JP3789857B2 - Vapor deposition equipment - Google Patents

Vapor deposition equipment Download PDF

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Publication number
JP3789857B2
JP3789857B2 JP2002185179A JP2002185179A JP3789857B2 JP 3789857 B2 JP3789857 B2 JP 3789857B2 JP 2002185179 A JP2002185179 A JP 2002185179A JP 2002185179 A JP2002185179 A JP 2002185179A JP 3789857 B2 JP3789857 B2 JP 3789857B2
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substrate
vapor deposition
mask
fixing
deposition chamber
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JP2004027291A (en
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幹夫 浅田
章裕 浜野
博彰 永田
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Canon Tokki Corp
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Canon Tokki Corp
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    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/50—Substrate holders
    • C23C14/505—Substrate holders for rotation of the substrates
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/06—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
    • C23C14/12—Organic material
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/24—Vacuum evaporation
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/10—Deposition of organic active material
    • H10K71/16—Deposition of organic active material using physical vapour deposition [PVD], e.g. vacuum deposition or sputtering
    • H10K71/164—Deposition of organic active material using physical vapour deposition [PVD], e.g. vacuum deposition or sputtering using vacuum deposition

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  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Physical Vapour Deposition (AREA)
  • Electroluminescent Light Sources (AREA)

Description

【０００１】
【発明の属する技術分野】
本発明は、例えば基板にマスクを介してＥＬ材料を蒸着して成膜しＥＬ表示装置を作製する蒸着装置に関するものである。
【０００２】
【従来の技術及び発明が解決しようとする課題】
例えばフルカラーの有機ＥＬを製作する際、真空化した蒸着室（真空槽）内で赤，青，緑の発光材（ＥＬ材料）をガラス基板に蒸着する場合には、高精細なマスクとガラス基板との高精度な位置合せ重合が±５μの精度で必要である。
【０００３】
しかし、このマスクとガラス基板とは真空槽内に設けた固定部に固定するものであるから、一旦真空槽内の固定部にセットした後再びこの合せ位置を修正（アライメント）することは極めて厄介な作業であり、そのためセット前に予め高精度で位置合せしておかなければならず、またその状態のままセットする必要があることから、非常に作業能率が悪く、また位置合せ精度が不十分となるおそれもあった。
【０００４】
また、例えば膜厚分布を均一にするためには、マスクを重合したガラス基板を蒸着時に回転させる回転機構を備えるが、このような回転機構を備えた固定部にマスクとガラス基板の重合位置を調整するアライメント機構を付加することは構造上容易ではない。
【０００５】
本発明は、一旦真空槽内の固定部にセットしたあるいは重合セットするマスクと基板との重合位置を槽外に設けた補正駆動機構８によって自動補正制御でき、これにより常に自動的に適正重合位置にセットする（精度の高い位置合せを行う）ことができ、マスク位置の変更やマスクの取り替えに際しても、真空槽内で自動的に常に適正重合位置に自動補正修正して固定でき、また蒸着時に膜厚を均一にするため固定部を回転させる回転機構を備える構成としても前述のように真空槽内での自動位置合せが自動的に行え、常にマスクと基板とを適正な重合位置に補正修正してセットできる極めて実用性に秀れた蒸着装置を提供することを目的としている。
【０００６】
【課題を解決するための手段】
添付図面を参照して本発明の要旨を説明する。
【０００７】
減圧雰囲気とする蒸着室１内に、マスク２を重合した基板３を固定する固定部４若しくは蒸着時に回転機構５によって回転する前記固定部４を設け、この固定部４に設けた重合固定機構６により前記マスク２と前記基板３とを重合固定し、蒸着源７より発生する成膜材料が前記マスク２に設けた開口部を介して前記基板３上に堆積して、このマスク２により定められる基板３の所定部に薄膜が形成されるように構成した蒸着装置において、前記固定部４若しくは前記固定部４及び前記回転機構５を前記蒸着室１外に設けた補正駆動機構８により移動自在に設けると共に、前記重合固定機構６の解除により前記固定部４への固定が解除された状態の前記基板３を保持する基板保持機構９を設け、前記マスク２と基板３との適正重合位置を判別する指標10を視認するカメラ部11を設け、このカメラ部11の画像に基づく判別により前記補正駆動機構８を作動して前記マスク２を固定若しくは支承している前記固定部４を、前記基板保持機構９により保持されている基板３に対して移動制御して適正重合位置に補正する補正制御部を備えたことを特徴とする蒸着装置に係るものである。
【０００８】
また、前記補正駆動機構８の固定側を前記蒸着室１側に固定し、移動側を前記蒸着室１内に配設する固定部４と連設し、この蒸着室１外に設けた補正駆動機構８の作動により蒸着室１内に設けた固定部４を移動制御し得るように構成し、前記マスク２を重合させた前記基板３を前記重合固定機構６により前記固定部４に固定するように構成し、この重合固定機構６による固定を解除し前記基板保持機構９により前記基板３を保持した状態で、固定部４を前記補正駆動機構８の作動により移動制御することで固定部４に配設した前記マスク２を前記基板３に対して移動制御するように構成したことを特徴とする請求項１記載の蒸着装置に係るものである。
