JP3871430B2 - Pressure sensor - Google Patents

Pressure sensor Download PDF

Info

Publication number
JP3871430B2
JP3871430B2 JP03720298A JP3720298A JP3871430B2 JP 3871430 B2 JP3871430 B2 JP 3871430B2 JP 03720298 A JP03720298 A JP 03720298A JP 3720298 A JP3720298 A JP 3720298A JP 3871430 B2 JP3871430 B2 JP 3871430B2
Authority
JP
Japan
Prior art keywords
terminal
base member
pressure
circuit board
pressure sensor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP03720298A
Other languages
Japanese (ja)
Other versions
JPH11237291A (en
Inventor
幸造 山岸
陽司 芹沢
晴彦 関谷
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nagano Keiki Co Ltd
Original Assignee
Nagano Keiki Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nagano Keiki Co Ltd filed Critical Nagano Keiki Co Ltd
Priority to JP03720298A priority Critical patent/JP3871430B2/en
Priority to DE69815801T priority patent/DE69815801T2/en
Priority to US09/208,689 priority patent/US6298730B1/en
Priority to EP98310141A priority patent/EP0922946B1/en
Publication of JPH11237291A publication Critical patent/JPH11237291A/en
Application granted granted Critical
Publication of JP3871430B2 publication Critical patent/JP3871430B2/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Images

Landscapes

  • Measuring Fluid Pressure (AREA)

