JP3783498B2 - Crimping method for electronic parts - Google Patents

Crimping method for electronic parts Download PDF

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Publication number
JP3783498B2
JP3783498B2 JP35542999A JP35542999A JP3783498B2 JP 3783498 B2 JP3783498 B2 JP 3783498B2 JP 35542999 A JP35542999 A JP 35542999A JP 35542999 A JP35542999 A JP 35542999A JP 3783498 B2 JP3783498 B2 JP 3783498B2
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Japan
Prior art keywords
electronic component
substrate
optical head
crimping
imaging
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JP35542999A
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JP2001177298A (en
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一雄 有門
和宏 野田
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Panasonic Corp
Panasonic Holdings Corp
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Panasonic Corp
Matsushita Electric Industrial Co Ltd
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【０００１】
【発明の属する技術分野】
本発明は、フリップチップなどの電子部品を基板に圧着する電子部品の圧着方法に関するものである。
【０００２】
【従来の技術】
電子部品の小型化、配線パターンの狭ピッチ化にともなって、電子部品を基板に実装する際の位置精度には高精度が求められるようになり、基板の変形や位置ずれなどによって生ずる実装点の位置誤差を画像認識によって補正する方法が広く用いられている。この方法は電子部品の実装に先立って、基板または基板と電子部品の双方をカメラで撮像し、得られた画像データに基づいて基板や電子部品の位置を検出し、この結果により実装時の位置補正を行うものである。
【０００３】
ところで、フリップチップなど半導体素子の下面にバンプが形成され、このバンプを基板の電極に接合するものでは、前述の実装時の位置補正に際してはこのバンプの位置を画像認識により求める必要がある。このため、電子部品を保持する圧着ヘッドと基板との間にカメラを位置させて基板と電子部品のバンプの双方を撮像することが行われる。この場合には、圧着ヘッドを下降させて電子部品を基板に圧着する際には、圧着ヘッドの下方からカメラを退避させる必要があるため、可動式のアームに光学系を装着した光学ヘッドが用いられる。
【０００４】
【発明が解決しようとする課題】
ところが、上記従来の圧着装置においては、カメラによる撮像時には光学ヘッドを静止させる必要があることから、１回の認識動作において、光学ヘッドが進出・退避する移動時間に、カメラの撮像のために光学ヘッドが停止している静止時間を加えた認識所要時間が必要とされていた。このため基板・部品認識に要する時間が長く、結果として圧着作業全体のタクトタイム短縮が困難で、生産性の向上が阻害されるという問題点があった。
【０００５】
そこで本発明は、タクトタイムを短縮して生産性を向上させる電子部品の圧着方法を提供することを目的とする。
【００１０】
【課題を解決するための手段】
請求項１記載の電子部品の圧着方法は、電子部品を保持した圧着ヘッドを昇降させて基板に押圧することにより前記電子部品を基板に圧着する電子部品の圧着方法であって、１次元画像を検出する１次元画像検出手段を備え上下両方向の撮像が可能な光学ヘッドを電子部品を保持した圧着ヘッドと基板の間の空間に進退手段によって進出させる工程と、この光学ヘッドを前記進退手段によってスキャンさせて得られた複数の１次元画像に基づいて前記基板および電子部品の２次元画像を取得する工程と、この２次元画像より基板および電子部品を認識する工程とを含み、前記光学ヘッドに備えられた撮像方向切り換え手段により撮像方向を切り換えて、光学ヘッドの進出時には基板の上面もしくは電子部品の下面のうちいずれか一方側を撮像し、光学ヘッドの退避時に他方側を撮像するようにした。
【００１３】
本発明によれば、光学ヘッドを進退手段によってスキャンさせて得られた複数の１次元画像に基づいて、基板およびまたは電子部品の２次元画像を取得することにより、光学ヘッドの静止時間を省いて撮像に要する時間を短縮することができる。
【００１４】
【発明の実施の形態】
次に本発明の実施の形態を図面を参照して説明する。図１は本発明の一実施の形態の電子部品の圧着装置の側面図、図２は同電子部品の圧着装置の部分斜視図、図３、図４、図５は同電子部品の圧着装置による基板および電子部品の認識動作の説明図である。
【００１５】
まず図１を参照して電子部品の圧着装置の構造を説明する。図１において、ＸＹテーブル１上には基板ホルダ２が設けられており、基板ホルダ２には基板３が載置されている。ＸＹテーブル１を駆動することにより、基板３は水平面内で移動する。ＸＹテーブル１の上方には、昇降テーブル８が配設されている。昇降テーブル８の昇降ブロック７には、圧着ヘッド６が装着されている。
