JP3617495B2 - Semiconductor element connection structure, liquid crystal display device and electronic apparatus - Google Patents

Semiconductor element connection structure, liquid crystal display device and electronic apparatus Download PDF

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JP3617495B2
JP3617495B2 JP2001368894A JP2001368894A JP3617495B2 JP 3617495 B2 JP3617495 B2 JP 3617495B2 JP 2001368894 A JP2001368894 A JP 2001368894A JP 2001368894 A JP2001368894 A JP 2001368894A JP 3617495 B2 JP3617495 B2 JP 3617495B2
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semiconductor element
liquid crystal
substrate
crystal display
display device
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JP2002198397A (en
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憲治 内山
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Seiko Epson Corp
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H01L2224/161—Disposition
    • H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
    • H01L2224/321—Disposition
    • H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/32225—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73201—Location after the connecting process on the same surface
    • H01L2224/73203—Bump and layer connectors
    • H01L2224/73204—Bump and layer connectors the bump connector being embedded into the layer connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/14—Integrated circuits
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30—Technical effects
    • H01L2924/36—Material effects
    • H01L2924/364—Polymers
    • H01L2924/3641—Outgassing

Description

【０００１】
【発明の属する技術分野】
本発明は、基板上に半導体素子を接続するための半導体素子の接続構造、その構造を用いた液晶表示装置及びその液晶表示装置を使用した電子機器に関する。
【０００２】
【従来の技術】
近年、ナビゲーションシステム、テレビ、パームトップコンピュータ、電子手帳、携帯電話機等といった各種の電子機器において、可視情報を表示するために液晶表示装置が広く用いられている。この液晶表示装置は、一般に、液晶パネルに液晶駆動用ＩＣすなわち半導体素子を接続し、さらにその液晶パネルにバックライト、ケーシング等といった付帯部品を装着することによって構成される。ここにいう液晶パネルは、通常、少なくとも２枚の液晶用基板によって挟まれた間隙に液晶を充填し、必要に応じてさらに、偏光板、カラーフィルタ等を装着することによって構成される。
【０００３】
液晶駆動用ＩＣを液晶パネルに接続する方法としては、従来より種々考えられており、例えば、ＣＯＢ（Ｃｈｉｐ Ｏｎ Ｂｏａｒｄ）方式やＣＯＧ（Ｃｈｉｐ Ｏｎ Ｇｌａｓｓ）方式等に基づいた接続方法が考えられる。ＣＯＢ方式では、配線パターンを形成した絶縁基板上にＡＣＦ（ Ａｎｉｓｏｔｒｏｐｉｃ ｃｏｎｄｕｃｔｉｖｅ ｆｉｌｍ）その他の接合剤を用いて液晶駆動用ＩＣを接続し、その絶縁基板をヒートシール等を介して液晶パネルに接続する。一方、ＣＯＧ方式では、電極端子が形成されたガラス基板上にＡＣＦ等を用いて液晶駆動用ＩＣを直接に接続する。ＣＯＢ方式及びＣＯＧ方式のいずれの場合でも、液晶駆動用ＩＣ等の半導体素子は、絶縁基板や液晶用ガラス基板等といった基板上に接続される。
【０００４】
上記従来の接続方法では、基板と液晶駆動用ＩＣとの間にＡＣＦその他の接合剤が空隙無く均一に充填されていた。そのため、液晶駆動用ＩＣを圧着するときにそのＩＣに反りが生じたり、温度変化に起因して液晶駆動用ＩＣ及び／又は基板が変形するとき、基板上の電極に接触する液晶駆動用ＩＣのバンプ部分に過剰な応力が発生し、その結果、電気接続状態が不安定になるおそれがあった。また、そのような問題の発生を回避するためには、液晶駆動用ＩＣの圧着条件を狭い許容範囲内で厳しく管理しなければならず、従って、複雑な工程管理を要求されていた。
【０００５】
また、特開平２−４２７３８号公報によれば、ＣＯＢ実装プリント回路板においてＩＣチップと基板との間に緩衝層としての柔軟性接着剤層を設けることにより、両者の間の接合信頼性を向上させた接続構造も開示されている。しかしながら、この従来の接続構造では、緩衝作用を得るために専用の柔軟性接着層を形成しなければならず、部品コスト及び製造コストが高くなるという問題があった。
【０００６】
【発明が解決しようとする課題】
本発明は、半導体素子の接続構造における従来の問題点に鑑みて成されたものであって、極めて簡単な構成を付加するだけで、基板に対する半導体素子の接続状態を安定に保持できるようにすることを目的とする。
【０００７】
【課題を解決するための手段】
上記の目的を達成するため、本発明の半導体素子の接続構造は、複数のバンプを具備する半導体素子が基板に接続されてなる半導体素子の接続構造において、前記半導体素子と前記基板とは接着層を介して接合されてなり、前記接着層は前記半導体素子と前記基板との間にわたる複数の空間を具備し、前記空間と前記空間の間において前記半導体素子と前記基板とが接合されてなることを特徴とする。
【０００８】
この接続構造によれば、半導体素子又は基板が変形するときに、接合剤の中に形成した空間がそれらの変形に対応して自由に変形して半導体素子等の変形を吸収する。その結果、半導体素子又は基板が変形する場合でも半導体素子の電極部分に過剰な負荷が加わることを防止でき、よって、半導体素子の電気接続状態を安定した良好な状態に保持できる。
【０００９】
上記構成において、半導体素子としてはＩＣチップ、ＬＳＩチップ等の素子が考えられる。また、液晶表示装置を想定する場合には、半導体素子として液晶駆動用ＩＣ等が考えられる。また、基板としては、ＣＯＢ方式の場合の絶縁基板、ＣＯＧ方式の場合の液晶用透明基板、その他各種の接続方法に対応した各種の基板が考えられる。また、接合剤としては、ＡＣＦ（ Ａｎｉｓｏｔｒｏｐｉｃ ｃｏｎｄｕｃｔｉｖｅ ｆｉｌｍ：異方性導電膜）や通常の接着剤等が考えられる。
