JP3836654B2 - Easy-open composite film - Google Patents
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- JP3836654B2 JP3836654B2 JP2000030557A JP2000030557A JP3836654B2 JP 3836654 B2 JP3836654 B2 JP 3836654B2 JP 2000030557 A JP2000030557 A JP 2000030557A JP 2000030557 A JP2000030557 A JP 2000030557A JP 3836654 B2 JP3836654 B2 JP 3836654B2
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Description
【０００１】
【発明の属する技術分野】
本発明は易開封性複合フイルムに関し、特に高温状態での耐破袋性に優れ、酸素バリアー性を持つ、高温成形性の良好な深絞り包装用底材として好適に使用できる易開封性複合フイルムに関する。
【０００２】
【従来の技術】
高温殺菌用特に高圧下で行われる１００〜１３０℃の殺菌用の深絞り底材用フイルムとしては、融点が９０〜１２０℃の範囲の低密度ポリエチレン系樹脂あるいは融点が１１５〜１２５℃の範囲の直鎖状低密度ポリエチレンでは耐破袋性の問題があり、主にポリプロピレン樹脂をシーラントとするフイルムが用いられている。
【０００３】
またこのような底材に易開封性（イージーピール性）を付与するために付与するために使用するイージーピール材には、ポリプロピレン樹脂と直鎖状低密度ポリエチレンとのブレンド樹脂樹脂やポリプロピレン樹脂とポリスチレン樹脂とのブレンド樹脂が使用されている。
【０００４】
しかしながら厚さが２００〜１０００μｍ程度のポリプロピレン樹脂を基材とする高温殺菌用深絞り底材に前記のブレンド樹脂層を配した場合、高温成形時に熱板にフイルムが融着してとられるという問題があった。
【０００５】
また、前記ブレンド樹脂のうち前者は、剥離強度が低く、高温高圧下の使用で破袋することがあり、後者は、常温での開封時、剥離強度にばらつきがあり、開封性が悪いため、膜残りが発生したり層剥離が発生することもあった。
【０００６】
【発明が解決しようとする課題】
本発明は従来技術の前記の問題点を解決しようとするものであり、高温高圧状態での耐破袋性に優れ、かつ高温成形性の良好な深絞り包装用底材として好適に使用できる易開封性複合フイルムを提供することを目的とする。
【０００７】
【課題を解決するための手段】
前記の目的は以下の手段によって達成される。
【０００８】
すなわち、本発明は、少なくとも最外層と中間層とイージーピール層とからなり、最外層がポリプロピレン樹脂層でイージーピール層がポリプロピレン樹脂と高密度ポリエチレン樹脂との混合樹脂層からなる複合フイルムであって、該混合樹脂層の配合比率が７０：３０〜３０：７０であると共に、該混合樹脂層の厚さが３〜２０μｍの範囲であり、前記混合樹脂層のポリプロピレン樹脂の融点が１３５〜１６５℃の範囲であり、高密度ポリエチレン樹脂の融点が１３０〜１４０℃の範囲であり、前記中間層と前記イージーピール層とは共押出しにより製膜されることを特徴とする、深絞り包装用底材として用いる易開封性複合フイルムを提案するものであり、前記中間層に、酸素遮断性のバリアー材を配したこと、前記の最外層のポリプロピレン樹脂層に無機フイラーを添加したことを含む。
【０００９】
【発明の実施の形態】
以下、本発明を更に詳細に説明する。