【００１６】
昇降テーブル８を駆動することにより、圧着ヘッド６が昇降する。昇降テーブル８は、圧着ヘッド６を昇降させる昇降手段となっている。ＸＹテーブル１および基板ホルダ２は基板３を保持し、圧着ヘッド６に対して位置決めする基板保持部となっている。圧着ヘッド６は、下面にバンプ５ａが形成された電子部品５を保持している。
【００１７】
昇降テーブル８の下方には撮像部１０が配設されている。撮像部１０は、水平方向に延出して設けられた光学ヘッド１１を備えている。光学ヘッド１１は移動テーブル１３によって水平方向に移動し、撮像時には圧着ヘッド６の下方の撮像位置に進出する。そして圧着ヘッド６を下降させて電子部品５を圧着する際には、前記撮像位置から退避する。移動テーブル１３は光学ヘッド１１を進退させる進退手段となっている。光学ヘッド１１の進退時の位置はリニアスケール１４によって検出される。
【００１８】
光学ヘッド１１は、１次元のＣＣＤカメラ１７（１次元画像検出手段）を備えており、圧着ヘッド６に保持された電子部品５と基板３との間の空間に進出して撮像することにより、電子部品５の下面と基板３の上面とを撮像して１次元画像を検出する。検出された１次元画像は、画像認識部１２に伝達される。
【００１９】
画像認識部１２は、光学ヘッド１１をスキャンさせることにより得られた複数の１次元画像に基づいて２次元画像を取得する。すなわち、光学ヘッド１１を進出させる過程において、リニアスケールによって光学ヘッド１１の位置を検出しながら所定タイミングでＣＣＤカメラ１７による１次元画像を検出する撮像を反復して行うことにより、複数の１次元画像を所定間隔で配列した２次元画像を取得する。
【００２０】
次に図２を参照して光学ヘッド１１について説明する。光学ヘッド１１は矩形断面の筒状部材で構成されており、先端部の上面と下面にはそれぞれ開口部１１ａ，１１ｂが設けられている。開口部１１ａ，１１ｂはシャッター１５ａ，１５ｂによって開閉可能となっており、開口部１１ａ，１１ｂの内部には反射部１６が配設されている。
【００２１】
基板３と圧着ヘッド６に保持された電子部品５の間の空間に光学ヘッド１１を進出させることにより、電子部品５の下面を開口部１１ａを介して、また基板３の上面の電極３ａや認識マーク３ｂを開口部１１ｂを介して撮像する。図３（ａ）に示すように、開口部１１ａを電子部品５の下方に位置させ、開口部１１ａを開放するとともに開口部１１ｂをシャッター１５ｂによって閉じることにより、電子部品５の下面からの光を開口部１１ａを介して入光させ、この光を反射部１６のハーフミラーによって水平方向に反射させる。これにより、電子部品５の下面からの光はＣＣＤカメラ１７によって受光され、電子部品５の１次元画像が検出される。
【００２２】
また下面の開口部１１ｂを基板３上面の撮像位置、例えば認識マーク３ｂの上方に位置させ、開口部１１ｂを開放するとともに開口部１１ａをシャッター１５ａによって閉じることにより、基板３からの光を開口部１１ｂを介して入光させ、同様に基板３の上面の１次元画像を取得する。したがって開口部１１ａ，１１ｂ、シャッター１５ａ，１５ｂは、電子部品５の下面と基板３の上面とを選択的に撮像するために撮像方向を切り換える撮像方向切換え手段となっている。
【００２３】
なお、撮像方向切換え手段としては、シャッター１５ａ，１５ｂを設ける替わりに、開口部１１ａ，１１ｂの周囲にそれぞれ単独でＯＮ−ＯＦＦ制御が可能な照明部を設けるようにしてもよい。撮像時には、撮像方向側の照明部のみをＯＮすることにより、当該撮像方向からのみ光が入射することとなり、シャッター開閉を行うことなく撮像方向の切り換えを行うことができる。
【００２４】
この電子部品の圧着装置は上記のように構成されており、以下電子部品の圧着作業において行われる電子部品および基板の認識動作について説明する。まず図１において、基板ホルダ２に基板３を保持させ、電子部品５を保持した圧着ヘッド６の下方に位置させる。次いで移動テーブル１３を駆動して、図３（ａ）に示すように光学ヘッド１１を電子部品５と基板３との間の空間に進出させる。
【００２５】
このとき、光学ヘッド１１の上面の開口部１１ａは開放状態となっているため、電子部品５の下面からの光は光学ヘッド１１内に入射し、反射部１６によって反射されてＣＣＤカメラ１７によって受光される。そして、光学ヘッド１１を移動テーブル１３によって進出させながら、ＣＣＤカメラ１７による撮像を所定タイミングで複数回行う。このように光学ヘッド１１をスキャンして得られた複数の１次元画像に基づき、画像認識部１２は電子部品５の下面の２次元画像を取得する。そして取得された２次元画像より、電子部品５の外形やバンプ５ａを認識する。
【００２６】
次いで図３（ｂ）に示すように、圧着ヘッド６の下方から光学ヘッド１１を退避させる。この退避動作時には、開口部１１ｂを介して基板３からの光を光学ヘッド１１内に入光させて基板３を撮像する。光学ヘッド１１を移動テーブル１３によって退避させながら、ＣＣＤカメラ１７による撮像を所定タイミングで複数回行う。このように光学ヘッド１１をスキャンして得られた複数の１次元画像に基づき、画像認識部１２は基板３の上面の２次元画像を取得する。そして取得された２次元画像より、基板３の電極３ａや認識マーク３ｂを認識する。
【００２７】
すなわち、上記撮像動作では、シャッター１５ａ，１５ｂの開閉により撮像方向を切り換えて、光学ヘッド１１の進出時には電子部品５または基板３のうちいずれか一方側を撮像し、退避時には他方側を撮像するものである。このように、１次元画像検出手段を備えた光学ヘッド１１をスキャンさせることにより得られた複数の１次元画像に基づいて２次元画像を取得することにより、撮像動作においてカメラを撮像対象に対して相対的に静止させる必要がなく、静止時間を省いて効率のよい基板・電子部品の認識を行うことができる。
【００２８】
そしてこのようにして得られた基板３および電子部品５の認識結果に基づき、電子部品５を基板３に対して相対的に位置決めし、圧着ヘッド６を下降させることにより、電子部品５を基板３に圧着する。