【０００９】
また、前記補正駆動機構８は、固定側に対して移動側がＸ，Ｙ及びθ方向に移動制御される構成とし、このＸ，Ｙ及びθ方向に移動する移動側に前記蒸着室１内の前記固定部４に連設する連設部13を設け、この連設部13をベローズ14でおおい蒸着室１内に垂設し、この連設部13に前記固定部４を設けたことを特徴とする請求項２記載の蒸着装置に係るものである。
【００１０】
また、前記固定部４は、蒸着時に前記マスク２を重合した前記基板３を回転させるためにこの固定部４を回転させる前記回転機構５を備え、この回転機構５は固定部４と共に前記補正駆動機構８の移動側に設けたことを特徴とする請求項１〜３のいずれか１項に記載の蒸着装置に係るものである。
【００１１】
また、前記カメラ部11は、前記蒸着室１外に設け、前記マスク２と前記基板３に設けた前記指標10の一致・位置ズレを透明窓部15を介して蒸着室１外からとらえこの画像データに基づいて前記補正制御部により前記補正駆動機構８を移動制御するように構成したことを特徴とする請求項１〜４のいずれか１項に記載の蒸着装置に係るものである。
【００１２】
また、前記固定部４は、マスク・基板取付ユニットとして前記補正駆動機構８の移動側と一体化された状態で蒸着室１内に垂下配設され、この固定部４に設けた蒸着用開口部16をおおうように前記マスク２を配設し、このマスク２に前記基板３を重合配設して前記重合固定機構６により重合固定するように構成し、この重合固定機構６による重合固定を解除すると共に前記基板保持機構９により前記基板３を保持し、前記固定部４を基板３から相対的に離反移動することで、前記基板保持機構９により保持された基板３に対してマスク２を配設した前記固定部４を前記補正駆動機構８により移動制御し得るように構成したことを特徴とする請求項１〜５のいずれか１項に記載の蒸着装置に係るものである。
【００１３】
【発明の実施の形態】
好適と考える本発明の実施の形態（発明をどのように実施するか）を、図面に基づいてその作用効果を示して簡単に説明する。
【００１４】
マスク２を重合した基板３は、重合固定機構６により蒸着室１（真空槽）内の固定部４に重合固定させるが、このマスク２と基板３とを常に適正重合位置で重合固定させるために、前記重合固定機構６による重合固定を解除した状態で基板保持機構９によりマスク２と別に基板３のみを保持する。
【００１５】
この状態で例えば固定部４のわずかな下降移動等によりマスク２と基板３とを相対的に離反した状態とし、この状態で補正駆動機構８により基板３に対するマスク２の移動補正を行う。
【００１６】
即ち、例えば図８に示すように、適正重合位置なら互いに一致すること等により適正重合位置を示唆する指標10をマスク２と基板３とに夫々設け、この指標10を蒸着室１外に設けたカメラ部11により捉え、この画像に基づいて補正制御部により蒸着室１外に設けた補正駆動機構８を例えばＸ，Ｙ，θ方向に所定量作動させ、この補正駆動機構８の移動側と一体化している蒸着室１内の固定部４を前記指標10が適正重合位置を示唆する位置となるように移動制御する。
【００１７】
この補正を終えた後、例えば固定部４を上昇するなどして離反していたマスク２と基板３とを重合し、重合固定機構６によりこのマスク２と基板３とを固定部４に重合固定した後、基板保持機構９を解除し、マスク２と基板３とを適正重合位置で固定部４にセットすることを完了する。
【００１８】
また、回転機構５を備えた場合には、この固定部４を回転機構５により回転しながら、蒸着室１内の蒸着源７より発生する成膜材料を固定部４の蒸着用開口部16から露出するマスク２の開口部を介して基板３上に（このマスク開口部によって決められた基板３上の所定部に）堆積して薄膜を形成する。
【００１９】
このように膜厚を均一とするために固定部４を蒸着時に回転させる回転機構５を備える場合でも、この回転機構５を固定部４と共に補正駆動機構８の移動側に一体的に設けることで、前記作用・効果は確実に発揮される。
【００２０】
即ち、回転機構５を備え、マスク２と基板３とを固定する重合固定機構６等の取付構造を備えた固定部４を、補正駆動機構８の移動側に、回転するマスク基板取付ユニットとして一体化させて設けると共に、例えばベローズ14でおおって外気と遮断させつつ真空化する蒸着室１内に垂設する構成とし、またマスク２と基板３とのアライメントを行う場合には、前述のように基板保持機構９によりマスク２とは別に基板３を保持してこのユニット毎補正駆動機構８によりカメラ部11（補正制御部によるマイコン制御）によって蒸着室１内で基板３に対するマスク２の重合位置を自動補正制御できる構成としているため、厄介なマスク２の取り替えや修正作業を全く要せずに、減圧雰囲気とする（真空化する）蒸着室１内で自動的に常に適正重合位置にアライメントして重合固定セットできる画期的な蒸着装置が容易に実現できることとなる。
【００２１】
【実施例】
本発明の具体的な実施例について図面に基づいて説明する。
【００２２】
本実施例は、図１に示すように、真空ポンプ12により真空化する蒸着室１内に、マスク２を重合したガラス基板３を固定し蒸着時には図４に示すように回転機構５によって回転する（マスク基板取付ユニットとしての）固定部４を上方から吊り下げ垂下状態に設けている。
【００２３】
この固定部４の下部のマスクホルダー４Ａは、蒸着用開口部16を有する枠状構成とし、この蒸着用開口部16をおおうように薄板状のマスク２を水平載置し、この上に薄板状のガラス基板３を重合し、この重合端部に設けた重合固定機構６により基板３を上方から押圧してマスク２と基板３とをマスクホルダー４Ａ上に重合固定する構成としている。
【００２４】
即ち、蒸着室１外上部に回転機構５（回転駆動源と回転軸等から成る）を設け、蒸着時にはこの回転機構５により回転する固定部４（マスクホルダー４Ａ）を、連設部13（回転軸を有する）を介して蒸着室１内に吊り下げ配設し、この蒸着室１内底部に設けた蒸着源７より発生する成膜材料が固定部４の蒸着用開口部16から露出しているマスク２に設けた開口部を介して基板３上に堆積して、このマスク２の重合位置（マスク２の開口部位置）により定められる基板３上の所定部に薄膜が形成されるように構成している。
【００２５】
本実施例では、この蒸着室１外に設けられる回転機構５及びこれと一体となって蒸着室１内で回転する固定部４を前記蒸着室１外上部に設けた補正駆動機構８により移動自在に設けている。
【００２６】
即ち、この補正駆動機構８の固定側を前記蒸着室１側（蒸着室１上部面）に固定し、移動側に回転機構５を設けると共にこの移動側と蒸着室１内に配設する固定部４とを回転軸を有する連設部13にて連設し、この蒸着室１外に設けた補正駆動機構８の作動により蒸着室１内に設けた固定部４を回転機構５と共に移動制御し得るように構成している。
【００２７】
また、前記重合固定機構６の解除により前記固定部４への押圧固定が解除された状態の前記基板３を保持し蒸着室１に対して固定する基板保持機構９を設けている。
【００２８】
即ち、前述のようにマスク２を重合させた基板３を重合固定機構６により前記固定部４に押圧固定するように構成し、この重合固定機構６による押圧固定を解除し、蒸着室１に設けた前記基板保持機構９により前記基板３を保持した状態で、固定部４を前記補正駆動機構８の作動により移動制御することで固定部４に配設したマスク２を、蒸着室１に対して保持固定されている基板３に対して移動制御するように構成している。
【００２９】