Description

【0001】
【発明の属する技術分野】
本発明は、圧力センサに係り、流体の圧力を電気信号に変換して外部に出力する圧力センサに関する。
【0002】
【背景技術】
流体圧力の測定には、被検知圧力および大気圧の圧力差を検出して電気信号に変換する圧力センサが用いられている。
このような圧力センサは、被設置部に締着固定される継手と、継手にビーム溶接等によって取り付けられる圧力検出素子と、圧力検出素子に電気的に接続される出力手段とを備え、継手の圧力導入孔内に導かれた流体圧が圧力検出素子を形成するダイアフラムの歪みに変換され、この歪みがダイアフラム上の歪みゲージで検出され、この歪みゲージの抵抗値に応じた電気信号が出力手段からコネクタやケーブルを介して出力されるようになっている。
【0003】
このような圧力センサの出力手段は、中央に開口を有する環状の回路基板を含んで構成されている。そして、回路基板の開口内に圧力検出素子を位置させることにより、圧力検出素子のダイアフラムと回路基板とをほぼ面一にし、ダイアフラム上の歪みゲージと回路基板上のパッドとをワイヤーボンディング等で電気的に接続している。
【0004】
ところで、このような圧力センサによれば、回路基板の開口部分やボンディング用のパッド部分にはIC、コンデンサ、抵抗等の電気回路部品を実装できないため、その分回路基板の径寸法を大きくして実装面積を確保する必要がある。従って、圧力センサ全体の径寸法も大きくなるため、被設置部周りの形状やスペースによってはボックスレンチが入らず、圧力センサの取付作業が困難な場合がある。
【0005】
一方、圧力センサの中には、実開平6−2189号公報に示すように、圧力検出素子と回路基板とを離間させるとともに、回路基板から圧力検出素子側に向かってL字形の端子を突出させ、この端子と歪みゲージとをワイヤーボンディングによって電気的に接続したものがある。このような圧力センサでは、圧力検出素子と回路基板とを離間させるうえ、回路基板には前述のような開口が設けられないため、回路基板の両面全域に電気回路部品を実装することで回路基板の径寸法を小さくでき、その分圧力センサ全体を小径化して小スペースに対応できるというメリットがある。
【0006】
【発明が解決しようとする課題】
しかしながら、前述の公報記載の圧力センサによれば、L字形の端子の一端は回路基板に固定されているものの、他端すなわちワイヤーボンディングの結線側が回路基板と圧力検出素子との間に宙吊り状態で位置しているため、金線等のワイヤーに超音波振動を付与しながら行う通常のボンディングでは、端子の結線部分も一緒に振動してまう可能性があり、ボンディングによる端子とワイヤーとの接合強度が低下するという心配がある。
【0007】
本発明の目的は、小径化を図った場合でも、ワイヤボンディングによる端子とワイヤ−との接合強度を確実に確保できる圧力センサを提供することにある。
【0008】
【課題を解決するための手段】
本発明の圧力センサは、継手に設けられた圧力導入孔の一端側に取り付けられる圧力検出素子と、この圧力検出素子の周囲に配置されて前記継手に固定される台部材と、この台部材に一端側が固定されかつ他端側が前記圧力検出素子に対して離間した回路基板に接続される端子とを備え、この端子の前記台部材への固定端側に前記圧力検出素子との間で行われるワイヤーボンディング用の結線部が設けられており、この結線部は板状であるとともに、前記台部材の周方向に沿った短辺と径方向に沿った長辺とを有し、かつ長辺側の一対の辺縁が連続して前記台部材に埋設されていることを特徴とするものである。
【0009】
このような圧力センサにおいては、端子におけるワイヤーボンディング用の結線部が設けられた側を台部材で固定するため、ボンディング中に超音波振動を付与しても端子まで振動する心配がない。従って、ワイヤボンディングを良好な状態で行え、端子とワイヤ−との接合強度が確実に確保されるようになる。
この際、圧力検出素子と回路基板とを互いに離間させるため、回路基板に従来のような開口を設ける必要がなく、その分回路基板の径寸法を小さくして圧力センサの小径化も図られる。
【0010】
また、以上において、端子の前記固定端側を結線部が露出した状態で台部材に埋設させるので、台部材と端子との固定状態が良好に維持され、端子への超音波振動による影響がより低減される。
【0011】
また、台部材を樹脂製とし、端子を台部材にインサートモールドすることで埋設してもよく、こうすることにより、端子を埋設させた台部材が簡単かつ安価に製作されるうえ、互いに一体に成形されることで取り扱いも容易である。
【0012】
【発明の実施の形態】
以下、本発明の各実施形態を図面に基づいて説明する。
〔第1実施形態〕
図1は、本実施形態に係る圧力センサ1を示す断面図、図2は、その分解斜視図である。
【0013】
圧力センサ1は、図中の二点鎖線で示す被設置部Aの挿入孔Bに螺入される継手10と、継手10にビーム溶接された圧力検出素子20と、検出した圧力に応じて外部に電気信号を出力する出力手段30とを備えたものであり、車載用で油圧を検出するセンサである。
【0014】
継手10は、金属製とされているとともに、図中の上下(以下、上および下の記載は、図中での位置を意味し、必ずしも実際に取り付けられた場合の位置を意味するものではない)に貫通した圧力導入孔11を備えている。
【0015】
この圧力導入孔11の上部には、一回り大きな径寸法の嵌合部12が設けられ、この嵌合部12には、引抜加工で得られるパイプ13が圧力導入孔11から一部突出した状態に嵌合している。そして、パイプ13に設けられた貫通孔14の径寸法は、圧力導入孔11の径寸法よりも小さく、これによって圧力導入孔11内の容積がより小さく調整され、また、パイプ13が圧力検出素子20を溶接する際の裏あて部材を兼ねるようになっている。そして、圧力導入孔11の上部外周縁部分にはテーパ面15が設けられ、テーパ面15のさらに外周側には一段低い位置決め溝16が設けられている。
【0016】
この位置決め溝16は、後述するケース31の取付時に利用されるものであり、平面環状に連続して設けられている。位置決め溝16の底面側(すなわち深さ方向の奥側)は、圧力導入孔11の径方向の内側に向かって抉られた状態に設けられている。
【0017】
圧力検出素子20は、金属ダイアフラム21の上面に酸化シリコン等の絶縁膜を介して歪みゲージを設けた歪みゲージ型の素子(モジュール)である。この圧力検出素子20では、ダイアフラム21が下方の筒状部22と一体に形成され、筒状部22の内側面をパイプ13の外側面に接触させることにより、圧力検出素子20全体がガイドされながら継手10の上部に配置され、これによって筒状部22の内部と圧力導入孔11とが連通してダイアフラム21の感圧面に油圧が作用する。そして、筒状部22の下端には継手10のテーパ面15と対向当接する別のテーパ面23が設けられ、各テーパ面15,23同士が当接した状態でその傾斜角度に沿った方向からビーム溶接されている。
【0018】
出力手段30は、金属製のケース31と、ケース31内の底部分に接着されて圧力検出素子20を囲う樹脂製の台部材32と、圧力検出素子20の上方に配置された回路基板33と、これらの各部材31〜33の全体を覆う樹脂製のコネクタ34とで構成され、台部材32および回路基板33が第1端子35で接続され、回路基板33およびコネクタ34が第2端子36で電気的に接続されている。
【0019】
ケース31は、回路基板33の両面に実装されたIC、コンデンサ、抵抗等の電気回路部品50をノイズから保護する電磁遮蔽用の部材であり、底部分が継手10の取付面10B上に配置された状態でプロジェクション溶接等され、底の中央部分に設けられた開口を通して圧力検出素子20がケース31内に収容されるようになっている。ケース31の底側開口部周縁の一部分には、しぼり加工等によって下方に折曲した突起部31Aが設けられており、この突起部31Aが断面凹略状に設けられた前記位置決め溝16の上部周縁に嵌合係止し、これによってケース31が継手10に対して位置決めされるようになっている。また、ケース31の底側開口部周縁の他の部分には、上方に折曲した突片31B(図2)が設けられ、この突片31Bが台部材32を取り付ける際に利用される。
【0020】
このケース31には、側面の一部をプレスや切り起こし等で加工した支持部37が設けられ、この支持部37上に回路基板33が載置されるようになっている。また、ケース31の上端縁の一部には、回路基板33の上面に折り曲げられる接点部38が設けられており、接点部38を介して回路基板33のアースラインとケース31(最終的には継手10)とが電気的に接続されることで、回路基板33の下面に実装されてケース31に囲われた電気回路部品50が確実に電磁遮蔽され、また、その接点部38によって回路基板33がケース31に上方から確実に押さえ込まれるようになっている。
【0021】
台部材32にはケース31の突片31Bに対応した挿入部32A(図2)が設けられ、接着剤を台部材32の下面に塗布するのみならず挿入部32A内にも充填することにより、この挿入部32Aと突片31Bとを嵌合させて台部材32を取り付け、これによってケース31に対する台部材32の取付強度を向上させている。
【0022】
このような台部材32に固定された第1端子35の下端側は、台部材32の上面に露出した部分が結線部35Aとなっており、この結線部35Aと圧力検出素子20の前述した歪みゲージとが金線39によるワイヤーボンディングで電気的に接続されている。この際、第1端子35は、図3,4に示すように、固定部35Bが台部材32にインサートモールドされることで埋設固定されており、特に結線部35Aの長辺側の辺縁35Cも連続して台部材32に埋設されることで、金線35に超音波振動を付与して行われるボンディング中の第1端子35の振動がより確実に抑えられるようになっている。
【0023】
コネクタ34には樹脂製の受部材52にインサートモールドされた複数のターミナル53が設けられ、これらのターミナル53の下端側に穿設された挿通孔に第2端子36の上端側が挿通されて半田付けされている。各ターミナル53は、受部材52ごとコネクタ本体54の内側から固定され、外側に貫通した先端のみが露出するようになっている。受部材52の下部側にはケース31の上端縁と当接して支持される受部52Aが設けられ、受部材52がコネクタ本体54の挿入部69から外れるのを防止している。
【0024】
このようなコネクタ本体54の下端側は、継手10の薄肉状のかしめ部である立上部17の内側にOリング56を介して位置されるとともに、その内面がケース31の外面と近接対向するようになっており、立上部17の先端をかしめることで継手10に固定される。なお、コネクタ本体54の内面とケース31の外面とは、図1に示すように互いに接触していることが好ましいが、コネクタ34の内側への収縮をシール性が失われない程度に抑制できれば、若干の隙間を空けて近接対向させてもよい。
【0025】
このような出力手段30では、圧力検出素子20のダイアフラム21に作用する圧力は、ダイアフラム21上の歪みゲージおよびこれに第1端子35を介して接続された回路基板33上の電気回路によって電気抵抗値に変換され、さらに、電気回路によってその抵抗値が所定の電気信号に変換され、その電気信号が第2端子36を介してコネクタ34のターミナル53から出力される。
【0026】
このような本実施形態においては、先ず、継手10に圧力検出素子20をビーム溶接する。
次いで、ケース31を上方から継手10に配置するとともに、ケース31の突起部31Aを位置決め溝16に係止させることでケース31を位置決めし、この後、ケースを継手10に対してプロジェクション溶接で固定する。
そして、台部材32の下面および挿入部32Aに接着剤を塗布および充填した後、その挿入部32Aと突片31Bとを嵌合させてケース31内に台部材32を接着し、第1端子35の結線部35Aと圧力検出素子20の歪みゲージとのワイヤーボンディングを行う。
さらに、第1端子35がスルーホール33A(図2)に挿通されるようにして回路基板33を上方から配置し、ケース31の接点部38を折り曲げて回路基板33を固定し、スルーホール33A部分と第1端子35との半田付けを行う。
【0027】
次に、受部材52と一体になったターミナル53を第2端子36に半田付けするとともに、受部材52をケース31の上端縁に載せて支持させ、この状態を維持しながら受部材52をコネクタ本体54の挿入部69に挿入して接着剤等で固定する。そして、コネクタ34をケース31等を覆うように配置し、最後に、継手10をかしめてコネクタ34を固定し、これにより圧力センサ1の組立が完了する。
また、圧力センサ1を被設置部Aに取り付ける際には、ボックスレンチ等を用いて圧力センサ1全体を回転させながら締着すればよい。
【0028】
このような本実施形態によれば、以下のような効果がある。
1)圧力センサ1では、第1端子35の結線部35A側が固定部35Bで台部材32に固定されているため、ワイヤーボンディング中に金線39に超音波振動が付与されても第1端子35まで振動するのを防止できる。従って、ボンディングによる第1端子35と金線39との結線を良好な状態で行え、それらの接合強度を確実に確保できる。
【0029】
2)第1端子35は固定部35Bが台部材32に埋設されて固定されているため、固定部35Bを単に接着剤等を用いて固定するのに比して固定状態を良好に維持でき、第1端子35への超音波振動による影響をより低減できる。
【0030】
3)第1端子35は、固定部35Bのみの埋設だけでなく、結線部35Aの各辺縁35Cの埋設によっても固定されているため、超音波振動の影響を一層受けにくくできるうえ、台部材32の取扱中における結線部35Aのめくり上がりも防止できる。
【0031】
4)従来の圧力センサでは、端子が宙吊りになっていることでバネとして作用するため、ボンディング時にボンディングマシンの先端を端子の結線部に接触させると、端子が瞬間押し戻されように弾性変形し、金線等が断線する可能性があった。しかし、本実施形態では、第1端子35が台部材32に固定されることにより、結線部35Aの裏面側がその台部材32で受けられるから、ボンディングマシンを結線部35Aに接触させても弾性変形せず、金線39の断線を防止してその結線をより確実に行える。
【0032】
5)第1端子35は台部材32にインサートモールドされているため、第1端子35が埋設された台部材32を簡単かつ安価に製作できるとともに、それらを互いに一体に成形することで取り扱いも容易にできる。
【0033】
6)圧力センサ1では、コネクタ34の内側に金属のケース31が配置されているため、コネクタ34の下端が温度変化によって収縮するのを防止でき、継手10のかしめ部分のシール性を良好に維持できる。従って、圧力検出素子20と回路基板33との間の空間を密閉しなくとも、圧力検出素子20を外部の環境から十分保護することができ、回路基板33とケース31との間の面倒なシーリング等を省いて圧力センサ1を簡単かつ安価に製作できる。
【0034】
7)圧力検出素子20と回路基板33とは互いに間隔を空けて配置されているため、回路基板に従来設けていた開口を不要にでき、その分回路基板33の径寸法を小さくして圧力センサ1の小径化を図ることができる。
【0035】
