circuit board 1, and the rising portion 20 and the vertical portion 12 are formed. A gap 21 is formed between the two.
[0006]
Then, with the bent piece 16 of the leg 15 placed on the component mounting surface of the printed circuit board 1, a screw (not shown) as a fastening member is attached to the tap hole 14 from the lower surface of the printed circuit board 1, that is, the solder surface side. By screwing, the two heat radiating plates 11 and 11 are attached and fixed so as to face each other along both longitudinal sides of the printed circuit board 1 on which the electronic component 2 is mounted in advance. Further, the back surface of the component main body 3 constituting the electronic component 2 is thermally connected and fixed to the rising portion 20 of the component mounting portion 13. It should be noted that any number of electronic components 2 that are tightly fixed to the rising portion 20 can be attached as long as the derating of each electronic component 2 is satisfied.
[0007]
Reference numeral 25 denotes a sheet metal-like support member that spans between the heat sinks 11 and 11, and this causes stress (twisting force) to the printed circuit board 1 due to the force F applied from the lateral direction of each of the heat sinks 11 and 11. It is provided to prevent the occurrence. Specifically, a horizontal linearly extending horizontal part 26 straddling between the two heat sinks 11 and 11, and bent vertically from both ends of the horizontal part 26, the horizontal direction of the heat sink 11 It is comprised by the contact part 27 which receives the force F substantially. A tap hole 28 formed by burring is formed in the contact portion 27, and a screw 30 as a fastening member is inserted into the hole 29 formed in the vertical portion 12, and the screw 30 is screwed into the tap hole 28. As a result, the heat radiating plate 11 and the support member 25 can be mounted and fixed in a state where the contact portion 27 is in contact with the inner surface of the vertical portion 12. Reference numeral 23 denotes a groove cut out in a shape suitable for the horizontal portion 26, which is formed at the upper end of the rising portion 20 of the heat sink 11 for positioning the support member 25.
[0008]
When the electronic component 2 generates heat as the temperature of the electronic component 2 rises, heat is directly conducted to the component mounting portion 13 of the heat radiating plate 11, and from the vertical portion 12 on the opposite side to the component mounting portion 13 to the periphery thereof. Heat is dissipated by exchanging heat with certain air. In addition, as the electronic component 2 generates heat, the heated air around it rises, so that the cold air C around the outside of the vertical portion 12 flows from the lower side of the heated air to the air intake port. 18 passes through the electronic component 2 side. Then, the electronic component 2 itself cool air C is guided, by performing the electronic component 2 and the heat exchanger, increases air tinged heat again, a new cold air C is introduced from the air inlet 18. By repeating this, wind fluidity is constantly generated from the outside of the heat dissipation plate 11 to the electronic component 2 side, and the temperature rise of the electronic component 2 is suppressed. At the same time, heat buildup is prevented by using the fluidity of the air passing through the air intake port 18 for the heat generating components mounted on other printed circuit boards 1 around the electronic component 2. Is possible. In this way, air fluidity is promoted from the air intake port 18 below the heat sink 11, and heat in the mounting space of the electronic component 2 surrounded by the heat sink 11 and the printed circuit board 1 is quickly dissipated upward. Is possible.
[0009]
In the above configuration, the support member 25 is provided across the heat sinks 11 and 11, the screws 30 are tightened from both outer sides of the heat sinks 11 and 11, and the contact portion 27 is brought into contact with the heat sink 11. The stress of the printed circuit board 1 due to the force F from the lateral direction of the heat sinks 11 and 11 is prevented. However, in order to ensure that the contact portion 27 of the support member 25 is in contact with the vertical portion 12 of the heat sink 11, the tightening work with the screw 30 is indispensable, and at that time, the support member 25 is distorted or tilted. Therefore, the original effect of the support member 25 cannot be fully exhibited.
[0010]
In addition, since the tightening directions of the screws 30 when mounting and fixing the support members 25 to the respective heat sinks 11 are opposite to each other, the screw 30 is rotated while rotating the printed circuit board 1 with the heat sinks 11 and 11 one by one. The tightening work was unavoidable, and the number of processes was two, leading to a decrease in workability.
[0011]
The present invention has been made paying attention to the above-mentioned problem , and can support and fix the support member to the heat radiating plate reliably without the support member being distorted or tilted . A first object of the present invention is to provide a heat sink supporting structure that can reliably abut the abutting portion against the vertical portion of the heat radiating plate and can reliably prevent the support member from being displaced laterally .
[0012]
A second object of the present invention is to provide a support structure for a heat radiating plate in which a fastening member can be easily tightened.