本発明において、最外層となるポリプロピレン樹脂（以下、ＰＰという。）層は、ホモ並びにポリプロピレンーポリエチレンランダムコポリマー等のコポリマーが使用でき、融点が１５５〜１６５℃の範囲のものが好適であり、融点が１５５℃未満では耐熱性が低く、高温殺菌時に成形部が変形することがある。
【００１０】
また、上記最外層には耐熱性を向上させる目的で無機フイラーを添加してもよく、無機フイラーの添加は２０〜５０質量％の範囲が好ましく、２０質量％未満では耐熱性の改良効果がなく、５０質量％を越えると製膜性が低下する。このような無機フイラーとしてはケイ酸塩鉱物 、アルミノシリケート、ホワイトカーボン等が挙げられる。
【００１１】
また、中間層にはポリアミド樹脂（以下、Ｎｙという。）、エチレンー酢酸ビニル共重合体けん化物樹脂（以下、ＥＶＯＨという。）、塩化ビニリデン樹脂（以下、ＰＶＤＣという。）、ポリメタキシレンアジパミド樹脂（以下、ＭＸＤ６Ｎｙという。）等の使用がが好ましい。
【００１２】
イージーピール層はポリプロピレン樹脂と高密度ポリエチレン樹脂との混合樹脂からなり、混合樹脂層の配合比率は、７０：３０〜３０：７０の範囲とする必要があり、この範囲を越えると、剥離強度が強すぎたり、弱すぎたりし、膜残りや層剥離を発生したり、耐破袋性の点で問題となる。
【００１３】
また高温成形時に熱板取られが起こり易くなる。一般にポリプロピレン樹脂及び高密度ポリエチレン樹脂の物性によって配合比率は多少異なるが、イージーピール強度は対ポリプロピレン樹脂と適切な温度にてヒートシールを行い、１５ｍｍ幅の短冊状に切取り、引張試験機にて２００ｍｍ／ｍｉｎの速度で引張った時のイージーピール強度が４．９０〜１１．７７Ｎ／１５ｍｍ幅に入るよう調整すればよい。
【００１４】
上記イージーピール層（以下、ＥＰ層という。）の厚さは、３〜２０μｍの範囲とする必要があり、３μｍ未満では製膜性が安定せず、また２０μｍを越えるとケバ立ち、膜残りが発生するという問題がある。
【００１５】
またＥＰ層で使用するポリプロピレン樹脂（以下、ＰＰという。）はその融点が１３５〜１６５℃の範囲、高密度ポリエチレン樹脂（以下、ＨＤＰＥという。）はその融点が１３０〜１４０℃の範囲の樹脂を使用する必要があり、上記融点未満では易開封性に劣り、上記融点を越えるものではシール性に劣るという問題ががある。
【００１６】
なお、上記ＰＰの密度は０．８９〜０．９０ｇ／ｃｍ3の範囲、ＨＤＰＥの密度は０．９３〜０．９７ｇ／ｃｍ3の範囲のものが好適に使用できる。
【００１７】
以下本発明の実施例を示すが本発明はこれに限定されるものではない。
【００１８】
【実施例】
（実施例１）
以下に示した層構成の複合フィルムを共押出しによって製膜し、
Ｎｙ（厚み30μm）／接着性樹脂（以下、ＡＤという）（厚み10μm）／ＰＰ（厚み57μm）／ＥＰ（厚み3μm）
この複合フイルムの最外側のＮｙ側にＰＰフイルムをドライラミネ−トして
以下の構成の本発明の底材用の複合フイルムを得た。
ＰＰ（厚み400μm）／／Ｎｙ（厚み30μm）／ＡＤ（厚み10μm)／ＰＰ（厚み57μm)／ＥＰ（3μm）
また、厚み２５μmの延伸ポリアミド樹脂（以下、ＯＮｙという。）フイルムと厚み６０μmのＰＰフイルムをドライラミネートして蓋材とした。
なお、底材用の複合フイルムのＥＰ層はＰＰとＨＤＰＥからなり、ＰＰの含有量は３０質量％であり、このＰＰの密度は０．９０ｇ／ｃｍ3、融点は１６０℃、ＨＤＰＥの密度は０．９５ｇ／ｃｍ3、融点は１３３℃であった。
【００１９】
（実施例２）
以下に示した層構成の複合フィルムを共押出しによって製膜し、
Ｎｙ（厚み30μm）／ＡＤ（厚み10μm）／ＰＰ（厚み57μm）／ＥＰ（厚み3μm）