【００１０】
ＡＣＦというのは、熱可塑性樹脂フィルム又は熱硬化性樹脂フィルムの中に導電粒子を分散させたもので、熱圧着を受けることによって単一方向への導電性を発揮するような接合剤である。一方、通常の接着剤とは、主に基板と半導体素子とを機械的に接合させるだけで、電気的な接続の役割は持たない接着剤である。ＡＣＦを用いる場合は、基板上の端子と半導体素子のバンプとがＡＣＦ内の導電粒子を介して電気的に接続される。一方、通常の接着剤を用いる場合は、基板上の端子と半導体素子のバンプとが直接に接続されて電気的な導通がとられ、その状態において通常の接着剤によって半導体素子が基板に機械的に接着される。
【００１１】
半導体素子として液晶表示装置に使われる液晶駆動用ＩＣを考えると、その液晶駆動用ＩＣの能動面には複数のバンプが列状に並べられる。この列状の態様としては種々考えられるが、例えば図２及び図７に示すように、長手方向に列状（図では２列）に並べられた一対のバンプ列２８，２９と、短手方向に列状（図では２列）に並べられた一対のバンプ列２８，２８とによって環状に配列されることがある。また、図８に示すように、長手方向又は短手方向に関してだけ一対のバンプ列２８，２９が設けられることもある。
【００１２】
以上のようなバンプ配列を有する半導体素子を基板上に接続する際には、図２に示すように、環状のバンプによって囲まれる領域内の接合剤の中に空間３３を形成したり、図７に示すように、個々のバンプ２８，２９の間やバンプ列の外側に空間３３を形成したりすることができる。
【００１４】
本発明に係る液晶表示装置は、以上に説明した半導体素子の接続構造を用いて構成される液晶表示装置である。より具体的には、本発明の電子機器における液晶表示装置は、液晶を挟んで互いに対向する一対の基板を備え、複数のバンプを具備する半導体素子が一方の前記基板に接続されてなる液晶表示装置において、前記半導体素子と前記基板とは接着層を介して接合されてなり、前記接着層は前記半導体素子と前記基板との間にわたる複数の空間を具備し、前記空間と前記空間の間において前記半導体素子と前記基板とが接合されてなることを特徴とする。
【００１５】
また、本発明に係る液晶表示装置を用いた電子機器は、例えばナビゲーションシステム、テレビ、パームトップコンピュータ、電子手帳、携帯電話機等といった各種の機器が具体例として考えられる。本発明の電子機器は、上記本発明の液晶表示装置と、前記液晶表示装置に接続される半導体駆動用出力端子と、を備えることを特徴とする。また、本発明の電子機器は、複数のバンプを具備する半導体素子と、前記半導体素子が接続される基板と、前記基板に接続される半導体駆動用出力端子とを備える電子機器において、前記半導体素子と前記基板とは接着層を介して接合されてなり、前記接着層は前記半導体素子と前記基板との間にわたる複数の空間を具備し、前記空間と前記空間の間において前記半導体素子と前記基板とが接合されてなることを特徴とする。
また、本発明に係る電子機器は、以上に説明した半導体素子の接続構造を用いて構成される液晶表示装置と液晶表示装置に接続される半導体駆動用出力端子とを備えた電子機器である。より具体的には、本発明の電子機器における液晶表示装置は、液晶を挟んで互いに対向する一対の基板を備え、複数のバンプを具備する半導体素子が一方の前記基板に接続されてなる液晶表示装置において、前記半導体素子と前記基板とは接着層を介して接合されてなり、前記接着層は前記半導体素子と前記基板との間にわたる複数の空間を具備し、前記空間と前記空間の間において前記半導体素子と前記基板とが接合されてなることを特徴とする。
【００１６】
【発明の実施の形態】
図６は、本発明に係る液晶表示装置を用いた電子機器の一実施形態である、携帯電話機の一例を示している。この携帯電話機は、上部筐体１及び下部筐体２を有する。上部筐体１の中には、キーボード１０等を制御するためのＰＣＢ（Ｐｒｉｎｔｅｄ Ｃｉｒｃｕｉｔ Ｂｏａｒｄ ）等が含まれる。また、下部筐体２の中には、コントロール用ＬＳＩ等を搭載した制御回路基板３及びその回路基板３を搭載した本体基板４が収納される。本体基板４の上には本発明に係る液晶表示装置５が装着される。本体基板４の表面には、複数の半導体駆動用出力端子６が配線パターンとして形成されている。液晶表示装置５はその内部に液晶駆動用ＩＣ７、すなわち半導体素子を有しており、液晶表示装置５を本体基板４の上に装着した状態で液晶駆動用ＩＣ７が半導体駆動用出力端子６に電気的に接続される。下部筐体２の中に液晶表示装置５その他の必要機器を配設し、その後、上部筐体１を上方から被せることにより携帯電話機が完成する。なお、符号２０はスピーカを示している。
【００１７】
液晶表示装置５は、例えば図４に示すように、液晶パネル８、バックライトユニット９、シールドケース１１及び弾性体コネクタ１２を有する。液晶パネル８は、図３に示すように、透明なガラスによって形成された第１液晶用基板１３及び同じく透明なガラスによって形成された第２液晶用基板１４を有する。第１液晶用基板１３の内側表面には透明電極１８が形成され、一方、第２液晶用基板１４の内側表面には透明電極１９が形成される。これらの電極は、いずれも、ＩＴＯ（Ｉｎｄｉｕｍ Ｔｈｉｎ Ｏｘｉｄｅ ）その他の透明導電材料によって形成される。
【００１８】
第１液晶用基板１３及び第２液晶用基板１４のそれぞれの外側表面には、偏光板１６ａ及び偏光板１６ｂが貼り付けられる。第１液晶用基板１３と第２液晶用基板１４とは環状のシール剤１７によって所定の間隙、いわゆるセルギャップをもって液密状態に接着される。そして、このセルギャップ内に液晶が封入される。第１液晶用基板１３のうち第２液晶用基板１４の外側（図３の右側）に張り出す部分１３ａの内側表面の右端部には半導体入力用端子２１が形成される。半導体素子としての液晶駆動用ＩＣ７は接着層３１によって第１液晶用基板１３の上に直接に接着され、これにより、ＩＣ７の出力用バンプ２８が透明電極１８に接続し、他方、ＩＣ７の入力用バンプ２９が半導体入力用端子２１に接続する。
【００１９】
このように本実施形態では、液晶駆動用ＩＣ７が液晶パネル８を構成する液晶用基板１３の上に直接に接合される形式の液晶表示装置、すなわちＣＯＧ（Ｃｈｉｐ
Ｏｎ Ｇｌａｓｓ）型液晶表示装置が用いられている。
【００２０】
図３において、バックライトユニット９は、導光体２２及びその左端に固着された複数、例えば４個のＬＥＤ（Ｌｉｇｈｔ Ｅｍｉｔｔｉｎｇ Ｄｉｏｄｅ：発光ダイオード）２３を有する。導光体２２の右端部には、図４にも示すように、弾性体コネクタ１２をガイドするための手段として作用する直方体形状のガイド穴２４が形成される。このガイド穴２４は、図３に示すように、弾性体コネクタ１２を隙間なく収納できる大きさに形成される。
【００２１】
弾性体コネクタ１２は、図５に示すように、電気絶縁性を備えた弾性材料、例えばシリコンゴムによって、断面半円形状の柱状に形成された弾性基部２５と、その弾性基部２５の半円状外周表面に互いに平行に設けられた多数の導電部２６とを有する。互いに隣り合う２つの導電部２６の間は弾性材料によって非導電部となっており、その非導電部の幅は、例えば１５μｍ〜２５μｍ程度に保持される。図中の符号Ｗは、互いに隣り合う導電部２６間の間隔、いわゆる導電部間ピッチを示しており、通常は、Ｗ＝３０μｍ〜５０μｍ程度に設定される。
【００２２】