更に説明すれば、図８に示すように、このマスク２と基板３とには適正重合位置を判別する指標10が夫々隅部に設けられていて、これが一致することで適正な重合位置となり、これがズレていることで移動補正が必要であることがわかるようにし、この指標10を蒸着室１外に設けたカメラ部11により透明窓部15を介して視認するように設け、このカメラ部11の画像に基づく判別により前記補正駆動機構８を作動して前記マスク２を支承している前記固定部４を、前記基板保持機構９により保持されている基板３に対して移動制御して適正重合位置となるまで自動補正する補正制御部を備えた構成としている。
【００３０】
更に具体的に説明すれば、本実施例の前記補正駆動機構８は、蒸着室１上部に固定する固定板を固定側とし、この固定板に対して移動する移動テーブル８Ａを移動側とし、図７に示すように、固定板と移動テーブル８Ａとの間にガイド部と駆動部とを有するモジュール８Ｂを複数設けると共に、水平回動支点部８Ｃを設け、各モジュール８Ｂを駆動制御することで移動テーブル８ＡがＸ，Ｙ及びθ方向に移動制御される薄偏平形のアライメント機構を蒸着室１上部に構成し、このＸ，Ｙ及びθ方向に移動する移動テーブル８Ａに回転機構５を設けると共にこの回転軸を有する連設部13を蒸着室１内に垂設し、この連設部13をベローズ14でおおい外気と遮断し蒸着室１内の固定部４と連設している。
【００３１】
また、前記カメラ部11は、ＣＣＤカメラを採用して蒸着室１外に設け、前記マスク２と前記基板３に設けた前記指標10の一致・位置ズレを透明窓部15を介して蒸着室１外からとらえこの画像データに基づいて前記補正制御部により前記補正駆動機構８をＸ，Ｙ，θのどの方向にどれだけ移動させるから制御処理して前記各モジュール８Ｂを駆動し、移動テーブル８Ａを移動制御するように構成している。
【００３２】
即ち、前記固定部４は、マスク・基板取付ユニットとして前記補正駆動機構８の移動テーブル８Ａと一体化された状態で蒸着室１内に垂下配設され、この固定部４に設けた蒸着用開口部16をおおうようにマスク２を配設し、このマスク２に基板３を重合配設して前記重合固定機構６により押圧重合固定するように構成している。カメラ部11（補正制御部）を用いてアライメントする場合には、この重合固定機構６による重合固定を解除すると共に、蒸着室１に設けた前記基板保持機構９により基板３をチャック保持する。
【００３３】
この基板保持機構９は、重合しているマスク２と基板３の端部に対して進退するチャック部９Ａを蒸着室１内面に設け、このチャック部９Ａを前記重合端部に接近移動してマスク２上の基板３の端部のみをチャックし得る位置で停止し、チャック作動により基板３のみをチャックして基板３を保持するように構成している。
【００３４】
また、前記固定部４を基板３から相対的に離反移動自在に設け、基板保持機構９によりチャックして基板３を保持した状態で少し固定部４のマスク２を載置するマスクホルダー４Ａ部分を下降するように構成している。（補正終了後は逆に上昇することで基板保持機構９に保持されている基板３とマスク２とは適正重合位置となって重合し、重合固定機構６によりこの重合を押圧固定した後、基板保持機構９を解除することでセット完了するように構成している）。
【００３５】
このように基板３は蒸着室１側に設けた基板保持機構９により保持し、マスク２は固定部４に載置された状態で下方へやや離反した状態とされ、この状態で基板３に対してマスク２を配設した前記固定部４を前記補正駆動機構８により移動制御し得るように構成している。
【００３６】
従って、本実施例では、蒸着室１内にマスク２と基板３とをセットする前に予め適正な重合位置に位置合せしておいて蒸着室１内の固定部４にセットする必要はなく、またマスク２の取り替えに際して再びこのようなセットを要せずに、例えば図１に示す固定部４のマスクホルダー４Ａ上にマスク２と基板３を重合載置すれば、先ず図２に示すように、上側の基板３は基板保持機構９により自動的にチャック保持され、少し固定部４を下げて基板３とマスク２とを離反状態となり、補正駆動機構８により基板３に対するマスク２の移動補正を行うことができる。
【００３７】
この補正を終えた後、例えば図３に示すように固定部４を上昇して離反していたマスク２と基板３とを重合し、重合固定機構６によりこのマスク２と基板３とを固定部４に重合固定した後、基板保持機構９を解除し、マスク２と基板３とを常に適正重合位置で固定部４に自動セットすることを完了することができる。
【００３８】
即ち、回転機構５を備え、マスク２と基板３とを固定する重合固定機構６等の取付構造を備えた固定部４を、補正駆動機構８の移動側に、回転するマスク基板取付ユニットとして一体化させて設けると共に、例えばベローズ14でおおって外気と遮断させつつ真空化する蒸着室１内に垂設する構成とし、またマスク２と基板３とのアライメントを行う場合には、前述のように基板保持機構９によりマスク２とは別に基板３を保持してこのユニット毎補正駆動機構８によりカメラ部11（補正制御部）によって蒸着室１内で基板３に対するマスク２の重合位置を自動補正制御できる構成としているため、厄介なマスク２の取り替えや修正作業を全く要せずに、減圧雰囲気とする（真空化する）蒸着室１内で自動的に常に適正重合位置にアライメントして重合固定セットできる画期的な蒸着装置が容易に実現できることとなる。
【００３９】
尚、本発明は、本実施例に限られるものではなく、各構成要件の具体的構成は適宜設計し得るものである。
【００４０】
【発明の効果】
本発明は上述のように構成したから、一旦蒸着室内の固定部にセットしたあるいは重合セットするマスクと基板との重合位置を室外に設けた補正駆動機構によって自動補正制御でき、これにより常に自動的に適正重合位置にセットする（精度の高い位置合せを行う）ことができ、マスク位置の変更やマスクの取り替えに際しても、蒸着室内で自動的に常に適正重合位置に自動補正修正して固定でき、また蒸着時に膜厚を均一にするため固定部を回転させる回転機構を備える構成としても前述のように真空槽内での自動位置合せが自動的に行え、常にマスクと基板とを適正な重合位置に補正修正してセットできる極めて実用性に秀れた画期的な蒸着装置となる。
【００４１】
即ち、減圧雰囲気とする（真空化する）蒸着室内で自動的に常に適正重合位置にアライメントして重合固定セットできる画期的な蒸着装置が容易に実現できることとなる。
【００４２】
また、請求項２〜６記載の発明においては、前記作用・効果を発揮する本発明を一層簡易な構成で容易に実現できる一層実用性に秀れた画期的な蒸着装置となる。
【図面の簡単な説明】
【図１】本実施例の概略構成説明図である。
【図２】本実施例の基板を基板保持機構により保持し、基板に対して補正駆動機構を作動制御してマスクの重合位置をアライメントする状態の概略構成説明図である。
【図３】本実施例の固定部にマスクと基板とを重合固定機構に重合固定し、蒸着する状態の概略構成説明図である。
【図４】本実施例の蒸着時の概略構成説明図である。
【図５】本実施例の固定部並びに基板保持機構を示す要部の概略構成説明平面図である。
【図６】本実施例の固定部並びに基板保持機構を示す要部の概略構成説明正面図である。
【図７】本実施例の補正駆動機構並びにその動作を示す説明平面図である。
【図８】本実施例のアライメント動作を示すマスクと基板との重合状態（指標が位置ズレ状態から一致した適正重合状態に補正されること）を示す説明平面図である。
【符号の説明】
１ 蒸着室
２ マスク
３ 基板
４ 固定部
５ 回転機構
６ 重合固定機構
７ 蒸着源
８ 補正駆動機構
９ 基板保持機構
10 指標
11 カメラ部
13 連設部
14 ベローズ
15 透明窓部
16 蒸着用開口部[0001]
BACKGROUND OF THE INVENTION
The present invention relates to an evaporation apparatus for manufacturing an EL display device by depositing an EL material on a substrate through a mask, for example.
