JP3745835B2 - Package structure of electronic components - Google Patents

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JP3745835B2
JP3745835B2 JP15297296A JP15297296A JP3745835B2 JP 3745835 B2 JP3745835 B2 JP 3745835B2 JP 15297296 A JP15297296 A JP 15297296A JP 15297296 A JP15297296 A JP 15297296A JP 3745835 B2 JP3745835 B2 JP 3745835B2
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JPH09321445A (en
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仁 高梨
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Miyazaki Epson Corp
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Description

【０００１】
【発明の属する技術分野】
本発明は電子部品を搭載したプリント基板をケースにより封止した構造のパッケージの改良に関し、特に構造の複雑化、ケース高の大型化、組み付け作業の繁雑化を招くことのない電子部品のパッケージ構造に関する。
【０００２】
【従来の技術】
水晶振動子等の圧電デバイスを用いた発振回路等の様に温度補償、電磁シールド等を必要とする電子回路にあっては、電子回路を備えたプリント基板をシールドケース内に封止し、これをユニット化して、電子機器、通信機器等の装置本体に組み込むことが行われている。
図６(a) 及び(b) は従来の電子部品のパッケージの一例の外観斜視図及び底部斜視図であり、このパッケージ１は、上面に配線パターン及び電子部品２を備えたプリント基板３の上面を金属ケース４により封止したものであり、このパッケージ１は、プリント基板３の対向し合う２つの端縁の中央部に夫々切欠き３ａを設けると共に、該切欠き３ａと対応するケース端縁の下縁部から該切欠き３ａ内に嵌合する突片４ａを突出させて、該突片４ａを切欠き３ａに嵌合させた状態でケース４をプリント基板３に組み付けている。プリント基板３に対するケース４の固定は、(b) に示す様にパッケージを裏返した状態で突片４ａの裏側とプリント基板の裏面との間をハンダ５によって行っていた。
しかし、この従来例にあっては、プリント基板の裏面にケースの一部が突出する為、パッケージの全高が大きくなって小型化の要請に反するという不具合があり、またパッケージをひっくり返した上でハンダ接続を行う必要がある為、作業性が悪化するという欠点がある。
【０００３】
なお、図６のパッケージはＬ字状のリード端子６がプリント基板３の下方に突出するタイプであるが、これ以外にもプリント基板の底面に沿ってパッド状のリード端子を平面状に配置したものもある。しかし、このタイプにおいては、ケースから上記突片４ａの如きものを突出させる訳にはゆかないので、ケース側壁と基板端縁等との間をハンダ或は接着剤により固定する必要が生じる。しかし、ハンダ代等を確保することが難しく、パッケージの大型化、組み付け作業の繁雑化等の不具合が生じている。
また、特開平８−３７４２１号公報には、水晶振動子や複数の回路素子が載置された多層構造基板の下方に、該多層構造基板を介して、該多層構造基板と同面積の定電位面としてのシールド層８を一層介設した構成の温度補償型水晶発振器が開示されており、上記のごとき構成を備えることによって基板実装時における周波数微調整のための手間を省略し、調整に起因する発振周波数、周波数温度特性、消費電流、出力電圧等の電気的特性の変動を防止するようにしている。しかし、この従来例は、基板構造が複雑である為、基板自体が高価となるばかりか、基板上の凹部内に部品を実装する工程の自動化が困難になるという欠点がある。
【０００４】
【発明が解決しようとする課題】
本発明は上記に鑑みてなされたものであり、電子部品を搭載したプリント基板をケースにより封止した構造のパッケージにおいて、構造の複雑化、ケース高の大型化、組み付け作業の繁雑化を招くことのない電子部品のパッケージ構造を提供することを目的としている。
【０００５】
【課題を解決するための手段】
上記目的を達成するため、請求項１の発明は、下面に表面実装用のパッドを有するプリント基板と、該プリント基板の上面に実装された電子部品と、該電子部品を包囲、収納する為にプリント基板の上部空間を封止する下方が開放し且つ４つの側壁を有した箱形の金属ケースと、を備えたパッケージにおいて、上記プリント基板上面の対向する２つの端縁適所に夫々形成した導体膜と、上記金属ケースの対向する２つの側壁下部であって上記各導体膜と対応する部分に夫々形成された左右２本の切り込みに挟まれた側壁部分の一箇所を内側方向へ傾斜角をもって屈曲退避させることにより形成した退避片と、上記金属ケースの対向する他の２つの側壁の下端縁の適所に夫々形成された凸部又は凹部と、該凸部又は凹部に対応する上記プリント基板の他の２つの端縁に夫々形成された凹部又は凸部と、を備え、上記各退避片を構成する前記側壁部分は、前記２つの側壁下部から下方へ突出しない長さを有し、前記各凸部と各凹部同士を嵌合させると共に、上記各退避片の下端縁を上記各導体膜面と当接させた状態でハンダにより電気的及び機械的に接続固定し、上記金属ケースの側壁及びプリント基板の端縁に夫々設けた各凸部又は凹部は、上記金属ケースの上記他の２つの側壁及び上記プリント基板の上記他の２つの端縁に夫々設けられ、各凸部又は凹部は非対称の位置関係にあることを特徴とする。
請求項２の発明は、請求項１において、上記金属ケースの一方の側壁又は上記プリント基板の一方の端縁の中央部に一つの凸部又は凹部を設けると共に、対向する他方の側壁、又は他方の端縁には２つの凸部又は凹部を該他方の側壁、又は他方の端縁の中央部を挟んで対称位置に配置したことを特徴とする。