8)圧力検出素子20と回路基板33との間隔は、回路基板33の下面側にも電気回路部品50を実装できる程度に空けられているため、回路基板33の実装効率を向上させてその径寸法をより小さくでき、小径化をさらに促進できる。
【0036】
〔第2実施形態〕
図5には、本発明の第2実施形態に係る圧力センサ2が示されている。なお、第1実施形態と同様な機能を有する構成部材には同一符号を付し、ここでのそれらの説明を省略または簡略化するとともに、以下には第1実施形態との相違のみを説明する。
【0037】
圧力センサ2では、圧力検出素子20と回路基板33との間隔は、第1実施形態に比してさほど空いておらず、回路基板33の下面には電気回路部品が実装されていないか、または、図示しない高さの小さな電気回路部品のみが実装されている。すなわち、本発明は、回路基板33の下面側に電気回路部品を実装しない場合、あるいは実装不可能な場合でも含まれる。
【0038】
その他、圧力センサ2によれば、継手10と無底筒状のケース31の下端縁とが溶接等されて接合されている点、そのケース31の上端縁をかしめることでコネクタ34が接合されている点、電気回路部品50がケース31およびこれと接触する蓋部材71によって電磁遮蔽されている点、第2端子36が蓋部材71に設けられた貫通コンデンサ72に挿通され、FPC(フレキシブル・プリンテッド・サーキット)73を介して直線状のターミナル53と接続されている点、で第1実施形態とは大きく異なる。
【0039】
本実施形態によれば、前記1)〜5)、7)の効果を得ることができる。
また、圧力センサ2でも、蓋部材71が電気回路部品50の電磁遮蔽用として用いられるのみならず、圧力検出素子20周りの気密性を確保する作用をも有するため、第1実施形態とは構成が異なるが、前記6)の効果も同様に得ることができる。
【0040】
なお、本発明は、前記各実施形態に限定されるものではなく、本発明の目的を達成できる他の構成等を含み、以下に示すような変形等も本発明に含まれる。
例えば、前記各実施形態では、圧力センサ1、2は継手10に一体に設けられた雄ねじ部分を挿入孔Bの雌ねじ部分に螺入することで被設置部Aに締着されていたが、継手10にフランジを一体または別体で設け、そのフランジにボルトを挿通することで被設置部Aに締着してもよい。ただし、フランジを設けると、その分圧力センサが径方向に大きくなるため、小径化や軽量化の観点からは、前記実施形態のような締着構造を採用するのが好ましい。
【0041】
前記各実施形態では、第1端子35が台部材32にインサートモールドによって埋設固定されていたが、この他、例えば第1端子を台部材の溝等に圧入するなどして埋設してもよい。しかし、このような場合には、圧入する作業を要する分だけインサートモールドに比して手間がかかるという欠点がある。
【0042】
また、本発明では、端子を台部材に任意の方法で固定でき、例えば端子を接着剤等で固定してもよいし、超音波溶着によって固定してもよい。しかし、端子をインサートモールドで固定することにより、端子を確実に埋設してより強固に固定できるうえ、台部材と端子との一体化を接着工程や溶着工程を不要にして容易かつ安価にできるため、そうすることが好ましい。
【0043】
前記各実施形態では、車載用で油圧を検出する圧力センサ1,2が示されていたが、本発明の圧力センサは、それに限定されないことは勿論であり、船舶、建築用重機、冷凍機、その他あらゆる機器に適用でき、また、空気圧、水圧等、任意の流体の圧力検出に適用できる。
【0044】
【発明の効果】
以上に述べたように、本発明によれば、端子におけるワイヤーボンディング用の結線部側が台部材で固定されるため、ボンディング中に超音波振動を付与しても端子まで振動するのを防止でき、ワイヤボンディングによる端子とワイヤ−との接合強度を確実に確保できるという効果がある。
【図面の簡単な説明】
【図1】本発明の第1実施形態に係る圧力センサを示す断面図である。
【図2】前記第1実施形態を示す分解斜視図である。
【図3】前記第1実施形態の要部を示す拡大図である。
【図4】図3におけるIV−IV線断面図である。
【図5】本発明の第2実施形態に係る圧力センサを示す断面図である。
【符号の説明】
1 圧力センサ
10 継手
11 圧力導入孔
20 圧力検出素子
32 台部材
33 回路基板
35 端子である第1端子
35A 結線部
[0001]
BACKGROUND OF THE INVENTION
The present invention relates to a pressure sensor, and more particularly to a pressure sensor that converts a fluid pressure into an electrical signal and outputs the signal to the outside.
[0002]
[Background]
For the measurement of the fluid pressure, a pressure sensor that detects a pressure difference between the detected pressure and the atmospheric pressure and converts it into an electrical signal is used.
Such a pressure sensor includes a joint that is fastened and fixed to an installation portion, a pressure detection element that is attached to the joint by beam welding, and an output means that is electrically connected to the pressure detection element. The fluid pressure introduced into the pressure introducing hole is converted into the strain of the diaphragm forming the pressure detecting element, this strain is detected by the strain gauge on the diaphragm, and an electric signal corresponding to the resistance value of the strain gauge is output means Is output via a connector or cable.
[0003]
The output means of such a pressure sensor includes an annular circuit board having an opening at the center. Then, by positioning the pressure detection element in the opening of the circuit board, the diaphragm of the pressure detection element and the circuit board are substantially flush, and the strain gauge on the diaphragm and the pad on the circuit board are electrically connected by wire bonding or the like. Connected.
[0004]
By the way, according to such a pressure sensor, since an electric circuit component such as an IC, a capacitor, and a resistor cannot be mounted on the opening portion of the circuit board or the pad portion for bonding, the diameter dimension of the circuit board is increased accordingly. It is necessary to secure the mounting area. Therefore, since the diameter of the entire pressure sensor is also increased, the box wrench may not be inserted depending on the shape and space around the portion to be installed, and it may be difficult to mount the pressure sensor.
[0005]
On the other hand, in the pressure sensor, as shown in Japanese Utility Model Laid-Open No. 6-2189, the pressure detection element and the circuit board are separated from each other, and an L-shaped terminal protrudes from the circuit board toward the pressure detection element side. Some terminals are electrically connected to the strain gauge by wire bonding. In such a pressure sensor, the pressure detection element and the circuit board are separated from each other, and the circuit board is not provided with the opening as described above. Therefore, the circuit board is mounted by mounting electric circuit components on both sides of the circuit board. Therefore, there is an advantage that the diameter of the pressure sensor can be reduced and the diameter of the entire pressure sensor can be reduced to cope with a small space.
[0006]
[Problems to be solved by the invention]
However, according to the pressure sensor described in the above publication, one end of the L-shaped terminal is fixed to the circuit board, but the other end, that is, the wire bonding connection side is suspended between the circuit board and the pressure detection element. Therefore, in normal bonding performed while applying ultrasonic vibration to a wire such as a gold wire, there is a possibility that the connection part of the terminal may vibrate together, and the bonding strength between the terminal and the wire due to bonding There is a concern that will decrease.
[0007]
An object of the present invention is to provide a pressure sensor that can reliably ensure the bonding strength between a terminal and a wire by wire bonding even when the diameter is reduced.
[0008]
[Means for Solving the Problems]
The pressure sensor of the present invention includes a pressure detection element attached to one end side of a pressure introduction hole provided in the joint, a base member disposed around the pressure detection element and fixed to the joint, and the base member A terminal connected to a circuit board having one end fixed and the other end spaced from the pressure detecting element, and the terminal is fixed to the base member and is performed between the pressure detecting element and the terminal. A wire bonding portion is provided, the wire connection portion is plate-shaped, has a short side along the circumferential direction of the base member and a long side along the radial direction, and has a long side. The pair of edges are continuously embedded in the base member .
[0009]
In such a pressure sensor, the side of the terminal on which the wire bonding connection portion is provided is fixed by the base member, so that there is no fear of vibration to the terminal even if ultrasonic vibration is applied during bonding. Therefore, wire bonding can be performed in a good state, and the bonding strength between the terminal and the wire can be ensured reliably.