[0002]
[Prior art and problems to be solved by the invention]
For example, when manufacturing a full-color organic EL, when red, blue, and green light emitting materials (EL materials) are deposited on a glass substrate in a vacuum deposition chamber (vacuum chamber), a high-definition mask and glass substrate are used. Highly accurate alignment polymerization is required with an accuracy of ± 5 μm.
[0003]
However, since the mask and the glass substrate are fixed to a fixed portion provided in the vacuum chamber, it is extremely troublesome to once again set the alignment position after setting the fixed portion in the vacuum chamber. Therefore, it must be aligned with high accuracy in advance before setting, and it must be set as it is, so the work efficiency is very poor and the alignment accuracy is insufficient. There was also a risk of becoming.
[0004]
Further, for example, in order to make the film thickness distribution uniform, a rotation mechanism that rotates the glass substrate on which the mask is polymerized during deposition is provided, and the overlapping position of the mask and the glass substrate is set on the fixed portion having such a rotation mechanism. It is not easy to add an alignment mechanism for adjustment.
[0005]
In the present invention, the superposition position of the mask and the substrate to be set or superposed on the fixed part in the vacuum chamber can be automatically corrected by the correction drive mechanism 8 provided outside the bath, thereby automatically automatically setting the proper superposition position. Can be set (to perform highly accurate alignment), and when changing the mask position or replacing the mask, it can be automatically corrected and fixed at the proper polymerization position automatically in the vacuum chamber. As described above, automatic positioning within the vacuum chamber can be performed automatically, and the mask and substrate are always corrected and corrected to the proper superposition position, even with a structure equipped with a rotating mechanism that rotates the fixed part to make the film thickness uniform. It is an object of the present invention to provide a vapor deposition apparatus that is extremely practical and can be set.
[0006]
[Means for Solving the Problems]
The gist of the present invention will be described with reference to the accompanying drawings.
[0007]
In the vapor deposition chamber 1 having a reduced pressure atmosphere, a fixing portion 4 for fixing the substrate 3 on which the mask 2 is superposed or the fixing portion 4 rotated by the rotating mechanism 5 at the time of vapor deposition is provided, and the polymerization fixing mechanism 6 provided in the fixing portion 4. The mask 2 and the substrate 3 are superposed and fixed by the above, and a film forming material generated from the vapor deposition source 7 is deposited on the substrate 3 through an opening provided in the mask 2 and is determined by the mask 2. In the vapor deposition apparatus configured so that a thin film is formed on a predetermined portion of the substrate 3, the fixed portion 4 or the fixed portion 4 and the rotating mechanism 5 are movable by a correction drive mechanism 8 provided outside the vapor deposition chamber 1. And a substrate holding mechanism 9 for holding the substrate 3 in a state where the fixing to the fixing portion 4 is released by releasing the superposition fixing mechanism 6, and determining an appropriate superposition position of the mask 2 and the substrate 3. You A camera unit 11 for visually recognizing the index 10 is provided, and the fixing unit 4 that fixes or supports the mask 2 by operating the correction driving mechanism 8 by discrimination based on an image of the camera unit 11 is used as the substrate holding mechanism. The vapor deposition apparatus is provided with a correction control unit that performs movement control with respect to the substrate 3 held by the substrate 9 and corrects it to an appropriate polymerization position.
[0008]
Further, the fixed side of the correction drive mechanism 8 is fixed to the vapor deposition chamber 1 side, and the moving side is connected to the fixed portion 4 disposed in the vapor deposition chamber 1, and the correction drive provided outside the vapor deposition chamber 1. The fixing unit 4 provided in the vapor deposition chamber 1 can be moved and controlled by the operation of the mechanism 8, and the substrate 3 on which the mask 2 is superposed is fixed to the fixing unit 4 by the superposition fixing mechanism 6. In the state where the fixing by the superposition fixing mechanism 6 is released and the substrate 3 is held by the substrate holding mechanism 9, the fixing unit 4 is moved and controlled by the operation of the correction driving mechanism 8, so that the fixing unit 4 is moved. 2. The vapor deposition apparatus according to claim 1, wherein the movement of the arranged mask is controlled with respect to the substrate.
[0009]
Further, the correction drive mechanism 8 is configured such that the movement side is controlled to move in the X, Y, and θ directions with respect to the fixed side, and the movement side in the X, Y, and θ directions moves to the inside of the vapor deposition chamber 1. A continuous portion 13 is provided to be connected to the fixed portion 4, the continuous portion 13 is suspended in the vapor deposition chamber 1 by a bellows 14, and the fixed portion 4 is provided in the continuous portion 13. The vapor deposition apparatus according to claim 2.
[0010]
The fixing unit 4 includes the rotating mechanism 5 that rotates the fixing unit 4 to rotate the substrate 3 on which the mask 2 is superposed during vapor deposition, and the rotating mechanism 5 together with the fixing unit 4 performs the correction driving. The deposition apparatus according to claim 1, wherein the deposition apparatus is provided on a moving side of the mechanism 8.
[0011]
Further, the camera unit 11 is provided outside the vapor deposition chamber 1, and this image is obtained from the outside of the vapor deposition chamber 1 through the transparent window portion 15 to recognize the coincidence / position shift of the index 10 provided on the mask 2 and the substrate 3. 5. The vapor deposition apparatus according to claim 1, wherein movement of the correction drive mechanism 8 is controlled by the correction control unit based on data. 6.
