JP3687506B2 - Multilayer metal printed circuit board - Google Patents

Multilayer metal printed circuit board Download PDF

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Publication number
JP3687506B2
JP3687506B2 JP2000250622A JP2000250622A JP3687506B2 JP 3687506 B2 JP3687506 B2 JP 3687506B2 JP 2000250622 A JP2000250622 A JP 2000250622A JP 2000250622 A JP2000250622 A JP 2000250622A JP 3687506 B2 JP3687506 B2 JP 3687506B2
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JP
Japan
Prior art keywords
circuit board
printed circuit
metal
printed
board
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP2000250622A
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Japanese (ja)
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JP2001102760A (en
Inventor
健次 岡本
幸男 中嶋
一彦 今村
孝男 市原
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fuji Electric FA Components and Systems Co Ltd
Original Assignee
Fuji Electric FA Components and Systems Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fuji Electric FA Components and Systems Co Ltd filed Critical Fuji Electric FA Components and Systems Co Ltd
Priority to JP2000250622A priority Critical patent/JP3687506B2/en
Publication of JP2001102760A publication Critical patent/JP2001102760A/en
Application granted granted Critical
Publication of JP3687506B2 publication Critical patent/JP3687506B2/en
Anticipated expiration legal-status Critical
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Abstract

PROBLEM TO BE SOLVED: To increase the packaging density of parts by efficient cooling. SOLUTION: A metal printed-circuit board 1 is formed by laminating an insulation layer 3 on the upper surface of a metal plate 2 that is a base, and electronic components 7 are packaged on a conductor pattern being formed on the upper surface of the insulation layer 3. A double-sided printed-circuit board 4, where the electronic components 7 are packaged is arranged at the upper portion of the metal printed-circuit board 1 in parallel. By filling an insulation resin 5 between the metal printed-circuit board 1 and the double-sided printed-circuit board 4 for curing, both the boards 1 and 4 are supported and fixed in one piece. Furthermore, an insulation resin 6 is laminated for curing onto the upper surface of both the printed-circuit boards 4, so that the packaged electronic parts 7 can be covered. By using a resin with a large thermal conductivity for the insulation resins 5 and 6, heat being generated from the electronic components 7 can be efficiently transferred and absorbed to the insulation resins 5 and 6 and is discharged from the surface of the metal plate 2 or the insulation resin 6.