【００２９】
次に図４を参照して、上記光学ヘッド１１による他の撮像動作例について説明する。この撮像動作例は、電子部品５の認識マークとしてのバンプ５ａと基板３の認識マークとしての電極３の位置を予めずらして配置しておくことにより、光学ヘッド１１の同一方向への移動動作中において、基板３と電子部品５の双方を撮像するものである。
【００３０】
図４（ａ）に示すように、基板３の位置決め時には、圧着ヘッド６に保持された電子部品５のバンプ５ａに対して、電極３ａを所定のオフセット量ｄだけ水平方向にずらして位置決めする。そしてこの状態で光学ヘッド１１を電子部品５と基板３の間に進出させる。まず開口部１１ａが手前側のバンプ５ａの下方に到達したならば、シャッター１５ａを開放してバンプ５ａを撮像する。そしてバンプ５ａの撮像を終えたならば、図４（ｂ）に示すようにシャッター１５ａを閉じるとともにシャッター１５ｂを開放することにより、基板３の右側の電極３ａを撮像する。
【００３１】
以下、図４（ｃ）に示すようにシャッター１５ａを開放して左側のバンプ５ａを、次いで図４（ｄ）に示すようにシャッター１５ｂを開放して左側の電極３ａを順次撮像する。これにより、光学ヘッド１１の進出動作において、電子部品５と基板３の双方の複数の認識マークとしてのバンプ５ａ、電極３ａを撮像することができる。
【００３２】
この撮像動作において、本実施例に示すようにシャッター１５ａ，１５ｂを用いて光学ヘッド１１による撮像方向を切り換える替わりに、前述のように各シャッターに個別の照明部を設け、これらの照明部の点灯タイミングを制御することにより、撮像方向の切り換えを行うようにしてもよい。
【００３３】
また、図５に示すように単一の光学ヘッド１１に複数のＣＣＤカメラ１７Ａ，１７Ｂを備え、開口部１１ａ，１１ｂを介して入光した光を、各ＣＣＤカメラに対応して個別に設けられた反射部１６Ａ，１６Ｂで反射して、ＣＣＤカメラ１７Ａ，１７Ｂに受光させるようにしてもよい。このような構成を採用することにより、シャッター開閉動作などの撮像方向の切り換えを行うことなく、電子部品５の下面と基板３の上面とを同一の撮像動作で撮像することができる。
【００３４】
【発明の効果】
本発明によれば、光学ヘッドを進退手段によってスキャンさせて得られた複数の１次元画像に基づいて、基板およびまたは電子部品の２次元画像を取得するようにしたので、光学ヘッドの静止時間を省いて撮像に要する時間を短縮し、タクトタイムを短縮して生産性を向上させることができる。
【図面の簡単な説明】
【図１】本発明の一実施の形態の電子部品の圧着装置の側面図
【図２】本発明の一実施の形態の電子部品の圧着装置の部分斜視図
【図３】本発明の一実施の形態の電子部品の圧着装置による基板および電子部品の認識動作の説明図
【図４】本発明の一実施の形態の電子部品の圧着装置による基板および電子部品の認識動作の説明図
【図５】本発明の一実施の形態の電子部品の圧着装置による基板および電子部品の認識動作の説明図
【符号の説明】
１ ＸＹテーブル
３ 基板
５ 電子部品
６ 圧着ヘッド
１０ 撮像部
１１ 光学ヘッド
１２ 画像認識部
１３ 移動テーブル
１５ａ，１５ｂ シャッター
１６ 反射部
１７ ＣＣＤカメラ[0001]
BACKGROUND OF THE INVENTION
The present invention relates to an electronic component of pressure Chakuhoho crimping the electronic parts such as a flip chip to a substrate.
[0002]
[Prior art]
As electronic components are miniaturized and wiring patterns are narrowed, high accuracy is required for the positional accuracy when mounting electronic components on a substrate. A method of correcting a position error by image recognition is widely used. In this method, before mounting electronic components, the substrate or both the substrate and electronic components are imaged with a camera, and the positions of the substrates and electronic components are detected based on the obtained image data. Correction is performed.
[0003]
By the way, in the case where bumps are formed on the lower surface of a semiconductor element such as a flip chip and this bump is bonded to an electrode of a substrate, the position of the bumps needs to be obtained by image recognition when correcting the position at the time of mounting described above. For this reason, a camera is positioned between the pressure bonding head that holds the electronic component and the substrate to image both the substrate and the bump of the electronic component. In this case, when the crimping head is lowered and the electronic component is crimped to the substrate, it is necessary to retract the camera from below the crimping head, so an optical head with an optical system mounted on a movable arm is used. It is done.