本実施形態の液晶表示装置を携帯電話機（図６）の本体基板４に装着する際には、図４において、弾性体コネクタ１２を導光体２２のガイド穴２４の中に挿入し、バックライトユニット９を本体基板４上の所定位置に置き、液晶パネル８をバックライトユニット９上の所定位置に置き、シリコンゴムその他の弾性体によって形成した加圧用部材３０を間に入れた状態でシールドケース１１を液晶パネル８及びバックライトユニット９の上に被せ、そして図３に示すように、カシメ用ストッパ２７を変形させることによって本体基板４とシールドケース１１とを締め付けて固定する。このとき、弾性体コネクタ１２は加圧用部材３０の働きによって図３の上下方向に圧縮されて弾性変形し、その結果、導電部２６（図５参照）は、弾性基部２５の弾性復元力によって、液晶パネル８側の半導体入力用端子２１と本体基板４側の半導体駆動用出力端子６の両方にしっかりと接触する。なお、弾性体コネクタ１２を圧縮する方法に関しては、加圧用部材３０のような専用の部品を用意するのに代えて、シールドケース１１の対応する個所を内側へ突出するように変形させてシールドケース１１の該部にリブを形成し、そのリブによって弾性体コネクタ１２を圧縮することもできる。
【００２３】
以上により液晶表示装置の組み付けが完了すると、制御回路基板３（図６）から半導体駆動用出力端子６、弾性体コネクタ１２（図３）及び半導体入力用端子２１を通して液晶駆動用ＩＣ７へ電気信号及び液晶駆動用電力が供給され、それに基づいて液晶駆動用ＩＣ７によって電極１８及び１９への印加電圧が制御される。そして、この電圧制御により、液晶パネル８の有効表示領域に可視像が表示される。
【００２４】
本実施形態では、液晶パネル８側の半導体入力用端子２１と携帯電話機側の半導体駆動用出力端子６との間に弾性体コネクタ１２を配置するだけで両者を電気的に接続できるので、組立作業が非常に簡単である。また、弾性体コネクタ１２をガイド穴２４の中に配置したので、弾性体コネクタ１２に力が加わったときにその弾性体コネクタ１２が撓み、座屈などといった変形を生じることがなく、従って、半導体入力用端子２１と半導体駆動用出力端子６との間の電気接続状態を常に安定状態に保持できる。
【００２５】
本実施形態では、図１に示すように、液晶駆動用ＩＣ７が接着層３１によって第１液晶用基板１３上に接着される。そしてその接着層３１は、接合剤としてのＡＣＦ（ Ａｎｉｓｏｔｒｏｐｉｃ ｃｏｎｄｕｃｔｉｖｅ ｆｉｌｍ：異方性導電膜）３２及びそのＡＣＦ３２の内部に形成された複数個の空間３３によって構成される。ＡＣＦ３２は、接着性樹脂フィルムの中に多数の導電粒子３４を分散させることによって形成されており、ＩＣ７の出力用バンプ２８が導電粒子３４を介して透明電極１８に電気的に接続され、他方、入力用バンプ２９が導電粒子３４を介して半導体入力用端子２１に電気的に接続される。また、バンプ２８、バンプ２９及び各端子間は、接着性樹脂によって絶縁状態に保持される。
【００２６】
図２は、図１において矢印Ａで示す方向から液晶駆動用ＩＣ７の接合部分を見た状態を示している。この図から明らかなように、複数の空間３３は、長手方向に２列に並べられたバンプ２８，２９と、短手方向に２列に並べられたバンプ２８，２８とによって囲まれる領域内、すなわち環状に配列された複数のバンプ２８，２９によって囲まれる領域内に互いに近接した状態で位置している。一般に、液晶駆動用ＩＣ７を基板１３上に接合する際には、液晶駆動用ＩＣ７と基板１３との間にＡＣＦ３２を挟んだ状態でＩＣ７を加熱しながら基板１３に所定圧力で押し付ける。この加熱及び加圧処理の際、液晶駆動用ＩＣ７は反りを生じることがあり、そのような反りが発生すると、バンプ２８及び２９の接続部に過剰な応力が発生して電気的な接続状態が不安定になるおそれがある。また、液晶駆動用ＩＣ７に温度変化が生じるときにも、そのＩＣ７及び／又は基板１３が変形することによってバンプ２８及び２９の接続状態が不安定になるおそれがある。これに対し、本実施形態のようにＡＣＦ３２の内部に空間３３を設けておけば、液晶駆動用ＩＣ７が変形するときには、その変形に従ってそれらの空間３３が自由に変形してそのＩＣ７の変形を吸収でき、その結果、バンプ２８及び２９の接続部分に過剰な応力が発生することを防止できる。
【００２７】
ＡＣＦ３２の内部に空間３３を形成するための方法は特定の方法に限定されないが、例えば、液晶駆動用ＩＣ７を基板１３に圧着する際の圧着条件を使用する液晶駆動用ＩＣ７に対応した適切な条件に設定することにより、そのような空間３３を得ることができる。そのような圧着条件の一例として次のような条件が挙げられる。
【００２８】
（１）液晶駆動用ＩＣ７：ＳＥＤ１２２０（セイコーエプソン株式会社製）
このＩＣの形状は、図２において、Ｌ×Ｗ＝７．７ｍｍ×２．８ｍｍであり、バンプ数は約２００個であり、バンプサイズは８０μｍ×１２０μｍである。
【００２９】
（２）ＡＣＦ３２：ＣＰ８５３０（ソニーケミカル株式会社製）
（３）ＡＣＦの加熱温度：１８０〜２３０℃（中心温度＝２００〜２１０℃）
ＩＣ７を高温に加熱された加圧ヘッドで押し付けることによりＡＣＦを加圧及び加熱する場合には、その加圧ヘッドの温度を２６０〜３６０℃（中心温度＝３００℃程度）とすることにより、上記のＡＣＦの温度が得られる。
【００３０】
（４）加圧ヘッドの加圧力：１２ｋｇｆ〜２０ｋｇｆ
（５）加圧ヘッドの加圧時間：１０秒
以上の（１）〜（５）の条件の下に液晶駆動用ＩＣ７を基板１３上に接合したところ、図２に示すような複数の空間３３がＡＣＦ３２の内部に形成された。
【００３１】
図７は、空間３３の設け方についての変形例を示している。この変形例が図２に示した先の実施形態と異なる点は、長手方向のバンプ列２８，２９の間及び短手方向のバンプ列２８，２８の間に空間３３を設けるだけでなく、個々のバンプの間及び一対のバンプ列の外側に空間３３を設けたことである。空間３３をこのように配置した場合でも、基板に対する半導体素子の接続状態を安定に保持できる。
【００３２】
図８は、バンプ配列に関する変形例を示している。この変形例が図２に示した先の実施形態と異なる点は、複数のバンプ２８，２９を環状に配列するのではなくて、長手方向に関してだけ列状に配列した点である。この変形例では、バンプ列２８，２９の間に複数の空間３３を設けてあるが、これに代えて又はこれに加えて、個々のバンプの間及び／又はバンプ列の外側に空間３３を設けることもできる。
【００３３】
以上、好ましい実施形態を挙げて本発明を説明したが、本発明はその実施形態に限定されるものでなく、請求の範囲に記載した技術的範囲内で種々に改変できる。
【００３４】
例えば、本発明に係る半導体の接続構造及び液晶表示装置は、携帯電話機以外の電子機器、例えば、ナビゲーションシステム、テレビ、パームトップコンピュータ、電子手帳等といった、可視情報の表示を必要とする各種の機器に対して使用できる。
【００３５】
図３〜図５に示した実施形態は、ＣＯＧ（ Ｃｈｉｐ Ｏｎ Ｇｌａｓｓ）型液晶表示装置に本発明を適用した場合の実施形態であるが、本発明はそれ以外の形式の液晶表示装置、例えばＣＯＢ（Ｃｈｉｐ Ｏｎ Ｂｏａｒｄ）型液晶表示装置等に対しても適用できる。また、図３〜図５に示した実施形態では、電子機器としての携帯電話機側の出力用端子６と液晶パネル８側の入力用端子２１とを弾性体コネクタ１２によって電気的に接続したが、両者を接続するための接続方法はこれに限られない。例えば、ＦＰＣ（Ｆｌｅｘｉｂｌｅ Ｐｒｉｎｔｅｄ Ｃｉｒｃｕｉｔ）を用いて両端子を接続する場合も本発明に含まれる。
【００３６】
また、図１の実施形態では、接着層３１を導電粒子３４を含むＡＣＦ３２によって構成したが、これに代えて、導電粒子を含まない接着剤を用いて構成することもできる。この場合には、その接着剤の内部に空間３３が形成される。またこの場合には、液晶駆動用ＩＣ７のバンプと液晶パネル側の電極端子とが直接に接続される。
【００３７】
【発明の効果】
本発明の半導体素子の接続構造、液晶表示装置及び電子機器によれば、接合剤の内部に空間を設けるという極めて簡単な構成を付加するだけで、基板に対する半導体素子の接続状態を安定に保持できる。特別な柔軟層又は緩衝層等を設ける必要がないので、構造が簡単であり、製作も簡単である。
【００３８】
本発明の半導体素子の接続構造、液晶表示装置及び電子機器によれば、半導体素子が変形するときにバンプの接続部分に生じる応力を非常に効果的に低減できる。
【００３９】
本発明の半導体素子の接続構造、液晶表示装置及び電子機器によれば、導電粒子を分散した状態で含む接合剤を用いる場合でも、半導体素子の接続状態を安定に保持できる。
