JP3666034B2 - Negative pressure generation means - Google Patents

Negative pressure generation means Download PDF

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Publication number
JP3666034B2
JP3666034B2 JP26634294A JP26634294A JP3666034B2 JP 3666034 B2 JP3666034 B2 JP 3666034B2 JP 26634294 A JP26634294 A JP 26634294A JP 26634294 A JP26634294 A JP 26634294A JP 3666034 B2 JP3666034 B2 JP 3666034B2
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Japan
Prior art keywords
air
air supply
supply source
negative pressure
piston
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Expired - Lifetime
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JP26634294A
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Japanese (ja)
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JPH08108329A (en
Inventor
一馬 関家
徹 高沢
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Disco Corp
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Disco Corp
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Filing date
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Priority to JP26634294A priority Critical patent/JP3666034B2/en
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Description

【0001】
【産業上の利用分野】
本発明は、精密研削装置のチャックテーブル等に関連して設けられる負圧生成手段に関する。
【0002】
【従来の技術】
半導体ウェーハ等をダイシングする精密切削装置は、例えば図3に示すようにチャックテーブルTを備えており、このチャックテーブルTはウェーハW(粘着テープNを介してフレームFに貼着されている)を吸引保持し、チャックテーブルTを移動してアライメント手段Aによるアライメント工程及び回転ブレードを備えた切削手段Bにて切削工程を遂行するようになっている。この場合、チャックテーブルTには吸引機構が設けられ、且つ吸引機構に関連して負圧生成手段が装着されている。
【0003】
【発明が解決しようとする課題】
前記従来の負圧生成手段は、エアー供給源からベンチュリー管等の減圧手段に高圧エアーを供給すると共にこれを排気することにより、作用域即ちチャックテーブルの吸引機構をほぼ真空まで減圧するが、その真空状態を保持するために高圧エアーの供給を続行しなければならずエアーの供給量が著しく増大する。このため、エアー供給源は比較的大型で高能力のものを必要とし、設置スペースを多く取るばかりか諸経費が増大する等の欠点がある。
本発明は、このような従来の問題点を解決するためになされ、エアー供給源からの高圧エアーの供給量を減少させることにより小型の使用を可能とし、経費の節減も図れるようにした、負圧生成手段を提供することを課題とする。
【0004】
【課題を解決するための手段】
この課題を技術的に解決するための手段として、本発明は、高圧エアーを供給するエアー供給源と、このエアー供給源と連通し負圧を生成する減圧手段と、この減圧手段と連通しウェーハを保持するチャックテーブルと、から構成されるチャックテーブルを含む負圧生成手段において、
前記エアー供給源と前記減圧手段の途中の要所にエアー量調整手段が配設され、
前記減圧手段と前記チャックテーブルとを連通し真空系を形成する接続管に分岐管が接続され、
前記エアー量調整手段と前記分岐管とに作動手段が接続され、
前記作動手段は、シリンダと、このシリンダ内に配設されるスプリング及びピストンと、このピストンから突出するピストンロッドから構成されていて、
前記スプリング側が前記分岐管に接続されて、前記真空系の作用によって前記ピストンが移動し、前記ピストンロッドの先端に枢支された操作アームが前記エアー量調整手段を構成するバルブ機構を操作し、前記エアー供給源のエアー供給量を調整する負圧生成手段を要旨とするものである。
【0005】
【作用】
エアー供給源から減圧手段に高圧エアーが供給され、チャックテーブルの吸引機構を含む真空系を真空状態にすると、作動手段が作動しその作動手段により操作アームを介してエアー量調整手段が働き、エアー供給源からの高圧エアーの供給を自動的に調整することが出来る。
【0006】
【実施例】
以下、本発明の実施例を添付図面に基づいて詳説する。
図1において、1はコンプレッサ等のエアー供給源であり、ベンチュリー管等の減圧手段2に接続管3を介して接続され、接続管3の途中の要所にバルブ機構4aを有するエアー量調整手段4が設けられ、エアー供給源1から減圧手段3に高圧エアーを供給出来るようにしてある。
【0007】
5は前記減圧手段2と接続管6を介して連通する作用域例えばチャックテーブル等の保持手段であり、減圧手段2の減圧作用によって真空系7を形成し、保持手段5の上に載置されたフレーム付きウェーハWを吸引保持することが出来る。
【0008】
8は作動手段であって、シリンダ8a内にスプリング8bを介してピストン8cが装着され、スプリング8b側の開口端は分岐管9にて前記接続管6に接続され、ピストン8c側の開口端からはピストンロッド10が突出している。
【0009】
11は作動手段8に接続された操作アームであり、その一端側は前記ピストンロッド10の先端部に枢支され、他端側は前記エアー量調整手段4のバルブ機構4aに装着され、この操作アーム11を介してバルブ機構4aを操作出来るようにしてある。
【0010】
本発明に係る負圧生成手段12は、上記のように構成されその作用について説明すると、前記保持手段5の上にウェーハWが載置されるとエアー供給源1から高圧エアーが減圧手段2に供給され、接続管6内が減圧されて真空系7が形成される。この結果、保持手段5は負圧となってウェーハWを吸引保持する。
【0011】
この時、エアー量調整手段4のバルブ機構4aは開状態であるが、前記真空系7の作用によって分岐管9内も負圧となり、作動手段8のピストン8cが吸引されてスプリング8bを縮めながら図1の右方向に移動する。すると、ピストンロッド10が右方向に引っ張られて操作アーム11を時計方向に回動し、この回動に伴って下の添え図のように前記バルブ機構4aが閉じる方向に回転する。従って、スプリング8bの復元力と真空圧とのバランスがとれるようにエアー供給量が制御され、エアー供給源1からの高圧エアーの節約がなされる。
【0012】
真空系7の真空圧が解除されると、作動手段8のスプリング8bの復元力によってピストン8cが図1の左方向に押し戻されて元の位置に復帰し、これに伴ないピストンロッド10を介して操作アーム11が反時計方向に回動されてエアー量調整手段4のバルブ機構4aも開状態に復帰される。
【0013】
図2は本発明の他の実施例を示すもので、基本的構成は図1の実施例と同じ(同一部材は同一符号を付す)であるが、減圧手段2に関連させて逆流防止弁13を設けた点が構成上異なっている。即ち、接続管6の途中に逆流防止弁13が設けられており、前記エアー量調整手段4のバルブ機構4aが完全に閉じられたとしても、逆流防止弁13は実線で示す位置となってエアーが真空系7に逆流せず、このためウェーハWが保持手段5に吸引保持された状態が維持され且つエアーの使用量を前記実施例以上に節約することが出来る。
尚、かかる構成では、ウェーハWを取り外す際真空系7が大気に開放出来るよう大気開放バルブ14を設ける必要がある。
【0014】
【発明の効果】
以上説明したように、本発明によれば、チャックテーブル等の負圧生成手段において、作用域である保持手段を含む真空系に連通させて作動手段を設け、この作動手段により操作アームを介してエアー量調整手段のバルブ機構を操作出来るように構成したので、真空系が真空圧に達した時にエアー量調整手段のバルブ機構を閉じる方向に回動させ或は完全に閉じてエアー供給源からの高圧エアーの供給量を減少させることが出来る。従って、エアー供給源は従来のものより小型化して設置スペースを減少出来ると共に、電力等諸経費も節減出来る効果を奏する。
【図面の簡単な説明】
【図1】 本発明の実施例を示す全体構成の説明図である。
【図2】 本発明の他の実施例を示す全体構成の説明図である。
【図3】 精密切削装置の一例を示す斜視図である。
【符号の説明】
1…エアー供給源 2…減圧手段 3…接続管 4…エアー量調整手段4a…バルブ機構 5…保持手段 6…接続管 7…真空系 8…作動手段 8a…シリンダ 8b…スプリング 8c…ピストン 9…分岐管 10…ピストンロッド 11…操作アーム 12…負圧生成手段
13…逆流防止弁 14…大気開放バルブ
[0001]
[Industrial application fields]
The present invention relates to a negative pressure generating means provided in association with a chuck table or the like of a precision grinding apparatus.