請求項３の発明は、請求項１において、上記金属ケースの一方の側壁又は上記プリント基板の一方の端縁の中央部に一つの凸部又は凹部を設けると共に、対向する他方の側壁、又は他方の端縁の非中央位置に一つの凸部又は凹部を設けたことを特徴とする。
請求項４の発明は、請求項１において、上記金属ケースの一方の側壁又は上記プリント基板の一方の端縁の非中央部に一つの凸部又は凹部を設けると共に、対向する他方の側壁、又は他方の端縁の非中央位置であって上記一方の凸部又は凹部と対向する位置に一つの凸部又は凹部を設けたことを特徴とする。
請求項５の発明は、請求項１、２、３、又は４において、上記導体膜を上記プリント基板上の電子回路のアースに接続したことを特徴とする。
請求項６の発明は、請求項１乃至５の何れか一項において、上記導体膜は、非導電性材料から成る基材の表面を導電性金属によりメタライズしたものであることを特徴とする。
【０００６】
【発明の実施の形態】
以下、本発明を図面に示した形態例により詳細に説明する。図１（ａ）及び（ｂ）は本発明の一形態例の電子部品のパッケージの分解斜視図、及びプリント基板の裏面図であり、図２（ａ）（ｂ）及び（ｃ）は組み付け状態を示す斜視図、要部拡大図及びＡ−Ａ断面図である。このパッケージ１０は、電子部品１１を実装したプリント基板１２と、このプリント基板１２上の電子部品１１を包囲、収納する為にプリント基板１２の上部空間を封止する金属ケース１３（下方が開放し且つ４つの側壁を有した箱形）とを備えている。このパッケージ１０の特徴的な構成は、プリント基板１２の上面の端縁適所に導体膜１５を形成するとともに、金属ケース１３の側壁下部であって上記導体膜と対応する部分が内外方向へフリーとなるように該側壁下部に切り込みを形成することにより形成した退避片１６を備えた点にある。そして、退避片１６を金属ケース１３の内側に所定角度傾斜させて退避させた状態で、金属ケース１３をプリント基板上にかぶせた時に、該退避片１６の先端部が導体膜１５と接することにより、電気的及び機械的に接続固定した状態となる様にしている。この接触状態は弾性的な圧接でも良いし、非弾性的な単なる接触でも良い。
【０００７】
図１では、プリント基板１２と金属ケース１３の対向し合う短辺の中央部に夫々導体膜１５と退避片１６を設けたが、これは一例であり、これらを短辺或は長辺上のどのような位置に設けてもよい。
図示した退避片１６は、ケース側壁に２本の切り込みを形成することにより形成される部分を内側に屈曲させることにより形成しているが、これは一例に過ぎず、側壁の一部をプレス加工により内側へへこませることにより退避片を形成してもよい。
また、導体膜１５は、例えば、プリント基板１２の基材、即ち非導電性材料の表面を導電性金属によってメタライズすることにより形成する。使用する金属材料としては、例えば銀−パラジウム膜、ニッケル膜、金膜を順次重ねてメッキしたものを用いる。銀−パラジウム膜はセラミック基板になじみ易いため最下層の膜として用い、金膜はハンダとのなじみが良好である為に用い、ニッケル膜は銀−パラジウム膜と金膜とのなじみの悪さを解消する為に中間膜として用いる。
【０００８】
金属ケース１３をプリント基板１２に取付ける際の位置決め方法としてこの形態例では、金属ケース１３の側壁の下端縁の適所に凸部又は凹部２０を形成すると共に、このケース側の凸部又は凹部２０に対応する上記プリント基板の端縁に凹部又は凸部２１を設け、各凸部と各凹部同士を嵌合させるようにしている。一方の突部を他方の凹部に嵌合させることにより、位置決めが完了する。
位置決めの完了後に、金属ケースの側壁から内側に退避した退避片１６の外側面と導体膜１５の上面との間にハンダを流し込むことにより、退避片１６と導体膜１５とを電気的、機械的に固定する。
この接続作業に於ては、予め基板上の電子部品をクリームハンダを用いて基板上に仮止めしておき、この基板上にケースをかぶせて退避片１６と導体膜１５との間にクリームハンダを充填してからパッケージ全体を加熱することにより、電子部品とケースを一括して基板上にリフロー接続することが可能となる。
勿論、基板上に電子部品を固定した後で、ケースを基板上に接続固定してもよい。
【０００９】
また、この導体膜１５は必要に応じてプリント基板上の電子回路のアースに接続する。このように構成することにより、金属ケースがシールド効果を発揮することができる。
なお、ケース１３としては、金属材料以外にも、セラミックや耐熱性の樹脂を用いてもよい。金属材料以外のケースを用いる際に、シールド効果を持たせたい場合には、ケース表面に金属のメタライズを施せば良い。特に、導体膜１５と接する退避片１６部分については、メタライズ等により導電性の表面を有するように加工しておく必要がある。
次に上記した位置決め用の凸部又は凹部の配置であるが、図１(a) (b) では、対向し合う側壁及び端縁の夫々中央部に凸部と凹部を設けて位置決めを行っているが、このように構成すると、ケースの前後方向とプリント基板の前後方向を誤って組み付ける事態が生じ易い。
このような誤装着の発生を防止する為には、対向し合う側壁に夫々形成された凸部又は凹部２０、或は対向し合う端縁に夫々形成された凹部又は凸部２１が非対称状態となる様に夫々の位置、個数等を異ならせることが有効である。
なお図１(b) のプリント基板裏面図において、符号２２はこのパッケージを他の基板上に表面実装する時に用いるパッドであり、２３はハンダ溜りである。
【００１０】
図３(a) (b) 及び(c) は夫々プリント基板に金属ケースを装着する際の誤装着防止の為の構成例を示す平面略図であり、まず(a) は対向し合う２辺Ｓ１、Ｓ２の内の一方の辺Ｓ１の中央部に凸部又は凹部２０、２１を一か所設けると共に、他方の辺Ｓ２には該辺Ｓ２の中心Ｃを中心として対称位置関係で２つの凸部又は凹部２０、２１を配置した。このように対向し合う２辺Ｓ１、Ｓ２上に非対称状態となる位置関係及び個数で凸部又は凹部２０、２１を配置したので、誤装着の防止が可能となる。