Description

【０００１】
【発明の属する技術分野】
本発明は、部品の実装密度の大きい多層金属プリント基板に関する。
【０００２】
【従来の技術】
従来、部品の実装密度を大きくするために金属ベース上に２種類以上の絶縁層を形成し、その上に導体パターンを形成した金属プリント基板が知られている。その一例として、特開平４−３３２１８８号に記載されているものがある。これは、搭載される電気回路の特性に対応した絶縁層を配設する構成としたことで実装密度を高めるようにしたものである。
【０００３】
【発明が解決しようとする課題】
しかしながら、これら従来の金属プリント基板は、電子部品の配置が１平面上であるため、電子部品の実装密度の向上にも上限があり、必ずしも充分な実装密度が得られるとは限らない。
本発明は上記問題点を解決するためになされたもので、その目的とするところは、電子部品をさらに高密度に実装することのできる多層金属プリント基板を提供することにある。
【０００４】
【課題を解決するための手段】
上記目的を達成するために、この発明は、ベースとなる金属板上に絶縁層を積層して形成された金属プリント基板に部品を実装するとともに、金属プリント基板の部品実装側上方に、部品を実装した１以上のプリント基板を基板間に絶縁樹脂を充填して積層し、上方に積層されるプリント基板の一部を切除し、その切除部にスルーホールおよび接続用電極パターンを形成した基板を嵌合し埋設したことを特徴とする。
【０００５】
この発明においては、ベースとなる金属板上に絶縁層を積層して金属プリント基板が形成されるとともに、金属プリント基板に部品が実装される。金属プリント基板の部品実装側上方に、部品を実装した１以上のプリント基板が、基板間に絶縁樹脂が充填されて積層される。それにより、部品が複数層にわたって実装されて実装密度が増大するとともに、部品からの発熱が絶縁樹脂層や金属板を介して効率良く放出される。
【０００６】
また、上方に積層されるプリント基板の一部が切除され、その切除部に、スルーホールおよび接続用電極パターンを形成した基板が嵌合・埋設されたことにより、上下の導体パターン間の接続が容易になる。
【０００７】
【発明の実施の形態】
以下、図に沿って本発明の実施例を説明する。
図１は多層金属プリント基板の一例を示す断面図である。
図において、１は金属プリント基板であり、ベースである金属板２の上面に絶縁層３が積層されて形成される。絶縁層３の上面には図示しないが導体パターンが形成されて電子部品７が実装される。
【０００８】
金属プリント基板１の上方には、両面プリント基板４が平行に配設される。この両面プリント基板４の両面には図示しないが導体パターンが形成されて電子部品７が実装される。
金属プリント基板１と両面プリント基板４との間には、絶縁樹脂５が充填されて硬化されることにより、両基板が一体的に支持・固定される。
【０００９】
さらに、両面プリント基板４の上面にも、実装されている電子部品７を覆うように絶縁樹脂６が積層されて硬化される。
この例では、金属プリント基板１の上方に、両面プリント基板４を平行に配設したことにより、電子部品７が３層にわたって実装され実装密度がその分大きくなる。また、実装密度が増したため、電子部品７による単位面積当たりの発熱量が増大するが、電子部品７の周囲に絶縁樹脂５，６が充填されていることにより、電子部品７から発生した熱量が効率良く絶縁樹脂５，６へ伝達・吸収される。
【００１０】
絶縁樹脂５，６へ伝達された熱量は下側の金属板２の表面、あるいは上側の絶縁樹脂６の表面から外部へ効率良く放出される。それにより、実装された電子部品７が一定温度以下に保たれる。
なお、絶縁樹脂５，６は、熱伝導率の大きい樹脂が望ましい。
また、絶縁樹脂５，６は互いに熱伝導率の異なる樹脂であっても構わない。
【００１１】
さらには、金属プリント基板１の上方に積層されるプリント基板は、片面のプリント基板とすることも、あるいはプリント基板をさらに２枚以上の重ねることも可能である。
また、金属プリント基板１あるいは両面プリント基板４を複数に区分して、それぞれ異なる物理的特性の絶縁層を配設して形成することも可能である。
【００１２】
図２はこの発明の実施例を示し、図（ａ）は断面図、図（ｂ）は図（ａ）のＡ−Ａ線矢視図である。
この実施例は、図１の多層金属プリント基板における両面プリント基板４および絶縁樹脂５の層の一部を変更したものであり、他の部分は図１と共通なので、共通部分は図１と同じ符号を附して説明を省略し、異なる部分についてのみ説明する。
【００１３】
図において、金属プリント基板１と両面プリント基板５４の上面との間でそれぞれの導体パターン（図示せず）を接続する必要がある場合、両面プリント基板５４の該当位置が切除され、この切除部に同一形状をしたスルーホール基板５５が嵌合・固定される。このスルーホール基板５５は、積層された組立状態で下端が金属プリント基板１に当接する厚みを有するとともに、厚み方向にスルーホール５６が形成されている。さらに、スルーホール基板５５の上下面にはスルーホール５６から外周部にかけて放射状に接続用の電極パターン５７が形成されている。
【００１４】
同様に、電極パターン５７の外周端と接する金属プリント基板１および両面プリント基板５４の上面には、電極パターン５７の外周端と接続される接続用の電極パターン５８が形成されている。それにより、組立の際は、金属プリント基板１の上に、スルーホール基板５５を嵌合した両面プリント基板５４が載置され、スルーホール基板５５の電極パターン５７と、基板１および基板５４の上面に形成されている電極パターン５８とが半田付けにより接続される。次いで、両基板１，５４間に絶縁樹脂５が充填されて硬化することにより固定される。さらに、両面プリント基板５４の上面にも同様に絶縁樹脂６が積層されて硬化する。
【００１５】
この実施例では、上下の基板１，５４の間がスルーホール基板５５により支持されるとともに電極パターン５７と電極パターン５８とが半田付けされることにより、積層される基板１，５４間の機械的安定が得られる。同時に、電極パターン５７，５８が電気的にも接続されることで、積層される基板１，５４間の回路の接続が容易になる。
【００１６】
なお、スルーホール基板５５の個数は３個以上にすることも、また形状、大きさも実装される電子部品７や回路構成に応じて変更可能である。
【００１７】
【発明の効果】
以上述べたようにこの発明によれば、金属板をベースとして形成された金属プリント基板に１以上のプリント基板を絶縁樹脂を介して積層することにより、部品が複数層にわたって実装可能となり実装密度が増大する。
また、上方に積層されるプリント基板の一部を切除し、その切除部にスルーホールおよび接続用電極パターンを形成した基板を嵌合し埋設したことにより、他の基板の導体パターンとの間の接続が容易になり、回路接続の作業性が向上する。
【図面の簡単な説明】
【図１】 多層金属プリント基板の一例を示す断面図である。
【図２】 この発明の実施例を示す断面図および矢視図である。
【符号の説明】
１ 金属プリント基板 ２ 金属板
３ 絶縁層 ４ 両面プリント基板
５，６ 絶縁樹脂 ７ 電子部品
５４ 両面プリント基板 ５５ スルーホール基板
５６ スルーホール ５７，５８ 電極パターン[0001]
BACKGROUND OF THE INVENTION
The present invention relates to a multilayer metal printed board having a high mounting density of components.
[0002]
[Prior art]
2. Description of the Related Art Conventionally, a metal printed board is known in which two or more types of insulating layers are formed on a metal base and a conductor pattern is formed thereon in order to increase the mounting density of components. One example thereof is described in JP-A-4-332188. This is to increase the mounting density by providing an insulating layer corresponding to the characteristics of the electric circuit to be mounted.
[0003]
[Problems to be solved by the invention]
However, these conventional metal printed boards have an upper limit in improving the mounting density of electronic components because the arrangement of electronic components is on one plane, and a sufficient mounting density is not always obtained.