[0002]
[Prior art]
A precision cutting apparatus for dicing a semiconductor wafer or the like includes a chuck table T as shown in FIG. 3, for example, and this chuck table T is attached to a wafer W (attached to a frame F via an adhesive tape N). The chuck table T is held by suction, and the cutting process is performed by the alignment process by the alignment unit A and the cutting unit B provided with a rotating blade. In this case, the chuck table T is provided with a suction mechanism, and negative pressure generating means is attached in relation to the suction mechanism.
[0003]
[Problems to be solved by the invention]
The conventional negative pressure generating means supplies the high pressure air from the air supply source to the pressure reducing means such as a venturi tube and exhausts it, thereby reducing the working area, that is, the suction mechanism of the chuck table to almost vacuum. In order to maintain the vacuum state, the supply of high-pressure air must be continued, and the supply amount of air is significantly increased. For this reason, the air supply source requires a relatively large and high-capacity air source, and there are drawbacks such as a large installation space and an increase in various expenses.
The present invention has been made in order to solve the above-described conventional problems. By reducing the amount of high-pressure air supplied from an air supply source, the present invention can be used in a small size and can reduce costs. It is an object to provide pressure generation means.
[0004]
[Means for Solving the Problems]
As means for technically solving this problem, the present invention includes an air supply source that supplies high-pressure air, a decompression unit that communicates with the air supply source and generates a negative pressure, and a wafer that communicates with the decompression unit. In the negative pressure generating means including a chuck table configured to hold a chuck table,
An air amount adjusting means is disposed at a midpoint between the air supply source and the pressure reducing means,
A branch pipe is connected to a connection pipe that connects the pressure reducing means and the chuck table to form a vacuum system,
Actuating means is connected to the air amount adjusting means and the branch pipe,
The actuating means includes a cylinder, a spring and a piston disposed in the cylinder, and a piston rod protruding from the piston.
The spring side is connected to the branch pipe, the piston is moved by the action of the vacuum system, and an operation arm pivotally supported at the tip of the piston rod operates a valve mechanism constituting the air amount adjusting means, The gist of the present invention is negative pressure generating means for adjusting the air supply amount of the air supply source.
[0005]
[Action]
When high-pressure air is supplied from the air supply source to the decompression means and the vacuum system including the chuck table suction mechanism is brought into a vacuum state, the operation means is activated, and the air amount adjustment means is operated by the operation means via the operation arm. The supply of high-pressure air from the supply source can be automatically adjusted.
[0006]
【Example】
Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings.
In FIG. 1, reference numeral 1 denotes an air supply source such as a compressor, which is connected to a decompression means 2 such as a venturi pipe via a connection pipe 3 and has an air amount adjustment means having a valve mechanism 4 a at a midpoint of the connection pipe 3. 4 is provided so that high-pressure air can be supplied from the air supply source 1 to the decompression means 3.
[0007]
Reference numeral 5 denotes a holding means such as a chuck table which communicates with the pressure reducing means 2 via the connecting pipe 6. A vacuum system 7 is formed by the pressure reducing action of the pressure reducing means 2 and is placed on the holding means 5. The wafer W with a frame can be sucked and held.
[0008]
8 is an actuating means, and a piston 8c is mounted in a cylinder 8a via a spring 8b. An opening end on the spring 8b side is connected to the connecting pipe 6 by a branch pipe 9, and from an opening end on the piston 8c side. The piston rod 10 protrudes.
[0009]