At this time, since the pressure detection element and the circuit board are separated from each other, it is not necessary to provide a conventional opening in the circuit board, and the diameter of the pressure sensor can be reduced by reducing the diameter of the circuit board.
[0010]
Further, in the above, since the embedded the fixed end of the terminal to the base member in a state where the connecting portion is exposed, is maintained satisfactorily fixed state between the base member and the terminal, and more affected by the ultrasonic vibration to the terminal Reduced.
[0011]
Alternatively, the base member may be made of resin, and the terminal may be embedded in the base member by insert molding, so that the base member with the embedded terminal can be easily and inexpensively manufactured and integrated with each other. Handling is easy because it is molded.
[0012]
DETAILED DESCRIPTION OF THE INVENTION
Hereinafter, each embodiment of the present invention will be described with reference to the drawings.
[First Embodiment]
FIG. 1 is a sectional view showing a pressure sensor 1 according to the present embodiment, and FIG. 2 is an exploded perspective view thereof.
[0013]
The pressure sensor 1 includes a joint 10 that is screwed into the insertion hole B of the installation portion A indicated by a two-dot chain line in the drawing, a pressure detection element 20 that is beam-welded to the joint 10, and an external device according to the detected pressure. And an output means 30 for outputting an electric signal, and is a vehicle-mounted sensor for detecting hydraulic pressure.
[0014]
The joint 10 is made of metal, and the upper and lower sides in the figure (hereinafter, the upper and lower descriptions mean positions in the figure, and do not necessarily mean positions when actually attached. ) Through the pressure introduction hole 11.
[0015]
A fitting part 12 having a slightly larger diameter is provided above the pressure introduction hole 11, and a pipe 13 obtained by drawing is partially protruded from the pressure introduction hole 11 in the fitting part 12. Is fitted. And the diameter dimension of the through-hole 14 provided in the pipe 13 is smaller than the diameter dimension of the pressure introduction hole 11, and the volume in the pressure introduction hole 11 is adjusted smaller by this, and the pipe 13 is a pressure detection element. It also serves as a backing member when welding 20. A tapered surface 15 is provided on the upper outer peripheral portion of the pressure introducing hole 11, and a positioning groove 16 that is one step lower is provided on the outer peripheral side of the tapered surface 15.
[0016]
The positioning groove 16 is used when a case 31 to be described later is attached, and is continuously provided in a planar ring shape. The bottom surface side of the positioning groove 16 (that is, the back side in the depth direction) is provided in a state of being rolled toward the inside in the radial direction of the pressure introducing hole 11.
[0017]
The pressure detection element 20 is a strain gauge type element (module) in which a strain gauge is provided on the upper surface of the metal diaphragm 21 via an insulating film such as silicon oxide. In the pressure detection element 20, the diaphragm 21 is formed integrally with the lower cylindrical portion 22, and the entire inner surface of the pressure detection element 20 is guided by bringing the inner side surface of the cylindrical portion 22 into contact with the outer side surface of the pipe 13. It arrange | positions at the upper part of the coupling 10, and the inside of the cylindrical part 22 and the pressure introduction hole 11 are connected by this, and a hydraulic pressure acts on the pressure-sensitive surface of the diaphragm 21. Further, another tapered surface 23 is provided at the lower end of the cylindrical portion 22 so as to face and come into contact with the tapered surface 15 of the joint 10. From the direction along the inclination angle in a state where the tapered surfaces 15, 23 are in contact with each other. Beam welded.
[0018]
The output means 30 includes a metal case 31, a resin base member 32 that is bonded to the bottom portion of the case 31 and surrounds the pressure detection element 20, and a circuit board 33 that is disposed above the pressure detection element 20. And the resin connector 34 covering the whole of each of the members 31 to 33, the base member 32 and the circuit board 33 are connected by the first terminal 35, and the circuit board 33 and the connector 34 are connected by the second terminal 36. Electrically connected.
[0019]
The case 31 is an electromagnetic shielding member that protects the electric circuit components 50 such as an IC, a capacitor, and a resistor mounted on both surfaces of the circuit board 33 from noise, and the bottom portion is disposed on the mounting surface 10B of the joint 10. The pressure detection element 20 is accommodated in the case 31 through an opening provided in the central portion of the bottom. A protrusion 31A that is bent downward by squeezing or the like is provided at a part of the periphery of the bottom opening of the case 31. The protrusion 31A is provided at an upper portion of the positioning groove 16 having a substantially concave cross section. The case 31 is positioned with respect to the joint 10 by being fitted and locked to the periphery. In addition, a protruding piece 31B (FIG. 2) bent upward is provided on the other part of the periphery of the bottom opening of the case 31, and this protruding piece 31B is used when the base member 32 is attached.
[0020]
The case 31 is provided with a support portion 37 in which a part of the side surface is processed by pressing or cutting, and the circuit board 33 is placed on the support portion 37. In addition, a contact portion 38 that is bent on the upper surface of the circuit board 33 is provided at a part of the upper edge of the case 31, and the ground line of the circuit board 33 and the case 31 (in the end, finally) By being electrically connected to the joint 10), the electric circuit component 50 mounted on the lower surface of the circuit board 33 and surrounded by the case 31 is surely electromagnetically shielded, and the circuit board 33 is provided by the contact portion 38. Is securely pressed into the case 31 from above.
[0021]