[0012]
The fixing portion 4 is suspended in the vapor deposition chamber 1 as a mask / substrate mounting unit and integrated with the moving side of the correction drive mechanism 8, and an evaporation opening provided in the fixing portion 4. The mask 2 is disposed so as to cover 16, the substrate 3 is superposed on the mask 2 and is superposed and fixed by the superposition fixing mechanism 6, and the superposition fixing by the superposition fixing mechanism 6 is released. At the same time, the substrate 3 is held by the substrate holding mechanism 9, and the fixing portion 4 is moved away from the substrate 3, whereby the mask 2 is arranged on the substrate 3 held by the substrate holding mechanism 9. 6. The vapor deposition apparatus according to claim 1, wherein the fixed portion 4 provided is configured to be movable and controlled by the correction drive mechanism 8.
[0013]
DETAILED DESCRIPTION OF THE INVENTION
An embodiment of the present invention (how to carry out the invention) considered to be suitable will be briefly described with reference to the drawings, showing its effects.
[0014]
The substrate 3 on which the mask 2 is polymerized is polymerized and fixed to the fixing part 4 in the vapor deposition chamber 1 (vacuum chamber) by the polymerization fixing mechanism 6. In order to always fix the mask 2 and the substrate 3 at the proper polymerization position. The substrate holding mechanism 9 holds only the substrate 3 separately from the mask 2 in a state in which the polymerization fixing by the polymerization fixing mechanism 6 is released.
[0015]
In this state, for example, the mask 2 and the substrate 3 are relatively separated from each other by a slight downward movement of the fixed portion 4, and in this state, the movement of the mask 2 relative to the substrate 3 is corrected by the correction drive mechanism 8.
[0016]
That is, for example, as shown in FIG. 8, an index 10 indicating the proper polymerization position is provided on the mask 2 and the substrate 3 respectively by matching each other at the proper polymerization position, and this index 10 is provided outside the vapor deposition chamber 1. The correction drive mechanism 8 provided outside the deposition chamber 1 is operated by a predetermined amount in, for example, the X, Y, and θ directions by the correction control unit based on the image captured by the camera unit 11 and integrated with the moving side of the correction drive mechanism 8. The fixed portion 4 in the vapor deposition chamber 1 is controlled to move so that the index 10 is a position suggesting an appropriate polymerization position.
[0017]
After completing this correction, the mask 2 and the substrate 3 that have been separated by, for example, raising the fixing portion 4 are superposed, and the mask 2 and the substrate 3 are superposed and fixed to the fixing portion 4 by the superposition fixing mechanism 6. After that, the substrate holding mechanism 9 is released, and the setting of the mask 2 and the substrate 3 on the fixing portion 4 at the proper superposition position is completed.
[0018]
Further, when the rotating mechanism 5 is provided, the film forming material generated from the vapor deposition source 7 in the vapor deposition chamber 1 is transferred from the vapor deposition opening 16 of the fixed unit 4 while rotating the fixed unit 4 by the rotating mechanism 5. A thin film is formed by depositing on the substrate 3 (on a predetermined portion on the substrate 3 determined by the mask opening) through the exposed opening of the mask 2.
[0019]
Even when the rotation mechanism 5 that rotates the fixing portion 4 during vapor deposition is provided in order to make the film thickness uniform, the rotation mechanism 5 is integrally provided on the moving side of the correction drive mechanism 8 together with the fixing portion 4. The actions and effects are surely exhibited.
[0020]
That is, the fixing unit 4 including the rotation mechanism 5 and the mounting structure such as the superposition fixing mechanism 6 that fixes the mask 2 and the substrate 3 is integrated as a rotating mask substrate mounting unit on the moving side of the correction driving mechanism 8. For example, when the mask 2 and the substrate 3 are aligned as described above, the mask 2 and the substrate 3 are aligned with each other, for example, by being covered with a bellows 14 and being vacuumed while being shielded from the outside air. The substrate 3 is held separately from the mask 2 by the substrate holding mechanism 9, and the overlapping position of the mask 2 with respect to the substrate 3 in the vapor deposition chamber 1 is controlled by the camera unit 11 (microcomputer control by the correction control unit) by the unit-specific correction drive mechanism 8. Since it is configured so that automatic correction control can be performed, the proper polymerization position is always automatically set in the vapor deposition chamber 1 in which the atmosphere is reduced (evacuated) without requiring troublesome replacement or correction of the mask 2. Therefore, it is possible to easily realize an epoch-making vapor deposition apparatus that can be aligned and fixed to the apparatus.
[0021]
【Example】
Specific embodiments of the present invention will be described with reference to the drawings.
[0022]
In this embodiment, as shown in FIG. 1, a glass substrate 3 on which a mask 2 is polymerized is fixed in a vapor deposition chamber 1 which is evacuated by a vacuum pump 12, and is rotated by a rotating mechanism 5 as shown in FIG. The fixing portion 4 (as a mask substrate mounting unit) is provided in a suspended state suspended from above.
[0023]
The mask holder 4A below the fixed portion 4 has a frame-like configuration having a vapor deposition opening 16, and a thin plate-like mask 2 is horizontally placed so as to cover the vapor deposition opening 16, and a thin plate is formed thereon. The glass substrate 3 is polymerized and the mask 3 and the substrate 3 are superposed and fixed on the mask holder 4A by pressing the substrate 3 from above by a superposition fixing mechanism 6 provided at the superposition end.
[0024]
That is, a rotation mechanism 5 (consisting of a rotation drive source and a rotation shaft) is provided at the upper part of the vapor deposition chamber 1, and a fixed portion 4 (mask holder 4A) rotated by the rotation mechanism 5 at the time of vapor deposition is connected to a continuous portion 13 (rotation). The film forming material generated from the vapor deposition source 7 provided at the bottom of the vapor deposition chamber 1 is exposed from the vapor deposition opening 16 of the fixed portion 4. The thin film is deposited on the substrate 3 through the opening provided in the mask 2 so that a thin film is formed at a predetermined portion on the substrate 3 defined by the overlapping position of the mask 2 (opening position of the mask 2). It is composed.
[0025]
In the present embodiment, the rotating mechanism 5 provided outside the vapor deposition chamber 1 and the fixed portion 4 that rotates integrally with the rotation mechanism 5 are movable by a correction drive mechanism 8 provided outside the vapor deposition chamber 1. Provided.
[0026]
That is, the fixed side of the correction drive mechanism 8 is fixed to the vapor deposition chamber 1 side (the upper surface of the vapor deposition chamber 1), the rotating mechanism 5 is provided on the moving side, and the fixing portion disposed in the moving side and the vapor deposition chamber 1 is provided. 4 is connected by a connecting portion 13 having a rotation axis, and the movement of the fixed portion 4 provided in the vapor deposition chamber 1 is controlled together with the rotation mechanism 5 by the operation of the correction drive mechanism 8 provided outside the vapor deposition chamber 1. Configure to get.