Reference numeral 11 denotes an operating arm connected to the operating means 8, one end of which is pivotally supported by the tip of the piston rod 10, and the other end is attached to the valve mechanism 4 a of the air amount adjusting means 4. The valve mechanism 4a can be operated via the arm 11.
[0010]
The negative pressure generating means 12 according to the present invention is configured as described above. The operation of the negative pressure generating means 12 will be described. When the wafer W is placed on the holding means 5, high-pressure air is supplied from the air supply source 1 to the pressure reducing means 2. Then, the inside of the connecting pipe 6 is depressurized to form a vacuum system 7. As a result, the holding means 5 becomes a negative pressure and sucks and holds the wafer W.
[0011]
At this time, the valve mechanism 4a of the air amount adjusting means 4 is in an open state, but the inside of the branch pipe 9 also becomes negative pressure by the action of the vacuum system 7, and the piston 8c of the operating means 8 is sucked and the spring 8b is contracted. Move to the right in FIG. Then, the piston rod 10 is pulled rightward to rotate the operation arm 11 clockwise, and with this rotation, the valve mechanism 4a rotates in the closing direction as shown in the attached drawing below. Therefore, the air supply amount is controlled so that the restoring force of the spring 8b and the vacuum pressure are balanced, and high-pressure air from the air supply source 1 is saved.
[0012]
When the vacuum pressure of the vacuum system 7 is released, the piston 8c is pushed back to the left in FIG. 1 by the restoring force of the spring 8b of the operating means 8 and returns to the original position. Thus, the operating arm 11 is rotated counterclockwise, and the valve mechanism 4a of the air amount adjusting means 4 is also returned to the open state.
[0013]
FIG. 2 shows another embodiment of the present invention. The basic configuration is the same as that of the embodiment of FIG. 1 (the same members are given the same reference numerals), but the backflow prevention valve 13 is related to the pressure reducing means 2. The point which provided is different on a structure. That is, the backflow prevention valve 13 is provided in the middle of the connecting pipe 6, and even if the valve mechanism 4a of the air amount adjusting means 4 is completely closed, the backflow prevention valve 13 is in the position indicated by the solid line. Does not flow back to the vacuum system 7, so that the state in which the wafer W is sucked and held by the holding means 5 is maintained, and the amount of air used can be saved more than in the above embodiment.
In this configuration, it is necessary to provide an air release valve 14 so that the vacuum system 7 can be opened to the atmosphere when the wafer W is removed.
[0014]
【The invention's effect】
As described above, according to the present invention, the negative pressure generating means such as the chuck table is provided with the operating means in communication with the vacuum system including the holding means as the working area, and the operating means is provided via the operation arm. Since the valve mechanism of the air amount adjusting means can be operated, when the vacuum system reaches a vacuum pressure, the valve mechanism of the air amount adjusting means is rotated in the closing direction or completely closed to remove from the air supply source. The supply amount of high-pressure air can be reduced. Therefore, the air supply source can be made smaller than the conventional one to reduce the installation space, and various costs such as electric power can be saved.
[Brief description of the drawings]
FIG. 1 is an explanatory diagram of an overall configuration showing an embodiment of the present invention.
FIG. 2 is an explanatory diagram of an overall configuration showing another embodiment of the present invention.
FIG. 3 is a perspective view showing an example of a precision cutting apparatus.
[Explanation of symbols]
DESCRIPTION OF SYMBOLS 1 ... Air supply source 2 ... Pressure reduction means 3 ... Connection pipe 4 ... Air amount adjustment means 4a ... Valve mechanism 5 ... Holding means 6 ... Connection pipe 7 ... Vacuum system 8 ... Actuation means 8a ... Cylinder 8b ... Spring 8c ... Piston 9 ... Branch pipe 10 ... Piston rod 11 ... Operating arm 12 ... Negative pressure generating means 13 ... Backflow prevention valve 14 ... Air release valve