The present invention has been made to solve the above-described problems, and an object of the present invention is to provide a multilayer metal printed circuit board on which electronic components can be mounted at a higher density.
[0004]
[Means for Solving the Problems]
In order to achieve the above object, the present invention mounts a component on a metal printed circuit board formed by laminating an insulating layer on a base metal plate, and mounts the component on the component mounting side of the metal printed circuit board. One or more mounted printed boards are filled with insulating resin between the boards, and a part of the printed board stacked above is cut out, and a board in which through holes and connection electrode patterns are formed in the cut portions It is characterized by being fitted and buried.
[0005]
In the present invention, an insulating layer is laminated on a base metal plate to form a metal printed board, and components are mounted on the metal printed board. One or more printed circuit boards on which components are mounted are stacked with an insulating resin filled between the substrates above the component mounting side of the metal printed circuit board. As a result, the components are mounted over a plurality of layers to increase the mounting density, and heat generated from the components is efficiently released through the insulating resin layer and the metal plate.
[0006]
In addition, a part of the printed circuit board stacked above is cut out, and a board in which through holes and connection electrode patterns are formed is fitted and embedded in the cut portion, so that the connection between the upper and lower conductor patterns is achieved. It becomes easy.
[0007]
DETAILED DESCRIPTION OF THE INVENTION
Embodiments of the present invention will be described below with reference to the drawings.
FIG. 1 is a cross-sectional view showing an example of a multilayer metal printed board.
In the figure, reference numeral 1 denotes a metal printed circuit board, which is formed by laminating an insulating layer 3 on the upper surface of a metal plate 2 as a base. Although not shown, a conductive pattern is formed on the upper surface of the insulating layer 3 to mount the electronic component 7.
[0008]
A double-sided printed board 4 is disposed in parallel above the metal printed board 1. Although not shown, a conductive pattern is formed on both sides of the double-sided printed circuit board 4 and the electronic component 7 is mounted.
Between the metal printed circuit board 1 and the double-sided printed circuit board 4, the insulating resin 5 is filled and cured, so that both the boards are integrally supported and fixed.
[0009]
Further, an insulating resin 6 is laminated on the upper surface of the double-sided printed board 4 so as to cover the mounted electronic component 7 and cured.
In this example, since the double-sided printed circuit board 4 is disposed in parallel above the metal printed circuit board 1, the electronic component 7 is mounted over three layers, and the mounting density is increased accordingly. Further, since the mounting density is increased, the amount of heat generated per unit area by the electronic component 7 is increased. However, since the insulating resin 5 and 6 are filled around the electronic component 7, the amount of heat generated from the electronic component 7 is increased. Efficiently transmitted and absorbed to the insulating resins 5 and 6.
[0010]
The amount of heat transferred to the insulating resins 5 and 6 is efficiently released to the outside from the surface of the lower metal plate 2 or the surface of the upper insulating resin 6. Thereby, the mounted electronic component 7 is kept below a certain temperature.
The insulating resins 5 and 6 are desirably resins having a high thermal conductivity.
The insulating resins 5 and 6 may be resins having different thermal conductivities.
[0011]
Furthermore, the printed circuit board laminated above the metal printed circuit board 1 can be a single-sided printed circuit board, or two or more printed circuit boards can be stacked.