The base member 32 is provided with an insertion portion 32A (FIG. 2) corresponding to the protruding piece 31B of the case 31, and not only by applying an adhesive to the lower surface of the base member 32 but also filling the insertion portion 32A, The insertion member 32A and the protruding piece 31B are fitted to each other to attach the base member 32, thereby improving the mounting strength of the base member 32 to the case 31.
[0022]
The lower end side of the first terminal 35 fixed to the base member 32 has a connection portion 35A exposed at the upper surface of the base member 32, and the above-described distortion of the connection portion 35A and the pressure detection element 20 is described above. The gauge is electrically connected by wire bonding with a gold wire 39. At this time, as shown in FIGS. 3 and 4, the first terminal 35 is embedded and fixed by insert-molding the fixing portion 35B into the base member 32, and in particular, the edge 35C on the long side of the connection portion 35A. In addition, since the base member 32 is continuously embedded, the vibration of the first terminal 35 during bonding performed by applying ultrasonic vibration to the gold wire 35 can be more reliably suppressed.
[0023]
The connector 34 is provided with a plurality of terminals 53 insert-molded on a resin receiving member 52, and the upper end side of the second terminal 36 is inserted into the insertion holes formed in the lower end sides of these terminals 53 and soldered. Has been. Each terminal 53 is fixed from the inside of the connector main body 54 together with the receiving member 52, and only the tip penetrating to the outside is exposed. On the lower side of the receiving member 52, a receiving portion 52 </ b> A that is supported in contact with the upper end edge of the case 31 is provided to prevent the receiving member 52 from coming off the insertion portion 69 of the connector main body 54.
[0024]
The lower end side of the connector main body 54 is positioned inside the upright portion 17 which is a thin caulking portion of the joint 10 via the O-ring 56, and its inner surface is close to and opposed to the outer surface of the case 31. It is fixed to the joint 10 by caulking the tip of the upright part 17. The inner surface of the connector main body 54 and the outer surface of the case 31 are preferably in contact with each other as shown in FIG. 1, but if the contraction to the inner side of the connector 34 can be suppressed to such an extent that the sealing property is not lost, You may make it adjoin in close proximity, leaving some clearance gaps.
[0025]
In such an output means 30, the pressure acting on the diaphragm 21 of the pressure detection element 20 is electrically resisted by a strain gauge on the diaphragm 21 and an electric circuit on the circuit board 33 connected to this via the first terminal 35. The resistance value is converted into a predetermined electric signal by an electric circuit, and the electric signal is output from the terminal 53 of the connector 34 via the second terminal 36.
[0026]
In this embodiment, first, the pressure detection element 20 is beam-welded to the joint 10.
Next, the case 31 is disposed on the joint 10 from above, and the case 31 is positioned by engaging the protrusion 31A of the case 31 with the positioning groove 16, and then the case is fixed to the joint 10 by projection welding. To do.
Then, after applying and filling an adhesive to the lower surface of the base member 32 and the insertion portion 32A, the insertion portion 32A and the protruding piece 31B are fitted to bond the base member 32 in the case 31, and the first terminal 35 is attached. Wire bonding is performed between the connecting portion 35A and the strain gauge of the pressure detecting element 20.
Further, the circuit board 33 is arranged from above so that the first terminal 35 is inserted into the through hole 33A (FIG. 2), the contact portion 38 of the case 31 is bent to fix the circuit board 33, and the through hole 33A portion And the first terminal 35 are soldered.
[0027]
Next, the terminal 53 integrated with the receiving member 52 is soldered to the second terminal 36, and the receiving member 52 is placed on and supported by the upper end edge of the case 31, and the receiving member 52 is connected to the connector while maintaining this state. It inserts in the insertion part 69 of the main body 54, and fixes with an adhesive agent etc. Then, the connector 34 is disposed so as to cover the case 31 and the like, and finally, the joint 10 is caulked to fix the connector 34, whereby the assembly of the pressure sensor 1 is completed.
Further, when the pressure sensor 1 is attached to the installation portion A, the pressure sensor 1 may be fastened while rotating the entire pressure sensor 1 using a box wrench or the like.
[0028]
According to this embodiment, there are the following effects.
1) In the pressure sensor 1, since the connection portion 35 </ b> A side of the first terminal 35 is fixed to the base member 32 by the fixing portion 35 </ b> B, even if ultrasonic vibration is applied to the gold wire 39 during wire bonding, the first terminal 35. Can be prevented from vibrating. Therefore, the connection between the first terminal 35 and the gold wire 39 by bonding can be performed in a good state, and the bonding strength thereof can be ensured reliably.
[0029]
2) Since the first terminal 35 has the fixed portion 35B embedded and fixed in the base member 32, the fixed state can be maintained better than simply fixing the fixed portion 35B using an adhesive or the like, The influence of ultrasonic vibration on the first terminal 35 can be further reduced.
[0030]
3) Since the first terminal 35 is fixed not only by embedding only the fixing portion 35B but also by embedding each edge 35C of the connecting portion 35A, the first terminal 35 can be made less susceptible to the influence of ultrasonic vibration, and the base member It is also possible to prevent the connection portion 35A from being turned up during handling of 32.
[0031]
4) Since the conventional pressure sensor acts as a spring because the terminal is suspended, when the tip of the bonding machine is brought into contact with the terminal connection part during bonding, the terminal is elastically deformed so that it is momentarily pushed back. There was a possibility that the gold wire etc. was disconnected. However, in this embodiment, since the first terminal 35 is fixed to the base member 32, the back surface side of the connection portion 35A is received by the base member 32. Therefore, even if the bonding machine is brought into contact with the connection portion 35A, it is elastically deformed. Without disconnection, the wire 39 can be prevented from being disconnected and connected more reliably.
[0032]