[0004]
[Problems to be solved by the invention]
However, in the above conventional crimping apparatus, since the optical head needs to be stationary at the time of imaging by the camera, the optical head is used for imaging by the moving time when the optical head advances and retracts in one recognition operation. The time required for recognition including the stationary time when the head is stopped is required. For this reason, the time required for substrate / component recognition is long, and as a result, it is difficult to shorten the tact time of the entire crimping operation, which hinders improvement in productivity.
[0005]
Accordingly, the present invention aims at providing an electronic component of pressure Chakuhoho improve productivity by shortening the tact time.
[0010]
[Means for Solving the Problems]
The electronic component crimping method according to claim 1 is a method for crimping an electronic component in which the electronic component is crimped to the substrate by moving the crimping head holding the electronic component up and down and pressing the electronic component against the substrate. A step of advancing and retreating an optical head having a one-dimensional image detection means for detection, which is capable of imaging both vertically and vertically, into a space between the pressure-bonding head holding the electronic component and the substrate; A step of acquiring a two-dimensional image of the substrate and the electronic component based on a plurality of one-dimensional images obtained in this manner, and a step of recognizing the substrate and the electronic component from the two-dimensional image. The imaging direction is switched by the imaging direction switching means provided, and when the optical head advances, either the upper surface of the substrate or the lower surface of the electronic component is imaged. And so as to image the other side when retraction of the optical head.
[0013]
According to the present invention, by obtaining a two-dimensional image of a substrate and / or an electronic component based on a plurality of one-dimensional images obtained by scanning the optical head by advancing / retreating means, the stationary time of the optical head can be saved. The time required for imaging can be shortened.