この複合フイルムの最外側のＮｙ側にＰＰフイルムをドライラミネ−トして
以下の構成の本発明の底材用の複合フイルムを得た。
ＰＰ（厚み400μm）／／Ｎｙ（厚み30μm）／ＡＤ（厚み10μm)／ＰＰ（厚み57μm)／ＥＰ（3μm）
また、蓋材は実施例１と同一層構成のものを用いた。
なお、底材用の複合フイルムのＥＰ層はＰＰとＨＤＰＥからなり、ＰＰの含有量は７０質量％であり、このＰＰの密度は０．９０ｇ／ｃｍ3、融点は１６０℃、ＨＤＰＥの密度は０．９５ｇ／ｃｍ3、融点は１３３℃であった。
【００２０】
（実施例３）
以下に示した層構成の複合フィルムを共押出しによって製膜し、
Ｎｙ（厚み10μm）／ＥＶＯＨ（厚み20μm）／ＡＤ（厚み10μm）／ＰＰ（厚み40μm）／ＥＰ（厚み20μm）
この複合フイルムの最外側のＮｙ側にＰＰフイルムをドライラミネ−トして
以下の構成の本発明の底材用の複合フイルムを得た。
ＰＰ（厚み400μm）／／Ｎｙ（厚み10μm）／ＥＶＯＨ（厚み20μm）／ＡＤ（厚み10μm)／ＰＰ（厚み40μm)／ＥＰ（20μm）
また、蓋材は厚み２０μmのＯＰＰフイルムと厚み１２μmのアルミ蒸着ポリエチレンテレフタレートフイルム（以下、ＶＭＰＥＴという。）と厚み５０μmのＰＰとをその順序でドライラミネートして蓋材とした。
なお、底材用の複合フイルムのＥＰ層はＰＰとＨＤＰＥからなり、ＰＰの含有量は６０質量％であり、このＰＰの密度は０．９０ｇ／ｃｍ3、融点は１６０℃、ＨＤＰＥの密度は０．９５ｇ／ｃｍ3、融点は１３３℃であった。
【００２１】
（実施例４）
以下に示した層構成の複合フィルムを共押出しによって製膜し、
Ｎｙ（厚み10μm）／ＭＸＤ６（厚み20μm）／ＡＤ（厚み10μm）／ＰＰ（厚み40μm）／ＥＰ（厚み20μm）
この複合フイルムの最外側のＮｙ側にフイラー入りポリプロピレンフイルムをドライラミネ−トして
以下の構成の本発明の底材用の複合フイルムを得た。
フイラー入りＰＰ（厚み400μm）／／Ｎｙ（厚み30μm）／ＭＸＤ６（厚み20μm）／ＡＤ（厚み10μm)／ＰＰ（厚み40μm)／ＥＰ（20μm）
また、蓋材は実施例３と同一層構成のものを用いた。
なお、底材用の複合フイルムのＥＰ層はＰＰとＨＤＰＥからなり、ＰＰの含有量は６０質量％であり、このＰＰの密度は０．８９ｇ／ｃｍ3、融点は１３５℃、ＨＤＰＥの密度は０．９７ｇ／ｃｍ3、融点は１３７℃であった。
また、底材用の複合フイルムの最外層のＰＰ層中の無機フイラーの含有量は
３０質量％であった。
【００２２】
なお、無機フイラーはアルミノシリケートを使用した。
【００２３】
（比較例１）
以下に示した層構成の複合フィルムを共押出しによって製膜し、
Ｎｙ（厚み30μm）／ＡＤ（厚み10μm）／ＰＰ（厚み57μm）／ＥＰ（厚み3μm） この複合フイルムの最外側のＮｙ側にＰＰフイルムをドライラミネ−トして
以下の構成の本発明の底材用の複合フイルムを得た。
ＰＰ（厚み400μm）／／Ｎｙ（厚み30μm）／ＡＤ（厚み10μm)／ＰＰ（厚み57μm)／ＥＰ層（3μm）
また、蓋材は実施例１と同一層構成のものを用いた。
【００２４】
なお、底材用の複合フイルムのＥＰ層はＰＰとＨＤＰＥからなり、ＰＰの含有量は２０質量％であり、このＰＰの密度は０．９０ｇ／ｃｍ3、融点は１６０℃、ＨＤＰＥの密度は０．９５ｇ／ｃｍ3、融点は１３５℃であった。
【００２５】
（比較例２）
以下に示した層構成の複合フィルムを共押出しによって製膜し、
Ｎｙ（厚み30μm）／ＡＤ（厚み10μm）／ＰＰ（厚み57μm）／ＥＰ（厚み3μm） この複合フイルムの最外側のＮｙ側にＰＰフイルムをドライラミネ−トして
以下の構成の本発明の底材用の複合フイルムを得た。
【００２６】