5) Since the first terminal 35 is insert-molded in the base member 32, the base member 32 in which the first terminal 35 is embedded can be manufactured easily and inexpensively, and they can be handled easily by molding them together. Can be.
[0033]
6) In the pressure sensor 1, since the metal case 31 is disposed inside the connector 34, the lower end of the connector 34 can be prevented from contracting due to temperature change, and the sealing performance of the caulked portion of the joint 10 is maintained well. it can. Therefore, even if the space between the pressure detection element 20 and the circuit board 33 is not sealed, the pressure detection element 20 can be sufficiently protected from the external environment, and the troublesome sealing between the circuit board 33 and the case 31 is possible. The pressure sensor 1 can be manufactured easily and inexpensively.
[0034]
7) Since the pressure detection element 20 and the circuit board 33 are arranged at a distance from each other, the opening conventionally provided in the circuit board can be eliminated, and the diameter dimension of the circuit board 33 can be reduced correspondingly to reduce the pressure sensor. 1 can be reduced in diameter.
[0035]
8) Since the space between the pressure detection element 20 and the circuit board 33 is large enough to mount the electric circuit component 50 on the lower surface side of the circuit board 33, the mounting efficiency of the circuit board 33 is improved and the diameter thereof is increased. The size can be further reduced, and the reduction in diameter can be further promoted.
[0036]
[Second Embodiment]
FIG. 5 shows a pressure sensor 2 according to the second embodiment of the present invention. Note that components having the same functions as those in the first embodiment are denoted by the same reference numerals, and descriptions thereof are omitted or simplified. Only differences from the first embodiment will be described below. .
[0037]
In the pressure sensor 2, the distance between the pressure detection element 20 and the circuit board 33 is not so large as compared to the first embodiment, and no electrical circuit component is mounted on the lower surface of the circuit board 33, or Only an electric circuit component having a small height (not shown) is mounted. In other words, the present invention is included even when an electric circuit component is not mounted on the lower surface side of the circuit board 33 or when it cannot be mounted.
[0038]
In addition, according to the pressure sensor 2, the joint 34 and the bottom edge of the bottomless cylindrical case 31 are joined by welding or the like, and the connector 34 is joined by caulking the top edge of the case 31. The electrical circuit component 50 is electromagnetically shielded by the case 31 and the lid member 71 in contact with the case 31, and the second terminal 36 is inserted into a feedthrough capacitor 72 provided in the lid member 71, so that the FPC (flexible It differs greatly from the first embodiment in that it is connected to a linear terminal 53 via a printed circuit 73.
[0039]
According to this embodiment, the effects 1) to 5) and 7) can be obtained.
The pressure sensor 2 also has the function of ensuring airtightness around the pressure detection element 20 as well as the lid member 71 used for electromagnetic shielding of the electric circuit component 50. However, the effect 6) can be obtained in the same manner.
[0040]
Note that the present invention is not limited to the above-described embodiments, and includes other configurations that can achieve the object of the present invention, and includes the following modifications and the like.
For example, in each of the above embodiments, the pressure sensors 1 and 2 are fastened to the installation portion A by screwing the male screw portion integrally provided in the joint 10 into the female screw portion of the insertion hole B. 10 may be provided with a flange integrally or separately, and bolts may be inserted into the flange so as to be fastened to the installation portion A. However, when the flange is provided, the pressure sensor becomes larger in the radial direction, and therefore, from the viewpoint of reducing the diameter and reducing the weight, it is preferable to employ the fastening structure as in the above embodiment.
[0041]
In each said embodiment, although the 1st terminal 35 was embed | buried and fixed to the base member 32 by insert mold, you may embed | buy, for example by pressingly inserting the 1st terminal in the groove | channel etc. of a base member. However, in such a case, there is a drawback that it takes more time than the insert mold by the amount required for the press-fitting operation.
[0042]
Moreover, in this invention, a terminal can be fixed to a base member by arbitrary methods, for example, a terminal may be fixed with an adhesive agent etc., and may be fixed by ultrasonic welding. However, by fixing the terminal with an insert mold, the terminal can be securely embedded and fixed more firmly, and the integration of the base member and the terminal can be easily and inexpensively without the need for an adhesion process or a welding process. It is preferable to do so.
[0043]
In each of the above-described embodiments, the pressure sensors 1 and 2 for detecting the hydraulic pressure for in-vehicle use are shown, but the pressure sensor of the present invention is not limited thereto, and of course, ships, heavy equipment for construction, refrigerators, It can be applied to all other devices, and can be applied to pressure detection of any fluid such as air pressure and water pressure.
[0044]
【The invention's effect】
As described above, according to the present invention, since the connection part side for wire bonding in the terminal is fixed by the base member, it can be prevented from vibrating to the terminal even if ultrasonic vibration is applied during bonding, There is an effect that the bonding strength between the terminal and the wire by wire bonding can be surely secured.
[Brief description of the drawings]
FIG. 1 is a cross-sectional view showing a pressure sensor according to a first embodiment of the present invention.
FIG. 2 is an exploded perspective view showing the first embodiment.
FIG. 3 is an enlarged view showing a main part of the first embodiment.
4 is a cross-sectional view taken along line IV-IV in FIG.
FIG. 5 is a cross-sectional view showing a pressure sensor according to a second embodiment of the present invention.
[Explanation of symbols]
DESCRIPTION OF SYMBOLS 1 Pressure sensor 10 Joint 11 Pressure introduction hole 20 Pressure detection element 32 Base member 33 Circuit board 35 1st terminal 35A which is a terminal Connection part