次に、図３(b) の例では、他方の辺Ｓ２の中心位置に一つの凸部又は凹部２０、２１を配置すると共に、一方の辺Ｓ１の非中心位置に凸部又は凹部２０、２１を配置することにより、両辺Ｓ１、Ｓ２上の凸部又は凹部２０、２１の位置関係を非対称にして誤装着の防止を図っている。なお、この例では、辺Ｓ２上の凸部又は凹部２０、２１の位置を、辺Ｓ２の非中心部であって、非対称となる位置に設けてもよい。
図３(c) の例では、両辺Ｓ１、Ｓ１上に夫々一つづつ設けた凸部又は凹部２０、２１を対向し合う位置関係で配置することにより誤装着の防止を図っている。
【００１１】
次に、図４は他の形態例のパッケージの分解斜視図、図５(a) (b) (c) 及び(d) はこの形態例のパッケージの全体構成を示す正面断面図、側面図、ケースの構成図、及びプリント基板の構成である。
この形態例の特徴は、プリント基板１２として多層基板を用い、この多層基板の対向し合う端縁の上面適所を所定の深さ溝状に切欠くことにより、基板の肉厚内に埋設され且つ基板面積とほぼ等しい面積を有するアース用の電極膜２５を一部露出させ、この露出したアース用の電極膜２５に、ケース１３から下方へ突出した退避片１６を電気的に接続固定させつつ、ケース１３を多層基板１２上にかぶせた点にある。
この形態例のケース１３に設けた退避片１６は、ケースの下底縁よりも所定長下方へ突出しており、この退避片１６の下方への突出長は、ケース１３を基板上に閉止した時に、退避片１６の先端部が溝２６の底面の電極膜２５に接する様に設定する。
このように構成することにより、各退避片１６が基板上の各溝２６内に入り込むような位置関係でケース１３を基板上にかぶせるだけでケースの位置決めが完了し、退避片１６と溝内の電極膜２５との接合部をハンダにて固定することにより、固定が完了する。この形態例では、退避片１６と溝２６が位置決め手段を兼ねることができるので、上記形態例に様に位置決め用の凸部又は凹部２０、２１を格別に設ける必要がなくなる。
なお、基板に対するケースの取付け方向を誤ることがないように、一方又は双方の溝２６及び退避片１６を図示の中心位置から所定距離ずらせておいてもよいし、各退避片１６の幅を異ならせてもよいし、また両方の溝及び退避片の位置を非対称となる様に配置することが好ましい。
また、上記例では、溝及び退避片を一つの辺に一つづつ設けたが、必要に応じて複数づつ設けてもよい。
【００１２】
【発明の効果】
以上のように本発明によれば、ケースの下縁部の一部が基板の下面を越えて下方へ突出することがないので、パッケージの高さを低く抑えることができる。ハンダ接続時に基板をひっくり返すことなく、基板上にケースを単純に載置してからそのままハンダ接続すれば良いので自動実装化し易い。基板上の電子部品と共に、基板に対してケースをリフローによりハンダ接続することができるので、接続作業を一工程で実現可能となる。また、位置決め用の凹部、凸部を設けることにより、ケースの位置合わせが容易となる。位置決め用の凹部、凸部を、非対称の位置関係、及び個数で配置することにより、基板に対するケースの向きを誤って装着することを防止できる。更に、多層基板に適用する場合には、位置決め用の凹部、凸部を省略して、構成及び作業性を簡略化することができる。
【図面の簡単な説明】
【図１】 (a) 及び(b) は本発明の一形態例の電子部品のパッケージの分解斜視図、及びプリント基板の底部構成図。
【図２】 (a) (b) 及び(c) は図１のパッケージの組み付け状態を示す斜視図、要部拡大図及びＡ−Ａ断面図。
【図３】 (a) (b) 及び(c) は夫々誤装着防止の為の構成例を示す平面略図。
【図４】本発明の他の形態例のパッケージの分解斜視図。
【図５】 (a) (b) (c) 及び(d) は図４の形態例のパッケージの全体構成を示す正面断面図、側面図、ケースの構成図、及びプリント基板の構成図。
【図６】 (a) 及び(b) は従来のパッケージの構成を示す斜視図、及び底部斜視図。
【符号の説明】
１０ パッケージ、１１ 電子部品、１２ プリント基板、１３ 金属ケース、１５ 導体膜、１６ 退避片、２０ 凸部又は凹部、２１ 凹部又は凸部、２５電極膜、２６ 溝。[0001]
BACKGROUND OF THE INVENTION
The present invention relates to an improvement of a package having a structure in which a printed circuit board on which an electronic component is mounted is sealed with a case, and in particular, a package structure of an electronic component that does not cause complicated structure, large case height, and complicated assembly work. About.
[0002]
[Prior art]
For an electronic circuit that requires temperature compensation, electromagnetic shielding, etc., such as an oscillation circuit using a piezoelectric device such as a crystal resonator, the printed circuit board with the electronic circuit is sealed in a shield case. Are unitized and incorporated into apparatus main bodies such as electronic devices and communication devices.