【００４０】
本発明の半導体素子の接続構造、液晶表示装置及び電子機器によれば、半導体素子又は基板が変形しても半導体素子の電極部分の接続状態が不安定になることを防止できる。
【００４１】
本発明の半導体素子の接続構造によれば、半導体素子又は基板が変形しても半導体素子の電極部分の接続状態が不安定になることを防止できる。
【図面の簡単な説明】
【図１】本発明に係る半導体素子の接続構造の一実施形態を示す断面図である。
【図２】図１における矢印Ａに従って半導体素子の接合部分を示す平面図である。
【図３】本発明に係る液晶表示装置の一実施形態を示す側面断面図である。
【図４】図３の液晶表示装置の分解斜視図である。
【図５】電子機器内で液晶表示装置と他の回路を電気的に接続するための弾性体コネクタの一例を示す斜視図である。
【図６】本発明に係る電子機器の一実施形態である携帯電話機を示す分解斜視図である。
【図７】接合剤の中に設ける空間の設け方の変形例を示す平面図である。
【図８】半導体素子のバンプ配列の変形例を示す平面図である。
【符号の説明】
１ 上部筐体
２ 下部筐体
３ 制御回路基板
４ 本体基板
５ 液晶表示装置
６ 半導体駆動用出力端子
７ 液晶駆動用ＩＣ（半導体素子）
８ 液晶パネル
９ バックライトユニット
１０ キーボード
１１ シールドケース
１２ 弾性体コネクタ
１３ 第１液晶用基板
１４ 第２液晶用基板
１８，１９ 透明電極
２１ 半導体入力用端子
２８ 出力用バンプ
２９ 入力用バンプ
３１ 接着層
３２ ＡＣＦ（接合剤）
３３ 空間[0001]
BACKGROUND OF THE INVENTION
The present invention relates to a semiconductor element connection structure for connecting a semiconductor element on a substrate, a liquid crystal display device using the structure, and an electronic apparatus using the liquid crystal display device.
[0002]
[Prior art]
In recent years, liquid crystal display devices have been widely used to display visible information in various electronic devices such as navigation systems, televisions, palmtop computers, electronic notebooks, and mobile phones. In general, the liquid crystal display device is configured by connecting a liquid crystal driving IC, that is, a semiconductor element, to a liquid crystal panel, and further attaching accessory parts such as a backlight and a casing to the liquid crystal panel. The liquid crystal panel here is usually constituted by filling a liquid crystal in a gap sandwiched between at least two liquid crystal substrates, and further attaching a polarizing plate, a color filter, or the like as necessary.
[0003]
Various methods for connecting a liquid crystal driving IC to a liquid crystal panel have been conventionally considered. For example, a connection method based on a COB (Chip On Board) method, a COG (Chip On Glass) method, or the like can be considered. In the COB method, a liquid crystal driving IC is connected to an insulating substrate on which a wiring pattern is formed using an ACF (Anisotropic Conductive Film) or other bonding agent, and the insulating substrate is connected to a liquid crystal panel through a heat seal or the like. On the other hand, in the COG method, a liquid crystal driving IC is directly connected using ACF or the like on a glass substrate on which electrode terminals are formed. In both the COB method and the COG method, a semiconductor element such as a liquid crystal driving IC is connected to a substrate such as an insulating substrate or a liquid crystal glass substrate.
[0004]
In the above conventional connection method, the ACF and other bonding agents are uniformly filled between the substrate and the liquid crystal driving IC without a gap. Therefore, when the liquid crystal driving IC is crimped, when the IC is warped, or when the liquid crystal driving IC and / or the substrate is deformed due to a temperature change, the liquid crystal driving IC in contact with the electrode on the substrate Excessive stress is generated in the bump portion, and as a result, the electrical connection state may become unstable. Further, in order to avoid the occurrence of such a problem, the pressure bonding conditions of the liquid crystal driving IC must be strictly managed within a narrow allowable range, and therefore complicated process management has been required.