[0013]
[Means for Solving the Problems]
The heat sink support structure according to claim 1, wherein a support member is bridged between two heat sinks erected on a substrate, and the heat sink is a vertical portion where contact portions as both ends of the support member abut. And in the support structure of the heat sink having a component mounting portion that is provided facing the inside of the vertical portion and thermally connected to the electronic component mounted on the substrate, as both ends of the support member, A bent piece extending downward from the abutting portion is formed, a fitting portion for fitting and fixing the bent piece is formed in a component mounting portion of the heat sink , and the bent piece is connected to the fitting portion. Is fitted to the vertical portion and the component mounting portion by the elastic restoring force of the component mounting portion .
[0014]
In this case, when the bent pieces at both ends of the support member are fitted to the fitting portion formed in the component mounting portion of the heat sink, the contact portion of the support member is in contact with the vertical portion of the heat sink. The support member is attached and fixed to each heat sink, and the stress on the substrate due to the force from the outside of the vertical portion of the heat sink can be prevented by the support member. In addition, since the heat radiation plate and the support member are fixed at the stage where both end portions of the support member are fitted to the fitting portion, the support member may be damaged even if the fastening operation is subsequently performed by the fastening member. The support member can be securely attached and fixed to the heat sink without tilting.
[0015]
Further, when the bent piece of the support member is fitted into the fitting portion, the contact portion of the support member and the bent piece are sandwiched between the vertical portion of the heat sink and the component mounting portion by the elastic restoring force of the component mounting portion. Accordingly, the abutting portion of the support member can be reliably abutted against the vertical portion of the heat radiating plate, and the support member can be reliably prevented from shifting in the lateral direction.
[0016]
The heat sink support structure according to claim 2, further comprising a fastening member that fastens the support member to the heat sink, and an attachment hole that allows the fastening member to be tightened from above. Configured.
[0017]
In this case, since the fastening members used when fastening the support member to each heat sink can be fastened from the same upper direction, the fastening work of the fastening members is easy and performed in one step. Is possible.
[0018]
DETAILED DESCRIPTION OF THE INVENTION
Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings. 3 and FIG. 4 shown in the conventional example are denoted by the same reference numerals, and detailed description of common portions is omitted because it is duplicated.
[0019]
In FIG. 1 and FIG. 2 showing an embodiment of the present invention, in this embodiment, as both ends of the support member 25, in addition to the contact portion 27 that substantially receives the force F from the lateral direction of the radiator plate 11, A bent piece 31 is formed that extends downward from the contact portion 27 and is bent in a U-shape toward the rising portion 20 of the component mounting portion 13 of the heat sink 11. Corresponding to the bent piece 31, a fitting hole 32 for fitting and fixing the bent piece 31 is formed in the rising portion 20 of the heat radiating plate 11. Here, in particular, in order to ensure that the both ends of the support member 25 and the heat radiating plate 11 are fitted and fixed, the lateral distance between the surfaces of the vertical portion 12 and the rising portion 20 facing each other is the vertical portion 12. Is formed to be shorter than the lateral distance from the outer surface of the abutting portion 27 facing to the protruding end portion 33 of the bent piece 31 facing the rising portion 20, and the component mounting portion 13 has a slight elasticity. Have. In addition, as a fitting part, you may set it as a dent instead of the fitting hole 32 like a present Example, and may combine a some hole and dent. Further, the shape of the bent piece 31 fitted into the fitting hole 32 is not limited to that of the embodiment.
[0020]
Further, in this embodiment, the positioning groove 23 that defines the mounting position of the support member 25 is formed at the upper end of the rising portion 20 of the heat sink 11 as in the prior art, but here the horizontal portion of the support member 25 A placing piece 35 extending in the horizontal direction so that 26 is placed is bent. A burring tap hole 36 is formed in the mounting piece 35 in the vertical direction, and the horizontal portion 26 of the support member 25 is a fastening member corresponding to the tap hole 36. A hole 38 through which the screw 37 can be inserted is formed in the vertical direction. The tapped holes 36 in each of the heat sinks 11 are formed so that the screws 37 can be screwed from above, so that the screws 37 for fixing the heat sinks 11 and 11 and the support member 25 are all Same tightening direction. Further, when the screw 37 is tightened, the horizontal portion 26 of the support member 25 is in close contact with the entire upper surface of the mounting piece 35 of the heat radiating plate 11. As a result, the support member 25 is placed on the placement piece 35 of the heat sink 11 in a stable state, and the heat from the component mounting portion 13 is further increased by the support member 25 made of a material having excellent thermal conductivity. It is also possible to dissipate heat effectively. Other configurations are common to the conventional example.