FIGS. 6A and 6B are an external perspective view and a bottom perspective view of an example of a conventional electronic component package. The package 1 has an upper surface of a printed circuit board 3 having a wiring pattern and an electronic component 2 on the upper surface. The package 1 is provided with a notch 3a at the center of two opposing edges of the printed circuit board 3, and a case edge corresponding to the notch 3a. The case 4 is assembled to the printed circuit board 3 in a state in which the protruding piece 4a that fits into the notch 3a is projected from the lower edge portion, and the protruding piece 4a is fitted into the notch 3a. The case 4 is fixed to the printed board 3 with solder 5 between the back side of the protruding piece 4a and the back side of the printed board in a state where the package is turned over as shown in FIG.
However, in this conventional example, since a part of the case protrudes on the back side of the printed circuit board, there is a problem that the total height of the package becomes large and violates the demand for miniaturization, and the package is turned over. Since it is necessary to perform solder connection, there is a drawback that workability is deteriorated.
[0003]
6 is a type in which the L-shaped lead terminal 6 protrudes below the printed circuit board 3, but in addition to this, pad-shaped lead terminals are arranged in a plane along the bottom surface of the printed circuit board. There are also things. However, in this type, the protrusion 4a cannot be protruded from the case, so it is necessary to fix the case side wall and the substrate edge with solder or an adhesive. However, it is difficult to secure a soldering cost and the like, resulting in problems such as an increase in the size of the package and a complicated assembly work.
JP-A-8-37421 discloses a constant potential having the same area as that of the multilayer structure substrate via the multilayer structure substrate below the multilayer structure substrate on which the crystal resonator and the plurality of circuit elements are placed. A temperature-compensated crystal oscillator having a configuration in which a shield layer 8 as a surface is interposed is disclosed, and by providing the configuration as described above, the labor for fine frequency adjustment at the time of mounting on a substrate is omitted, resulting from the adjustment. Thus, fluctuations in electrical characteristics such as oscillation frequency, frequency temperature characteristics, current consumption, and output voltage are prevented. However, this conventional example has a drawback that since the board structure is complicated, the board itself is expensive and it is difficult to automate the process of mounting the components in the recesses on the board.