[0027]
Further, a substrate holding mechanism 9 is provided that holds the substrate 3 in a state where the pressing and fixing to the fixing portion 4 is released by releasing the superposition fixing mechanism 6 and fixes the substrate 3 to the vapor deposition chamber 1.
[0028]
That is, as described above, the substrate 3 on which the mask 2 is superposed is pressed and fixed to the fixing portion 4 by the polymerization fixing mechanism 6, and the pressure fixing by the polymerization fixing mechanism 6 is released and provided in the vapor deposition chamber 1. The mask 2 disposed on the fixed portion 4 is controlled with respect to the vapor deposition chamber 1 by controlling the movement of the fixed portion 4 by the operation of the correction drive mechanism 8 while the substrate 3 is held by the substrate holding mechanism 9. The movement is controlled with respect to the substrate 3 which is held and fixed.
[0029]
More specifically, as shown in FIG. 8, the mask 2 and the substrate 3 are each provided with an index 10 for determining an appropriate polymerization position at each corner, and when they match, an appropriate polymerization position is obtained. It is understood that the movement correction is necessary due to the deviation, and this index 10 is provided so as to be visually recognized through the transparent window portion 15 by the camera portion 11 provided outside the vapor deposition chamber 1. According to the determination based on the image of the above, the correction driving mechanism 8 is operated to control the movement of the fixing portion 4 that supports the mask 2 with respect to the substrate 3 held by the substrate holding mechanism 9 to perform proper polymerization. The correction control unit is configured to automatically correct the position until the position is reached.
[0030]
More specifically, in the correction drive mechanism 8 of this embodiment, a fixed plate fixed to the upper part of the vapor deposition chamber 1 is a fixed side, and a moving table 8A that moves relative to the fixed plate is a moving side. As shown in FIG. 7, a plurality of modules 8B each having a guide portion and a drive portion are provided between the fixed plate and the moving table 8A, and a horizontal rotation fulcrum portion 8C is provided, and each module 8B is driven and controlled to move. A thin flat alignment mechanism in which the table 8A is controlled to move in the X, Y, and θ directions is formed in the upper portion of the vapor deposition chamber 1, and a rotating mechanism 5 is provided on the moving table 8A that moves in the X, Y, and θ directions. A continuous portion 13 having a rotating shaft is suspended in the vapor deposition chamber 1, and the continuous portion 13 is shielded from the outside air by a bellows 14 and is connected to the fixed portion 4 in the vapor deposition chamber 1.
[0031]
In addition, the camera unit 11 employs a CCD camera and is provided outside the vapor deposition chamber 1, and the alignment / position shift of the index 10 provided on the mask 2 and the substrate 3 is passed through the transparent window 15 to the vapor deposition chamber 1. From the outside, based on this image data, the correction control unit moves the correction drive mechanism 8 in which direction of X, Y, θ and how much it moves to drive each module 8B to move the movement table 8A. It is configured to control movement.
[0032]
That is, the fixed portion 4 is suspended in the vapor deposition chamber 1 as a mask / substrate mounting unit and integrated with the moving table 8A of the correction drive mechanism 8, and the vapor deposition opening provided in the fixed portion 4 is provided. The mask 2 is disposed so as to cover the portion 16, and the substrate 3 is superposed on the mask 2, and is configured to be pressure-polymerized and fixed by the superposition fixing mechanism 6. When alignment is performed using the camera unit 11 (correction control unit), the polymerization fixing by the polymerization fixing mechanism 6 is released, and the substrate 3 is chucked and held by the substrate holding mechanism 9 provided in the vapor deposition chamber 1.
[0033]
The substrate holding mechanism 9 is provided with a superposed mask 2 and a chuck portion 9A that moves forward and backward with respect to the end of the substrate 3 on the inner surface of the vapor deposition chamber 1, and moves the chuck portion 9A closer to the superposed end to move the mask. 2 is stopped at a position where only the end portion of the substrate 3 can be chucked, and the substrate 3 is held by chucking only the substrate 3 by the chuck operation.
[0034]
Further, the fixed portion 4 is provided so as to be relatively movable away from the substrate 3, and a mask holder 4 </ b> A portion on which the mask 2 of the fixed portion 4 is slightly placed in a state where the substrate 3 is held by being chucked by the substrate holding mechanism 9. It is configured to descend. (After the correction is completed, the substrate 3 and the mask 2 held by the substrate holding mechanism 9 are raised in the opposite direction so that they are polymerized at an appropriate polymerization position, and this polymerization is pressed and fixed by the polymerization fixing mechanism 6. The setting is completed by releasing the holding mechanism 9).
[0035]
In this way, the substrate 3 is held by the substrate holding mechanism 9 provided on the vapor deposition chamber 1 side, and the mask 2 is in a state of being slightly separated downward while being placed on the fixing portion 4. Thus, the fixed portion 4 provided with the mask 2 is configured to be movable and controlled by the correction drive mechanism 8.
[0036]
Therefore, in this embodiment, before setting the mask 2 and the substrate 3 in the vapor deposition chamber 1, it is not necessary to align them in advance at an appropriate polymerization position and set them in the fixing portion 4 in the vapor deposition chamber 1. Further, when the mask 2 is replaced, if such a set is not required again, for example, if the mask 2 and the substrate 3 are superposed on the mask holder 4A of the fixing portion 4 shown in FIG. 1, first, as shown in FIG. The upper substrate 3 is automatically chucked and held by the substrate holding mechanism 9, the fixing portion 4 is slightly lowered to separate the substrate 3 and the mask 2, and the correction drive mechanism 8 corrects the movement of the mask 2 relative to the substrate 3. It can be carried out.
[0037]
After completing this correction, for example, as shown in FIG. 3, the mask 2 and the substrate 3 which are separated by raising the fixing portion 4 are superposed, and the mask 2 and the substrate 3 are fixed by the superposition fixing mechanism 6. After being superposed and fixed to 4, the substrate holding mechanism 9 is released, and it is possible to complete the automatic setting of the mask 2 and the substrate 3 to the fixing portion 4 always at the proper superposition position.
[0038]
That is, the fixing unit 4 including the rotation mechanism 5 and the mounting structure such as the superposition fixing mechanism 6 that fixes the mask 2 and the substrate 3 is integrated as a rotating mask substrate mounting unit on the moving side of the correction driving mechanism 8. For example, when the mask 2 and the substrate 3 are aligned as described above, the mask 2 and the substrate 3 are aligned as described above. The substrate holding mechanism 9 holds the substrate 3 separately from the mask 2, and the unit-by-unit correction driving mechanism 8 automatically corrects and controls the superposition position of the mask 2 with respect to the substrate 3 in the vapor deposition chamber 1 by the camera unit 11 (correction control unit). Because it has a structure that can be used, it does not require any troublesome replacement or correction work of the mask 2 and is always automatically aligned to the proper polymerization position in the vacuum chamber 1 where the atmosphere is reduced (evacuated). Thus, an epoch-making vapor deposition apparatus that can be fixed by polymerization can be easily realized.