It is also possible to divide the metal printed board 1 or the double-sided printed board 4 into a plurality of parts and to dispose and form insulating layers having different physical characteristics.
[0012]
2A and 2B show an embodiment of the present invention, in which FIG. 2A is a cross-sectional view, and FIG. 2B is a view taken along the line A-A in FIG.
In this embodiment, a part of the double-sided printed circuit board 4 and the insulating resin 5 layer in the multilayer metal printed circuit board of FIG. 1 is changed, and the other parts are the same as in FIG. A description will be omitted with reference numerals, and only different parts will be described.
[0013]
In the figure, when it is necessary to connect each conductor pattern (not shown) between the metal printed circuit board 1 and the upper surface of the double-sided printed circuit board 54, the corresponding position of the double-sided printed circuit board 54 is cut out, The through hole substrate 55 having the same shape is fitted and fixed. The through-hole substrate 55 has a thickness such that the lower end abuts against the metal printed circuit board 1 in a stacked assembly state, and a through-hole 56 is formed in the thickness direction. Further, on the upper and lower surfaces of the through-hole substrate 55, connection electrode patterns 57 are formed radially from the through-hole 56 to the outer peripheral portion.
[0014]
Similarly, a connection electrode pattern 58 connected to the outer peripheral end of the electrode pattern 57 is formed on the upper surface of the metal printed circuit board 1 and the double-sided printed circuit board 54 in contact with the outer peripheral edge of the electrode pattern 57. Thereby, at the time of assembly, the double-sided printed board 54 fitted with the through-hole board 55 is placed on the metal printed board 1, the electrode pattern 57 of the through-hole board 55, and the upper surfaces of the board 1 and the board 54. The electrode pattern 58 formed on the substrate is connected by soldering. Next, the insulating resin 5 is filled between the substrates 1 and 54 and fixed by being cured. Further, the insulating resin 6 is similarly laminated on the upper surface of the double-sided printed board 54 and cured.
[0015]
In this embodiment, the upper and lower substrates 1 and 54 are supported by the through-hole substrate 55 and the electrode pattern 57 and the electrode pattern 58 are soldered to mechanically connect the stacked substrates 1 and 54. Stability is obtained. At the same time, since the electrode patterns 57 and 58 are also electrically connected, the circuit connection between the stacked substrates 1 and 54 is facilitated.
[0016]
The number of through-hole substrates 55 can be three or more, and the shape and size can be changed according to the electronic component 7 and the circuit configuration to be mounted.
[0017]
【The invention's effect】
As described above, according to the present invention, by stacking one or more printed boards on a metal printed board formed using a metal plate as a base via an insulating resin, components can be mounted over a plurality of layers, and the mounting density is reduced. Increase.
Also, by cutting out a part of the printed circuit board that is stacked above, and fitting and embedding a substrate in which the through-hole and connection electrode pattern are formed in the cut-out portion, the space between the conductor pattern of the other substrate Connection becomes easy and workability of circuit connection is improved.
[Brief description of the drawings]
FIG. 1 is a cross-sectional view showing an example of a multilayer metal printed board.
FIG. 2 is a cross-sectional view and an arrow view showing an embodiment of the present invention.
[Explanation of symbols]
DESCRIPTION OF SYMBOLS 1 Metal printed board 2 Metal plate 3 Insulating layer 4 Double-sided printed board 5,6 Insulation resin 7 Electronic component 54 Double-sided printed board 55 Through-hole board 56 Through-hole 57,58 Electrode pattern