Claims (2)

継手に設けられた圧力導入孔の一端側に取り付けられる圧力検出素子と、この圧力検出素子の周囲に配置されて前記継手に固定される台部材と、この台部材に一端側が固定されかつ他端側が前記圧力検出素子に対して離間した回路基板に接続される端子とを備え、この端子の前記台部材への固定端側に前記圧力検出素子との間で行われるワイヤーボンディング用の結線部が設けられており、この結線部は板状であるとともに、前記台部材の周方向に沿った短辺と径方向に沿った長辺とを有し、かつ長辺側の一対の辺縁が連続して前記台部材に埋設されていることを特徴とする圧力センサ。A pressure detecting element attached to one end side of a pressure introducing hole provided in the joint; a base member disposed around the pressure detecting element and fixed to the joint; one end side fixed to the base member and the other end And a terminal connected to a circuit board separated from the pressure detection element, and a wire bonding connection portion performed between the pressure detection element and the terminal on a fixed end side of the terminal. The connecting portion is plate-shaped, has a short side along the circumferential direction of the base member and a long side along the radial direction, and a pair of edges on the long side is continuous. And a pressure sensor embedded in the base member . 請求項1に記載の圧力センサにおいて、前記台部材は樹脂製とされ、前記端子が前記台部材にインサートモールドされていることを特徴とする圧力センサ。The pressure sensor according to claim 1 , wherein the base member is made of resin, and the terminal is insert-molded on the base member.
JP03720298A 1997-12-11 1998-02-19 Pressure sensor Expired - Fee Related JP3871430B2 (en)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP03720298A JP3871430B2 (en) 1998-02-19 1998-02-19 Pressure sensor
DE69815801T DE69815801T2 (en) 1997-12-11 1998-12-10 pressure transducer
US09/208,689 US6298730B1 (en) 1997-12-11 1998-12-10 Pressure sensor
EP98310141A EP0922946B1 (en) 1997-12-11 1998-12-10 Pressure sensor