[0039]
Note that the present invention is not limited to this embodiment, and the specific configuration of each component can be designed as appropriate.
[0040]
【The invention's effect】
Since the present invention is configured as described above, the overlapping position between the mask and the substrate to be set or overlapped once set in the deposition chamber can be automatically corrected and controlled by a correction driving mechanism provided outside the chamber. It can be set to the proper polymerization position (perform highly accurate alignment), and when changing the mask position or replacing the mask, it can be automatically corrected and fixed at the proper polymerization position automatically in the deposition chamber. In addition, as described above, automatic alignment within the vacuum chamber can be performed automatically, and the mask and substrate are always placed at the proper polymerization position, even with a structure equipped with a rotating mechanism that rotates the fixed part to make the film thickness uniform during vapor deposition. It is an epoch-making vapor deposition apparatus that is extremely practical and can be set with correction.
[0041]
That is, it is possible to easily realize an epoch-making vapor deposition apparatus that can automatically align and set in a proper polymerization position automatically in a vapor deposition chamber in which the atmosphere is reduced (evacuated).
[0042]
Moreover, in invention of Claims 2-6, it becomes an epoch-making vapor deposition apparatus excellent in the further practicality which can implement | achieve easily this invention which exhibits the said effect | action and effect with a simpler structure.
[Brief description of the drawings]
FIG. 1 is an explanatory diagram of a schematic configuration of the present embodiment.
FIG. 2 is a schematic explanatory diagram of a state in which the substrate of this embodiment is held by a substrate holding mechanism, and the correction drive mechanism is controlled to be aligned with the substrate to align the overlapping positions of the masks.
FIG. 3 is an explanatory diagram of a schematic configuration in a state in which a mask and a substrate are superposed and fixed on a superposition fixing mechanism and vapor deposition is performed on a fixing portion of the present embodiment.
FIG. 4 is an explanatory diagram of a schematic configuration at the time of vapor deposition in this example.
FIG. 5 is a plan view illustrating a schematic configuration of a main part showing a fixing part and a substrate holding mechanism of the present embodiment.
FIG. 6 is a front view of a schematic configuration of a main part showing a fixing part and a substrate holding mechanism of the present embodiment.
FIG. 7 is an explanatory plan view showing a correction drive mechanism and its operation according to the present embodiment.
FIG. 8 is an explanatory plan view showing a superposition state of the mask and the substrate (an index is corrected to a proper superposition state that coincides with a positional deviation state) showing an alignment operation of the present embodiment.
[Explanation of symbols]
DESCRIPTION OF SYMBOLS 1 Deposition chamber 2 Mask 3 Substrate 4 Fixing part 5 Rotating mechanism 6 Polymerization fixing mechanism 7 Deposition source 8 Correction drive mechanism 9 Substrate holding mechanism
10 indicators
11 Camera section
13 Consecutive section
14 Bellows
15 Transparent window
16 Deposition opening

Claims (6)

減圧雰囲気とする蒸着室内に、マスクを重合した基板を固定する固定部若しくは蒸着時に回転機構によって回転する前記固定部を設け、この固定部に設けた重合固定機構により前記マスクと前記基板とを重合固定し、蒸着源より発生する成膜材料が前記マスクに設けた開口部を介して前記基板上に堆積して、このマスクにより定められる基板の所定部に薄膜が形成されるように構成した蒸着装置において、前記固定部若しくは前記固定部及び前記回転機構を前記蒸着室外に設けた補正駆動機構により移動自在に設けると共に、前記重合固定機構の解除により前記固定部への固定が解除された状態の前記基板を保持する基板保持機構を設け、前記マスクと基板との適正重合位置を判別する指標を視認するカメラ部を設け、このカメラ部の画像に基づく判別により前記補正駆動機構を作動して前記マスクを固定若しくは支承している前記固定部を、前記基板保持機構により保持されている基板に対して移動制御して適正重合位置に補正する補正制御部を備えたことを特徴とする蒸着装置。In the vapor deposition chamber having a reduced pressure atmosphere, a fixing part for fixing the substrate on which the mask is polymerized or the fixing part rotated by a rotation mechanism during vapor deposition is provided, and the mask and the substrate are polymerized by the polymerization fixing mechanism provided in the fixing part Vapor deposition configured to deposit a film forming material generated from a vapor deposition source on the substrate through an opening provided in the mask and form a thin film on a predetermined portion of the substrate defined by the mask In the apparatus, the fixed portion or the fixed portion and the rotation mechanism are movably provided by a correction driving mechanism provided outside the vapor deposition chamber, and the fixing to the fixed portion is released by releasing the superposition fixing mechanism. A substrate holding mechanism that holds the substrate is provided, and a camera unit that visually recognizes an index for determining an appropriate superposition position of the mask and the substrate is provided. Correction control for operating the correction drive mechanism according to the determination to fix or fix the fixed portion supporting or supporting the mask with respect to the substrate held by the substrate holding mechanism to correct to an appropriate superposition position. The vapor deposition apparatus characterized by having a part. 前記補正駆動機構の固定側を前記蒸着室側に固定し、移動側を前記蒸着室内に配設する固定部と連設し、この蒸着室外に設けた補正駆動機構の作動により蒸着室内に設けた固定部を移動制御し得るように構成し、前記マスクを重合させた前記基板を前記重合固定機構により前記固定部に固定するように構成し、この重合固定機構による固定を解除し前記基板保持機構により前記基板を保持した状態で、固定部を前記補正駆動機構の作動により移動制御することで固定部に配設した前記マスクを前記基板に対して移動制御するように構成したことを特徴とする請求項１記載の蒸着装置。The fixed side of the correction drive mechanism is fixed to the vapor deposition chamber side, and the moving side is connected to a fixed portion disposed in the vapor deposition chamber, and the correction drive mechanism provided outside the vapor deposition chamber is provided in the vapor deposition chamber. The fixing part can be controlled to move, the substrate on which the mask is superposed is fixed to the fixing part by the superposition fixing mechanism, the fixing by the superposition fixing mechanism is released, and the substrate holding mechanism is released. In the state where the substrate is held by the above, the movement of the fixed portion is controlled by the operation of the correction drive mechanism so that the movement of the mask disposed on the fixed portion is controlled with respect to the substrate. The vapor deposition apparatus according to claim 1. 