[0014]
DETAILED DESCRIPTION OF THE INVENTION
Next, embodiments of the present invention will be described with reference to the drawings. FIG. 1 is a side view of an electronic component crimping apparatus according to an embodiment of the present invention, FIG. 2 is a partial perspective view of the electronic component crimping apparatus, and FIGS. 3, 4, and 5 are based on the electronic component crimping apparatus. It is explanatory drawing of the recognition operation | movement of a board | substrate and an electronic component.
[0015]
First, the structure of the electronic component crimping apparatus will be described with reference to FIG. In FIG. 1, a substrate holder 2 is provided on an XY table 1, and a substrate 3 is placed on the substrate holder 2. By driving the XY table 1, the substrate 3 moves in a horizontal plane. Above the XY table 1, an elevating table 8 is disposed. A crimping head 6 is mounted on the lifting block 7 of the lifting table 8.
[0016]
By driving the lifting table 8, the crimping head 6 moves up and down. The lifting table 8 is a lifting means for lifting the crimping head 6. The XY table 1 and the substrate holder 2 serve as a substrate holding unit that holds the substrate 3 and positions the substrate 3 with respect to the crimping head 6. The pressure bonding head 6 holds the electronic component 5 having the bump 5a formed on the lower surface.
[0017]
An imaging unit 10 is disposed below the lifting table 8. The imaging unit 10 includes an optical head 11 that extends in the horizontal direction. The optical head 11 is moved in the horizontal direction by the moving table 13 and advances to an imaging position below the crimping head 6 at the time of imaging. Then, when the electronic component 5 is crimped by lowering the crimping head 6, the crimping head 6 is retracted from the imaging position. The moving table 13 is an advance / retreat means for moving the optical head 11 back and forth. The position of the optical head 11 when it advances and retreats is detected by the linear scale 14.
[0018]
The optical head 11 includes a one-dimensional CCD camera 17 (one-dimensional image detection means), and advances into the space between the electronic component 5 held by the pressure-bonding head 6 and the substrate 3 to take an image. A one-dimensional image is detected by imaging the lower surface of the electronic component 5 and the upper surface of the substrate 3. The detected one-dimensional image is transmitted to the image recognition unit 12.
[0019]
The image recognition unit 12 acquires a two-dimensional image based on a plurality of one-dimensional images obtained by scanning the optical head 11. That is, in the process of advancing the optical head 11, a plurality of one-dimensional images are obtained by repeatedly performing imaging for detecting a one-dimensional image by the CCD camera 17 at a predetermined timing while detecting the position of the optical head 11 using a linear scale. Are acquired at predetermined intervals.
[0020]
Next, the optical head 11 will be described with reference to FIG. The optical head 11 is composed of a cylindrical member having a rectangular cross section, and openings 11a and 11b are provided on the upper surface and the lower surface of the tip portion, respectively. The openings 11a and 11b can be opened and closed by shutters 15a and 15b, and a reflecting portion 16 is disposed inside the openings 11a and 11b.
[0021]
By moving the optical head 11 into the space between the substrate 3 and the electronic component 5 held by the pressure-bonding head 6, the lower surface of the electronic component 5 passes through the opening 11a and the electrode 3a on the upper surface of the substrate 3 is recognized. The mark 3b is imaged through the opening 11b. As shown in FIG. 3A, the opening 11a is positioned below the electronic component 5, the opening 11a is opened, and the opening 11b is closed by the shutter 15b, so that light from the lower surface of the electronic component 5 can be received. The light enters through the opening 11 a and is reflected in the horizontal direction by the half mirror of the reflecting portion 16. Thereby, the light from the lower surface of the electronic component 5 is received by the CCD camera 17 and a one-dimensional image of the electronic component 5 is detected.
[0022]
Further, the opening 11b on the lower surface is positioned above the imaging position on the upper surface of the substrate 3, for example, above the recognition mark 3b, and the opening 11b is opened and the opening 11a is closed by the shutter 15a. The light is incident through 11b, and a one-dimensional image of the upper surface of the substrate 3 is acquired in the same manner. Therefore, the openings 11a and 11b and the shutters 15a and 15b serve as imaging direction switching means for switching the imaging direction in order to selectively image the lower surface of the electronic component 5 and the upper surface of the substrate 3.
[0023]
Note that as the imaging direction switching means, instead of providing the shutters 15a and 15b, illumination units capable of ON-OFF control independently may be provided around the openings 11a and 11b. At the time of imaging, by turning on only the illumination unit on the imaging direction side, light enters only from the imaging direction, and the imaging direction can be switched without opening and closing the shutter.