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP03720298A JP3871430B2 (en) 1998-02-19 1998-02-19 Pressure sensor

Publications (2)

Publication Number Publication Date
JPH11237291A JPH11237291A (en) 1999-08-31
JP3871430B2 true JP3871430B2 (en) 2007-01-24

Family

ID=12491009

Family Applications (1)

Application Number Title Priority Date Filing Date
JP03720298A Expired - Fee Related JP3871430B2 (en) 1997-12-11 1998-02-19 Pressure sensor

Country Status (1)

Country Link
JP (1) JP3871430B2 (en)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6584851B2 (en) 2000-11-30 2003-07-01 Nagano Keiki Co., Ltd. Fluid pressure sensor having a pressure port
EP1229317A3 (en) 2001-02-01 2003-09-03 Nagano Keiki Co., Ltd. Pressure sensor
WO2009087767A1 (en) * 2008-01-10 2009-07-16 Saginomiya Seisakusho, Inc. Pressure sensor and method for manufacturing the same
JP4790033B2 (en) * 2009-02-17 2011-10-12 長野計器株式会社 Sensor
US8286496B2 (en) 2009-02-17 2012-10-16 Nagano Keiki Co., Ltd. Fluid pressure sensor incorporating flexible circuit board
CN114142282A (en) * 2021-11-18 2022-03-04 上海索迪龙自动化有限公司 A ground connection spare and proximity sensor for proximity sensor

Also Published As

Publication number Publication date
JPH11237291A (en) 1999-08-31

Similar Documents

Publication Publication Date Title
US6227055B1 (en) Pressure sensor assembly with direct backside sensing
KR19990082707A (en) Pressure sensor
EP1970686B1 (en) Pressure sensor and manufacturing method of said sensor
US6209399B1 (en) Pressure sensor unit, especially for automotive engineering applications
JP4301048B2 (en) Pressure sensor and manufacturing method thereof
US6782758B2 (en) Hermetic pressure transducer
US6715357B2 (en) Hermetic pressure transducer
US6763724B2 (en) Hermetic pressure transducer
JP2003294558A (en) Pressure sensor
US6474170B1 (en) Pressure sensor
JP3871430B2 (en) Pressure sensor
US6313514B1 (en) Pressure sensor component
JP2007285750A (en) Pressure sensor
JP3962469B2 (en) Pressure sensor
JP3509627B2 (en) Pressure detector
JP3899174B2 (en) Pressure sensor
EP1382953A2 (en) Hermetic pressure transducer
JP4622666B2 (en) Electronic equipment
JP5500001B2 (en) Pressure sensor mounting structure
JP2002098552A (en) Sensor
JP2006208087A (en) Pressure sensor
JP4223273B2 (en) Pressure sensor
JP4049109B2 (en) Pressure sensor
JP4049129B2 (en) Pressure sensor device
JP5720450B2 (en) Pressure sensor and pressure sensor mounting structure

Legal Events

Date Code Title Description
A521 Written amendment

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20040614

A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20040614

A977 Report on retrieval

Free format text: JAPANESE INTERMEDIATE CODE: A971007

Effective date: 20060526

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20060704

A521 Written amendment

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20060901

TRDD Decision of grant or rejection written
A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

Effective date: 20060926

A61 First payment of annual fees (during grant procedure)

Free format text: JAPANESE INTERMEDIATE CODE: A61

Effective date: 20061017

R150 Certificate of patent or registration of utility model

Free format text: JAPANESE INTERMEDIATE CODE: R150

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20121027

Year of fee payment: 6

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20151027

Year of fee payment: 9

LAPS Cancellation because of no payment of annual fees