前記補正駆動機構は、固定側に対して移動側がＸ，Ｙ及びθ方向に移動制御される構成とし、このＸ，Ｙ及びθ方向に移動する移動側に前記蒸着室内の前記固定部に連設する連設部を設け、この連設部をベローズでおおい蒸着室内に垂設し、この連設部に前記固定部を設けたことを特徴とする請求項２記載の蒸着装置。The correction drive mechanism is configured such that the movement side is controlled to move in the X, Y, and θ directions with respect to the fixed side, and the movement side that moves in the X, Y, and θ directions is connected to the fixed portion in the deposition chamber. 3. The vapor deposition apparatus according to claim 2, wherein a continuous portion is provided, the continuous portion is suspended by a bellows in a vapor deposition chamber, and the fixed portion is provided at the continuous portion. 前記固定部は、蒸着時に前記マスクを重合した前記基板を回転させるためにこの固定部を回転させる前記回転機構を備え、この回転機構は固定部と共に前記補正駆動機構の移動側に設けたことを特徴とする請求項１〜３のいずれか１項に記載の蒸着装置。The fixing unit includes the rotating mechanism that rotates the fixing unit to rotate the substrate on which the mask is superimposed during vapor deposition, and the rotating mechanism is provided on the moving side of the correction driving mechanism together with the fixing unit. The vapor deposition apparatus of any one of Claims 1-3 characterized by the above-mentioned. 前記カメラ部は、前記蒸着室外に設け、前記マスクと前記基板に設けた前記指標の一致・位置ズレを透明窓部を介して蒸着室外からとらえこの画像データに基づいて前記補正制御部により前記補正駆動機構を移動制御するように構成したことを特徴とする請求項１〜４のいずれか１項に記載の蒸着装置。The camera unit is provided outside the vapor deposition chamber, and the alignment and positional deviation of the indicators provided on the mask and the substrate are detected from outside the vapor deposition chamber through a transparent window, and the correction control unit corrects the correction based on the image data. The vapor deposition apparatus according to claim 1, wherein the drive mechanism is configured to control movement. 前記固定部は、マスク・基板取付ユニットとして前記補正駆動機構の移動側と一体化された状態で蒸着室内に垂下配設され、この固定部に設けた蒸着用開口部をおおうように前記マスクを配設し、このマスクに前記基板を重合配設して前記重合固定機構により重合固定するように構成し、この重合固定機構による重合固定を解除すると共に前記基板保持機構により前記基板を保持し、前記固定部を基板から相対的に離反移動することで、前記基板保持機構により保持された基板に対してマスクを配設した前記固定部を前記補正駆動機構により移動制御し得るように構成したことを特徴とする請求項１〜５のいずれか１項に記載の蒸着装置。The fixed part is suspended in the vapor deposition chamber in a state of being integrated with the moving side of the correction drive mechanism as a mask / substrate mounting unit, and the mask is covered so as to cover the vapor deposition opening provided in the fixed part. Arranged to superpose and arrange the substrate on the mask and superpose and fix by the superposition fixing mechanism, release the superposition fixation by the superposition fixing mechanism and hold the substrate by the substrate holding mechanism, By moving the fixing portion away from the substrate relatively, the fixing portion provided with a mask with respect to the substrate held by the substrate holding mechanism can be controlled to move by the correction driving mechanism. The vapor deposition apparatus of any one of Claims 1-5 characterized by these.
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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4596794B2 (en) * 2004-02-27 2010-12-15 日立造船株式会社 Alignment equipment for vacuum deposition
JP4494832B2 (en) * 2004-03-11 2010-06-30 株式会社アルバック Alignment apparatus and film forming apparatus
KR100636492B1 (en) 2005-01-05 2006-10-18 삼성에스디아이 주식회사 Device and Mothod for aligning of substrate and mask
JP4384109B2 (en) 2005-01-05 2009-12-16 三星モバイルディスプレイ株式會社 Drive shaft of vapor deposition source for vapor deposition system and vapor deposition system having the same
KR101190106B1 (en) 2005-08-25 2012-10-11 히다치 조센 가부시키가이샤 Alignment device for vacuum deposition
WO2007023553A1 (en) * 2005-08-25 2007-03-01 Hitachi Zosen Corporation Alignment device for vacuum deposition
KR20070046375A (en) * 2005-10-31 2007-05-03 주성엔지니어링(주) Apparatus for aligning substrate and mask, and method of aligning using the same
JP4865414B2 (en) * 2006-06-22 2012-02-01 トッキ株式会社 Alignment method
JP4768530B2 (en) * 2006-06-27 2011-09-07 トッキ株式会社 Alignment method in organic EL element forming apparatus
JP5153813B2 (en) * 2010-04-12 2013-02-27 日立造船株式会社 Alignment equipment for vacuum deposition
JP5639431B2 (en) * 2010-09-30 2014-12-10 キヤノントッキ株式会社 Deposition equipment
JP6095405B2 (en) * 2013-02-19 2017-03-15 株式会社アルバック Alignment method
KR20140145449A (en) * 2013-06-13 2014-12-23 주식회사 선익시스템 Pressure module and apparatus for stretching substrate
CN103785189B (en) * 2014-02-26 2016-06-01 哈尔滨工业大学 On the useless foam extracting machine of donkey-hide gelatin glue liquid, case is done more physical exercises mechanism arrangement
CN103768815B (en) * 2014-02-26 2016-01-20 哈尔滨工业大学 Donkey-hide gelatin glue with high temperature-proof video camera mounting box gives up foam extractor top box
KR101561140B1 (en) * 2014-10-28 2015-10-20 에스엔유 프리시젼 주식회사 Apparatus for rotating aligning a substrate
JP2016117915A (en) * 2014-12-18 2016-06-30 キヤノントッキ株式会社 Device and method of vapor deposition
US9490154B2 (en) * 2015-01-15 2016-11-08 Applied Materials, Inc. Method of aligning substrate-scale mask with substrate
CN106884151A (en) * 2015-12-16 2017-06-23 上海新微技术研发中心有限公司 Substrate alignment device, substrate alignment method and physical vapor deposition method
JP6662841B2 (en) * 2017-12-21 2020-03-11 株式会社アルバック Vapor deposition equipment
JP7194006B2 (en) * 2018-12-18 2022-12-21 キヤノントッキ株式会社 Substrate mounting method, film forming method, film forming apparatus, and organic EL panel manufacturing system
JP7269000B2 (en) 2018-12-26 2023-05-08 キヤノントッキ株式会社 Substrate mounting method, film forming method, film forming apparatus, and organic EL panel manufacturing system
JP2022032234A (en) * 2020-08-11 2022-02-25 キヤノントッキ株式会社 Rotary deposition device and method for producing electronic device

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