[0021]
When assembling the heat radiating plate 11 and the support member 25 having the above-described configuration, first, the bent piece 16 of the leg 15 at the bottom of the heat radiating plate 11 is placed on the component mounting surface of the printed circuit board 1 and the solder surface of the printed circuit board 1. A screw is screwed into the tap hole 14 from the side. Thereby, the two heat sinks 11 and 11 are attached and fixed so as to face each other along the longitudinal direction both sides of the printed circuit board 1 on which the electronic component 2 is mounted. Next, the rear surface of the component main body 3 constituting the electronic component 2 is thermally connected and fixed to the rising portion 20 of the component mounting portion 13 inside the heat sink 11 using, for example, screws.
[0022]
If the heat sink 11 is simply attached to the printed board 1, stress is applied to the printed board 1, which is more flexible than the heat sink 11, by the force F from the lateral direction of the heat sink 11. In order to prevent this, a metal support member 25 is attached and fixed between the heat sinks 11 and 11. Specifically, the support member 25 is pushed from the upper end portions of the heat radiation plates 11 and 11 so that the horizontal portion 26 of the support member 25 is placed on a horizontal placement piece 35 formed on each of the heat radiation plates 11 and 11. Then, the component mounting portion 13 of each heat sink 11, 11 is slightly elastically deformed inward by the pressing force from above the support member 25, and between the vertical portion 12 and the rising portion 20 of the heat sink 11, 11. Then, the contact part 27 and the bent piece 31 which are both ends of the support member 25 are inserted. Eventually, when the support member 25 is pushed in to some extent, the protruding end portion 33 formed in the bent piece 31 of the support member 25 fits into the fitting hole 32 of each of the heat sinks 11 and 11, and the component mounting portion 13 is in its original position. Return to. As a result, both end portions (the contact portion 27 and the bent piece 31) of the support member 25 are sandwiched between the vertical portion 12 and the rising portion 20 of the heat sinks 11 and 11, and the screw 37 is not attached. In this state, the attachment and fixing of the support member 25 to each of the heat radiating plates 11 and 11 is achieved simply by pushing the support member 25 from above. At the same time, the abutting portion 27 of the support member 25 abuts on the vertical portion 12 of each of the heat radiating plates 11, 11, thereby preventing stress on the printed circuit board 1 due to the force F from the lateral direction of the radiating plates 11, 11.
[0023]
In order to more firmly fix the support member 25 to each of the heat radiating plates 11, 11, a screw 37 may be used. Specifically, the screw 38 is inserted in the vertical direction from the hole 38 formed in the support member 25, and the screw 38 is screwed into the tap hole 36 of the heat sink 11 therebelow. Thus, the support member 25 and the heat radiating plate 11 are more firmly fixed in a state in which the horizontal portion 26 is in close contact with the entire upper surface of the mounting piece 35. At this time, since the screws 37 are fastened to the heat radiating plates 11 and 11 from the same upper direction, the screw 37 can be easily tightened and can be performed in one process. Further, since the heat sinks 11 and 11 and the support member 25 are already fixed due to the fitting between the fitting hole 32 and the protruding end 33, the support member 25 may be distorted when tightening with the screw 37. The tilting does not occur, and the original effect of the support member 25 can be sufficiently exerted.
[0024]
Note that the screw 37 here is auxiliary, and is omitted if the support member 25 is securely fixed to the heat sinks 11 and 11 by fitting the fitting hole 32 and the projecting end portion 33. It doesn't matter. Further, instead of the screw 37, a fastening member such as a rivet may be used separately.
[0025]
As described above, in this embodiment, the support member 25 is bridged between the two heat sinks 11 and 11 standing on the printed circuit board 1, and the heat sinks 11 and 11 are both ends of the support member 25. Heat dissipation having a vertical portion 12 with which the abutting portion 27 abuts, and a component mounting portion 13 provided facing the inner side of the vertical portion 12 and thermally connected to the electronic component 2 mounted on the printed circuit board 1. In the support structure of the plates 11 and 11, as both end portions of the support member 25 , a bent piece 31 extending downward from the contact portion 27 is formed, and the bent piece 31 is used as a fitting portion for fitting and fixing. A fitting hole 32 is formed in the component mounting portion 13 of the heat sinks 11 and 11.
[0026]
In this way, when the bent pieces 31 at both ends of the support member 25 are fitted into the fitting holes 32 formed in the component mounting portion 13 of the heat sinks 11 and 11, the vertical portions 12 of the heat sinks 11 and 11 are fitted. With the contact portion 27 of the support member 25 being in contact with the support member 25, the support member 25 is attached and fixed to each of the heat sinks 11, 11. Stress can be prevented by the support member 25. Further, since the heat radiation plates 11 and 11 and the support member 25 are fixed at the stage where the bent piece 31 of the support member 25 is fitted into the fitting hole 32, the tightening work with the screw 37 is performed thereafter. Even if this is the case, the support member 25 is not distorted or tilted, and the support member 25 can be securely attached and fixed to the heat sinks 11 and 11.