ＰＰ（厚み400μm）／／Ｎｙ（厚み30μm）／ＡＤ（厚み10μm)／ＰＰ（厚み57μm)／ＥＰ層（3μm）
また、蓋材は実施例１と同一層構成のものを用いた。
【００２７】
なお、底材用の複合フイルムのＥＰ層はＰＰとＨＤＰＥからなり、ＰＰの含有量は８０質量％であり、このＰＰの密度は０．９０ｇ／ｃｍ3、融点は １６０℃、ＨＤＰＥの密度は０．９５ｇ／ｃｍ3、融点は１３３ ℃であった。
【００２８】
（比較例３）
以下に示した層構成の複合フィルムを共押出しによって製膜し、
Ｎｙ（厚み10μm）／ＥＶＯＨ（厚み20μm）／ＡＤ（厚み10μm）／ＰＰ（厚み30μm）／ＥＰ（厚み30μm）
この複合フイルムの最外側のＮｙ側にＰＰフイルムをドライラミネ−トして
以下の構成の本発明の底材用の複合フイルムを得た。
ＰＰ（厚み400μm）／／Ｎｙ（厚み10μm）／ＥＶＯＨ（厚み20μm）／ＡＤ（厚み10μm)／ＰＰ（厚み30μm)／ＥＰ（30μm）
また、蓋材は実施例３と同一層構成のものを用いた。
【００２９】
なお、底材用の複合フイルムのシール層中のＰＰの含有量は６０質量％であり、このＰＰの密度は０．９０ｇ／ｃｍ3、融点は１６０℃、ＨＤＰＥの密度は０．９５ｇ／ｃｍ3、融点は１３３℃であった。
【００３０】
上述した内容の実施例１〜４、比較例１〜３の複合フイルムを底材及び蓋材として使用し、深絞り包装機ＦＶ６３００（大森機械工業社製）にてパック品を作製し、テスト評価を実施した。
【００３１】
＜評価方法＞
・剥離強度
常温環境下でシール部を１５ｍｍ幅の短冊状に切取り、引張試験機にて２００ｍｍ／分で引張った時の応力を測定し、剥離強度とした。
・開封性
スキンパックテストで作製したパック品を開封し、容易に開封できるか否かを評価した。
・成形時の熱板とられ
ＥＰ層側（シール部側）を表面温度１５０℃に達した熱板に接触させて３秒間加熱した後、熱板にとられず容易に脱離できるか否かを評価した。
・耐破袋性
油分の多い惣菜食品（鯖の煮付け等）を内容物にしてパック品を作製し、電子レンジ（６００Ｗ）で４分間加熱したとき、パック品が破袋するか否かを評価した。
【００３２】
【表１】
ＥＰ層中のＰＰ含有量が３０質量％未満の比較例１は剥離強度が４．９０Ｎ／１５ｍｍ幅未満となり、イージーピール強度が劣り、成形時の熱板とられもあり、耐破袋性も劣る。
【００３３】
またＥＰ層中のＰＰ含有量が７０質量％を越える比較例２は剥離強度が１１．７７Ｎ／１５ｍｍ幅を越え、イージーピール性が劣り、開封性も劣る。
【００３４】
さらにＥＰ層の厚みが２０ｍｍを越える比較例３は膜残りが発生し、開封性が劣る。
【００３５】
【発明の効果】
以上述べたように、本発明によれば高温状態での耐破袋性に優れ、高温成形時に熱板とられすることなく、使用時には極めて容易に開封可能である易開封性複合フイルムが得られる。[0001]
BACKGROUND OF THE INVENTION
TECHNICAL FIELD The present invention relates to an easily openable composite film, and in particular, an easily openable composite film that can be suitably used as a bottom material for deep-drawing packaging having excellent resistance to bag breaking at high temperatures, oxygen barrier properties, and good high temperature moldability. About.