[0024]
The electronic component crimping apparatus is configured as described above, and the electronic component and substrate recognition operation performed in the electronic component crimping operation will be described below. First, in FIG. 1, the substrate 3 is held by the substrate holder 2, and is positioned below the crimping head 6 that holds the electronic component 5. Next, the moving table 13 is driven to advance the optical head 11 into the space between the electronic component 5 and the substrate 3 as shown in FIG.
[0025]
At this time, since the opening 11 a on the upper surface of the optical head 11 is in an open state, light from the lower surface of the electronic component 5 enters the optical head 11, is reflected by the reflecting unit 16, and is received by the CCD camera 17. Is done. Then, while the optical head 11 is advanced by the moving table 13, imaging by the CCD camera 17 is performed a plurality of times at a predetermined timing. Based on the plurality of one-dimensional images obtained by scanning the optical head 11 in this manner, the image recognition unit 12 acquires a two-dimensional image of the lower surface of the electronic component 5. And the external shape and bump 5a of the electronic component 5 are recognized from the acquired two-dimensional image.
[0026]
Next, as shown in FIG. 3B, the optical head 11 is retracted from below the pressure-bonding head 6. During this retracting operation, light from the substrate 3 enters the optical head 11 through the opening 11b and the substrate 3 is imaged. While the optical head 11 is retracted by the moving table 13, imaging by the CCD camera 17 is performed a plurality of times at a predetermined timing. The image recognition unit 12 acquires a two-dimensional image of the upper surface of the substrate 3 based on the plurality of one-dimensional images obtained by scanning the optical head 11 in this way. And the electrode 3a and the recognition mark 3b of the board | substrate 3 are recognized from the acquired two-dimensional image.
[0027]
That is, in the above imaging operation, the imaging direction is switched by opening and closing the shutters 15a and 15b, and when one of the electronic component 5 and the substrate 3 is imaged when the optical head 11 advances, the other side is imaged when retracted. It is. As described above, by acquiring a two-dimensional image based on a plurality of one-dimensional images obtained by scanning the optical head 11 provided with the one-dimensional image detection means, the camera is imaged with respect to the imaging target in the imaging operation. There is no need to make it relatively stationary, and it is possible to perform efficient substrate / electronic component recognition by omitting the stationary time.
[0028]
And based on the recognition result of the board | substrate 3 and the electronic component 5 which were obtained in this way, the electronic component 5 is positioned relatively with respect to the board | substrate 3, and the crimping | compression-bonding head 6 is lowered | hung, so that the electronic component 5 is board | substrate 3 Crimp to.
[0029]
Next, with reference to FIG. 4, another example of the imaging operation by the optical head 11 will be described. In this example of the imaging operation, the positions of the bumps 5a as the recognition marks of the electronic component 5 and the electrodes 3 as the recognition marks of the substrate 3 are shifted in advance, so that the optical head 11 is moving in the same direction. In FIG. 2, both the substrate 3 and the electronic component 5 are imaged.
[0030]
As shown in FIG. 4A, when the substrate 3 is positioned, the electrodes 3a are shifted in the horizontal direction by a predetermined offset amount d with respect to the bumps 5a of the electronic component 5 held by the crimping head 6. In this state, the optical head 11 is advanced between the electronic component 5 and the substrate 3. First, when the opening 11a reaches the lower side of the front bump 5a, the shutter 15a is opened to image the bump 5a. When the imaging of the bump 5a is finished, the electrode 3a on the right side of the substrate 3 is imaged by closing the shutter 15a and opening the shutter 15b as shown in FIG. 4B.
[0031]
Thereafter, as shown in FIG. 4C, the shutter 15a is opened and the left bump 5a is taken, and then as shown in FIG. 4D, the shutter 15b is opened and the left electrode 3a is taken sequentially. Thereby, in the advance operation of the optical head 11, it is possible to image the bumps 5a and the electrodes 3a as a plurality of recognition marks on both the electronic component 5 and the substrate 3.
[0032]
In this imaging operation, instead of switching the imaging direction by the optical head 11 using the shutters 15a and 15b as shown in the present embodiment, as described above, an individual illumination unit is provided for each shutter, and lighting of these illumination units is performed. The imaging direction may be switched by controlling the timing.