Claims (1)

ベースとなる金属板上に絶縁層を積層して形成された金属プリント基板に部品を実装するとともに、金属プリント基板の部品実装側上方に、部品を実装した１以上のプリント基板を基板間に絶縁樹脂を充填して積層し、上方に積層されるプリント基板の一部を切除し、その切除部にスルーホールおよび接続用電極パターンを形成した基板を嵌合し埋設したことを特徴とする多層金属プリント基板。  Components are mounted on a metal printed circuit board formed by laminating an insulating layer on a base metal plate, and one or more printed circuit boards on which components are mounted are insulated between the substrates above the component mounting side of the metal printed circuit board. A multilayer metal characterized by filling and laminating a resin, cutting off a part of a printed circuit board laminated above, and fitting and embedding a substrate on which a through hole and a connection electrode pattern are formed. Printed board.
JP2000250622A 1993-06-25 2000-08-22 Multilayer metal printed circuit board Expired - Fee Related JP3687506B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2000250622A JP3687506B2 (en) 1993-06-25 2000-08-22 Multilayer metal printed circuit board

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
JP18083693 1993-06-25
JP7440294 1994-03-18
JP5-180836 1994-03-18
JP6-74402 1994-03-18
JP2000250622A JP3687506B2 (en) 1993-06-25 2000-08-22 Multilayer metal printed circuit board

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
JP09598594A Division JP3198796B2 (en) 1993-06-25 1994-05-10 Mold module

Publications (2)

Publication Number Publication Date
JP2001102760A JP2001102760A (en) 2001-04-13
JP3687506B2 true JP3687506B2 (en) 2005-08-24

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Family Applications (1)

Application Number Title Priority Date Filing Date
JP2000250622A Expired - Fee Related JP3687506B2 (en) 1993-06-25 2000-08-22 Multilayer metal printed circuit board

Country Status (1)

Country Link
JP (1) JP3687506B2 (en)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW550997B (en) * 2001-10-18 2003-09-01 Matsushita Electric Ind Co Ltd Module with built-in components and the manufacturing method thereof
KR101098604B1 (en) 2004-12-24 2011-12-23 두산산업차량 주식회사 Apparatus for connecting current poles of power module of a fork-lift truck
JP5072124B2 (en) * 2009-10-30 2012-11-14 パナソニック株式会社 Circuit boards and electronic equipment

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