Claims (1)

高圧エアーを供給するエアー供給源と、このエアー供給源と連通し負圧を生成する減圧手段と、この減圧手段と連通しウェーハを保持するチャックテーブルと、から構成されるチャックテーブルを含む負圧生成手段において、
前記エアー供給源と前記減圧手段の途中の要所にエアー量調整手段が配設され、
前記減圧手段と前記チャックテーブルとを連通し真空系を形成する接続管に分岐管が接続され、
前記エアー量調整手段と前記分岐管とに作動手段が接続され、
前記作動手段は、シリンダと、このシリンダ内に配設されるスプリング及びピストンと、このピストンから突出するピストンロッドから構成されていて、
前記スプリング側が前記分岐管に接続されて、前記真空系の作用によって前記ピストンが移動し、前記ピストンロッドの先端に枢支された操作アームが前記エアー量調整手段を構成するバルブ機構を操作し、前記エアー供給源のエアー供給量を調整する負圧生成手段。
Negative pressure including a chuck table comprising an air supply source that supplies high-pressure air, a decompression unit that communicates with the air supply source and generates a negative pressure, and a chuck table that communicates with the decompression unit and holds a wafer. In the generation means,
An air amount adjusting means is disposed at a midpoint between the air supply source and the pressure reducing means,
A branch pipe is connected to a connection pipe that connects the pressure reducing means and the chuck table to form a vacuum system,
Actuating means is connected to the air amount adjusting means and the branch pipe,
The actuating means includes a cylinder, a spring and a piston disposed in the cylinder, and a piston rod protruding from the piston.
The spring side is connected to the branch pipe, the piston is moved by the action of the vacuum system, and an operation arm pivotally supported at the tip of the piston rod operates a valve mechanism constituting the air amount adjusting means, Negative pressure generating means for adjusting an air supply amount of the air supply source .
JP26634294A 1994-10-05 1994-10-05 Negative pressure generation means Expired - Lifetime JP3666034B2 (en)

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Application Number Priority Date Filing Date Title
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JP3666034B2 true JP3666034B2 (en) 2005-06-29

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* Cited by examiner, † Cited by third party
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JP2009166153A (en) * 2008-01-15 2009-07-30 Koganei Corp Vacuum generator
JP2009176992A (en) * 2008-01-25 2009-08-06 Disco Abrasive Syst Ltd Wafer processing apparatus
JP5196142B2 (en) * 2008-04-17 2013-05-15 株式会社ニコン Polishing equipment
CN107695746A (en) * 2017-11-16 2018-02-16 重庆市乐珐机电有限责任公司 Ring flange stationary fixture
JP7039134B2 (en) * 2018-06-04 2022-03-22 株式会社ディスコ Cutting equipment
SG11202109859QA (en) * 2019-03-25 2021-10-28 Kla Tencor Corp Vacuum hold-down apparatus for flattening bowed semiconductor wafers

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