[0005]
Further, according to Japanese Patent Laid-Open No. 2-42738, the COB mounting printed circuit board is provided with a flexible adhesive layer as a buffer layer between the IC chip and the substrate, thereby improving the bonding reliability between the two. A connected structure is also disclosed. However, this conventional connection structure has a problem that a dedicated flexible adhesive layer must be formed in order to obtain a buffering action, resulting in high component costs and manufacturing costs.
[0006]
[Problems to be solved by the invention]
The present invention has been made in view of the conventional problems in the connection structure of a semiconductor element, and it is possible to stably maintain the connection state of the semiconductor element to the substrate only by adding a very simple configuration. For the purpose.
[0007]
[Means for Solving the Problems]
In order to achieve the above object, a semiconductor element connection structure according to the present invention is a semiconductor element connection structure in which a semiconductor element having a plurality of bumps is connected to a substrate. The semiconductor element and the substrate are bonded to each other. And the adhesive layer has a plurality of spaces extending between the semiconductor element and the substrate, and the semiconductor element and the substrate are bonded between the space and the space. It is characterized by.
[0008]
According to this connection structure, when the semiconductor element or the substrate is deformed, the space formed in the bonding agent is freely deformed corresponding to the deformation and absorbs the deformation of the semiconductor element or the like. As a result, even when the semiconductor element or the substrate is deformed, it is possible to prevent an excessive load from being applied to the electrode portion of the semiconductor element, and thus the electrical connection state of the semiconductor element can be maintained in a stable and good state.
[0009]
In the above configuration, an element such as an IC chip or an LSI chip can be considered as the semiconductor element. When a liquid crystal display device is assumed, a liquid crystal driving IC or the like can be considered as a semiconductor element. Further, as the substrate, an insulating substrate in the case of the COB method, a transparent substrate for liquid crystal in the case of the COG method, and various other substrates corresponding to various connection methods are conceivable. As the bonding agent, ACF (Anisotropic Conductive Film), a normal adhesive, or the like can be considered.
[0010]
ACF is a bonding agent in which conductive particles are dispersed in a thermoplastic resin film or a thermosetting resin film, and exhibits a conductivity in a single direction by receiving thermocompression bonding. On the other hand, a normal adhesive is an adhesive that mainly mechanically bonds a substrate and a semiconductor element and does not have an electrical connection role. When the ACF is used, the terminals on the substrate and the bumps of the semiconductor element are electrically connected through the conductive particles in the ACF. On the other hand, when a normal adhesive is used, the terminals on the substrate and the bumps of the semiconductor element are directly connected to establish electrical continuity. In this state, the semiconductor element is mechanically attached to the substrate by the normal adhesive. Glued to.
[0011]
Considering a liquid crystal driving IC used in a liquid crystal display device as a semiconductor element, a plurality of bumps are arranged in a row on the active surface of the liquid crystal driving IC. There are various possible forms of this row. For example, as shown in FIGS. 2 and 7, a pair of bump rows 28 and 29 arranged in a row in the longitudinal direction (two rows in the figure), and a short direction May be arranged in a ring shape by a pair of bump rows 28, 28 arranged in a row (two rows in the figure). Further, as shown in FIG. 8, a pair of bump rows 28 and 29 may be provided only in the longitudinal direction or the short direction.
[0012]
When the semiconductor element having the bump arrangement as described above is connected to the substrate, as shown in FIG. 2, a space 33 is formed in the bonding agent in the region surrounded by the annular bump, As shown in FIG. 5, a space 33 can be formed between the individual bumps 28 and 29 or outside the bump row.
[0014]
The liquid crystal display device according to the present invention is a liquid crystal display device configured using the semiconductor element connection structure described above. More specifically, the liquid crystal display device in the electronic apparatus of the present invention includes a pair of substrates facing each other with the liquid crystal interposed therebetween, and a liquid crystal display in which a semiconductor element having a plurality of bumps is connected to one of the substrates. In the apparatus, the semiconductor element and the substrate are bonded via an adhesive layer, and the adhesive layer includes a plurality of spaces extending between the semiconductor element and the substrate, and between the space and the space. The semiconductor element and the substrate are bonded to each other.
[0015]
Specific examples of the electronic apparatus using the liquid crystal display device according to the present invention are various apparatuses such as a navigation system, a television, a palmtop computer, an electronic notebook, and a mobile phone. An electronic apparatus according to the present invention includes the above-described liquid crystal display device according to the present invention and a semiconductor driving output terminal connected to the liquid crystal display device. According to another aspect of the present invention, there is provided an electronic apparatus comprising: a semiconductor element having a plurality of bumps; a substrate to which the semiconductor element is connected; and a semiconductor drive output terminal connected to the substrate. And the substrate are bonded via an adhesive layer, and the adhesive layer includes a plurality of spaces extending between the semiconductor element and the substrate, and the semiconductor element and the substrate are interposed between the spaces. And are joined.
An electronic apparatus according to the present invention is an electronic apparatus including a liquid crystal display device configured using the semiconductor element connection structure described above and a semiconductor drive output terminal connected to the liquid crystal display device. More specifically, the liquid crystal display device in the electronic apparatus of the present invention includes a pair of substrates facing each other with the liquid crystal interposed therebetween, and a liquid crystal display in which a semiconductor element having a plurality of bumps is connected to one of the substrates. In the apparatus, the semiconductor element and the substrate are bonded via an adhesive layer, and the adhesive layer includes a plurality of spaces extending between the semiconductor element and the substrate, and between the space and the space. The semiconductor element and the substrate are bonded to each other.
[0016]
DETAILED DESCRIPTION OF THE INVENTION
FIG. 6 shows an example of a cellular phone which is an embodiment of an electronic apparatus using the liquid crystal display device according to the present invention. This mobile phone has an upper housing 1 and a lower housing 2. The upper housing 1 includes a PCB (Printed Circuit Board) for controlling the keyboard 10 and the like. In the lower housing 2, a control circuit board 3 on which a control LSI and the like are mounted and a main body board 4 on which the circuit board 3 is mounted are housed. A liquid crystal display device 5 according to the present invention is mounted on the main body substrate 4. A plurality of semiconductor drive output terminals 6 are formed on the surface of the main body substrate 4 as a wiring pattern. The liquid crystal display device 5 includes a liquid crystal driving IC 7, that is, a semiconductor element, and the liquid crystal driving IC 7 is electrically connected to the semiconductor driving output terminal 6 with the liquid crystal display device 5 mounted on the main body substrate 4. Connected. A liquid crystal display device 5 and other necessary devices are arranged in the lower housing 2 and then the upper housing 1 is covered from above, thereby completing the mobile phone. Reference numeral 20 denotes a speaker.