[0027]
Further, in this embodiment, when the bent piece 31 of the support member 25 is fitted into the fitting hole 32, both ends of the support member 25 (the contact portion 27 and the bent piece 31 are caused by the elastic restoring force of the component mounting portion 13. ) Is sandwiched between the vertical part 12 of the heat sinks 11 and 11 and the component mounting part 13, so that the contact part 27 of the support member 25 is securely in contact with the vertical part 12 of the heat sinks 11 and 11. In addition, the support member 25 can be reliably prevented from shifting in the lateral direction.
[0028]
Further, in this embodiment, a screw 37 is provided as a fastening member for fastening (screwing) the support member 25 to the heat radiating plates 11, 11, and as a mounting hole that allows the screw 37 to be fastened from above. Tap holes 36 are formed in the heat sinks 11 and 11.
[0029]
In this way, since the screws 37 used for fixing the support member 25 to the respective heat sinks 11 and 11 can be tightened from the same upper direction, the screw 37 can be easily tightened in one process. It becomes possible to do.
[0030]
Further, when the support member 25 is fixed to each of the heat sinks 11 and 11 with the screws 37, the support member 25 comes into close contact with the entire upper surface of the mounting piece 35 formed around the tap hole 38, so that the component mounting portion It is also possible to effectively dissipate the heat reaching the mounting piece 35 from 13 by the support member 25.
[0031]
As mentioned above, based on the said Example, although the support structure of the heat sink applied to a power supply device has been demonstrated, this invention is not limited to the said Example, A various deformation | transformation implementation is possible.
[0032]
【The invention's effect】
According to the support structure of the heat sink of claim 1, the support member can be securely attached to and fixed to the heat sink without the support member being distorted or inclined, and the contact portion of the support member can be fixed to the heat sink. of it is possible to reliably abut the vertical portion, the support member is Ru can be reliably prevented from being displaced laterally.
[0033]
According to the support structure of the heat sink of claim 2, the fastening operation of the fastening member is easy and can be performed in one step.
[Brief description of the drawings]
FIG. 1 is a side view showing a heat sink support structure in an embodiment of the present invention.
FIG. 2 is a perspective view of the main part.
FIG. 3 is a side view showing a heat sink support structure in a conventional example.
FIG. 4 is a perspective view of a main part in a conventional example.
[Explanation of symbols]
1 Printed circuit board (board)
2 Electronic parts
11 Heat sink
12 Vertical section
13 Parts mounting part
25 Support member
27 Abutment (both ends)
31 Folded piece (both ends)
32 Fitting hole (fitting part)
36 Tap holes (mounting holes)

Claims (2)

基板上に立設する２個の放熱板の間に支持部材を架け渡すと共に、前記放熱板は前記支持部材の両端部としての当接部が当接する垂直部と、この垂直部の内側に対向して設けられ、前記基板上に取付けられた電子部品に熱的に接続する部品取付け部とを有する放熱板の支持構造において、
前記支持部材の両端部として、前記当接部より下方に延設した折曲片を形成し、
前記折曲片を嵌合固定する嵌合部を前記放熱板の部品取付け部に形成し、
前記折曲片を前記嵌合部に嵌合すると、前記部品取付け部の弾性復元力により、前記当接部と前記折曲片とを前記垂直部と前記部品取付け部との間に挟持する構成としたことを特徴とする放熱板の支持構造。A support member is bridged between two heat sinks erected on the substrate, and the heat sink is opposed to the vertical portion where the contact portions as both ends of the support member are in contact with the inside of the vertical portion. In a heat sink support structure having a component mounting portion provided and thermally connected to an electronic component mounted on the substrate,
As both ends of the support member, a bent piece extending downward from the contact portion is formed,
Forming a fitting portion for fitting and fixing the bent piece on the component mounting portion of the heat sink ,
When the bent piece is fitted to the fitting portion, the contact portion and the bent piece are sandwiched between the vertical portion and the component mounting portion by an elastic restoring force of the component mounting portion. the support structure of the heat sink, characterized in that the the. 前記支持部材を前記放熱板に止着する止着部材をさらに備えると共に、前記止着部材を上方向から止着可能にする取付孔を前記放熱板に形成したことを特徴とする請求項１記載の放熱板の支持構造。  2. The heat radiation plate according to claim 1, further comprising a fastening member that fastens the support member to the heat radiating plate, and an attachment hole that allows the fastening member to be fastened from above. Support structure for heat sink.

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