[0004]
[Problems to be solved by the invention]
The present invention has been made in view of the above, and in a package having a structure in which a printed circuit board on which electronic components are mounted is sealed by a case, the structure is complicated, the case is enlarged, and the assembly work is complicated. It is an object of the present invention to provide a package structure for electronic components that does not have any problem.
[0005]
[Means for Solving the Problems]
In order to achieve the above object, the invention of claim 1 is directed to a printed circuit board having a surface mounting pad on the lower surface, an electronic component mounted on the upper surface of the printed circuit board , and surrounding and storing the electronic component. And a box-shaped metal case having four open side walls that seals the upper space of the printed circuit board, and a conductor formed at each of two opposing edge positions on the upper surface of the printed circuit board. with a film, the tilt angle of one position to the inward direction of the two opposing husband a lower side wall portions corresponding to portions of the respective conductive film s formed two right and left sandwiched sidewall portion cut in the metal casing a retraction piece formed by bending retracted, and respectively formed protrusions or recesses in place of the lower edge of the other two opposite side walls of the metal case, the print corresponding to the convex portion or concave portion With the other two edges respectively formed concave or convex portion of the plate, wherein the side wall portion constituting the respective retraction piece has a length which does not protrude from said two side walls lower down, The convex portions and the concave portions are fitted to each other, and the lower end edge of each retracting piece is electrically and mechanically connected and fixed with solder in a state of being in contact with each conductive film surface. The convex portions or concave portions provided on the side walls and the edge of the printed circuit board are respectively provided on the other two side walls of the metal case and the other two edge portions of the printed circuit board. Is characterized by an asymmetric positional relationship .
A second aspect of the present invention provides the first side wall of the metal case or the central portion of one end edge of the printed circuit board according to the first aspect, with one convex portion or a concave portion and the other side wall facing the other side or the other side. It is characterized in that two convex portions or concave portions are arranged at symmetrical positions across the other side wall or the central portion of the other end edge at the end edge.
A third aspect of the present invention provides the first side wall of the metal case or the central portion of one end edge of the printed circuit board according to the first aspect. One convex portion or a concave portion is provided at a non-central position of the end edge of this.
According to a fourth aspect of the present invention, in the first aspect, the one side wall of the metal case or the one edge of the printed circuit board is provided with one convex portion or a concave portion, and the other side wall facing each other, or One convex portion or a concave portion is provided at a position that is a non-center position of the other end edge and is opposed to the one convex portion or the concave portion.
According to a fifth aspect of the present invention, in the first, second, third, or fourth aspect, the conductor film is connected to a ground of an electronic circuit on the printed circuit board.
According to a sixth aspect of the present invention, in any one of the first to fifth aspects, the conductive film is obtained by metallizing a surface of a base material made of a nonconductive material with a conductive metal.
[0006]
DETAILED DESCRIPTION OF THE INVENTION
Hereinafter, the present invention will be described in detail with reference to embodiments shown in the drawings. Figure 1 (a) and (b) an embodiment exploded perspective view of the electronic component package of the present invention, and is a rear view of the printed circuit board, FIG. 2 (a) (b) and (c) assembled state FIG. 3 is a perspective view, an enlarged view of a main part, and an AA cross-sectional view. The package 10 includes a printed circuit board 12 on which an electronic component 11 is mounted, and a metal case 13 (the lower part is opened) that encloses the electronic component 11 on the printed circuit board 12 and seals the upper space of the printed circuit board 12. And a box having four side walls ). The characteristic configuration of the package 10 is that a conductor film 15 is formed at an appropriate position on the edge of the upper surface of the printed circuit board 12, and a portion corresponding to the conductor film at the lower portion of the side wall of the metal case 13 is free inward and outward. Thus, the retracting piece 16 formed by forming a cut in the lower portion of the side wall is provided. Then, when the metal case 13 is placed on the printed circuit board with the retracting piece 16 inclined to the inside of the metal case 13 by a predetermined angle, the tip of the retracting piece 16 comes into contact with the conductor film 15. The electrical and mechanical connection is fixed. This contact state may be an elastic pressure contact or an inelastic simple contact.
[0007]
In FIG. 1, the conductive film 15 and the retracting piece 16 are provided in the center part of the short side where the printed circuit board 12 and the metal case 13 face each other, but this is an example, and these are on the short side or the long side. It may be provided at any position.
The illustrated retraction piece 16 is formed by bending inward a portion formed by forming two cuts in the case side wall, but this is only an example, and a part of the side wall is pressed. The retracting piece may be formed by indenting inward.
The conductor film 15 is formed, for example, by metallizing the base material of the printed circuit board 12, that is, the surface of a nonconductive material, with a conductive metal. As the metal material to be used, for example, a silver-palladium film, a nickel film, and a gold film which are sequentially stacked and plated are used. The silver-palladium film is used as the lowermost film because it is easy to be familiar with the ceramic substrate, the gold film is used because it is well compatible with the solder, and the nickel film eliminates the incompatibility between the silver-palladium film and the gold film. Therefore, it is used as an intermediate film.