[0017]
For example, as shown in FIG. 4, the liquid crystal display device 5 includes a liquid crystal panel 8, a backlight unit 9, a shield case 11, and an elastic connector 12. As shown in FIG. 3, the liquid crystal panel 8 includes a first liquid crystal substrate 13 formed of transparent glass and a second liquid crystal substrate 14 formed of transparent glass. A transparent electrode 18 is formed on the inner surface of the first liquid crystal substrate 13, while a transparent electrode 19 is formed on the inner surface of the second liquid crystal substrate 14. These electrodes are all formed of ITO (Indium Thin Oxide) or other transparent conductive material.
[0018]
A polarizing plate 16a and a polarizing plate 16b are attached to the outer surfaces of the first liquid crystal substrate 13 and the second liquid crystal substrate 14, respectively. The first liquid crystal substrate 13 and the second liquid crystal substrate 14 are bonded in a liquid-tight state with a predetermined gap, a so-called cell gap, by an annular sealant 17. Then, liquid crystal is sealed in the cell gap. A semiconductor input terminal 21 is formed on the right end portion of the inner surface of the portion 13a of the first liquid crystal substrate 13 projecting outside the second liquid crystal substrate 14 (on the right side in FIG. 3). The liquid crystal driving IC 7 as a semiconductor element is directly bonded onto the first liquid crystal substrate 13 by the adhesive layer 31, whereby the output bumps 28 of the IC 7 are connected to the transparent electrode 18, and on the other hand, for the input of the IC 7. The bump 29 is connected to the semiconductor input terminal 21.
[0019]
Thus, in the present embodiment, a liquid crystal display device in which the liquid crystal driving IC 7 is directly bonded onto the liquid crystal substrate 13 constituting the liquid crystal panel 8, that is, a COG (Chip)
On Glass) type liquid crystal display devices are used.
[0020]
In FIG. 3, the backlight unit 9 includes a light guide 22 and a plurality of, for example, four LEDs (Light Emitting Diodes) 23 fixed to the left end thereof. As shown in FIG. 4, a rectangular parallelepiped guide hole 24 that functions as a means for guiding the elastic connector 12 is formed at the right end of the light guide 22. As shown in FIG. 3, the guide hole 24 is formed to have a size that can accommodate the elastic connector 12 without a gap.
[0021]
As shown in FIG. 5, the elastic connector 12 includes an elastic base 25 formed in a columnar shape having a semicircular cross section by an elastic material having electrical insulation, for example, silicon rubber, and a semicircular shape of the elastic base 25. A plurality of conductive portions 26 provided in parallel to each other on the outer peripheral surface. A space between two adjacent conductive portions 26 is a non-conductive portion made of an elastic material, and the width of the non-conductive portion is maintained at, for example, about 15 μm to 25 μm. A symbol W in the drawing indicates a distance between adjacent conductive portions 26, that is, a so-called pitch between the conductive portions, and is usually set to about W = 30 μm to 50 μm.
[0022]
When the liquid crystal display device of this embodiment is mounted on the main body substrate 4 of the mobile phone (FIG. 6), the elastic connector 12 is inserted into the guide hole 24 of the light guide 22 in FIG. The unit 9 is placed at a predetermined position on the main body substrate 4, the liquid crystal panel 8 is placed at a predetermined position on the backlight unit 9, and a shielding case with a pressurizing member 30 formed of silicon rubber or another elastic body interposed therebetween 11 is placed on the liquid crystal panel 8 and the backlight unit 9, and as shown in FIG. 3, the caulking stopper 27 is deformed to fasten and fix the main board 4 and the shield case 11. At this time, the elastic connector 12 is compressed and elastically deformed by the action of the pressing member 30 in the vertical direction of FIG. 3, and as a result, the conductive portion 26 (see FIG. 5) is caused by the elastic restoring force of the elastic base 25. Both the semiconductor input terminal 21 on the liquid crystal panel 8 side and the semiconductor drive output terminal 6 on the main body substrate 4 side firmly contact. In addition, regarding the method of compressing the elastic connector 12, instead of preparing a dedicated component such as the pressing member 30, a corresponding portion of the shield case 11 is deformed so as to protrude inward and the shield case It is also possible to form a rib at the portion of 11 and compress the elastic connector 12 by the rib.
[0023]
When the assembly of the liquid crystal display device is completed as described above, the electrical signal and the signal are transmitted from the control circuit board 3 (FIG. 6) to the liquid crystal drive IC 7 through the semiconductor drive output terminal 6, the elastic connector 12 (FIG. 3) and the semiconductor input terminal 21. The liquid crystal driving power is supplied, and the voltage applied to the electrodes 18 and 19 is controlled by the liquid crystal driving IC 7 based on the power. By this voltage control, a visible image is displayed in the effective display area of the liquid crystal panel 8.
[0024]
In the present embodiment, since the elastic connector 12 can be electrically connected between the semiconductor input terminal 21 on the liquid crystal panel 8 side and the semiconductor drive output terminal 6 on the mobile phone side, both can be electrically connected. Is very simple. Further, since the elastic connector 12 is disposed in the guide hole 24, the elastic connector 12 does not bend or buckle when a force is applied to the elastic connector 12, and therefore the semiconductor connector 12 is not subject to deformation. The electrical connection state between the input terminal 21 and the semiconductor drive output terminal 6 can always be maintained in a stable state.
[0025]
In the present embodiment, as shown in FIG. 1, the liquid crystal driving IC 7 is bonded onto the first liquid crystal substrate 13 by the adhesive layer 31. The adhesive layer 31 is composed of an ACF (Anisotropic Conductive Film) 32 as a bonding agent and a plurality of spaces 33 formed inside the ACF 32. The ACF 32 is formed by dispersing a large number of conductive particles 34 in an adhesive resin film, and the output bumps 28 of the IC 7 are electrically connected to the transparent electrode 18 via the conductive particles 34, The input bumps 29 are electrically connected to the semiconductor input terminals 21 through the conductive particles 34. Further, the bump 28, the bump 29, and each terminal are kept in an insulating state by an adhesive resin.