[0002]
[Prior art]
As a film for deep-drawn bottom material for sterilization at 100 to 130 ° C. performed under high pressure, particularly for high temperature sterilization, a low density polyethylene resin having a melting point of 90 to 120 ° C. or a melting point of 115 to 125 ° C. Linear low-density polyethylene has a problem of resistance to bag breakage, and a film using a polypropylene resin as a sealant is mainly used.
[0003]
In addition, the easy peel material used for imparting easy-openability (easy peel property) to such a bottom material includes a blend resin resin of polypropylene resin and linear low density polyethylene, and a polypropylene resin. Blend resin with polystyrene resin is used.
[0004]
However, when the blended resin layer is disposed on a deep-drawn bottom material for high temperature sterilization based on a polypropylene resin having a thickness of about 200 to 1000 μm, the film is fused to the hot plate during high temperature molding. was there.
[0005]
In addition, the former of the blend resin has a low peel strength and may break when used under high temperature and high pressure, and the latter has a variation in peel strength at the time of opening at room temperature, and the openability is poor. A film residue or delamination may occur.
[0006]
[Problems to be solved by the invention]
The present invention is intended to solve the above-mentioned problems of the prior art, and can be suitably used as a bottom material for deep-drawing packaging that has excellent resistance to bag breakage in a high-temperature and high-pressure state and good high-temperature formability. An object is to provide an openable composite film.
[0007]
[Means for Solving the Problems]
The above object is achieved by the following means.
[0008]
That is, the present invention is a composite film comprising at least an outermost layer, an intermediate layer and an easy peel layer, wherein the outermost layer is a polypropylene resin layer and the easy peel layer is a mixed resin layer of a polypropylene resin and a high density polyethylene resin. The blending ratio of the mixed resin layer is 70:30 to 30:70, the thickness of the mixed resin layer is in the range of 3 to 20 μm, and the melting point of the polypropylene resin of the mixed resin layer is 135 to 165 ° C. by weight, Ri range der of melting point 130 to 140 ° C. in a high-density polyethylene resin, wherein the intermediate layer and the easy peel layer, characterized in Rukoto is film formation by co-extrusion, deep drawing packaging bottom The present invention proposes an easy-open composite film to be used as a material, wherein an oxygen-barrier barrier material is disposed in the intermediate layer, and the outermost poly Comprising the addition of an inorganic filler Len resin layer.
[0009]
DETAILED DESCRIPTION OF THE INVENTION
Hereinafter, the present invention will be described in more detail.
In the present invention, the polypropylene resin (hereinafter referred to as PP) layer as the outermost layer can use homo and copolymers such as polypropylene-polyethylene random copolymer, and preferably has a melting point in the range of 155 to 165 ° C. However, if it is less than 155 degreeC, heat resistance is low, and a molded part may deform | transform at the time of high temperature sterilization.
[0010]
In addition, an inorganic filler may be added to the outermost layer for the purpose of improving heat resistance. The addition of the inorganic filler is preferably in the range of 20 to 50% by mass, and if it is less than 20% by mass, there is no effect of improving heat resistance. If it exceeds 50% by mass, the film-forming property is lowered. Examples of such inorganic fillers include silicate minerals, aluminosilicates, and white carbon.
[0011]
The intermediate layer also includes a polyamide resin (hereinafter referred to as Ny), an ethylene-vinyl acetate copolymer saponified resin (hereinafter referred to as EVOH), a vinylidene chloride resin (hereinafter referred to as PVDC), and polymetaxylene adipamide. Use of a resin (hereinafter referred to as MXD6Ny) or the like is preferable.