[0008]
In this embodiment, as a positioning method for attaching the metal case 13 to the printed circuit board 12, a convex portion or a concave portion 20 is formed at an appropriate position on the lower edge of the side wall of the metal case 13, and the convex portion or concave portion 20 on the case side is formed. Concave portions or convex portions 21 are provided on the corresponding edge of the printed circuit board, and the respective convex portions and the respective concave portions are fitted to each other. Positioning is completed by fitting one protrusion into the other recess.
After the positioning is completed, solder is poured between the outer surface of the retracting piece 16 retracted inward from the side wall of the metal case and the upper surface of the conductive film 15, thereby electrically and mechanically connecting the retracting piece 16 and the conductive film 15. Secure to.
In this connection operation, the electronic components on the substrate are temporarily fixed on the substrate using cream solder in advance, and the case is covered with cream solder between the retraction piece 16 and the conductor film 15. By heating the entire package after filling, the electronic components and the case can be reflow-connected on the substrate in a lump.
Of course, the case may be connected and fixed on the substrate after the electronic component is fixed on the substrate.
[0009]
The conductor film 15 is connected to the ground of the electronic circuit on the printed circuit board as necessary. By comprising in this way, a metal case can exhibit a shielding effect.
In addition to the metal material, the case 13 may be made of ceramic or heat resistant resin. When a case other than a metal material is used, if it is desired to have a shielding effect, the case surface may be metallized. In particular, the retracting piece 16 portion in contact with the conductor film 15 needs to be processed to have a conductive surface by metallization or the like.
Next, the positioning protrusions or recesses are arranged as described above. In FIGS. 1 (a) and 1 (b), positioning is performed by providing a protrusion and a recess at the center of each of the opposing side walls and edges. However, when configured in this way, a situation in which the front-rear direction of the case and the front-rear direction of the printed board are assembled by mistake is likely to occur.
In order to prevent the occurrence of such erroneous mounting, the convex portions or concave portions 20 formed on the opposing side walls or the concave portions or convex portions 21 respectively formed on the opposing edges are in an asymmetric state. It is effective to vary the position, number, etc. of each.
1B, reference numeral 22 denotes a pad used when the package is surface-mounted on another substrate, and 23 denotes a solder pool.
[0010]
FIGS. 3A, 3B, and 3C are schematic plan views showing examples of configurations for preventing erroneous mounting when a metal case is mounted on a printed circuit board, respectively. First, FIG. 3A shows two sides S1 facing each other. , S2 is provided with one convex portion or concave portion 20, 21 at the center of one side S1, and the other side S2 has two convex portions symmetrically about the center C of the side S2. Or the recessed parts 20 and 21 were arrange | positioned. Since the convex portions or the concave portions 20 and 21 are arranged on the two sides S <b> 1 and S <b> 2 that face each other in the asymmetrical positional relationship and number, the erroneous mounting can be prevented.
Next, in the example of FIG. 3B, one convex portion or concave portion 20, 21 is arranged at the center position of the other side S2, and the convex portion or concave portion 20, 21 is arranged at a non-center position of one side S1. By arranging the, the positional relationship between the convex portions or the concave portions 20 and 21 on both sides S1 and S2 is made asymmetric to prevent erroneous mounting. In this example, the positions of the convex portions or the concave portions 20 and 21 on the side S2 may be provided at a non-center portion of the side S2 and asymmetric.
In the example of FIG. 3 (c), erroneous mounting is prevented by arranging convex portions or concave portions 20, 21 provided on the sides S1, S1 one by one in a facing positional relationship.
[0011]
Next, FIG. 4 is an exploded perspective view of a package according to another embodiment, and FIGS. 5A, 5B, 5C, and 5D are a front sectional view, a side view, and an entire configuration of the package according to this embodiment. It is the block diagram of a case, and the structure of a printed circuit board.
The feature of this embodiment is that a multilayer substrate is used as the printed circuit board 12, and the upper surface of the opposing edges of the multilayer substrate is cut into a groove with a predetermined depth so as to be embedded in the thickness of the substrate and A part of the ground electrode film 25 having an area substantially equal to the substrate area is exposed, and a retraction piece 16 protruding downward from the case 13 is electrically connected and fixed to the exposed ground electrode film 25. The case 13 is located on the multilayer substrate 12.
The retraction piece 16 provided in the case 13 of this embodiment protrudes downward by a predetermined length from the bottom bottom edge of the case, and the protrusion length of the retraction piece 16 is lower when the case 13 is closed on the substrate. The tip of the retracting piece 16 is set so as to be in contact with the electrode film 25 on the bottom surface of the groove 26.