[0026]
FIG. 2 shows a state in which the joint portion of the liquid crystal driving IC 7 is viewed from the direction indicated by the arrow A in FIG. As is clear from this figure, the plurality of spaces 33 are in an area surrounded by the bumps 28 and 29 arranged in two rows in the longitudinal direction and the bumps 28 and 28 arranged in two rows in the short direction, In other words, they are located close to each other in a region surrounded by a plurality of bumps 28 and 29 arranged in an annular shape. In general, when bonding the liquid crystal driving IC 7 onto the substrate 13, the IC 7 is pressed against the substrate 13 with a predetermined pressure while heating the IC 7 with the ACF 32 sandwiched between the liquid crystal driving IC 7 and the substrate 13. During the heating and pressurizing process, the liquid crystal driving IC 7 may be warped. When such warping occurs, excessive stress is generated at the connection portion of the bumps 28 and 29, and the electrical connection state is brought about. May become unstable. Also, when the temperature change occurs in the liquid crystal driving IC 7, the connection state of the bumps 28 and 29 may become unstable due to the deformation of the IC 7 and / or the substrate 13. On the other hand, if the space 33 is provided inside the ACF 32 as in the present embodiment, when the liquid crystal driving IC 7 is deformed, the space 33 is freely deformed according to the deformation and absorbs the deformation of the IC 7. As a result, it is possible to prevent an excessive stress from being generated in the connection portion between the bumps 28 and 29.
[0027]
The method for forming the space 33 inside the ACF 32 is not limited to a specific method. For example, an appropriate condition corresponding to the liquid crystal driving IC 7 that uses the pressure bonding condition when the liquid crystal driving IC 7 is pressure bonded to the substrate 13 is used. By setting to, such a space 33 can be obtained. The following conditions are mentioned as an example of such crimping conditions.
[0028]
(1) IC 7 for driving liquid crystal: SED1220 (manufactured by Seiko Epson Corporation)
In FIG. 2, the shape of this IC is L × W = 7.7 mm × 2.8 mm, the number of bumps is about 200, and the bump size is 80 μm × 120 μm.
[0029]
(2) ACF32: CP8530 (manufactured by Sony Chemical Corporation)
(3) ACF heating temperature: 180-230 ° C. (center temperature = 200-210 ° C.)
When the ACF is pressed and heated by pressing the IC 7 with a pressure head heated to a high temperature, the temperature of the pressure head is set to 260 to 360 ° C. (center temperature = about 300 ° C.). Of ACF is obtained.
[0030]
(4) Pressurizing force of the pressure head: 12 kgf to 20 kgf
(5) Pressurizing time of the pressure head: When the liquid crystal driving IC 7 is bonded on the substrate 13 under the conditions (1) to (5) of 10 seconds or more, a plurality of spaces 33 as shown in FIG. Was formed inside ACF32.
[0031]
FIG. 7 shows a modification of how the space 33 is provided. This modified example is different from the previous embodiment shown in FIG. 2 in that not only a space 33 is provided between the bump rows 28 and 29 in the longitudinal direction and the bump rows 28 and 28 in the short direction, but individual spaces 33 are provided. The space 33 is provided between the bumps and outside the pair of bump rows. Even when the space 33 is arranged in this manner, the connection state of the semiconductor element to the substrate can be stably maintained.
[0032]
FIG. 8 shows a modification regarding the bump arrangement. This modified example is different from the previous embodiment shown in FIG. 2 in that the plurality of bumps 28 and 29 are not arranged in a ring shape but are arranged in a row only in the longitudinal direction. In this modification, a plurality of spaces 33 are provided between the bump rows 28 and 29. Instead of or in addition to this, spaces 33 are provided between individual bumps and / or outside the bump rows. You can also.
[0033]
The present invention has been described with reference to the preferred embodiments. However, the present invention is not limited to the embodiments, and various modifications can be made within the technical scope described in the claims.
[0034]
For example, the semiconductor connection structure and the liquid crystal display device according to the present invention are various devices that require display of visible information, such as electronic devices other than mobile phones, such as navigation systems, televisions, palmtop computers, and electronic notebooks. Can be used against.
[0035]
The embodiment shown in FIGS. 3 to 5 is an embodiment in the case where the present invention is applied to a COG (Chip On Glass) type liquid crystal display device. However, the present invention is not limited to other types of liquid crystal display devices such as COB. The present invention can also be applied to a (Chip On Board) type liquid crystal display device or the like. In the embodiment shown in FIGS. 3 to 5, the output terminal 6 on the mobile phone side as an electronic device and the input terminal 21 on the liquid crystal panel 8 side are electrically connected by the elastic connector 12. The connection method for connecting both is not limited to this. For example, the present invention includes a case where both terminals are connected using an FPC (Flexible Printed Circuit).
[0036]
In the embodiment of FIG. 1, the adhesive layer 31 is configured by the ACF 32 including the conductive particles 34. However, instead of this, the adhesive layer 31 may be configured using an adhesive that does not include the conductive particles. In this case, a space 33 is formed inside the adhesive. In this case, the bumps of the liquid crystal driving IC 7 and the electrode terminals on the liquid crystal panel side are directly connected.
[0037]
【The invention's effect】
According to the semiconductor element connection structure, the liquid crystal display device, and the electronic apparatus of the present invention, the connection state of the semiconductor element to the substrate can be stably maintained only by adding a very simple configuration of providing a space inside the bonding agent. . Since it is not necessary to provide a special flexible layer or a buffer layer, the structure is simple and the manufacture is also simple.
[0038]
According to the semiconductor element connection structure, the liquid crystal display device, and the electronic apparatus of the present invention, it is possible to very effectively reduce the stress generated in the bump connection portion when the semiconductor element is deformed.
[0039]
According to the semiconductor element connection structure, the liquid crystal display device, and the electronic apparatus of the present invention, the connection state of the semiconductor elements can be stably maintained even when a bonding agent containing conductive particles in a dispersed state is used.
[0040]
According to the semiconductor element connection structure, the liquid crystal display device, and the electronic apparatus of the present invention, it is possible to prevent the connection state of the electrode portion of the semiconductor element from becoming unstable even if the semiconductor element or the substrate is deformed.
[0041]
According to the semiconductor element connection structure of the present invention, it is possible to prevent the connection state of the electrode portion of the semiconductor element from becoming unstable even if the semiconductor element or the substrate is deformed.
[Brief description of the drawings]
FIG. 1 is a cross-sectional view showing an embodiment of a semiconductor element connection structure according to the present invention.
2 is a plan view showing a junction portion of a semiconductor element according to an arrow A in FIG.
FIG. 3 is a side sectional view showing an embodiment of a liquid crystal display device according to the present invention.
4 is an exploded perspective view of the liquid crystal display device of FIG. 3. FIG.
FIG. 5 is a perspective view showing an example of an elastic connector for electrically connecting a liquid crystal display device and another circuit in an electronic apparatus.
FIG. 6 is an exploded perspective view showing a mobile phone which is an embodiment of an electronic apparatus according to the invention.
FIG. 7 is a plan view showing a modification of how to provide a space provided in the bonding agent.
FIG. 8 is a plan view showing a modification of the bump arrangement of the semiconductor element.