[0012]
The easy peel layer is made of a mixed resin of a polypropylene resin and a high density polyethylene resin, and the blending ratio of the mixed resin layer needs to be in the range of 70:30 to 30:70. It is too strong or too weak, causing film residue or delamination, and is problematic in terms of resistance to bag breakage.
[0013]
Further, the hot plate is easily removed during high temperature molding. In general, the blending ratio is somewhat different depending on the physical properties of polypropylene resin and high-density polyethylene resin, but easy peel strength is heat-sealed with polypropylene resin at an appropriate temperature, cut into a strip of 15 mm width, and 200 mm in a tensile tester. The easy peel strength when pulled at a speed of / min may be adjusted to fall within the range of 4.90 to 11.77 N / 15 mm.
[0014]
The thickness of the above easy peel layer (hereinafter referred to as EP layer) needs to be in the range of 3 to 20 μm. If it is less than 3 μm, the film-forming property is not stable. There is a problem that occurs.
[0015]
The polypropylene resin (hereinafter referred to as PP) used in the EP layer has a melting point in the range of 135 to 165 ° C., and the high density polyethylene resin (hereinafter referred to as HDPE) has a melting point in the range of 130 to 140 ° C. If it is less than the above melting point, it is inferior in easy-opening property, and if it exceeds the above melting point, there is a problem that the sealing property is inferior.
[0016]
The density of the PP in the range of 0.89~0.90g / cm 3, the density of the HDPE can be used suitably is in the range of 0.93~0.97g / cm 3.
[0017]
Examples of the present invention will be shown below, but the present invention is not limited thereto.
[0018]
【Example】
Example 1
A composite film having the following layer structure is formed by coextrusion,
Ny (thickness 30 μm) / adhesive resin (hereinafter referred to as AD) (thickness 10 μm) / PP (thickness 57 μm) / EP (thickness 3 μm)
A PP film was dry laminated on the outermost Ny side of the composite film to obtain a composite film for a bottom material of the present invention having the following constitution.
PP (thickness 400 μm) / Ny (thickness 30 μm) / AD (thickness 10 μm) / PP (thickness 57 μm) / EP (3 μm)
Further, a stretched polyamide resin (hereinafter referred to as ONy) film having a thickness of 25 μm and a PP film having a thickness of 60 μm were dry-laminated to form a cover material.
The EP layer of the composite film for the bottom material is composed of PP and HDPE, the PP content is 30% by mass, the density of this PP is 0.90 g / cm 3 , the melting point is 160 ° C., and the density of HDPE is The melting point was 0.95 g / cm 3 and 133 ° C.
[0019]
(Example 2)
A composite film having the following layer structure is formed by coextrusion,
Ny (thickness 30 μm) / AD (thickness 10 μm) / PP (thickness 57 μm) / EP (thickness 3 μm)
A PP film was dry laminated on the outermost Ny side of the composite film to obtain a composite film for a bottom material of the present invention having the following constitution.
PP (thickness 400 μm) / Ny (thickness 30 μm) / AD (thickness 10 μm) / PP (thickness 57 μm) / EP (3 μm)
In addition, the lid member having the same layer structure as that of Example 1 was used.
The EP layer of the composite film for the bottom material is composed of PP and HDPE, the PP content is 70% by mass, the density of this PP is 0.90 g / cm 3 , the melting point is 160 ° C., and the density of HDPE is The melting point was 0.95 g / cm 3 and 133 ° C.
[0020]
Example 3
A composite film having the following layer structure is formed by coextrusion,
Ny (thickness 10 μm) / EVOH (thickness 20 μm) / AD (thickness 10 μm) / PP (thickness 40 μm) / EP (thickness 20 μm)
A PP film was dry laminated on the outermost Ny side of the composite film to obtain a composite film for a bottom material of the present invention having the following constitution.