With this configuration, the case positioning is completed simply by covering the case 13 on the substrate in such a positional relationship that each retraction piece 16 enters each groove 26 on the substrate. Fixing is completed by fixing the joint with the electrode film 25 with solder. In this embodiment, the retracting piece 16 and the groove 26 can also serve as positioning means, so that there is no need to provide positioning protrusions or recesses 20, 21 as in the above embodiment.
It should be noted that one or both of the grooves 26 and the retracting pieces 16 may be shifted from the center position in the drawing by a predetermined distance so that the case mounting direction with respect to the substrate is not mistaken, or the widths of the respective retracting pieces 16 are different. In addition, it is preferable that the positions of both grooves and the retracting pieces are asymmetric.
Moreover, in the said example, although the groove | channel and the evacuation piece were provided one by one, you may provide two or more as needed.
[0012]
【The invention's effect】
As described above, according to the present invention, a part of the lower edge portion of the case does not protrude downward beyond the lower surface of the substrate, so that the height of the package can be kept low. Automatic mounting is easy because the case is simply placed on the board and then soldered as it is without turning the board over when soldering. Since the case can be soldered to the board together with the electronic components on the board by reflow, the connecting operation can be realized in one step. Further, the positioning of the case is facilitated by providing the positioning concave and convex portions. Recess for positioning the convex portion, the positional relationship of the non-symmetrical, and by arranging in number, it is possible to prevent the mounting incorrectly orientation of the case relative to the substrate. Furthermore, when applied to a multilayer substrate, the positioning concave portions and convex portions can be omitted, and the configuration and workability can be simplified.
[Brief description of the drawings]
FIGS. 1A and 1B are an exploded perspective view of an electronic component package according to an embodiment of the present invention and a bottom configuration diagram of a printed circuit board.
FIGS. 2A, 2B, and 2C are a perspective view, an enlarged view of a main part, and an AA cross-sectional view showing an assembled state of the package of FIG. 1;
FIGS. 3A, 3B, and 3C are schematic plan views showing configuration examples for preventing erroneous mounting, respectively.
FIG. 4 is an exploded perspective view of a package according to another embodiment of the present invention.
FIGS. 5A, 5B, 5C, and 5D are a front sectional view, a side view, a case configuration diagram, and a printed circuit board configuration diagram showing the overall configuration of the package of the embodiment of FIG.
6A and 6B are a perspective view and a bottom perspective view showing a configuration of a conventional package, respectively.
[Explanation of symbols]
10 package, 11 electronic component, 12 printed circuit board, 13 metal case, 15 conductor film, 16 retracting piece, 20 convex portion or concave portion, 21 concave portion or convex portion, 25 electrode film, 26 groove.

Claims (6)

下面に表面実装用のパッドを有するプリント基板と、該プリント基板の上面に実装された電子部品と、該電子部品を包囲、収納する為にプリント基板の上部空間を封止する下方が開放し且つ４つの側壁を有した箱形の金属ケースと、を備えたパッケージにおいて、上記プリント基板上面の対向する２つの端縁適所に夫々形成した導体膜と、上記金属ケースの対向する２つの側壁下部であって上記各導体膜と対応する部分に夫々形成された左右２本の切り込みに挟まれた側壁部分の一箇所を内側方向へ傾斜角をもって屈曲退避させることにより形成した退避片と、上記金属ケースの対向する他の２つの側壁の下端縁の適所に夫々形成された凸部又は凹部と、該凸部又は凹部に対応する上記プリント基板の他の２つの端縁に夫々形成された凹部又は凸部と、を備え、
上記各退避片を構成する前記側壁部分は、前記２つの側壁下部から下方へ突出しない長さを有し、
前記各凸部と各凹部同士を嵌合させると共に、上記各退避片の下端縁を上記各導体膜面と当接させた状態でハンダにより電気的及び機械的に接続固定し、上記金属ケースの側壁及びプリント基板の端縁に夫々設けた各凸部又は凹部は、上記金属ケースの上記他の２つの側壁及び上記プリント基板の上記他の２つの端縁に夫々設けられ、各凸部又は凹部は非対称の位置関係にあることを特徴とする電子部品のパッケージ構造。 A printed circuit board having a surface mounting pad on the lower surface, an electronic component mounted on the upper surface of the printed circuit board , and a lower portion for sealing the upper space of the printed circuit board to surround and store the electronic component; In a package comprising a box-shaped metal case having four side walls, conductor films formed respectively at appropriate positions on two opposite edges of the upper surface of the printed circuit board, and lower portions of the two opposite side walls of the metal case. A retracting piece formed by bending and retracting one portion of the side wall portion sandwiched between the two left and right cuts formed respectively in the portion corresponding to each of the conductor films, and the metal case; and place respectively formed projections or recesses opposite the other two side walls of the lower edge of the recess also being formed respectively on the two other edges of the printed circuit board corresponding to the convex portion or concave portion Includes a convex portion,