[0033]
Further, as shown in FIG. 5, a single optical head 11 is provided with a plurality of CCD cameras 17A and 17B, and light incident through the openings 11a and 11b is individually provided corresponding to each CCD camera. Alternatively, the light may be reflected by the reflecting portions 16A and 16B and received by the CCD cameras 17A and 17B. By adopting such a configuration, the lower surface of the electronic component 5 and the upper surface of the substrate 3 can be imaged by the same imaging operation without switching the imaging direction such as a shutter opening / closing operation.
[0034]
【The invention's effect】
According to the present invention, since the two-dimensional image of the substrate and / or the electronic component is acquired based on the plurality of one-dimensional images obtained by scanning the optical head by the advancing / retreating means, the rest time of the optical head is reduced. The time required for imaging can be reduced by omitting, and the tact time can be shortened to improve the productivity.
[Brief description of the drawings]
FIG. 1 is a side view of an electronic component crimping apparatus according to an embodiment of the present invention. FIG. 2 is a partial perspective view of an electronic component crimping apparatus according to an embodiment of the present invention. FIG. 4 is an explanatory diagram of a recognition operation of a board and an electronic component by the electronic component crimping apparatus according to the embodiment of the present invention. FIG. 10 is an explanatory diagram of a recognition operation of a substrate and an electronic component by an electronic component crimping apparatus according to an embodiment of the present invention.
DESCRIPTION OF SYMBOLS 1 XY table 3 Board | substrate 5 Electronic component 6 Crimp head 10 Imaging part 11 Optical head 12 Image recognition part 13 Moving table 15a, 15b Shutter 16 Reflection part 17 CCD camera

Claims (1)

電子部品を保持した圧着ヘッドを昇降させて基板に押圧することにより前記電子部品を基板に圧着する電子部品の圧着方法であって、１次元画像を検出する１次元画像検出手段を備え上下両方向の撮像が可能な光学ヘッドを電子部品を保持した圧着ヘッドと基板の間の空間に進退手段によって進出させる工程と、この光学ヘッドを前記進退手段によってスキャンさせて得られた複数の１次元画像に基づいて前記基板および電子部品の２次元画像を取得する工程と、この２次元画像より基板および電子部品を認識する工程とを含み、前記光学ヘッドに備えられた撮像方向切り換え手段により撮像方向を切り換えて、光学ヘッドの進出時には基板の上面もしくは電子部品の下面のうちいずれか一方側を撮像し、光学ヘッドの退避時に他方側を撮像することを特徴とする電子部品の圧着方法。 An electronic component crimping method for crimping the electronic component to a substrate by moving a crimping head holding the electronic component up and down and pressing the electronic component against the substrate, comprising one-dimensional image detection means for detecting a one-dimensional image in both the upper and lower directions. Based on a plurality of one-dimensional images obtained by advancing and retracting an optical head capable of imaging into a space between a pressure-bonding head holding an electronic component and a substrate by advancing and retracting means, and scanning the optical head by the advancing and retracting means A step of acquiring a two-dimensional image of the substrate and the electronic component, and a step of recognizing the substrate and the electronic component from the two-dimensional image, and switching an imaging direction by an imaging direction switching means provided in the optical head. When the optical head is advanced, either the upper surface of the substrate or the lower surface of the electronic component is imaged, and the other side is imaged when the optical head is retracted The method of crimping electronic components you characterized Rukoto.
JP35542999A 1999-12-15 1999-12-15 Crimping method for electronic parts Expired - Fee Related JP3783498B2 (en)

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JP4147963B2 (en) * 2003-02-10 2008-09-10 松下電器産業株式会社 Electronic component mounting apparatus and electronic component mounting method
US7025244B2 (en) 2003-02-10 2006-04-11 Matsushita Electric Industrial Co., Ltd. Electronic component mounting apparatus and electronic component mounting method
JP6093214B2 (en) * 2013-03-19 2017-03-08 ヤマハ発動機株式会社 Component mounting equipment
KR102004764B1 (en) * 2013-06-20 2019-07-29 삼성전기주식회사 Component embeding method and embedded substrate manufacturing method
KR101624220B1 (en) 2014-10-21 2016-05-26 주식회사 테크아이 Roll vision Press
CN112236034A (en) * 2020-09-25 2021-01-15 广上科技(广州)有限公司 Two-dimensional code is board scanning tool even and test system thereof

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