[Explanation of symbols]
DESCRIPTION OF SYMBOLS 1 Upper housing | casing 2 Lower housing | casing 3 Control circuit board 4 Main body board | substrate 5 Liquid crystal display device 6 Output terminal 7 for semiconductor drive Liquid crystal drive IC (semiconductor element)
8 Liquid crystal panel 9 Backlight unit 10 Keyboard 11 Shield case 12 Elastic connector 13 First liquid crystal substrate 14 Second liquid crystal substrate 18, 19 Transparent electrode 21 Semiconductor input terminal 28 Output bump 29 Input bump 31 Adhesive layer 32 ACF (bonding agent)
33 space

Claims (11)

複数のバンプを具備する半導体素子が基板に接続されてなる半導体素子の接続構造において、
前記半導体素子と前記基板とは接着層を介して接合されてなり、
前記接着層は前記半導体素子と前記基板との間にわたる複数の空間を具備し、前記空間と前記空間の間において前記半導体素子と前記基板とが接合されてなることを特徴とする半導体素子の接続構造。In a semiconductor element connection structure in which a semiconductor element having a plurality of bumps is connected to a substrate,
The semiconductor element and the substrate are bonded via an adhesive layer,
The bonding layer includes a plurality of spaces extending between the semiconductor element and the substrate, and the semiconductor element and the substrate are joined between the space and the space. Construction. 請求項１記載の半導体素子の接続構造において、
半導体素子は列状に並べられた複数のバンプを有し、
上記空間は、前記バンプ列の間、前記バンプ列の外側及び個々の前記バンプの間又はそれらの少なくともいずれか１つの領域内に形成されてなることを特徴とする半導体素子の接続構造。In the connection structure of the semiconductor element according to claim 1,
The semiconductor element has a plurality of bumps arranged in a row,
2. The semiconductor element connection structure according to claim 1, wherein the space is formed between the bump rows, outside the bump row and between the individual bumps, or in at least one region thereof. 請求項１又は請求項２に記載の半導体素子の接続構造において、前記接着層は、樹脂フィルム及び前記樹脂フィルム中に分散された導電粒子を有する異方性導電膜を含むことを特徴とする半導体素子の接続構造。3. The semiconductor element connection structure according to claim 1, wherein the adhesive layer includes a resin film and an anisotropic conductive film having conductive particles dispersed in the resin film. Device connection structure. 液晶を挟んで互いに対向する一対の基板を備え、複数のバンプを具備する半導体素子が一方の前記基板に接続されてなる液晶表示装置において、
前記半導体素子と前記基板とは接着層を介して接合されてなり、
前記接着層は前記半導体素子と前記基板との間にわたる複数の空間を具備し、前記空間と前記空間の間において前記半導体素子と前記基板とが接合されてなることを特徴とする液晶表示装置。In a liquid crystal display device comprising a pair of substrates facing each other across the liquid crystal, and a semiconductor element having a plurality of bumps connected to one of the substrates,
The semiconductor element and the substrate are bonded via an adhesive layer,
The liquid crystal display device, wherein the adhesive layer includes a plurality of spaces extending between the semiconductor element and the substrate, and the semiconductor element and the substrate are bonded between the space and the space. 請求項４記載の液晶表示装置において、
前記半導体素子は列状に並べられた複数のバンプを有し、
上記空間は、前記バンプ列の間、前記バンプ列の外側及び個々の前記バンプの間又はそれらの少なくともいずれか１つの領域内に形成されてなることを特徴とする液晶表示装置。The liquid crystal display device according to claim 4.
The semiconductor element has a plurality of bumps arranged in a row,
The liquid crystal display device according to claim 1, wherein the space is formed between the bump rows, between the bump rows and between the individual bumps, or at least one region thereof. 請求項４又は請求項５に記載の液晶表示装置において、前記接着層は、樹脂フィルム及び前記樹脂フィルム中に分散された導電粒子を有する異方性導電膜を含むことを特徴とする液晶表示装置。6. The liquid crystal display device according to claim 4, wherein the adhesive layer includes a resin film and an anisotropic conductive film having conductive particles dispersed in the resin film. . 請求項４乃至６のいずれか１項に記載の液晶表示装置と、
前記液晶表示装置に接続される半導体駆動用出力端子と、
を備えることを特徴とする電子機器。A liquid crystal display device according to any one of claims 4 to 6,
An output terminal for driving a semiconductor connected to the liquid crystal display device;
An electronic device comprising: 複数のバンプを具備する半導体素子と、前記半導体素子が接続される基板と、前記基板に接続される半導体駆動用出力端子とを備える電子機器において、
前記半導体素子と前記基板とは接着層を介して接合されてなり、
前記接着層は前記半導体素子と前記基板との間にわたる複数の空間を具備し、前記空間と前記空間の間において前記半導体素子と前記基板とが接合されてなることを特徴とする電子機器。In an electronic device comprising a semiconductor element having a plurality of bumps, a substrate to which the semiconductor element is connected, and a semiconductor drive output terminal connected to the substrate,
The semiconductor element and the substrate are bonded via an adhesive layer,
The electronic device is characterized in that the adhesive layer has a plurality of spaces between the semiconductor element and the substrate, and the semiconductor element and the substrate are bonded between the space and the space. 電子機器において、
液晶を挟んで互いに対向する一対の基板を備え、複数のバンプを具備する半導体素子が一方の前記基板に接続されてなる液晶表示装置と、
前記液晶表示装置に接続される半導体駆動用出力端子とを備え、
前記半導体素子と前記基板とは接着層を介して接合されてなり、
前記接着層は前記半導体素子と前記基板との間にわたる複数の空間を具備し、前記空間と前記空間の間において前記半導体素子と前記基板とが接合されてなることを特徴とする電子機器。In electronic equipment,
A liquid crystal display device comprising a pair of substrates facing each other across the liquid crystal, and a semiconductor element having a plurality of bumps connected to one of the substrates;
A semiconductor drive output terminal connected to the liquid crystal display device,
The semiconductor element and the substrate are bonded via an adhesive layer,
The electronic device is characterized in that the adhesive layer has a plurality of spaces between the semiconductor element and the substrate, and the semiconductor element and the substrate are bonded between the space and the space. 請求項９に記載の電子機器において、
前記半導体素子は列状に並べられた複数のバンプを有し、
上記空間は、前記バンプ列の間、前記バンプ列の外側及び個々の前記バンプの間又はそれらの少なくともいずれか１つの領域内に形成されてなることを特徴とする電子機器。The electronic device according to claim 9,
The semiconductor element has a plurality of bumps arranged in a row,
The electronic device is characterized in that the space is formed between the bump rows, outside the bump rows and between the individual bumps, or in at least one region thereof. 請求項９又は請求項１０に記載の電子機器において、前記接着層は、樹脂フィルム及び前記樹脂フィルム中に分散された導電粒子を有する異方性導電膜を含むことを特徴とする電子機器。11. The electronic device according to claim 9, wherein the adhesive layer includes a resin film and an anisotropic conductive film having conductive particles dispersed in the resin film.
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