The side wall portion constituting each retraction piece has a length that does not protrude downward from the lower portions of the two side walls,
The convex portions and the concave portions are fitted to each other, and the lower end edge of each retracting piece is electrically and mechanically connected and fixed with solder in a state of being in contact with each conductive film surface. The convex portions or concave portions provided on the side walls and the edge of the printed circuit board are respectively provided on the other two side walls of the metal case and the other two edge portions of the printed circuit board. Is a package structure of an electronic component, characterized by having an asymmetric positional relationship. 上記金属ケースの一方の側壁又は上記プリント基板の一方の端縁の中央部に一つの凸部又は凹部を設けると共に、対向する他方の側壁、又は他方の端縁には２つの凸部又は凹部を該他方の側壁、又は他方の端縁の中央部を挟んで対称位置に配置したことを特徴とする請求項１に記載の電子部品のパッケージ構造。One convex portion or concave portion is provided in the central portion of one side wall of the metal case or one end edge of the printed circuit board, and two convex portions or concave portions are provided on the other side wall or the other end edge facing each other. 2. The electronic component package structure according to claim 1 , wherein the other side wall or the central portion of the other end edge is disposed at a symmetrical position. 上記金属ケースの一方の側壁又は上記プリント基板の一方の端縁の中央部に一つの凸部又は凹部を設けると共に、対向する他方の側壁、又は他方の端縁の非中央位置に一つの凸部又は凹部を設けたことを特徴とする請求項１に記載の電子部品のパッケージ構造。One convex portion or concave portion is provided in the central portion of one side wall of the metal case or one end edge of the printed circuit board, and one convex portion is provided at a non-center position of the opposite side wall or the other edge. The package structure for an electronic component according to claim 1 , wherein a recess is provided. 上記金属ケースの一方の側壁又は上記プリント基板の一方の端縁の非中央部に一つの凸部又は凹部を設けると共に、対向する他方の側壁、又は他方の端縁の非中央位置であって上記一方の凸部又は凹部と対向する位置に一つの凸部又は凹部を設けたことを特徴とする請求項１に記載の電子部品のパッケージ構造。One convex portion or a concave portion is provided on one side wall of the metal case or one end edge of the printed circuit board, and the other side wall or the other end is opposed to a non-center position. The package structure for an electronic component according to claim 1 , wherein one convex portion or concave portion is provided at a position facing one convex portion or concave portion. 上記導体膜を上記プリント基板上の電子回路のアースに接続したことを特徴とする請求項１、請求項２、請求項３、又は請求項４のいずれかに記載の電子部品のパッケージ構造。Claim 1, characterized in that said conductive film is connected to the ground of the electronic circuit on the printed circuit board, according to claim 2, package structure of an electronic component according to claim 3, or claim 4. 上記導体膜は、非導電性材料から成る基材の表面を導電性金属によりメタライズしたものであることを特徴とする請求項１、請求項２、請求項３、請求項４、又は請求項５のいずれかに記載の電子部品のパッケージ構造。The conductive film, according to claim 1, characterized in that the surface of the substrate made of non-conductive material is obtained by metallization of a conductive metal, claim 2, claim 3, claim 4, or claim 5 A package structure of an electronic component according to any one of the above.
JP15297296A 1996-05-24 1996-05-24 Package structure of electronic components Expired - Lifetime JP3745835B2 (en)

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US7130198B2 (en) * 2001-12-06 2006-10-31 Rohm Co., Ltd. Resin-packaged protection circuit module for rechargeable batteries and method of making the same
JP4883882B2 (en) * 2003-09-25 2012-02-22 京セラ株式会社 Electronic equipment
JP2010136407A (en) * 2003-10-23 2010-06-17 Nippon Dempa Kogyo Co Ltd Method of manufacturing crystal oscillator
JP4976263B2 (en) * 2006-12-28 2012-07-18 日本電波工業株式会社 Crystal oscillator for surface mounting
JP5206550B2 (en) * 2009-03-31 2013-06-12 パナソニック株式会社 Air conditioner
JPWO2013179527A1 (en) * 2012-06-01 2016-01-18 日本電気株式会社 Electronic component with shield case
JP6305086B2 (en) * 2014-02-07 2018-04-04 三菱電機株式会社 Lighting device
JP2015207867A (en) * 2014-04-18 2015-11-19 日本電波工業株式会社 Oscillator device
JP6089380B2 (en) * 2016-06-29 2017-03-08 パナソニックＩｐマネジメント株式会社 USB outlet
JP6089381B2 (en) * 2016-06-29 2017-03-08 パナソニックＩｐマネジメント株式会社 USB outlet
JP6782448B2 (en) * 2017-07-20 2020-11-11 パナソニックＩｐマネジメント株式会社 USB outlet
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