PP (thickness 400 μm) // Ny (thickness 10 μm) / EVOH (thickness 20 μm) / AD (thickness 10 μm) / PP (thickness 40 μm) / EP (20 μm)
The lid material was dry laminated with an OPP film having a thickness of 20 μm, an aluminum-deposited polyethylene terephthalate film (hereinafter referred to as VMPET) having a thickness of 12 μm, and a PP having a thickness of 50 μm in that order to obtain a lid material.
The EP layer of the composite film for the bottom material is composed of PP and HDPE, the PP content is 60% by mass, the density of this PP is 0.90 g / cm 3 , the melting point is 160 ° C., and the density of HDPE is The melting point was 0.95 g / cm 3 and 133 ° C.
[0021]
Example 4
A composite film having the following layer structure is formed by coextrusion,
Ny (thickness 10 μm) / MXD6 (thickness 20 μm) / AD (thickness 10 μm) / PP (thickness 40 μm) / EP (thickness 20 μm)
A polypropylene film containing a filler was dry-laminated on the outermost Ny side of the composite film to obtain a composite film for a bottom material of the present invention having the following constitution.
PP with filler (thickness 400 μm) // Ny (thickness 30 μm) / MXD6 (thickness 20 μm) / AD (thickness 10 μm) / PP (thickness 40 μm) / EP (20 μm)
Further, the lid member having the same layer configuration as that of Example 3 was used.
The EP layer of the composite film for the bottom material is composed of PP and HDPE, the PP content is 60% by mass, the density of this PP is 0.89 g / cm 3 , the melting point is 135 ° C., and the density of HDPE is The melting point was 0.97 g / cm 3 and the melting point was 137 ° C.
The content of the inorganic filler in the outermost PP layer of the composite film for the bottom material was 30% by mass.
[0022]
As the inorganic filler, aluminosilicate was used.
[0023]
(Comparative Example 1)
A composite film having the following layer structure is formed by coextrusion,
Ny (thickness 30 μm) / AD (thickness 10 μm) / PP (thickness 57 μm) / EP (thickness 3 μm) This composite film is dry laminated on the outermost Ny side of the composite film to form the bottom material of the present invention having the following constitution A composite film for was obtained.
PP (thickness 400 μm) // Ny (thickness 30 μm) / AD (thickness 10 μm) / PP (thickness 57 μm) / EP layer (3 μm)
In addition, the lid member having the same layer structure as that of Example 1 was used.
[0024]
The EP layer of the composite film for the bottom material is composed of PP and HDPE, the PP content is 20% by mass, the density of this PP is 0.90 g / cm 3 , the melting point is 160 ° C., and the density of HDPE is The melting point was 0.95 g / cm 3 and 135 ° C.
[0025]
(Comparative Example 2)
A composite film having the following layer structure is formed by coextrusion,
Ny (thickness 30 μm) / AD (thickness 10 μm) / PP (thickness 57 μm) / EP (thickness 3 μm) This composite film is dry laminated on the outermost Ny side of the composite film to form the bottom material of the present invention having the following constitution A composite film for was obtained.
[0026]
PP (thickness 400 μm) // Ny (thickness 30 μm) / AD (thickness 10 μm) / PP (thickness 57 μm) / EP layer (3 μm)
In addition, the lid member having the same layer structure as that of Example 1 was used.
[0027]
The EP layer of the composite film for the bottom material is composed of PP and HDPE, the PP content is 80% by mass, the density of this PP is 0.90 g / cm 3 , the melting point is 160 ° C., and the density of HDPE is The melting point was 0.95 g / cm 3 and 133 ° C.
[0028]
(Comparative Example 3)
A composite film having the following layer structure is formed by coextrusion,
Ny (thickness 10 μm) / EVOH (thickness 20 μm) / AD (thickness 10 μm) / PP (thickness 30 μm) / EP (thickness 30 μm)
A PP film was dry laminated on the outermost Ny side of the composite film to obtain a composite film for a bottom material of the present invention having the following constitution.
PP (thickness 400 μm) // Ny (thickness 10 μm) / EVOH (thickness 20 μm) / AD (thickness 10 μm) / PP (thickness 30 μm) / EP (30 μm)
Further, the lid member having the same layer configuration as that of Example 3 was used.
[0029]
The content of PP in the sealing layer of the composite film for the bottom material is 60% by mass. The density of this PP is 0.90 g / cm 3 , the melting point is 160 ° C., and the density of HDPE is 0.95 g / cm. 3. Melting point was 133 ° C.
[0030]
Using the composite films of Examples 1 to 4 and Comparative Examples 1 to 3 having the contents described above as the bottom material and the cover material, a pack product is prepared by a deep drawing packaging machine FV6300 (manufactured by Omori Machinery Co., Ltd.), and test evaluation Carried out.
[0031]
<Evaluation method>
Peel strength The seal portion was cut into a 15 mm-wide strip under a normal temperature environment, and the stress when it was pulled at 200 mm / min with a tensile tester was measured to obtain the peel strength.
・ Opened skin The pack product produced by the skin pack test was opened and evaluated whether it could be opened easily.
・ Whether the EP layer side (seal part side), which is a hot plate at the time of molding, is brought into contact with a hot plate having a surface temperature of 150 ° C. and heated for 3 seconds, is it easily removed without being taken by the hot plate? Evaluated.
・ Evaluate whether or not the packaged product breaks when the packaged product is made with the contents of a high-breakage-resistant oil-rich side dish (boiled rice cake etc.) and heated in a microwave oven (600W) for 4 minutes. did.
[0032]
[Table 1]
In Comparative Example 1 in which the PP content in the EP layer is less than 30% by mass, the peel strength is less than 4.90 N / 15 mm width, the easy peel strength is inferior, the hot plate is formed during molding, and the bag breaking resistance is also good. Inferior.
[0033]
In Comparative Example 2 in which the PP content in the EP layer exceeds 70% by mass, the peel strength exceeds 11.77 N / 15 mm width, the easy peel property is inferior, and the openability is also inferior.
[0034]
Further, in Comparative Example 3 in which the thickness of the EP layer exceeds 20 mm, a film residue is generated and the unsealing property is inferior.
[0035]
【The invention's effect】
As described above, according to the present invention, an easy-open composite film that is excellent in bag breaking resistance in a high-temperature state and can be opened very easily at the time of use without being taken as a hot plate during high-temperature molding can be obtained. .
Claims (3)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2000030557A JP3836654B2 (en) | 2000-02-08 | 2000-02-08 | Easy-open composite film |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2000030557A JP3836654B2 (en) | 2000-02-08 | 2000-02-08 | Easy-open composite film |
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| JP2001219512A JP2001219512A (en) | 2001-08-14 |
| JP3836654B2 true JP3836654B2 (en) | 2006-10-25 |
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Families Citing this family (7)
| Publication number | Priority date | Publication date | Assignee | Title |
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| JP5152635B2 (en) * | 2007-09-27 | 2013-02-27 | 大日本印刷株式会社 | Oxygen-absorbing coextrusion multilayer laminate sheet |
| JP5152633B2 (en) * | 2007-09-27 | 2013-02-27 | 大日本印刷株式会社 | Oxygen-absorbing coextrusion multilayer laminate sheet |
| JP5152634B2 (en) * | 2007-09-27 | 2013-02-27 | 大日本印刷株式会社 | Oxygen-absorbing coextrusion multilayer laminate sheet |
| CN101990496A (en) * | 2008-04-03 | 2011-03-23 | 东赛璐株式会社 | Heat-fusible multilayered film |
| JP6303680B2 (en) * | 2014-03-24 | 2018-04-04 | 三菱ケミカル株式会社 | Coextrusion composite film |
| JP6330593B2 (en) * | 2014-09-10 | 2018-05-30 | 三菱ケミカル株式会社 | Coextruded film for high temperature sterilization |
| JP6384330B2 (en) * | 2015-01-08 | 2018-09-05 | 三菱ケミカル株式会社 | High-temperature sterilization coextrusion film and deep-drawn packaging |
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